CN106462284B - Contact panel sensor conductive film, contact panel sensor, touch panel - Google Patents

Abstract

The present invention provides excellent adhesion, with the electrical connectivity for drawing wiring, extraction wiring and detecting electrode that can be miniaturize high contact panel sensor conductive film, contact panel sensor and touch panel.Contact panel sensor conductive film of the invention has substrate, configure the detecting electrode on the surface of at least side of substrate, coating is plated in configuring the pattern-like with the functional group to interact with plating catalyst or its precursor on the periphery of detecting electrode on the side surface with detecting electrode of substrate, configuration is plated the extraction wiring on coating in pattern-like, and it will test electrode and draw the electric conductivity interconnecting piece of wiring electrical connection, drawing wiring is the wiring formed by the method at least with following processes, in this process, coating is plated to pattern-like and assigns plating catalyst or its precursor, pattern-like for having been assigned plating catalyst or its precursor is plated coating and carries out plating.

Description

Contact panel sensor conductive film, contact panel sensor, touch panel

Technical field

The present invention relates to contact panel sensor conductive film, contact panel sensor and touch panels.

Background technique

The conductive film that elecroconductive thin line is formed on substrate is widely used in solar battery, inorganic EL (electroluminescent hair Light, Electro Luminescence) transparent electrode of various electronic devices, various display devices such as element, organic EL element Electromagnetic wave mask, touch panel, in transparent planar heat producing body etc..

Especially in recent years, installation rate of the touch panel on mobile phone, portable game machine etc. rises, being capable of multiple spot The demand of the contact panel sensor conductive film of the electrostatic capacitance method of detection rapidly increases.

As a mode of contact panel sensor conductive film, the mode being equipped with such as lower component: base can be enumerated Plate is arranged the detecting electrode for being used to detect input position on the surface of the substrate and is used to apply voltage to the detecting electrode Extraction wiring (periphery wiring).It should be noted that from productivity, reduce damage to each component from the aspect of, it is conductive Property film manufactured preferably by low temperature process, as shown in patent document 1 is equal, draw wiring in most cases and be using containing Conductive ink (silver ink) etc. of silver and formed.

Existing technical literature

Patent document

Patent document 1: No. 4780254 bulletins of Japan Patent

Summary of the invention

Problems to be solved by the invention

On the other hand, in order to make application of the touch panel in small information terminating machine have progressed, ensure big input area, It is required that the width of frame portion is narrow (narrow frame).In general, touch panel frame portion have draw wiring, thus in order to Corresponding to above-mentioned urgent expectation, it is desirable that draw the miniaturization (width for drawing wiring is made to narrow) of wiring.

But as described above, silver ink etc. has been used in patent document 1, in the silk-screen printing skill of such silver ink In art, there are the limit for the miniaturization of wiring and dimensional accuracy.

In addition, from durability aspect, also the adaptation for drawing wiring is required to mention with the miniaturization for drawing wiring It is high.

In turn, it for the purpose for the contact detection sensitivity for improving touch panel, also requires detecting electrode and draws wiring High electrical connectivity.

In view of the foregoing, the issue of the present invention is to provide a kind of contact panel sensor conductive film, the conductions Property film excellent adhesion, there is the extraction wiring that can miniaturize, the electrical connectivity for drawing wiring and detecting electrode is high.

In addition, project of the invention, which also resides in, provides the touch panel comprising above-mentioned contact panel sensor conductive film Sensor and touch panel.

[means to solve the problem]

The present inventor has made intensive studies problem of the prior art, as a result, it has been found that, contained by being configured on substrate There is the plated coating of particular functional group, coating imparting plating catalyst or its precursor are plated to this to implement plating, be formed Draw wiring；And by the way that the interconnecting piece that will test electrode and draw wiring electrical connection is arranged, it is able to solve the above subject.

That is, the inventors discovered that, it is configured to solve the above subject by following.

(1) a kind of contact panel sensor conductive film, has:

Substrate；

Detecting electrode configures on the surface of at least side of substrate；

Pattern-like is plated coating, in configuration on the side surface with detecting electrode of substrate in the week of detecting electrode Side, and there is the functional group to interact with plating catalyst or its precursor；

Wiring is drawn, configuration is plated on coating in pattern-like；And

Electric conductivity interconnecting piece will test electrode and draw wiring electrical connection；

Drawing wiring is the wiring formed by the method at least with following processes, in this process, to pattern-like quilt Coating layer assigns plating catalyst or its precursor, the pattern-like for having been assigned plating catalyst or its precursor be plated coating into Row plating.

(2) the contact panel sensor conductive film as described in (1), wherein it is for plated that pattern-like, which is plated coating, With the layer that pattern-like assigns energy and is formed, which contains has and plating coating formation composition Cover the functional group of catalyst or the interaction of its precursor and the compound of polymerizable group.

(3) a kind of contact panel sensor conductive film, has:

Substrate；

Plated coating, the plated coating configuration have and interact with plating catalyst or its precursor on substrate Functional group；

Detecting electrode, detecting electrode configuration is on plated coating；

Draw wiring, the extraction wiring on plated coating, configuration is on the periphery of detecting electrode；And

Electric conductivity interconnecting piece, the electric conductivity interconnecting piece will test electrode and draw wiring electrical connection；

Drawing wiring is the wiring formed as follows: plating catalyst or its precursor is assigned for plated coating, for being assigned The plated coating for having given plating catalyst or its precursor carries out plating to form metal layer, by etching metal layer at pattern The wiring is consequently formed in shape.

(4) such as described in any item contact panel sensor conductive films of (1)~(3), wherein electric conductivity interconnecting piece For the interconnecting piece for using conductive paste or conductive ink to be formed by print process.

(5) such as described in any item contact panel sensor conductive films of (1)~(4), wherein detecting electrode is logical Cross the electrode that sputtering method or vapour deposition method are formed.

(6) such as described in any item contact panel sensor conductive films of (1)~(5), wherein with substrate surface neighbour Ground connection configuration priming coat.

