CN105355348A - Electronic component multi-layer composite metal electrode and making process thereof - Google Patents
Electronic component multi-layer composite metal electrode and making process thereof Download PDFInfo
- Publication number
- CN105355348A CN105355348A CN201510852675.3A CN201510852675A CN105355348A CN 105355348 A CN105355348 A CN 105355348A CN 201510852675 A CN201510852675 A CN 201510852675A CN 105355348 A CN105355348 A CN 105355348A
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- metal electrode
- layer
- electrode layer
- clad metal
- composite metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
The invention relates to an electronic component multi-layer composite metal electrode and a making process thereof. The electronic component multi-layer composite metal electrode comprises a first composite metal electrode layer and a second composite metal electrode layer, wherein the first composite metal electrode layer is made by the adoption of an aluminum paste silk-screen printing process and serves as a ceramic and electrode combination layer and an electricity and heat conduction layer; the second composite metal electrode layer is made of Cu metal wires through a thermal spraying process or a multi-layer composite electrode with a Cu or Ag surface layer through a magnetron sputtering process. On the premise of guaranteeing electrical properties of the product, by the adoption of the process of using the composite metal electrode for replacing an Ag electrode, the ability of an electronic component in resisting the impact of a large surge current or multiple large surge currents is improved; the Cu or Ag composite electrode layer is used as a weldable layer to enhance the anti-corrosion performance of the electronic component to soldering tin, so cheap soldering tin with low Ag or without Ag can be used, and electrode manufacture cost is lowered.
Description
Technical field
The present invention relates to electronic building brick field, especially a kind of electronic devices and components multilayer composite metal electrode and preparation technology thereof.
Background technology
Piezo-resistance mixes a small amount of electron level Bi by electron level ZnO powder base-material
2o
3, Co
2o
3, MnO
2, Sb
2o
3, TiO
2, Cr
2o
3, Ni
2o
3etc. multiple additives, through the fine electronic pottery that the technical processs such as mixing, shaping, sintering are made; It has the characteristic of resistance value to the change of applied voltage sensitivity, is mainly used in various transient overvoltages, the absorption surge energy that may occur in perception, limiting circuit.
In order to reduce the manufacturing cost of piezo-resistance, promote piezo-resistance manufacturing process level, in electrode manufacturing process, drop into more human, financial, and material resources at present always carry out technological innovation, achieve a series of innovation achievement, relevant passing achievement is listed below:
1. application number is 201110140236.1, and denomination of invention is " copper-electrode zinc-oxide voltage-sensitive resistor and preparation method thereof ", under disclosing oxygen-free atmosphere, adopts tunnel chain-conveyer furnace, the technique of burning infiltration electrodes in base metal;
2. application number is 2015101584847, denomination of invention is " electronic devices and components multilayer alloy electrode and preparation method thereof ", disclose a kind of preparation method adopting two-layer compound electrode fabrication electronic devices and components electrode, wherein ground floor adopts the slurrying of base metal powder, typography applies, and the second layer adopts hot-spraying technique direct spraying Cu alloy material.
Summary of the invention
The technical problem to be solved in the present invention is: propose a kind of electronic devices and components multilayer composite metal electrode and preparation technology thereof, substitutes conventional silver slurry typography, solves electronic devices and components electrode Cost Problems.
The technical solution adopted in the present invention is: a kind of electronic devices and components multilayer composite metal electrode, comprises the first clad metal electrode layer and the second clad metal electrode layer, and the first described clad metal electrode layer covers ceramic matrix surface; First clad metal electrode layer adopts aluminium paste to be made by silk screen printing; The second described clad metal electrode layer is covered on the first clad metal electrode layer; Described second clad metal electrode layer adopts fine copper to be covered on the first clad metal electrode layer by hot-spraying technique or the second clad metal electrode layer to adopt magnetron sputtering technique to make Cu or Ag be that the multi-layer composite electrode on top layer is covered on the first clad metal electrode layer.
Further, what the multi-layer composite electrode that the second clad metal electrode layer of the present invention adopts magnetron sputtering technique to make comprised top layer can the articulamentum of layer and bottom; Described can layer be Cu or Ag layer; Described articulamentum is the composite bed that in Ni, Cr, Cu, Zn, V, at least two kinds of metals are formed.
Further say, when the second clad metal electrode layer of the present invention adopts fine copper to make, the fine copper of plated surface matcoveredn (as Sn) also can be used to make.
Meanwhile, present invention also offers a kind of preparation technology, comprise preparation first clad metal electrode layer and preparation the second clad metal electrode layer; The second described clad metal electrode layer is covered on the first clad metal electrode layer;
The preparation method of the first described clad metal electrode layer comprises the following steps:
1) clean is carried out to ceramic matrix surface;
2) aluminium paste is adopted to be covered in ceramic matrix surface by screen printing mode;
3) put into sintering furnace and carry out burning infiltration, according to glass dust softening point situation, complete the preparation of the first clad metal electrode layer;
The preparation method of the second described clad metal electrode layer comprises the following steps:
A), hot-spraying technique is adopted: embed in thermal spraying tool by burning attached the first good complex metal layer electrode layer; Adopt Cu wire as thermal spraying silk, spray parameters coating thickness on the first complex metal layer electrode layer of setting employing electric arc or flame heat spray is the second layer clad metal electrode layer of more than 20 μm;
Or,
B), magnetron sputtering technique is adopted:
I) target that the alloy using at least two kinds of metals in Ni, Cr, Cu, Zn, V metal to form makes, the first complex metal layer electrode layer adopts magnetron sputtering technique to prepare articulamentum;
Ii) adopt Cu and magnetron sputtering technique preparation can layer on articulamentum surface; The thickness of the second clad metal electrode layer is 0.3 ~ 4 μm.
Described steps A) in, Cu wire can use pure Cu wire also can use the Cu wire of electroplating surfaces with tin.
Electrode shape, according to ceramic component shape, is not limited to any shape of electrode; Electronic building brick shape can be square, circular, ellipse etc.; Electronic devices and components are pressure-sensitive, air-sensitive, PTC temperature-sensitive, NTC temperature-sensitive, piezoelectric ceramic, the electronic building bricks such as ceramic condenser.
The invention has the beneficial effects as follows: compared with traditional Ag electrode process, mainly by increasing electrode film layer thickness, electrodes conduct, heat conductivility can be changed, thus the ability of electronic devices and components withstand large surge current or repeatedly large inrush current shock can be promoted; By being used as with Cu or Ag composite electrode layers to strengthen the anti-corrode characteristic of electronic component to scolding tin by layer, thus low-cost low Ag can be used or without Ag scolding tin; Under guarantee product electrical property prerequisite, substitute Ag electrode process by using clad metal electrode thus reduce electrode fabrication cost.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is structural representation of the present invention;
Fig. 2 is technique general flow chart of the present invention;
In figure: 1, ceramic matrix; 21, the first clad metal electrode layer; 22, the second clad metal electrode; 3, pin; 4, insulating barrier.
Embodiment
The present invention is further detailed explanation with preferred embodiment by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present invention are described in a schematic way, and therefore it only shows the formation relevant with the present invention.
A kind of electronic devices and components as shown in Figure 1, for piezo-resistance, technological process as shown in Figure 2, contains batching, mist projection granulating, dry-pressing formed, Low fire ceramic, ceramic surface silk screen printing, second layer clad metal electrode makes, welding, insulating material encapsulating, solidification.
Following examples adopt diameter 14mm, thickness 1.8mm, model be 14471 piezo-resistance be example.
Embodiment:
Ground floor clad metal electrode layer making step:
1) clean is carried out to ceramic matrix surface;
2) aluminium paste is used to be covered on ceramic matrix 1 by screen printing mode by above-mentioned conducting resinl;
3) chip being completed for printing electrode is put into sintering furnace and carry out burning infiltration, according to glass dust softening point situation, general burning infiltration temperature is selected between 500 ~ 750 DEG C, thus completes the first clad metal electrode layer 21 and prepare.
Second layer alloy electrode layers making step:
1. hot-spraying technique
The substrate burning attached first complex metal layer electrode is embedded in thermal spraying tool;
Adopt Cu wire or zinc-plated Cu wire as thermal spraying silk, the spray parameters of setting electric-arc thermal spray coating, require that coating thickness is the second layer clad metal electrode layer of more than 20 μm according to product specification.
2. magnetron sputtering technique
Adopt the substrate having burnt attached good the first metal layer material, the target that the alloy using at least two kinds of metals in Ni, Cr, Cu, Zn, V metal to form makes, the first complex metal layer electrode layer adopts magnetron sputtering technique to prepare articulamentum; Adopt Cu or Ag can layer by magnetron sputtering technique preparation on articulamentum surface; According to the second clad metal electrode layer 22 that specification requirement making thickness is between 0.3 ~ 4 μm.
Welded with pin 3 by second clad metal electrode, welding product are encapsulated through the epoxy resin/insulating barrier such as organic siliconresin or phenolic aldehyde 4 material, detecting electric characteristic.
As following table, from electrode material characteristic aspect, more traditional Ag electrode is the difference of Combined electrode in electrode heat conduction, conductive effect therewith;
As following table, the every main performance difference of product of more traditional print silver electrode technique case embodiment technique making is therewith as following table:
Can reach a conclusion from embodiment contrast table, compared with traditional printing silver electrode structure, this new technology adopts cheap Cu, Al to be the product that main clad metal electrode makes, main electrical property can remain unchanged, and there is more excellent high current impulse withstanding capability, composite wave ability can reach more than 2 times of traditional Ag electrode.
The just the specific embodiment of the present invention described in above specification, various illustrating is not construed as limiting flesh and blood of the present invention, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from the spirit and scope of the invention.
Claims (5)
1. an electronic devices and components multilayer composite metal electrode, comprises the first clad metal electrode layer and the second clad metal electrode layer, it is characterized in that: the first described clad metal electrode layer covers ceramic matrix surface; First clad metal electrode layer adopts aluminium paste to be made by silk screen printing; The second described clad metal electrode layer is covered on the first clad metal electrode layer; Described second clad metal electrode layer adopts fine copper to be covered on the first clad metal electrode layer by hot-spraying technique or the second clad metal electrode layer to adopt magnetron sputtering technique to make Cu or Ag be that the multi-layer composite electrode on top layer is covered on the first clad metal electrode layer.
2. electronic devices and components multilayer composite metal electrode as claimed in claim 1, is characterized in that: what the multi-layer composite electrode that the second described clad metal electrode layer adopts magnetron sputtering technique to make comprised top layer can the articulamentum of layer and bottom; Described can layer be Cu or Ag layer; Described articulamentum is the composite bed that in Ni, Cr, Cu, Zn, V, at least two kinds of metals are formed.
3. electronic devices and components multilayer composite metal electrode as claimed in claim 1, is characterized in that: the Cu wire adopting Cu wire or plated surface matcoveredn when the second described clad metal electrode layer is covered on the first clad metal electrode layer by hot-spraying technique.
4. an electronic devices and components multilayer composite metal technology for preparing electrode as claimed in claim 1, is characterized in that: comprise preparation first clad metal electrode layer and preparation the second clad metal electrode layer; The second described clad metal electrode layer is covered on the first clad metal electrode layer;
The preparation method of the first described clad metal electrode layer comprises the following steps:
1) clean is carried out to ceramic matrix surface;
2) aluminium paste is adopted to be covered in ceramic matrix surface by screen printing mode;
3) put into sintering furnace and carry out burning infiltration, according to glass dust softening point situation, complete the preparation of the first clad metal electrode layer;
The preparation method of the second described clad metal electrode layer comprises the following steps:
A), hot-spraying technique is adopted: embed in thermal spraying tool by burning attached the first good complex metal layer electrode layer; Adopt Cu wire as thermal spraying silk, spray parameters coating thickness on the first complex metal layer electrode layer of setting employing electric arc or flame heat spray is the second layer clad metal electrode layer of more than 20 μm;
Or,
B), magnetron sputtering technique is adopted:
I) target that the alloy using at least two kinds of metals in Ni, Cr, Cu, Zn, V metal to form makes, the first complex metal layer electrode layer adopts magnetron sputtering technique to prepare articulamentum;
Ii) Cu or Ag is adopted to make target on articulamentum surface, can layer by magnetron sputtering technique preparation; The thickness of the second clad metal electrode layer is 0.3 ~ 4 μm.
