CN106944745A - A kind of laser processing for processing large format circuit - Google Patents
A kind of laser processing for processing large format circuit Download PDFInfo
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- CN106944745A CN106944745A CN201710267870.9A CN201710267870A CN106944745A CN 106944745 A CN106944745 A CN 106944745A CN 201710267870 A CN201710267870 A CN 201710267870A CN 106944745 A CN106944745 A CN 106944745A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- Optics & Photonics (AREA)
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- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser processing for processing large format circuit, whole region segmentation to be processed is first incited somebody to action into some small machining areas, laser path to be processed is planned in each small machining area, the laser path to be processed includes laser incising line and the junction curve of conducting channel, the junction curve connects the starting ends or final end of two laser incisings line in two neighboring small machining area, the junction curve is located in single corresponding small machining area, the corresponding laser graphics of above-mentioned laser path to be processed are pre-entered into the laser control system of high-velocity scanning galvanometer.This method guarantees that the line of adjacent circuit laser incising is coherent, the completely isolated of coherent laser light score line two side areas is realized, large format, long range, the processing of complex figure circuit is met, makes the range of work of high-velocity scanning galvanometer more extensive.
Description
Technical field
The present invention relates to laser circuit manufacture field, specially a kind of laser processing for processing large format circuit.
Background technology
Chinese invention patent 2014102519075, the applying date is on June 9th, 2014, open a kind of entitled：One kind is used
In aluminium base circuit arrangement of back contact solar cell and preparation method thereof, patent [0049] section is pointed out：" in aluminium based metal
The step of opposite side processing circuit pattern of paper tinsel 203, further comprises following steps：Aluminium based metal paper tinsel 203 is connected on using laser straight
On to depict spacing be 0.1-2 millimeter of parallel curves, then automatic or manual removes the metal part of centre ", [0052]
Section is pointed out:" subsequently into laser rose system, the benchmark of positioning is the perforation 101 on insulated rubber film, directly acts on laser
On aluminium based metal paper tinsel 203, complete circuit pattern is depicted, then the centre that two laser incisings are marked is removed using automatic or manual
Metal part 205, forms insulating tape 204, that is, removes the space left behind the intermetallic metal part that two laser incisings are marked ".
Understand from the above mentioned, the formation of circuit carries out groove by laser scoring technique on aluminium based metal paper tinsel 203, then
The intermetallic metal part 205 that two laser incisings are marked is removed using automatic or manual, insulating tape 204 is formed, without being torn
The metal foil portion come is exactly conducting channel, and the above method is applied to the processing of the less circuitous pattern of breadth, but laser is cut
A speed is cut slow, speed is less than 200mm/s, so if being processed in size very big foil basic layer using this method is needed
Expend for a long time.
With the development of science and technology, high-velocity scanning galvanometer system has been used in the manufacture field of above-mentioned metal foil conducting channel,
The system process velocity is fast, and its speed is more than 10m/s, is very suitable for the processing of the conducting channel of large format, but the system
Only it is suitable for the processing of simple circuitous pattern, such as more conducting channel of straight circuit.
Above two method is all to use groove method, exactly by programming pre-set running orbit, passes through groove method
Multigroup two curves being parallel to each other are depicted on metal foil layer, the metal foil between laser scoring is then removed again so as to shape
Into circuit.
The content of the invention
The present invention is to above weak point there is provided a kind of laser processing for processing large format circuit, and this method ensures
The line of adjacent circuit laser incising it is coherent, realize the completely isolated of coherent laser light score line two side areas, meet significantly
Face, long range, the processing of complex figure circuit, make the range of work of high-velocity scanning galvanometer more extensive.
The technical solution adopted for the present invention to solve the technical problems is：
A kind of laser processing for processing large format circuit, step is as follows：
Step one：The procedure preparation stage of laser graphics:
First entirely region segmentation to be processed into some small machining areas, laser road to be processed will be planned in each small machining area
Footpath, the laser path to be processed includes laser incising line and the junction curve of conducting channel, and the junction curve connection is adjacent
The starting ends or final end of two laser incisings line in two small machining areas, the junction curve is located at single corresponding
Small machining area in, the corresponding laser graphics of above-mentioned laser path to be processed are pre-entered into the laser of high-velocity scanning galvanometer
In control system；
Step 2：The implementation phase of laser graphics：
Laser control system controls one or more groups of high-velocity scanning galvanometers to corresponding small processing district according to the laser graphics of step one
Domain carries out laser incising line and the generation of junction curve respectively, and high-velocity scanning galvanometer is processed after a small machining area, by it
Lathe dragging high-velocity scanning galvanometer is moved to next small machining area and is processed, and final high-velocity scanning galvanometer completes whole to be added
The laser graphics in work area domain.
