CN206024253U - Multi-layer flexible circuit board - Google Patents
Multi-layer flexible circuit board Download PDFInfo
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- CN206024253U CN206024253U CN201621061622.6U CN201621061622U CN206024253U CN 206024253 U CN206024253 U CN 206024253U CN 201621061622 U CN201621061622 U CN 201621061622U CN 206024253 U CN206024253 U CN 206024253U
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Abstract
The utility model discloses a kind of multi-layer flexible circuit board, including：Flexible parent metal, including back to first, second surface for arranging；Flexible circuitry layer, including alternately laminated multiple circuit layers and multiple insulating medium layers, wherein first circuit layer is arranged at the first surface of the flexible parent metal, and top circuit layer is arranged on top layer insulating medium layer；The flexible circuitry layer includes conductive through hole, conductive blind hole and conductive buried via hole etc., respectively in order to by the plurality of circuit layer electrically connect, surface circuit layer is electrically connected with interior circuit layers and at least two interior circuit layers are electrically connected, the conductive through hole, conductive blind hole and conductive buried via hole are mainly made up of the duct being distributed on the insulating medium layer, are filled with conductive filler in the duct.There is multi-layer flexible circuit board of the present utility model preparation process is simple easily to implement, and the circuit number of plies is more and the features such as little thickness, ultra-thin flexible can be widely applied to the fields such as wearable device.
Description
Technical field
This utility model is specifically related to a kind of multi-layer flexible circuit board, belongs to circuit board production techniques field.
Background technology
With the progress of electronic technology, electronic product is towards diversification, intellectuality, flexibility development, most typical representative
It is exactly the rise of intelligent wearable electronic product, this puts forward higher requirement to circuit board therein.Flexible PCB, also known as
FPC, flex circuit application, abbreviation soft board or FPC (Flexible Printed Circuit), with Distribution density high,
Lightweight, thickness of thin, bent the features such as, be particularly well-suited to that complex-shaped, inner space is narrow and small or composite human body morphology
Electronic product.
Flexible PCB have one side, two-sided and multi-layer sheet point, the base material for being adopted is based on polyimide copper clad lamination.Existing
The preparation technology of flexible circuit board includes following flow process：Sawing sheet-base material drilling-Chemical cleaning-the electroplates in hole-electro-coppering-change
Cleaning-patch dry film-double-sided exposure-development-etching-striping-Chemical cleaning-pasting protective film-lamination-reinforcing-electronickelling gold-
Segmentation-punching profile-electrical detection-end inspection-CQA- packaging shipment.
When traditional flexible PCB prepares multi-layer sheet, typically done by inner figure, through over etching, bonding and pressing,
Through hole is realized by machine drilling or laser drill generally, but the buried via hole of circuit and blind hole are difficult to realize by drilling, this restriction
Flexible PCB develops to high density, high accuracy with high-layer direction；In addition the temperature of process for pressing is higher so that flexible electrical
Road plate which has limited drawing materials for flexible PCB, and be limited to Copper Foil and base substantially using polyimide high temperature-resistant material
The thickness of material, the thickness of current single-layer-flex circuit will be more than 100 μm, realize multilamellar and ultra-thin relatively difficult；Furthermore,
Conventional flex circuits plate production procedure is long, high cost, and conducting wire is all metal copper foil to be taken a picture by chemical medicinal liquid and is etched
Formed, the process can produce the waste water for being difficult to purified treatment, and this causes more tight to the periphery natural environment such as neighbouring river, soil
Weight and long-term pollution.
Therefore, with the extensive application of extensive and super large-scale integration, find one kind and prepare fine lines, aperture
Footpath is run through, the technique of blind hole buried via hole, multilamellar and ultrathin flexible circuit board is a urgent task, meanwhile, find a kind of work
Skill flow process is short, low cost, environmentally friendly flexible PCB preparation technology are also an important subject.
Content of the invention
Main purpose of the present utility model is to provide a kind of multi-layer flexible circuit board, to overcome the deficiencies in the prior art.
To achieve these goals, the technical solution adopted in the utility model includes：
This utility model embodiment provides a kind of multi-layer flexible circuit board, and which includes：
Flexible parent metal, including first surface and with first surface back to second surface；
Flexible circuitry layer, including alternately laminated (n+1) individual circuit layer and n insulating medium layer, wherein first circuit
Layer is arranged at the first surface of the flexible parent metal, and the first insulating medium layer is arranged on first circuit layer, (n+1) individual electricity
Road floor is arranged on n-th insulating medium layer, and n is the integer more than or equal to 2；
Also, the flexible circuitry layer includes conductive through hole, conductive blind hole and conductive buried via hole, the conductive through hole is at least used
With by individual for (n+1) in flexible circuitry layer circuit layer electrical connection, the conductive blind hole is at least in order to by (n+1) individual circuit
Layer is electrically connected at least one of the 1st circuit layer circuit layer with n-th circuit layer, and the conductive buried via hole is at least in order to by the
At least two circuit layers electrical connection in 1 circuit layer to n-th circuit layer, the conductive through hole, conductive blind hole and conduction are buried
Hole is mainly made up of the duct being distributed on the insulating medium layer, is filled with conductive filler in the duct.
More preferred, n is any integer in 2～20, especially preferred, and n is any integer in 3～20.
In some embodiments, the circuit layer can be by the stream comprising conductive materials such as electrocondution slurry, conductive ink
Body solidify to form, and there is setting pattern structure.
In some embodiments, the conductive filler in filling and the duct by flow into duct, comprising conductive materials
Fluid solidify to form.
Preferably, the conductive filler is mainly by the micron particle and/or nanometer of conductive metallic material and/or material with carbon element
Grain aggregation is formed.
In some embodiments, the duct both ends open being distributed in the insulating medium layer, the both ends open difference
Located at an insulating medium layer side surface relative with the first surface of the base material and the insulating medium layer and the base
The first surface of material back to another side surface.
Preferably, the duct has the inwall being obliquely installed, in order to make the fluid comprising conductive materials in ostium road
Duct inwall is fully infiltrated.
In the multi-layer flexible circuit board provided than existing flexible PCB, this utility model, conductive through hole, conduction are buried
Hole and conductive blind hole can be easily made, and can make interconnect to form buried via hole between the circuit of random layer inside circuit board, circuit
The circuit of the circuit on plate top layer and internal random layer can interconnect to form blind hole, and the through hole through whole circuit board not only can
Extend vertically through, can be to carry out running through around folding according to the layout and circuit function of circuit, the circuit number of plies can be up to 21 layers, and
The multi-layer flexible circuit board belongs to a kind of structure of increasing material manufacturing, draws materials more extensively, more frivolous and soft, by control absolutely
The thickness of edge dielectric layer, the thickness of the multi-layer flexible circuit board comprising more than 3 circuit layers can be controlled below 100 μm, tool
The characteristics of having ultra-thin flexible.
