WO2019184439A1 - Ultra-thick 5g antenna pcb module processing method - Google Patents

Ultra-thick 5g antenna pcb module processing method Download PDF

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Publication number
WO2019184439A1
WO2019184439A1 PCT/CN2018/119850 CN2018119850W WO2019184439A1 WO 2019184439 A1 WO2019184439 A1 WO 2019184439A1 CN 2018119850 W CN2018119850 W CN 2018119850W WO 2019184439 A1 WO2019184439 A1 WO 2019184439A1
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WIPO (PCT)
Prior art keywords
layer
processing
ultra
thick
sheet
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PCT/CN2018/119850
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French (fr)
Chinese (zh)
Inventor
唐宏华
武守坤
陈春
林映生
卫雄
范思维
石学兵
Original Assignee
惠州市金百泽电路科技有限公司
西安金百泽电路科技有限公司
深圳市金百泽电子科技股份有限公司
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Publication of WO2019184439A1 publication Critical patent/WO2019184439A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Definitions

  • the invention relates to the technical field of manufacturing a 5G communication printed circuit board, in particular to a processing method of an ultra thick 5G antenna PCB module.
  • 5G network has the highest theoretical transmission speed of 10Gb per second, which is hundreds of times faster than the current 4G network transmission; due to its high speed, low latency and low power consumption, In the future, it will penetrate into the Internet of Things and all walks of life, and integrate deeply with industrial facilities, medical instruments, and transportation to effectively meet the diversified business needs of vertical industries such as industry, medical care, and transportation.
  • the traditional practice of the antenna module is to use the injection molding process.
  • it is difficult to debug the signal after installation which takes a lot of time and becomes a technical bottleneck for 5G network promotion.
  • the industry has another shortcut—using PCB integration technology to process Debug-free 5G antenna module.
  • the antenna module In order to meet the requirements of high-frequency signal transmission and realize the function of free adjustment, the antenna module generally has a thickness of 7.0mm or more, and the integrated thickness of some antenna modules has reached more than 11.5mm.
  • the PCB is laminated and drilled. Holes, circuits, and CNCs all face large technical bottlenecks. Therefore, how to break through the difficulty of existing PCB technology processing and achieve mass production is of great significance.
  • An ultra thick 5G antenna PCB module processing method includes the following processing steps:
  • Step 1 top-level component production:
  • Step 1.1 cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
  • Step 1.2 Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
  • Step 1.3 Pressing the sheet material: the L10 layer sheet and the L23 layer sheet processed in step 1.2 are subjected to high temperature pressing, that is, the L13 layer sheet is obtained, and the L13 layer sheet is drilled, LDI line, and inside. After layer etching, inner layer AOI, depth control, solder mask, post-cure, and browning, the top layer component is obtained;
  • Step 2 the bottom part is made:
  • Step 2.1 cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
  • Step 2.2 sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
  • Step 2.3 Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the L46 layer sheet is subjected to drilling, plasma, copper sinking, A copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, deep immersion edge, surface immersion gold treatment, then the bottom part;
  • Step 3 Finishing production: the top part prepared by the step 1 and the bottom part prepared by the step 2 are pressed together at a high temperature, and then subjected to two-drilling, testing, and shape processing, and the ultra-thickness is obtained after passing the finished product inspection. 5G antenna PCB module.
  • the thickness of the 5G antenna PCB module designed according to the product requirements can reach 11 ⁇ 12mm, but it is difficult to carry out the processes of copper, electroplating, wiring, etching and solder resist on the ultra-thick 5G antenna PCB module board by the traditional process.
  • the manufacturing quality of the circuit and the plating is difficult to ensure, and the mass production requirements cannot be met.
  • the present invention designs the ultra-thick 5G antenna PCB module to be composed of two components, a top member and a bottom member, which are manufactured by the top member and the bottom member.
  • the pressure-blending blind holes are separately made to make the thickness of each component smaller and the plating difficulty is reduced.
  • the blind hole design is more conducive to high-frequency signal transmission; since the total thickness of the top part and the bottom part after the total pressure can reach 11 ⁇ 12mm, It is difficult to make the solder mask and the surface treatment at this thickness.
  • the top layer part is subjected to the solder resist treatment and the bottom layer part is subjected to surface treatment after the sheet material is pressed, and the final product is produced. No need to do soldering and surface treatment, reduce the difficulty of production, improve the processing precision and product quality of ultra-thick antenna modules.
  • the L13 layer material is controlled by deep edge treatment, and the thickness of the L13 layer sheet is 4-7 mm, and the thickness of the L13 layer is 1 1/2 thickness from the top edge of the top layer. /2.
  • the overall thickness of the L13 layer after pressing is less than 7.0 mm, and the conventional equipment can effectively meet the requirements of the line, electroplating and etching of the super thick plate, and the depth of the sinking edge is too shallow, which will increase the difficulty of riveting at the total pressure. If the edge is too deep, the thickness of the edge of the plate is insufficient, the support strength is lowered, and the pressure is easy to be biased.
  • the L46 layer material is controlled by deep-edge processing, and the thickness of the L46 layer sheet is 4-7 mm, and the thickness of the L46 layer is from the long side of the bottom layer to the depth of 1/2. 1/2.
  • the overall thickness of the L46 layer sheet after pressing is less than 7.0 mm, and the conventional equipment can effectively meet the requirements of the line, electroplating and etching of the ultra-thick board, and the depth of the sinking edge is too shallow, which increases the difficulty of riveting at the total pressure. If the edge is too deep, the thickness of the edge of the plate is insufficient, the support strength is lowered, and the pressure is easy to be biased.
  • the L13 layer sheet and the L46 layer sheet are respectively pressed to form a deep thickness and the total thickness of the sheet is 5 to 6 mm.
  • the total thickness of the L13 layer and the L46 layer is less than 7.0mm, and the conventional equipment can effectively meet the requirements of the circuit, plating and etching of the ultra-thick board, and the PCB prepared by the thickness is prepared.
  • the module has good rigidity and high processing yield.
  • the edge of the L13 layer and the L46 layer are provided with mutually matching riveting positioning holes.
  • the riveting strength is enhanced by increasing the number of rivet positioning holes.
  • step 3 the top part and the bottom part are pressed together by rivets.
  • the length of the rivet used is 8mm, the length of the rivet is too short, the riveting is not tight, too long is easy to cause the leaning tower to shift, and in order to enhance the riveting strength, the rivet is made of super hard alloy material.
  • the drilling holes in steps 1.3 and 2.3 include drilling a blind hole and a pre-drilling hole, the pre-drilling hole is processed by 0.2 to 0.3 mm smaller than the design aperture, and the pre-drilled hole of the top part is The position of the pre-drilled holes of the position and the bottom member correspond to each other.
  • the aperture of the pre-drilled hole is 0.2-0.3 mm smaller than the design aperture, which can avoid the aperture misalignment or the larger aperture when the second drilling is performed.