This laser processing is similar to graphic joining method, entirely metal foil to be processed will be divided into some small processing districts
Domain, then carries out groove processing one by one to zoning respectively by one or more groups of high-velocity scanning galvanometers again, last each small
Graphics processing in machining area is closed just forms a complete processing curve at one piece in whole metal foil, according to idealization
The head and the tail of laser scoring in state, adjacent small machining area should connect together, i.e., whole processing district curve should be connected
It is continuous and continual, but during reality processing, because the mechanical movement track of galvanometer system does not reach so high precision,
Therefore the splicing precision between contiguous concatenation figure does not reach continuous continual requirement, finally in the splicing of adjacent graphics processing
Place occurs the line of discontinuous laser incising, and laser incising line can discontinuously bring very big be stranded for removals of subsequent metal paper tinsel
Difficulty, therefore in order to allow laser grooving and scribing line to form continuous curve, the present invention devises junction curve, the company in step in
Starting ends or final end that curve connects two laser incisings line in two neighboring small machining area are connect, i.e. the connection is bent
The two ends of dislocation or in the incomplete adjacent small machining area of overlap joint two laser incisings line can be all surrounded by line,
That is the design of junction curve eliminate the dislocation between laser incising line two ends or overlap it is imperfect, it is final adjacent
Two laser incising line can be fully connected, and precondition is provided for the smooth removal of subsequent metal paper tinsel.
Brief description of the drawings
Fig. 1 show the groove dislocation situation figure of the present invention；
Fig. 2 show the subregion groove schematic diagram one of the present invention；
Fig. 3 show the subregion groove schematic diagram two of the present invention；
Fig. 4 show the subregion groove schematic diagram three of the present invention；
Fig. 5 show situation figure one of the junction curve positioned at two small machining areas of the present invention；
Fig. 6 show situation figure two of the junction curve positioned at two small machining areas of the present invention.
Embodiment
The present invention will be described in detail with specific embodiment below in conjunction with the accompanying drawings：
Illustrate in Fig. 1 at the dislocation situation of a variety of adjacent laser grooves, 1 is that 3 are inwardly to misplace at equidirectional dislocation, 2
Outwards misplace, be inwardly skew simultaneously at 4, be imperfect for overlap joint at outwards skew simultaneously, 6 at 5, also have in reality processing
Other dislocation situations, will not enumerate herein.
This example describes a kind of laser processing for processing large format circuit, and step is as follows：
Step one：The procedure preparation stage of laser graphics:
First entirely region segmentation to be processed into some small machining areas, laser road to be processed will be planned in each small machining area
Footpath, the laser path to be processed includes laser incising line and the junction curve of conducting channel, and the junction curve connection is adjacent
The starting ends or final end of two laser incisings line in two small machining areas, the junction curve is located at single corresponding
Small machining area in, the corresponding laser graphics of above-mentioned laser path to be processed are pre-entered into the laser of high-velocity scanning galvanometer
In control system；
Step 2：The implementation phase of laser graphics：
Laser control system controls one or more groups of high-velocity scanning galvanometers to corresponding small processing district according to the laser graphics of step one
Domain carries out laser incising line and the generation of junction curve respectively, and high-velocity scanning galvanometer is processed after a small machining area, by it
Lathe dragging high-velocity scanning galvanometer is moved to next small machining area and is processed, and final high-velocity scanning galvanometer completes whole to be added
The laser graphics in work area domain.
In this example, the shape of the junction curve curve is varied, for example circular or polygon, and junction curve is closed
Close or do not close, as long as the junction curve can be by the head and the tail of two laser incising line in the intersection of two small machining areas
End is surrounded, and the two laser incisings line allowed in two small machining areas links up or connected.
Either produced in Fig. 1 which kind of dislocation or overlap it is imperfect, as shown in figs 2-4, as long as in two laser scorings
Head and the tail end depict a junction curve, in this example junction curve be set to closure circular curve, the circular curve
The starting point or terminal of two laser scorings are all enclosed, therefore two score lines formation one of adjacent small machining area
The continuous curve of bar, while can first find out from Fig. 2-Fig. 4, the junction curve is all only inside single small machining area.
Further explain the junction curve to be located in single corresponding small machining area, that is to say, that the company
Just once being formed inside a small machining area for curve is connect, as seen in figs. 5-6, if the junction curve is respectively at two
If being formed inside adjacent small machining area, then two parts connection is bent after junction curve will be divided into two parts, splicing
There is also dislocation for line（Shown in Fig. 6）Or it is discontinuous（Shown in Fig. 5）Situation, so junction curve should be located at it is single corresponding small plus
In the domain of work area.
In this example, for convenience of explanation, as shown in Fig. 2 whole region just has been divided into 4 small machining areas,
The division numbers of small machining area and size will also be depending on the reality processing sizes according to metal foil, while the shape of laser incising line
Shape is also varied, and it is corresponded with circuitry shapes, also will not enumerate herein, the key of this patent is to process
Region carries out subregion processing, while will all by way of setting full curve by the two ends of two laser scorings of intersection
Two laser incising line is connected, while junction curve should be located in single corresponding small machining area.
