CN106876355A - Base plate for packaging ball grid array and the spherical grid array package body using the substrate - Google Patents
Base plate for packaging ball grid array and the spherical grid array package body using the substrate Download PDFInfo
- Publication number
- CN106876355A CN106876355A CN201710100186.1A CN201710100186A CN106876355A CN 106876355 A CN106876355 A CN 106876355A CN 201710100186 A CN201710100186 A CN 201710100186A CN 106876355 A CN106876355 A CN 106876355A
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- China
- Prior art keywords
- grid array
- base plate
- ball grid
- packaging ball
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of base plate for packaging ball grid array and the spherical grid array package body using the substrate.The base plate for packaging ball grid array includes：External connection pad array, chip bearing area, multiple pin connection gaskets, injecting glue region and mould stream conducting region.External connection pad array is located at the first surface of base plate for packaging ball grid array；Chip bearing area is located at the second surface of semiconductor substrate；Multiple pin connection gaskets are located at the second surface of base plate for packaging ball grid array；Injecting glue region is located at the second surface of base plate for packaging ball grid array；Mould stream conducting region is located at the second surface of base plate for packaging ball grid array.Base plate for packaging ball grid array and reduce gold-plated area using the spherical grid array package body of the substrate that the present invention is provided, have saved the cost of semiconductor package product.
Description
Technical field
The present embodiments relate to field of manufacturing semiconductor devices, more particularly to base plate for packaging ball grid array and making
With the spherical grid array package body of the substrate.
Background technology
BGA Package is a kind of surface patch encapsulation of IC chip.Ball grating array package device has because of it
Assembly yield is high, pin is firm, good electrical property, excellent in heat dissipation effect and the advantages of assemble hardware compatibility with existing SMT, and obtains
Obtain application widely.
Injecting glue packaging technology is an important step in ball grating array package device manufacturing process.Note of the prior art
Glue packaging technology is typically in the setting injecting glue region of the same side large area of multiple base plate for packaging ball grid array so that colloid can
The chip on base plate for packaging ball grid array is flow in each base plate for packaging ball grid array and covered from the injecting glue region.In injecting glue envelope
Dress technique complete after, in addition it is also necessary to will be present in base plate for packaging ball grid array side unnecessary colloid removal, and complete plant ball with
And the subsequent step such as pelletizing.However, because base plate for packaging ball grid array is usually green paint, and the associativity of green paint and injecting glue colloid
Again preferably, therefore during unnecessary colloid is removed from the side of base plate for packaging ball grid array, may be such that ball bar battle array
The green paint on row package substrate upper strata is peeled off and causes aqueous vapor to enter circuit, causes circuit to aoxidize.In this case, prior art is led to
Normal way is that layer of metal (such as gold or silver) is first plated on the injecting glue region of base plate for packaging ball grid array side, is then entered again
Row injecting glue packaging technology.Because metal is poor with the associativity of colloid, when needing unnecessary colloid from base plate for packaging ball grid array
During removal, unnecessary injecting glue colloid can be removed easily from base plate for packaging ball grid array.However, above-mentioned deposit in the prior art
Problem be：Due to having carried out the gold-plated of large area in the side of single base plate for packaging ball grid array, therefore to ball bar battle array
When row packaging body carries out large-scale mass production, the cost for producing spherical grid array package body significantly increases, and this is for current
The inexpensive target advocated in semiconductor packages scale of mass production is runed counter to.Additionally, above-mentioned in the prior art can only be from
Injecting glue encapsulation is carried out to base plate for packaging ball grid array on one direction, this also significantly reduces the flexibility of BGA Package.
Accordingly, it would be desirable to one kind can effectively reduce gold-plated area can make the variation of injecting glue mode to reduce packaging cost, again
Solution.
The content of the invention
An object of the present invention is to provide a base plate for packaging ball grid array and the BGA Package using the substrate
Body, it is improved injecting glue mode of the prior art.
