CN204278723U - QFN chip web plate - Google Patents
QFN chip web plate Download PDFInfo
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- CN204278723U CN204278723U CN201420701855.2U CN201420701855U CN204278723U CN 204278723 U CN204278723 U CN 204278723U CN 201420701855 U CN201420701855 U CN 201420701855U CN 204278723 U CN204278723 U CN 204278723U
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- web plate
- opening
- qfn
- chip web
- qfn chip
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Abstract
The utility model relates to semiconductor device packaging technique field, particularly relate to a kind of QFN chip web plate, can based on the basis of the QFN web plate of traditional 0.4pitch, some non-touching sub-openings are set in each inside opening district, effectively to avoid that opening is excessive and lower tin that is that cause is too much or blocked up, and then the generation of the defect such as the such as crossover caused, outside opening is carried out chamfered simultaneously, with the generation of the defects such as such as biting of effectively avoiding causing because of too small openings or few tin, with effective chip web plate opening is optimized while, the yield of improving production efficiency and product greatly, and effectively reduce process costs.
Description
Technical field
The utility model relates to semiconductor device packaging technique field, particularly relates to a kind of QFN chip web plate.
Background technology
SMT is surface installation technique (Surface Mount Technology is called for short SMT) is by utilizing the automatic assembly equipment such as stencil printer, chip mounter, Reflow Soldering that surface mount device (as resistance, electric capacity, inductance etc.) is directly pasted, is welded in a kind of electronics tipping technology of circuit board surface.
In SMT production process, printing is a difficult problem in SMT manufacturing industry always, especially at QFN (Quad Flat No-leadPackage, quad flat non-pin package) IC spacing is in the technique of 0.4pitch (0.4mm), due to web plate opening excessive time to produce crossover, then can produce again when web plate opening is less and bite or few tin, and then can produce the defect such as rosin joint or crossover to other elements during by changing the adjustment of web plate thickness, Fig. 1 is the structural representation of traditional 0.4pitchQFN web plate opening, as shown in Figure 1, traditional QFN web plate is provided with some rectangular peripheral openings 11 and some foursquare interior side openings 12, and the long edge lengths of each peripheral openings 11 is 1mm, bond length w is 0.215mm, the length of side of each interior side opening 12 is then 2.2mm, namely very easily produce in the region at peripheral openings 11 place and bite or lack the phenomenons such as tin, and in the region at interior side opening 12 place, often can produce the phenomenons such as crossover, and then make very easily to exert an adverse impact in current printing process, while the yield greatly reducing production efficiency and product, also further can increase process costs.
Utility model content
For above-mentioned technical problem, this application provides a kind of QFN chip web plate, described chip web plate is provided with external zones and the inner area that surrounds by this external zones, and be provided with some open regions in described inner area;
Wherein, the described chip web plate being arranged in each described open region is provided with some non-touching sub-openings.
As a preferred embodiment, in above-mentioned QFN chip web plate:
The described chip web plate being positioned at described external zones is provided with some non-touching outside openings.
As a preferred embodiment, in above-mentioned QFN chip web plate:
Described outside opening is the rectangle with circular arc chamfering.
As a preferred embodiment, in above-mentioned QFN chip web plate:
The bond length of described outside opening is 0.13mm, and long edge lengths is 1.15mm, and chamfering is 0.05mm.
As a preferred embodiment, in above-mentioned QFN chip web plate:
Described sub-opening is the square with circular arc chamfering.
As a preferred embodiment, in above-mentioned QFN chip web plate:
The length of side of described sub-opening is 0.56mm, and chamfering is 0.06mm.
As a preferred embodiment, above-mentioned QFN chip web plate comprises:
Screen frame;
Mesh sheet, by adhesive tape sticking on described screen frame;
Wherein, described mesh sheet is arranged described outside area and described inner area.
As a preferred embodiment, in above-mentioned QFN chip web plate:
The thickness of described mesh sheet is 0.1mm.
In sum, owing to have employed technique scheme, present patent application describes a kind of QFN chip web plate, can based on the basis of the QFN web plate of traditional 0.4pitch, some non-touching sub-openings are set in each inside opening district, effectively to avoid that opening is excessive and lower tin that is that cause is too much or blocked up, and then the generation of the defect such as the such as crossover caused, outside opening is carried out chamfered simultaneously, with the generation of the defects such as such as biting of effectively avoiding causing because of too small openings or few tin, with effective chip web plate opening is optimized while, the yield of improving production efficiency and product greatly, and effectively reduce process costs.
Accompanying drawing explanation
Fig. 1 is the structural representation of traditional 0.4pitchQFN web plate opening;
Fig. 2 is the structural representation of QFN chip web plate opening in the embodiment of the present application;
Fig. 3 is the size comparison's structural representation between traditional peripheral openings and the embodiment of the present application peripheral opening;
Fig. 4 is the size comparison's structural representation between traditional interior side opening and the embodiment of the present application neutron opening.
Detailed description of the invention
In order to solve peripheral opening size in traditional mesh-plate structure too small and the few tin, solder skip etc. that cause, and the too small and generation of the defect such as too much, blocked up crossover caused of lower tin caused of inner side opening size, the application can based on the basis of traditional web plate interface opening, the long limit of inscribe process is carried out to the broadside of peripheral openings on traditional web plate and carries out outer drawing, and after carrying out chamfering simultaneously, to form the outside opening of the application, so that the lower tin in printing process; In addition, in on traditional web plate side opening region in offer the identical and non-touching sub-opening of some shapes, and antithetical phrase opening also carries out chamfered, to control the lower tin in printing process, and then the opening on whole web plate is all optimized, and then improve the yield of product.
Be further described below in conjunction with the detailed description of the invention of accompanying drawing to the application:
Fig. 2 is the structural representation of QFN chip web plate opening in the embodiment of the present application; As shown in Figure 2, the spacing of the QFN IC of the QFN chip web plate of the application can be 0.4pitch (i.e. 0.4mm), this QFN chip web plate can comprise screen frame (not shown) and by the mesh sheet (not shown) of adhesive tape sticking on this screen frame, and this mesh sheet is positioned among screen frame; Preferably, the thickness of this mesh sheet is chosen as 0.1mm.
Further, as shown in Figure 2, external zones 1 and inner area 2 can be set in above-mentioned mesh sheet (the total figure namely shown in Fig. 2), and inner area 2 is arranged among external zones 1, makes external zones 2 surround inner area 1.
Further, some open regions 22 are also provided with in above-mentioned inner area 2, and each open region 22 traditional for the formation of one in side opening, and in the present embodiment, in each open region 22, form some non-touching sub-openings 23, as shown in Figure 2, four sub-openings 23 are set in the mesh sheet of each open region 22, and the shape of every sub-opening 23 is all chosen as the square with circular arc chamfering, such as the length of side of this sub-opening 23 can be 0.56mm, and chamfering then can be 0.06mm.
Further, mesh sheet in above-mentioned external zones 2 is offered several non-touching outside openings 21, and this outside opening 21 is for having the rectangle of circular arc chamfering, the long edge lengths of such as this outside opening 21 can be 1.15mm, bond length is 0.13mm, and chamfering is 0.05mm.
Fig. 3 is the size comparison's structural representation between traditional peripheral openings and the embodiment of the present application peripheral opening, and Fig. 4 is the size comparison's structural representation between traditional interior side opening and the embodiment of the present application neutron opening; As shown in figs. 34, form the web plate opening in the present embodiment by the traditional QFN web plate of optimization improvement, be specially:
As shown in Figure 3, minor face (limit namely extended in X direction) inscribe one segment distance of peripheral openings 11 traditional web plate can will offered, a segment distance is drawn outside (namely along the limit that Y-direction extends) in long limit, and after carrying out chamfered, the outside opening 21 in the present embodiment can be formed.
Preferably, as shown in Figure 3, by the minor face M1 of peripheral openings 11 by 0.215mm inscribe 0.08mm, 0.1mm can be drawn by outside the long limit M2 of outside opening, and after carrying out the chamfered of 0.05mm, be 0.13mm to form minor face M3 length, the long limit M4 length outside opening 21 that is 1.15mm.
As shown in Figure 4, after the length of side of side opening 12 in traditional web plate is offered can being shortened certain length, and carry out chamfered, to form some non-touching some sub-openings 23 in the region forming interior side opening 12 in tradition.
Preferably, as shown in Figure 4, after the length of the length of side N1 of interior side opening 12 can being foreshortened to 0.5mm by 2.2mm, carry out the chamfered of 0.06mm, and then in an open region 22, form the sub-opening 23 that four length of side N are 0.56mm.
Further, according to IP7525 (flakiness ratio formula and area ratio formula), traditional mesh sheet thickness can be adjusted to 0.10mm from 0.12mm.
Preferably, above-mentioned flakiness ratio (aspect ratio) A1 formula is:
A1＝W/T＞1.5；
Wherein, the thickness (Thickness of Stencil Foil) of W to be A/F (width of aperture), T be web plate.
Above-mentioned area ratio (area ratio) A2 formula is:
A2＝(L*W)/(2*(L+W)*T)＞0.06；
Wherein, the area (area of Pad) that (L*W) is pad, (2* (L+W) * T) is aperture area (Area of Aperture Walls).
The size of the web plate opening in the present embodiment is on the basis according to traditional web plate opening size, after optimization process, according to the standard of industry open carve formed, and then make 0.4mm Picth QFN web plate opening new in the present embodiment compared to traditional web plate, the better quality of printing can be made, and due to after the chamfered to traditional square hole, make lower tin amount very full, and lower tin can not be caused blocked up, other the bad problem too much caused, and can further by the adjustment to mesh sheet thickness, make the thickness of lower tin more perfect, and then ensure that the quality of printing process, in the technique of reality, by adopting the web plate in this example can by steel mesh Yield lmproved to 99.5%.
It should be noted that, the length of side in the present embodiment refers to the distance between the relative edge of sub-opening 23, long edge lengths then refers to the distance between the minor face of outside opening 21, and bond length then refers to the distance between the long limit of outside opening 21, specifically can see shown in Fig. 3 ~ 4.
To sum up, owing to have employed technique scheme, the QFN chip web plate recorded in the embodiment of the present application, can based on the basis of the QFN web plate of traditional 0.4pitch, some non-touching sub-openings are set in each inside opening district, effectively to avoid that opening is excessive and lower tin that is that cause is too much or blocked up, and then the generation of the defect such as the such as crossover caused, outside opening is carried out chamfered simultaneously, with the generation of the defects such as such as biting of effectively avoiding causing because of too small openings or few tin, with effective chip web plate opening is optimized while, the yield of improving production efficiency and product greatly, and effectively reduce process costs.
By illustrating and accompanying drawing, giving the exemplary embodiments of the ad hoc structure of detailed description of the invention, based on the utility model spirit, also can do other conversion.Although above-mentioned utility model proposes existing preferred embodiment, but these contents are not as limitation.
For a person skilled in the art, after reading above-mentioned explanation, each middle change and correction undoubtedly will be apparent.Therefore, appending claims should regard the whole change and correction of containing true intention of the present utility model and scope as.In Claims scope, the scope of any and all equivalences and content, all should think and still belong in intention of the present utility model and scope.
Claims (8)
1. a QFN chip web plate, is characterized in that, described chip web plate is provided with external zones and the inner area that surrounds by this external zones, and be provided with some open regions in described inner area;
Wherein, the described chip web plate being arranged in each described open region is provided with some non-touching sub-openings.
2. QFN chip web plate as claimed in claim 1, is characterized in that, the described chip web plate being positioned at described external zones is provided with some non-touching outside openings.
3. QFN chip web plate as claimed in claim 2, it is characterized in that, described outside opening is the rectangle with circular arc chamfering.
4. QFN chip web plate as claimed in claim 3, it is characterized in that, the bond length of described outside opening is 0.13mm, and long edge lengths is 1.15mm, and chamfering is 0.05mm.
5. QFN chip web plate as claimed in claim 1, it is characterized in that, described sub-opening is the square with circular arc chamfering.
6. QFN chip web plate as claimed in claim 5, it is characterized in that, the length of side of described sub-opening is 0.56mm, and chamfering is 0.06mm.
7. QFN chip web plate as claimed in claim 1, it is characterized in that, described chip web plate comprises:
Screen frame;
Mesh sheet, by adhesive tape sticking on described screen frame;
Wherein, described mesh sheet is arranged described outside area and described inner area.
8. QFN chip web plate as claimed in claim 7, it is characterized in that, the thickness of described mesh sheet is 0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420701855.2U CN204278723U (en) | 2014-11-20 | 2014-11-20 | QFN chip web plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420701855.2U CN204278723U (en) | 2014-11-20 | 2014-11-20 | QFN chip web plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204278723U true CN204278723U (en) | 2015-04-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420701855.2U Expired - Fee Related CN204278723U (en) | 2014-11-20 | 2014-11-20 | QFN chip web plate |
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| Country | Link |
|---|---|
| CN (1) | CN204278723U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714472A (en) * | 2017-01-18 | 2017-05-24 | 对松堂电子（苏州）有限公司 | Steel mesh process |
-
2014
- 2014-11-20 CN CN201420701855.2U patent/CN204278723U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714472A (en) * | 2017-01-18 | 2017-05-24 | 对松堂电子（苏州）有限公司 | Steel mesh process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20181120 |