Description of the drawings
In order to be illustrated more clearly that this utility model architectural feature and technical essential, below in conjunction with the accompanying drawings and specific embodiment party
Formula is described in detail to this utility model.
Fig. 1 is a kind of cross-sectional view of the multi-layer flexible circuit board in one embodiment of this utility model；
Fig. 2 is a kind of exposure schematic diagram of the multi-layer flexible circuit board in one embodiment of this utility model；
Fig. 3 is a kind of through hole cross-sectional view of the multi-layer flexible circuit board in one embodiment of this utility model；
Fig. 4 is that a kind of cross-section structure partial enlargement of the multi-layer flexible circuit board in one embodiment of this utility model is illustrated
Figure；
Fig. 5 is a kind of cross-sectional view of the multi-layer flexible circuit board in one embodiment of this utility model.
Specific embodiment
A kind of multi-layer flexible circuit board that this utility model embodiment is provided includes：
Flexible parent metal, with first surface and with first surface back to second surface；
Flexible circuitry layer, including alternately laminated (n+1) individual circuit layer and n insulating medium layer, wherein first circuit
Layer is arranged at the first surface of the flexible parent metal, and the first insulating medium layer is arranged on first circuit layer, (n+1) individual electricity
Road floor is arranged on n-th insulating medium layer, and n is the integer more than or equal to 2；
Also, the flexible circuitry layer includes conductive through hole, conductive blind hole and conductive buried via hole, the conductive through hole is at least used
With by individual for (n+1) in flexible circuitry layer circuit layer electrical connection, the conductive blind hole is at least in order to by (n+1) individual circuit
Layer is electrically connected at least one of the 1st circuit layer circuit layer with n-th circuit layer, and the conductive buried via hole is at least in order to by the
At least two circuit layers electrical connection in 1 circuit layer to n-th circuit layer, the conductive through hole, conductive blind hole and conduction are buried
Hole is mainly made up of the duct being distributed on the insulating medium layer, is filled with conductive filler in the duct.
More preferred, n is any integer in 2～20, is especially preferably less than or equal to 20 more than or equal to 3
Integer.
Aforementioned " conductive through hole " it is understood that be by the n insulating medium layer in multiple ducts filled with conductive filler
The continuous current passage being electrically connected to form with the local circuit in (n+1) the individual circuit layer, can be with by the continuous current passage
Should (n+1) individual circuit layer electrical connection.
Aforementioned " conductive blind hole " is it is understood that be by being distributed in (n+1) individual circuit layer and n-th circuit layer to the 1st electricity
One or more filled with conductive filler in the one or more insulating medium layers between a selected circuit layer in the floor of road
Duct and (n+1) the individual circuit layer and the selected circuit layer in the current channel that is electrically connected to form of local circuit, by
(n+1) the individual circuit layer can be electrically connected by the current channel with the selected circuit layer.
Aforementioned " conductive buried via hole " is it is understood that be by any two being distributed in n-th circuit layer and the 1st circuit layer
The one or more ducts filled with conductive filler in one or more insulating medium layers between above selected circuit layer with
The two or more selectes the current channel that is electrically connected to form of local circuit in circuit layer, by the current channel can by this two
Individual above selected circuit layer electrical connection.
Further, the duct both ends open being distributed in the insulating medium layer, the both ends open are respectively arranged on described
An insulating medium layer side surface relative with the first surface of the base material and the insulating medium layer and the first of the base material
Another side surface of surface opposite pair.
Further, the conductive filler being filled in the duct by flow into duct, the fluid comprising conductive materials solid
Change and formed.
Wherein, the duct can have various forms, the such as rule such as slit-type, circular hole, square hole, taper hole or irregular
Form.
In some more preferred embodiment, the first surface of the duct and the base material back to one end open
The diameter of another end opening relative with the first surface of the base material with diameter greater than the duct of mouth.Thereby design, can be with
Make to be coated or printed on electrocondution slurry or conductive ink of dielectric layer surface etc. to be easier to enter and fill the duct.
Particularly preferably, the duct has the inwall that is obliquely installed, in order to make ostium road comprising conductive materials
Fluid fully infiltrates duct inwall.
Further, the duct has trapezoid cross section structure.
In some more preferred embodiment, a diameter of 1-3000 μm of the duct.
In some more preferred embodiment, the thickness of the circuit layer is 0.5-50 μm.
In some more preferred embodiment, the circuit layer is solidify to form by the fluid comprising conductive materials, and
Have and set pattern structure.
Wherein, described " pattern structure " refers to that the arrangement form of circuit in each circuit layer, those skilled in the art are known,
For different circuit function demands, the form of circuit accordingly can be changed.
Further, the fluid comprising conductive materials includes electrocondution slurry or conductive ink.
In some more preferred embodiment, the electrocondution slurry or conductive ink can mainly by conducting metal material
Material and/or material with carbon element micron particle and/or nano-particle (micron particle and/or nano-particle of conductive metallic material and/or
The micron particle and/or nano-particle of material with carbon element) it is scattered in organic solvent and is formed.
Accordingly, in some embodiments, the conductive filler can mainly by aforesaid conductive metal material and/or carbon
The micron particle and/or nanoparticle aggregate of material is formed.
Wherein, the metal material is at least selected from silver, copper, gold, nickel or aluminum, but not limited to this.
Wherein, the material with carbon element is at least selected from CNT, Graphene, micron carbon granule or nano carbon particle, but not
It is limited to this.
Further, the circuit layer can print to be formed using electrocondution slurry or conductive ink, the printing for wherein adopting
Mode include silk screen printing, ink jet printing, intaglio printing, letterpress, trans-printing, aerosol printing in any one or
Two or more combinations, and not limited to this.
Wherein adoptable curing mode includes appointing in heat cure sintering, photon sintering, microwave sintering, plasma agglomeration
Anticipate one or more combination, and not limited to this.
In some more preferred embodiment, at least one circuit layer surface is additionally provided with electroplated metal layer.
Particularly preferably, the electroplated metal layer includes copper coating.
It is further preferred that the thickness of the copper coating is 0.1 μm -50 μm.