  • the pre-drilled hole is positioned by the edge of the plate and the expansion and contraction is measured to prevent the positioning offset.
  • the two drills in the step 3 are drilled through the pre-drilled holes in one step by one step, that is, the NPTH mounting holes are obtained.
  • the one-step drilling method can prevent the deviation of precision caused by distributed drilling.
  • the shape processing is performed by using a forward-reverse-controlled deep-milling process, and the NPTH mounting hole is used for internal positioning, and the front and back sides of the ultra-thick 5G antenna PCB module are controlled to a depth of 6 mm. Dimensional deviation ⁇ 0.10mm. Through the NPTH mounting hole for internal positioning, to prevent the shape deviation during processing, to ensure that the dimensional deviation ⁇ 0.10mm.
  • the processing method of the ultra thick 5G antenna PCB module of the invention has the following beneficial effects:
  • the conventional equipment can meet the processing requirements: the upper limit of the conventional horizontal line processing plate thickness is below 7.0 mm, and the present invention optimizes the through hole and back drilling process of the conventional ultra thick plate processing process to prepare the top layer with blind holes through structural optimization.
  • the parts and the bottom part, the top part and the bottom part are all under 7.0mm, and the conventional equipment can effectively meet the requirements of the line, plating and etching of the ultra-thick board;
  • the invention optimizes the preparation process of the ultra-thick 5G antenna PCB module, and the solder resist and the surface treatment are preferentially completed in the manufacture of the top layer component and the bottom layer component, thereby greatly reducing the PCB module due to the ultra-thick 5G antenna.
  • the surface treatment process is difficult due to excessive thickness, thereby improving the production efficiency of the product;
  • the present invention separately controls the top layer component and the bottom layer component to deepen the edge and then riveting, thereby effectively ensuring the pressing precision, and optimizing the step-by-step drilling process of the conventional process to the top component separately. Pre-drilling small holes with the bottom part, and then drilling down after the total pressure, which can prevent the precision deviation caused by the step drilling, thus ensuring the hole position precision control, thereby improving the product preparation precision;
  • the appearance tolerance of the finished product is small, and the product yield is improved: the NPTH mounting hole is used as the inner positioning hole, and the front and back sides of the ultra-thick 5G antenna PCB module are controlled to be 6 mm deep, thereby ensuring the deviation of the finished product dimension ⁇ 0.10 mm. To improve product yield.
  • FIG. 1 is a flow chart of a processing method of an ultra-thick 5G antenna PCB module according to the present invention.
  • a processing method of an ultra-thick 5G antenna PCB module includes the following processing steps:
  • Step 1 Top-level component production:
  • Step 1.1 cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
  • Step 1.2 Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
  • Step 1.3 Pressing the sheet material: pressurizing the L10 layer sheet and the L23 layer sheet processed in step 1.2, that is, obtaining the L13 layer sheet, the thickness of the L13 layer sheet is 4-7 mm, and the board edge is set.
  • There is a staking positioning hole and the L13 layer material is subjected to drilling, LDI line, inner layer etching, inner layer AOI, deep immersion edge, solder resist, post-cure, and browning treatment, thereby obtaining a top layer component, wherein
  • the drilling hole includes a drilling blind hole and a pre-drilling small hole, and the pre-drilling small hole is processed by 0.2 to 0.3 mm smaller than the designed aperture, and the plate edge film hole is used for positioning and measuring the expansion and contraction, and the pre-drilling small hole of the top part
  • the position corresponds to the position of the budget hole of the bottom member, and the depth of the top layer of the L13 layer is 1/2 thickness from the top edge of the L13 layer
  • Step 2 the bottom part is made:
  • Step 2.1 cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
  • Step 2.2 sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
  • Step 2.3 Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the thickness of the L46 layer sheet is 4-7 mm, and the board edge is set.
  • There are riveted positioning holes the L46 layer is drilled, plasma, copper, copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, depth control,
  • the bottom layer component is obtained, wherein the borehole comprises a blind hole for drilling and a pre-drilled hole, and the pre-drilled hole is processed by a reduction of 0.2 to 0.3 mm than the designed aperture, and the edge of the film is used for positioning.
  • the position of the pre-drilled small hole and the position of the pre-drilled small hole of the top layer component corresponding to each other, and the deep-side edge of the L46 layer material is 1/2 thickness from the top edge of the L46 layer material, The thickness is 1/2 of the thickness of the L46 layer, and the overall thickness of the L46 layer after the edge is 2 to 3.5 mm;
  • Step 3 the finished product is prepared: the top layer component prepared by the step 1 and the bottom layer component prepared by the step 2 are rivet-wrapped and then subjected to high-temperature pressing, and the overall thickness after pressing is 5-6 mm;
  • the pre-drilled hole is drilled once by one-step drilling, that is, the NPTH mounting hole is obtained, and the shape processing is performed by forward and reverse controlled deep milling, and the NPTH mounting hole is used for internal positioning.
  • the depth of the front and back sides is 6mm, and the dimensional deviation after the shape processing is ⁇ 0.10mm.
  • the ultra-thick 5G antenna PCB module is obtained.
  • a processing method of an ultra-thick 5G antenna PCB module includes the following processing steps:
  • Step 1 Top-level component production:
  • Step 1.1 cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
  • Step 1.2 Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
  • Step 1.3 Pressing the sheet material: pressurizing the L10 layer sheet and the L23 layer sheet processed in step 1.2, that is, obtaining the L13 layer sheet, the thickness of the L13 layer sheet is 4-7 mm, and the board edge is set.
  • There is a staking positioning hole and the L13 layer material is subjected to drilling, LDI line, inner layer etching, inner layer AOI, deep immersion edge, solder resist, post-cure, and browning treatment, thereby obtaining a top layer component, wherein
  • the drilling hole includes a drilling blind hole and a pre-drilling small hole, and the pre-drilling small hole is processed by 0.2 to 0.3 mm smaller than the designed aperture, and the plate edge film hole is used for positioning and measuring the expansion and contraction, and the pre-drilling small hole of the top part
  • the position corresponds to the position of the budget hole of the bottom member, and the depth of the top layer of the L13 layer is 1/2 thickness from the top edge of the L13 layer
  • Step 2 the bottom part is made:
  • Step 2.1 cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
  • Step 2.2 sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
  • Step 2.3 Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the thickness of the L46 layer sheet is 4-7 mm, and the board edge is set.
  • There are riveted positioning holes the L46 layer is drilled, plasma, copper, copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, depth control,
  • the bottom layer component is obtained, wherein the borehole comprises a blind hole for drilling and a pre-drilled hole, and the pre-drilled hole is processed by a reduction of 0.2 to 0.3 mm than the designed aperture, and the edge of the film is used for positioning.
