CN109760122A - A kind of half cutting method of mold for taking off lid for rigid-flex combined board - Google Patents
A kind of half cutting method of mold for taking off lid for rigid-flex combined board Download PDFInfo
- Publication number
- CN109760122A CN109760122A CN201811582464.2A CN201811582464A CN109760122A CN 109760122 A CN109760122 A CN 109760122A CN 201811582464 A CN201811582464 A CN 201811582464A CN 109760122 A CN109760122 A CN 109760122A
- Authority
- CN
- China
- Prior art keywords
- isolation film
- rigid
- mold
- straight line
- combined board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of half cutting methods of mold that lid is taken off for rigid-flex combined board, using the fine control capability of Pressesservo, method is partly rushed with mold will be punched into the deep gouge with specific shape on isolation film, cooperative mechanical hand or manpower remove isolation film again, whole process is simple and practical, and can greatly promote isolation film removes efficiency.
Description
Technical field
Lid processing technology is taken off the present invention relates to rigid-flex combined board.
Background technique
As electronic product develops towards frivolous, short and small, multifunction, the wiring board needed should rigid printed board
Welding stability, have flexible printed wiring flexible again, such rigid-flex combined board is main development trend.But it is flexible
Printed wiring board can ground pad or other component pads usually on flexible electric circuit board.Ground pad or other members
Device bonding pad the middle layer for being located at layer structure do outer-layer circuit need to be covered on otherwise flex plate pad with isolation film can quilt
It etches away.Protection cap accomplishes to need when finished product again again to tear the isolation film on surface in order to next processing again, and is isolated
Film tears and is not easy to since it is with certain viscosity.
The present more common method of industry is to be precut using laser cutting technique to isolation film, is recycled artificial
It is removed, but laser cutting speed is slow, causes production efficiency extremely low, and mold corresponding with laser cutting is cut
Method is since its process velocity is fast, increasingly by the concern of researcher.
Summary of the invention
The purpose of the present invention is to solve the above the deficiencies in the prior art, provides and a kind of take off lid for rigid-flex combined board
Half cutting method of mold.
A kind of half cutting method of mold for taking off lid for rigid-flex combined board, comprising:
1) rigid-flex combined board that isolation film is posted on surface is placed on Pressesservo, the isolation film depth is L3；
2) mold hemisection is carried out to isolation film using Pressesservo；Driven by servo motor, cutting die is on isolation film
Several end to end deep gouges are formed, the cross section of the deep gouge includes first, second straightway perpendicular with isolation film,
The first straight line section is located at the outer ring of deep gouge, and first straight line segment length is L1；The second straight line section is located at deep gouge
Inner ring, second straight line segment length are L2；The bottom end of first straight line section and the bottom end of second straight line section pass through the circular arc to bend inwards
It is connected；Described L1-L3=30 μm, and L1 > L2；
3) isolation film being located in deep gouge area encompassed is removed by manipulator or manually.
Preferably, the deep gouge in step 2) is also located at the top of semi-solid preparation layer in rigid-flex combined board.
Preferably, the material of the semi-solid preparation layer is polypropylene.
The utility model has the advantages that
1, compared with manually directly removing, due to deep gouge, removing for isolation film is more easy.
2, deep gouge is processed using half cutting method of mold, than being cut by laser high-efficient, first straight line section, second straight line in deep gouge
The cooperation of section and circular arc, so that isolation film is easier to remove, the cross sectional shape than traditional triangle is more excellent.
3, the least significant end of deep gouge still has 30 μm of distance to the lower surface of isolation film in half cutting method of mold, can prevent cutting die
The semi-solid preparation layer of rigid region is damaged, to prevent influencing the structural stability of rigid-flex combined board, simultaneously because there is guarantor when cutting
Subsequent processing may be will affect, if cutting die leaves the marking on semi-solid preparation layer so as to cause rigid-flexible by protecting liquid or other liquid
Board dysfunction.
Detailed description of the invention
Fig. 1 is the cross-sectional view of rigid-flex combined board hemisection isolation film；
Fig. 2 is the enlarged drawing of a-quadrant in Fig. 1；
Fig. 3 is the schematic diagram that deep gouge is distributed on rigid-flex combined board surface；
1. 2. semi-solid preparation layer of flexible inner layer core plate, 3. isolation film, 4. deep gouge.
