CN106910626A - A kind of double concave high voltage ceramic capacitor and manufacturing process - Google Patents
A kind of double concave high voltage ceramic capacitor and manufacturing process Download PDFInfo
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- CN106910626A CN106910626A CN201511004057.XA CN201511004057A CN106910626A CN 106910626 A CN106910626 A CN 106910626A CN 201511004057 A CN201511004057 A CN 201511004057A CN 106910626 A CN106910626 A CN 106910626A
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- electrode
- ceramic dielectric
- dielectric matrix
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- double concave
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The present invention relates to a kind of double concave high voltage ceramic capacitor and its manufacturing process, the ceramic dielectric base shape of the capacitor is that the double concave formed after two truncated cone-shaped vacancies is manufactured on cylinder, i.e. ceramic matrix edge thickness is more than center, the transition face that section is camber line is provided between ceramic matrix centre disc and shape such as the concave slope of frustum cone side, ceramic matrix is provided with electrode, three layers of electrode point, top layer is signal bronze, welding lead on electrode, matrix, electrode and part lead are wrapped up by epoxy resin.The capacitor preparation process includes ceramic matrix making, electric polarization, welding lead, application and printing, test.The electrode for capacitors is prepared by magnetron sputtering method, can free coordination electrode size.By the design of transition face in matrix spill, eletrode tip electric discharge risk can be reduced, further the lifting resistance to voltage levels of capacitor, realize miniaturization, by the design of signal bronze layer, be capable of achieving still solderable during electrode partial oxidation.
Description
Technical field
The present invention relates to ceramic capacitor field, especially a kind of dielectric is in the adjustable high voltage ceramic capacitor of concave concave electrode size and manufacture work
Skill.
Background technology
Ceramic capacitor is widely used in the equipment such as power supply, household electrical appliances, automobile as basic passive element, plays filtering, vibration, coupling.
Traditional ceramic capacitor is discrete component, and based on cylinder, its moulding process is simple, raw cook even density after shaping, is easy to dress alms bowl to burn for shape
Tie, be easy to printed electrode, be easy to welding lead, be easy to large-scale production.The miniaturization trend of Current electronic element is obvious, patent
CN202268250U discloses a kind of high-voltage ceramic condenser medium structure, and its dielectric is in double concave, in the upper and lower disc of dielectric in cylinder
The symmetrical truncated cone-shaped vacancy that produces is formed, and is punctured because circular plate type high voltage ceramic capacitor breakdown mode is commonly electrode edge, i.e., applied voltage when,
Circular plate type high voltage ceramic capacitor electrode edge field intensity is higher than other regions, is preferentially punctured, and the thickness for reducing plectane ceramic capacitor central area will not
Product voltage endurance capability is impacted, while dielectric thickness is thinning, product capacity is also increased, on the premise of former capacity is kept, contracting can be continued
The diameter of the board-like ceramic condenser of roundlet, reduces dielectric and wastes.Because traditional ceramics capacitor prepares electrode using the technique sintered after printing electroconductive glue materials,
During patent CN202268250U dielectric structures printing electrocondution slurry, because of ceramic matrix depth difference, cause scraper dynamics different, electrocondution slurry meeting
Alluvial causes thickness of electrode uneven in spill, and electrocondution slurry is wasted.Patent CN104167290A proposes a kind of spill higfh-tension ceramics electric capacity
Device, its dielectric structure is similarly spill, is formed in the symmetrical cylindrical vacancy that produces of the upper and lower disc of dielectric in cylinder, its electric polarization technique
The technique deposited using overall chemical, after copper layer on whole ceramic substrate, the layers of copper of ceramic substrate cylindrical outer side surface is ground off, and forms electrode,
Its electrode layers thickness is uniform, has the disadvantage that electrode is completely covered substrate disc, electrode size cannot be adjusted, i.e., capacitance cannot be adjusted, in addition edging
The process easily substrate unfilled corner caused by mechanical external force, artificially causes defective workmanship.
The content of the invention
It is an object of the invention to provide a kind of double concave high voltage ceramic capacitor, by design and the improvement of manufacturing process to capacitor arrangement,
On the premise of ensureing that product technology performance is constant, small product size can be reduced, realize miniaturization, and reduce product voltage breakdown risk, be capable of achieving product
Electrode size unrestricted choice, the free degree of lifting product design, at the same reducing energy consumption, and improve product solderability, it is easy to mass production.