  • the position of the pre-drilled small hole and the position of the pre-drilled small hole of the top layer component corresponding to each other, and the deep-side edge of the L46 layer material is 1/2 thickness from the top edge of the L46 layer material, The thickness is 1/2 of the thickness of the L46 layer, and the overall thickness of the L46 layer after the edge is 2 to 3.5 mm;
  • Step 3 the finished product is prepared: the top layer component prepared by the step 1 and the bottom layer component prepared by the step 2 are rivet-wrapped and then subjected to high-temperature pressing, and the overall thickness after pressing is 5-6 mm;
  • the pre-drilled hole is drilled once by one-step drilling, that is, the NPTH mounting hole is obtained, and the shape processing is performed by forward and reverse controlled deep milling, and the NPTH mounting hole is used for internal positioning.
  • the depth of the front and back sides is 6mm, and the dimensional deviation after the shape processing is ⁇ 0.10mm.
  • the ultra-thick 5G antenna PCB module is obtained.
  • the ultra-thick 5G antenna PCB module prepared by the invention has small thickness deviation, and the processing thickness can be processed to a thickness of 7.0 mm or more, which breaks through the bottleneck of the traditional processing technology, and the outer dimension precision control is better, and the dimensional deviation is ⁇ 0.10. Mm, to meet the requirements of mass production.
  • the invention provides a batch processing method for ultra-thick antenna modules by using conventional equipment, reduces the processing difficulty of the ultra-thick antenna module, and improves the precision and product quality of the processed ultra-thick antenna module.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Details Of Aerials (AREA)

Abstract

An ultra-thick 5G antenna PCB module processing method, comprising the following steps: step 1: fabricating top-layer components; step 2: fabricating bottom-layer components; step 3: fabricating a finished product. The fabrication for both the top-layer components and the bottom-layer components comprise cutting, board processing, and board lamination. By means of optimizing the structure and preparation flow of the ultra-thick 5G antenna PCB module, the difficulty of the process is lessened, and the thickness of processable boards reaches 7-12 mm. Moreover, conventional equipment may be used to effectively meet circuitry, electroplating and etching requirements for ultra-thick boards, and improve product preparation precision, such that the finished product has low shape deviation and the product yield is improved.

Description

一种超厚5G天线PCB模块加工方法Ultra thick 5G antenna PCB module processing method 技术领域Technical field
本发明涉及5G通讯印制电路板的制作技术领域，具体为一种超厚5G天线PCB模块加工方法。The invention relates to the technical field of manufacturing a 5G communication printed circuit board, in particular to a processing method of an ultra thick 5G antenna PCB module.
背景技术Background technique
5G网络作为第五代移动通信技术，其最高理论传输速度可达每秒数10Gb，这比目前4G网络的传输速度快数百倍；由于其高速率、低时延、低功耗的特点，未来将渗透到物联网及各行各业，与工业设施、医疗仪器、交通工具等深度融合，有效满足工业、医疗、交通等垂直行业的多样化业务需求。As the fifth generation mobile communication technology, 5G network has the highest theoretical transmission speed of 10Gb per second, which is hundreds of times faster than the current 4G network transmission; due to its high speed, low latency and low power consumption, In the future, it will penetrate into the Internet of Things and all walks of life, and integrate deeply with industrial facilities, medical instruments, and transportation to effectively meet the diversified business needs of vertical industries such as industry, medical care, and transportation.
为抢占未来市场，许多国家和地区对5G商用高度重视，已竞相展开5G网络技术开发。工信部此前发布的《信息通信行业发展规划(2016-2020年)》明确提出，2020年启动5G商用服务。根据工信部等部门提出的5G推进工作部署以及三大运营商的5G商用计划，我国将于2017年展开5G网络第二阶段测试，2018年进行大规模试验组网，并在此基础上于2019年启动5G网络建设，最快2020年正式推出商用服务；因此，近几年5G网络将获得爆发式增长。In order to seize the future market, many countries and regions attach great importance to 5G commercialization, and have begun to develop 5G network technology. The “Information and Communication Industry Development Plan (2016-2020)” previously issued by the Ministry of Industry and Information Technology clearly stated that 5G commercial services will be launched in 2020. According to the 5G promotion work plan proposed by the Ministry of Industry and Information Technology and the 5G commercial plan of the three major operators, China will launch the second phase of the 5G network test in 2017 and the large-scale test network in 2018, based on this in 2019. Start 5G network construction, and officially launch commercial services in 2020; therefore, 5G networks will gain explosive growth in recent years.
随着5G技术的诞生，作为5G网络的基础材料-高频高速板材也取得了蓬勃发展，包括国外ROGERS、TACONIC、台系厂商及国内生益科技等均推出了成熟的5G材料；三大运营商的5G PCB主板也竞相研发，并推出多个升级版本；其中作为5G信号接收及传输的天线模块显得尤为重要。With the birth of 5G technology, as the basic material of 5G network - high-frequency high-speed sheet has also flourished, including foreign ROGERS, TACONIC, Taiwanese manufacturers and domestic Shengyi technology have launched mature 5G materials; three major operations The 5G PCB motherboards are also racing to develop and launch multiple upgrade versions; the antenna module that is used for 5G signal reception and transmission is particularly important.
技术问题technical problem
天线模块的传统做法是采用注塑工艺，但因精度偏差及工艺局限，安装后信号调试困难，需耗费大量时间，成为5G网络推广的技术瓶颈，为此业界另辟捷径—采用PCB集成技术来加工免调试的5G天线模块。为满足高频信号传输要求并实现免调功能，天线模块一般厚度都在7.0mm以上，部分天线模块的集成厚度已达到11.5mm以上；针对此类超厚印制板，在PCB层压、钻孔、线路及CNC等工序均面临较大的技术瓶颈，因此如何突破现有PCB技术加工难度并实现批量化生产，显得意义非凡。The traditional practice of the antenna module is to use the injection molding process. However, due to the accuracy deviation and process limitations, it is difficult to debug the signal after installation, which takes a lot of time and becomes a technical bottleneck for 5G network promotion. For this reason, the industry has another shortcut—using PCB integration technology to process Debug-free 5G antenna module. In order to meet the requirements of high-frequency signal transmission and realize the function of free adjustment, the antenna module generally has a thickness of 7.0mm or more, and the integrated thickness of some antenna modules has reached more than 11.5mm. For such ultra-thick printed boards, the PCB is laminated and drilled. Holes, circuits, and CNCs all face large technical bottlenecks. Therefore, how to break through the difficulty of existing PCB technology processing and achieve mass production is of great significance.