Further, components and parts pad is also provided with (n+1) individual circuit layer, in order to fix and the flexible circuit
The function element that plate coordinates, such as resistance, electric capacity, diode, audion, IC chip and various kinds of sensors or other units
Part.
Further, matcoveredn is also covered on (n+1) individual circuit layer, the components and parts pad is from the protective layer
Expose.
More preferred, the surface roughness of (n+1) individual circuit layer is in below 300nm.
In some more preferred embodiment, (n+1) individual circuit layer surface is additionally provided with electroplated metal layer.
Further, before the electroplated metal layer is set, (n+1) individual circuit layer surface by through polishing extremely
Surface roughness is less than or equal to 300nm.Particularly, when the circuit of the multi-layer flexible circuit board is used for loading high-frequency signal
When, the surface roughness of the circuit layer is less than or equal to 300nm.
In some more preferred embodiment, the first surface of the base material is distributed fluted, the flexible circuitry
Partly or wholly in the groove, this kind of design contributes to the thickness for further reducing flexible PCB to layer.
Further, first circuit layer is partly or wholly located in the groove.
Further, the groove located at the base material first surface can be that embossed technique is prepared from.
In some more preferred embodiment, at least one dielectric layer surface is also formed with groove, located at this
Circuit layer at least one insulating medium layer is partly or wholly arranged in the groove, and this kind of design is also contributed to further
Reduce the thickness of flexible PCB.
Further, the thickness of the insulating medium layer is 1-100 μm.
Further, the specific insulation of the insulating medium layer is more than 1012Ω·cm.
In some more preferred embodiment, the insulating medium layer is formed by UV adhesive curings.
Further, the thickness of the flexible parent metal is 2-500 μm.
Further, the flexible parent metal be at least selected from polyethylene (PE), polrvinyl chloride (PVC), polystyrene (PS),
The fexible film that polypropylene (PP), nylon, polyester material (such as PET/PEN) or polyimide material (PI) are made, it is also possible to
Using flexible parent metals such as paper, leathers, naturally it is also possible to be the complex of these materials, and not limited to this.
In some more preferred embodiment, first circuit layer is arranged at flexible parent metal first surface it
Before, the first surface of the flexible parent metal is through activation processing.
Further, the mode of the activation processing includes sided corona treatment method, coating, method of chemical treatment, physical treatment
At least one in method, and not limited to this.
Further, the flexible circuitry layer includes more than 3 circuit layers, and the thickness of the flexible circuitry layer is in 100 μ
Below m.
In some more specific embodiment, a class multi-layer flexible circuit board can include：
Flexible parent metal, with back to the first surface and second surface for arranging；
First dielectric on being arranged on the first surface first circuit layer and first circuit layer
Layer；
Second on second circuit layer being arranged on first insulating medium layer and second circuit layer is absolutely
Edge dielectric layer；
In the same manner, n-th on n-th circuit layer being arranged on second insulating medium layer and n-th circuit layer
Insulating medium layer, n are integer and 3≤n≤20；
Conductive vias are provided with per the insulating medium layer between two neighboring circuit layer (filled with conductive filler and two ends are opened
The duct of mouth), for the electric connection of adjacent circuit layer, the duct inwall inclines certain angle, assumes reverse frustoconic, and
Size is adjustable；
By these conductive vias, (conductive through hole can run through whole flexible circuit to may make up aforesaid conductive through hole
Plate), conductive blind hole, conductive buried via hole etc.；
The top layer circuit (i.e. (n+1) individual circuit layer) and n circuit layer being arranged on n-th insulating medium layer is constituted
(n+1) layer flexible circuitry layer.
A kind of preparation method of multi-layer flexible circuit board that the other side of this utility model embodiment is provided includes：
1) provide flexible parent metal, the flexible parent metal include first surface and with first surface back to second surface；
2) first surface in the flexible parent metal is provided as the circuit layer of first circuit layer；
3) insulating medium layer of first insulating medium layer is provided as on the circuit layer；
4) on the insulating medium layer, processing forms at least one through hole, and the both ends open of the through hole is respectively arranged at
An insulating medium layer side surface relative with first surface and the insulating medium layer and first surface back to another
Side surface；
5) applying conductive slurry or conductive ink on the insulating medium layer, and make a part of electrocondution slurry therein
Or conductive ink is flowed into the through hole and contacted with first circuit layer, make the electrocondution slurry or conductive ink solid afterwards
Change, so as to form second conductive layer on the insulating medium layer, while formed in the through hole at least can be by first
The conductive filler that individual circuit layer and second circuit layer are electrically connected with；
6) repeat step is 3) to step 5) operation, until forming n-th insulating barrier and (n+1) individual circuit layer, n is big
In or integer equal to 2, obtain the multi-layer flexible circuit board.
More preferred, n is any integer in 2～20.Particularly preferably, n is any integer in 3～20.
Further, 1) abovementioned steps include：The base material is cut to required profile and size, and on the substrate
Process location hole.
Wherein, the mode of the cutting includes cut mode or machine cuts mode, but not limited to this.
In some more preferred embodiment, 2) abovementioned steps also include：First surface at least to the base material
Activation processing is carried out to improve the surface energy of the first surface, first circuit layer is set afterwards on the first surface.
The method of aforementioned activation processing includes any in sided corona treatment method, coating, method of chemical treatment, physical treatment process
One or more combination, but not limited to this.
In some embodiments, 2) abovementioned steps include：Electrocondution slurry or conductive ink are applied using mode of printing
In the first surface of the base material, cured is carried out afterwards, form first circuit layer.
In some more preferred embodiment, 2) abovementioned steps also include：Arrange in the first surface of the base material
Groove, and make first circuit layer partly or wholly in the groove.
In some more preferred embodiment, step 2) also include：The circuit layer is surface-treated.Described
Surface treatment, be the function according to circuit design, choose whether that needs are carried out.
Further, the mode of the surface treatment includes surface sanding and polishing or electroplating processes.For example, if circuit will
Load high-frequency signal, then carry out surface sanding and polishing process, and if circuit will load super-current power unit, then electroplated
Process.
In some more preferred embodiment, described preparation method includes：The circuit layer is carried out at plating
Reason, so as to form electroplated metal layer on the circuit layer, for example, thickness is 0.1 μm -50 μm of copper coating.
In some more preferred embodiment, described preparation method includes：Place is polished to the circuit layer
Reason, so that the surface roughness of the circuit layer is in below 300nm.
In some embodiments, also first the circuit layer can be processed by shot blasting, afterwards the circuit layer is carried out
Electroplating processes.