(7) such as described in any item contact panel sensor conductive films of (1)~(6), wherein draw the line of wiring Width is 1~10 μm.

(8) a kind of contact panel sensor, it includes described in any item contact panel sensors of (1)~(7) with leading Electrical film.

(9) a kind of touch panel, it includes described in any item contact panel sensor conductive films of (1)~(7).

[The effect of invention]

In accordance with the invention it is possible to provide a kind of contact panel sensor conductive film, the adaptation of the conductive film is excellent It is different, there is the extraction wiring that can be miniaturize, the electrical connectivity for drawing wiring and detecting electrode is high.

In addition, in accordance with the present invention it is further possible to provide the touch panel comprising above-mentioned contact panel sensor conductive film Sensor and touch panel.

Detailed description of the invention

Fig. 1 is the top view of the 1st embodiment of contact panel sensor conductive film of the invention.

Fig. 2 is the sectional view after the cutting line A-A shown in Fig. 1 is cut off.

Fig. 3 is the sectional view after the cutting line B-B shown in Fig. 1 is cut off.

Fig. 4 is the sectional view that an embodiment of the manufacturing method for drawing wiring is shown by process sequence.

Fig. 5 is the top view of the 2nd embodiment of contact panel sensor conductive film of the invention.

Fig. 6 is the sectional view that the cutting line C-C shown in Fig. 5 is cut off.

Fig. 7 is the sectional view that the other embodiment for the manufacturing method for drawing wiring is shown by process sequence.

Fig. 8 is the top view of the 3rd embodiment of contact panel sensor conductive film of the invention.

Fig. 9 is the sectional view that the cutting line D-D shown in Fig. 8 is cut off.

Figure 10 is the top view of the 4th embodiment of contact panel sensor conductive film of the invention.

Figure 11 is the sectional view that the cutting line E-E shown in Figure 10 is cut off.

Specific embodiment

Contact panel sensor of the invention conductive film, contact panel sensor and touch panel are carried out in detail below It describes in detail bright.

It should be noted that in the present specification, the numberical range for using "~" to indicate refers to be remembered comprising "~" front and back Range of the numerical value of load as lower limit value and upper limit value.In addition, the figure in the present invention is schematic diagram, the thickness relationship of each layer or position Setting relationship etc. may not be consistent with actual conditions.

As one of the characteristic point of contact panel sensor conductive film of the invention, can enumerate: to specific The plated coating of functional group implements plating after assigning plating catalyst or its precursor to form extraction wiring this point；And The electric conductivity interconnecting piece this point that will test electrode and draw wiring electrical engagement is set.

As a mode of the manufacturing method for drawing wiring, the very thin figure of line width can be formed by specifically patterning Case shape is plated coating, and wiring is drawn in manufacture on the plated coating of pattern-like later.That is, by will be as the substrate for drawing wiring The line width miniaturization of the plated coating of layer can will be formed by the line width for drawing wiring and miniaturize.In addition, as wiring is drawn Manufacturing method other way, can enumerate and be etched into the mode of pattern-like after forming metal layer for the time being, in this approach, lead to It crosses and the range of etching is controlled, be also able to carry out the miniaturization for drawing the line width of wiring.

In addition, by configuring plated coating between substrate and extraction wiring, additionally it is possible to keep the adaptation for drawing wiring excellent It is different.

It should be noted that the inventor have observed that, in the case where stating plated coating production extraction wiring in use, with The zygosity of detecting electrode may not be high.The reason is not yet clear in detail for it, it is believed that being plated since extraction wiring is configured in On layer, thus when forming extraction wiring across plated coating on detecting electrode, conducting is present such that due to plated coating Property is insufficient.Furthermore, it can be said that when forming detecting electrode on drawing wiring, make due to being plated the influence of the thickness of coating It draws wiring and detecting electrode is easy to produce difference in height, the zygosity of the two is easily reduced.And it is also believed that due to drawing Wiring is that the impurity for being formed by plating, thus being easy to produce in plating appears in the table for drawing wiring Face causes the reduction with the zygosity of detecting electrode；Etc..Then, the inventors discovered that, it will test electrode by setting and draw The electric conductivity interconnecting piece of wiring electrical connection out, is able to solve the above problem.

<<the 1st embodiment>>

The top view of the 1st embodiment of contact panel sensor conductive film of the invention is shown in Fig. 1.Fig. 2 For the sectional view cut off along cutting line A-A.Fig. 3 is the sectional view after being cut off along cutting line B-B.

As shown in Figure 1, there is the contact panel sensor conductive film 10 of present embodiment composition input area (to make For contact panel sensor in use, the input area can carry out input by user operates) middle section E_I, Yi Jiwei In middle section E_IOutside lateral area E_O.It should be noted that area of the middle section in other words as configuration detecting electrode Domain；Lateral area E_OIn other words as the neighboring area (peripheral region) for configuring extraction wiring in the outside of middle section.

Contact panel sensor conductive film 10 has substrate 12 and the configuration (table on the interarea of the side of substrate 12 On face) detecting electrode 14, pattern-like is plated coating 16, draws wiring 18 and electric conductivity interconnecting piece 24.Detecting electrode 14 with draw Wiring 18 is electrically connected by electric conductivity interconnecting piece 24 out.It should be noted that being configured in as shown in figure 3, drawing wiring 18 The pattern-like being configured on 12 surface of substrate is plated the upper surface of coating 16.In other words, the plated coating 16 of pattern-like is located at substrate 12 Between extraction wiring 18.

Above-mentioned composition is described in detail below.16 He of coating is plated to the pattern-like as feature of present invention point first It draws wiring 18 and electric conductivity interconnecting piece 24 is described in detail.

[pattern-like is plated coating 16 and draws wiring 18]

(pattern-like is plated coating 16)

Pattern-like is plated periphery (the lateral area E that coating 16 is configured in detecting electrode 14_O), for being catalyzed with plating The layer of the pattern-like of functional group's (being hereinafter also referred to simply as " interaction property group ") of agent or the interaction of its precursor is (plated Coating).Pattern-like is plated coating 16 according to the function of interaction property group for plating used when wiring is drawn in production It covers catalyst or its precursor is adsorbed (attachment).That is, pattern-like is plated coating as the good of plating catalyst or its precursor Receiving layer play function.

Pattern-like is plated coating 16 and is located at substrate 12 and draws between wiring 18.It is configured that is, pattern-like is plated coating 16 In the position that extraction wiring 18 is configured.It should be noted that as described later, pattern-like is plated the allocation position of coating 16 not It is limited to the mode of Fig. 1, the lateral area E of preferred disposition on the substrate 12_OAt least part (detecting electrode 14 on substrate 12 Periphery at least part), can also be throughout lateral area E_OEntire surface configured.

The thickness that pattern-like is plated coating 16 is not particularly limited, from the aspect of productivity, preferably 0.01~10 μ M, it is more preferably 0.2~5 μm, further preferably 0.25~1.0 μm.

In addition, the line width that pattern-like is plated coating 16 is not particularly limited, from be plated to be configured on coating in pattern-like From the aspect of the low resistive for drawing wiring, preferably 30 μm or less, more preferably 15 μm or less, further preferably 10 μm Hereinafter, preferably 0.5 μm or more, more preferably 1.0 μm or more.

The type of the interaction group contained by coating 16 is plated about pattern-like in following paragraph specifically It is bright.

It constitutes pattern-like and is plated the material of coating 16 and be not particularly limited, can usually enumerate resin (such as (methyl) third Olefin(e) acid system resin (including crosslinking and noncrosslinking (methyl) acrylic resin)), heat-curing resin or thermoplastic can be enumerated The insulative resins such as property resin.In these materials containing interaction property group.So-called (methyl) acrylic resin Refer to the concept including acrylic resin and methacrylic resin.

More specifically, as heat-curing resin, for example, epoxy resin, phenol resin, polyimide resin, Polyester resin, bimaleimide resin, polyolefin resin, isocyanate resin, crosslinking (methyl) acrylic resin etc..Make For thermoplastic resin, for example, phenoxy resin, polyether sulfone, polysulfones, polyphenylsulfone, polyphenylene sulfide, polyphenyl ether, Polyetherimide, noncrosslinking (methyl) acrylic resin etc..

The forming method of coating 16 is plated about pattern-like, as long as the figure with specific interaction property group can be formed The layer of case shape is just not particularly limited, and can suitably enumerate the mode using aftermentioned plated coating formation composition.

(drawing wiring 18)

Drawing wiring 18 is the component undertaken for applying alive effect to detecting electrode 14.It draws wiring 18 and is located at base Lateral area E on plate 12_O, it is electrically connected by detecting electrode 14 corresponding to electric conductivity interconnecting piece 24 and one end, it is another End is located at the position that flexible printed circuit board etc. is configured.

In addition, drawing wiring 18 in Fig. 1 and describing 5, but there is no particular restriction for the number, generally according to detection electricity The number of pole 14 is arranged 2 or more.

The thickness for drawing wiring 18 is not particularly limited, can be according to using purpose suitably to select optimal thickness, from leading From the aspect of electrical characteristics, preferably 0.1 μm or more, more preferably 0.5 μm or more, further preferably 1~30 μm.

The line width for drawing wiring 18 is not particularly limited, from the aspect of the low resistive for drawing wiring, preferably 30 μ M or less, more preferably 15 μm or less, further preferably 10 μm hereinafter, preferably 0.5 μm or more, be more preferably 1.0 μm with On.

Be not particularly limited in addition, constituting and drawing the type of metal of wiring 18, for example, copper, chromium, lead, nickel, Gold, silver, tin, zinc etc., from electric conductivity aspect, preferably copper, gold, silver, more preferable copper, silver.

(pattern-like is plated coating and draws the manufacturing method of wiring)

Pattern-like is plated coating 16 and draws the manufacturing method of wiring 18 to be not particularly limited, from being formed by extraction wiring From the aspect of 18 miniaturization is easy, preferably be implemented on substrate formed pattern-like be plated coating process (process 1) and It is plated form the process (process 2) for drawing wiring on coating in pattern-like.

Component materials used in each process and its process are described in detail below.

[process 1: pattern-like is plated coating formation process]

Process 1 is following processes: to containing with the functional group to interact with plating catalyst or its precursor and polymerizeing Property group compound plated coating formation composition with pattern-like assign energy, on substrate formed pattern-like be plated Layer.More specifically, firstly, as shown in Fig. 4 (A), plated coating is formed on the substrate 12 and forms the film 20 for using composition, such as Shown in Fig. 4 (B), energy is assigned to promote polymerizable group with pattern-like as indicated by black arrows for obtained film 20 It reacts, solidified, then, remove the region for being not endowed with energy, obtain pattern-like and be plated coating 16 (Fig. 4 (C)).

The pattern-like formed using above-mentioned operation is plated coating 16 according to the function of interaction property group in aftermentioned work (attachment) is adsorbed to plating catalyst or its precursor in sequence 2.In addition, polymerizable group passes through the solidification that assigns based on energy It handles and is used in the mutual combination of compound, the excellent pattern-like of stiffness can be obtained and be plated coating 16.

Hereinafter, material used in this process is described in detail first, the process of process is carried out thereafter detailed Explanation.It should be noted that being described in detail in the paragraph below about used substrate.

(plated coating, which is formed, uses composition)

Contain the compound with interaction property group and polymerizable group in plated coating formation composition.

Interaction property group means to urge with the plating for being imparted to the plated coating of pattern-like in aftermentioned process The functional group that agent or its precursor interact, can be used for example can form electrostatic with plating catalyst or its precursor The functional group of interaction can form the nitrogen-containing functional group of coordination with plating catalyst or its precursor, sulfur-bearing functional group, contain Oxygen functional group etc..

It can more specifically be enumerated as interaction property group: amino, amide groups, imide, urea groups, tertiary ammonia Base, ammonium, amidino groups, triazine ring, triazole ring, benzotriazole base, imidazole radicals, benzimidazolyl, quinolyl, pyridyl group, pyrimidine radicals, Pyrazinyl, quinazolyl, quinoxalinyl, purine radicals, triazine radical, piperidyl, piperazinyl, pyrrolidinyl, pyrazolyl, anilino-, Group containing alkyl amine structure, the group containing isocyanide urea structure, nitro, nitroso, azo group, diazo, azido, cyanogen The nitrogen-containing functional groups such as base, cyanic acid ester group (R-O-CN)；Ether, phenolic hydroxyl group, carboxyl, carbonate group, carbonyl, ester group, contains hydroxyl The oxygen-containing functional groups such as the group of N- oxide structure, the group containing S- oxide structure, the group containing N- hydroxyl structure；Thiophene Pheno base, thiol base, ghiourea group, thio cyanuric acid base, benzothiazolyl, mercapto-triazine base, thioether group, sulphur oxygroup (チ オ キ シ Base), sulfoxide group, sulfuryl, sulfurous acid alkali, the group containing sulphoxide imine structure, the group containing sulfoxide salt structure, sulfonic acid The sulfur-bearings functional groups such as base, group containing sulfonate structure；Phosphate (ホ ス Off ォ ー ト) base, phosphino-, contains phosphinylidyne amido The phosphorous functional group such as the group of phosphate ester structure；Group etc. containing halogen atoms such as chlorine, bromines, in the functional group that salt structure can be used In, their salt can also be used.

Wherein, the reason high, high with the adsorption capacity of plating catalyst or its precursor etc. for polarity, preferably carboxyl, sulphur Acidic group, phosphate and boronate isoiony polar group, ether or cyano, more preferable carboxyl or cyano.

In compound, interaction property group may include two or more.In addition, phase interaction contained in compound It is not particularly limited with the number of property group, can be 1 or 2 or more.

Polymerizable group is that the functional group that can form chemical bonding is assigned by energy, for example, free radical polymerization Property group, cationic polymerizable group etc..Wherein, from reactivity it is more excellent from the aspect of, preferred radically polymerizable group Group.As radically polymerizable group group, for example, acrylate-based (acryloxy), methacrylate (first Base acryloxy), itaconic acid ester group, butenoic acid ester group, methacrylate ester group, the unsaturated carboxylic acids ester group such as maleic acid ester group, Styryl, vinyl, acrylamido, methacryl amido etc..Wherein preferred methacryloxy, acryloyl-oxy Base, vinyl, styryl, acrylamido, methacryl amido, particularly preferred methacryloxy, acryloyl-oxy Base, styryl.

In compound, polymerizable group may include two or more.In addition, polymerizable group contained in compound Number be not particularly limited, can be 1, or 2 or more.

Above compound can be low molecular compound or high-molecular compound.Low molecular compound means point Compound of the son amount less than 1000, high-molecular compound mean that molecular weight is 1000 or more compound.

It should be noted that the low molecular compound with above-mentioned polymerizable group is equivalent to so-called monomer (monomer).In addition, so-called high-molecular compound may be the polymer with specific repetitive unit.

In addition, a kind can be used only as compound, can also share two or more.

In the case that above compound is polymer, the weight average molecular weight of polymer is not particularly limited, from dissolubility etc. From the aspect of treatability is more excellent, preferably 1000 or more 70 ten thousand or less, further preferably 2000 or more 20 ten thousand or less. Especially from polymerization sensitivity aspect, preferably 20000 or more.

The synthetic method of such polymer with polymerizable group and interaction property group is not particularly limited, can It uses well known synthetic method (paragraph [0097]~[0125] referring to patent disclosure 2009-280905).

(suitable way 1 of polymer)

As the 1st preferred embodiment of polymer, can enumerate comprising the weight with polymerizable group represented by following formula (a) Multiple unit (also taking the circumstances into consideration to be known as polymerizable group unit below) and the repetition with interaction group represented by following formula (b) The copolymer of unit (also taking the circumstances into consideration to be known as interaction property group unit below).

[changing 1]

In above-mentioned formula (a) and formula (b), R¹~R⁵Each independently represent hydrogen atom or substituted or unsubstituted alkyl (example Such as methyl, ethyl, propyl, butyl).It should be noted that the type of substituent group is not particularly limited, methoxy can be enumerated Base, chlorine atom, bromine atom or fluorine atom etc..

It should be noted that as R¹, preferably hydrogen atom, methyl or the methyl replaced by bromine atom.As R², preferred hydrogen Atom, methyl or the methyl replaced by bromine atom.As R³, preferred hydrogen atom.As R⁴, preferred hydrogen atom.As R⁵, preferably Hydrogen atom, methyl or the methyl replaced by bromine atom.

In above-mentioned formula (a) and formula (b), X, Y and Z each independently represent singly-bound or substituted or unsubstituted divalent is organic Group.As divalent organic group, can enumerating substituted or unsubstituted divalent aliphatic alkyl, (preferably carbon atom number is 1~8. For example, the alkylidenes such as methylene, ethylidene, propylidene), (preferably carbon atom number is substituted or unsubstituted divalent aromatic hydrocarbyl 6~12.Such as phenylene) ,-O- ,-S- ,-SO₂,-N (R)-(R: alkyl) ,-CO- ,-NH- ,-COO- ,-CONH- or by it The group (such as alkylidene oxygroup, alkylidene Epoxide carbonyl, alkylidene carbonyl acyloxy etc.) being composed etc..

As X, Y and Z, from the aspect of the adaptation for being easy, drawing wiring from the synthesis of polymer is more excellent, preferably Singly-bound, ester group (- COO-), amide groups (- CONH-), ether (- O-) or substituted or unsubstituted divalent aromatic hydrocarbyl, it is more excellent Menu key, ester group (- COO-), amide groups (- CONH-).

In above-mentioned formula (a) and formula (b), L¹And L²Each independently represent singly-bound or substituted or unsubstituted divalent organic group Group.It is identical as the meaning of divalent organic group described in above-mentioned X, Y and Z as the definition of divalent organic group.

As L¹, from the aspect of the adaptation for being easy, drawing wiring from the synthesis of polymer is more excellent, preferred fat Race's alkyl or divalent organic group (such as aliphatic alkyl) with urethane bond or urea bond, wherein it is preferred that total carbon is former Subnumber is 1~9.It should be noted that herein, L¹Total carbon atom number refer to by L¹The substituted or unsubstituted divalent indicated is organic Total carbon atom number contained by group.

In addition, from draw wiring adaptation it is more excellent from the aspect of, L²Preferably singly-bound or for divalent fat Race's alkyl, divalent aromatic hydrocarbyl or the group for being composed them.Wherein, L²Preferably singly-bound or total carbon atom number are 1 ~15, it is particularly preferably unsubstituted.It should be noted that herein, L²Total carbon atom number refer to by L²Represented substitution or nothing takes Total carbon atom number contained by the divalent organic group in generation.

In above-mentioned formula (b), W indicates interaction property group.Interaction property group is as defined above.

From the aspect of gelation when from reactive (curability, polymerism) and inhibiting synthesis, relative in polymer Whole repetitive units, the content of above-mentioned polymerizable group unit be preferably 5~50 moles of %, more preferably 5~40 moles of %.

In addition, from the adsorptivity aspect for plating catalyst or its precursor, relative to the whole in polymer Repetitive unit, the content of above-mentioned interaction group unit are preferably 5~95 moles of %, more preferably 10~95 moles of %.

(suitable way 2 of polymer)

As the 2nd preferred embodiment of polymer, can enumerate comprising repetition represented by following formula (A), formula (B) and formula (C) The copolymer of unit.

[changing 2]

Repetitive unit represented by formula (A) is identical as repetitive unit represented by above-mentioned formula (a), the explanation of each group also phase Together.

R in repetitive unit represented by formula (B)⁵, X and L²With the R in repetitive unit represented by above-mentioned formula (b)⁵, X and L²Identical, the explanation of each group is also identical.

Wa in formula (B) indicate hydrophilic radical or its precursor group represented by the aftermentioned V in addition to urged with plating Agent or the group of its precursor interaction.Wherein preferred cyano, ether.

In formula (C), R⁶Each independently represent hydrogen atom or substituted or unsubstituted alkyl.

In formula (C), U indicates singly-bound or substituted or unsubstituted divalent organic group.The definition of divalent organic group with it is upper Divalent organic group meaning represented by X, the Y stated and Z is identical.As U, it is easy from the synthesis of polymer, draws the closely sealed of wiring Property it is more excellent from the aspect of, preferably singly-bound, ester group (- COO-), amide groups (- CONH-), ether (- O-) or replace or Unsubstituted divalent aromatic hydrocarbyl.

In formula (C), L³Indicate singly-bound or substituted or unsubstituted divalent organic group.The definition of divalent organic group with it is upper The L stated¹And L²Represented divalent organic group meaning is identical.As L³, it is easy from the synthesis of polymer, draws the closely sealed of wiring From the aspect of property is more excellent, preferably singly-bound or divalent aliphatic alkyl, divalent aromatic hydrocarbyl or they be composed Group.

In formula (C), V indicates hydrophilic radical or its precursor group.About hydrophilic radical, as long as to represent hydrophily Group be just not particularly limited, for example, hydroxyl, carboxylic acid group etc..In addition, the precursor group of so-called hydrophilic radical Refer to the group that hydrophilic radical is produced by specifically handling (for example, the processing carried out using acid or alkali), such as can be with Enumerate the carboxyl etc. protected by THP (2- THP trtrahydropyranyl).

As hydrophilic radical, from the aspect of the interaction with plating catalyst or its precursor, preferably ion Property polar group.As ionic polar group, specifically, carboxylic acid group, sulfonic group, phosphate, boronate can be enumerated.Its In, from the acidity (not decomposing other functional groups) of appropriateness it is such from the aspect of, preferred carboxylic acid group.

The preferred content of each unit is as follows in 2nd preferred embodiment of above-mentioned polymer.

From the aspect of gelation when from reactive (curability, polymerism) and inhibiting synthesis, relative in polymer Whole repetitive units, the content of repetitive unit represented by formula (A) is preferably 5~50 moles of %, more preferably 5~30 rubs You are %.

From the adsorptivity aspect for plating catalyst or its precursor, list is repeated relative to the whole in polymer The content of member, repetitive unit represented by formula (B) is preferably 5~75 moles of %, more preferable 10~70 moles of %.

From the aspect of developability and moisture-proof adaptation based on aqueous solution, list is repeated relative to the whole in polymer Member, the content of repetitive unit represented by formula (C) are preferably 10~70 moles of %, more preferably 20~60 moles of %, further Preferably 30~50 moles of %.

As the concrete example of above-mentioned polymer, for example, the paragraph of Japanese Unexamined Patent Publication 2009-007540 bulletin [0106] in paragraph [0065]~[0070] of the polymer, Japanese Unexamined Patent Publication 2006-135271 bulletin recorded in~[0112] The polymer etc. recorded in the polymer of record, No. US2010-080964 paragraph [0030]~[0108].

The polymer can be manufactured using well known method (for example, method in the above-mentioned document enumerated).

(suitable way of monomer)

In the case where above compound is so-called monomer, as one of suitable way, it is represented that formula (X) can be enumerated Compound.

[changing 3]

In formula (X), R¹¹~R¹³Each independently represent hydrogen atom or substituted or unsubstituted alkyl.As unsubstituted Alkyl, methyl, ethyl, propyl or butyl can be enumerated.In addition, can be enumerated former by methoxyl group, chlorine as alkyl is replaced The substituted methyl such as son, bromine atom or fluorine atom, ethyl, propyl, butyl.It should be noted that as R¹¹, preferably hydrogen atom or Methyl.As R¹², preferred hydrogen atom.As R¹³, preferred hydrogen atom.

L¹⁰Indicate singly-bound or divalent organic group.As divalent organic group, substituted or unsubstituted aliphatic can be enumerated Alkyl (preferably carbon atom number is 1~8), substituted or unsubstituted aromatic hydrocarbyl (preferably carbon atom number is 6~12) ,-O- ,- S-、-SO₂,-N (R)-(R: alkyl) ,-CO- ,-NH- ,-COO- ,-CONH- or the group that is composed them it is (such as sub- Alkyl oxy, alkylidene Epoxide carbonyl, alkylidene carbonyl acyloxy etc.) etc..

As substituted or unsubstituted aliphatic alkyl, preferably methylene, ethylidene, propylidene or butylidene or this The group that a little groups are obtained by substitutions such as methoxyl group, chlorine atom, bromine atom or fluorine atoms.

As substituted or unsubstituted aromatic hydrocarbyl, preferably unsubstituted phenylene or by methoxyl group, chlorine atom, The phenylene that the substitutions such as bromine atom or fluorine atom obtain.

In formula (X), as L¹⁰One of suitable way ,-NH- aliphatic alkyl-or-CO- aliphatic hydrocarbon can be enumerated Base-.

The definition of W is identical as the meaning of the definition of the W in formula (b), indicates interaction property group.Interaction property group It is as defined above.

In formula (X), as the suitable way of W, ionic polar group, more preferable carboxylic acid group can be enumerated.

In the case that above compound is so-called monomer, as one of other suitable way, formula (1) institute can be enumerated The compound of expression.

[changing 4]

In formula (1), R¹⁰Indicate hydrogen atom, metal cation or quaternary ammonium cation.As metal cation, such as can lift Alkali metal cation (sodium ion, calcium ion), copper ion, palladium ion, silver ion etc. out.It should be noted that as metal sun Ion, the main metal cation for using 1 valence or divalent, using divalent metal cation (such as palladium ion), after The n stated indicates 2.

As quaternary ammonium cation, for example, tetramethyl ammonium, potassium ion etc..

Wherein, from the aspect of the metallic residue after the attachment of plating catalyst or its precursor and patterning, preferred hydrogen Atom.

L in formula (1)¹⁰Definition and above-mentioned formula (X) in L¹⁰Definition meaning it is identical, indicate singly-bound or divalent organic group Group.Divalent organic group is as defined above.

R in formula (1)¹¹~R¹³Definition and the R in above-mentioned formula (X)¹¹~R¹³Definition meaning it is identical, indicate that hydrogen is former Sub or substituted or unsubstituted alkyl.It should be noted that R¹¹~R¹³Suitable way it is as described above.

N indicates an integer of 1 or 2.Wherein, from the acquired aspect of compound, preferably n is 1.

As the suitable way of compound represented by formula (1), compound represented by formula (2) can be enumerated.

[changing 5]

In formula (2), R¹⁰、R¹¹It is as defined above with n.

L¹¹Indicate ester group (- COO-), amide groups (- CONH-) or phenylene.Wherein, if L¹¹It is for amide groups, then acquired Plated coating polymerism and solvent resistance (such as alkali solvent tolerance) improve.

L¹²Indicate singly-bound, divalent aliphatic alkyl (preferably carbon atom number is 1~8, more preferable carbon atom number is 3~5) or 2 Valence aromatic hydrocarbyl.Aliphatic alkyl can be straight-chain, branched, ring-type.It should be noted that in L¹²The case where for singly-bound Under, L¹¹Indicate phenylene.

The molecular weight of compound represented by formula (1) is not particularly limited, dissolubility from volatility, in a solvent, at Film property and treatability etc. are set out, and preferably 100~1000, more preferably 100~300.

Plated coating formation is not particularly limited with the content of the above compound in composition, relative to total composition Preferably 2~50 mass %, more preferably 5~30 mass %.If in above range, then the treatability of composition is excellent, holds Pattern-like easy to control is plated the thickness of coating.

From the aspect of treatability, in plated coating formation with preferably comprising solvent in composition.

The solvent that can be used is not particularly limited, for example: water；Methanol, ethyl alcohol, propyl alcohol, ethylene glycol, 1- first The alcohols solvents such as oxygroup -2- propyl alcohol, glycerol, propylene glycol monomethyl ether；The acid such as acetic acid；The ketones such as acetone, methyl ethyl ketone, cyclohexanone Solvent；The amide solvents such as formamide, dimethyl acetamide, N-Methyl pyrrolidone；The nitrile solvents such as acetonitrile, propionitrile；Acetic acid The esters solvents such as methyl esters, ethyl acetate；The carbonate-based solvents such as dimethyl carbonate, diethyl carbonate；In addition there are ether solvent, Glycolic solvents, amine solvent, thio-alcohol solvent, halogen based solvents etc..

Wherein, preferably alcohols solvent, amide solvent, ketones solvent, nitrile solvents, carbonate-based solvent.

Plated coating formation is not particularly limited with the content of the solvent in composition, is preferably relative to total composition 50~98 mass %, more preferably 70~95 mass %.If in above range, then the treatability of composition is excellent, is easy control Pattern shape is plated the thickness etc. of coating.

Polymerization initiator can be contained in plated coating formation composition.By containing polymerization initiator, further The combination between compound between compound and substrate is formed, the more excellent extraction of adaptation can be obtained as a result and match Line.

It is not particularly limited as used polymerization initiator, thermal polymerization can be used for example, photopolymerization is drawn Send out agent etc..As the example of Photoepolymerizationinitiater initiater, benzophenone, acetophenones, alpha-aminoalkyl benzophenone class, benzene can be enumerated Acyloin class, ketone, thioxanthene ketone class, benzil class, benzyl ketals class, oxime esters, anthrone class, tetramethylthiuram monosulfide class, Double acylphosphine oxide class, acylphosphine oxide class, Anthraquinones, azo-compound etc. and its derivative.

In addition, the example as thermal polymerization, can enumerate diazonium based compound or peroxide based compound etc..

In the case where containing polymerization initiator in plated coating formation composition, the content of polymerization initiator relative to Total composition is preferably 0.01~1 mass %, more preferably 0.1~0.5 mass %.When the content is in above range, group The treatability for closing object is excellent, and the obtained adaptation for drawing wiring is more excellent.

It (wherein can not include that above-mentioned formula (X) or formula (1) are represented containing monomer in plated coating formation composition Compound).By containing monomer, the crosslink density etc. that pattern-like is plated in coating can be suitably controlled.

Used monomer is not particularly limited, for example, can enumerate as the compound with addition polymerization has The compound of ethylenic bond unsaturated bond can enumerate the compound with epoxy group as the compound with ring-opening polymerization Deng.Wherein, it is examined in terms of improving the crosslink density in the plated coating of pattern-like, further increasing the adaptation for drawing wiring Consider, it is preferable to use polyfunctional monomer.So-called polyfunctional monomer refers to the monomer with 2 or more polymerizable groups.Specifically, It is preferable to use the monomers with 2~6 polymerizable groups.

Transport properties of molecules aspect from the cross-linking reaction affected to reactivity, as used more officials The molecular weight of energy monomer is preferably 150~1000, further preferably 200~700.In addition, as multiple polymerisms Interval (distance) between group is preferably 1~15, more preferably 6 or more 10 or less in terms of atomicity.

Plated coating formation with can according to need in composition the other additives of addition (such as sensitizer, curing agent, Polymerization inhibitor, antioxidant, antistatic agent, ultraviolet absorbing agent, filler, particle, fire retardant, surfactant, lubricant, plasticising Agent etc.).

It should be noted that hereinbefore for containing the compound with interaction property group and polymerizable group Plated coating formation is described with composition, but is not limited to which, for example, it is also possible to for containing with interaction The property compound of group and the plated coating formation composition of the compound with polymerizable group.

Interaction property group and polymerizable group are as defined above.

The so-called compound with interaction property group is the compound with interaction property group.Interaction property Group is as defined above.It can be low molecular compound or high-molecular compound as such compound. As the suitable way of the compound with interaction property group, can enumerate with repetition represented by above-mentioned formula (b) The macromolecule (such as polyacrylic acid) of unit.It should be noted that not including in the compound with interaction property group Polymerizable group.

Compound with polymerizable group is so-called monomer, more excellent from the hardness for being formed by plated coating From the aspect of, preferably there is the polyfunctional monomer of 2 or more polymerizable groups.About polyfunctional monomer, in particular, it is preferred that Use the monomer with 2~6 polymerizable groups.From the side of the transport properties of molecules in the cross-linking reaction affected to reactivity Face is set out, and the molecular weight as used polyfunctional monomer is preferably 150~1000, further preferably 200~700.Separately Outside, as the interval (distance) between multiple polymerizable groups, in terms of atomicity preferably 1~15, more preferably 6~ 10。

(process of process 1)

In process 1, plated coating formation composition is configured first on substrate, method is not particularly limited, example Contact above-mentioned plated coating formation on substrate with composition come forming plated coating formation composition as that can enumerate The method of film (plated coating precursor layer).As this method, for example, being coated with above-mentioned plated coating shape on substrate At the method (rubbing method) with composition.

In the case where rubbing method, the method that plated coating formation composition is coated on substrate is not particularly limited, Well known method (such as spin coating, die coating, dip coated etc.) can be used.

From treatability, manufacture efficiency aspect, preferably following manner: being coated with plated coating formation group on substrate Object is closed, is dried removes remaining solvent as needed, forms film.

It should be noted that be dried condition be not particularly limited, from productivity it is more excellent from the aspect of, it is excellent It is selected in room temperature~220 DEG C (preferably 50~120 DEG C) and implements 1~30 minute (preferably 1~10 minute).

The film containing above compound on substrate is not particularly limited in the method that pattern-like assigns energy.Example Such as, it is preferable to use heat treatment, exposure-processed (photo-irradiation treatment), from processing terminate in a short time from the aspect of, it is excellent Select exposure-processed.By assigning energy to film, the polymerizable group in compound is activated, and generates the crosslinking between compound, Carry out the solidification of layer.

In exposure-processed, the light irradiation etc. based on UV (ultraviolet light) lamp, luminous ray etc. is used.As light source, such as There are mercury lamp, metal halide lamp, xenon lamp, chemical lamp, carbon arc lamp etc..As radioactive ray, there are also electron ray, X-ray, ions Beam, far infrared etc..As specific mode, scan exposure, xenon discharge lamp etc. based on infrared laser can be preferably enumerated High illumination flash exposure, infrared lamp exposure etc..

It is different according to the reactivity and light source of compound as the time for exposure, between usually 10 seconds~5 hours.Make The degree for being 10~8000mJ for exposure energy, the preferably range of 50~3000mJ.

It should be noted that be not particularly limited in the method that pattern-like implements above-mentioned exposure-processed, it can be using known Method, for example, being used up across mask to film irradiation exposure.

In addition, blast drier, baking oven, infrared ray can be used in the case where assigning as energy using heating Drying machine, heating drum etc..

Then, the part that energy imparting is not carried out in film is removed, pattern-like is formed and is plated coating.

Above-mentioned removing method is not particularly limited, and properly selects the best approach according to used compound.Such as it can To enumerate the method for using alkaline solution (preferably pH:13.0~13.8) as developer solution.Energy is being removed using alkaline solution In the case where not assigning region, can enumerate the substrate dipping method in the solution that will have the film for having been assigned energy, It is coated with the method etc. of developer solution, the method preferably impregnated on the substrate.In the case where the method impregnated, from life Production property workability etc. is set out, and is preferably 1 minute to 30 minutes or so as dip time.

In addition, as other methods the solvent using above compound is dissolved can be enumerated as developer solution, dipping is wherein Method.

[process 2: drawing wiring formation process]

Process 2 be following processes: to the pattern-like formed in above-mentioned operation 1 be plated coating assign plating catalyst or its Precursor, the pattern-like for having been assigned plating catalyst or its precursor is plated coating and carries out plating, plated in pattern-like It is formed on coating and draws wiring.As shown in Fig. 4 (D), by implementing this process, configuration extraction on coating 16 is plated in pattern-like and is matched Line 18.