技术解决方案Technical solution
本发明可以通过以下技术方案来实现：The invention can be implemented by the following technical solutions:
一种超厚5G天线PCB模块加工方法，包括以下加工步骤：An ultra thick 5G antenna PCB module processing method includes the following processing steps:
  步骤1，顶层部件制作：Step 1, top-level component production:
   步骤1.1，开料：按设计结构对PCB基板进行开料，即得L10与L23两个内层板料；Step 1.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
步骤1.2，板料加工：所述L10层板料和L23层板料分别进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 1.2: Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
步骤1.3，板料压合：将经步骤1.2处理后的L10层板料和L23层板料进行高温压合，即得L13层板料，所述L13层板料经过钻孔、LDI线路、内层蚀刻、内层AOI、控深沉边、阻焊、后固化、棕化处理后，即得顶层部件；Step 1.3: Pressing the sheet material: the L10 layer sheet and the L23 layer sheet processed in step 1.2 are subjected to high temperature pressing, that is, the L13 layer sheet is obtained, and the L13 layer sheet is drilled, LDI line, and inside. After layer etching, inner layer AOI, depth control, solder mask, post-cure, and browning, the top layer component is obtained;
步骤2，底层部件制作：Step 2, the bottom part is made:
步骤2.1，开料：按设计结构对PCB基板进行开料，即得L40与L56层两个内层板料；Step 2.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
步骤2.2，板料加工：所述L40层板料进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理，所述L56层板料进行钻孔、等离子、沉铜、一铜、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 2.2, sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
步骤2.3，板料压合：将经步骤2.2处理后的L40层板料和L56层板料进行压合，即得L46层板料，所述L46层板料经过钻孔、等离子、沉铜、一铜、背钻、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、控深沉边、表面沉金处理后，即得底层部件；Step 2.3: Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the L46 layer sheet is subjected to drilling, plasma, copper sinking, A copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, deep immersion edge, surface immersion gold treatment, then the bottom part;
步骤3，成品制作：将经步骤1制备得到的顶层部件和经步骤2制备得到的底层部件采用高温压合在一起，然后进行二钻、测试、外形加工，经成品检验合格后即得到超厚5G天线PCB模块。Step 3: Finishing production: the top part prepared by the step 1 and the bottom part prepared by the step 2 are pressed together at a high temperature, and then subjected to two-drilling, testing, and shape processing, and the ultra-thickness is obtained after passing the finished product inspection. 5G antenna PCB module.
根据产品需求设计得到的5G天线PCB模块厚度可达到11～12mm，但以传统工艺对超厚5G天线PCB模块板进行沉铜、电镀、线路、蚀刻和阻焊等工序均有很大的困难度，导致线路及电镀的制作品质难以保证，无法满足批量化生产要求，本发明通过将超厚5G天线PCB模块设计为由顶层部件和底层部件两个部件组成，所述顶层部件和底层部件制作时分别进行一次压合并钻盲孔，使各个部件厚度更小并降低电镀难度，采用盲孔设计更利于高频信号传输；由于顶层部件和底层部件总压后整体板厚可达到11～12mm，在此厚度下制作阻焊及表面处理困难较大，为此顶层部件和底层部件制作时在经过板料压合处理后分别对顶层部件进行阻焊处理和底层部件进行表面处理，则最终成品制作时无需再做阻焊及表面处理，降低制作难度，提高超厚天线模块的加工精度和产品质量。The thickness of the 5G antenna PCB module designed according to the product requirements can reach 11~12mm, but it is difficult to carry out the processes of copper, electroplating, wiring, etching and solder resist on the ultra-thick 5G antenna PCB module board by the traditional process. The manufacturing quality of the circuit and the plating is difficult to ensure, and the mass production requirements cannot be met. The present invention designs the ultra-thick 5G antenna PCB module to be composed of two components, a top member and a bottom member, which are manufactured by the top member and the bottom member. The pressure-blending blind holes are separately made to make the thickness of each component smaller and the plating difficulty is reduced. The blind hole design is more conducive to high-frequency signal transmission; since the total thickness of the top part and the bottom part after the total pressure can reach 11~12mm, It is difficult to make the solder mask and the surface treatment at this thickness. For the top layer and the bottom part, the top layer part is subjected to the solder resist treatment and the bottom layer part is subjected to surface treatment after the sheet material is pressed, and the final product is produced. No need to do soldering and surface treatment, reduce the difficulty of production, improve the processing precision and product quality of ultra-thick antenna modules.
进一步地，步骤1.3所述L13层板料控深沉边处理，所述L13层板料厚度范围为4～7mm，从顶层长边沉边1/2厚度，余厚为L13层板料厚度的1/2。所述L13层板料压合后整体厚度在7.0mm以下，采用常规设备即可有效满足超厚板的线路、电镀及蚀刻制作要求，沉边深度过浅，会增加总压时铆合难度，沉边过深，板边余厚不足，支撑强度下降，易压合偏位。Further, in step 1.3, the L13 layer material is controlled by deep edge treatment, and the thickness of the L13 layer sheet is 4-7 mm, and the thickness of the L13 layer is 1 1/2 thickness from the top edge of the top layer. /2. The overall thickness of the L13 layer after pressing is less than 7.0 mm, and the conventional equipment can effectively meet the requirements of the line, electroplating and etching of the super thick plate, and the depth of the sinking edge is too shallow, which will increase the difficulty of riveting at the total pressure. If the edge is too deep, the thickness of the edge of the plate is insufficient, the support strength is lowered, and the pressure is easy to be biased.
进一步地，所述步骤2.3所述L46层板料控深沉边处理，所述L46层板料厚度范围为4～7mm，从底层长边沉边1/2深度，余厚为L46层板料厚度的1/2。所述L46层板料压合后整体厚度在7.0mm以下，采用常规设备即可有效满足超厚板的线路、电镀及蚀刻制作要求，沉边深度过浅，会增加总压时铆合难度，沉边过深，板边余厚不足，支撑强度下降，易压合偏位。Further, in step 2.3, the L46 layer material is controlled by deep-edge processing, and the thickness of the L46 layer sheet is 4-7 mm, and the thickness of the L46 layer is from the long side of the bottom layer to the depth of 1/2. 1/2. The overall thickness of the L46 layer sheet after pressing is less than 7.0 mm, and the conventional equipment can effectively meet the requirements of the line, electroplating and etching of the ultra-thick board, and the depth of the sinking edge is too shallow, which increases the difficulty of riveting at the total pressure. If the edge is too deep, the thickness of the edge of the plate is insufficient, the support strength is lowered, and the pressure is easy to be biased.
进一步地，所述L13层板料和L46层板料分别控深沉边后压合一起的整体厚度为5～6mm。控深沉边后L13层板料和L46层板料压合一起的总厚度在7.0mm以下，采用常规设备即可有效满足超厚板的线路、电镀及蚀刻制作要求，且此厚度制备得到的PCB模块刚性好，加工良品率高。Further, the L13 layer sheet and the L46 layer sheet are respectively pressed to form a deep thickness and the total thickness of the sheet is 5 to 6 mm. After controlling the deep edge, the total thickness of the L13 layer and the L46 layer is less than 7.0mm, and the conventional equipment can effectively meet the requirements of the circuit, plating and etching of the ultra-thick board, and the PCB prepared by the thickness is prepared. The module has good rigidity and high processing yield.
进一步地，所述L13层板料和L46层板料的板边均设置有相互配合的铆合定位孔。通过增加铆合定位孔数量从而增强铆合强度。Further, the edge of the L13 layer and the L46 layer are provided with mutually matching riveting positioning holes. The riveting strength is enhanced by increasing the number of rivet positioning holes.
