CN210866147U - Heating block unit and heating device - Google Patents
Heating block unit and heating device Download PDFInfo
- Publication number
- CN210866147U CN210866147U CN201922003929.0U CN201922003929U CN210866147U CN 210866147 U CN210866147 U CN 210866147U CN 201922003929 U CN201922003929 U CN 201922003929U CN 210866147 U CN210866147 U CN 210866147U
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- fuse lead
- fuse
- pad
- heating block
- depth
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The present disclosure relates to a heating block unit and a heating apparatus. In various embodiments, a heating block cell is provided that includes a recess including a bottom and a sidewall, the recess including: a pad placement region; the two pull rod mounting areas are respectively arranged on two sides of the bonding pad mounting area; wherein the heating block cell further includes one or more fuse lead mounting areas disposed across the bottom and the sidewall.
Description
Technical Field
The present invention relates generally to integrated circuit packaging technology, and more particularly to heater block design for series fuse leads.
Background
In the semiconductor industry, it is generally necessary to package a fabricated integrated circuit chip (Die) to form a final product of the integrated circuit chip, and the Die plays an important role in protecting the chip, enhancing the electrothermal performance, and facilitating the assembly of the whole device.
The conventional SO packaging process may use a fuse lead connected in series to connect a pin lead and a die pad (die pad) to each other to achieve chip grounding, and the die pad is sunk below the pin lead plane to improve the stability of the subsequent process. Typically, the packaging process requires grooving of the heat block.
However, since the pressing of the machine inevitably has a certain offset, the fuse lead is disadvantageously brought into contact with the heating block to generate warpage, which adversely affects the workability of the first and second welding spots of the product, thereby damaging the product quality.
Thus, there is a strong need in the art to provide improved solutions to the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a heating block unit, which comprises a groove, the groove comprising a bottom and a sidewall, the groove comprising: a pad placement region; the two pull rod mounting areas are respectively arranged on two sides of the bonding pad mounting area; wherein the heating block cell further includes one or more fuse lead mounting areas disposed across the bottom and the sidewall.
An embodiment of the utility model provides a heating block, it further contains the vacuum hole, the vacuum hole is located the pad is settled and is distinguished.
An embodiment of the utility model provides a heating block, wherein two pull rod arrangement regions are arranged relatively each other.
An embodiment of the utility model provides a heating block, wherein a plurality of fuse lead wire arrangement regions are located the regional different sides of fuse lead wire arrangement.
An embodiment of the utility model provides a heating block, wherein a plurality of fuse lead wire arrangement regions are located fuse lead wire arrangement region homonymy.
An embodiment of the present invention provides a heating block, wherein the plurality of fuse lead mounting areas are adjacent to each other or not.
An embodiment of the utility model provides a heating block, wherein one or more fuse lead wire settle regional vertical direction degree of depth more than or equal to the regional fluting degree of depth is settled to the pad.
An embodiment of the utility model provides a heating block, wherein the regional vertical direction degree of depth ratio is settled to one or more fuse lead wires the regional fluting degree of depth of pad settlement is 10 mu m big.
An embodiment of the utility model provides a heating device, it contains the recess, the recess contains bottom and lateral wall, the recess contains: a pad placement region; the two pull rod mounting areas are respectively arranged on two sides of the bonding pad mounting area; wherein the heating device further comprises one or more fuse lead placement regions having a dimension in a first direction greater than a maximum allowable object offset distance in the first direction and a dimension in a second direction greater than a maximum allowable object offset distance in the second direction.
An embodiment of the utility model provides a heating device, wherein a plurality of fuse lead wire arrangement regions are located the regional different sides of fuse lead wire arrangement.
An embodiment of the utility model provides a heating device, wherein a plurality of fuse lead wire arrangement regions are located fuse lead wire arrangement region homonymy.
An embodiment of the present invention provides a heating device, wherein the plurality of fuse lead mounting areas are adjacent to each other or not.
An embodiment of the utility model provides a heating device, wherein one or more fuse lead wire settle regional vertical direction degree of depth more than or equal to the regional fluting degree of depth is settled to the pad.
