CN106784261B - 一种分层型量子点led背光源的制作方法 - Google Patents
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Abstract
本发明公开了一种分层型量子点LED背光源的制作方法,首先制作荧光胶A,并将荧光胶A涂覆于LED透镜的表面,然后制备荧光胶B,并将荧光胶B涂覆于荧光胶A表面,最后在荧光胶B表面涂覆一层光固化胶水作为保护层,得到分层型的LED透镜,最后将LED透镜固定于LED灯条上,LED灯条发出的光与荧光胶A、荧光胶B发出的光复合得到白光。与传统背光源相比,量子点材料的半波宽较窄,极大提升了LED背光源的色域值,本发明所述的制作方法制得的LED背光源色域值可达NTSC 95%以上,且所述方法工艺简单、生产成本低廉。并且所述层状结构荧光胶解决了现有技术中直接将多种荧光材料混合相互反应破坏量子点荧光粉的结构、造成光衰的问题。
Description
技术领域
本发明属于LED背光源技术领域,涉及一种量子点LED背光源的制作方法,具体地说涉及一种分层型量子点LED背光源的制作方法。
背景技术
目前,大多数显示装置都是通过背光源结构照射液晶屏实现图像显示的,背光源的发光特性直接影响显示装置的显示画面质量。近些年随着全球能源危机和人们节能环保意识的逐步增强,大量节能环保材料走进了我们的生活。其中发光二极管(LED)由于具有能耗低、产热少、寿命长等优点正在逐渐取代传统的CCFL照明材料,成为新一代的背光源材料。特别是高色域的LED背光源使应用其的电视、手机、平板电脑等电子产品屏幕具有更加鲜艳的颜色,色彩还原度更高。
LED材料中,荧光粉发光材料已被广泛应用于LED照明和显示中,最常见的LED背光源采用蓝光芯片激发YAG黄光荧光粉的形式,因背光源中缺少红光成分,色域值只能达到NTSC 65%~72%。为了进一步提高色域值,技术人员普遍采用了蓝光芯片同时激发红光荧光粉、绿光荧光粉的方式,但由于现用荧光粉的半波宽较宽,故即使采用这种方式,也只能将背光源的色域值提升至NTSC 80%左右。同时,现有荧光粉的激发效率低,为实现高色域白光需要大量荧光粉,导致LED封装过程中荧光粉的浓度(荧光粉占封装胶水的比例)很高,从而极大地增加了封装作业的难度以及产品的不良率,同时荧光粉还存在光衰大、颗粒均匀度差、使用寿命短的问题。
为解决荧光粉的上述问题,近年来,量子点材料逐渐受到重视,特别是量子点荧光粉具有光谱随尺寸可调、发射峰半波宽窄、斯托克斯位移大、激发效率高等一系列独特的光学性能,受到LED背光行业的广泛关注。目前,量子点荧光粉实现高色域白光的方式主要有:(1)将量子点荧光粉制成光学膜材,填充于导光板或者贴于液晶屏幕内,通过蓝光或紫外光背光灯珠激发,获得白光;(2)将量子点荧光粉制成玻璃管,置于屏幕侧面,通过蓝光或紫外光背光灯珠激发,获得白光。但是,这两种实现方式的工艺复杂、光转化效率低、成本较高,很难实现大规模产业化,且现有技术得到的量子点LED背光源色域值较低。
发明内容
为此,本发明所要解决的技术问题在于现有量子点LED背光源生产工艺复杂、成本高、光转化效率和色域值低,从而提出一种易于生产、成本低廉、良率高、发光效果好的分层量子点LED背光源的制作方法。
为解决上述技术问题,本发明的技术方案为:
本发明提供一种分层型量子点LED背光源的制作方法,其包括如下步骤:
a、向发光材料A中加入光固化胶水并将二者混合均匀,得到荧光胶A,所述光固化胶水与所述发光材料A的质量比为1-300:1;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的内表面或外表面,并使所述荧光胶固化;
c、向发光材料B中加入光固化胶水并将二者混合均匀,得到荧光胶B,所述光固化胶水与所述发光材料B的质量比为1-300:1;
d、将所述荧光胶B涂覆于所述荧光胶A表面,并使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层光固化胶水,并使所述光固化胶水固化,得到分层结构的LED透镜;
其中,所述发光材料A和/或发光材料B包括量子点荧光粉。
作为优选,所述量子点荧光粉为BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种。
作为优选,所述发光材料A和/或发光材料B还包括稀土元素掺杂的无机荧光粉。
作为优选,所述无机荧光粉为硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种。
作为优选,所述发光材料A和所述发光材料B的发射光峰值波长为450-660nm。
作为优选,涂覆于所述LED透镜表面的荧光胶A厚度为3-300μm,所述荧光胶A经230-400nm的紫外光照射3-100s固化。
作为优选,所述荧光胶B的涂覆厚度为3-300μm,所述荧光胶B经230-400nm的紫外光照射3-100s固化。
作为优选,所述步骤e中,所述光固化胶水的涂覆厚度为10-1000μm,所述光固化胶水经230-400nm的紫外光照射5-200s固化。
作为优选,所述步骤e后还包括步骤f:将所述LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光。
作为优选,所述发光芯片为发光峰值波长230-400nm的紫外芯片或发光峰值波长420-480nm的蓝光芯片。
本发明的上述技术方案相比现有技术具有以下优点:
(1)本发明所述的分层型量子点LED背光源的制作方法,首先制作荧光胶A,并将荧光胶A涂覆于LED透镜的表面,然后制备荧光胶B,并将荧光胶B涂覆于荧光胶A表面,最后在荧光胶B表面涂覆一层光固化胶水作为保护层,得到分层型的LED透镜,最后将LED透镜固定于LED灯条上,LED灯条发出的光与荧光胶A、荧光胶B发出的光复合得到白光。与传统背光源相比,量子点材料的半波宽较窄,极大提升了LED背光源的色域值,本发明所述的制作方法制得的LED背光源色域值可达NTSC 95%以上,且所述方法工艺简单、生产成本低廉。并且所述层状结构荧光胶解决了现有技术中直接将多种荧光材料混合(尤其是多种量子点荧光材料混合)相互反应破坏量子点荧光粉的结构、造成光衰的问题。
(2)本发明所述的分层型量子点LED背光源的制作方法,所述步骤e后还包括步骤f:将所述LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光。将荧光胶涂覆于LED透镜,并在荧光胶表面涂覆光固化胶保护层,可使量子点荧光粉远离发光芯片,防止了量子点荧光粉受发光芯片的高温影响造成光衰,显著提高了背光源的可靠性,同时,量子点荧光粉可以保持较高的激发效率,且荧光胶层涂覆厚度可控,灯珠中只有发光芯片发光,封装过程中无需添加荧光粉,降低了封装作业的难度和产品的不良率,从而降低了背光源的生产成本,适合大批量工业化生产。
附图说明
为了使本发明的内容更容易被清楚的理解,下面根据本发明的具体实施例并结合附图,对本发明作进一步详细的说明,其中
图1是本发明实施例1所述的LED背光源的结构示意图;
图2是本发明实施例2所述的LED背光源的结构示意图;
图中附图标记表示为:1-支架;2-金属镀层;3-发光芯片;4-键合线;5-封装胶水层;6-LED透镜;7-荧光胶层A;8-荧光胶层B;9-光固化胶保护层。
具体实施方式
实施例1
本发明提供一种分层型量子点LED背光源的制作方法,所述方法包括如下步骤:
a、称取0.04g发光材料A,所述发光材料A为发射光波长542nm的InAs、InN绿光量子点荧光粉,其中所述InAs量子点荧光粉的质量为0.02g,称取0.04g聚氨酯类光固化胶水加入所述发光材料A中,进行真空脱泡搅拌,得到量子点荧光胶A,所述量子点荧光粉为粉末状,其也可为溶剂分散状;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的外表面,涂覆的荧光胶A厚度为3μm,将涂覆有荧光胶A的LED透镜置于紫外固化炉中,在230nm的紫外光下照射3s,使所述荧光胶A固化;
c、称取0.57g发光材料B,所述发光材料B为发射光波长655nm的磷酸盐红光荧光粉,称取0.57g环氧类光固化胶水,并将其加入所述发光材料B,进行真空脱泡搅拌,得到荧光胶B;
d、将所述荧光胶B涂覆于固化后的所述荧光胶A表面,使荧光胶B完全包覆荧光胶A,所述荧光胶B的涂覆厚度为3μm,将涂覆了荧光胶B的LED透镜置于紫外固化炉中,在230nm的紫外光下照射3s使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层厚度为10μm的环氧类光固化胶水,使光固化胶水完全覆盖所述荧光胶B,将涂覆了环氧类光固化胶水的LED透镜置于紫外固化炉中,在230nm的紫外光下照射5s,使光固化胶水固化,得到具有光固化胶保护层的分层型LED透镜;
f、将所述分层型LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光,灯珠中未封装荧光粉,本实施例中,所述发光芯片为发射光波长445nm的蓝光芯片,所述蓝光芯片与荧光胶A发出的绿光、荧光胶B发出的红光复合,得到白光发射,即制得分层型量子点LED背光源。
本实施例中所述分层性LED背光源的结构如图1所示,其包括LED单色灯条,所述LED灯条包括支架1、设置于所述支架1上表面的金属镀层2、固定于所述金属镀层表面的发光芯片3,所述发光芯片与所述金属镀层2还通过键合线4连接,所述发光芯片3外部封装有封装胶水层5,所述LED灯条外部设置有所述LED透镜6,所述LED透镜6外表面涂覆有荧光胶层A7,所述荧光胶层A7表面又涂覆有荧光胶层B8,所述荧光胶层B表面涂覆有光固化胶保护层9,其中所述荧光胶层A与荧光胶层B中的至少一种含有量子点材料。
实施例2
本发明提供一种分层型量子点LED背光源的制作方法,所述方法包括如下步骤:
a、称取0.13g发光材料A,所述发光材料A为发射光波长645nm的CdSe红光量子点荧光粉,称取39g环氧类光固化胶水加入所述发光材料A中,进行真空脱泡搅拌,得到量子点荧光胶A,所述量子点荧光粉为粉末状,其也可为溶剂分散状;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的内表面,涂覆的荧光胶A厚度为300μm,将涂覆有荧光胶A的LED透镜置于紫外固化炉中,在400nm的紫外光下照射100s,使所述荧光胶A固化;
c、称取0.03g发光材料B,所述发光材料B为发射光波长540nm的BaTiO3、CsPbCl3、CsPbBr3绿光量子点银光粉,称取1.57g有机硅类光固化胶水,并将其加入所述发光材料B,进行真空脱泡搅拌,得到荧光胶B;
d、将所述荧光胶B涂覆于固化后的所述荧光胶A表面,使荧光胶B完全包覆荧光胶A,所述荧光胶B的涂覆厚度为300μm,将涂覆了荧光胶B的LED透镜置于紫外固化炉中,在400nm的紫外光下照射100s使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层厚度为1000μm的有机硅类光固化胶水,使光固化胶水完全覆盖所述荧光胶B,将涂覆了环氧类光固化胶水的LED透镜置于紫外固化炉中,在400nm的紫外光下照射200s,使光固化胶水固化,得到具有光固化胶保护层的分层型LED透镜;
f、将所述分层型LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光,灯珠中未封装荧光粉,本实施例中,所述发光芯片为发射光波长480nm的蓝光芯片,所述蓝光芯片与荧光胶A发出的红光、荧光胶B发出的绿光复合,得到白光发射,即制得分层型量子点LED背光源。
本实施例中所述分层性LED背光源的结构如图2所示,其包括LED单色灯条,所述LED灯条包括支架1、设置于所述支架1上表面的金属镀层2、固定于所述金属镀层表面的发光芯片3,所述发光芯片与所述金属镀层2还通过键合线4连接,所述发光芯片3外部封装有封装胶水层5,所述LED灯条外部设置有所述LED透镜6,所述LED透镜6内表面涂覆有荧光胶层A7,所述荧光胶层A7表面又涂覆有荧光胶层B8,所述荧光胶层B8表面涂覆有光固化胶保护层9,其中所述荧光胶层A与荧光胶层B中的至少一种含有量子点材料。
实施例3
本发明提供一种分层型量子点LED背光源的制作方法,所述方法包括如下步骤:
a、称取0.13g发光材料A,所述发光材料A为发射光波长645nm的CdSe红光量子点荧光粉,称取39g环氧类光固化胶水加入所述发光材料A中,进行真空脱泡搅拌,得到量子点荧光胶A,所述量子点荧光粉为粉末状,其也可为溶剂分散状;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的内表面,涂覆的荧光胶A厚度为300μm,将涂覆有荧光胶A的LED透镜置于紫外固化炉中,在400nm的紫外光下照射100s,使所述荧光胶A固化;
c、称取0.03g发光材料B,所述发光材料B为发射光波长540nm的BaTiO3、CsPbCl3、CsPbBr3绿光量子点银光粉,称取1.57g有机硅类光固化胶水,并将其加入所述发光材料B,进行真空脱泡搅拌,得到荧光胶B;
d、将所述荧光胶B涂覆于固化后的所述荧光胶A表面,使荧光胶B完全包覆荧光胶A,所述荧光胶B的涂覆厚度为300μm,将涂覆了荧光胶B的LED透镜置于紫外固化炉中,在400nm的紫外光下照射100s使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层厚度为1000μm的有机硅类光固化胶水,使光固化胶水完全覆盖所述荧光胶B,将涂覆了环氧类光固化胶水的LED透镜置于紫外固化炉中,在400nm的紫外光下照射200s,使光固化胶水固化,得到具有光固化胶保护层的分层型LED透镜;
f、将所述分层型LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光,灯珠中未封装荧光粉,本实施例中,所述发光芯片为发射光波长480nm的蓝光芯片,所述蓝光芯片与荧光胶A发出的红光、荧光胶B发出的绿光复合,得到白光发射,即制得分层型量子点LED背光源。
实施例4
本发明提供一种分层型量子点LED背光源的制作方法,所述方法包括如下步骤:
a、称取发光材料A,所述发光材料A由0.55g发射光波长635nm的氟化物红光荧光粉和0.32g发射光波长467nm的铝酸盐蓝光荧光粉组成,称取4.93g聚氨酯类光固化胶水加入所述发光材料A中,进行真空脱泡搅拌,得到量子点荧光胶A;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的内表面,涂覆的荧光胶A厚度为100μm,将涂覆有荧光胶A的LED透镜置于紫外固化炉中,在275nm的紫外光下照射50s,使所述荧光胶A固化;
c、称取0.06g发光材料B,所述发光材料B为发射光波长533nm的GaN、PbTe绿光量子点荧光粉,称取2.25g有机硅类光固化胶水,并将其加入所述发光材料B,进行真空脱泡搅拌,得到荧光胶B,所述量子点荧光粉为粉末状,其也可为溶剂分散状;
d、将所述荧光胶B涂覆于固化后的所述荧光胶A表面,使荧光胶B完全包覆荧光胶A,所述荧光胶B的涂覆厚度为25μm,将涂覆了荧光胶B的LED透镜置于紫外固化炉中,在330nm的紫外光下照射25s使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层厚度为500μm的有机硅类光固化胶水,使光固化胶水完全覆盖所述荧光胶B,将涂覆了环氧类光固化胶水的LED透镜置于紫外固化炉中,在230nm的紫外光下照射40s,使光固化胶水固化,得到具有光固化胶保护层的分层型LED透镜;
f、将所述分层型LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光,灯珠中未封装荧光粉,本实施例中,所述发光芯片为发射光波长335nm的紫外芯片,所述紫外芯片与荧光胶A发出的红光、蓝光、荧光胶B发出的绿光复合,得到白光发射,即制得分层型量子点LED背光源。
实施例5
本发明提供一种分层型量子点LED背光源的制作方法,所述方法包括如下步骤:
a、称取发光材料A,所述发光材料A由0.25g发射光波长645nm的CsPbBr3红光量子点荧光粉和发射光波长460nm的蓝光氮化物荧光粉组成,称取9.5g环氧类光固化胶水加入所述发光材料A中,进行真空脱泡搅拌,得到量子点荧光胶A,所述量子点荧光粉为粉末状,其也可为溶剂分散状;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的内表面,涂覆的荧光胶A厚度为75μm,将涂覆有荧光胶A的LED透镜置于紫外固化炉中,在355nm的紫外光下照射55s,使所述荧光胶A固化;
c、称取发光材料B,所述发光材料B由0.35g发射光波长545nm的MgTe绿光量子点银光粉和0.09g发射光波长540nm的氟化物绿光荧光粉组成,称取3.55g有机硅类光固化胶水,并将其加入所述发光材料B,进行真空脱泡搅拌,得到荧光胶B;
d、将所述荧光胶B涂覆于固化后的所述荧光胶A表面,使荧光胶B完全包覆荧光胶A,所述荧光胶B的涂覆厚度为155μm,将涂覆了荧光胶B的LED透镜置于紫外固化炉中,在375nm的紫外光下照射35s使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层厚度为165μm的有机硅类光固化胶水,使光固化胶水完全覆盖所述荧光胶B,将涂覆了环氧类光固化胶水的LED透镜置于紫外固化炉中,在385nm的紫外光下照射15s,使光固化胶水固化,得到具有光固化胶保护层的分层型LED透镜;
f、将所述分层型LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光,灯珠中未封装荧光粉,本实施例中,所述发光芯片为发射光波长375nm的紫外芯片,所述紫外芯片与荧光胶A发出的红光、蓝光、荧光胶B发出的绿光复合,得到白光发射,即制得分层型量子点LED背光源。
实验例
测试实施例1-3所述的制作方法制得的分层性量子点LED背光源的色坐标和色域值,结果如表1所示。
表1
实例1 | 实例2 | 实例3 | |
色坐标 | (0.30,0.29) | (0.28,0.27) | (0.32,0.29) |
NTSC色域值 | 99.3% | 95.6% | 101.5% |
从上述结果可以看出,采用实施例1-3所述的方法得到的LED背光源发光的颜色均处于白光区,且具有高色域值,色域值均可达NTSC95%以上。
显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。对于所属领域的普通技术人员来说,在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。
Claims (3)
1.一种分层型量子点LED背光源的制作方法,其特征在于,包括如下步骤:
a、向发光材料A中加入光固化胶水并将二者混合均匀,得到荧光胶A,所述光固化胶水与所述发光材料A的质量比为1-300:1;
b、将所述荧光胶A涂覆于LED背光源中LED透镜的内表面或外表面,并使所述荧光胶固化;
c、向发光材料B中加入光固化胶水并将二者混合均匀,得到荧光胶B,所述光固化胶水与所述发光材料B的质量比为1-300:1;
d、将所述荧光胶B涂覆于所述荧光胶A表面,并使所述荧光胶B固化;
e、在所述荧光胶B表面涂覆一层光固化胶水,并使所述光固化胶水固化,得到分层结构的LED透镜;
f、将所述LED透镜固定于LED单色灯条上,所述LED单色灯条中的灯珠只有发光芯片发光;
其中,所述发光材料A和/或发光材料B包括量子点荧光粉;
所述量子点荧光粉为BaS、AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、GaS、GaSe、InGaAs、MgS、MgSe、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、CsPbCl3、CsPbBr3、CsPbI3中的至少一种;
所述发光材料A和/或发光材料B还包括稀土元素掺杂的无机荧光粉;所述无机荧光粉为硅酸盐、铝酸盐、磷酸盐、氮化物、氟化物荧光粉中的至少一种;
涂覆于所述LED透镜表面的荧光胶A厚度为3-300μm,所述荧光胶A经230-400nm的紫外光照射3-100s固化;
所述荧光胶B的涂覆厚度为3-300μm,所述荧光胶B经230-400nm的紫外光照射3-100s固化;
所述步骤e中,所述光固化胶水的涂覆厚度为10-1000μm,所述光固化胶水经230-400nm的紫外光照射5-200s固化。
2.根据权利要求1所述的分层型量子点LED背光源的制作方法,其特征在于,所述发光材料A和所述发光材料B的发射光峰值波长为450-660nm。
3.根据权利要求2所述的分层型量子点LED背光源的制作方法,其特征在于,所述发光芯片为发光峰值波长230-400nm的紫外芯片或发光峰值波长420-480nm的蓝光芯片。
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CN202616230U (zh) * | 2012-04-28 | 2012-12-19 | 天津三安光电有限公司 | 发光二极管封装结构 |
CN104681689A (zh) * | 2013-11-26 | 2015-06-03 | 四川新力光源股份有限公司 | 光学器件及其制造方法和包括光学器件的发光装置 |
CN103700654A (zh) * | 2013-12-20 | 2014-04-02 | 纳晶科技股份有限公司 | 基于cob封装的led光源及其制造方法 |
CN104393154A (zh) * | 2014-12-09 | 2015-03-04 | 武汉大学 | 一种led芯片级白光光源的晶圆级封装方法 |
CN204792905U (zh) * | 2015-08-03 | 2015-11-18 | 苏文藏 | 消除光斑增强散热效果的led封装结构 |
CN106058012A (zh) * | 2016-07-27 | 2016-10-26 | 天津市中环量子科技有限公司 | 一种复合白光led及其制备方法 |
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