进一步地，步骤3所述顶层部件和底层部件用铆钉进行压合。所用铆钉长度为8mm，铆钉长度太短铆合不紧，太长了容易导致斜塔式偏移，同时为了增强铆合强度，铆钉采用超硬合金材料制成。Further, in step 3, the top part and the bottom part are pressed together by rivets. The length of the rivet used is 8mm, the length of the rivet is too short, the riveting is not tight, too long is easy to cause the leaning tower to shift, and in order to enhance the riveting strength, the rivet is made of super hard alloy material.
进一步地，步骤1.3和步骤2.3所述钻孔包括钻盲孔和预钻小孔，所述预钻小孔按比设计孔径缩小0.2～0.3mm进行加工，所述顶层部件的预钻小孔的位置和底层部件的预钻小孔的位置相互对应。预钻小孔的孔径比设计孔径缩小0.2～0.3mm，可避免后续二钻时孔径错位或孔径偏大。Further, the drilling holes in steps 1.3 and 2.3 include drilling a blind hole and a pre-drilling hole, the pre-drilling hole is processed by 0.2 to 0.3 mm smaller than the design aperture, and the pre-drilled hole of the top part is The position of the pre-drilled holes of the position and the bottom member correspond to each other. The aperture of the pre-drilled hole is 0.2-0.3 mm smaller than the design aperture, which can avoid the aperture misalignment or the larger aperture when the second drilling is performed.
进一步地，所述预钻小孔采用板边菲林孔定位并测量涨缩，防止定位偏移。Further, the pre-drilled hole is positioned by the edge of the plate and the expansion and contraction is measured to prevent the positioning offset.
进一步地，步骤3所述二钻为采用一步下钻方式一次钻透预钻小孔，即得NPTH安装孔。采用一步下钻方式可防止分布钻孔造成精度偏差。Further, the two drills in the step 3 are drilled through the pre-drilled holes in one step by one step, that is, the NPTH mounting holes are obtained. The one-step drilling method can prevent the deviation of precision caused by distributed drilling.
    进一步地，步骤3中所述外形加工为采用正反控深铣加工，以NPTH安装孔做内定位，对所述超厚5G天线PCB模块的正面和反面各控深6mm，所述外形加工后外形尺寸偏差≤0.10mm。通过NPTH安装孔做内定位，防止加工时外形偏移，保证外形尺寸偏差≤0.10mm。Further, in the step 3, the shape processing is performed by using a forward-reverse-controlled deep-milling process, and the NPTH mounting hole is used for internal positioning, and the front and back sides of the ultra-thick 5G antenna PCB module are controlled to a depth of 6 mm. Dimensional deviation ≤0.10mm. Through the NPTH mounting hole for internal positioning, to prevent the shape deviation during processing, to ensure that the dimensional deviation ≤ 0.10mm.
有益效果Beneficial effect
本发明一种超厚5G天线PCB模块的加工方法，具有如下的有益效果：The processing method of the ultra thick 5G antenna PCB module of the invention has the following beneficial effects:
第一、常规设备即可满足加工要求：常规水平线加工板厚上限在7.0mm以下，本发明通过结构优化，将传统超厚板加工工艺的通孔和背钻工艺优化为制备有盲孔的顶层部件和底层部件，顶层部件和底层部件分压厚度均在7.0mm以下，采用常规设备即可有效满足超厚板的线路、电镀及蚀刻制作要求；First, the conventional equipment can meet the processing requirements: the upper limit of the conventional horizontal line processing plate thickness is below 7.0 mm, and the present invention optimizes the through hole and back drilling process of the conventional ultra thick plate processing process to prepare the top layer with blind holes through structural optimization. The parts and the bottom part, the top part and the bottom part are all under 7.0mm, and the conventional equipment can effectively meet the requirements of the line, plating and etching of the ultra-thick board;
第二、降低工艺难度：本发明通过对超厚5G天线PCB模块的制备流程优化，将阻焊及表面处理优先在顶层部件和底层部件制作时完成，大大降低了由于超厚5G天线PCB模块的厚度过大导致的表面处理工艺难度，从而提高了产品的生产效率；Second, the process difficulty is reduced: the invention optimizes the preparation process of the ultra-thick 5G antenna PCB module, and the solder resist and the surface treatment are preferentially completed in the manufacture of the top layer component and the bottom layer component, thereby greatly reducing the PCB module due to the ultra-thick 5G antenna. The surface treatment process is difficult due to excessive thickness, thereby improving the production efficiency of the product;
第三、提高产品制备精度：本发明分别对顶层部件和底层部件进行控深沉边后再铆合，有效保证了压合精度，以及将传统工艺的分步下钻工艺优化为先分别对顶层部件和底层部件进行预钻小孔，总压后再一次下钻，可防止分步钻孔造成精度偏差，从而确保孔位精度控制，从而提高产品制备精度；Third, improve product preparation accuracy: the present invention separately controls the top layer component and the bottom layer component to deepen the edge and then riveting, thereby effectively ensuring the pressing precision, and optimizing the step-by-step drilling process of the conventional process to the top component separately. Pre-drilling small holes with the bottom part, and then drilling down after the total pressure, which can prevent the precision deviation caused by the step drilling, thus ensuring the hole position precision control, thereby improving the product preparation precision;
    第四、成品外形公差小，提高产品良率：本发明采用NPTH安装孔作为内定位孔，并且对超厚5G天线PCB模块的正面和反面各控深6mm，从而保证成品外形尺寸偏差≤0.10mm，提高产品良率。Fourth, the appearance tolerance of the finished product is small, and the product yield is improved: the NPTH mounting hole is used as the inner positioning hole, and the front and back sides of the ultra-thick 5G antenna PCB module are controlled to be 6 mm deep, thereby ensuring the deviation of the finished product dimension ≤ 0.10 mm. To improve product yield.
