TW201902314A - Method for manufacturing rigid-flex printed circuit board - Google Patents
Method for manufacturing rigid-flex printed circuit board Download PDFInfo
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- TW201902314A TW201902314A TW106123535A TW106123535A TW201902314A TW 201902314 A TW201902314 A TW 201902314A TW 106123535 A TW106123535 A TW 106123535A TW 106123535 A TW106123535 A TW 106123535A TW 201902314 A TW201902314 A TW 201902314A
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- flexible
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- circuit board
- hard
- rigid
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
本發明涉及一種軟硬結合電路板的製造方法。The invention relates to a method for manufacturing a soft-hard circuit board.
軟硬結合電路板是相對一般的硬性電路板和柔性電路板的結合設計，軟硬結合電路板具有薄、輕、易組裝、電氣信號傳輸穩定性高、產品信賴度高等優點。但是，由於技術複雜、價格偏高的原因，軟硬結合電路板主要用於軍事、醫療等高單價、高品質、小用量的高階電路板中。隨著中高階消費性電子產品對於品質和輕薄短小的要求日趨嚴苛，軟硬結合電路板在消費性電子產品中的應用比例也日漸增加。The soft-hard circuit board is a combination design of a general rigid circuit board and a flexible circuit board. The soft-hard circuit board has the advantages of thinness, lightness, easy assembly, high stability of electrical signal transmission, and high product reliability. However, due to technical complexity and high price, the combination of soft and hard circuit boards is mainly used in military, medical and other high-order circuit boards with high unit price, high quality and small amount. With the increasingly stringent requirements for quality, lightness, thinness, and shortness of mid-to-high-end consumer electronics products, the application ratio of soft-hard circuit boards to consumer electronics products is increasing.
在習知的製造軟硬結合電路板的方法中，為了保護軟硬結合電路板的開窗區域，通常需要先在需要開窗區域貼設保護膜，在後續程式中再手動去掉保護膜，因此，需要大量的人力進行貼設保護膜和去掉保護膜的工序，導致軟硬結合電路板的生產效率低。In the conventional method for manufacturing a flexible-hard circuit board, in order to protect the window area of the flexible-hard circuit board, it is usually necessary to first place a protective film on the window-opening area, and then manually remove the protective film in subsequent programs, so It requires a lot of manpower to carry out the process of attaching the protective film and removing the protective film, which results in low production efficiency of the soft-hard circuit board.
因此，如何提高軟硬結合電路板的生產效率是目前亟待解決的問題。Therefore, how to improve the production efficiency of the soft-hard combined circuit board is an urgent problem to be solved at present.
有鑑於此，本發明提供一種軟硬結合電路板的製造方法，以解決軟硬結合電路板的生產效率低的技術問題。In view of this, the present invention provides a method for manufacturing a flexible-hard circuit board to solve the technical problem of low production efficiency of a flexible-hard circuit board.
一種軟硬結合電路板的製造方法，包括： 提供一柔性電路板； 在柔性電路板兩側對稱位置印刷柔性絕緣基材，得到柔性預製板； 提供兩個硬性絕緣基材，在所述兩個硬性絕緣基材上均形成第一預切區，第一預切區的寬度小於柔性絕緣基材的寬度； 提供兩個銅箔，在兩個銅箔上均形成第二預切區，第二預切區的寬度等於第一預切區的寬度； 熱壓所述柔性預製板、兩個硬性絕緣基材和兩個銅箔，形成軟硬結合基板，所述柔性預製板、兩個硬性絕緣基材和兩個銅箔的自下而上的排列順序為：銅箔、硬性絕緣基材、柔性預製板、硬性絕緣基材和銅箔，第一預切區和第二預切區重疊設置形成開口，部分柔性絕緣基材暴露於開口； 在軟硬結合基板上設置至少一個開孔，並採用黑影製程對所述開孔進行修整，同時在柔性絕緣基材表面形成碳殘留層； 在軟硬結合基板的開孔的內壁，開口的內壁和柔性絕緣基材的碳殘留層上電鍍銅層； 蝕刻軟硬結合基板的銅箔、開口內銅層和柔性絕緣基材上的銅層，在軟硬結合基板的銅箔形成圖案化的電路結構，形成硬板區域； 蝕刻掉碳殘留層和部分柔性絕緣基材，形成軟板區域；以及 在硬板區域上設置防焊層，形成所述軟硬結合電路板。A method for manufacturing a soft-hard combined circuit board includes: providing a flexible circuit board; printing a flexible insulating substrate on symmetrical sides of the flexible circuit board to obtain a flexible prefabricated board; providing two rigid insulating substrates on the two A first pre-cut region is formed on the rigid insulating substrate, and the width of the first pre-cut region is smaller than that of the flexible insulating substrate; two copper foils are provided, and a second pre-cut region is formed on both copper foils, and the second The width of the pre-cut area is equal to the width of the first pre-cut area; the flexible pre-fabricated board, two rigid insulating substrates, and two copper foils are hot-pressed to form a soft-hard substrate, and the flexible pre-fabricated board and two rigid insulation The bottom-up arrangement of the substrate and the two copper foils is: copper foil, rigid insulating substrate, flexible pre-fabricated board, rigid insulating substrate, and copper foil. The first pre-cut area and the second pre-cut area are overlapped and formed. Opening, part of the flexible insulating substrate is exposed to the opening; at least one opening is provided on the flexible and hard substrate, and the opening is trimmed using a black shadow process, while a carbon residual layer is formed on the surface of the flexible insulating substrate; Induration The inner wall of the opening of the substrate, the inner wall of the opening and the carbon residue layer of the flexible insulating substrate are electroplated with a copper layer; the copper foil for etching the flexible and rigid substrate, the copper layer in the opening and the copper layer on the flexible insulating substrate, Forming a patterned circuit structure on the copper foil of the flexible and hard substrate to form a hard board area; etching away the carbon residual layer and a part of the flexible insulating substrate to form a soft board area; and providing a solder resist layer on the hard board area to form a hard board area The soft-hard circuit board is described.
