CN106535510A - Method for producing rigid-flex PCB lid - Google Patents
Method for producing rigid-flex PCB lid Download PDFInfo
- Publication number
- CN106535510A CN106535510A CN201611022539.2A CN201611022539A CN106535510A CN 106535510 A CN106535510 A CN 106535510A CN 201611022539 A CN201611022539 A CN 201611022539A CN 106535510 A CN106535510 A CN 106535510A
- Authority
- CN
- China
- Prior art keywords
- base material
- rigid
- laminating
- property base
- lid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a method for producing a rigid-flex PCB lid. The method comprises material cutting, flexible material treatment, rigid material treatment, integration, a shadow/copper plating, an outer layer, and punching and lid removing. According to the method for producing a rigid-flex PCB lid, an internal-layer circuit is produced in the rigid-flex PCB, anti-etching ink is not required to be printed after a coverage film is pressed. The flexible board, the rigid board and the pure copper foil can be combined at one time to complete the combination. The pure copper foil cannot be cracked when pressed. The method reduces production process and reduces production cost.
Description
Technical field
The invention belongs to the making field of rigid-flexible combined circuit board, and in particular to a kind of rigid-flex combined board takes off the making side of lid
Method.
Background technology
Rigid-flexible combined circuit board is constituted by rigidity and flexible substrate are selectively laminated together, with the empty shape that metallizes
Into conductive communication.This wiring board includes rigid plate and flexible plate technique simultaneously, provides for the complicated electronic system of interconnection
Outstanding method, reduces product weight and installation work-hour, great reduces cost.
Rigid-flexible combined circuit board makes more difficult, since it is desired that there is the cooperation of different substrate material, is related to size steady
Qualitative, internal layer soft board opens a window the protection in area, and the reliability of the positioning that will keep of each layer and plated-through-hole.
The content of the invention
To reduce Making programme, reduce production cost, in solving the problems, such as to produce rigid-flex board it is endosmosis enter medicinal liquid, the present invention carries
The manufacture method for having supplied a kind of rigid-flex combined board to take off lid.Concrete scheme of the invention is as follows for achieving the above object：
The manufacture method that a kind of rigid-flex combined board takes off lid, it is characterised in that comprise the following steps：
Sawing sheet：Sheet material will be cut into respectively will around property base material, coverlay, rigid substrate, pure glue, Copper Foil；
Around property base material treatment, comprise the following steps：
Drilling：After property base material sawing sheet, through hole is got out on product using rig；
Copper facing：Last layer copper is plated in the through hole of property base material, makes to turn on around property base material levels；
Internal layer circuit：Figure after property base material copper facing, needed for producing on property base material；
AOI：Opposing connection base material carries out AOI inspections；
Cutting：Coverlay is cut into into the shape of design；
Laminating：What figure was produced in the coverlay laminating of cutting forming or be pressed together on takes off cover region around property base material；
Punching：Edges of boards location hole is gone out, in case lamination, secondary drilling positioning is used；
Plasma：Cleaning plate face and remove hole endogenous cause of ill and drill the glue residue to be formed；
Rigid substrate process, comprises the following steps：
Etching：Rigid substrate after sawing sheet is etched, and forms circuit；
Laminating：Form rigid substrate and pure glue laminating after circuit；
Laser incising：Rigid substrate after laminating and pure glue are cut out into the shape of design；
Laminating：Copper Foil after sawing sheet and pure glue laminating；
Laser incising：Rigid substrate after laminating and pure glue are cut out into the shape of design；
Integrate：After by process around property base material and process after rigid substrate carry out lamination, pressing, punching, secondary drilling,
Cutting edge, plasma treatment；
Shadow/copper facing：The uniform copper of last layer is plated in hole, each layer connection is made；
Outer-layer circuit：Figure after copper facing, needed for producing in plate face；
Take off lid：After completing outer-layer circuit, it is punched out using mould, the rigid plate for taking off cover region is removed complete and takes off lid.
A kind of rigid-flex combined board that the present invention is provided is taken off the manufacture method of lid and is made than conventional uncovering method, has following
Several advantages：
1st, flex plate is finishing internal layer circuit, need not print anti-etching printing ink after pressing coverlay.
2nd, flex plate, rigid plate, pure copper foil can disposably complete combination.
3rd, flex plate, rigid plate, pure copper foil combination is completed, and during pressing, pure copper foil will not be by pressure break.
Description of the drawings
Accompanying drawing described herein is used for providing a further understanding of the present invention, constitutes the part of the application, not
Inappropriate limitation of the present invention is constituted, in the accompanying drawings：
Fig. 1 is schematic flow sheet of the present invention；
Fig. 2 is semi-finished product structure schematic diagram after present invention integration；
Fig. 3 is finished product structure schematic diagram of the present invention.
Specific embodiment
Describe the present invention, the illustrative examples of the here present invention below in conjunction with accompanying drawing and specific embodiment in detail
And explanation is for explaining the present invention but not as a limitation of the invention.