An a kind of embodiment of the invention, base plate for packaging ball grid array has first surface and second surface；First
Surface is relative with second surface；Base plate for packaging ball grid array includes：External connection pad array, chip bearing area, multiple pins connect
Connection pad and injecting glue region.External connection pad array is located at the first surface of base plate for packaging ball grid array；Chip bearing area is located at
The second surface of semiconductor substrate；Multiple pin connection gaskets are located at the second surface of base plate for packaging ball grid array；Injecting glue region position
In the second surface of base plate for packaging ball grid array；The base plate for packaging ball grid array is characterised by：Base plate for packaging ball grid array is also
Including mould stream conducting region, mould stream conducting region is located at the second surface of base plate for packaging ball grid array.
According to another embodiment of the present invention, injecting glue region is arranged on an angle of base plate for packaging ball grid array；Mould stream
Conducting region is arranged on another angle with injecting glue region position in diagonal base plate for packaging ball grid array；Injecting glue region
Material used is identical with the material used by mould stream conducting region；Material used is gold or silver.
Embodiments of the invention also provide a spherical grid array package body to be included：Base plate for packaging ball grid array, chip, lead with
And packing colloid.Base plate for packaging ball grid array includes the external connection pad battle array of the first surface positioned at base plate for packaging ball grid array
Row, positioned at base plate for packaging ball grid array second surface chip bearing area；Positioned at the second surface of base plate for packaging ball grid array
Multiple pin connection gaskets and the second surface positioned at base plate for packaging ball grid array injecting glue region；Chip is arranged at chip and holds
Carry in area；With the respective pins of chip be connected multiple pin connection gaskets of base plate for packaging ball grid array by lead；Packing colloid sets
It is placed on the second surface of base plate for packaging ball grid array and covers chip；The spherical grid array package body is characterised by：Ball bar battle array
Row package substrate also include mould stream conducting region, its second surface for being located at base plate for packaging ball grid array and positioned at packing colloid it
Outward.
According to still another embodiment of the invention, injecting glue region is arranged on an angle of base plate for packaging ball grid array；Mould stream
Conducting region is arranged on another angle with injecting glue region position in diagonal base plate for packaging ball grid array；Injecting glue region
Material used is identical with the material used by mould stream conducting region；Material used is gold or silver.
Compared with prior art, base plate for packaging ball grid array provided in an embodiment of the present invention and the ball bar battle array using the substrate
Row packaging body changes the type of flow of injecting glue colloid, so as to reduce gold-plated area, saved semiconductor package product into
This.Meanwhile, it is improved after ball grid array base plate and using the substrate spherical grid array package body colloid injecting glue direction by original
The single fixed-direction for coming, is changed into two-way optional formula, makes injecting glue mode more diversified.
Brief description of the drawings
Fig. 1 is the structural representation comprising multiple base plate for packaging ball grid array
Fig. 2A is the top view of single base plate for packaging ball grid array according to an embodiment of the invention
Fig. 2 B are the side views of single base plate for packaging ball grid array according to an embodiment of the invention
Fig. 3 is the structural representation comprising multiple spherical grid array package bodies according to another embodiment of the present invention
Specific embodiment
Spirit for a better understanding of the present invention, makees furtherly below in conjunction with part preferred embodiment of the invention to it
It is bright.
Fig. 1 is the injecting glue schematic diagram of ball grid array base plate.As shown in figure 1, the BGA support plate 10 of double biserial
With 4 base plate for packaging ball grid array, respectively substrate 100, substrate 102, substrate 104 and substrate 106.Wherein, in substrate
100 left side is provided with gold-plated region 108 and the gold-plated region 108 and extends into the upper left position of substrate 100 and substrate 104.
When injecting glue packaging technology is carried out, colloid (not shown) injects from the gum-injecting port 110 of substrate 100, then along gold-plated region
108 flow to substrate 100 and substrate 104 respectively.The semiconductor core on substrate 100 and substrate 104 is completely covered in colloid
After piece, unnecessary colloid is separated from gold-plated region 108.The structure and glue injection method of substrate 102 and 106 and substrate 100 and
104 it is identical, will not be repeated here.Said structure exist problem be：Due to the whole left field in substrate 100 all
Metal has been plated, therefore when large-scale mass production is carried out to spherical grid array package body, its cost also significantly increases.This
Outward, for substrate 100 and 104, colloid can only flow into substrate 100 along the gum-injecting port 110 of substrate 100, then colloid edge
Gold-plated region and flow into substrate 104 along the gum-injecting port 112 of substrate 104.Therefore, the flow direction of colloid is also relatively more single in Fig. 1
One.
Fig. 2A is the top view of single base plate for packaging ball grid array according to an embodiment of the invention.Fig. 2 B are according to this hair
The side view of the single base plate for packaging ball grid array of a bright embodiment.
As shown in Figure 2 A and 2B, base plate for packaging ball grid array 20 has first surface 214 and second surface 216.First
Multiple external connection pad array 218 are provided with surface 214.Chip bearing area 220, multiple are provided with second surface 216
Pin connection gasket 221, injecting glue region 210 (that is, gold-plated region) and mould stream conducting region 222.In fig. 2, injecting glue region position
In the upper left corner of base plate for packaging ball grid array 20, it is completely overlapped with gold-plated region 210.Multiple pin connection gaskets 221 are located at ball
The second surface 216 of grid array package substrate 20, and multiple pin connection gasket 221 be used for to be hosted in chip bearing area 220
Chip (not shown) respective pins (not shown) be connected.Mould stream conducting region 222 is located at base plate for packaging ball grid array 20
At the lower right corner.Herein, in the embodiment of the present invention injecting glue region 210 (that is, gold-plated region) and the position of mould stream conducting region 222
It is not only limited in the upper left corner and the lower right corner, injecting glue region 210 (that is, gold-plated region) can also be set with mould stream conducting region 222
It is placed at the other positions of base plate for packaging ball grid array 20.For example, injecting glue region 210 (that is, gold-plated region) is arranged at into ball bar
The upper right corner of array package base plate 20, mould stream conducting region 222 is then arranged at the lower left corner of base plate for packaging ball grid array 20；Or
Injecting glue region 210 (that is, gold-plated region) is arranged at the left side of base plate for packaging ball grid array 20, mould stream conducting region 222 then sets
It is placed in the lower right corner of base plate for packaging ball grid array 20.
Additionally, the material used by mould stream conducting region 222 is identical with the material used by gold-plated region 210, and it is generally gold-plated
The material therefor of region 210 is gold or silver.
Fig. 3 is the structural representation comprising multiple spherical grid array package bodies according to another embodiment of the present invention.Wherein, often
One spherical grid array package body all contains the single BGA Package base according to disclosed in Fig. 2A and Fig. 2 B in the present invention
Plate.Show that 2x2 arranges spherical grid array package body structure in Fig. 3, it includes 4 spherical grid array package bodies 30,32,34 and 36.
Spherical grid array package body 32 and 36 is identical with the structure of spherical grid array package body 30 and 34.Here, with BGA Package
As a example by body 30 and 34.In figure 3, spherical grid array package body 30 includes base plate for packaging ball grid array 20, chip (not shown), lead
(not shown) and packing colloid 324.The upper left corner of base plate for packaging ball grid array 20 is provided with gold-plated region 310.BGA
Packaging body 34 includes base plate for packaging ball grid array 22, chip (not shown), lead (not shown) and packing colloid 324.Ball bar
The lower left corner of array package base plate 22 is provided with gold-plated region 320.Wherein, also there is mould between spherical grid array package body 30 and 34
Stream conducting region 322.The Part I 3221 of mould stream conducting region 322 is positioned at spherical grid array package body 30 and gold-plated region
At the relative lower right corner in 310 positions.The Part II 3222 of mould stream conducting region 322 is located at the plating with spherical grid array package body 34
At the relative upper right corner in the position of golden region 320.When injecting glue packaging technology is carried out, first packing colloid 324 is sealed from BGA
Introduced at the gold-plated region 310 in the upper left corner for filling substrate 20, the packing colloid 324 of introducing flows to ball bar along gold-plated region 310
Chip (not shown) on array package base plate 20 and by chip covering, subsequent packing colloid 324 is continued on, via ball bar
Second of the flow direction stream conducting region 322 of Part I 3221 of the mould stream conducting region 322 in the lower right corner of array package base plate 20
Divide 3222.Then, packing colloid 324 flows to the chip (not shown) on base plate for packaging ball grid array 22 and covers the chip.
Finally, packing colloid 324 flows out from the gold-plated region 320 in the lower left corner of spherical grid array package body 34.
It should be understood that above-mentioned 2x2 rows spherical grid array package body structure is only merely exemplary embodiment of the invention.Ability
Field technique personnel are appreciated that above-mentioned technical proposal of the invention can also be applied to other any amount of BGA Packages
Body structure, and its technical scheme is identical with the principle of above-mentioned 2x2 row's spherical grid array package body structures.For example, being arranged for 3x3
Spherical grid array package body structure, after packing colloid 324 flows out from the gold-plated region 320 in the lower left corner of base plate for packaging ball grid array 22,
Next base plate for packaging ball grid array can be flow to along gold-plated region 320.Additionally, the gold-plated region 310/ in the embodiment of the present invention
320 are also not limited solely to the upper left corner/lower left corner and the lower right corner/upper right corner, gold-plated area with the position of mould stream conducting region 3221/3222
Domain 310/320 may also set up at the other positions of spherical grid array package body structure with mould stream conducting region 3221/3222.
It will be understood that the flow direction of above-mentioned packing colloid 324 is also not limited to the side disclosed in above-mentioned Fig. 3
To.Due to the setting of mould stream conducting region, the flow direction of above-mentioned packing colloid 324 can also be flowed from opposite direction.That is,
Packing colloid 324 is introduced from gold-plated region 320, packing colloid 324 flows to base plate for packaging ball grid array 22 along gold-plated region 320
On chip (not shown) and by the chip covering, subsequent packing colloid 324 is continued on, via base plate for packaging ball grid array 22
The Part I 3221 of the flow direction stream conducting region 322 of Part II 3222 of the mould stream conducting region 322 in the upper right corner.Then, seal
Dress colloid 324 flows to the chip (not shown) on base plate for packaging ball grid array 20 and covers the chip.Finally, packing colloid
324 flow out from the gold-plated region 310 in the upper left corner of base plate for packaging ball grid array 20.Additionally, gold-plated region 310/320 leads to mould conductance
Region 3221/3222 is also not only confined on the angle of base plate for packaging ball grid array.According to gold-plated region 310/320 and mould stream
The adjustment of the set location of conducting region 3221/3222, the flow direction of packing colloid 324 can also change therewith.
It is of the invention with the prior art on base plate for packaging ball grid array compared with the technical scheme of the metal cladding of large area
By only setting gold-plated region and mould stream conducting region on base plate for packaging ball grid array in embodiment, greatly reduce gold-plated
Area, significantly reduces the cost of manufacture spherical grid array package body.In addition, the BGA base provided in the embodiment of the present invention
The injecting glue direction of plate is two-way optional formula so that injecting glue mode is more diversified.
Technology contents of the invention and technical characterstic have revealed that as above, but those of ordinary skill in the art still may base
Make a variety of replacements and modification without departing substantially from spirit of the present invention in teachings of the present invention and announcement.Therefore, protection model of the invention
Enclose the content that should be not limited to disclosed in embodiment, and should include various without departing substantially from replacement of the invention and modification, and be this patent
Application claims are covered.
Claims (10)
1. a kind of base plate for packaging ball grid array, it has first surface and second surface；The first surface and second table
Face is relative, wherein the base plate for packaging ball grid array includes：
External connection pad array, its first surface for being located at the base plate for packaging ball grid array；
Chip bearing area, its second surface for being located at the base plate for packaging ball grid array；
Multiple pin connection gaskets, its second surface for being located at the base plate for packaging ball grid array；And
Injecting glue region, its second surface for being located at the base plate for packaging ball grid array；
It is characterized in that：
The base plate for packaging ball grid array also includes mould stream conducting region, and the mould stream conducting region is sealed positioned at the BGA
Fill the second surface of substrate.
2. base plate for packaging ball grid array according to claim 1, it is characterised in that：The injecting glue region is arranged at the ball
On one angle of grid array package substrate.
3. base plate for packaging ball grid array according to claim 2, it is characterised in that：The mould stream conducting region be arranged at
Injecting glue region position is on another angle of the diagonal base plate for packaging ball grid array.
4. the base plate for packaging ball grid array according to any claim in claim 1-3, it is characterised in that：The injecting glue
Material used by region and the material used by the mould stream conducting region are gold or silver.
5. base plate for packaging ball grid array according to claim 4, it is characterised in that：Material used by the injecting glue region with
Material used by the mould stream conducting region is identical.
6. a kind of spherical grid array package body, it includes：
Base plate for packaging ball grid array, it has first surface and second surface；The first surface is relative with the second surface,
Wherein, the base plate for packaging ball grid array includes：
External connection pad array, its first surface for being located at the base plate for packaging ball grid array；
Chip bearing area, its second surface for being located at the base plate for packaging ball grid array；
Multiple pin connection gaskets, its second surface for being located at the base plate for packaging ball grid array；And
Injecting glue region, its second surface for being located at the base plate for packaging ball grid array；
Chip, it is arranged in the chip bearing area；
Lead, it is by the respective pins phase of the multiple pin connection gasket of the base plate for packaging ball grid array and the chip
Even；And
Packing colloid, it is arranged on the second surface of the base plate for packaging ball grid array and covers the chip；
It is characterized in that：
The base plate for packaging ball grid array also includes mould stream conducting region, and the mould stream conducting region is sealed positioned at the BGA
Fill the second surface of substrate and be located at outside the packing colloid.
7. spherical grid array package body according to claim 6, it is characterised in that：The injecting glue region is arranged at the ball bar
On one angle of array package base plate.
8. spherical grid array package body according to claim 7, it is characterised in that：The mould stream conducting region is arranged at and institute
Injecting glue region position is stated on another angle of the diagonal base plate for packaging ball grid array.
9. the spherical grid array package body according to any claim in claim 6-8, it is characterised in that：The injecting glue area
Material used by domain and the material used by the mould stream conducting region are gold or silver.
10. spherical grid array package body according to claim 9, it is characterised in that：Material used by the injecting glue region with
Material used by the mould stream conducting region is identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710100186.1A CN106876355A (en) | 2017-02-23 | 2017-02-23 | Base plate for packaging ball grid array and the spherical grid array package body using the substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710100186.1A CN106876355A (en) | 2017-02-23 | 2017-02-23 | Base plate for packaging ball grid array and the spherical grid array package body using the substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106876355A true CN106876355A (en) | 2017-06-20 |
Family
ID=59169321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710100186.1A Pending CN106876355A (en) | 2017-02-23 | 2017-02-23 | Base plate for packaging ball grid array and the spherical grid array package body using the substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106876355A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101577236A (en) * | 2009-06-08 | 2009-11-11 | 美新半导体（无锡）有限公司 | Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof |
| CN102054716A (en) * | 2010-10-26 | 2011-05-11 | 日月光封装测试(上海)有限公司 | Method and structure for molding leadframe strip |
| CN105799299A (en) * | 2014-12-29 | 2016-07-27 | 昆山国显光电有限公司 | Full bonding method |
| CN205564729U (en) * | 2016-02-23 | 2016-09-07 | 日月光封装测试(上海)有限公司 | Package substrate and integrated circuit package body |
-
2017
- 2017-02-23 CN CN201710100186.1A patent/CN106876355A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101577236A (en) * | 2009-06-08 | 2009-11-11 | 美新半导体（无锡）有限公司 | Epoxy resin encapsulating die of substrate flip-chip type electronic device and encapsulating method thereof |
| CN102054716A (en) * | 2010-10-26 | 2011-05-11 | 日月光封装测试(上海)有限公司 | Method and structure for molding leadframe strip |
| CN105799299A (en) * | 2014-12-29 | 2016-07-27 | 昆山国显光电有限公司 | Full bonding method |
| CN205564729U (en) * | 2016-02-23 | 2016-09-07 | 日月光封装测试(上海)有限公司 | Package substrate and integrated circuit package body |
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Application publication date: 20170620 |
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