進一步的，所述“在柔性電路板兩側對稱位置印刷柔性絕緣基材，得到柔性預製板”包括： 在柔性電路板的上表面和下表面對稱位置印刷液態柔性材料；以及 烘烤所述液態柔性材料形成柔性絕緣基材，從而得到柔性預製板。Further, the "printing a flexible insulating substrate at symmetrical positions on both sides of the flexible circuit board to obtain a flexible prefabricated board" includes: printing a liquid flexible material at symmetrical positions on the upper and lower surfaces of the flexible circuit board; and baking the liquid The flexible material forms a flexible insulating substrate, thereby obtaining a flexible prefabricated board.
進一步的，所述柔性絕緣基材的厚度大於12微米。Further, the thickness of the flexible insulating substrate is greater than 12 microns.
進一步的，在熱壓完成後，所述硬性絕緣基材包括黏合區，內埋區和流膠區，所述黏合區位於所述柔性電路板與銅箔之間，所述內埋區位於所述柔性絕緣基材與銅箔之間，所述流膠區位於柔性絕緣基材上。Further, after the hot pressing is completed, the rigid insulating substrate includes an adhesive region, an embedded region, and a flow-through region. The adhesive region is located between the flexible circuit board and the copper foil, and the embedded region is located in the substrate. Between the flexible insulating substrate and the copper foil, the glue flow area is located on the flexible insulating substrate.
進一步的，所述柔性絕緣基材包括第一部分、第二部分和第三部分，所述第一部分暴露於所述開口，所述第二部分被所述流膠區覆蓋，所述第三部分被內埋區覆蓋。Further, the flexible insulating substrate includes a first portion, a second portion, and a third portion, the first portion is exposed to the opening, the second portion is covered by the flow-through region, and the third portion is covered by The buried area is covered.
進一步的，所述第二部分的寬度小於0.6毫米。Further, the width of the second portion is less than 0.6 mm.
進一步的，所述第三部分的寬度大於0.5毫米。Further, the width of the third portion is greater than 0.5 mm.
進一步的，被蝕刻掉的柔性絕緣基材的深度為大於2微米。Further, the depth of the etched flexible insulating substrate is greater than 2 microns.
進一步的，所述軟硬結合電路板的製造方法還包括在軟板區域的柔性絕緣基材上開設至少一個過孔。Further, the method for manufacturing a flexible-hard combined circuit board further includes opening at least one via hole in the flexible insulating substrate in the area of the flexible board.
本發明採用在硬性絕緣基材和銅箔上預先設置預切區，進一步採用黑影製程在修整開孔的同時在柔性絕緣基材表面形成碳殘留層，後續再通過蝕刻的方式去掉碳殘留層從而形成軟板區域，因此，有效的避免了人工貼設保護膜和去掉保護膜的過程，因此，提高了軟硬結合電路板的生產效率。In the present invention, a pre-cut area is set in advance on a rigid insulating substrate and copper foil, and a black shadow process is used to form a carbon residual layer on the surface of the flexible insulating substrate while trimming the openings, and then the carbon residual layer is removed by etching. The area of the flexible board is formed. Therefore, the process of manually attaching the protective film and removing the protective film is effectively avoided. Therefore, the production efficiency of the rigid-flex circuit board is improved.
下面將結合本發明實施方式中的附圖，對本發明實施方式中的技術方案進行清楚、完整地描述，顯然，所描述的實施方式僅僅是本發明一部分實施方式，而不是全部的實施方式。In the following, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of them.
基於本發明中的實施方式，本領域普通技術人員在沒有做出創造性勞動前提下所獲得的所有其他實施方式，都屬於本發明保護的範圍。Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without making creative efforts fall within the protection scope of the present invention.