An embodiment of the utility model provides a heating device, wherein one or more fuse lead wire arrangement region's vertical direction degree of depth is than the regional fluting degree of depth of pad arrangement is 10 mu m big.
Drawings
Fig. 1 shows a schematic top view of a strand unit.
Fig. 2 shows a partially enlarged side view of the fuse wire 10 of fig. 1, connecting the pin wire 2 to the die pad 9.
Fig. 3 shows an operation cross-sectional view in a normal operation state without machine pressing offset.
Fig. 4 shows an operation cross-sectional view when an abnormal operation state occurs due to a machine pressing offset.
Fig. 5 shows a top view of a heating block unit used in the prior art.
Fig. 6 shows a top view of the heating block unit of the present invention.
Fig. 7 shows a top view of a bar unit implemented according to design rules.
Fig. 8A shows a schematic diagram of more than two fuse leads on a bar unit, where the fuse leads are adjacent to each other and located on the same side.
Fig. 8B shows a schematic diagram of a heater corresponding to the design of fig. 8A.
Fig. 9A shows a schematic diagram of more than two fuse leads on a bar unit, where the fuse leads are not adjacent to each other or located on different sides.
Fig. 9B shows a schematic of a heater corresponding to the design of fig. 9A.
Fig. 10 shows a side view of a bar unit without table nip offset placed over a heating block with a fuse lead placement area.
FIG. 11 shows a side view of a bar unit with a table nip offset placed over a heating block with a fuse lead placement area.
Detailed Description
For a better understanding of the spirit of the present invention, some preferred embodiments of the present invention will be described in detail below.
Directional phrases used in this disclosure, such as, for example, above, below, left side, right side, front, back, side, horizontal, transverse, vertical, and the like, refer only to the directions of the attached drawings. Accordingly, the directional terms used are used for describing and understanding the present invention, and are not used for limiting the present invention.
Various embodiments of the present invention are discussed in detail below. While specific implementations are discussed, it should be understood that these implementations are for illustrative purposes only. One skilled in the relevant art will recognize that other components and configurations may be used without departing from the spirit and scope of the invention.
Fig. 1 shows a top view of a strand unit as is common in the prior art. The strip unit has a chip pad 9 in the middle, and pin leads 1-8 and Tie bars (Tie bar)12, 13 are arranged around the outer perimeter of the chip pad 9. The pad seating region 11 denotes a region for seating a pad in the heating block unit corresponding to the bar unit, which may be formed through a grooving process. Fuse leads 10 connect the chip pad 9 and the pin leads 2 of the pin leads 1-8 to each other to achieve a chip ground function. Preferably, the tie rods 12, 13 are arranged opposite each other.
Fig. 2 shows a partially enlarged side view of the fuse wire 10 connecting the chip pad 9 and the pin lead 2 in fig. 1. In fig. 2, fuse leads 10' connect the chip pad 9' and the pin leads 2' to each other to achieve a chip ground function. As an example, the upper surface of the fuse lead 10 'is at an angle of approximately 45 ° to the upper surface of the die pad 9'. However, the angle may be any acute angle.
Fig. 3 is a side view of the operation of the machine in a normal operation state without a machine pressing offset, which includes: the heating block unit 301, the pressing plate 302 and the strip unit which is normally pressed and does not deviate between the heating block unit 301 and the pressing plate 302 are provided with a pad arranging area 309; the bar unit appears from a side view as a lead 303 located above both sides of the heating block unit 301, a die pad 305 located below within the pad placement region 309, and a fuse lead 304 connecting the die pad 305 and a part of the lead 303; a chip 306 located over the chip pad 305, a bonding wire 307 connecting the chip 306 and the wire 303 to each other, and a first bonding pad 308 and a second bonding pad 308'. In a normal operation state, that is, when there is no material pressing offset of the machine, the fuse lead 304 does not warp or deform, the trace of the ball pressing of the bonding pin is complete, and the operation position of the second bonding point 308' is normal.