In some embodiments, 3) abovementioned steps include：At least using blade coating, spin coating, dip-coating, spraying, silk-screen, dispensing
UV glue is applied to formation UV glued membranes on the circuit layer by any one mode in technique etc., and is processed on the UV glued membranes
The through hole is formed, the insulating medium layer is obtained.
In some embodiments, 3) abovementioned steps include：At least using proximity printing or projection exposure mode
The figure of mask plate is transferred on UV glued membranes, and does not damage UV film surfaces, afterwards will be unexposed using organic solvent
UV glue removes, and forms the insulating medium layer with the through hole.
The mode of operation of aforementioned proximity printing includes：Mask plate retains a small gap with photoresist substrate layer,
Gap is about 0～200 μm.Can be prevented effectively from UV glue directly contact and the UV glued membranes that cause are damaged and mask dash-board injury,
Make uncured UV film surfaces complete, also enable the durable use of mask plate, graphic defects are few.
The mode of operation of aforementioned projection formula exposure includes：Realized using optical system aggregation light between mask plate and UV glue
Exposure, can improve graphics resolution using optical system aggregation light.
In some more preferred embodiment, the first surface of aforementioned through-hole and the base material back to one end open
The diameter of another end opening relative with the first surface of the base material with diameter greater than the duct of mouth.
Further, the through hole has the inwall being obliquely installed, in order to make electrocondution slurry or the conductive ink of inflow through hole
Water fully infiltrates through-hole wall.
Preferably, the through hole has trapezoid cross section structure.
Preferably, a diameter of 1-3000 μm of the through hole.
Further, in the case where the electrocondution slurry or conductive ink of through hole printing are using the mobility of itself
Heavy, and contact with first circuit layer, cured be electrically connected with first circuit layer afterwards, by this " plug version " technique
Form aforesaid conductive through hole, conductive blind hole, the preparation of conductive buried via hole.
Further, 6) abovementioned steps include：Electrocondution slurry or conductive ink are applied to using mode of printing arbitrary exhausted
On edge dielectric layer, cured is carried out afterwards, so as to form circuit layer on arbitrary insulating medium layer.
In some more preferred embodiment, 6) abovementioned steps also include：In at least one dielectric layer surface
Groove is set, and the circuit layer being distributed at least one insulating medium layer is partly or wholly arranged in the groove.
In some more preferred embodiment, the groove can be that embossed technique is prepared from, but be not limited to
This.
Aforesaid mode of printing includes silk screen printing, ink jet printing, intaglio printing, letterpress, trans-printing, aerosol
Any one in printing or two or more combinations, but not limited to this.
The method of said curing process is included in heat cure sintering, photon sintering, microwave sintering, plasma agglomeration method
Any one or two or more combinations, but not limited to this.
Further, the multi-layer flexible circuit board includes conductive through hole, conductive blind hole and conductive buried via hole, described conductive logical
At least in order to by individual for (n+1) in flexible circuitry layer circuit layer electrical connection, the conductive blind hole is at least in order to by (n+ in hole
1) individual circuit layer is electrically connected at least one of the 1st circuit layer circuit layer with n-th circuit layer, and the conductive buried via hole is at least
In order at least two adjacent circuit layers in the 1st circuit layer to (n+1) individual circuit layer to be electrically connected, the conductive through hole,
Conductive blind hole and conductive buried via hole are mainly made up of the through hole being distributed in the insulating medium layer, filling in the through hole
There is the conductive filler being solidify to form by the electrocondution slurry or conductive ink that flow into the through hole.
Preferably, aforesaid conductive slurry or conductive ink are mainly by conductive metallic material and/or the micron particle of material with carbon element
And/or nano-particle is scattered in organic solvent and is formed, but not limited to this.Preferably, the metal material at least selected from silver, copper,
Gold, nickel or aluminum, but not limited to this.Preferably, the material with carbon element at least selected from CNT, Graphene, micron carbon granule or is received
Rice carbon granule, but not limited to this.
Preferably, the thickness of the circuit layer is 0.5-50 μm.
Further, components and parts pad is additionally provided with (n+1) individual circuit layer.
In some more preferred embodiment, described preparation method also includes：Set on (n+1) individual circuit layer
Protective layer is put, and the components and parts pad is exposed from the protective layer.
Preferably, the thickness of the insulating medium layer is 1-100 μm.
Preferably, the specific insulation of the insulating medium layer is more than 1012Ω·cm.
Preferably, the thickness of the base material is 2-500 μm.
Further, the base material is at least selected from polyethylene, polrvinyl chloride, polystyrene, polypropylene, nylon, polyester
Or Kapton, paper or leather, but not limited to this.
Further, the flexible circuitry layer includes more than 3 circuit layers, and the thickness of the flexible circuitry layer is in 100 μ
Below m.
For the ease of understanding this utility model, this utility model is more fully retouched below with reference to relevant drawings
State.Better embodiment of the present utility model is given in accompanying drawing.But, this utility model can be by many different forms
To realize, however it is not limited to embodiment disclosed below.On the contrary, the purpose for providing these embodiments is made to this practicality
It is more thorough comprehensive that new disclosure understands.
Unless otherwise defined, all of technology used herein and scientific terminology are led with technology of the present utility model is belonged to
The implication that the technical staff in domain is generally understood that is identical.In term used in the description of the present utility model it is simply herein
The purpose of description specific embodiment, it is not intended that in limiting this utility model.
In addition, in each diagram of the present utility model, for the ease of illustrating, structure or some partial sizes can be relative
Exaggerate in other structures or part, therefore, be only used for the basic structure for illustrating theme of the present utility model.
Refer to shown in Fig. 1, in some specific embodiments of the present utility model, a kind of multi-layer flexible circuit board 10 is wrapped
Include flexible parent metal 11, circuit layer 12, insulating medium layer 13, conductive hole 14 etc..
Wherein, the flexible parent metal 11 includes first surface and the second surface opposite with first surface.The circuit layer
12 include circuit layer 121,122,123,124,125,126 etc..The insulating medium layer 13 include circuit layer 131,132,133,
134th, 135 etc..The conductive hole 14 include conductive through hole 141 through whole flexible circuitry layer, connection surface circuit layer and
The conductive blind hole 142 of interior circuit layers, conductive buried via hole 143 of connection interior circuit layers etc..
Wherein, the conductive through hole 141, conductive blind hole 142, conductive buried via hole 143 etc. can mainly be formed from dielectric
Duct composition in layer 13.The duct can be the through hole through insulating medium layer, it is preferred that the hole wall in the duct inclines one
Determining angle, and size being adjustable, conductive filler is filled with the through hole.