本文所使用的所有的技術和科學術語與屬於本發明的技術領域的技術人員通常理解的含義相同。本文中在本發明的說明書中所使用的術語只是為了描述具體的實施方式的目的，不是旨在於限制本發明。All technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the invention. The terms used herein in the description of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.
本發明提供一種軟硬結合電路板100的製造方法，包括： 提供一柔性電路板10； 在柔性電路板10兩側對稱位置印刷柔性絕緣基材20，得到柔性預製板30； 提供兩個硬性絕緣基材40，在所述兩個硬性絕緣基材40上均形成第一預切區41，第一預切區41的寬度C2小於柔性絕緣基材20的寬度C1； 提供兩個銅箔50，在兩個銅箔50上均形成第二預切區51，第二預切區51的寬度C3等於第一預切區41的寬度C2； 熱壓所述柔性預製板30、兩個硬性絕緣基材40和兩個銅箔50，形成軟硬結合基板60，在熱壓過程中，柔性預製板30、兩個硬性絕緣基材40和兩個銅箔50的自下而上的排列順序為：銅箔50、硬性絕緣基材40、柔性預製板30、硬性絕緣基材40和銅箔50，第一預切區41和第二預切區51重疊設置形成開口61，部分柔性絕緣基材20暴露於開口61； 在軟硬結合基板60上設置至少一個開孔，並採用黑影製程對所述開孔進行修整，同時在柔性絕緣基材20表面形成碳殘留層64； 在軟硬結合基板60的開孔的內壁，開口61的內壁61a和柔性絕緣基材20的碳殘留層64上電鍍銅層70； 蝕刻軟硬結合基板60的銅箔50、開口61內銅層70和柔性絕緣基材20上的銅層70，在軟硬結合基板60的銅箔50形成圖案化的電路結構52，形成硬板區域81； 蝕刻掉碳殘留層64和部分柔性絕緣基材20，形成軟板區域82；以及 在硬板區域81上設置防焊層90。The invention provides a method for manufacturing a flexible-hard circuit board 100, which includes: providing a flexible circuit board 10; printing a flexible insulating substrate 20 on symmetrical sides of the flexible circuit board 10 to obtain a flexible prefabricated board 30; and providing two rigid insulations. A substrate 40 having a first pre-cut region 41 formed on the two rigid insulating substrates 40, and a width C2 of the first pre-cut region 41 is smaller than a width C1 of the flexible insulating substrate 20; two copper foils 50 are provided, A second pre-cut area 51 is formed on both copper foils 50, and the width C3 of the second pre-cut area 51 is equal to the width C2 of the first pre-cut area 41; the flexible prefabricated board 30, two rigid insulating substrates are hot-pressed The material 40 and the two copper foils 50 form a flexible and rigid bonded substrate 60. During the hot pressing process, the bottom-up arrangement order of the flexible prefabricated board 30, the two rigid insulating substrates 40, and the two copper foils 50 is: The copper foil 50, the rigid insulating substrate 40, the flexible prefabricated board 30, the rigid insulating substrate 40, and the copper foil 50. The first pre-cut region 41 and the second pre-cut region 51 are overlapped to form an opening 61, and a part of the flexible insulating substrate 20 is exposed. At the opening 61; at least one opening is provided on the soft-hard substrate 60, and black The manufacturing process trims the openings and forms a carbon residual layer 64 on the surface of the flexible insulating substrate 20 at the same time; the inner walls of the openings of the flexible and rigid substrate 60, the inner walls 61a of the openings 61 and the carbon of the flexible insulating substrate 20 The copper layer 70 is electroplated on the residual layer 64; the copper foil 50 of the flexible and rigid substrate 60, the copper layer 70 in the opening 61 and the copper layer 70 on the flexible insulating substrate 20 are etched, and a pattern is formed on the copper foil 50 of the flexible and rigid substrate 60 The circuit structure 52 is formed to form a hard board region 81; the carbon residual layer 64 and a part of the flexible insulating substrate 20 are etched to form a soft board region 82; and a solder resist layer 90 is provided on the hard board region 81.
請參閱圖1，圖1為本發明所提供的軟硬結合電路板的製造方法的柔性電路板100的示意圖。Please refer to FIG. 1, which is a schematic diagram of a flexible circuit board 100 of a method for manufacturing a flexible-hard circuit board provided by the present invention.
進一步的，所述“提供一柔性電路板10”可以包括： 提供一柔性絕緣板材111； 在柔性絕緣板材111上設置通孔112、盲孔113；以及 在所述柔性絕緣板材111的上、下表面111a、111b及通孔112、盲孔113內設置電路結構114。Further, the “providing a flexible circuit board 10” may include: providing a flexible insulating plate 111; providing a through hole 112 and a blind hole 113 on the flexible insulating plate 111; and upper and lower portions of the flexible insulating plate 111 Circuit structures 114 are disposed in the surfaces 111a, 111b, the through holes 112, and the blind holes 113.
