CN106937491A - One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application - Google Patents
One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application Download PDFInfo
- Publication number
- CN106937491A CN106937491A CN201710218498.2A CN201710218498A CN106937491A CN 106937491 A CN106937491 A CN 106937491A CN 201710218498 A CN201710218498 A CN 201710218498A CN 106937491 A CN106937491 A CN 106937491A
- Authority
- CN
- China
- Prior art keywords
- gold
- nickel
- plating
- pcb board
- board card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 114
- 239000010931 gold Substances 0.000 title claims abstract description 114
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 110
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 238000007747 plating Methods 0.000 title claims abstract description 79
- 238000000034 method Methods 0.000 title claims abstract description 72
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 53
- 238000005246 galvanizing Methods 0.000 title claims abstract description 19
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 8
- 238000005554 pickling Methods 0.000 claims description 8
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 claims description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 4
- 229910000085 borane Inorganic materials 0.000 claims description 4
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004327 boric acid Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- 235000011194 food seasoning agent Nutrition 0.000 claims description 4
- DITXJPASYXFQAS-UHFFFAOYSA-N nickel;sulfamic acid Chemical class [Ni].NS(O)(=O)=O DITXJPASYXFQAS-UHFFFAOYSA-N 0.000 claims description 4
- 229910001379 sodium hypophosphite Inorganic materials 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 16
- 238000005516 engineering process Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 7
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical class Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 3
- 239000004278 EU approved seasoning Substances 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 210000004209 hair Anatomy 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000009533 lab test Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Abstract
The present invention provides a kind of pcb board card gold finger galvanizing nickel that is based on plating gold process and its application.With（Electronickelling+plating gold）Technique substitutes original（Chemical nickel+chemistry gold+plating gold）Technique, this process increases the hardness of golden finger in PCB, reduces board golden finger and the probability of scratch occurs, improves the connect-disconnect life of board golden finger.
Description
Technical field
Pcb board card gold finger galvanizing nickel is based on the present invention relates to the making manufacture field of PCB, more particularly to one kind
With plating gold process and its application.
Background technology
Golden finger is the portion being in contact with other substrates for relevant devices such as computer display card, memory bar, USB interfaces
Position can meet the requirement of multiple plug, it is necessary to have good wearability and low contact resistance.
At present, the golden finger on pcb board factory processing PCB plate, is all to use（Chemical nickel+chemistry gold+plating gold）Technique, gold
Finger hardness is general, scratch easily occurs, and connect-disconnect life is not high.
The content of the invention
In order to overcome above-mentioned deficiency of the prior art, the present invention provide it is a kind of based on pcb board card gold finger galvanizing nickel and
Plating gold process and its application, use（Electronickelling+plating gold）Technique substitutes original（Chemical nickel+chemistry gold+plating gold）Technique,
This process increases the hardness of golden finger in PCB, reduce board golden finger and the probability of scratch occur, improve board
The connect-disconnect life of golden finger.
A kind of pcb board card gold finger galvanizing nickel and plating gold process and its application technology scheme of being based on of the invention is to cover
After lid gold finger lead, electronickelling and plating gold process are carried out successively on golden finger surface.
The electro-nickel process is that nickel plating solution used is consisted of the following composition：420-550g/L nickel sulfamic acids, 40-
60g/L nickel chlorides, dimethyamine borane 20-30 g/L, 20-50g/L boric acid, sodium hypophosphite 20-30 g/L.
The electro-nickel process is the electroless nickel layer under 55-70ASF current densities.
The plating gold process is that the gold ion concentration in golden plating solution used is 3-7g/L；Golden plating solution proportion is 1.10-
1.15g/cm 3。
The plating gold process, current density is 25-35ASF.
After plating gold process terminates, carry out pickling, ultrasonic wave successively to golden finger and embathe and drying and processing.
The pickling, specially use quality percentage are that 12% watery hydrochloric acid carries out cleaning 30-60s, then use deionization
Water rinses 20s.
The ultrasonic wave embathes specifically, ultrasonic frequency is 60000HZ-80000HZ, embathes the time for 30-90s.
Drying and processing is specifically, using 40-50 DEG C of hot-air seasoning, then room temperature placement cooling.
A kind of described answering in terms of golden finger hardness is improved based on pcb board card gold finger galvanizing nickel and plating gold process
With.