In order to realize the purpose of foregoing invention, the present invention is realized using following technical scheme：
A kind of double concave high voltage ceramic capacitor, includes scolding tin, lead, Resin Wrappage, electrode layer and ceramic dielectric matrix, described ceramics
Dielectric matrix is the centrosymmetric cylinder that upper bottom surface respectively has a truncated cone-shaped vacancy, the axle of vacancy round platform and the overlapping of axles of ceramic dielectric matrix, circle
Platform disc area is less than bottom cylindrical face area, and it is camber line that the inclined-plane of vacancy frustum cone side has one section of section with round platform compared with the intersection of small area disc
There is a shape such as between the disc and bottom surface outer ring annulus of bottom center position than thin edge in transition face, the i.e. thickness of ceramic dielectric matrix core
The inclined-plane of frustum cone side, there is one section of section between inclined-plane and ceramic dielectric matrix bottom center disc is the transition face of camber line, is set on ceramic dielectric matrix
There is electrode, welding lead on electrode, Resin Wrappage parcel electrode, ceramic dielectric matrix and part lead.
Further, the electrode is three layers, and bottom is the nichrome that nickel or NI-G content respectively account for 50%, and middle level is copper, and top layer is signal bronze.
Further, the electrode top layer signal bronze area is less than or equal to electrode copper layer area.
Further, in the electrode top layer signal bronze, Theil indices are 30%-99%.
The preparation process of the capacitor includes that prepared by double concave high voltage ceramic capacitor ceramic dielectric matrix, ceramic dielectric base electrode, lead
Welding, the coating of resin-encapsulate material, mark printing, test, the specific embodiment of its manufacture are as follows：
1) double concave high voltage ceramic capacitor ceramics porcelain powder punch forming, formation possesses the double concave raw cook of some strength.
2) raw cook forms the ceramic dielectric matrix of double concave high voltage ceramic capacitor through tunnel kiln sintering into porcelain.
3) ceramic dielectric matrix wind bath cleaning.
4) ceramic dielectric matrix surface mask film covering plate.
5) using vacuum sputtering methods and coordinate corresponding mask plate, sputter electrode under-layer, middle level, top layer in ceramic dielectric matrix surface successively.
6) weld connects lead on electrode.
7) coated with resins encapsulating material, parcel ceramic dielectric matrix, electrode and part lead.
8) mark is printed on resin, every test is carried out to product by national standard.
Compared with prior art, the beneficial effects of the invention are as follows：
The transition face that section is camber line is increased between the inclined-plane of ceramic dielectric matrix bottom surface disc and medial surface, makes the sideways transition in bottom surface more flat
It is sliding, reduce the risk of point discharge, it is ensured that when Leaded Ceramic Disc Capacitor proof voltage punctures, breakdown point is not present in porcelain Jie's intrinsic silicon disc edge.Ceramic electrical
When dragging making alive on container, the like charges of electrode surface are mutually exclusive, are intended between electric charge away from each other, and in the plane, electrode edge is subject to it
The coefficient larger repulsion in his region, to reach stress balance, the electric charge spacing of electrode edge is smaller compared to the electric charge spacing of central area, makes
It is bigger into electrode edge charge density, the bigger result of field intensity, when puncturing so as to the condenser voltage for causing conventional planar electrode, breakdown point is located at electricity
Pole edge, i.e. edge effect；It is mutually exclusive between like charges under three-dimensional situation, cause the sophisticated position charge density of powered surfaces big, electricity
Field intensity is big, it is easy to discharge, i.e. point discharge.The present invention because using concave structure, except electrode edge exist edge effect in addition to, in ceramic dielectric
Between the bottom surface of matrix and the inclined-plane of medial surface, a tip is also constituted, when point effect is better than edge effect, condenser voltage breakdown point is by position
In the edge of ceramic dielectric matrix concave inside disc, and dielectric thickness is thinning herein, it is impossible to ensure that capacitor breakdown voltage meets national mark
Alignment request.Use and use section to can remove tip for the transition face of circular arc at sharp place, form smooth transition face, greatly reduce point discharge
Risk, lifts the security of capacitor.The design of transition face can further reduce the risk of spill capacitor concave inside disc edge breakdown, can enter
One step increases spill depth, while reducing ceramic dielectric base diameter accordingly, further realizes miniaturization.Small size ceramic capacitor is compared to substantially
Product ceramic condenser, is molded, burns till etc. that the internal diversity that technical process causes is smaller, and potential process failure point is few, and proof voltage is better than same specification substantially
Product ceramic capacitor.Additionally, when double concave high voltage ceramic capacitor raw cook is molded, because frictional force reason cannot be realized flowing completely between powder, will lead
The density that cause mould contacts the disc lower zone of the i.e. thinner thickness in position of powder at first is larger, and raw cook external den is less than central area, while interior
There is the trend for pushing powder laterally on side inclined-plane, and it be the transition face of camber line to use section, can make disc inside raw cook to medial slope transition more
It is smooth, be unlikely to Steep Density increasing occur, because raw cook it is compressing after, when press pressure is cancelled, raw cook will appear from certain bounce-back expansion, use
Crossing the design in face can reduce when batch is made because of the potential cracking risk of density variation.
The present invention uses the magnetron sputtering method for improving operation that electrode is prepared for ceramic dielectric matrix, and magnetron sputtering belongs to more universal electric polarization technology, passes through
Lotus energy particle bombardment target, makes target splatter to ceramic dielectric matrix surface form electrode, is covered by mask plate, can unrestricted choice ceramics Jie
The electric exposed position of matrix, size.Thickness of electrode prepared by magnetically controlled sputter method is uniform and the adjustment of electrode can be realized by the selection of mask panel aperture.
The porcelain body that edging is likely to result in after sputtering mode can avoid full electrode plating is damaged, and increased reliability of technology.Magnetically controlled sputter method needs ceramics
Substrate cleaning, general to be reached by the way of being dried after pure water cleaning, it is to be capable of achieving cleaning that the present invention drenches mode using wind, and ceramic dielectric matrix is in
Spill, ceramic dielectric matrix movement during blowing, at air curtain edge, the wind being blown into from concave edge can be blown out through spill rear steering by other edge,
The situation that be pressed in for dust on substrate by high wind at the top of being not in, compared to cylindrical ceramic matrix, preferably, the present invention is logical for the cleaning effect of top blowing
The mode that multidirectional continual strong wind and dust are collected is crossed, is capable of achieving after ceramic dielectric matrix is sintered to remain the cleaning of the surface powders such as insulating powder, directly
Sputtering electrode back pull is qualified, without by the way of cleaning, drying, technical process is succinct, reducing energy consumption.
Magnetron sputtering method prepares electrode typically using duallayered electrode structure, and electrode outer layer metal plays conductive and welding, and internal layer is transition metal,
Play conductive and connection porcelain body with outer layer metal, guarantee pulling force, the ceramic dielectric matrix of usual sputtering electrode can quickly enter subsequent technique, weld
Connect, dispatch from the factory after application encapsulating material, but capacitance present device specialization is refined, and most of enterprise is absorbed in a part for technique, and such as Some Enterprises make
Complete electropolarized ceramic dielectric matrix to dispatch from the factory, the links such as welding, encapsulating, test, therefore electropolarized ceramic dielectric base are completed by follow-up producer
Body may not be used rapidly, and the problem for easily occurring electrode surface oxidation in storing process, current electrode outer layer splash-proofing sputtering metal is mainly copper, once
There is oxidation, electrode will be unable to welding lead, and be difficult to subsequent treatment, the present invention sets up one layer of copper and tin and closes by three layers of electrode structure, in outermost layer
Gold, by adjusting its stanniferous ratio, makes electrode top layer composition be approached with scolding tin, and at normal temperatures, tin does not react signal bronze with the oxygen in air, its
Oxide is mainly cupric oxide, can still be realized outer in the case where partial oxidation occurs in outer electrode, i.e., in the case that oxidation occurs in outer section copper
Tin in layer electrode is welded with scolding tin, the invention can ensure that the solderability of lead, so as to extend electropolarized ceramic dielectric matrix storage time, easily
In a kind of popularization of double concave high voltage ceramic capacitor of the invention.
Brief description of the drawings
Fig. 1 is a kind of positive structure diagram of double concave high voltage ceramic capacitor of the invention.
Fig. 2 is a kind of side structure schematic view of double concave high voltage ceramic capacitor of the invention.
Fig. 3 is a kind of porcelain dielectric matrix side structure schematic view of double concave high voltage ceramic capacitor of the invention.
Fig. 4 is a kind of electropolarized ceramic dielectric base electrode structural representation of double concave high voltage ceramic capacitor of the invention.
Specific embodiment
Specific embodiment of the invention is further illustrated below in conjunction with the accompanying drawings：
Unless otherwise instructed, the percentage composition in this specification refers both to weight/mass percentage composition.
Embodiment 1, referring to shown in accompanying drawing 1,2,3,4, a kind of double concave high voltage ceramic capacitor of the present invention, it include scolding tin 001,
Lead 002, Resin Wrappage 003, electrode layer 004 and ceramic dielectric matrix 005, described ceramic dielectric matrix 005 respectively have for upper bottom surface
The centrosymmetric cylinder of one truncated cone-shaped vacancy, the axle of vacancy round platform and the overlapping of axles of ceramic dielectric matrix 005, round platform disc area are less than cylinder
Base area, it is the transition face 502 of camber line that the inclined-plane 501 of vacancy frustum cone side has one section of section with round platform compared with the intersection of small area disc, i.e.,
There is a shape between the disc 503 and bottom surface outer ring annulus 504 of bottom center position than thin edge in the thickness of the core of ceramic dielectric matrix 005
Such as the inclined-plane 501 of frustum cone side, there is one section of section between inclined-plane 501 and the bottom center's disc 503 of ceramic dielectric matrix 005 is the transition face of camber line
502, ceramic dielectric matrix 005 is provided with electrode 004, welding lead 002 on electrode 004.The parcel of Resin Wrappage 003 electrode 004, pottery
Porcelain dielectric matrix 005 and part lead 002.004 point of electrode is three layers, and bottom is the nickel-chrome alloy layer 401 that nickel chromium content respectively accounts for 50%, middle level
It is layers of copper 402, top layer is signal bronze layer 403,403 area of signal bronze layer are equal to the area of layers of copper 402, signal bronze layer 403 in electrode 004
Middle Theil indices are 99%.
The preparation process of above-mentioned capacitor include the manufacture of ceramic dielectric matrix, ceramic dielectric base electrode, welding lead, resin-encapsulate material coat,
Mark printing, test.Concrete technology step is as follows：
1) raw cook is compressing：Electronic ceramic powder is fitted into mould corresponding with shape of product, punch forming, forms middle thin edges thickness
Ceramic dielectric matrix raw cook.
2) sinter：Ceramic dielectric matrix raw cook enters tunnel kiln sintering after filling alms bowl, forms the ceramic dielectric matrix of double concave high voltage ceramic capacitor.
3) wind bath：Ceramic dielectric matrix is cleaned through multidirectional high wind, the powder such as the insulating powder on ceramic dielectric matrix will be remained in after sintering and is removed.
4) mask：According to electrode shape, the size of design, corresponding mask plate is chosen, by ceramic dielectric matrix parcel, expose region to be sputtered.
5) sputtering electrode：Using magnetically controlled sputter method and coordinate corresponding mask plate, successively ceramic dielectric matrix surface sputter electrode under-layer, in
Layer, top layer.
6) lead welding：External lead wire is welded on electrode.
7) coated with resins encapsulating material：Ceramic dielectric matrix after welding lead completes epoxy resin application by paint line, and epoxy resin is through drying
Ceramic dielectric matrix, electrode and part lead are wrapped up after roasting solidification.
8) print and test：Mark is printed on epoxy resin, and every test is carried out to the capacitor after printing by national standard, it is qualified after go out
Factory.
The present invention and prior art size comparison：
The present invention and the contrast of prior art proof voltage：
All technical of the present invention meets GB GB/T 2693-2001《Electronic equipment fixed capacity device Part I generic specification》And GB/T
14472-1998《The part suppression electromagnetic interference of electronic equipment fixed capacity device the 14th porcelain Jie's fixed capacity device》Standard requirement.
Better embodiment of the invention is the foregoing is only, protection scope of the present invention is not limited with above-mentioned implementation method.
Claims (5)
1. a kind of double concave high voltage ceramic capacitor, it is characterised in that include scolding tin, lead, Resin Wrappage, electrode layer and ceramic dielectric matrix,
Described ceramic dielectric matrix is the centrosymmetric cylinder that upper bottom surface respectively has a truncated cone-shaped vacancy, axle and the ceramic dielectric base of vacancy round platform
The overlapping of axles of body, round platform disc area is less than bottom cylindrical face area, and inclined-plane and the round platform of vacancy frustum cone side are deposited compared with the intersection of small area disc
It is the transition face of camber line in one section of section, i.e., the thickness of ceramic dielectric matrix core is than thin edge, the disc of bottom center position and bottom surface
There is one section of section in the presence of the inclined-plane of a shape such as frustum cone side between the annulus of outer ring, between inclined-plane and ceramic dielectric matrix bottom center disc is camber line
Transition face, ceramic dielectric matrix is provided with electrode, welding lead on electrode, Resin Wrappage parcel electrode, ceramic dielectric matrix and part
Lead.
2. a kind of double concave high voltage ceramic capacitor according to claim 1, it is characterised in that described electrode is three layers, bottom is nickel or nickel
Cadmium content respectively accounts for 50% nichrome, and middle level is copper, and top layer is signal bronze.
3. a kind of double concave high voltage ceramic capacitor according to claim 2, it is characterised in that described electrode top layer signal bronze area is less than
Equal to electrode copper layer area.
4. a kind of double concave high voltage ceramic capacitor according to claim 2, it is characterised in that in described electrode top layer signal bronze, tin contains
It is 30%-99% to measure.
5. the manufacturing process of a kind of double concave high voltage ceramic capacitor according to claim 1, it is characterised in that including double concave higfh-tension ceramics electricity
Prepared by container ceramic dielectric matrix, ceramic dielectric base electrode, lead welding, the coating of resin-encapsulate material, mark printing, test, specifically
Technical process is as follows：
1) double concave high voltage ceramic capacitor ceramics porcelain powder punch forming, formation possesses the double concave raw cook of some strength.
2) raw cook forms the ceramic dielectric matrix of double concave high voltage ceramic capacitor through tunnel kiln sintering into porcelain.
3) ceramic dielectric matrix wind bath cleaning.
4) ceramic dielectric matrix surface mask film covering plate.
5) using vacuum sputtering methods and coordinate corresponding mask plate, sputter electrode under-layer, middle level, top layer in ceramic dielectric matrix surface successively.
6) external lead wire is welded on electrode.
7) coated with resins encapsulating material, parcel ceramic dielectric matrix, electrode and part lead.
8) mark is printed on resin, every test is carried out to product by national standard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201511004057.XA CN106910626A (en) | 2015-12-18 | 2015-12-18 | A kind of double concave high voltage ceramic capacitor and manufacturing process |
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| CN201511004057.XA CN106910626A (en) | 2015-12-18 | 2015-12-18 | A kind of double concave high voltage ceramic capacitor and manufacturing process |
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| CN106910626A true CN106910626A (en) | 2017-06-30 |
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| CN201511004057.XA Pending CN106910626A (en) | 2015-12-18 | 2015-12-18 | A kind of double concave high voltage ceramic capacitor and manufacturing process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111048311A (en) * | 2018-10-12 | 2020-04-21 | 太阳诱电株式会社 | Ceramic electronic component, method for producing same, and ceramic electronic component-mounted circuit board |
| CN113725002A (en) * | 2021-09-02 | 2021-11-30 | 江门市东有科技有限公司 | Single-layer capacitor and preparation method thereof |
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| CN111048311A (en) * | 2018-10-12 | 2020-04-21 | 太阳诱电株式会社 | Ceramic electronic component, method for producing same, and ceramic electronic component-mounted circuit board |
| CN113725002A (en) * | 2021-09-02 | 2021-11-30 | 江门市东有科技有限公司 | Single-layer capacitor and preparation method thereof |
| CN113725002B (en) * | 2021-09-02 | 2023-03-14 | 江门市东有科技有限公司 | Single-layer capacitor and preparation method thereof |
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