所述“提供一柔性絕緣板材111”可以為塗布液態第一柔性材料，經過烘烤、裁切等工藝，形成柔性絕緣板材111。所述第一柔性材料可以採用聚醯亞胺(polyimide，PI)、聚對苯二甲酸乙二醇酯（Polyethylene Terephthalate，PET）或聚萘二甲酸乙二醇酯（Polyethylene Naphthalate，PEN）、聚乙烯（polyethylene，PE）、特氟龍（Teflon）、液晶高分子聚合物（liquid crystal polymer，LCP）、聚氯乙烯(polyvinyl chloride polymer，PVC)等材料中的一種。The “providing a flexible insulating plate 111” may be a coating of a liquid first flexible material, and the flexible insulating plate 111 is formed through processes such as baking and cutting. The first flexible material may be polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyethylene naphthalate. One of materials such as polyethylene (PE), Teflon, liquid crystal polymer (LCP), and polyvinyl chloride polymer (PVC).
所述“在柔性絕緣板材111上設置通孔112、盲孔113”可以採用機械打孔、鐳射打孔等形成通孔112、盲孔113。The “setting of the through hole 112 and the blind hole 113 on the flexible insulating plate 111” may form the through hole 112 and the blind hole 113 by mechanical drilling, laser drilling, or the like.
所述“在所述柔性絕緣板材111的上、下表面111a、111b及通孔112、盲孔113內設置電路結構114”可以為採用黑影製程對通孔112、盲孔113進行修整，再進行電鍍銅層、蝕刻等工藝，從而在通孔112、盲孔113內和柔性絕緣板材111的上、下表面111a、111b形成電路結構114。The "setting of the circuit structure 114 in the upper and lower surfaces 111a and 111b of the flexible insulating sheet 111, the through hole 112, and the blind hole 113" may be a process of trimming the through hole 112 and the blind hole 113 using a shadow process, and then Processes such as copper plating and etching are performed to form circuit structures 114 in the through holes 112, the blind holes 113, and the upper and lower surfaces 111a and 111b of the flexible insulating plate 111.
請參閱圖2，圖2為本發明所提供的軟硬結合電路板的製造方法的柔性預製板30的示意圖。Please refer to FIG. 2, which is a schematic diagram of a flexible prefabricated board 30 of a method for manufacturing a flexible-hard combined circuit board provided by the present invention.
進一步的，所述“在柔性電路板10兩側對稱位置印刷柔性絕緣基材20，得到柔性預製板30”可以包括： 在柔性電路板10的上表面10a和下表面10b對稱位置印刷液態第二柔性材料；以及 烘烤所述液態第二柔性材料形成柔性絕緣基材20，從而得到柔性預製板30。Further, the “printing the flexible insulating substrate 20 at symmetrical positions on both sides of the flexible circuit board 10 to obtain a flexible prefabricated board 30” may include: printing a liquid second at the symmetrical positions of the upper surface 10a and the lower surface 10b of the flexible circuit board 10. A flexible material; and baking the liquid second flexible material to form a flexible insulating substrate 20 to obtain a flexible prefabricated board 30.
所述第二柔性材料可以採用聚醯亞胺(polyimide，PI)、聚對苯二甲酸乙二醇酯（Polyethylene Terephthalate，PET）或聚萘二甲酸乙二醇酯（Polyethylene Naphthalate，PEN）、聚乙烯（polyethylene，PE）、特氟龍（Teflon）、液晶高分子聚合物（liquid crystal polymer，LCP）、聚氯乙烯(polyvinyl chloride polymer，PVC)等材料中的一種。The second flexible material may be polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), or polyethylene naphthalate. One of materials such as polyethylene (PE), Teflon, liquid crystal polymer (LCP), and polyvinyl chloride polymer (PVC).
所述所述柔性絕緣基材20的厚度W1大於12微米。The thickness W1 of the flexible insulating substrate 20 is greater than 12 microns.
在本實施例中，由於液態第二柔性材料具有流動性，在印刷的過程中，所述液態第二柔性材料填充通孔112，因此，將所述位於柔性電路板10的上表面10a的柔性絕緣基材20和位於柔性電路板10的下表面10b的柔性絕緣基材20連接。In this embodiment, since the liquid second flexible material has fluidity, during the printing process, the liquid second flexible material fills the through hole 112, so the flexibility of the upper surface 10a of the flexible circuit board 10 is set. The insulating base material 20 is connected to the flexible insulating base material 20 located on the lower surface 10 b of the flexible circuit board 10.
所述第一柔性材料和第二柔性材料可以選擇相同的材料、也可以選擇不同的材料。The first flexible material and the second flexible material may be selected from the same material or different materials.
請參閱圖3，圖3為本發明所提供的軟硬結合電路板的製造方法的硬性絕緣基材的示意圖。Please refer to FIG. 3. FIG. 3 is a schematic diagram of a rigid insulating substrate of a method for manufacturing a flexible-hard circuit board provided by the present invention.
在所述“提供兩個硬性絕緣基材40，在所述兩個硬性絕緣基材40上均形成第一預切區41，第一預切區41的寬度C2小於柔性絕緣基材20的寬度C1”中，可以採用裁剪、機械打孔、鐳射打孔等方式在硬性絕緣基材40上形成第一預切區41。In the “providing two rigid insulating substrates 40, a first pre-cut region 41 is formed on each of the two rigid insulating substrates 40, and the width C2 of the first pre-cut region 41 is smaller than the width of the flexible insulating substrate 20. In C1 ", the first pre-cut region 41 can be formed on the rigid insulating substrate 40 by cutting, mechanical punching, laser punching, or the like.
進一步的，所述柔性絕緣基材20的寬度C1和第一預切區41的寬度C2進一步具有以下關係：（C1-C2）/2＞0.5毫米。Further, the width C1 of the flexible insulating substrate 20 and the width C2 of the first pre-cut region 41 further have the following relationship: (C1-C2) / 2> 0.5 mm.
所述硬性絕緣基材40可以為聚丙烯（Polypropylene，PP）。The rigid insulating substrate 40 may be polypropylene (Polypropylene, PP).
請參閱圖4，圖4為本發明所提供的軟硬結合電路板的製造方法的銅箔的示意圖。Please refer to FIG. 4, which is a schematic diagram of a copper foil for a manufacturing method of a flexible-hard combined circuit board provided by the present invention.
在所述“提供兩個銅箔50，在兩個銅箔50上均形成第二預切區51，第二預切區51的寬度C3等於第一預切區41的寬度C2”中，可以採用裁剪、機械打孔、鐳射打孔、蝕刻等方式在銅箔50上形成第二預切區51。In the “providing two copper foils 50, and forming a second pre-cut area 51 on both copper foils 50, the width C3 of the second pre-cut area 51 is equal to the width C2 of the first pre-cut area 41”, The second pre-cut area 51 is formed on the copper foil 50 by cutting, mechanical punching, laser punching, etching or the like.
請參閱圖5和6，圖5為本發明所提供的軟硬結合電路板的製造方法的“熱壓柔性預製板30、兩個硬性絕緣基材40和兩個銅箔50”的示意圖，圖6為本發明所提供的軟硬結合電路板的製造方法的軟硬結合基板60的示意圖。Please refer to FIGS. 5 and 6. FIG. 5 is a schematic diagram of “hot-pressed flexible prefabricated board 30, two rigid insulating substrates 40, and two copper foils 50”, which is a method for manufacturing a flexible-hard combined circuit board provided by the present invention. 6 is a schematic diagram of a rigid-flex substrate 60 of a method for manufacturing a rigid-flex circuit board provided by the present invention.
在所述“熱壓所述柔性預製板30、兩個硬性絕緣基材40和兩個銅箔50，形成軟硬結合基板60，在熱壓過程中，柔性預製板30、兩個硬性絕緣基材40和兩個銅箔50的自下而上的排列順序為：銅箔50、硬性絕緣基材40、柔性預製板30、硬性絕緣基材40和銅箔50，第一預切區41和第二預切區51重疊設置形成開口61，部分柔性絕緣基材20暴露於開口61”中，在熱壓完成後，所述硬性絕緣基材40包括黏合區42，內埋區43和流膠區44。所述黏合區42位於所述柔性電路板10與銅箔50之間。所述內埋區43位於所述柔性絕緣基材20與銅箔50之間。所述流膠區位於柔性絕緣基材20上。In the "hot pressing of the flexible prefabricated board 30, two rigid insulating substrates 40 and two copper foils 50, a soft-hard combined substrate 60 is formed. During the hot pressing process, the flexible prefabricated board 30, two rigid insulating substrates The bottom-up arrangement of the material 40 and the two copper foils 50 is: copper foil 50, rigid insulating substrate 40, flexible pre-fabricated board 30, rigid insulating substrate 40 and copper foil 50, the first pre-cut area 41 and the first The two pre-cut regions 51 are overlapped to form an opening 61, and a part of the flexible insulating substrate 20 is exposed in the opening 61 ". After the hot pressing is completed, the rigid insulating substrate 40 includes an adhesive region 42, an embedded region 43, and a flow-through region. 44. The bonding area 42 is located between the flexible circuit board 10 and the copper foil 50. The buried region 43 is located between the flexible insulating substrate 20 and the copper foil 50. The glue flow area is located on the flexible insulating substrate 20.
具體的，所述硬性絕緣基材40受熱軟化，從而黏合於柔性預製板30和銅箔50之間，形成黏合區42和內埋區43，同時由於壓力作用，部分硬性絕緣基材40溢出於柔性絕緣基材20上，形成流膠區44。Specifically, the rigid insulating substrate 40 is softened by heat, and thereby adheres between the flexible prefabricated board 30 and the copper foil 50 to form a bonding region 42 and an embedded region 43. At the same time, due to the pressure, part of the rigid insulating substrate 40 overflows the flexibility On the insulating base material 20, a glue flow area 44 is formed.
所述柔性絕緣基材20包括第一部分21、第二部分22和第三部分23。所述第一部分21暴露於所述開口61。所述第二部分22被所述流膠區44覆蓋。所述第三部分23被內埋區43覆蓋。The flexible insulating substrate 20 includes a first portion 21, a second portion 22 and a third portion 23. The first portion 21 is exposed to the opening 61. The second portion 22 is covered by the flow-through region 44. The third portion 23 is covered by the buried area 43.
進一步的，所述第二部分22的寬度小於0.6毫米。所述第三部分23的寬度大於0.5毫米，從而有效避免由於第一預切區和柔性絕緣基材20之間偏移問題導致柔性電路板10的電路結構暴露的問題。Further, the width of the second portion 22 is less than 0.6 mm. The width of the third portion 23 is greater than 0.5 mm, thereby effectively avoiding the problem of exposing the circuit structure of the flexible circuit board 10 due to the offset between the first pre-cut region and the flexible insulating substrate 20.
請參閱圖7，圖7為本發明所提供的軟硬結合電路板的製造方法的形成有碳殘留層64的軟硬結合基板60的示意圖。Please refer to FIG. 7. FIG. 7 is a schematic diagram of a rigid-flexible substrate 60 with a carbon residual layer 64 formed in a method for manufacturing a rigid-flexible circuit board provided by the present invention.
在所述“在軟硬結合基板60上設置至少一個開孔，並採用黑影製程對所述開孔進行修整，同時在柔性絕緣基材20表面形成碳殘留層64”中，可以採用機械打孔的方法在軟硬結合基板60上設置開孔62、63。In the step of “providing at least one opening in the soft-hard substrate 60 and trimming the opening using a black shadow process, and forming a carbon residual layer 64 on the surface of the flexible insulating substrate 20”, mechanical punching may be used. In the method of holes, openings 62 and 63 are provided on the flexible and rigid substrate 60.
在本實施例中，開孔62為盲孔，開孔63為通孔。在其他實施例中，可以只設置一個開孔，或設置兩個以上開孔。In this embodiment, the opening hole 62 is a blind hole, and the opening hole 63 is a through hole. In other embodiments, only one opening may be provided, or more than two openings may be provided.
請參閱圖8，圖8為本發明所提供的軟硬結合電路板的製造方法的電鍍銅層70後的軟硬結合基板60的示意圖。Please refer to FIG. 8. FIG. 8 is a schematic diagram of a soft-hard bonded substrate 60 after a copper electroplated layer 70 of the method for manufacturing a soft-hard bonded circuit board provided by the present invention.
在所述“在軟硬結合基板60的開孔的內壁，開口61的內壁61a和柔性絕緣基材20的碳殘留層64上電鍍銅層70”的一種實施方式中，在軟硬結合基板60的開孔62、63的內壁62a、63a，開口61的內壁61a和柔性絕緣基材20的碳殘留層64上電鍍銅層70。In one embodiment of “the inner wall of the opening of the soft-hard substrate 60, the inner wall 61a of the opening 61, and the carbon residual layer 64 of the flexible insulating substrate 20”, an electroplated copper layer 70 is formed on the soft-hard substrate The inner walls 62 a and 63 a of the openings 62 and 63 of the substrate 60, the inner wall 61 a of the opening 61 and the carbon residual layer 64 of the flexible insulating substrate 20 are plated with a copper layer 70.
請參閱圖9，圖9為本發明所提供的軟硬結合電路板的製造方法的蝕刻後的軟硬結合基板60的示意圖。Please refer to FIG. 9. FIG. 9 is a schematic diagram of an etched flexible-hard substrate 60 after the method for manufacturing a flexible-hard circuit board provided by the present invention.
在所述“蝕刻掉碳殘留層64和部分柔性絕緣基材20，形成軟板區域82”中，被蝕刻掉的柔性絕緣基材20的深度C6為大於2微米。In the “etching away of the carbon residual layer 64 and part of the flexible insulating substrate 20 to form a flexible board region 82”, the depth C6 of the etched flexible insulating substrate 20 is greater than 2 μm.
請參閱圖10，圖10為本發明所提供的軟硬結合電路板的製造方法所製造的軟硬結合電路板100的示意圖。Please refer to FIG. 10, which is a schematic diagram of a flexible-hard combined circuit board 100 manufactured by a method for manufacturing a flexible-hard combined circuit board provided by the present invention.
在硬板區域81上設置防焊層90，從而形成所述軟硬結合電路板100。A solder resist layer 90 is provided on the hard board region 81, so as to form the flexible-hard circuit board 100.
另外，請參閱圖11，本發明所提供的方法還可以包括在軟板區域82的柔性絕緣基材20上開設至少一個過孔，以暴露柔性電路板10上的電路結構114，從而使得柔性電路板10上的電路結構114可以與外電路電連接。在本實施例中，在軟板區域82的柔性絕緣基材20上開設過孔83、84。In addition, referring to FIG. 11, the method provided by the present invention may further include opening at least one via hole in the flexible insulating substrate 20 of the flexible board region 82 to expose the circuit structure 114 on the flexible circuit board 10, thereby making the flexible circuit The circuit structure 114 on the board 10 may be electrically connected to an external circuit. In this embodiment, via holes 83 and 84 are formed in the flexible insulating substrate 20 of the flexible board region 82.
本發明採用在硬性絕緣基材40和銅箔50上預先設置第一預切區41和第二預切區51，進一步採用黑影製程在修整開孔62、63的同時在柔性絕緣基材20表面形成碳殘留層64，後續再通過蝕刻的方式去掉碳殘留層64從而形成軟板區域82，因此，有效的避免了人工貼設保護膜和去掉保護膜的過程，因此，提高了軟硬結合電路板100的生產效率。In the present invention, a first pre-cut area 41 and a second pre-cut area 51 are set in advance on the rigid insulating substrate 40 and the copper foil 50, and a black shadow process is further used to trim the openings 62 and 63 on the surface of the flexible insulating substrate 20 The carbon residual layer 64 is formed, and the carbon residual layer 64 is subsequently removed by etching to form a soft board region 82. Therefore, the process of manually attaching a protective film and removing the protective film is effectively avoided, and therefore, a soft-hard combined circuit is improved. Production efficiency of the board 100.
本發明之技術內容及技術特點已揭示如上，然而熟悉本項技術之人士仍可能基於本發明之教示及揭示而作種種不背離本發明精神之替換及修飾。因此，本發明之保護範圍應不限於實施例所揭示者，而應包括各種不背離本發明之替換及修飾，並為以下之申請專利範圍所涵蓋。The technical content and technical features of the present invention have been disclosed as above. However, those skilled in the art may still make various substitutions and modifications based on the teaching and disclosure of the present invention without departing from the spirit of the present invention. Therefore, the protection scope of the present invention should not be limited to those disclosed in the embodiments, but should include various substitutions and modifications that do not depart from the present invention, and are covered by the following patent application scope.
10‧‧‧柔性電路板 10‧‧‧flexible circuit board
111‧‧‧柔性絕緣板材 111‧‧‧flexible insulation sheet
111a、10a‧‧‧上表面 111a, 10a‧‧‧ Top surface
111b、10b‧‧‧下表面 111b, 10b‧‧‧ lower surface
112‧‧‧通孔 112‧‧‧through hole
113‧‧‧盲孔 113‧‧‧ blind hole
114、52‧‧‧電路結構 114, 52‧‧‧Circuit Structure
20‧‧‧柔性絕緣基材 20‧‧‧ flexible insulating substrate
21‧‧‧第一部分 21‧‧‧ Part I
22‧‧‧第二部分 22‧‧‧ Part Two
23‧‧‧第三部分 23‧‧‧ Part III
30‧‧‧柔性預製板 30‧‧‧flexible prefabricated board
40‧‧‧硬性絕緣基材 40‧‧‧ rigid insulating substrate
41‧‧‧第一預切區 41‧‧‧The first pre-cut area
42‧‧‧黏合區 42‧‧‧ Adhesive zone
43‧‧‧內埋區 43‧‧‧Buried area
44‧‧‧流膠區 44‧‧‧Flow glue area
50‧‧‧銅箔 50‧‧‧copper foil
51‧‧‧第二預切區 51‧‧‧Second precut area
60‧‧‧軟硬結合基板 60‧‧‧Flexible and rigid substrate
61‧‧‧開口 61‧‧‧ opening
62、63‧‧‧開孔 62, 63‧‧‧ opening
64‧‧‧碳殘留層 64‧‧‧carbon residue
61a、62a、63a‧‧‧內壁 61a, 62a, 63a
70‧‧‧銅層 70‧‧‧ copper layer
81‧‧‧硬板區域 81‧‧‧ hard board area
82‧‧‧軟板區域 82‧‧‧ soft board area
90‧‧‧防焊層 90‧‧‧ solder mask
100‧‧‧軟硬結合電路板 100‧‧‧Integrated circuit board
C1、C2、C3、C4、C5‧‧‧寬度 C1, C2, C3, C4, C5‧‧‧Width
C6‧‧‧深度 C6‧‧‧ depth
W1‧‧‧厚度 W1‧‧‧thickness
圖1為本發明所提供的軟硬結合電路板的製造方法的柔性電路板的示意圖。FIG. 1 is a schematic diagram of a flexible circuit board for a method for manufacturing a flexible-hard circuit board provided by the present invention.
圖2為本發明所提供的軟硬結合電路板的製造方法的柔性預製板的示意圖。FIG. 2 is a schematic diagram of a flexible prefabricated board for a manufacturing method of a flexible-hard combined circuit board provided by the present invention.
圖3為本發明所提供的軟硬結合電路板的製造方法的硬性絕緣基材的示意圖。FIG. 3 is a schematic diagram of a rigid insulating substrate of a method for manufacturing a flexible-hard combined circuit board provided by the present invention.
圖4為本發明所提供的軟硬結合電路板的製造方法的銅箔的示意圖。FIG. 4 is a schematic diagram of a copper foil for a manufacturing method of a flexible-hard combined circuit board provided by the present invention.
圖5為本發明所提供的軟硬結合電路板的製造方法的“熱壓柔性預製板、兩個硬性絕緣基材和兩個銅箔”的示意圖。FIG. 5 is a schematic diagram of a “hot-pressed flexible prefabricated board, two rigid insulating substrates, and two copper foils” of a method for manufacturing a flexible-hard combined circuit board provided by the present invention.
圖6為本發明所提供的軟硬結合電路板的製造方法的軟硬結合基板的示意圖。FIG. 6 is a schematic diagram of a rigid-flex substrate with a manufacturing method of a rigid-flex circuit board provided by the present invention.
圖7為本發明所提供的軟硬結合電路板的製造方法的形成有碳殘留層的軟硬結合基板的示意圖。FIG. 7 is a schematic diagram of a rigid-flexible substrate with a carbon residue layer formed in a method for manufacturing a rigid-flexible circuit board provided by the present invention.
圖8為本發明所提供的軟硬結合電路板的製造方法的電鍍銅層後的軟硬結合基板的示意圖。FIG. 8 is a schematic diagram of a soft-hard bonded substrate after electroplating a copper layer in a method for manufacturing a soft-hard bonded circuit board provided by the present invention.
圖9為本發明所提供的軟硬結合電路板的製造方法的蝕刻後的軟硬結合基板的示意圖。FIG. 9 is a schematic diagram of an etched soft-hard bonded substrate according to the method for manufacturing a soft-hard bonded circuit board provided by the present invention.
圖10為本發明所提供的軟硬結合電路板的製造方法所製造的軟硬結合電路板的示意圖。FIG. 10 is a schematic diagram of a flexible-hard circuit board manufactured by the method for manufacturing a flexible-hard circuit board provided by the present invention.
圖11為本發明所提供的軟硬結合電路板的製造方法所述製造的軟板區域設有過孔的軟硬結合電路板的示意圖。FIG. 11 is a schematic diagram of a soft-hard combined circuit board provided with vias in a soft-board region manufactured according to the method for manufacturing a soft-hard combined circuit board provided by the present invention.
無no
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| CN201710373210.9 | 2017-05-24 | ||
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| ??201710373210.9 | 2017-05-24 |
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| CN109640544A (en) * | 2018-12-24 | 2019-04-16 | 江苏弘信华印电路科技有限公司 | A kind of multilayered rigidity and flexibility board and its manufacture craft |
| CN112839451B (en) * | 2019-11-25 | 2022-09-20 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of rigid-flex board and rigid-flex board |
| CN113498249B (en) * | 2020-04-07 | 2023-11-10 | 庆鼎精密电子（淮安）有限公司 | Soft-hard combined circuit board and preparation method thereof |
| CN113645772B (en) * | 2020-05-11 | 2022-08-16 | 庆鼎精密电子（淮安）有限公司 | Rigid-flex board and manufacturing method thereof |
| CN112672543B (en) * | 2020-12-09 | 2023-08-18 | 四会富仕电子科技股份有限公司 | Method for separating electroplated copper layer |
| CN112739069B (en) * | 2020-12-09 | 2023-08-08 | 四会富仕电子科技股份有限公司 | Method for improving incomplete stripping of electroplated copper layer |
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| TWI268749B (en) * | 2005-02-02 | 2006-12-11 | Compeq Mfg Company Limited | Method for manufacturing flex-rigid printed circuit board |
| CN2930196Y (en) * | 2006-07-28 | 2007-08-01 | 佳总兴业股份有限公司 | Soft and hard composite printed circuit board structure |
| CN103338599B (en) * | 2012-09-24 | 2016-08-17 | 惠州中京电子科技股份有限公司 | A kind of Rigid Flex processing technology |
| CN103442525A (en) * | 2013-08-01 | 2013-12-11 | 北大方正集团有限公司 | Printed circuit board with rigidity combined with flexibility and manufacturing method thereof |
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| CN105592638B (en) * | 2014-10-20 | 2018-10-30 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN105992460A (en) * | 2015-03-06 | 2016-10-05 | 富葵精密组件(深圳)有限公司 | Rigid-flex combined board and manufacturing method thereof |
| CN106304607B (en) * | 2015-05-25 | 2019-09-20 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex combined board and preparation method thereof |
| CN106163144A (en) * | 2016-08-31 | 2016-11-23 | 河源西普电子有限公司 | The manufacture method that a kind of rigid-flex combines |
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