CN107385500A - A kind of production equipment and its control method of pcb board plating golden finger - Google Patents
A kind of production equipment and its control method of pcb board plating golden finger Download PDFInfo
- Publication number
- CN107385500A CN107385500A CN201710565528.7A CN201710565528A CN107385500A CN 107385500 A CN107385500 A CN 107385500A CN 201710565528 A CN201710565528 A CN 201710565528A CN 107385500 A CN107385500 A CN 107385500A
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- China
- Prior art keywords
- pcb board
- transfer wheel
- cylinder
- bath
- material transfer
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Abstract
The present invention relates to pcb board manufacture field, the more particularly to a kind of production equipment and its control method of pcb board plating golden finger, including electroplating bath group, material transfer wheel group and two confession material-receiving devices located at material transfer wheel group both sides above electroplating bath group, material transfer wheel group includes the first material transfer wheel, second material transfer wheel, first material transfer wheel is provided with four first cantilevers, first cantilever outer end bottom is provided with the first cylinder, first cylinder end is hinged with the first material grasping folder, second material transfer wheel is provided with four second cantilevers, second cantilever outer end bottom is provided with the second cylinder, second cylinder end is hinged with the first material grasping folder, first material grasping folder can carry out material with the second material grasping folder and exchange.Its is simple in construction by the present invention, and floor space is few, can not only improve the precision positioned between raw material and electroplating bath, and with two upper shots and two blanking points, energy feeding and blanking simultaneously, substantially increase production efficiency.
Description
Technical field
The present invention relates to pcb board manufacture field, more particularly to a kind of production equipment of pcb board plating golden finger and its control
Method.
Background technology
Pcb board is widely used in electric equipment, for transmitting operating current and data-signal.In the production of PCB plates
During, generally require to plate golden finger.Means traditional at present are to hang on pcb board on hook, and then hook moves down,
Pcb board is put into electroplating bath and electroplated, and then pcb board is cleaned.During plating, its process include cleaning,
Nickel plating, cleaning, gold-plated, cleaning, current is typically all to use linear production line or circular line, linear pattern production
The equipment of line and circular line is excessive, and floor space is more, and is all that material is put extension from a fixed feed point
Hook, then link up with the drive of transmission chain, successively by each electroplating bath group, and complete in these grooves plating and clear
Wash, after machining, in the blanking point blanking of another fixation.The production efficiency of so pattern is not high, and due to life
Producing line is long, it is easy to causes the position inaccurate between raw material and each electroplating bath, influences electroplating quality and efficiency.
The content of the invention
The present invention is the existing technological deficiency of solution, there is provided a kind of production equipment of pcb board plating golden finger, its structure
Simply, floor space is few, can not only improve the precision positioned between raw material and electroplating bath, and with two upper shots with
Two blanking points, energy feeding and blanking simultaneously, substantially increase production efficiency.Its specific technical scheme is as follows：
The present invention disclose the production equipment that a kind of pcb board plates golden finger, including electroplating bath group, above electroplating bath group
And material transfer wheel group and two for transmitting material supply material-receiving devices located at material transfer wheel group both sides, material transfer wheel group includes
First material transfer wheel, the second material transfer wheel, crossbearer, above electroplating bath group, crossbearer subtracts crossbearer provided with the first decelerator, second
Fast device, connection is engaged by gear between the first material transfer wheel and the first decelerator, led between the second material transfer wheel and the second decelerator
Cross gear engagement connection；
First material transfer wheel, which comprises at least, has four rhizospheres to be hanged around the first material transfer wheel center spaced set and isometric first
Arm, the first cantilever outer end lower section are provided with the first material grasping folder for being used to capture material, the first material grasping folder and the first cantilever outer end bottom
Between by one be used to making material grasping to be moved up under pressing from both sides in the groove of electroplating bath group to be carried out to the material on the first material grasping folder
The first cylinder connection of processing；
Second material transfer wheel, which comprises at least, has four rhizospheres to be hanged around the second material transfer wheel center spaced set and isometric second
Arm, the second cantilever outer end lower section are provided with the second material grasping folder for being used to capture material, the second material grasping folder and the second cantilever outer end bottom
Between by one be used to making material grasping to be moved up under pressing from both sides in the groove of electroplating bath group to be carried out to the material on the second material grasping folder
The second cylinder connection of processing；
First material grasping folder can carry out material with the second material grasping folder and exchange, so that material is transferred to second from the first material transfer wheel
Follow-up procedure of processing is carried out after material transfer wheel.