As can be seen from the above technical solutions, the present invention has advantages below：
In pcb board station-service prior art as shown in Figure of description Fig. 1 and Fig. 2（Chemical nickel and gold+plating gold）Technique and Ben Fa
Bright（Electronickelling+plating gold）Technique respectively process 50pcs boards checking improve, it is identical scrape pin and identical power under conditions of, hair
Cash finger prior art（Chemical nickel and gold+plating gold）The scratch of processing technology is relatively deep more apparent.By prior art（Change
Learn nickel gold+plating gold）Technique and of the invention（Electronickelling+plating gold）The board of technique processing is sent to third party LAB test hairs
It is existing, it is of the invention（Electronickelling+plating gold）Technique processing PCB golden finger hardness significantly improve, average hardness reach 110 with
On, and（Chemical nickel and gold+plating gold）The PCB golden finger hardness average values of technique are less than 90.As can be seen here, with of the invention（Electricity
Nickel plating+plating gold）Processing technology of golden finger, improves the hardness of PCB golden fingers, improves the connect-disconnect life of pcb board golden finger.
Brief description of the drawings
In order to illustrate more clearly of technical scheme, will make simple to the accompanying drawing to be used needed for description below
Introduce on ground, it should be apparent that, drawings in the following description are only some embodiments of the present invention, for ordinary skill
For personnel, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 show golden finger use（Chemical nickel and gold+plating gold）Scratch picture of the processing technology under proof force.
Fig. 2 show golden finger with of the invention（Electronickelling+plating gold）Scratch picture of the processing technology under proof force.
Specific embodiment
To enable that the purpose of the present invention, feature, advantage are more obvious and understandable, below in conjunction with this specific implementation
Accompanying drawing in example, is clearly and completely described, it is clear that the embodiments described below are only to the technical scheme in the present invention
Only it is a part of embodiment of the invention, and not all embodiment.Based on the embodiment in this patent, ordinary skill people
All other embodiment that member is obtained under the premise of creative work is not made, belongs to the scope of this patent protection.
Embodiment 1
One kind of the invention is based on pcb board card gold finger galvanizing nickel and electroplates gold process and its application, after covering gold finger lead,
Electronickelling and plating gold process are carried out successively on golden finger surface.
The electro-nickel process is that nickel plating solution used is consisted of the following composition：500g/L nickel sulfamic acids, 50g/L
Nickel chloride, dimethyamine borane 25 g/L, 30g/L boric acid, the g/L of sodium hypophosphite 25.
The electro-nickel process is the electroless nickel layer under 60ASF current densities.
The plating gold process is that the gold ion concentration in golden plating solution used is 5g/L；Golden plating solution proportion is 1.12g/cm
3。
The plating gold process, current density is 30ASF.
After plating gold process terminates, carry out pickling, ultrasonic wave successively to golden finger and embathe and drying and processing.
The pickling, specially use quality percentage are that 12% watery hydrochloric acid carries out cleaning 45s, then use deionized water
Rinse 20s.
The ultrasonic wave embathes specifically, ultrasonic frequency is 70000HZ, embathes the time for 60s.
Drying and processing is specifically, using 50 DEG C of hot-air seasonings, then room temperature placement cooling.
In pcb board station-service prior art as shown in Figure of description Fig. 1 and Fig. 2（Chemical nickel and gold+plating gold）Technique and
It is of the invention（Electronickelling+plating gold）Technique is respectively processed the checking of 50pcs boards and is improved, in the identical condition for scraping pin and identical power
Under, find golden finger prior art（Chemical nickel and gold+plating gold）The scratch of processing technology is relatively deep more apparent.By prior art
's（Chemical nickel and gold+plating gold）Technique and of the invention（Electronickelling+plating gold）The board of technique processing is sent to third party LAB surveys
Examination finds, of the invention（Electronickelling+plating gold）The PCB golden finger hardness of technique processing is significantly improved, and average hardness reaches 110
More than, and（Chemical nickel and gold+plating gold）The PCB golden finger hardness average values of technique are less than 90.As can be seen here, with of the invention
（Electronickelling+plating gold）Processing technology of golden finger, improves the hardness of PCB golden fingers, improves the plug longevity of pcb board golden finger
Life.
Embodiment 2
One kind of the invention is based on pcb board card gold finger galvanizing nickel and electroplates gold process and its application, after covering gold finger lead,
Electronickelling and plating gold process are carried out successively on golden finger surface.
The electro-nickel process is that nickel plating solution used is consisted of the following composition：550g/L nickel sulfamic acids, 40g/L
Nickel chloride, dimethyamine borane 21 g/L, 20g/L boric acid, the g/L of sodium hypophosphite 20.