附图说明DRAWINGS
图1为本发明一种超厚5G天线PCB模块的加工方法流程图。1 is a flow chart of a processing method of an ultra-thick 5G antenna PCB module according to the present invention.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
如图1所示，一种超厚5G天线PCB模块的加工方法，包括以下加工步骤：As shown in FIG. 1, a processing method of an ultra-thick 5G antenna PCB module includes the following processing steps:
步骤1：顶层部件制作：Step 1: Top-level component production:
步骤1.1，开料：按设计结构对PCB基板进行开料，即得L10与L23两个内层板料；Step 1.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
步骤1.2，板料加工：所述L10层板料和L23层板料分别进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 1.2: Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
步骤1.3，板料压合：将经步骤1.2处理后的L10层板料和L23层板料进行压合，即得L13层板料，所述L13层板料厚度为4～7mm，板边设有铆合定位孔，所述L13层板料经过钻孔、LDI线路、内层蚀刻、内层AOI、控深沉边、阻焊、后固化、棕化处理后，即得顶层部件，其中所述钻孔包括钻盲孔和预钻小孔，所述预钻小孔按比设计孔径缩小0.2～0.3mm进行加工，采用板边菲林孔定位并测量涨缩，所述顶层部件的预钻小孔的位置和底层部件的预算小孔的位置相对应，所述控深沉边处理时从L13层板料的顶层长边沉边1/2厚度，余厚为L13层板料厚度的1/2，L13层板料沉边后整体厚度为2～3.5mm；Step 1.3: Pressing the sheet material: pressurizing the L10 layer sheet and the L23 layer sheet processed in step 1.2, that is, obtaining the L13 layer sheet, the thickness of the L13 layer sheet is 4-7 mm, and the board edge is set. There is a staking positioning hole, and the L13 layer material is subjected to drilling, LDI line, inner layer etching, inner layer AOI, deep immersion edge, solder resist, post-cure, and browning treatment, thereby obtaining a top layer component, wherein The drilling hole includes a drilling blind hole and a pre-drilling small hole, and the pre-drilling small hole is processed by 0.2 to 0.3 mm smaller than the designed aperture, and the plate edge film hole is used for positioning and measuring the expansion and contraction, and the pre-drilling small hole of the top part The position corresponds to the position of the budget hole of the bottom member, and the depth of the top layer of the L13 layer is 1/2 thickness from the top edge of the L13 layer, and the thickness is 1/2 of the thickness of the L13 layer. The overall thickness of the L13 layer after the edge is 2 to 3.5 mm;
步骤2，底层部件制作：Step 2, the bottom part is made:
步骤2.1，开料：按设计结构对PCB基板进行开料，即得L40与L56层两个内层板料；Step 2.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
步骤2.2，板料加工：所述L40层板料进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理，所述L56层板料进行钻孔、等离子、沉铜、一铜、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 2.2, sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
步骤2.3，板料压合：将经步骤2.2处理后的L40层板料和L56层板料进行压合，即得L46层板料，所述L46层板料厚度为4～7mm，板边设有铆合定位孔，所述L46层板料经过钻孔、等离子、沉铜、一铜、背钻、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、控深沉边、表面沉金处理后，即得底层部件，其中所述钻孔包括钻盲孔和预钻小孔，所述预钻小孔按比设计孔径缩小0.2～0.3mm进行加工，采用板边菲林孔定位并测量涨缩，所述预钻小孔的位置和顶层部件的预钻小孔的位置相互对应，所述控深沉边处理时从L46层板料的顶层长边沉边1/2厚度，余厚为L46层板料厚度的1/2，L46层板料沉边后整体厚度为2～3.5mm；Step 2.3: Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the thickness of the L46 layer sheet is 4-7 mm, and the board edge is set. There are riveted positioning holes, the L46 layer is drilled, plasma, copper, copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, depth control, After the surface is subjected to gold immersion treatment, the bottom layer component is obtained, wherein the borehole comprises a blind hole for drilling and a pre-drilled hole, and the pre-drilled hole is processed by a reduction of 0.2 to 0.3 mm than the designed aperture, and the edge of the film is used for positioning. And measuring the expansion and contraction, the position of the pre-drilled small hole and the position of the pre-drilled small hole of the top layer component corresponding to each other, and the deep-side edge of the L46 layer material is 1/2 thickness from the top edge of the L46 layer material, The thickness is 1/2 of the thickness of the L46 layer, and the overall thickness of the L46 layer after the edge is 2 to 3.5 mm;
步骤3，成品制作：将经步骤1制备得到的顶层部件和经步骤2制备得到的底层部件采用铆钉铆紧再进行高温压合，压合后整体厚度为5～6mm；然后进行二钻，即用刃长12mm，直径1.65mm新钻刀，采用一步下钻方式一次钻透预钻小孔，即得NPTH安装孔，测试，外形加工采用正反控深铣加工，以NPTH安装孔做内定位，对正面和反面各控深6mm，外形加工后外形尺寸偏差≤0.10mm，经成品检验合格后即得到超厚5G天线PCB模块。Step 3, the finished product is prepared: the top layer component prepared by the step 1 and the bottom layer component prepared by the step 2 are rivet-wrapped and then subjected to high-temperature pressing, and the overall thickness after pressing is 5-6 mm; Using a new drill with a blade length of 12mm and a diameter of 1.65mm, the pre-drilled hole is drilled once by one-step drilling, that is, the NPTH mounting hole is obtained, and the shape processing is performed by forward and reverse controlled deep milling, and the NPTH mounting hole is used for internal positioning. The depth of the front and back sides is 6mm, and the dimensional deviation after the shape processing is ≤0.10mm. After the finished product inspection, the ultra-thick 5G antenna PCB module is obtained.
本发明的实施方式Embodiments of the invention
如图1所示，一种超厚5G天线PCB模块的加工方法，包括以下加工步骤：As shown in FIG. 1, a processing method of an ultra-thick 5G antenna PCB module includes the following processing steps:
步骤1：顶层部件制作：Step 1: Top-level component production:
步骤1.1，开料：按设计结构对PCB基板进行开料，即得L10与L23两个内层板料；Step 1.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
步骤1.2，板料加工：所述L10层板料和L23层板料分别进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 1.2: Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