Further, the circuit layer 121 is arranged on first surface, and insulating medium layer 131 is arranged at circuit layer 121
On, first circuit layer 121 and first insulating medium layer 131 is formed, is then prepared on first insulating medium layer
Second circuit layer 122 and second insulating medium layer 132；In the same manner, the 3rd circuit layer 123 and the 3rd insulation are set gradually
Dielectric layer 133, the 4th circuit layer 124 and the 4th insulating medium layer 134, the 5th circuit layer 125 and the 5th insulation are situated between
Matter layer 135；The duct is set on every layer of insulating medium layer, and circuit layer of the connection per adjacent two layers forms the upper and lower of circuit
It is electrically connected with.
Further, foregoing soft base material 11 can select polyethylene (PE), polrvinyl chloride (PVC), polystyrene (PS),
The fexible film that polypropylene (PP), nylon, polyester material (PET) or polyimide material (PI) are made, it would however also be possible to employ paper
, leather flexible parent metal, base material thickness be preferably 2 μm -500 μm.
Further, 11 surface of flexible parent metal can be through activation processing to improve surface energy, for improving base material to conduction
The adhesion of slurry, conductive ink or UV glue, applicable surface treatment method have：Sided corona treatment method, coating, chemical treatment
Method, physical treatment process etc., but not limited to this.
Further, the circuit layer 12 can adopt printing electrocondution slurry or conductive ink prepare, including silk screen printing,
Ink jet printing, intaglio printing, letterpress, trans-printing, aerosol printing and mixed printing etc., and not limited to this.
Wherein, the electrocondution slurry or conductive ink can be by the micron of the metal material or material with carbon element of electric conductivity
Grain or nano-particle be scattered in organic solvent formation slurry or ink, wherein metal material preferentially from silver, copper, gold,
Nickel, aluminum, material with carbon element is preferably from CNT, Graphene, micron carbon granule, nano carbon particle etc..
Further, after printing conductor circuit curing mode can be heat cure sintering, photon sintering, microwave sintering, etc.
The modes such as ion sintering, and not limited to this.
Further, according to the function of circuit design, choose whether to need to be surface-treated circuit layer；Surface treatment
Mode can be surface sanding and polishing or plating.Wherein, if circuit will load high-frequency signal, carry out surface polishing and throw
Optical processing, if circuit will load super-current power unit, carries out electroplating processes.
Further, the thickness of the circuit layer 12 preferably thinks 0.5 μm -50 μm.
Further, the insulating medium layer 13 by UV glue film forming and can solidify and obtain.
The UV glue can belong to by ultraviolet (model of the wavelength in 110～400nm also known as light-sensitive emulsion, ultraviolet cured adhesive
Enclose) light irradiation solidification a class adhesive, specifically, the light trigger (or photosensitizer) in such adhesive is in ultraviolet
Irradiation is lower to absorb generation living radical or cation after ultraviolet light, and trigger monomer polymerization, cross-linking chemistry reaction make binding agent fast
Speed is converted into solid-state by liquid.
Refering to shown in Fig. 2, in some specific embodiments, after UV glue film forming, the UV films for covering underlying circuit layer are formed
13, then mask plate 16 can be positioned on UV films 13, using contactless exposure or projection exposure, ultraviolet light 17
It is irradiated to after mask plate 16 on UV glue so that UV glue crosslinks curing reaction, and the region stopped through mask plate is not sent out
Raw curing reaction, through removing photoresist in through hole, i.e., the aforesaid duct of formed afterwards.
Further, the thin film-forming method of the UV glue can be blade coating, spin coating, dip-coating, spraying, silk-screen, dispensing etc., but not
It is limited to this.
Further, the thickness of the insulating medium layer 13 that the UV adhesive curings are formed is preferably 1 μm -100 μm.
Further, after the UV adhesive curings, specific insulation is preferably greater than 1012Ω cm, its can be good with PET
In conjunction with, and with certain flexibility.
Further, the diameter in the duct is 1 μm -3000 μm.
Further, the conductive through hole 141, conductive blind hole 142, conductive buried via hole 143 can pass through in aforementioned duct
Place's printing electrocondution slurry or conductive ink are simultaneously filled this " plug version " technique of through hole to prepare.
More specifically, Fig. 3 is referred to, during described " plug version technique ", the conductive paste that is printed at through hole 14
Material or conductive ink flows under self gravitation effect, sinkings, contact with underlying circuit layer 121, after solidification so that above circuit
Layer 122 and underlying circuit layer 121 are electrically connected.
Preferably, through hole 14 hole wall incline certain angle so that electrocondution slurry or conductive ink flowing sink when with
Through hole hole wall fully infiltrates, and compared with vertical hole wall, after inclining certain angle, contact path is elongated, causes to lead after solidification
Electric layer is more preferably firm with the adhesive force of hole wall, meanwhile, through hole hole wall inclines certain angle and flexible PCB can also be disperseed to bend
When stress, increase flexible PCB resistance to flexility.
Fig. 4 is referred to again, in some specific embodiments, in order to improve the current load ability of circuit layer, can also be
One layer of copper is plated using electroplating technology on circuit layer 12, for example, it is possible to one layer of copper 1252 be electroplated on circuit layer 1251, is formed
5th circuit layer 125；Also one layer of copper 1262 can be electroplated on circuit layer 1261 in the same manner, form the 6th circuit layer 126.
Wherein, the thickness of copper coating is preferably 0.1 μm -50 μm.
Fig. 5 is referred to again, and in some specific embodiments, a kind of multi-layer flexible circuit board 20 can include flexible parent metal
21, circuit layer 22, insulating medium layer 23, conductive hole 24 etc..The flexible parent metal 21 includes first surface and and first surface
Opposite second surface.The circuit layer 22 includes circuit layer 221,222,223,224,225,226 etc..The insulating medium layer
13 include circuit layer 231,232,233,234,235 etc..The conductive hole 24 includes the conduction through whole flexible circuitry layer
Through hole, the conductive blind hole of connection surface circuit layer and interior circuit layers, conductive buried via hole of connection interior circuit layers etc..
Further, the first surface of the flexible parent metal can also form fluted 210, and the circuit layer 221 can be with portion
Divide or entirety is embedded in the groove 210.
In the same manner, in some embodiments, fluted, the circuit layer 22 also can be formed on 23 surface of insulating medium layer
Divide or entirety is embedded in the groove.
Both designs aforesaid contribute to the thickness for further reducing flexible PCB.
Further, the groove of the flexible parent metal first surface or the dielectric layer surface can embossed technique etc.
Mode is prepared from, may also be employed certainly machining, physically or chemically etching etc. mode formed.
In a specific embodiment of the present utility model, referring to shown in Fig. 1, a kind of multi-layer flexible circuit board
Preparation technology is comprised the following steps：
S1：According to circuit function, there is provided a flexible parent metal 11 (also known as flexible parent metal), then according to the circuit diagram for designing
Size is die cut, and accomplishes fluently location hole in flexible parent metal surrounding；
S2：Activation processing is carried out to improve surface energy to 11 surface of flexible parent metal, surface treatment method has：Sided corona treatment
Method, coating, method of chemical treatment, physical treatment process；
S3：Flexible parent metal 11 is adsorbed in vacuum adsorption table and is printed electrocondution slurry or conductive ink, is finished printing
After solidified, formed first circuit layer 121；It should be noted that according to the function of circuit design, it is right to choose whether to need
Circuit is surface-treated；Wherein surface treatment is divided into surface sanding and polishing or plating, if circuit will load high-frequency signal,
Surface sanding and polishing process is then carried out, if circuit will load super-current power unit, electroplating processes is carried out；
S4：The flexible parent metal for printing first circuit layer is put in vacuum adsorption table, UV glue is scratched, UV glue is scratched into
Contactless or projection exposure is carried out after film, the figure on mask plate is transferred on UV glue, is then entered with organic solvent
Row cleaning is removed photoresist, and forms through hole 14 and first insulating medium layer 131；It should be noted that specific insulation after UV adhesive curings
Should be greater than 1012Ω cm, can have good adhesion with PET, and with certain flexibility；
S5：The technique for repeating S3 and S4, forms second circuit layer 122, the 3rd circuit layer 123, the 4th circuit layer
124th, the 5th circuit layer 125, the 6th circuit layer 126 and second insulating medium layer 132, the 3rd insulating medium layer 133,
4th insulating medium layer 134, the 5th insulating medium layer 135, and it is electrically connected with the logical of insulating medium layer both sides circuit layer
Hole 14 etc..
In the multi-layer flexible circuit board that this utility model is provided, by forming through hole and being filled out with electrocondution slurry or conductive ink
Fill " plug version " technique of through hole to prepare conductive through hole, buried via hole and the blind hole of multilayer circuit, the circuit number of plies can be up to 21 layers, and
And the circuit of random layer can interconnect to form buried via hole inside circuit board, the circuit of the circuit on circuit board top layer and internal random layer
Can interconnect to form blind hole, the through hole through whole circuit board not only can be extended vertically through, can be with the layout according to circuit
Carry out running through around folding with circuit function.
Meanwhile, the multi-layer flexible circuit board that this utility model is provided, based on ground floor flexible parent metal, is superimposed electricity upwards
Road floor and insulating medium layer, belong to the structure of increasing material manufacturing, and its technique is more simple to operation.
Additionally, the multi-layer flexible circuit board that this utility model is provided is drawn materials more extensively, and more frivolous and soft, by control
The thickness of insulating medium layer processed, the thickness of ten layers of circuit can control (the monolayer below 100 μm, with conventional flex circuits plate
Thickness just reaches 100 μm) compare, ultra-thin flexible is truly realized, is suitable to apply in the products such as wearable device.
As follows will be in conjunction with drawings and Examples of the present utility model, further to the technology in this utility model embodiment
Scheme is clearly and completely described, it is clear that described embodiment is a part of embodiment of this utility model, rather than entirely
The embodiment in portion.Embodiment in based on this utility model, those of ordinary skill in the art are not before creative work is made
The every other embodiment for being obtained is put, the scope of this utility model protection is belonged to.
Embodiment 1：
The multi-layer flexible circuit board of the present embodiment include as base material flexible PET film and to be arranged on the PET thin
Flexible circuitry layer on film, first circuit layer that the flexible circuitry layer includes being formed at PET film surface, first insulation
Dielectric layer, second circuit layer, second insulating medium layer, the 3rd circuit layer, the 3rd insulating medium layer and the 4th electricity
Road floor (i.e. top layer circuit layer).Being additionally provided with the flexible circuitry layer, leading of being formed is prepared using previously described " plug version " technique
Electric hole, the conductive hole include conductive through hole through whole flexible circuitry layer, connection surface circuit layer and internal circuit
The conductive blind hole of layer, conductive buried via hole of connection interior circuit layers etc..
The preparation technology of the present embodiment multi-layer flexible circuit board can include：A flexible PET film is provided, using mode of laser
Cut and punch, a width of 250mm × 250mm of length, thickness are 100 μm, and in one layer of adhesion layer of surface-coated, fexible film are placed
In vacuum adsorption table, silver-colored circuit is printed on fexible film using screen printing mode, is positioned in baking oven after finishing printing
In 150 DEG C of heat cure 10min, first circuit layer is formed, then one layer of 5 μ m-thick is scratched in PET film using blade coating mode
UV glue, and contact exposure is carried out using printer, 10S is exposed, and PET film is put into ultrasound 1min in dehydrated alcohol, dried
Insulating medium layer and through hole are formed after dry, then repeated print, solidified, scratched UV glue, expose, remove photoresist, form second circuit
Layer, the 3rd circuit layer and second insulating medium layer, the 3rd insulating medium layer, then print on the 3rd insulating medium layer
Brush top layer circuit, forms top layer circuit layer (i.e. the 4th circuit layer) and components and parts pad, using wet-tumbling so that top layer electricity
Road layer surface roughness is 300nm, using the copper of electroplating technology one layer of 2 μ m-thick of plating, then scratches one layer of UV glue, be exposed,
Remove photoresist so that components and parts pad is exposed, be coated with UV protecting film elsewhere, thus prepare to form about 130 μm of thickness 4 layers
Flexible PET circuit boards.
Embodiment 2：
The multi-layer flexible circuit board of the present embodiment include as base material flexible PET film and to be arranged on the PET thin
Flexible circuitry layer on film, first circuit layer that the flexible circuitry layer includes being formed at PET film surface, first insulation
Dielectric layer, second circuit layer, second insulating medium layer, the 3rd circuit layer, the 3rd insulating medium layer and the 4th electricity
Road floor, the 4th insulating medium layer, the 5th circuit layer, the 5th insulating medium layer, the 6th circuit layer (i.e. top layer circuit
Layer).Being additionally provided with the flexible circuitry layer, the conductive hole to be formed, the conduction is prepared using previously described " plug version " technique
Hole includes conductive through hole through whole flexible circuitry layer, the conductive blind hole of connection surface circuit layer and interior circuit layers, even
Connect conductive buried via hole of interior circuit layers etc..