Embodiment
As shown in figure 1, the manufacture method that a kind of rigid-flex combined board takes off lid, it is characterised in that comprise the following steps：
Sawing sheet：Sheet material will be cut into respectively will around property base material, coverlay, rigid substrate, pure glue, Copper Foil；
Around property base material treatment, comprise the following steps：
Drilling：After property base material sawing sheet, through hole is got out on product using rig；
Copper facing：Last layer copper is plated in the through hole of property base material, makes to turn on around property base material levels；
Internal layer circuit：Figure after property base material copper facing, needed for producing on property base material；
AOI：Opposing connection base material carries out AOI inspections；
Cutting：Coverlay is cut into into the shape of design；
Laminating：What figure was produced in the coverlay laminating of cutting forming or be pressed together on takes off cover region around property base material；
Punching：Edges of boards location hole is gone out, in case lamination, secondary drilling positioning is used；
Plasma：Cleaning plate face and remove hole endogenous cause of ill and drill the glue residue to be formed；
Rigid substrate process, comprises the following steps：
Etching：Rigid substrate after sawing sheet is etched, and forms circuit；
Laminating：Form rigid substrate and pure glue laminating after circuit；
Laser incising：Rigid substrate after laminating and pure glue are cut out into the shape of design；
Laminating：Copper Foil after sawing sheet and pure glue laminating；
Laser incising：Rigid substrate after laminating and pure glue are cut out into the shape of design；
Integrate：After by process around property base material and process after rigid substrate carry out lamination, pressing, punching, secondary drilling,
Cutting edge, plasma treatment；
Shadow/copper facing：The uniform copper of last layer is plated in hole, each layer connection is made；
Outer-layer circuit：Figure after copper facing, needed for producing in plate face；
Take off lid：After completing outer-layer circuit, (half rushes, and the edge of a knife is only flushed to PET positions) is punched out using mould, will take off cover region
Rigid plate remove and take off lid, as shown in Figure 3.
The firm manufacture method for taking off lid around board that above-described embodiment scheme is provided, has rigidity under the outer copper foil for taking off cover region
Plate is supported, and will not be ruptured during pressing；After pressing, take off cover area and form a sealing space, therefore medicinal liquid is not had in rear processing procedure
Penetrate into
The technical scheme for being provided to the embodiment of the present invention above is described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are set forth, the explanation of above example is only applicable to help and understands this
The principle of inventive embodiments；Simultaneously for one of ordinary skill in the art, according to the embodiment of the present invention, in specific embodiment party
Will change in formula and range of application, in sum, this specification content should not be construed as limiting the invention.
Claims (3)
1. the manufacture method that a kind of rigid-flex combined board takes off lid, it is characterised in that comprise the following steps：
Sawing sheet：Sheet material will be cut into respectively will around property base material, coverlay, rigid substrate, pure glue, Copper Foil；
Around property base material treatment, comprise the following steps：
Drilling：After property base material sawing sheet, through hole is got out on product using rig；
Copper facing：Last layer copper is plated in the through hole of property base material, makes to turn on around property base material levels；
Internal layer circuit：Figure after property base material copper facing, needed for producing on property base material；
AOI：Opposing connection base material carries out AOI inspections；
Cutting：Coverlay is cut into into the shape of design；
Laminating：What figure was produced in the coverlay laminating of cutting forming or be pressed together on takes off cover region around property base material；
Punching：Edges of boards location hole is gone out, in case lamination, secondary drilling positioning is used；
Plasma：Cleaning plate face and remove hole endogenous cause of ill and drill the glue residue to be formed；
Rigid substrate process, comprises the following steps：
Etching：Rigid substrate after sawing sheet is etched, and forms circuit；
Laminating：Form rigid substrate and pure glue laminating after circuit；
Laser incising：Rigid substrate after laminating and pure glue are cut out into the shape of design；
Laminating：Copper Foil after sawing sheet and pure glue laminating；
Laser incising：Rigid substrate after laminating and pure glue are cut out into the shape of design；
Integrate：The rigid substrate after property base material and process after by process carries out lamination, pressing, punching, secondary drilling, sanction
Side, plasma treatment；
Shadow/copper facing：The uniform copper of last layer is plated in hole, each layer connection is made；
Outer-layer circuit：Figure after copper facing, needed for producing in plate face；
Take off lid：After completing outer-layer circuit, it is punched out using mould, the rigid plate for taking off cover region is removed complete and takes off lid.
2. the manufacture method that rigid-flex combined board as claimed in claim 1 takes off lid, it is characterised in that：
The coverlay is PET material.