The electro-nickel process is the electroless nickel layer under 70ASF current densities.
The plating gold process is that the gold ion concentration in golden plating solution used is 3g/L；Golden plating solution proportion is 1.10g/cm
3。
The plating gold process, current density is 25ASF.
After plating gold process terminates, carry out pickling, ultrasonic wave successively to golden finger and embathe and drying and processing.
The pickling, specially use quality percentage are that 12% watery hydrochloric acid carries out cleaning 60s, then use deionized water
Rinse 20s.
The ultrasonic wave embathes specifically, ultrasonic frequency is 60000HZ, embathes the time for 50s.
Drying and processing is specifically, using 40 DEG C of hot-air seasonings, then room temperature placement cooling.
In pcb board station-service prior art as shown in Figure of description Fig. 1 and Fig. 2（Chemical nickel and gold+plating gold）Technique and
It is of the invention（Electronickelling+plating gold）Technique is respectively processed the checking of 50pcs boards and is improved, in the identical condition for scraping pin and identical power
Under, find golden finger prior art（Chemical nickel and gold+plating gold）The scratch of processing technology is relatively deep more apparent.By prior art
's（Chemical nickel and gold+plating gold）Technique and of the invention（Electronickelling+plating gold）The board of technique processing is sent to third party LAB surveys
Examination finds, of the invention（Electronickelling+plating gold）The PCB golden finger hardness of technique processing is significantly improved, and average hardness reaches 110
More than, and（Chemical nickel and gold+plating gold）The PCB golden finger hardness average values of technique are less than 90.As can be seen here, with of the invention
（Electronickelling+plating gold）Processing technology of golden finger, improves the hardness of PCB golden fingers, improves the plug longevity of pcb board golden finger
Life.
Prior art（Chemical nickel and gold+plating gold）Technique and of the invention（Electronickelling+plating gold）The gold of technique processing
Finger hardness test result table is as shown in table 1：
Table 1：
| Testing process | Testing standard | Test gold is thick | Test result 1 | Test result 2 | Test result 3 | Average value |
| Prior art | HV0.3 | ＞ 50U | 90 | 83 | 86 | 86 |
| Embodiment 1 | HV0.3 | ＞ 50U | 110 | 113 | 114 | 127 |
| Embodiment 2 | HV0.3 | ＞ 50U | 129 | 126 | 125 | 112 |
Claims (10)
1. it is a kind of to be based on pcb board card gold finger galvanizing nickel and plating gold process, it is characterised in that after covering gold finger lead,
Golden finger surface carries out electronickelling and plating gold process successively.
2. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 1 is with plating gold process, it is characterised in that
The electro-nickel process is that nickel plating solution used is consisted of the following composition：420-550g/L nickel sulfamic acids, 40-60g/L chlorine
Change nickel, dimethyamine borane 20-30 g/L, 20-50g/L boric acid, sodium hypophosphite 20-30 g/L.
3. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 2 is with plating gold process, it is characterised in that
The electro-nickel process is the electroless nickel layer under 55-70ASF current densities.
4. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 1 is with plating gold process, it is characterised in that
The plating gold process is that the gold ion concentration in golden plating solution used is 3-7g/L；Golden plating solution proportion is 1.10-1.15g/cm
3。
5. one kind according to claim 4 is based on pcb board card gold finger galvanizing nickel and plating gold process and its application, and it is special
Levy and be, the plating gold process, current density is 25-35ASF.
6. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 1 is with plating gold process, it is characterised in that
After plating gold process terminates, carry out pickling, ultrasonic wave successively to golden finger and embathe and drying and processing.
7. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 6 is with plating gold process, it is characterised in that
The pickling, specially use quality percentage are that 12% watery hydrochloric acid carries out cleaning 30-60s, then use deionized water rinsing
20s。
8. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 6 is with plating gold process, it is characterised in that
The ultrasonic wave embathes specifically, ultrasonic frequency is 60000HZ-80000HZ, embathes the time for 30-90s.
9. a kind of pcb board card gold finger galvanizing nickel that is based on according to claim 6 is with plating gold process, it is characterised in that
Drying and processing is specifically, using 40-50 DEG C of hot-air seasoning, then room temperature placement cooling.