The preparation technology of the present embodiment multi-layer flexible circuit board can include：A flexibility PEN thin film is provided, using mode of laser
Cut and punch, a width of 100mm × 100mm of length, thickness are 10 μm, and in one layer of adhesion layer of surface-coated, fexible film are placed
In vacuum adsorption table, copper circuit is printed using screen printing mode on fexible film, is positioned under xenon lamp after finishing printing
Solidification 1S, is formed first circuit layer, and is polished using wet-tumbling so that its surface roughness is 200nm, Ran Hou electricity
The copper of one layer of 3 μ m-thick of plating, the UV glue that one layer of 3 μ m-thick is scratched on PI thin film using blade coating mode, and entered using ultraviolet photolithographic machine
Row contact exposure, exposes 60S, and PEN thin film is put into ultrasound 30S in dehydrated alcohol, formed after drying insulating medium layer with
Through hole, then repeats print, solidifies, polishing, electroplating, scratch UV glue, expose, remove photoresist, and forms second circuit layer, the 3rd electricity
Road floor, the 4th circuit layer, the 5th circuit layer and the second insulating medium layer, the 3rd insulating medium layer, the 4th insulation are situated between
The 5th insulating medium layer of matter layer, then prints top layer circuit on the 5th insulating medium layer, forms top layer circuit layer and unit
Device bonding pad, using wet-tumbling so that surface roughness is 300nm, the copper for plating one layer of 2 μ m-thick using electroplating technology, then
One layer of UV glue of blade coating, is exposed, removes photoresist so that components and parts pad is exposed, be coated with UV protecting film elsewhere, thus make
Standby what a 6 layers flexibility PEN circuit boards.
Embodiment 3：
The multi-layer flexible circuit board of the present embodiment include as base material flexible PET film and to be arranged on the PET thin
Flexible circuitry layer on film, first circuit layer that the flexible circuitry layer includes being formed at PET film surface, first insulation
Dielectric layer, second circuit layer, second insulating medium layer, the 3rd circuit layer, the 3rd insulating medium layer and the 4th electricity
Road floor, the 4th insulating medium layer, the 5th circuit layer, the 5th insulating medium layer, the 6th circuit layer etc., until the tenth
Individual insulating medium layer and the 11st circuit layer (i.e. top layer circuit layer).It is additionally provided with using described previously in the flexible circuitry layer
" plug version " technique prepare the conductive hole to be formed, the conductive hole include conductive through hole through whole flexible circuitry layer,
The conductive blind hole of connection surface circuit layer and interior circuit layers, conductive buried via hole of connection interior circuit layers etc..
The preparation technology of the present embodiment multi-layer flexible circuit board can include：A flexibility PI thin film is provided, using mechanical mould
Cut and punch, a width of 300mm × 300mm of length, thickness are 400 μm, and in one layer of adhesion layer of surface-coated, fexible film are placed
In vacuum adsorption table, silver-colored circuit is printed on fexible film using ink jet printing mode, infrared lamp after finishing printing, is positioned over
Lower sintering 10S, is formed first circuit layer, and is polished using wet-tumbling so that surface roughness is 600nm, then
The copper of one layer of 1 μ m-thick of plating, the UV glue that one layer of 10 μ m-thick is scratched on PI thin film using blade coating mode, and adopt ultraviolet photolithographic machine
Contact exposure is carried out, 90S is exposed, and PI thin film is put into ultrasound 1min in dehydrated alcohol, after drying, form insulating medium layer
And through hole, then repeat print, solidify, polishing, electroplating, scratch UV glue, expose, remove photoresist, formed second circuit layer, the 3rd
Circuit layer, the 4th circuit layer, the 5th circuit layer, the 6th circuit layer, the 7th circuit layer, the 8th circuit layer, the 9th
Individual circuit layer, the tenth circuit layer and second insulating medium layer, the 3rd insulating medium layer, the 4th insulating medium layer,
Five insulating medium layers, the 6th insulating medium layer, the 7th insulating medium layer, the 8th insulating medium layer, the 9th insulation
Dielectric layer, the tenth insulating medium layer, then print top layer circuit on the tenth insulating medium layer, formed top layer circuit layer and
Components and parts pad, using wet-tumbling so that surface roughness is 100nm, using electroplating technology plate one layer of 1 μ m-thick copper/nickel/
Stannum, then scratches one layer of UV glue, is exposed, removes photoresist so that components and parts pad is exposed, and is coated with UV protections elsewhere
Film, thus prepares what a 11 layers flexibility PI circuit boards.
Embodiment 4：
The multi-layer flexible circuit board of the present embodiment include as base material flexible PET film and to be arranged on the PET thin
Flexible circuitry layer on film, first circuit layer that the flexible circuitry layer includes being formed at PET film surface, first insulation
Dielectric layer, second circuit layer, second insulating medium layer, the 3rd circuit layer, the 3rd insulating medium layer and the 4th electricity
Road floor (i.e. top layer circuit layer).Being additionally provided with the flexible circuitry layer, leading of being formed is prepared using previously described " plug version " technique
Electric hole, the conductive hole include conductive through hole through whole flexible circuitry layer, connection surface circuit layer and internal circuit
The conductive blind hole of layer, conductive buried via hole of connection interior circuit layers etc..
The preparation technology of the present embodiment multi-layer flexible circuit board can include：A flexible PET film is provided, using mode of laser
Cut and punch, a width of 200mm × 200mm of length, thickness are 50 μm, and in one layer of adhesion layer of surface-coated, then using impressing skill
Art groove at the impressing in PET film, fills silver inks water in a groove using mode of printing, is positioned in baking oven after finishing printing
In 130 DEG C of heat cure 20min, the UV glue for scratching one layer of 6 μ m-thick in PET film using blade coating mode, and entered using printer
Row contact exposure, exposes 5S, and PET film is put into ultrasound 1min in dehydrated alcohol, formed after drying insulating medium layer with
Through hole, then repeats to imprint, prints, solidifies, scratch UV glue, expose, remove photoresist, and forms second layer circuit, third layer circuit and the
Two insulating medium layers, the 3rd insulating medium layer, then embossed grooves print top layer circuit on the 3rd insulating medium layer, are formed
Top layer circuit layer and components and parts pad, using wet-tumbling so that surface roughness is 300nm, plates one layer 2 using electroplating technology
Copper/the ni au of μ m-thick, then scratches one layer of UV glue, is exposed, removes photoresist so that components and parts pad is exposed, and is covered elsewhere
UV protecting film is stamped, what a 4 layers flexibility PET circuit boards are thus prepared.
Finally it should be noted that：Various embodiments above is only in order to illustrating the technical solution of the utility model, rather than which is limited
System；Although being described in detail to this utility model with reference to foregoing embodiments, one of ordinary skill in the art should
Understand：Which still can be modified to the technical scheme described in foregoing embodiments, or to which part or whole
Technical characteristic carries out equivalent；And these modifications or replacement, do not make the essence of appropriate technical solution depart from this practicality new
The scope of each embodiment technical scheme of type.
Claims (14)
1. a kind of multi-layer flexible circuit board, it is characterised in that include：
Flexible parent metal, including first surface and with first surface back to second surface；
Flexible circuitry layer, including alternately laminated (n+1) individual circuit layer and n insulating medium layer, wherein first circuit layer sets
The first surface of the flexible parent metal is placed in, the first insulating medium layer is arranged on first circuit layer, (n+1) individual circuit layer
It is arranged on n-th insulating medium layer, n is the integer more than or equal to 2；
Also, the flexible circuitry layer includes conductive through hole, conductive blind hole and conductive buried via hole, and the conductive through hole is at least in order to general
(n+1) in the flexible circuitry layer individual circuit layer electrical connection, the conductive blind hole at least in order to by (n+1) individual circuit layer with
N-th circuit layer is electrically connected at least one of the 1st circuit layer circuit layer, and the conductive buried via hole is at least in order to by the 1st
At least two circuit layers electrical connection in circuit layer to n-th circuit layer, the conductive through hole, conductive blind hole and conductive buried via hole are equal
Mainly it is made up of the duct being distributed on the insulating medium layer, in the duct, is filled with conductive filler.
2. multi-layer flexible circuit board according to claim 1, it is characterised in that：N is any integer in 2～20.
3. multi-layer flexible circuit board according to claim 1, it is characterised in that：The hole being distributed in the insulating medium layer
Road both ends open, the both ends open are respectively arranged on an insulating medium layer side surface relative with the first surface of the base material
With the first surface of the insulating medium layer and the base material back to another side surface.
4. multi-layer flexible circuit board according to claim 3, it is characterised in that：First table of the duct and the base material
Face back to one end open another end opening relative with the first surface of the base material with diameter greater than the duct straight
Footpath.
5. the multi-layer flexible circuit board according to claim 1,3 or 4, it is characterised in that：A diameter of 1- in the duct
3000μm；And/or, the duct has trapezoid cross section structure.
6. multi-layer flexible circuit board according to claim 1, it is characterised in that：The thickness of the circuit layer is 0.5-50 μ
m.
7. multi-layer flexible circuit board according to claim 1, it is characterised in that：The conductive filler is mainly by conducting metal
The micron particle and/or nanoparticle aggregate of material and/or material with carbon element is formed.
8. multi-layer flexible circuit board according to claim 1, it is characterised in that：At least one circuit layer surface is additionally provided with electricity
Metal cladding.
9. multi-layer flexible circuit board according to claim 8, it is characterised in that：The electroplated metal layer includes copper coating；
And/or, the thickness of the electroplated metal layer is 0.1 μm -50 μm.
10. multi-layer flexible circuit board according to claim 1, it is characterised in that：Electricity when the multi-layer flexible circuit board
When road is used for loading high-frequency signal, the surface roughness of the circuit layer is less than or equal to 300nm.
11. multi-layer flexible circuit boards according to claim 1, it is characterised in that：The first surface of the base material is distributed with
Groove, the flexible circuitry layer is partly or wholly in the groove.
12. multi-layer flexible circuit boards according to claim 1, it is characterised in that：At least one dielectric layer surface is also
Formation is fluted, and the circuit layer at least one insulating medium layer is partly or wholly arranged in the groove.
13. multi-layer flexible circuit boards according to claim 1, it is characterised in that：The thickness of the insulating medium layer is 1-
100μm；And/or, the specific insulation of the insulating medium layer is more than 1012Ω·cm.
14. multi-layer flexible circuit boards according to claim 1, it is characterised in that：The flexible circuitry layer includes more than 3
Circuit layer, and the thickness of the multi-layer flexible circuit board is below 100 μm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621061622.6U CN206024253U (en) | 2016-09-19 | 2016-09-19 | Multi-layer flexible circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621061622.6U CN206024253U (en) | 2016-09-19 | 2016-09-19 | Multi-layer flexible circuit board |
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| CN206024253U true CN206024253U (en) | 2017-03-15 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107087355A (en) * | 2017-06-16 | 2017-08-22 | 东莞职业技术学院 | A kind of method that use screen printing technique realizes the interconnection of PCB internal layers |
| CN107466167A (en) * | 2017-08-10 | 2017-12-12 | 上海幂方电子科技有限公司 | A kind of method that inkjet printing prepares flexible printed multilayer circuit board |
| CN107846776A (en) * | 2016-09-19 | 2018-03-27 | 苏州纳格光电科技有限公司 | Multi-layer flexible circuit board |
| CN108322997A (en) * | 2018-03-07 | 2018-07-24 | 苏州诺莱声科技有限公司 | A kind of flexible printed circuit board and the enhanced ultrasonic transducer that absorbs sound |
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2016
- 2016-09-19 CN CN201621061622.6U patent/CN206024253U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107846776A (en) * | 2016-09-19 | 2018-03-27 | 苏州纳格光电科技有限公司 | Multi-layer flexible circuit board |
| CN107087355A (en) * | 2017-06-16 | 2017-08-22 | 东莞职业技术学院 | A kind of method that use screen printing technique realizes the interconnection of PCB internal layers |
| CN107466167A (en) * | 2017-08-10 | 2017-12-12 | 上海幂方电子科技有限公司 | A kind of method that inkjet printing prepares flexible printed multilayer circuit board |
| CN108322997A (en) * | 2018-03-07 | 2018-07-24 | 苏州诺莱声科技有限公司 | A kind of flexible printed circuit board and the enhanced ultrasonic transducer that absorbs sound |
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Effective date of registration: 20211013 Address after: 215000 Room 202, building 12, Northwest District, Suzhou nano City, No. 99, Jinjihu Avenue, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou chuangyin Electronic Technology Co.,Ltd. Address before: D707, 7th floor, building D, 398 Ruoshui Road, Suzhou Industrial Park, 215000 Jiangsu Province Patentee before: Suzhou Hailu enterprise management partnership (L.P.) |