Specific embodiment
In order to deepen the understanding of the present invention, below in conjunction with embodiment and attached drawing, the invention will be further described, should
The examples are only for explaining the invention, is not intended to limit the scope of the present invention..
As shown in Figure 1-3, a kind of half cutting method of mold for taking off lid for rigid-flex combined board, comprising:
1) rigid-flex combined board that isolation film 3 is posted on surface is placed on Pressesservo, the isolation film depth is L3.
2) mold hemisection is carried out to isolation film using Pressesservo；As shown in figure 3, driven by servo motor, cutting die
Form several end to end deep gouges 4 on isolation film, 4 area encompassed of deep gouge be next need to remove every
Position from film 3.
As shown in Figs. 1-2, the cross section of the deep gouge includes first, second straightway perpendicular with isolation film, described
First straight line section be located at the outer ring of deep gouge, first straight line segment length is L1；The second straight line section is located at the inner ring of deep gouge,
Second straight line segment length is L2；The bottom end of first straight line section passes through the circular arc to bend inwards with the bottom end of second straight line section and is connected；
Described L1-L3=30 μm, and L1 > L2；The deep gouge is also located at the top of semi-solid preparation layer 2 in rigid-flex combined board.Described
The material of semi-solid preparation layer is polypropylene.When cutting, the least significant end of deep gouge is located at 30 μm of 3 lower surface of isolation film or more, that is, is isolated
Film is not completely cut through, at this point, isolation film still there is certain protection to make the flexible inner layer core plate and semi-solid preparation layer of bottom surface
With can prevent liquid from penetrating into semi-solid preparation layer 2 and flexible inner layer core plate 1.
3) isolation film 3 being located in deep gouge area encompassed is removed by manipulator or manually, since deep gouge 4 is transversal
Face shape is similar to pen head, so section when it tears compared to traditional triangular-section or other shapes is easier to tear
It pulls, to improve work efficiency, improves production efficiency.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (3)
1. a kind of half cutting method of mold for taking off lid for rigid-flex combined board characterized by comprising
1) rigid-flex combined board that isolation film is posted on surface is placed on Pressesservo, the isolation film depth is L3；
2) mold hemisection is carried out to isolation film using Pressesservo；Driven by servo motor, cutting die is formed on isolation film
Several end to end deep gouges, the cross section of the deep gouge includes first, second straightway perpendicular with isolation film, described
First straight line section be located at the outer ring of deep gouge, first straight line segment length is L1；The second straight line section is located at the inner ring of deep gouge,
Second straight line segment length is L2；The bottom end of first straight line section passes through the circular arc to bend inwards with the bottom end of second straight line section and is connected；
Described L1-L3=30 μm, and L1 > L2；
3) isolation film being located in deep gouge area encompassed is removed by manipulator or manually.
2. a kind of half cutting method of mold for taking off lid for rigid-flex combined board according to claim 1, which is characterized in that step 2)
In deep gouge be also located at the top of semi-solid preparation layer in rigid-flex combined board.
3. a kind of half cutting method of mold for taking off lid for rigid-flex combined board according to claim 2, which is characterized in that described
The material of semi-solid preparation layer is polypropylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582464.2A CN109760122A (en) | 2018-12-24 | 2018-12-24 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811582464.2A CN109760122A (en) | 2018-12-24 | 2018-12-24 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109760122A true CN109760122A (en) | 2019-05-17 |
Family
ID=66452121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811582464.2A Pending CN109760122A (en) | 2018-12-24 | 2018-12-24 | A kind of half cutting method of mold for taking off lid for rigid-flex combined board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109760122A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| CN102131348A (en) * | 2010-01-20 | 2011-07-20 | 奥特斯(中国)有限公司 | Method for manufacturing rigid-flexible printed circuit board |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN105246274A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Preparation method for four layer rigid-flex combination board with thickness over 0.32 mm and plugging handle in middle |
| CN106535510A (en) * | 2016-11-15 | 2017-03-22 | 景旺电子科技(龙川)有限公司 | Method for producing rigid-flex PCB lid |
| CN106714456A (en) * | 2016-12-06 | 2017-05-24 | 深圳市深联电路有限公司 | Method of high-precision numerical control V-CUT de-capping on metal copper substrate |
| CN106879195A (en) * | 2017-03-08 | 2017-06-20 | 维沃移动通信有限公司 | A kind of Rigid Flex preparation method and device |
| CN106961784A (en) * | 2017-03-10 | 2017-07-18 | 珠海元盛电子科技股份有限公司 | Rigid Flex, a kind of Rigid Flex prevent from oozing liquid medicine production method and special equipment |
| CN108207078A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
-
2018
- 2018-12-24 CN CN201811582464.2A patent/CN109760122A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4206746C1 (en) * | 1992-03-04 | 1993-06-24 | Degussa Ag, 6000 Frankfurt, De | Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away |
| CN102131348A (en) * | 2010-01-20 | 2011-07-20 | 奥特斯(中国)有限公司 | Method for manufacturing rigid-flexible printed circuit board |
| CN103281859A (en) * | 2013-06-07 | 2013-09-04 | 厦门弘信电子科技有限公司 | Rigid-flex combined circuit board and manufacturing method therefore |
| CN105246274A (en) * | 2015-10-26 | 2016-01-13 | 江苏弘信华印电路科技有限公司 | Preparation method for four layer rigid-flex combination board with thickness over 0.32 mm and plugging handle in middle |
| CN106535510A (en) * | 2016-11-15 | 2017-03-22 | 景旺电子科技(龙川)有限公司 | Method for producing rigid-flex PCB lid |
| CN106714456A (en) * | 2016-12-06 | 2017-05-24 | 深圳市深联电路有限公司 | Method of high-precision numerical control V-CUT de-capping on metal copper substrate |
| CN106879195A (en) * | 2017-03-08 | 2017-06-20 | 维沃移动通信有限公司 | A kind of Rigid Flex preparation method and device |
| CN106961784A (en) * | 2017-03-10 | 2017-07-18 | 珠海元盛电子科技股份有限公司 | Rigid Flex, a kind of Rigid Flex prevent from oozing liquid medicine production method and special equipment |
| CN108207078A (en) * | 2017-12-29 | 2018-06-26 | 江苏弘信华印电路科技有限公司 | Improve the manufacture craft that rigid-flex combined board takes off lid leak |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103997859B (en) | Flexible circuit board capable of being continuously discharged one by one, and preparation method thereof | |
| CN105086858A (en) | Gum and processing mold set, and processing technique thereof | |
| CN201098923Y (en) | Die cutting tool for flexible circuit board | |
| CN106042055B (en) | A kind of continuous cutting adagio technique | |
| CN109760122A (en) | A kind of half cutting method of mold for taking off lid for rigid-flex combined board | |
| CN105392278B (en) | It is a kind of local without glue reinforcing chip former | |
| CN105517326B (en) | It is a kind of local without glue reinforcing chip moulding process | |
| CN206559728U (en) | Rigid Flex and production equipment | |
| CN108188517A (en) | A kind of process of reinforcing chip continuous discharge deburring | |
| CN104647741B (en) | A kind of method that transparent organic thermoplastic is inlayed on metal decking | |
| CN203304157U (en) | Linear array transducer | |
| CN201832892U (en) | Side shearing die for left and right back wheel covers of vehicle | |
| CN206201090U (en) | A kind of circuit board mould | |
| CN108437681A (en) | The mute face effect implementation method of metal light and the shell with the mute face effect of metal light | |
| CN204669729U (en) | A kind of pcb board divides plate tool | |
| CN107846832A (en) | Shield shell component, terminal device and its assembly method and method for dismounting | |
| CN203637113U (en) | Pelletizing die | |
| CN108232398A (en) | A kind of lamination component and preparation method thereof | |
| CN108555130A (en) | A kind of steel disc punching deburring technique | |
| CN103002671A (en) | Manufacture method of joint part of hard-and-soft combined plate | |
| CN204019635U (en) | For making mould and the die-cutting machine of camera buffering spacer | |
| CN206335649U (en) | Mold cutter | |
| CN201880796U (en) | Punching cut die for left and right rear wheel covers of automobile | |
| CN206029981U (en) | Cutting blade device | |
| CN108789608A (en) | A kind of hot melt adhesive is without knife print technique |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190517 |