5. a preparation technology as claimed in claim 4, is characterized in that: described steps A) in, Cu wire is the Cu wire of pure Cu wire or plated surface matcoveredn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852675.3A CN105355348A (en) | 2015-11-30 | 2015-11-30 | Electronic component multi-layer composite metal electrode and making process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852675.3A CN105355348A (en) | 2015-11-30 | 2015-11-30 | Electronic component multi-layer composite metal electrode and making process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105355348A true CN105355348A (en) | 2016-02-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510852675.3A Pending CN105355348A (en) | 2015-11-30 | 2015-11-30 | Electronic component multi-layer composite metal electrode and making process thereof |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106782954A (en) * | 2017-02-13 | 2017-05-31 | 爱普科斯电子元器件(珠海保税区)有限公司 | A kind of preparation method and piezo-resistance of the piezo-resistance of resistance to big inrush current shock |
| CN108630363A (en) * | 2018-05-09 | 2018-10-09 | 山东鸿荣电子有限公司 | A kind of copper electrode voltage dependent resistor chip and electrode surface plating process |
| CN113871118A (en) * | 2017-05-16 | 2021-12-31 | 东莞令特电子有限公司 | Base metal electrode for metal oxide piezoresistor |
Citations (5)
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|---|---|---|---|---|
| CN1313616A (en) * | 2000-03-14 | 2001-09-19 | 株式会社村田制作所 | Ceramic electronic components with leading terminals |
| CN204257308U (en) * | 2014-11-03 | 2015-04-08 | 厦门万明电子有限公司 | A kind of zinc oxide varistor |
| CN104835606A (en) * | 2015-04-03 | 2015-08-12 | 兴勤（常州）电子有限公司 | Electronic component multilayer alloy electrode and production method thereof |
| CN205376228U (en) * | 2015-11-30 | 2016-07-06 | 兴勤（常州）电子有限公司 | Electronic components multilayer composite metal electrode |
| CN205428613U (en) * | 2015-11-30 | 2016-08-03 | 兴勤（常州）电子有限公司 | A multilayer composite metal electrode for electronic components |
-
2015
- 2015-11-30 CN CN201510852675.3A patent/CN105355348A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313616A (en) * | 2000-03-14 | 2001-09-19 | 株式会社村田制作所 | Ceramic electronic components with leading terminals |
| CN204257308U (en) * | 2014-11-03 | 2015-04-08 | 厦门万明电子有限公司 | A kind of zinc oxide varistor |
| CN104835606A (en) * | 2015-04-03 | 2015-08-12 | 兴勤（常州）电子有限公司 | Electronic component multilayer alloy electrode and production method thereof |
| CN205376228U (en) * | 2015-11-30 | 2016-07-06 | 兴勤（常州）电子有限公司 | Electronic components multilayer composite metal electrode |
| CN205428613U (en) * | 2015-11-30 | 2016-08-03 | 兴勤（常州）电子有限公司 | A multilayer composite metal electrode for electronic components |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106782954A (en) * | 2017-02-13 | 2017-05-31 | 爱普科斯电子元器件(珠海保税区)有限公司 | A kind of preparation method and piezo-resistance of the piezo-resistance of resistance to big inrush current shock |
| CN113871118A (en) * | 2017-05-16 | 2021-12-31 | 东莞令特电子有限公司 | Base metal electrode for metal oxide piezoresistor |
| CN108630363A (en) * | 2018-05-09 | 2018-10-09 | 山东鸿荣电子有限公司 | A kind of copper electrode voltage dependent resistor chip and electrode surface plating process |
| CN108630363B (en) * | 2018-05-09 | 2019-07-05 | 山东鸿荣电子有限公司 | A kind of copper electrode voltage dependent resistor chip and electrode surface plating process |
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Application publication date: 20160224 |
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