10. a kind of hard in raising golden finger based on pcb board card gold finger galvanizing nickel and plating gold process as claimed in claim 1
Application in terms of degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710218498.2A CN106937491A (en) | 2017-04-05 | 2017-04-05 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710218498.2A CN106937491A (en) | 2017-04-05 | 2017-04-05 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937491A true CN106937491A (en) | 2017-07-07 |
Family
ID=59426616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710218498.2A Pending CN106937491A (en) | 2017-04-05 | 2017-04-05 | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106937491A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385500A (en) * | 2017-07-12 | 2017-11-24 | 信丰迅捷兴电路科技有限公司 | A kind of production equipment and its control method of pcb board plating golden finger |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047348A (en) * | 1989-05-19 | 1990-11-28 | 湖南省冶金材料研究所 | Method for brushing gilding on spectacle-frame |
| CN1500910A (en) * | 2002-11-15 | 2004-06-02 | 中国科学院金属研究所 | Chemical nickel-plating method on magnesium alloy surface |
| CN1798868A (en) * | 2002-04-03 | 2006-07-05 | 应用材料股份有限公司 | Electroless deposition method |
| CN1928156A (en) * | 2005-09-05 | 2007-03-14 | 李克清 | Chemical plating method for Mg and its alloy |
| CN101695223A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing circuit board |
| CN102296332A (en) * | 2011-09-05 | 2011-12-28 | 厦门华戎能源科技有限公司 | Method for directly plating conductive metal on surface of polyethylene |
| CN202425191U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Thick-gold electro-plated battery flexible circuit board |
| CN202425198U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Nickel-and-gold-plated flexible printed circuit board (PCB) |
| CN102753734A (en) * | 2010-01-22 | 2012-10-24 | 爱德有限公司 | Composite plating solution having diamond microparticles dispersed therein, and process for production thereof |
| CN102828207A (en) * | 2012-09-13 | 2012-12-19 | 广东达志环保科技股份有限公司 | Nickel electroplating solution and electroplating method thereof |
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
| CN103397359A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Manufacturing method of electroplated connecting fingers free of lead wire residual |
| CN104023483A (en) * | 2014-06-12 | 2014-09-03 | 深圳崇达多层线路板有限公司 | Gold finger three-surface plating method |
| CN104342646A (en) * | 2014-10-20 | 2015-02-11 | 深圳市飞世尔实业有限公司 | Cyanide-free gold plating method for preparing ACF (anisotropic conductive film) conductive gold spheres |
| CN104394655A (en) * | 2014-10-22 | 2015-03-04 | 深圳崇达多层线路板有限公司 | Gold finger manufacturing method for reducing oxidation of gold finger |
| CN104918421A (en) * | 2015-05-25 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for PCB golden finger |
| CN105040049A (en) * | 2015-09-11 | 2015-11-11 | 南通皋鑫电子股份有限公司 | High-voltage diode silicon stack surface electrogilding process |
| CN105636364A (en) * | 2016-03-08 | 2016-06-01 | 深圳崇达多层线路板有限公司 | Manufacturing method of golden finger |
| CN105704946A (en) * | 2016-03-22 | 2016-06-22 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces |
| CN105764270A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
-
2017
- 2017-04-05 CN CN201710218498.2A patent/CN106937491A/en active Pending
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1047348A (en) * | 1989-05-19 | 1990-11-28 | 湖南省冶金材料研究所 | Method for brushing gilding on spectacle-frame |
| CN1798868A (en) * | 2002-04-03 | 2006-07-05 | 应用材料股份有限公司 | Electroless deposition method |
| CN1500910A (en) * | 2002-11-15 | 2004-06-02 | 中国科学院金属研究所 | Chemical nickel-plating method on magnesium alloy surface |
| CN1928156A (en) * | 2005-09-05 | 2007-03-14 | 李克清 | Chemical plating method for Mg and its alloy |
| CN101695223A (en) * | 2009-09-30 | 2010-04-14 | 深圳市金百泽电路板技术有限公司 | Method for producing circuit board |
| CN102753734A (en) * | 2010-01-22 | 2012-10-24 | 爱德有限公司 | Composite plating solution having diamond microparticles dispersed therein, and process for production thereof |
| CN102296332A (en) * | 2011-09-05 | 2011-12-28 | 厦门华戎能源科技有限公司 | Method for directly plating conductive metal on surface of polyethylene |
| CN202425191U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Thick-gold electro-plated battery flexible circuit board |
| CN202425198U (en) * | 2012-01-12 | 2012-09-05 | 深圳市爱升精密电路科技有限公司 | Nickel-and-gold-plated flexible printed circuit board (PCB) |