Claims (1)
1. a kind of laser processing for processing large format circuit, step is as follows：
Step one：The procedure preparation stage of laser graphics:
First entirely region segmentation to be processed into some small machining areas, laser road to be processed will be planned in each small machining area
Footpath, the laser path to be processed includes laser incising line and the junction curve of conducting channel, and the junction curve connection is adjacent
The starting ends or final end of two laser incisings line in two small machining areas, the junction curve is located at single corresponding
Small machining area in, the corresponding laser graphics of above-mentioned laser path to be processed are pre-entered into the laser of high-velocity scanning galvanometer
In control system；
Step 2：The implementation phase of laser graphics：
Laser control system controls one or more groups of high-velocity scanning galvanometers to corresponding small processing district according to the laser graphics of step one
Domain carries out laser incising line and the generation of junction curve respectively, and high-velocity scanning galvanometer is processed after a small machining area, by it
Lathe dragging high-velocity scanning galvanometer is moved to next small machining area and is processed, and final high-velocity scanning galvanometer completes whole to be added
The laser graphics in work area domain.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710267870.9A CN106944745A (en) | 2017-04-22 | 2017-04-22 | A kind of laser processing for processing large format circuit |
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| CN201710267870.9A CN106944745A (en) | 2017-04-22 | 2017-04-22 | A kind of laser processing for processing large format circuit |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108213774A (en) * | 2017-12-13 | 2018-06-29 | 北京华航无线电测量研究所 | A kind of processing technology of radiating guide Complex Different Shape foil-shaped brazing material |
| CN108465946A (en) * | 2018-04-02 | 2018-08-31 | 青岛布雷斯塔信息科技发展有限公司 | A kind of cutting joining method of wide cut multifunction laser machine |
| CN108480859A (en) * | 2018-04-02 | 2018-09-04 | 青岛布雷斯塔信息科技发展有限公司 | A kind of cutting method of wide cut multifunction laser machine |
| CN110116266A (en) * | 2019-04-22 | 2019-08-13 | 武汉铱科赛科技有限公司 | A kind of overlength wiring board material laser processing, device and system |
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| CN101211993A (en) * | 2006-12-31 | 2008-07-02 | 李毅 | Big width laser marking solar cell |
| CN103988283A (en) * | 2011-10-31 | 2014-08-13 | 凯文·迈克尔·科克利 | Interdigitated Foil Interconnect For Rear-Contact Solar Cells |
| CN103997296A (en) * | 2014-06-09 | 2014-08-20 | 占洪平 | Aluminum-base circuit device for back contact solar cell and manufacturing method thereof |
| WO2014158346A1 (en) * | 2013-03-13 | 2014-10-02 | Applied Materials, Inc. | Laser ablation platform for solar cells |
| CN104907703A (en) * | 2015-06-05 | 2015-09-16 | 义乌市圣石激光技术有限公司 | Method and device for improving efficiency in engraving three-dimensional images in large-area flat glass |
| CN106098809A (en) * | 2016-08-19 | 2016-11-09 | 中山瑞科新能源有限公司 | A kind of preparation method of series-parallel film battery assembly |
| CN106378533A (en) * | 2016-09-20 | 2017-02-08 | 武汉吉事达科技股份有限公司 | Silver paste laser etched pattern splicing method |
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2017
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Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101211993A (en) * | 2006-12-31 | 2008-07-02 | 李毅 | Big width laser marking solar cell |
| CN103988283A (en) * | 2011-10-31 | 2014-08-13 | 凯文·迈克尔·科克利 | Interdigitated Foil Interconnect For Rear-Contact Solar Cells |
| WO2014158346A1 (en) * | 2013-03-13 | 2014-10-02 | Applied Materials, Inc. | Laser ablation platform for solar cells |
| CN103997296A (en) * | 2014-06-09 | 2014-08-20 | 占洪平 | Aluminum-base circuit device for back contact solar cell and manufacturing method thereof |
| CN104907703A (en) * | 2015-06-05 | 2015-09-16 | 义乌市圣石激光技术有限公司 | Method and device for improving efficiency in engraving three-dimensional images in large-area flat glass |
| CN106098809A (en) * | 2016-08-19 | 2016-11-09 | 中山瑞科新能源有限公司 | A kind of preparation method of series-parallel film battery assembly |
| CN106378533A (en) * | 2016-09-20 | 2017-02-08 | 武汉吉事达科技股份有限公司 | Silver paste laser etched pattern splicing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108213774A (en) * | 2017-12-13 | 2018-06-29 | 北京华航无线电测量研究所 | A kind of processing technology of radiating guide Complex Different Shape foil-shaped brazing material |
| CN108465946A (en) * | 2018-04-02 | 2018-08-31 | 青岛布雷斯塔信息科技发展有限公司 | A kind of cutting joining method of wide cut multifunction laser machine |
| CN108480859A (en) * | 2018-04-02 | 2018-09-04 | 青岛布雷斯塔信息科技发展有限公司 | A kind of cutting method of wide cut multifunction laser machine |
| CN110116266A (en) * | 2019-04-22 | 2019-08-13 | 武汉铱科赛科技有限公司 | A kind of overlength wiring board material laser processing, device and system |
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Application publication date: 20170714 |