步骤1.3，板料压合：将经步骤1.2处理后的L10层板料和L23层板料进行压合，即得L13层板料，所述L13层板料厚度为4～7mm，板边设有铆合定位孔，所述L13层板料经过钻孔、LDI线路、内层蚀刻、内层AOI、控深沉边、阻焊、后固化、棕化处理后，即得顶层部件，其中所述钻孔包括钻盲孔和预钻小孔，所述预钻小孔按比设计孔径缩小0.2～0.3mm进行加工，采用板边菲林孔定位并测量涨缩，所述顶层部件的预钻小孔的位置和底层部件的预算小孔的位置相对应，所述控深沉边处理时从L13层板料的顶层长边沉边1/2厚度，余厚为L13层板料厚度的1/2，L13层板料沉边后整体厚度为2～3.5mm；Step 1.3: Pressing the sheet material: pressurizing the L10 layer sheet and the L23 layer sheet processed in step 1.2, that is, obtaining the L13 layer sheet, the thickness of the L13 layer sheet is 4-7 mm, and the board edge is set. There is a staking positioning hole, and the L13 layer material is subjected to drilling, LDI line, inner layer etching, inner layer AOI, deep immersion edge, solder resist, post-cure, and browning treatment, thereby obtaining a top layer component, wherein The drilling hole includes a drilling blind hole and a pre-drilling small hole, and the pre-drilling small hole is processed by 0.2 to 0.3 mm smaller than the designed aperture, and the plate edge film hole is used for positioning and measuring the expansion and contraction, and the pre-drilling small hole of the top part The position corresponds to the position of the budget hole of the bottom member, and the depth of the top layer of the L13 layer is 1/2 thickness from the top edge of the L13 layer, and the thickness is 1/2 of the thickness of the L13 layer. The overall thickness of the L13 layer after the edge is 2 to 3.5 mm;
步骤2，底层部件制作：Step 2, the bottom part is made:
步骤2.1，开料：按设计结构对PCB基板进行开料，即得L40与L56层两个内层板料；Step 2.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
步骤2.2，板料加工：所述L40层板料进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理，所述L56层板料进行钻孔、等离子、沉铜、一铜、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 2.2, sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
步骤2.3，板料压合：将经步骤2.2处理后的L40层板料和L56层板料进行压合，即得L46层板料，所述L46层板料厚度为4～7mm，板边设有铆合定位孔，所述L46层板料经过钻孔、等离子、沉铜、一铜、背钻、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、控深沉边、表面沉金处理后，即得底层部件，其中所述钻孔包括钻盲孔和预钻小孔，所述预钻小孔按比设计孔径缩小0.2～0.3mm进行加工，采用板边菲林孔定位并测量涨缩，所述预钻小孔的位置和顶层部件的预钻小孔的位置相互对应，所述控深沉边处理时从L46层板料的顶层长边沉边1/2厚度，余厚为L46层板料厚度的1/2，L46层板料沉边后整体厚度为2～3.5mm；Step 2.3: Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the thickness of the L46 layer sheet is 4-7 mm, and the board edge is set. There are riveted positioning holes, the L46 layer is drilled, plasma, copper, copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, depth control, After the surface is subjected to gold immersion treatment, the bottom layer component is obtained, wherein the borehole comprises a blind hole for drilling and a pre-drilled hole, and the pre-drilled hole is processed by a reduction of 0.2 to 0.3 mm than the designed aperture, and the edge of the film is used for positioning. And measuring the expansion and contraction, the position of the pre-drilled small hole and the position of the pre-drilled small hole of the top layer component corresponding to each other, and the deep-side edge of the L46 layer material is 1/2 thickness from the top edge of the L46 layer material, The thickness is 1/2 of the thickness of the L46 layer, and the overall thickness of the L46 layer after the edge is 2 to 3.5 mm;
步骤3，成品制作：将经步骤1制备得到的顶层部件和经步骤2制备得到的底层部件采用铆钉铆紧再进行高温压合，压合后整体厚度为5～6mm；然后进行二钻，即用刃长12mm，直径1.65mm新钻刀，采用一步下钻方式一次钻透预钻小孔，即得NPTH安装孔，测试，外形加工采用正反控深铣加工，以NPTH安装孔做内定位，对正面和反面各控深6mm，外形加工后外形尺寸偏差≤0.10mm，经成品检验合格后即得到超厚5G天线PCB模块。Step 3, the finished product is prepared: the top layer component prepared by the step 1 and the bottom layer component prepared by the step 2 are rivet-wrapped and then subjected to high-temperature pressing, and the overall thickness after pressing is 5-6 mm; Using a new drill with a blade length of 12mm and a diameter of 1.65mm, the pre-drilled hole is drilled once by one-step drilling, that is, the NPTH mounting hole is obtained, and the shape processing is performed by forward and reverse controlled deep milling, and the NPTH mounting hole is used for internal positioning. The depth of the front and back sides is 6mm, and the dimensional deviation after the shape processing is ≤0.10mm. After the finished product inspection, the ultra-thick 5G antenna PCB module is obtained.
根据本发明加工方法加工得到超厚5G天线PCB模块和传统加工方法加工得到超厚5G天线PCB模块的关键参数对比详情请参见表1。Refer to Table 1 for the key parameters of the ultra-thick 5G antenna PCB module processed by the processing method according to the present invention and the ultra-thick 5G antenna PCB module.
表1 不同制作方法制备得到的超厚5G天线PCB模块关键参数对比Table 1 Comparison of key parameters of ultra-thick 5G antenna PCB module prepared by different production methods
Figure 542004dest_path_image002
Figure 542004dest_path_image002
综上所述，本发明制备得到的超厚5G天线PCB模块厚度偏差小，且加工厚度可加工厚度达到7.0mm以上，突破传统加工工艺瓶颈，并且外形尺寸精度控制更佳，尺寸偏差均≤0.10mm，满足批量化生产要求。In summary, the ultra-thick 5G antenna PCB module prepared by the invention has small thickness deviation, and the processing thickness can be processed to a thickness of 7.0 mm or more, which breaks through the bottleneck of the traditional processing technology, and the outer dimension precision control is better, and the dimensional deviation is ≤0.10. Mm, to meet the requirements of mass production.
以上所述，仅为本发明的较佳实施例而已，并非对本发明作任何形式上的限制；凡本行业的普通技术人员均可按说明书附图所示和以上所述而顺畅地实施本发明；但是，凡熟悉本专业的技术人员在不脱离本发明技术方案范围内，可利用以上所揭示的技术内容而作出的些许更动、修饰与演变的等同变化，均为本发明的等效实施例；同时，凡依据本发明的实质技术对以上实施例所作的任何等同变化的更动、修饰与演变等，均仍属于本发明的技术方案的保护范围之内。The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention in any way; and those skilled in the art can smoothly implement the present invention as shown in the drawings and described above. However, those skilled in the art can make equivalent changes to the changes, modifications and evolutions made by the above-disclosed technical contents without departing from the technical scope of the present invention. At the same time, any changes, modifications and evolutions of any equivalent changes made to the above embodiments in accordance with the essential techniques of the present invention are still within the scope of the technical solutions of the present invention.
工业实用性Industrial applicability
本发明提供了一种使用常规设备即可满足超厚天线模块的批量化加工方法，降低超厚天线模块加工工艺难度，提高加工得到的超厚天线模块的精度和产品质量。The invention provides a batch processing method for ultra-thick antenna modules by using conventional equipment, reduces the processing difficulty of the ultra-thick antenna module, and improves the precision and product quality of the processed ultra-thick antenna module.