Further, electroplating bath group includes the first nickel bath, the second nickel bath, the first plating bath, the second plating bath, the
One rinse bath, the second rinse bath, the 3rd rinse bath, the first rinse bath, the first nickel bath, the second rinse bath and the first plating bath
Below the circus movement track of the first material-hent seat, and the first rinse bath, the first nickel bath, the second rinse bath and the first plating
Golden groove is around the rotation axis spaced set successively in the direction of the clock of the first material transfer wheel, the 3rd rinse bath, the second nickel plating
Groove, the second rinse bath and the second plating bath are located at below the circus movement track of the second material-hent seat, and the 3rd rinse bath, second
Nickel bath, the second rinse bath and the second plating bath are equidistant successively in the direction of the clock around the rotation axis of the second material transfer wheel
Set；
Include first for material-receiving device and supply splicing unit for splicing unit, second, first is located at first for splicing unit
Above rinse bath, second is located above the 3rd rinse bath for splicing unit.
Further, the connected mode between the first material grasping folder and the first cylinder is be hinged second material grasping folder and the second gas
Connected mode between cylinder is be hinged.
Further, first conveyer belt, the second conveyer belt, the 3rd conveyer belt are also included, first conveyer belt one end is close
First supplies splicing unit, feed end of the first conveyer belt other end close to the 3rd conveyer belt；Second conveyer belt one end is close to second
For splicing unit, the feed end of the other end of the second conveyer belt close to the 3rd conveyer belt.
Further, travelling gear is additionally provided with crossbearer, travelling gear is located between the first decelerator and the second decelerator
And it is connected with the first decelerator and the second decelerator.
Further, the first material transfer wheel is synchronous with the second material transfer wheel, gap rotates, and the angle rotated every time is 90 degree.
Further, the first material grasping folder includes two the first clamping parts worked independently from each other, and the second material grasping folder includes
There are two the second clamping parts worked independently from each other.
The present invention also provides a kind of control method of the production equipment of pcb board plating golden finger, comprises the following steps：
S1, feeding：
One of them first material grasping folder is from first for gripping the first pcb board at splicing unit；
Synchronously, one of them second material transfer wheel supplies to grip the second pcb board at splicing unit from second；
S2, cleaning：
Starting the first cylinder, the first cylinder movable end moves down so that the first pcb board enters in the first rinse bath cleans,
Start the first cylinder, the first cylinder movable end moves up so that the first pcb board leaves the first rinse bath, completes the first pcb board
Clean for the first time；
Synchronously, the second cylinder is started, the second cylinder movable end moves down so that the second pcb board enters the 3rd rinse bath
Interior cleaning, the movable end of the second cylinder moves up so that the second pcb board leaves the 3rd rinse bath, completes the first of the second pcb board
Secondary cleaning；
S3, nickel plating：
First material transfer wheel is rotated, and the first pcb board is brought to above the first nickel bath, and then the first material transfer wheel stops operating,
Starting the first cylinder, the first cylinder movable end moves down so that the first pcb board enters nickel plating in the first nickel bath, and then first
Cylinder movable end moves up so that the first pcb board leaves the first nickel bath, the first pcb board nickel plating of completion；
Synchronously, the second material transfer wheel rotates, and the second pcb board is brought to above the second nickel bath, then the second material transfer wheel stops
Rotation stop is moved, and starts the second cylinder, and the second cylinder movable end moves down so that the second pcb board enters nickel plating in the second nickel bath, so
The second cylinder movable end is moved up so that the second pcb board leaves the second nickel bath, the second pcb board nickel plating of completion afterwards；
S4, cleaning：
First material transfer wheel is rotated, and the first pcb board is brought to above the second rinse bath, and then the first material transfer wheel stops operating,
Starting the first cylinder, the first cylinder movable end moves down so that the first pcb board enters in the second rinse bath cleans, and then first
Cylinder movable end moves up so that the first pcb board leaves the first rinse bath, and complete the first pcb board second cleans；
Synchronously, the second material transfer wheel rotates, and the second pcb board is brought to above the second nickel bath, then the second material transfer wheel stops
Rotation stop is moved, and starts the second cylinder, and the second cylinder movable end moves down so that the second pcb board enters nickel plating in the second nickel bath, so
The second cylinder movable end is moved up so that the second pcb board leaves the second nickel bath afterwards, and complete the second pcb board second cleans；
S5, reload：
The first material grasping without the first pcb board of clamping of first material transfer wheel presss from both sides clamps the 2nd PCB at the second material transfer wheel
