CN106714472A - Steel mesh process - Google Patents
Steel mesh process Download PDFInfo
- Publication number
- CN106714472A CN106714472A CN201710037936.5A CN201710037936A CN106714472A CN 106714472 A CN106714472 A CN 106714472A CN 201710037936 A CN201710037936 A CN 201710037936A CN 106714472 A CN106714472 A CN 106714472A
- Authority
- CN
- China
- Prior art keywords
- perforate
- openings
- component
- steel mesh
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0169—Using a temporary frame during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a steel mesh process. Openings are formed in a steel mesh; the openings comprise a plurality of first openings, a plurality of second openings, a plurality of third openings and a plurality of fourth openings; the first openings are corresponding to components of which the bottoms are provided with pads; the first openings are shaped like a Chinese character ''tian''; the second openings are corresponding to power strip-class components provided with pins; the second openings are flared; the third openings are corresponding to IC-class components provided with pins, the intervals of the pins being smaller than 0.5mm; the third openings are adjacent to one another and are arranged in a row; two adjacent sides of each third opening are shrunk inwards, so that intervals between every two adjacent third holes can be increased; the fourth openings are corresponding to components of which the bottoms are provided with pads, through heat dissipation holes being formed in the pads; and each fourth opening is ||-shaped. The various kinds of openings are adopted, and therefore, solder paste can be increased or decreased, quality stability can be achieved, and the yield and performance of the product can be improved.
Description
Technical field
The present invention relates to a kind of steel mesh technique.
Background technology
Existing steel mesh opening, without the processing by other techniques, is easily caused according to the size openings of substrate P DA
Tin amount increases or upper tin is not enough, and it is bad easily to occur quality during welding, is mainly reflected in that (1) bridging is bad, (2) few tin is bad, (3)
Tin sweat(ing) is bad, (4) float bad this four aspects.
The content of the invention
To overcome disadvantages mentioned above, it is an object of the invention to provide one kind on the basis of original PAD sizes, expand or subtract
The ratio of small steel mesh opening increases or decreases tin cream amount, reach welding optimum efficiency, reduce the bad steel mesh technique of quality.
In order to reach object above, the technical solution adopted by the present invention is:A kind of steel mesh technique, is provided with out on steel mesh
Hole, the perforate includes:Several first perforates, first perforate is corresponding with the component that pad is arranged at bottom, and described first opens
Hole is in sphere of movements for the elephants shape;Several second perforates, second perforate is corresponding with the component of the socket class for having pin, and described second opens
Hole is to extending out drawing;Several the 3rd perforates, the IC class components pair of below the spacing 0.5mm between the 3rd perforate and pin
Should, several adjacent shapes of the 3rd perforate are in a row, and the adjacent both sides of each the 3rd perforate inside contract so that two adjacent institutes
Drawing is expanded at the interval stated between the 3rd perforate;Several the 4th perforates, the 4th perforate has on pad and pad with bottom passes through
The component correspondence of louvre is worn, each described 4th perforate is in " ‖ " font.
The beneficial effects of the invention are as follows the first perforate has the component of pad suitable for bottom, and pad is carried out with sphere of movements for the elephants shape
Opening, reduces tin cream amount, prevents component from floating;Second perforate is applied to the component of the socket class for having pin, steel mesh reaming and outer
Draw, increase tin cream amount, the pin for enabling scolding tin preferably to climb to component is welded, reduce missing solder bad;3rd perforate is fitted
For the IC class components of below the spacing 0.5mm between pin, the spacing of such IC classes component PIN two-by-two is smaller, to the 3rd
The both sides of perforate are inside contracted, and tin on bridging and component pin can be prevented between PIN and PIN not enough, reduce the tin cream between component PIN
Amount, prevents bridging, while increasing the tin cream amount of PIN points, component is preferably welded;4th perforate has weldering suitable for bottom
There is the component through louvre on disk and pad, with " ‖ " font opening, avoid through hole, prevent tin cream by the excessive tin of through hole;
In sum, by the opening mode of various steel mesh techniques, tin cream amount can be increased or decreased, reaches quality and stabilize, improved and produce
The yield and performance of product.
Preferably, the component that pad is arranged at the bottom includes QFN, QFP, IC, triode.
Preferably, the component of the socket class for having a pin includes QFP, socket component.
Preferably, the two ends and both sides of drawing or second perforate are outer outside the two ends of second perforate draws.
Preferably, drawn outside the two ends of the 3rd perforate.
Specific embodiment
Presently preferred embodiments of the present invention is described in detail below so that advantages and features of the invention can be easier to by
It will be appreciated by those skilled in the art that apparent clearly being defined so as to be made to protection scope of the present invention.
A kind of steel mesh technique of the present embodiment, is provided with perforate on steel mesh, the pin pair of perforate and various types of components
Should, perforate includes:
Several first perforates, the first perforate is corresponding with the component that pad is arranged at bottom, such as QFN, QFP, IC, triode,
First perforate is in sphere of movements for the elephants shape, reduces tin cream amount, prevents component from floating.
Several second perforates, the second perforate is corresponding with the component of the socket class for having pin, such as QFP, socket component, second
Perforate increases tin cream amount to drawing is extended out, and the pin for enabling scolding tin preferably to climb to component is welded, and reduces missing solder bad;
More specifically, the second perforate is had to the mode for extending out drawing, 1) it is directed to for the less socket class component of some sizes, such as
The specification of length, width and height is the socket class component of 24.5mm*4.3mm*2.1mm, is drawn outside the two ends of the second perforate, for example will be original
The specification that the * long of the second perforate is wide is 2.1mm*0.26mm, and the second perforate is extended into 2.15mm*0.26mm;And or pin 2)
For some larger-size socket class components, such as the specification of length, width and height is the socket class component of 45.8mm*5.2mm*10mm,
The two ends and both sides of the second perforate are drawn outward, such as:A is 2.1mm*0.26mm when the specification * long of the second original perforate wide,
Second perforate is expanded to 2.3mm*0.55mm;B is 3.85mm*0.8mm, extension when the specification * long of the second original perforate wide
It is 3.95mm*0.9mm to specification * long wide.
Several the 3rd perforates, the IC class components of below the spacing 0.5mm between the 3rd perforate and pin are corresponding, several
The adjacent shape of 3rd perforate is in a row, and the adjacent both sides of each the 3rd perforate inside contract, and is drawn outside the two ends of the 3rd perforate, such as can be by original
The * wide specifications long for carrying out the second perforate are 0.2*0.5mm, and several second perforates are arranged along the width of the second perforate, can
The * wide of the second perforate specifications long are extended to 0.17*0.65mm so that the interval between two adjacent the 3rd perforates is expanded
Draw, tin on bridging and component pin can be prevented between PIN and PIN not enough, reduce the tin cream amount between component PIN, prevent bridging, while
Increase the tin cream amount of PIN points, component is preferably welded.
Several the 4th perforates, the 4th perforate has on pad and pad with bottom has the component through louvre corresponding, often
Individual 4th perforate is in " ‖ " font, can avoid through hole, prevents tin cream by the excessive tin of through hole.
Embodiment of above technology design and feature only to illustrate the invention, technique is familiar with its object is to allow
People understands present disclosure and is carried out, and it is not intended to limit the scope of the present invention, all according to spirit of the invention
The equivalent change or modification that essence is done, should all cover within the scope of the present invention.
Claims (5)
1. a kind of steel mesh technique, is provided with perforate on steel mesh, it is characterised in that the perforate includes:
Several first perforates, first perforate is corresponding with the component that pad is arranged at bottom, and first perforate is in sphere of movements for the elephants shape;
Several second perforates, second perforate is corresponding with the component of the socket class for having pin, and second perforate is to extending out
Draw;
Several the 3rd perforates, the I C class components of below the spacing 0.5mm between the 3rd perforate and pin are corresponding, some
The adjacent shape of individual 3rd perforate is in a row, and the adjacent both sides of each the 3rd perforate inside contract so that adjacent two the described 3rd
Drawing is expanded at interval between perforate;
Several the 4th perforates, the 4th perforate has on pad and pad with bottom has the component through louvre corresponding, often
Individual 4th perforate is in " ‖ " font.
2. steel mesh technique according to claim 1, it is characterised in that:The bottom have pad component include QFN, QFP,
IC, triode.
3. steel mesh technique according to claim 1, it is characterised in that:The component of the socket class for having a pin include QFP,
Socket component.
4. steel mesh technique according to claim 1, it is characterised in that:Drawing or described second outside the two ends of second perforate
The two ends and both sides of perforate are outer to draw.
5. steel mesh technique according to claim 1, it is characterised in that:Drawn outside the two ends of the 3rd perforate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710037936.5A CN106714472A (en) | 2017-01-18 | 2017-01-18 | Steel mesh process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710037936.5A CN106714472A (en) | 2017-01-18 | 2017-01-18 | Steel mesh process |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106714472A true CN106714472A (en) | 2017-05-24 |
Family
ID=58906977
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710037936.5A Pending CN106714472A (en) | 2017-01-18 | 2017-01-18 | Steel mesh process |
Country Status (1)
Country | Link |
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CN (1) | CN106714472A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113714745A (en) * | 2021-09-13 | 2021-11-30 | 苏州欧方电子科技有限公司 | Local electroforming steel mesh processing technology based on micro-welding technology |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872261A (en) * | 1987-12-11 | 1989-10-10 | Digital Equipment Corporation | Method of and apparatus for surface mounting electronic components onto a printed wiring board |
CN201319701Y (en) * | 2008-11-28 | 2009-09-30 | 深圳市实益达科技股份有限公司 | Tinning steel mesh |
CN202242290U (en) * | 2011-10-11 | 2012-05-30 | 大连日佳电子有限公司 | Printing steel screen with combined openings |
CN203983260U (en) * | 2014-07-09 | 2014-12-03 | 上海卓悠网络科技有限公司 | A kind of project organization of the IC device based on QFN, QFP or SOP encapsulation technology |
CN204278723U (en) * | 2014-11-20 | 2015-04-22 | 上海斐讯数据通信技术有限公司 | QFN chip web plate |
-
2017
- 2017-01-18 CN CN201710037936.5A patent/CN106714472A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4872261A (en) * | 1987-12-11 | 1989-10-10 | Digital Equipment Corporation | Method of and apparatus for surface mounting electronic components onto a printed wiring board |
CN201319701Y (en) * | 2008-11-28 | 2009-09-30 | 深圳市实益达科技股份有限公司 | Tinning steel mesh |
CN202242290U (en) * | 2011-10-11 | 2012-05-30 | 大连日佳电子有限公司 | Printing steel screen with combined openings |
CN203983260U (en) * | 2014-07-09 | 2014-12-03 | 上海卓悠网络科技有限公司 | A kind of project organization of the IC device based on QFN, QFP or SOP encapsulation technology |
CN204278723U (en) * | 2014-11-20 | 2015-04-22 | 上海斐讯数据通信技术有限公司 | QFN chip web plate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113714745A (en) * | 2021-09-13 | 2021-11-30 | 苏州欧方电子科技有限公司 | Local electroforming steel mesh processing technology based on micro-welding technology |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 215000 66-69 Mu Xu Road, Mu Du Town, Wuzhong District, Suzhou, Jiangsu Applicant after: Taishodo Electronics (Suzhou) Co., Ltd. Address before: 215000 Huayuan East Road, Mu Du Town, Wuzhong District, Suzhou, Jiangsu 299 Applicant before: Taishodo Electronics (Suzhou) Co., Ltd. |
|
CB02 | Change of applicant information | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170524 |
|
RJ01 | Rejection of invention patent application after publication |