In the production process, when wire bonding is performed on the die-bonded strip unit, the strip unit is placed above the heating block, and the pressing plate is used for pressing the strip unit to ensure that the strip unit is tightly jointed with the heating block so as to facilitate the operation, wherein the heating block may comprise one or more heating block units. However, in the actual operation, the following situation generally occurs: firstly, because the material strip unit is thin, the width of the track is larger than that of the material strip unit (the width of the track of the machine table is fixed and cannot be adjusted), the material claw feeds the material strip unit, so that the material strip unit cannot be always parallel to the track, and even if the material strip unit still has small offset through parameter setting of the machine table and regular maintenance; secondly, the light around the welding pin of the machine station recognizes that the black-white ratio has errors, and the black-white ratio can be influenced by burrs on the edge of the pin; thirdly, due to the existence of a large number of simultaneous production tasks, the cutting machine is frequent, and the material pressing offset can also be caused.
In addition, even if the machine station performs secondary material pressing according to the feedback results of all parts, the deviation of the strip unit still occurs when the second pressing plate presses downwards, the maximum value of the deviation distance in the X direction is the shortest distance from the edge of the lead inner pin close to the pad to the edge of the pad in the X direction, and the maximum value in the Y direction is the shortest distance from the edge of the lead inner pin close to the pad to the edge of the pad in the Y direction. The above-mentioned offset may cause the fuse lead to be undesirably contacted to and pressed by the edge of the heating block unit to be deformed or thermally deformed. In addition, in the depth direction, the groove depth of the pad mounting area is shallower than the sinking depth of the chip pad, and under the condition that the bar unit is deviated, the pin will be tilted, thereby affecting the operability of the welding point (especially two welding points connected with the lead).
Fig. 4 is a side view of an operation in an actual production process when a machine swaging deviation occurs and an operation state is abnormal, which includes: the material strip pressing device comprises a heating block unit 401, a pressing plate 402 and a material strip unit, wherein the material strip unit is deviated due to abnormal pressing between the heating block unit 401 and the pressing plate 402, and the heating block unit 401 is provided with a pad arranging area 409; the bar unit appears from a side view as a lead 403 positioned above both sides of the heating block unit 401, a die pad 405 positioned below and within the pad placement region 409, and a fuse lead 404 connecting the die pad 405 and the lead 403; a chip 406 located over the chip pad 405, a bonding wire 407 connecting the chip 406 and the wire 403 to each other, and a first bonding pad 408 and a second bonding pad 408'. In this abnormal operation state, i.e., when the pressing offset of the machine occurs, the fuse lead 404 warps or deforms, the ball pressing track of the bonding pin is incomplete, and the operation position of the second bonding point 408' warps.
FIG. 5 shows a top view of one heating block cell in a heating block commonly employed in the prior art, including a pad placement area 501 for receiving a chip pad; and a pair of tie bar mounting areas 502 and 503 respectively disposed at both sides of the pad mounting area 501 to mount the tie bars in the bar unit, respectively. Preferably, the heating block unit shown in fig. 5 may further include vacuum holes 504 located in the pad seating region 501 to vacuum-adsorb the bar unit. For one embodiment, the vacuum hole 504 may be located at a central position of the pad placement region 501. Preferably, the tie bar seating regions 502 and 503 are located opposite to each other. In fig. 5, since a sufficient design margin is not left at the fuse lead, it will disadvantageously cause the fuse lead to contact with the heating block unit due to the deviation of the bar unit during actual operation, so that the problems of deformation such as warpage or thermal deformation occur and the product performance is affected.
Fig. 6 is a top view of a heating block unit according to the present invention, which includes a pad mounting region 601 for receiving a chip pad; a pair of tie bar mounting areas 602 and 603 respectively disposed at both sides of the pad mounting area 601 to respectively mount tie bars in the bar unit; the fuse lead mounting area 604, which is dedicated to overcome the strip unit offset problem, is used for mounting one or more fuse leads and may be designed to provide sufficient design margin for the fuse leads to prevent the fuse leads from deforming due to contact with the heating block unit. Preferably, the heating block unit shown in fig. 6 may further include a vacuum hole 605 located in the pad placement region 601 to vacuum-adsorb the bar unit. Although fig. 6 shows the fuse lead placement region 604 disposed across the pad placement region edge, the fuse lead placement region 604 may be disposed anywhere in and near the pad placement region. Preferably, the fuse lead seating region 604 may be a reinforced type recess specially designed for the corresponding fuse lead, which is left with a sufficient design margin in both horizontal and vertical directions to effectively prevent the fuse lead from contacting the heating block to be thermally deformed. With the help of fuse lead wire settling area 604, the utility model discloses can provide all-round redundancy to avoid pressing the material skew by the board and lead to fuse lead wire and heating block unit to take place to contact and produce and warp, thereby effectively reduced the negative effects to the first, second solder joint operation nature of product, and promote the product quality comprehensively.
The specific design principle for designing the fuse lead mounting region 604 for the fuse lead is to design a heating block including one or more heating block units according to the material bar units and the fuse lead, wherein the one or more heating block units are in one-to-one correspondence with the material bar units. Wherein, on each heating block unit, there may be arranged:
1) the heating block base has a heating function, and vacuum holes are formed in the pad arrangement area to carry out vacuum adsorption operation on a product;
2) the bonding pad arrangement area is positioned on the heating block base, accommodates the chip bonding pad, and the slotting depth of the bonding pad arrangement area is the vertical distance between the bottom surface of the pin and the bottom surface of the chip bonding pad; the size of the bonding pad is not less than that of the bonding pad arrangement area and not more than that of the area formed by the periphery of the lead inner pin.
3) And a pull rod (Tie bar) mounting area which is positioned on the heating block base and is used for mounting the pull rod (Tie bar).
4) Fuse lead wire arrangement area, it is located the heating block base for arrange fuse lead wire, confirm fuse lead wire arrangement area according to material strip unit and fuse lead wire design, can effectively solve the problem of material strip unit skew when the clamp plate pushes down, and provide sufficient design allowance and make the heating block unit can not take place to contact and heat it with the fuse lead wire, thereby avoid the fuse lead wire to be heated, warp and the operation is unusual.
Fig. 7 shows a top view of a bar unit implemented according to design rules. The top view of the implemented bar unit is shown on the left side of fig. 7, wherein a fuse lead 16 is connected between the lead 13 and the die pad 15, and the fuse lead 16 is partially enlarged and shown on the upper right side of fig. 7. As can be seen from fig. 7, although the fuse lead 16 is shown in an irregular pattern, the fuse lead 16 can be completely received in the region defined by the fuse lead receiving region 17 in both directions X and Y under the constraint of the redundant design rule, thereby preventing thermal deformation due to contact with the heating block unit. A schematic diagram of a design rule according to which the bar unit is implemented is shown in the lower right side of fig. 7, and the fuse lead mounting region 701 is designed to cover the fuse lead 702 having an irregular pattern, thereby providing sufficient design redundancy. To achieve this design redundancy, it is necessary to ensure that the dimensions of the fuse lead mounting region 701 in both the X and Y directions are greater than or equal to the corresponding dimensions of the fuse lead 702 in both the X and Y directions, respectively. For example, if the maximum lateral span of the left and right edges of the fuse wire mounting region 701 is denoted as X and the maximum lateral span of the left-most end to the right-most end of the fuse wire 702 is denoted as a, the fuse wire mounting region 701 may provide additional redundancy measures a1 and a2 compared to the lateral sides of the fuse wire 702, respectively, where a1 denotes the minimum allowable distance of the left edge of the fuse wire mounting region 701 from the left-most end of the fuse wire 702 and a2 denotes the minimum allowable distance of the right edge of the fuse wire mounting region 701 from the right-most end of the fuse wire 702. Similarly, if the maximum longitudinal span of the upper and lower edges of the fuse lead mounting region 701 is denoted as Y and the maximum longitudinal span of the uppermost end to the lowermost end of the fuse lead 702 is denoted as B, the fuse lead mounting region 701 may provide additional redundancy dimensions B1 and B2, respectively, compared to the longitudinal sides of the fuse lead 702, where B1 denotes the minimum allowable distance of the upper edge of the fuse lead mounting region 701 from the uppermost end of the fuse lead 702 and B2 denotes the minimum allowable distance of the lower edge of the fuse lead mounting region 701 from the lowermost end of the fuse lead 702. As another embodiment, the fuse lead seating region 701 may have a vertical direction depth equal to or greater than a groove depth of the heating block cell pad seating region. In some embodiments, the fuse lead seating region 701 may have a vertical depth 10 μm greater than the depth of the notch of the heating block cell pad seating region, thereby providing a space for a fuse lead connection to prevent the fuse lead from warping.
Fig. 8A shows a schematic diagram of more than two fuse leads on a bar unit, where the fuse leads are adjacent to each other and located on the same side. The fuse lead mounting area 801 is located at an edge of one side of the pad mounting area 802, and covers two adjacent fuse leads 803 on the same side. As shown in fig. 8A, the fuse lead mounting region 801 should at least spatially cover the fuse lead 803, i.e., can extend a1, a2, b1, b2 from the outermost ends in the X and Y directions to the maximum of the corresponding sides thereof in the X and Y horizontal directions. Preferably, the fuse lead seating region 801 may have a vertical depth equal to or greater than a depth of the notch of the heating block unit pad seating region 802. In some embodiments, the fuse lead seating region 801 may have a vertical depth 10 μm greater than the depth of the notch of the heat block cell pad seating region 802, thereby providing space for fuse lead connections to prevent buckling of the fuse leads.
Fig. 8B shows a schematic diagram of a heater corresponding to the design of fig. 8A. As shown in fig. 8B, the fuse lead mounting area 804 may accommodate more than two fuse leads that are adjacent to each other and located on the same side. At this time, the fuse lead mounting regions 804 may be designed by considering the fuse leads as a whole.
Fig. 9A shows a schematic diagram of more than two fuse leads on a bar unit, where the fuse leads are not adjacent to each other or located on different sides. As shown in fig. 9A, within the pad placement region 902, a first fuse lead placement region 901 spatially encapsulates at least a first fuse lead 903 corresponding thereto, and a second fuse lead placement region 904 spatially encapsulates at least a second fuse lead 905 corresponding thereto. For example, to achieve the above-described cladding effect, the lateral dimension X of the first fuse wire seating region 901 may extend a1, a2 from both sides at a maximum compared to the lateral dimension a of the first fuse wire 903, and the longitudinal dimension Y of the first fuse wire seating region 901 may extend B1, B2 from both sides at a maximum compared to the longitudinal dimension B of the first fuse wire 903. Similarly, the lateral dimension X 'of the second fuse lead mounting region 904 may extend a1', a2 'from both sides at a maximum as compared to the lateral dimension a' of the first fuse lead 903, and the longitudinal dimension Y 'of the second fuse lead mounting region 904 may extend B1', B2 'from both sides at a maximum as compared to the longitudinal dimension B' of the first fuse lead 903. Preferably, the fuse lead mounting regions 901, 904 may have a vertical depth equal to or greater than the depth of the slot of the heating block unit pad mounting region 902. In some embodiments, the fuse lead mounting regions 901, 904 may be 10 μm deeper vertically than the heater block cell pad mounting region 902, thereby providing room for fuse lead connections to prevent buckling of the fuse leads.
Fig. 9B shows a schematic of a heater corresponding to the design of fig. 9A. As shown in fig. 9B, the fuse lead mounting area 906 accommodates two fuse leads that are not adjacent on the same side. However, more than two fuse leads may also be located on different sides. When more than two fuse leads exist in the material strip unit and the fuse leads are not adjacent or located on different sides, the fuse lead arrangement area can be independently designed for each fuse lead.
Fig. 10 shows a side view of a bar unit without table swage bias placed over a heating block with fuse lead placement area, including, inter alia, fuse lead placement area 1007. As shown in fig. 10, in an ideal case, the center of the bar unit is coincident with the center of the heating block (i.e., the section B-B') so that there is no relative machine pressing offset, and thus the fuse lead 1004 is not thermally deformed by contacting the heating block unit 1001.
In contrast, fig. 11 shows a side view of a bar unit with a machine press bias placed over a heating block with a fuse wire placement area 1107, among other things. As shown in fig. 11, in this practical situation, the center of the strip unit (i.e., the section C-C ') and the center of the heating block (i.e., the section B-B') are shifted, so that there is a relative machine pressing shift. However, even so, since the heating block has the fuse lead seating region 1107, it is possible to provide a sufficient accommodation space in the horizontal and/or vertical direction, thereby preventing the fuse lead 1104 from being thermally deformed by contacting the heating block unit 1101, thereby significantly improving the product quality.
The technical content and the technical features of the present invention have been described in the above related embodiments, however, the above embodiments are only examples for implementing the present invention. Those skilled in the art may make various alterations and modifications based on the teachings and disclosure of this invention without departing from the spirit of this invention. Accordingly, the disclosed embodiments do not limit the scope of the invention. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (14)
1. A heating block cell comprising a recess, the recess comprising a bottom and a sidewall, the recess comprising:
a pad placement region; and
two pull rod mounting areas which are respectively arranged at two sides of the bonding pad mounting area;
wherein the heating block cell further includes one or more fuse lead mounting areas disposed across the bottom and the sidewall.
2. A heat block unit as claimed in claim 1, further comprising vacuum holes located within the pad placement region.
3. The heater block cell of claim 1, wherein the two tie bar seating regions are disposed opposite one another.
4. The heating block cell of claim 1, wherein the plurality of fuse lead mounting areas are located on opposite sides of the fuse lead mounting area.
5. The heating block cell of claim 1, wherein the plurality of fuse lead mounting areas are located on the same side as the fuse lead mounting areas.
6. The heating block cell of claim 5, wherein the plurality of fuse lead mounting areas are adjacent or non-adjacent to each other.
7. The heat block cell of claim 1, wherein a vertical direction depth of the one or more fuse lead mounting areas is greater than or equal to a kerf depth of the pad mounting area.
8. The heat block cell of claim 7, wherein a vertical direction depth of the one or more fuse lead mounting regions is 10 μ ι η greater than a trench depth of the pad mounting region.
9. A heating device comprising a recess, the recess comprising a bottom and a sidewall, the recess comprising:
a pad placement region; and
two pull rod mounting areas which are respectively arranged at two sides of the bonding pad mounting area;
wherein the heating device further comprises one or more fuse lead placement regions having a dimension in a first direction greater than a maximum allowable object offset distance in the first direction and a dimension in a second direction greater than a maximum allowable object offset distance in the second direction.
10. The heating device of claim 9, wherein the plurality of fuse lead mounting areas are located on opposite sides of the fuse lead mounting area.
11. The heating device of claim 9, wherein the plurality of fuse lead placement regions are located on a same side of the fuse lead placement regions.
12. The heating device of claim 11, wherein the plurality of fuse lead placement regions are adjacent or non-adjacent to each other.
13. The heating device of claim 9, wherein a vertical direction depth of the one or more fuse lead mounting areas is greater than or equal to a kerf depth of the pad mounting area.
14. The heating device of claim 13, wherein a vertical direction depth of the one or more fuse lead mounting regions is 10 μ ι η greater than a trench depth of the pad mounting region.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922003929.0U CN210866147U (en) | 2019-11-19 | 2019-11-19 | Heating block unit and heating device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922003929.0U CN210866147U (en) | 2019-11-19 | 2019-11-19 | Heating block unit and heating device |
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| CN210866147U true CN210866147U (en) | 2020-06-26 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931420A (en) * | 2019-11-19 | 2020-03-27 | 苏州日月新半导体有限公司 | Heating block unit and heating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110931420A (en) * | 2019-11-19 | 2020-03-27 | 苏州日月新半导体有限公司 | Heating block unit and heating device |
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Address after: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee after: Riyuexin semiconductor (Suzhou) Co.,Ltd. Address before: No. 188, Suhong West Road, Suzhou Industrial Park, Suzhou, Jiangsu Province Patentee before: SUZHOU ASEN SEMICONDUCTORS Co.,Ltd. |