Plate；
Synchronously, the second material grasping without the second pcb board of clamping of the second material transfer wheel presss from both sides receives the at the first material transfer wheel
One pcb board；
It is S6, gold-plated：
First material transfer wheel is rotated, and the second pcb board is brought to above the first plating bath, and then the first material transfer wheel stops operating,
Start the first cylinder, the first cylinder movable end move down so that the second pcb board enter it is gold-plated in the first plating bath, then first
Cylinder movable end moves up so that the second pcb board leaves the first plating bath, the gold plating process of the second pcb board of completion；
Synchronously, the second material transfer wheel rotates, and the first pcb board is brought to above the second plating bath, then the second material transfer wheel stops
Rotation stop is moved, start the second cylinder, the second cylinder movable end move down so that the first pcb board enter the second plating bath in it is gold-plated, so
The second cylinder movable end is moved up so that the first pcb board leaves the second plating bath, the gold plating process of the first pcb board of completion afterwards；
S7, cleaning：First material transfer wheel rotates, and the second pcb board is brought to above the first rinse bath, then the first material transfer wheel
Stop operating, start the first cylinder, the first cylinder movable end move down so that the second pcb board enter the first rinse bath in clean,
Then the first cylinder movable end is moved up so that the second pcb board leaves the first rinse bath, and the third time for completing the second pcb board is clear
Wash；
Synchronously, the second material transfer wheel rotates, and the first pcb board is brought to above the 3rd rinse bath, then the second material transfer wheel stops
Rotation stop is moved, and starts the second cylinder, and the second cylinder movable end moves down so that the first pcb board enters cleaning in the 3rd rinse bath, so
The second cylinder movable end is moved up so that the first pcb board leaves the 3rd rinse bath afterwards, and the third time for completing the first pcb board is cleaned.
Further, it is further comprising the steps of after step s 7：
S8, conveying：
First removes the second pcb board for splicing unit from the first material transfer wheel, and the second pcb board is moved to first conveyer belt,
The second pcb board is delivered to the 3rd conveyer belt by first conveyer belt；
Synchronously, second the first pcb board is removed from the second material transfer wheel for splicing unit, the first pcb board is moved to second
Conveyer belt, the second bin is delivered to the 3rd conveyer belt by the second conveyer belt.
Beneficial effects of the present invention：The present invention can supply splicing unit feeding simultaneously first for splicing unit, second,
Raw material by the running of the first material transfer wheel and the second material transfer wheel so as to first for splicing unit and the second confession splicing unit it
Between move, and electroplating work procedure is completed in the moving process, the present invention makes two productions equivalent to two production lines are incorporated
Line can be produced simultaneously, and two production lines share same electroplating bath group, not only improve utilization rate of equipment and installations, improve production
Efficiency, and the floor space of equipment is few, saves space, is more beneficial for managing control；In addition, the present invention using material transfer wheel come
Raw material is transmitted, and material transfer wheel uses gear drive, can improve the positioning precision of raw material.
Brief description of the drawings
Fig. 1 is the structural representation of the embodiment of the present invention；
Fig. 2 is the material transfer wheel group structure schematic diagram of the embodiment of the present invention；
Fig. 3 is the structural representation of the first material transfer wheel of the present invention；
Fig. 4 is the structural representation of the second material transfer wheel of the present invention.
Marked in figure：First material transfer wheel 100, the first cantilever 101, the first cylinder 102, the first material grasping folder 103, the first folder
Hold portion 104, the second material transfer wheel 200, the second cantilever 201, the second cylinder 202, the second material grasping folder 203, the second clamping part 204, the
One confession splicing unit 320, the second confession splicing unit 310, the first rinse bath 410, the first nickel bath 420, the second rinse bath 430,
Second plating bath 440, the 3rd rinse bath 450, the second nickel bath 460, the first plating bath 470, crossbearer 500, travelling gear 501,
First decelerator 502, the second decelerator 503.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to
The embodiment of accompanying drawing description is exemplary, it is intended to for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
It is easy to the description present invention and simplifies description, rather than instruction or implies that signified device or element there must be specific side
Position, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that indicating or implying relatively important
Property or the implicit quantity for indicating indicated technical characteristic.Thus, " first " is defined, the feature of " second " can be expressed
Or implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or two
More than, unless otherwise specifically defined.
In the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ", " fixation "
It should be interpreted broadly Deng term, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can be with
It is mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, can be two
The connection of individual element internal.For the ordinary skill in the art, it can understand that above-mentioned term exists as the case may be
Concrete meaning in the present invention.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through that can also include the first and second features
Other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
The present invention is described in further detail below by embodiment combination accompanying drawing.Refer to Fig. 1-Fig. 4
The present invention discloses a kind of production equipment and its control method of pcb board plating golden finger, includes material transfer wheel group, passes
Material wheel group includes the first material transfer wheel 100, the second material transfer wheel 200, crossbearer 500, and the first material transfer wheel 100 is close to the second material transfer wheel 200
To carry out material transmission between the two, crossbearer 500 is provided with the first decelerator 502, the second decelerator 503, the first material transfer wheel
Connection is engaged by gear between 100 and the first decelerator 502, passed through between the second material transfer wheel 200 and the second decelerator 503
Gear engagement connection, gear engagement connection can improve the rotation precision of the first material transfer wheel 100 and the second material transfer wheel 200；
There are four rhizospheres equidistantly to be set around the center of the first material transfer wheel 100 as shown in Fig. 2 the first material transfer wheel 100 comprises at least
Put and the first isometric cantilever 101, the electroplating process with pcb board coordinates for convenience, preferably four, adjacent two first
Angle between cantilever 101 is right angle.The outer end bottom of first cantilever 101 is provided with the first cylinder 102 set down, the first gas
The fixing end of cylinder 102 connection the first cantilever 101 outer end bottom, the movable end of the first cylinder 102 is downward and presss from both sides 103 with the first material grasping
It is be hinged；First material grasping folder 103 with the hinged place of the movable end of the first cylinder 102 be provided with motor so that the first material grasping press from both sides 103 can be along
Its pin joint is rotated to facilitate the progress material between the second material transfer wheel 200 to exchange, and the first material grasping folder 103 is provided with two mutually
The first clamping part 104 to work independently, first clamping part 104 are controlled it promptly or unclamped by independent motor.
As shown in figure 3, the second material transfer wheel 200, which comprises at least, has four rhizospheres around the center spaced set of the second material transfer wheel 200
And the second isometric cantilever 201, for convenience with the electroplating process cooperation of pcb board, preferably four, adjacent two second are outstanding
Angle between arm 201 is right angle.The outer end bottom of second cantilever 201 is provided with the second cylinder 202 set down, the second cylinder
202 fixing ends connection the second cantilever 201 outer end bottom, the telescopic end of the second cylinder 202 down and with the hinge of the second material grasping folder 203
Connect, the hinged place of the second material grasping folder 203 and the movable end of the second cylinder 202 is provided with motor to drive the second material grasping to press from both sides 203 along its
Pin joint is rotated to facilitate the progress material between the first material transfer wheel 100 to exchange, and the second material grasping folder 203 includes two mutually
The second clamping part 204 to work independently, the second clamping part 204 are controlled it promptly or unclamped by motor.
Further, the production line also includes supplying material-receiving device and electroplating bath group；
As shown in figure 1, electroplating bath is mounted on below material transfer wheel group, including the first nickel bath 420, the second nickel bath 460,
First plating bath 470, the second plating bath 440, the first rinse bath 410, the second rinse bath 430, the 3rd rinse bath 450.
First rinse bath 410, the first nickel bath 420, the second rinse bath 430 and the first plating bath 470 are located at the first material grasping
Below the circus movement track in portion, and the first rinse bath 410, the first nickel bath 420, the second rinse bath 430 and the first plating bath
470 around the first material transfer wheel 100 rotation axis spaced set successively in the direction of the clock.
3rd rinse bath 450, the second nickel bath 460, the second rinse bath 430 and the second plating bath 440 are located at the second material grasping
Below the circus movement track in portion, and the 3rd rinse bath 450, the second nickel bath 460, the second rinse bath 430 and the second plating bath
440 around the second material transfer wheel 200 rotation axis spaced set successively in the direction of the clock；
Include for material-receiving device and machined for being fed and receiving on the first material transfer wheel 100 to the first transmission wheel 100
Material first processed for splicing unit 320, for being fed and receiving on the second material transfer wheel 200 to the second transmission wheel 200
Into material second for splicing unit 310, first for splicing unit 320 located at the top of the first rinse bath 410, second for connecing
Material unit 310 is located at the top of the 3rd rinse bath 450.
Further, in order that the first material transfer wheel 100 and the synchronous axial system of the second material transfer wheel 200, it is additionally provided with crossbearer 500
Travelling gear 501, travelling gear 501 be located between the first decelerator 502 and the second decelerator 503 and with the first decelerator 502
And second decelerator 503 be connected.
Further, in order that the first material transfer wheel 100 and the second material transfer wheel 200 are preferably positioned above electroplating bath, the
One material transfer wheel 100 and the gap of the second material transfer wheel 200 rotate, and the angle rotated every time is 90 degree.
Further, in addition to strip workbench, workbench bottom is provided with power set, and power set are used to driving the
The decelerator 503 of one speed reducer 502 and second, crossbearer 500, first is for splicing unit 320, second for splicing unit 310, the
One nickel bath 420, the second nickel bath 460, the first plating bath 470, the second plating bath 440, the cleaning of the first rinse bath 410, second
The rinse bath 450 of groove 430 and the 3rd is on workbench.
Further, also include for transmit first for the finishing material of splicing unit 320 first conveyer belt,
In transmission second for the second conveyer belt of the finishing material of splicing unit 310, defeated from first conveyer belt and second for transmitting
The 3rd conveyer belt of the material of band is sent, on the 3rd conveyer belt, first conveyer belt is remote for first conveyer belt, the connection of the second conveyer belt
One end from the 3rd conveyer belt connects with first for splicing unit 320, and the second conveyer belt is away from the 3rd conveyer belt
One end connects with second for splicing unit 310.
The operation principle of the present invention：
S1, feeding：
One of them first clamping part 104 of one of them first material grasping folder 103 is from first for being pressed from both sides at splicing unit 320
Take the first pcb board；
Synchronously, one of them second clamping part 204 of one of them second material grasping folder 203 supplies splicing unit from second
The second pcb board is gripped at 310；
Go to step S2；
S2, cleaning：
Start the first cylinder 102, the movable end of the first cylinder 102 moves down so that the first pcb board enters the first rinse bath
Cleaned in 410, start the first cylinder 102, the movable end of the first cylinder 102 moves up so that the first pcb board leaves the first rinse bath
410, complete the first time cleaning of the first pcb board；
Synchronously, the second cylinder 202 is started, the movable end of the second cylinder 202 moves down so that the second pcb board enters the 3rd
Clean in rinse bath 450, the movable end of the second cylinder 202 moves up so that the second pcb board leaves the 3rd rinse bath 450, completes
The first time cleaning of second pcb board；
Go to step S3；
S3, nickel plating：
First material transfer wheel 100 rotates, and the first pcb board is brought to above the first nickel bath 420, then the first material transfer wheel 100
Stop operating, start the first cylinder 102, the movable end of the first cylinder 102 moves down so that the first pcb board enters the first nickel bath
Nickel plating in 420, then the movable end of the first cylinder 102 move up so that the first pcb board leaves the first nickel bath 420, complete first
Pcb board nickel plating；
Synchronously, the second material transfer wheel 200 is rotated, and the second pcb board is brought to the top of the second nickel bath 460, then second passed
Material wheel 200 stops operating, and starts the second cylinder 202, and the movable end of the second cylinder 202 moves down so that the second pcb board enters second
Nickel plating in nickel bath 460, then the movable end of the second cylinder 202 move up so that the second pcb board leaves the second nickel bath 460, it is complete
Into the second pcb board nickel plating；
Go to step S4；
S4, cleaning：
First material transfer wheel 100 rotates, and the first pcb board is brought to above the second rinse bath 430, then the first material transfer wheel 100
Stop operating, start the first cylinder 102, the movable end of the first cylinder 102 moves down so that the first pcb board enters the second rinse bath
Cleaned in 430, then the movable end of the first cylinder 102 is moved up so that the first pcb board leaves the first rinse bath 410, completion first
Second of cleaning of pcb board；
Synchronously, the second material transfer wheel 200 is rotated, and the second pcb board is brought to the top of the second nickel bath 460, then second passed
Material wheel 200 stops operating, and starts the second cylinder 202, and the movable end of the second cylinder 202 moves down so that the second pcb board enters second
Nickel plating in nickel bath 460, then the movable end of the second cylinder 202 move up so that the second pcb board leaves the second nickel bath 460, it is complete
Into second of cleaning of the second pcb board；
Go to step S5；
S5, reload：
Another first clamping part 104 of first material transfer wheel 100 receives the 2nd PCB plates at the second material transfer wheel 200；
Synchronously, another second clamping part 204 of the second material transfer wheel 200 receives first at the first material transfer wheel 100
Pcb board；
Go to step S6；
It is S6, gold-plated：
First material transfer wheel 100 rotates, and the second pcb board is brought to above the first plating bath 470, then the first material transfer wheel 100
Stop operating, start the first cylinder 102, the movable end of the first cylinder 102 moves down so that the second pcb board enters the first plating bath
Gold-plated in 470, then the movable end of the first cylinder 102 is moved up so that the second pcb board leaves the first plating bath 470, completion second
The gold plating process of pcb board；
Synchronously, the second material transfer wheel 200 is rotated, and the first pcb board is brought to the top of the second plating bath 440, then second passed
Material wheel 200 stops operating, and starts the second cylinder 202, and the movable end of the second cylinder 202 moves down so that the first pcb board enters second
Gold-plated in plating bath 440, then the movable end of the second cylinder 202 is moved up so that the first pcb board leaves the second plating bath 440, complete
Into the gold plating process of the first pcb board；
Go to step S7；
S7, cleaning：First material transfer wheel 100 is rotated, and the second pcb board is brought to the top of the first rinse bath 410, and then first
Material transfer wheel 100 stops operating, and starts the first cylinder 102, and the movable end of the first cylinder 102 moves down so that the second pcb board enters the
Cleaned in one rinse bath 410, then the movable end of the first cylinder 102 is moved up so that the second pcb board leaves the first rinse bath 410,
Complete the third time cleaning of the second pcb board；
Synchronously, the second material transfer wheel 200 is rotated, and the first pcb board is brought to the top of the 3rd rinse bath 450, then second passed
Material wheel 200 stops operating, and starts the second cylinder 202, and the movable end of the second cylinder 202 moves down so that the first pcb board enters the 3rd
Clean in rinse bath 450, then the movable end of the second cylinder 202 is moved up so that the first pcb board leaves the 3rd rinse bath 450, complete
Third time into the first pcb board is cleaned；
Go to step S8；
S8, conveying：
First removes the second pcb board for splicing unit 320 from the first material transfer wheel 100, and the second pcb board is moved to first
Conveyer belt, the second pcb board is delivered to the 3rd conveyer belt by first conveyer belt；
Synchronously, second the first pcb board is removed from the second material transfer wheel 200 for splicing unit 310, the first pcb board is moved
To the second conveyer belt, the second bin is delivered to the 3rd conveyer belt by the second conveyer belt.
In the description of this specification, reference term " embodiment ", " some embodiments ", " an implementation
The description of example ", " some embodiments ", " example ", " specific example " or " some examples " etc. means to combine the embodiment or shown
Specific features, structure, material or the feature of example description are contained at least one embodiment or example of the present invention.At this
In specification, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the tool of description
Body characteristicses, structure, material or feature can be tied in an appropriate manner in any one or more embodiments or example
Close.
Above content is to combine specific embodiment further description made for the present invention, it is impossible to assert this
The specific implementation of invention is confined to these explanations.For general technical staff of the technical field of the invention, not
On the premise of departing from present inventive concept, some simple deduction or replace can also be made.
Claims (9)
1. a kind of production equipment of pcb board plating golden finger, including electroplating bath group, above the electroplating bath group and for passing
The material transfer wheel group of defeated material and two confession material-receiving devices located at the material transfer wheel group both sides, it is characterised in that the material transfer
Wheel group includes the first material transfer wheel (100), the second material transfer wheel (200), crossbearer (500), and the crossbearer (500) is located at the electroplating bath
Group top, the crossbearer (500) are provided with the first decelerator (502), the second decelerator (503), the first material transfer wheel (100)
Connection, the second material transfer wheel (200) and second decelerator are engaged by gear between first decelerator (502)
(503) engaged and connected by gear between；
The first material transfer wheel (100) comprise at least have four rhizospheres around the first material transfer wheel (100) center spaced set and
Isometric the first cantilever (101), the first cantilever (101) outer end lower section are provided with the first material grasping folder for being used to capture material
(103), between described first material grasping folder (103) and first cantilever (101) outer end bottom it is used to that material grasping can be made by one
Moved up under folder in the groove of electroplating bath group so as to the first cylinder being processed to the material on first material grasping folder (103)
(102) connect；
The second material transfer wheel (200) comprise at least have four rhizospheres around the second material transfer wheel (200) center spaced set and
Isometric the second cantilever (201), the second cantilever (201) outer end lower section are provided with the second material grasping folder for being used to capture material
(203), between described second material grasping folder (203) and second cantilever (201) outer end bottom it is used to that material grasping can be made by one
Moved up under folder in the groove of electroplating bath group so as to the second cylinder being processed to the material on second material grasping folder (203)
(202) connect；
First material grasping folder (103), which with second material grasping presss from both sides (203), can carry out material and exchange, so that material is from described first
Material transfer wheel carries out follow-up procedure of processing after being transferred to the second material transfer wheel.
A kind of 2. production equipment of pcb board plating golden finger as claimed in claim 1, it is characterised in that：
The electroplating bath group includes the first nickel bath (420), the second nickel bath (460), the first plating bath (470), second gold-plated
Groove (440), the first rinse bath (410), the second rinse bath (430), the 3rd rinse bath (450), first rinse bath (410),
First nickel bath (420), second rinse bath (430) and first plating bath (470) are located at first material grasping
Below the circus movement track in portion, and first rinse bath (410), first nickel bath (420), second rinse bath
(430) and first plating bath (470) around the first material transfer wheel (100) rotation axis in the direction of the clock successively etc.
Spacing is set；3rd rinse bath (450), the second nickel bath (460), the second rinse bath (430) and the second plating bath (440)
Below the circus movement track of second material-hent seat, and the 3rd rinse bath (450), the second nickel bath (460), the
Two rinse baths (430) and the second plating bath (440) around the second material transfer wheel (200) rotation axis in the direction of the clock according to
Secondary spaced set；
Described to include first for splicing unit (320), second for splicing unit (310) for material-receiving device, described first for connecing
For material unit (320) above first rinse bath, described second is located at the 3rd rinse bath for splicing unit (310)
(450) top.
3. the production equipment of a kind of pcb board plating golden finger as claimed in claim 2, it is characterised in that it is defeated also to include first
Send band, the second conveyer belt, the 3rd conveyer belt, described first conveyer belt one end supplies splicing unit close to described first, and described first
Feed end of the conveyer belt other end close to the 3rd conveyer belt；Described second conveyer belt one end supplies splicing list close to described second
Member, the feed end of the other end of second conveyer belt close to the 3rd conveyer belt.
4. the production equipment of a kind of pcb board plating golden finger as claimed in claim 1, it is characterised in that on the crossbearer (500)
Travelling gear (501) is additionally provided with, the travelling gear (501) is located at first decelerator (502) and second decelerator
(503) it is connected between and with first decelerator (502) and second decelerator (503).
A kind of 5. production equipment of pcb board plating golden finger as claimed in claim 1, it is characterised in that the first material transfer wheel
, gap synchronous with the second material transfer wheel rotates, and the angle rotated every time is 90 degree.
A kind of 6. production equipment of pcb board plating golden finger as claimed in claim 1, it is characterised in that the first material grasping folder
(103) connected mode between first cylinder (102) is be hinged the second material grasping folder (203) and second gas
Connected mode between cylinder (202) is be hinged.
A kind of 7. production equipment of pcb board plating golden finger as claimed in claim 1, it is characterised in that the first material grasping folder
(103) two the first clamping parts worked independently from each other (104) are included, the second material grasping folder (203) includes two phases
The second clamping part (204) mutually to work independently.
8. the control method of a kind of production equipment as described in claim any one of 1-7, it is characterised in that according to following steps
Implement：
S1, feeding：
One of them described first clamping part (104) of the first material grasping folder (103) is from described first for splicing unit (320)
The first pcb board of place's gripping；
Synchronously, one of them described second clamping part (204) of second material-hent seat supplies splicing unit from described second
(310) place grips the second pcb board；
S2, cleaning：
Start the first cylinder (102), the first cylinder (102) movable end moves down so that first pcb board enters first
Cleaned in rinse bath (410), start the first cylinder (102), the first cylinder (102) movable end is moved up so that described first
Pcb board leaves the first rinse bath (410), completes the first time cleaning of the first pcb board；
Synchronously, the second cylinder (202) is started, the second cylinder (202) movable end is moved down so that second pcb board enters
Enter in the 3rd rinse bath (450) and clean, the movable end of the second cylinder (202) move up so that second pcb board leave it is described
3rd rinse bath (450), complete the first time cleaning of the second pcb board；
S3, nickel plating：
The first material transfer wheel (100) is rotated, and first pcb board is brought to above first nickel bath (420), Ran Hou
One material transfer wheel (100) is stopped operating, and starts the first cylinder (102), and the first cylinder (102) movable end is moved down so that described first
Pcb board enters the interior nickel plating of first nickel bath (420), and then the first cylinder (102) movable end is moved up so that described
First pcb board leaves first nickel bath (420), completes the first pcb board nickel plating；
Synchronously, the second material transfer wheel (200) is rotated, and second pcb board is brought to second nickel bath (460)
Side, then the second material transfer wheel (200) stops operating, and starts second cylinder (202), the second cylinder (202) movable end
Move down so that second pcb board enters the interior nickel plating of second nickel bath (460), then second cylinder (202) is living
Moved end moves up so that second pcb board leaves second nickel bath (460), the second pcb board nickel plating of completion；
S4, cleaning：
The first material transfer wheel (100) is rotated, and first pcb board is brought to above second rinse bath (430), Ran Hou
One material transfer wheel (100) is stopped operating, and starts the first cylinder (102), and the first cylinder (102) movable end is moved down so that described first
Pcb board, which enters in second rinse bath (430), to be cleaned, and then the first cylinder (102) movable end is moved up so that described
First pcb board leaves first rinse bath (410), completes second of cleaning of the first pcb board；
Synchronously, the second material transfer wheel (200) is rotated, and second pcb board is brought to second nickel bath (460)
Side, then the second material transfer wheel (200) stops operating, and starts second cylinder (202), the second cylinder (202) movable end
Move down so that second pcb board enters the interior nickel plating of second nickel bath (460), then second cylinder (202) is living
Moved end moves up so that second pcb board leaves second nickel bath (460), and complete the second pcb board second cleans；
S5, reload：
Another described first clamping part (104) of the first material grasping folder (103) clamps from the second material transfer wheel (200)
Second pcb board；
Synchronously, another described second clamping part (204) of second material grasping folder (203) is from the first material transfer wheel
(100) place receives first pcb board；
It is S6, gold-plated：
The first material transfer wheel (100) is rotated, and second pcb board is brought to above first plating bath (470), Ran Hou
One material transfer wheel (100) is stopped operating, and starts the first cylinder (102), and the first cylinder (102) movable end is moved down so that described second
Pcb board enter first plating bath (470) in it is gold-plated, then the first cylinder (102) movable end is moved up so that described
Second pcb board leaves first plating bath (470), completes the gold plating process of the second pcb board；
Synchronously, the second material transfer wheel (200) is rotated, and first pcb board is brought to second plating bath (440)
Side, then the second material transfer wheel (200) stops operating, and starts second cylinder (202), the second cylinder (202) movable end
Move down so that first pcb board enters gold-plated in second plating bath (440), then the second cylinder (202) work
Moved end moves up so that first pcb board leaves second plating bath (440), the gold plating process of the first pcb board of completion；
S7, cleaning：The first material transfer wheel (100) is rotated, and second pcb board is brought to first rinse bath (410)
Side, then the first material transfer wheel (100) stops operating, start the first cylinder (102), the first cylinder (102) movable end move down so as to
Make second pcb board enter in first rinse bath (410) to clean, then the first cylinder (102) movable end moves up
So that second pcb board leaves first rinse bath (410), the third time cleaning of the second pcb board is completed；
Synchronously, the second material transfer wheel (200) is rotated, and first pcb board is brought to the 3rd rinse bath (450)
Side, then the second material transfer wheel (200) stops operating, and starts second cylinder (202), the second cylinder (202) movable end
Move down so that first pcb board enters cleaning in the 3rd rinse bath (450), then second cylinder (202) is living
Moved end is moved up so that first pcb board leaves the 3rd rinse bath (450), and the third time for completing the first pcb board is cleaned.
9. control method as claimed in claim 7, it is characterised in that further comprising the steps of after the step S7：
S8, conveying：
Described first removes second pcb board for splicing unit (320) from the first material transfer wheel (100), described the
Two pcb boards move to the first conveyer belt, and second pcb board is delivered to the 3rd conveyer belt by first conveyer belt；
Synchronously, described second first pcb board is removed from the second material transfer wheel (200) for splicing unit (310),
First pcb board moves to second conveyer belt, and second bin is delivered to the 3rd conveyer belt by the second conveyer belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710565528.7A CN107385500B (en) | 2017-07-12 | 2017-07-12 | Production equipment of PCB gold-plated fingers and control method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710565528.7A CN107385500B (en) | 2017-07-12 | 2017-07-12 | Production equipment of PCB gold-plated fingers and control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107385500A true CN107385500A (en) | 2017-11-24 |
| CN107385500B CN107385500B (en) | 2023-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710565528.7A Active CN107385500B (en) | 2017-07-12 | 2017-07-12 | Production equipment of PCB gold-plated fingers and control method thereof |
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| Publication number | Publication date |
|---|---|
| CN107385500B (en) | 2023-09-19 |
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