Claims (10)

  1. 一种超厚5G天线PCB模块加工方法，其特征在于，包括以下加工步骤：An ultra thick 5G antenna PCB module processing method, characterized in that the following processing steps are included:
       步骤1，顶层部件制作：Step 1, top-level component production:
       步骤1.1，开料：按设计结构对PCB基板进行开料，即得L10与L23两个内层板料；Step 1.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L10 and L23 are obtained;
    步骤1.2，板料加工：所述L10层板料和L23层板料分别进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 1.2: Sheet processing: the L10 layer sheet and the L23 layer sheet are separately drilled and positioned, LDI line, inner layer etched, inner layer AOI, and browned;
    步骤1.3，板料压合：将经步骤1.2处理后的L10层板料和L23层板料进行高温压合，即得L13层板料，所述L13层板料经过钻孔、LDI线路、内层蚀刻、内层AOI、控深沉边、阻焊、后固化、棕化处理后，即得顶层部件；Step 1.3: Pressing the sheet material: the L10 layer sheet and the L23 layer sheet processed in step 1.2 are subjected to high temperature pressing, that is, the L13 layer sheet is obtained, and the L13 layer sheet is drilled, LDI line, and inside. After layer etching, inner layer AOI, depth control, solder mask, post-cure, and browning, the top layer component is obtained;
    步骤2，底层部件制作：Step 2, the bottom part is made:
    步骤2.1，开料：按设计结构对PCB基板进行开料，即得L40与L56层两个内层板料；Step 2.1, cutting material: according to the design structure, the PCB substrate is opened, that is, two inner layers of L40 and L56 layers are obtained;
    步骤2.2，板料加工：所述L40层板料进行钻定位孔、LDI线路、内层蚀刻、内层AOI、棕化处理，所述L56层板料进行钻孔、等离子、沉铜、一铜、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、棕化处理；Step 2.2, sheet processing: the L40 layer sheet is drilled, locating holes, LDI lines, inner layer etching, inner layer AOI, browning treatment, the L56 layer sheet is drilled, plasma, copper, copper , resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, browning treatment;
    步骤2.3，板料压合：将经步骤2.2处理后的L40层板料和L56层板料进行压合，即得L46层板料，所述L46层板料经过钻孔、等离子、沉铜、一铜、背钻、树脂塞孔、砂带研磨、LDI线路、内层蚀刻、内层AOI、控深沉边、表面沉金处理后，即得底层部件；Step 2.3: Pressing the sheet material: pressurizing the L40 layer sheet and the L56 layer sheet processed in step 2.2, that is, obtaining the L46 layer sheet, the L46 layer sheet is subjected to drilling, plasma, copper sinking, A copper, back drill, resin plug hole, abrasive belt grinding, LDI line, inner layer etching, inner layer AOI, deep immersion edge, surface immersion gold treatment, then the bottom part;
    步骤3，成品制作：将经步骤1制备得到的顶层部件和经步骤2制备得到的底层部件采用高温压合在一起，然后进行二钻、测试、外形加工，经成品检验合格后即得到超厚5G天线PCB模块。Step 3: Finishing production: the top part prepared by the step 1 and the bottom part prepared by the step 2 are pressed together at a high temperature, and then subjected to two-drilling, testing, and shape processing, and the ultra-thickness is obtained after passing the finished product inspection. 5G antenna PCB module.
  2. 根据权利要求1所述的一种超厚5G天线PCB模块加工方法，其特征在于：步骤1.3所述L13层板料控深沉边处理，所述L13层板料厚度范围为4～7mm，从顶层长边沉边1/2厚度，余厚为L13层板料厚度的1/2。The method for processing an ultra-thick 5G antenna PCB module according to claim 1, wherein the L13 layer material is controlled by a deep edge treatment in the step 1.3, and the L13 layer material has a thickness ranging from 4 to 7 mm, from the top layer. The long side is 1/2 thickness, and the remaining thickness is 1/2 of the thickness of the L13 layer.
  3. 根据权利要求1所述的一种超厚5G天线PCB模块加工方法，其特征在于：所述步骤2.3所述L46层板料控深沉边处理，所述L46层板料厚度范围为4～7mm，从底层长边沉边1/2深度，余厚为L46层板料厚度的1/2。The method for processing an ultra-thick 5G antenna PCB module according to claim 1, wherein: the L46 layer material is controlled by the deep edge processing in the step 2.3, and the thickness of the L46 layer is in the range of 4 to 7 mm. From the long side of the bottom layer to the side of 1/2 depth, the thickness is 1/2 of the thickness of the L46 layer.
  4. 根据权利要求2或3所述的一种超厚5G天线PCB模块加工方法，其特征在于：所述L13层板料和L46层板料分别控深沉边后压合一起的整体厚度为5～6mm。The method for processing an ultra-thick 5G antenna PCB module according to claim 2 or 3, wherein the L13 layer material and the L46 layer sheet are respectively pressed and pressed together and the overall thickness is 5-6 mm. .
  5. 根据权利要求2或3所述的一种超厚5G天线PCB模块加工方法，其特征在于：所述L13层板料和L46层板料的板边均设置有相互配合的铆合定位孔。The method for processing an ultra-thick 5G antenna PCB module according to claim 2 or 3, wherein the L13 layer and the L46 layer are provided with mutually matching riveting positioning holes.
  6. 根据权利要求1所述的一种超厚5G天线PCB模块加工方法，其特征在于：步骤3所述顶层部件和底层部件用铆钉进行压合。The method for processing an ultra-thick 5G antenna PCB module according to claim 1, wherein the top member and the bottom member in step 3 are pressed by a rivet.
  7. 根据权利要求1所述的一种超厚5G天线PCB模块加工方法，其特征在于：步骤1.3和步骤2.3所述钻孔包括钻盲孔和预钻小孔，所述预钻小孔按比设计孔径缩小0.2～0.3mm进行加工，所述顶层部件的预钻小孔的位置和底层部件的预钻小孔的位置相互对应。The method for processing an ultra-thick 5G antenna PCB module according to claim 1, wherein the drilling holes in steps 1.3 and 2.3 comprise a blind hole and a pre-drilled hole, and the pre-drilled hole is designed according to the ratio. The aperture is reduced by 0.2 to 0.3 mm for processing, and the position of the pre-drilled aperture of the top layer component and the position of the pre-drilled aperture of the bottom component correspond to each other.
  8. 根据权利要求7所述的一种超厚5G天线PCB模块加工方法，其特征在于：所述预钻小孔采用板边菲林孔定位并测量涨缩。The method for processing an ultra-thick 5G antenna PCB module according to claim 7, wherein the pre-drilled aperture is positioned by a plate edge film aperture and the expansion and contraction is measured.
  9. 根据权利要求8所述的一种超厚5G天线PCB模块加工方法，其特征在于：步骤3所述二钻为采用一步下钻方式一次钻透预钻小孔，即得NPTH安装孔。The method for processing an ultra-thick 5G antenna PCB module according to claim 8, wherein the two drills in the step 3 are drilled through the pre-drilled holes in a one-step drilling manner, that is, the NPTH mounting holes are obtained.
  10. 根据权利要求9所述的一种超厚5G天线PCB模块加工方法，其特征在于：步骤3中所述外形加工为采用正反控深铣加工，以NPTH安装孔做内定位，对所述超厚5G天线PCB模块的正面和反面各控深6mm，所述外形加工后外形尺寸偏差≤0.10mm。The method for processing an ultra-thick 5G antenna PCB module according to claim 9, wherein in the step 3, the shape is processed by using a forward-reverse-controlled deep-milling process, and the NPTH mounting hole is used for internal positioning. The front and back sides of the thick 5G antenna PCB module are controlled to a depth of 6 mm, and the dimensional deviation after the shape processing is ≤0.10 mm.
PCT/CN2018/119850 2018-03-30 2018-12-07 Ultra-thick 5g antenna pcb module processing method WO2019184439A1 (en)

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