3. the manufacture method that rigid-flex combined board as claimed in claim 1 takes off lid, it is characterised in that：
The covering film thickness is 20-50um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611022539.2A CN106535510A (en) | 2016-11-15 | 2016-11-15 | Method for producing rigid-flex PCB lid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611022539.2A CN106535510A (en) | 2016-11-15 | 2016-11-15 | Method for producing rigid-flex PCB lid |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106535510A true CN106535510A (en) | 2017-03-22 |
Family
ID=58352538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611022539.2A Pending CN106535510A (en) | 2016-11-15 | 2016-11-15 | Method for producing rigid-flex PCB lid |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535510A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107548237A (en) * | 2017-08-28 | 2018-01-05 | 苏州福莱盈电子有限公司 | A kind of FPC multi-layer sheet takes off lid resigning production technology |
| CN108012464A (en) * | 2017-11-28 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | The production method of rigid-flex combined board |
| CN108207078A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN109843001A (en) * | 2019-04-09 | 2019-06-04 | 苏州维信电子有限公司 | A kind of production method of Rigid Flex |
| WO2019184439A1 (en) * | 2018-03-30 | 2019-10-03 | 惠州市金百泽电路科技有限公司 | Ultra-thick 5g antenna pcb module processing method |
| CN112911837A (en) * | 2021-01-21 | 2021-06-04 | 盐城维信电子有限公司 | Synchronous processing method for inner layer and outer layer of flexible circuit board |
| CN113301737A (en) * | 2021-05-25 | 2021-08-24 | 深圳市三维电路科技有限公司 | Processing method of inner layer resistance welding of multilayer rigid-flex board |
| CN114423185A (en) * | 2022-01-07 | 2022-04-29 | 黄石西普电子科技有限公司 | Four-layer HDI board manufacturing method based on laser reverse cutting |
| CN114786370A (en) * | 2022-04-25 | 2022-07-22 | 黄石西普电子科技有限公司 | Manufacturing method of six-layer rigid-flex board |
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| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Fabrication method for rigid-flex printed combination board of covering membrane window |
| CN106102351A (en) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of manufacture method of coverlay protection electromagnetic shielding film rigid-flex combined board |
-
2016
- 2016-11-15 CN CN201611022539.2A patent/CN106535510A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103384444A (en) * | 2013-07-30 | 2013-11-06 | 博敏电子股份有限公司 | Rigid-flex printed circuit board capable of protecting inner layer windowing area and production method thereof |
| CN103648240A (en) * | 2013-12-19 | 2014-03-19 | 博敏电子股份有限公司 | Method for manufacturing symmetrical rigid-flexible printed circuit board |
| CN104135823A (en) * | 2014-07-14 | 2014-11-05 | 东莞市五株电子科技有限公司 | Fabrication method for rigid-flex printed combination board of covering membrane window |
| CN106102351A (en) * | 2016-07-05 | 2016-11-09 | 惠州市金百泽电路科技有限公司 | A kind of manufacture method of coverlay protection electromagnetic shielding film rigid-flex combined board |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107548237A (en) * | 2017-08-28 | 2018-01-05 | 苏州福莱盈电子有限公司 | A kind of FPC multi-layer sheet takes off lid resigning production technology |
| CN108012464A (en) * | 2017-11-28 | 2018-05-08 | 广州兴森快捷电路科技有限公司 | The production method of rigid-flex combined board |
| CN108207078A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
| CN108323039A (en) * | 2018-01-26 | 2018-07-24 | 景旺电子科技(龙川)有限公司 | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed |
| WO2019184439A1 (en) * | 2018-03-30 | 2019-10-03 | 惠州市金百泽电路科技有限公司 | Ultra-thick 5g antenna pcb module processing method |
| CN109760122A (en) * | 2018-12-24 | 2019-05-17 | 江苏弘信华印电路科技有限公司 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
| CN109843001A (en) * | 2019-04-09 | 2019-06-04 | 苏州维信电子有限公司 | A kind of production method of Rigid Flex |
| CN112911837A (en) * | 2021-01-21 | 2021-06-04 | 盐城维信电子有限公司 | Synchronous processing method for inner layer and outer layer of flexible circuit board |
| CN112911837B (en) * | 2021-01-21 | 2023-03-24 | 盐城维信电子有限公司 | Synchronous processing method for inner layer and outer layer of flexible circuit board |
| CN113301737A (en) * | 2021-05-25 | 2021-08-24 | 深圳市三维电路科技有限公司 | Processing method of inner layer resistance welding of multilayer rigid-flex board |
| CN114423185A (en) * | 2022-01-07 | 2022-04-29 | 黄石西普电子科技有限公司 | Four-layer HDI board manufacturing method based on laser reverse cutting |
| CN114423185B (en) * | 2022-01-07 | 2024-03-22 | 黄石西普电子科技有限公司 | Four-layer HDI board manufacturing method based on laser back cutting |
| CN114786370A (en) * | 2022-04-25 | 2022-07-22 | 黄石西普电子科技有限公司 | Manufacturing method of six-layer rigid-flex board |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170322 |
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| RJ01 | Rejection of invention patent application after publication |