| CN102828207A (en) * | 2012-09-13 | 2012-12-19 | 广东达志环保科技股份有限公司 | Nickel electroplating solution and electroplating method thereof |
| CN103233250A (en) * | 2013-04-28 | 2013-08-07 | 胜宏科技（惠州）股份有限公司 | Method for electroplating goldfinger with thick gold layer |
| CN103397359A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Manufacturing method of electroplated connecting fingers free of lead wire residual |
| CN104023483A (en) * | 2014-06-12 | 2014-09-03 | 深圳崇达多层线路板有限公司 | Gold finger three-surface plating method |
| CN104342646A (en) * | 2014-10-20 | 2015-02-11 | 深圳市飞世尔实业有限公司 | Cyanide-free gold plating method for preparing ACF (anisotropic conductive film) conductive gold spheres |
| CN104394655A (en) * | 2014-10-22 | 2015-03-04 | 深圳崇达多层线路板有限公司 | Gold finger manufacturing method for reducing oxidation of gold finger |
| CN104918421A (en) * | 2015-05-25 | 2015-09-16 | 深圳崇达多层线路板有限公司 | Manufacturing method for PCB golden finger |
| CN105040049A (en) * | 2015-09-11 | 2015-11-11 | 南通皋鑫电子股份有限公司 | High-voltage diode silicon stack surface electrogilding process |
| CN105636364A (en) * | 2016-03-08 | 2016-06-01 | 深圳崇达多层线路板有限公司 | Manufacturing method of golden finger |
| CN105704946A (en) * | 2016-03-22 | 2016-06-22 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board with golden finger coated with gold on four surfaces |
| CN105764270A (en) * | 2016-04-22 | 2016-07-13 | 深圳崇达多层线路板有限公司 | Manufacturing method of PCB possessing entire board electrolytic gold and golden finger surface processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107385500A (en) * | 2017-07-12 | 2017-11-24 | 信丰迅捷兴电路科技有限公司 | A kind of production equipment and its control method of pcb board plating golden finger |
| CN107385500B (en) * | 2017-07-12 | 2023-09-19 | 信丰迅捷兴电路科技有限公司 | Production equipment of PCB gold-plated fingers and control method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106758173B (en) | A kind of carbon fiber of metal-modified and preparation method thereof | |
| TWI314845B (en) | Conductive metal plated polyimide substrate and process for manufacturing the same | |
| CN106337197B (en) | A kind of electric connector electroplating technology | |
| CN106868509A (en) | A kind of graphene modified Lead dioxide anode modifiedby fluorine resin and preparation method thereof | |
| CN103981513B (en) | A kind of method at Electroless Nickel Plating on Carbon Fiber | |
| CN104561943A (en) | Chemical nickel-palladium alloy plating process for circuit boards | |
| CN104120469A (en) | Method for carrying out electronickelling on neodymium-iron-boron magnet | |
| CN104073849B (en) | A kind of technique of Sintered NdFeB magnet electroplating nickel on surface tungsten phosphorus | |
| CN106937491A (en) | One kind is based on pcb board card gold finger galvanizing nickel and plating gold process and its application | |
| CN108277480A (en) | A kind of method of graphite nickel plating | |
| CN106048564A (en) | ABS plastic surface palladium-free activation metallization method | |
| TW201640964A (en) | Surface-treated copper foil for forming high frequency signal transmission circuit, copper clad laminate board and printed wiring board | |
| CN104098277A (en) | Method for copperizing and silvering on surface of glass bead, and copperized and silvered glass bead | |
| CN102851654B (en) | Sensitization-free chemical nickel-plating method of conducting glass | |
| CN106283027B (en) | The method that brass surfaces prepare silvery white chemical composition coating | |
| CN104445997A (en) | Method for performing chemical nickel plating on surface of capacitive touch screen | |
| CN104060246B (en) | The tin plating electroless solution of aluminum alloy surface and the tin plating method of aluminum alloy surface | |
| CN107217244A (en) | Alkalescence solution glue | |
| CN103871540B (en) | A kind of nickel bag glass conductive powder body and preparation method thereof for conductive rubber | |
| CN106282977A (en) | The method of energy-saving ultrasonic wave added 316L rustless steel chemical plating nickel-phosphorus alloy | |
| CN110714216A (en) | Nickel-plated copper strip and preparation method thereof | |
| CN106190649B (en) | A kind of method that cleaning solution and its cleaning PCB move back molten tin bath | |
| CN106702448A (en) | Pretreatment method of nickel material electrogilding | |
| CN108666013A (en) | A kind of flexible composite transparent conductive film and preparation method thereof | |
| CN106917078B (en) | A kind of displacement plating palladium method for copper surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |