CN107217244A - Alkalescence solution glue - Google Patents
Alkalescence solution glue Download PDFInfo
- Publication number
- CN107217244A CN107217244A CN201710485683.8A CN201710485683A CN107217244A CN 107217244 A CN107217244 A CN 107217244A CN 201710485683 A CN201710485683 A CN 201710485683A CN 107217244 A CN107217244 A CN 107217244A
- Authority
- CN
- China
- Prior art keywords
- solution glue
- complexing agent
- alkalescence solution
- alkalescence
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Abstract
The present invention provides a kind of alkalescence solution glue, alkalescence solution glue includes alkali, complexing agent, stabilizer, the content of alkali is 1g/L~8g/L, the content of complexing agent is 8g/L~12g/L, the content of stabilizer is 1g/L~5g/L, alkali is sodium hydroxide or/and potassium hydroxide, complexing agent is potassium pyrophosphate, stabilizer is sodium acid carbonate, using above scheme, the Bivalent Tin in frosting colloid is adsorbed by alkalescence solution glue, peel off, the action time of alkalescence solution glue is short, quickly remove stannous while not reacted with Metal Palladium, and there is complexing agent to be complexed, the palladium little particle in colloid is set to be exposed to frosting, so that Metal Palladium has catalytic activity.
Description
Technical field
The present invention relates to plastic electroplating technical field, more particularly, to a kind of alkalescence solution glue.
Background technology
Plastic electroplating product has the organic solvent-resistant, fast light of good the lightweight of plastics, corrosion resistance, easy-formation and metal concurrently
According to, metallic luster, thermal conductivity, electric conductivity, electromagnetic shielding, easily weld the advantages of, in automobile, motorcycle, hardware, electronics, communication
Etc. industry extensive use.
In electroplating process, colloid palladium that plastic surface is adsorbed in catalytic liquid and without catalytic activity because around it
It is wrapped in by divalent tin ion, it is necessary to which the Bivalent Tin dissolved by solving glue process around palladium makes its exposed and really has catalysis
Activity, promotes chemical nickel to generate.
Upper plating phenomenon in the PC regions of double-colored material plastics is plating of overflowing, and causes to overflow activity of the reason for the plating including active liquid not
High, later stage maintenance is improper and the unstable caused dispergation of dispergation liquid medicine generation aging is not thorough.Existing acid degumming agent is to double
Colorant electroplates Shortcomings, because plating piece after activation is during cleaning, stannous ion can be hydrolyzed, and hydrolysis is obtained
Tin compound can react that to be formed around glue be stannic colloid palladium with palladium, obtained tetravalence tin ion it is molten with it is strong
Acid, exposes Metal Palladium, but the overlong time of Acidic Liquid dispergation, not only by tetravalent tin ion remaval, while also by Metal Palladium
Reaction takes place, catalytic activity reduction causes plating phenomenon of overflowing.
The content of the invention
The main object of the present invention is to provide the alkalescence solution glue that a kind of efficiency of construction is high and labor intensive cost is low.
To realize above-mentioned main purpose, the alkalescence solution glue that the present invention is provided includes alkali and complexing agent, the content of alkali
For 1g/L~8g/L, the content of complexing agent is 8g/L~12g/L.
As can be seen here, can be molten to the Bivalent Tin in frosting colloid under conditions of room temperature by alkalescence solution glue
Solution, stripping, while being difficult to react with Metal Palladium, the palladium little particle that complexing agent is risen in complexing, colloid is exposed to plastics
Surface so that Metal Palladium has catalytic activity, reduces plating phenomenon of overflowing, it is ensured that the effect of plating.
Further scheme is that the content of alkali is 6g/L~8g/L, and the content of the complexing agent is 8g/L~10g/L.
Further scheme is that alkali is sodium hydroxide or/and potassium hydroxide, and the complexing agent is potassium pyrophosphate.
Further scheme is that alkalescence solution glue includes stabilizer, and the content of the stabilizer is 1g/L~5g/L.
As can be seen here, stabilizer is added in alkalescence solution glue, can effectively extends the service life of alkalescence solution glue.
Further scheme is that stabilizer is sodium acid carbonate.
Embodiment
The alkalescence solution glue that the present invention is provided is applied in plastic electroplating technique, during plastic electroplating, utilizes alkali
Property solution glue quick adsorption and stripping are carried out to the Bivalent Tin in the frosting colloid after activation, make small of the palladium in colloid
Grain is exposed to frosting, while not reacted with Metal Palladium, Metal Palladium is had catalytic activity in frosting.
With reference to specific embodiment, the invention will be further described, but protection scope of the present invention is not limited to this.
Embodiment 1
1st, frosting is activated
(1) (PC and ABS, chemical plating region are molded pretreatment of base material dual-color plastic with ABS, and non-chemical plating region is noted with PC
Modeling)：Dual-color plastic is put into degreasing fluid, degreasing fluid includes consisting of composition：1mol/L sodium hydroxides, 1mol/L sodium carbonate with
And 0.1mol/L dodecyl sodium sulfates；Dual-color plastic is embathed 5 minutes at 50 DEG C of oil removing solution temperature, and running water is used after taking-up
Cleaning.
(2) dual-color plastic after cleaning is subjected to roughening treatment, roughening solution temperature is 70 DEG C, and dual-color plastic is molten in roughening
Chromium oxide containing 300g and 100g 98% sulfuric acid in liquid soak time 10-30 minutes, every 1 liter of roughening solution, after taking-up
Cleaned with running water.
(3) reduce：Dual-color plastic after step (2) cleaning is subjected to reduction treatment, 10% oxalic acid solution is placed on
In, 30 DEG C of solution temperature, soak time 3 minutes rises and rinsed after taking out with running water.
(4) salt pickling, salt pickling (hydrochloric acid that concentration is 30%) is carried out by the dual-color plastic after step (3) cleaning,
Solution temperature is 20~30 DEG C, and soak time 1 minute is cleaned after taking-up with running water.
(5) activate：Dual-color plastic is immersed in palladium water, soaking temperature is 25 DEG C, soak time 3 minutes is used certainly after taking-up
Water is cleaned.
(6) dispergation：By by step (5) cleaning after dual-color plastic carry out dispergation, solution sol solution include consisting of into
Point：7g/L sodium hydroxides, 10g/L potassium pyrophosphates and 3g/L sodium acid carbonates, room temperature, soak time 50s use running water after taking-up
Cleaning.
(7) chemical nickel plating：By by dispergation dual-color plastic be put into chemical nickel plating plating solution (E300A40ml/L and
E300B60ml/L, pH value 8.5) in, 8min is soaked at 32 DEG C, plating piece Y1 is obtained.
Embodiment 2
Method according to embodiment 1 prepares plating piece Y2, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Sodium hydroxide 1g/L, potassium pyrophosphate 12g/L and sodium acid carbonate 5g/L.
Embodiment 3
Method according to embodiment 1 prepares plating piece Y3, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Sodium hydroxide 8g/L, potassium pyrophosphate 8g/L and sodium acid carbonate 1g/L.
Embodiment 4
Method according to embodiment 1 prepares plating piece Y4, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Potassium hydroxide 6g/L, potassium pyrophosphate 8g/L and sodium acid carbonate 2g/L.
Embodiment 5
Method according to embodiment 1 prepares plating piece Y5, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Sodium hydroxide 3g/L, potassium pyrophosphate 9g/L and sodium acid carbonate 4g/L.
Embodiment 6
Method according to embodiment 1 prepares plating piece Y6, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Sodium hydroxide 7g/L.
Embodiment 7
Method according to embodiment 1 prepares plating piece Y7, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Potassium hydroxide 7g/L and potassium pyrophosphate 10g/L.
Embodiment 8
Method according to embodiment 1 prepares plating piece Y8, and difference is, the alkalescence solution glue of the present embodiment includes consisting of
Composition：Sodium hydroxide 7g/L and sodium acid carbonate 3g/L.
Comparative example 1
Method according to embodiment 1 prepares plating piece Z1, and difference is, the solution glue of this comparative example include consisting of into
Point：Concentration is 10% hydrochloric acid.
Comparative example 2
Method according to embodiment 1 prepares plating piece Z2, and difference is, the solution glue of this comparative example include consisting of into
Point：Concentration is 30% hydrochloric acid.
Method of testing and result
1st, whether the PC regions of plating piece are upper is plated
Range estimation, whether there is in the PC regions of plating piece has coating or copper point.It the results are shown in Table 1.
2nd, solution glue produces the sedimentation time
By after embodiment 1-8 and comparative example 1,2 uses solution glue place, record solution glue in produce precipitation when
Between.It the results are shown in Table 1.
Table 1
From table 1 it follows that carrying out the PC of the frosting of dispergation using embodiments of the invention 1-5 solution sol solution
The supreme plating in region and its service life is long, the frosting that sol solution carries out dispergation is solved using the embodiment of the present invention 6,7,8
PC put in region it is ten times greater after can be seen that margin location is equipped with trickle upper plating and service life is shorter, and the solution peptization applied in comparative example
The PC regions that liquid carries out the frosting of dispergation have upper plating phenomenon and service life is extremely short, therefore the solution sol solution of the present invention can
Suppress the upper plating in PC regions, and complexing agent and stabilizer, effectively keep the stability of alkali, the service life for solving sol solution is long.
Finally it is emphasized that the invention is not restricted to above-mentioned embodiment, the foregoing is only the preferable implementation of invention
Example, be not intended to limit the invention, it is all the present invention spirit with principle within made any modification, equivalent substitution and
Improve etc., it should be included in the scope of the protection.
Claims (5)
1. alkalescence solution glue, it is characterised in that including：
Alkali and complexing agent, the content of the alkali is 1g/L~8g/L, and the content of the complexing agent is 8g/L~12g/L.
2. alkalescence solution glue according to claim 1, it is characterised in that：
The content of the alkali is 6g/L~8g/L, and the content of the complexing agent is 8g/L~10g/L.
3. alkalescence solution glue according to claim 2, it is characterised in that：
The alkali is sodium hydroxide or/and potassium hydroxide, and the complexing agent is potassium pyrophosphate.
4. the alkalescence solution glue according to any one of claims 1 to 3, it is characterised in that：
The alkalescence solution glue includes stabilizer, and the content of the stabilizer is 1g/L~5g/L.
5. alkalescence solution glue according to claim 4, it is characterised in that：
The stabilizer is sodium acid carbonate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485683.8A CN107217244A (en) | 2017-06-23 | 2017-06-23 | Alkalescence solution glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710485683.8A CN107217244A (en) | 2017-06-23 | 2017-06-23 | Alkalescence solution glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107217244A true CN107217244A (en) | 2017-09-29 |
Family
ID=59950598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710485683.8A Pending CN107217244A (en) | 2017-06-23 | 2017-06-23 | Alkalescence solution glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107217244A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107904636A (en) * | 2017-11-24 | 2018-04-13 | 广东埃德伟控汽车部件有限公司 | A kind of acid double-colored material plating solution glue and preparation method thereof |
| CN112962126A (en) * | 2021-02-01 | 2021-06-15 | 宁波劳伦斯表面技术有限公司 | Alkaline double-color electroplating debonder and preparation process thereof |
| CN113815186A (en) * | 2021-08-31 | 2021-12-21 | 上海托新实业有限公司 | Double-color electroplating processing method for automotive interior parts |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508289A (en) * | 2002-12-17 | 2004-06-30 | 余章军 | Photo permeable character electroplated button preparing process |
| CN103556135A (en) * | 2013-11-07 | 2014-02-05 | 杭州东方表面技术有限公司 | Peptization solution for metalizing modification of plastic surface |
| CN104674314A (en) * | 2015-01-15 | 2015-06-03 | 温兵 | Cyanide-free and nickel-free electroplating method for copper-tin alloy |
-
2017
- 2017-06-23 CN CN201710485683.8A patent/CN107217244A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1508289A (en) * | 2002-12-17 | 2004-06-30 | 余章军 | Photo permeable character electroplated button preparing process |
| CN103556135A (en) * | 2013-11-07 | 2014-02-05 | 杭州东方表面技术有限公司 | Peptization solution for metalizing modification of plastic surface |
| CN104674314A (en) * | 2015-01-15 | 2015-06-03 | 温兵 | Cyanide-free and nickel-free electroplating method for copper-tin alloy |
Non-Patent Citations (2)
| Title |
|---|
| 刘仁志编: "《整机电镀》", 31 May 2008 * |
| 张允诚等: "《电镀手册》", 31 December 2011 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107904636A (en) * | 2017-11-24 | 2018-04-13 | 广东埃德伟控汽车部件有限公司 | A kind of acid double-colored material plating solution glue and preparation method thereof |
| CN112962126A (en) * | 2021-02-01 | 2021-06-15 | 宁波劳伦斯表面技术有限公司 | Alkaline double-color electroplating debonder and preparation process thereof |
| CN113815186A (en) * | 2021-08-31 | 2021-12-21 | 上海托新实业有限公司 | Double-color electroplating processing method for automotive interior parts |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170929 |
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| RJ01 | Rejection of invention patent application after publication |