It is divided into below and coating is plated to pattern-like assigns the process (process 2-1) of plating catalyst or its precursor and right It is said in the process (process 2-2) that the pattern-like for having been assigned plating catalyst or its precursor is plated coating progress plating It is bright.

(process 2-1: plating catalyst assigns process)

In this process, coating is plated to pattern-like first and assigns plating catalyst or its precursor.Above compound source Interaction group adhere to the plating catalyst or its precursor that (absorption) is assigned according to its function.More specifically, Plating catalyst or its precursor are endowed in plated coating and on plated clad surface.

Plating catalyst or its precursor are functioned as the catalyst or electrode of plating.Therefore, used plating The type for covering catalyst or its precursor is determined according to the type of plating is suitable.

It should be noted that used plating catalyst or its precursor be preferably electroless plating catalyst or its before Body.Mainly electroless plating catalyst or its precursor etc. are described in detail below.

About the electroless plating catalyst used in this process, as long as active nucleus when can become electroless plating, Then any electroless plating catalyst can be used, specifically, the catalysis energy with self catalyzed reduction reaction can be enumerated Metal (being known as the metal for carrying out electroless plating that ionization tendency is lower than Ni) of power etc..Specifically, can enumerate Pd, Ag, Cu, Ni, Pt, Au, Co etc..Wherein, from the aspect of the height of catalytic capability, particularly preferred Ag, Pd, Pt, Cu.

As the electroless plating catalyst, metallic colloid can be used.

It is urged as long as electroless plating catalyst precarsor used in this process can become electroless plating by chemical reaction Agent can use without particular limitation.The gold for the metal mainly enumerated used as above-mentioned electroless plating catalyst Belong to ion.Metal ion as electroless plating catalyst precarsor is become by reduction reaction as electroless plating catalyst 0 valence metal.Metal ion as electroless plating catalyst precarsor is imparted to pattern-like and is plated after coating, is impregnating Before into electroless plating bath, it can be changing into 0 valence metal by other reduction reaction as electroless plating and cover catalysis Agent.In addition it is also possible to be immersed in electroless plating bath with the state of electroless plating catalyst precarsor, electroless plating is utilized Reducing agent in bath is changing into metal (electroless plating catalyst).

Metal ion as electroless plating catalyst precarsor is imparted to pattern-like it is preferable to use metal salt and is plated Layer 16.As used metal salt, as long as being dissolved in solvent appropriate and being dissociated into metal ion and alkali (anion) Person is not particularly limited, and can enumerate M (NO₃)_n、MCl_n、M_2/n(SO₄)、M_3/n(PO₄) (metallic atom of M expression n valence) Deng.As metal ion, the metal ion that above-mentioned metal salt dissociates can be suitably used.For example, Ag from Son, Cu ion, Ni ion, Co ion, Pt ion, Pd ion.Wherein preferably can multiple tooth coordination metal ion, from can match From the aspect of the species number and catalytic capability of the functional group of position, particularly preferred Ag ion, Pd ion, Cu ion.

In this process, it is directly electroplated to be covered without electroless plating, it, can also as used catalyst To use 0 valence metal.

The method for being plated coating 16 to pattern-like is assigned as by plating catalyst or its precursor, such as can prepare and will plate It covers catalyst or its precursor dispersion or is dissolved in solution made of in solvent appropriate (plating catalyst liquid), by the solution coating It is plated be immersed in the solution on coating or by the substrate for being formed with the plated coating of pattern-like in pattern-like.

It is suitable for using water or organic solvent as above-mentioned solvent.It is preferably saturable plated to pattern-like as organic solvent Acetone, methyl acetoacetate, ethyl acetoacetate, ethylene acetate, hexamethylene can be used for example in solvent in coating Ketone, acetylacetone,2,4-pentanedione, acetophenone, 2- (1- cyclohexenyl group) cyclohexanone, propylene-glycol diacetate, glycerol triacetate, diethylene glycol (DEG) two Acetic acid esters, dioxane, N-Methyl pyrrolidone, dimethyl carbonate, ethylene glycol dimethyl ether etc..

The pH for assigning liquid containing the catalyst of plating catalyst or its precursor and solvent is not particularly limited, from aftermentioned It is easy when plating from the aspect of desired position forms the metal layer of desired amount, which is preferably 3.0~ 7.0,3.2~6.8, further preferably 3.5~6.6 are more preferably.

The preparation method that catalyst assigns liquid is not particularly limited, by specific dissolving metal salts in solvent appropriate, PH is adjusted to specific range using acid or alkali as needed.

The concentration of plating catalyst or its precursor in solution is not particularly limited, preferably 0.001~50 mass %, more Preferably 0.005~30 mass %.

In addition, as time of contact, preferably 30 seconds~24 hours or so, more preferably 1 minute~1 hour or so.

The plating catalyst of coating 16 or the adsorbance of its precursor are plated about pattern-like, according to used plating bath Kind, catalyst metals kind, pattern-like are plated the interaction group kind of coating 16, application method etc. and different, from plating It sets out in terms of precipitation property, preferably 5~1000mg/m², more preferably 10~800mg/m², particularly preferably 20~600mg/ m²。

(process 2-2: plating process)

Then, coating is plated to the pattern-like for having been assigned plating catalyst or its precursor and carries out plating.

The method of plating is not particularly limited, for example, electroless plating or electrolytic coating processing (electroplating processes).In this process, it can individually implement electroless plating, electroless plating can also implemented Further implement electrolytic coating processing later.

It should be noted that in the present specification, the one kind of so-called silver mirror reaction as above-mentioned electroless plating And including.It is thus possible to restore accompanying metal ion for example, by silver mirror reaction etc., form desired pattern-like gold Belong to layer, and then implementable electrolytic coating processing thereafter.

The process for covering processing and electrolytic coating processing to electroless plating below is described in detail.

So-called electroless plating refers to operations described below: using dissolution be hopeful in the form of plating be precipitated metal from Metal is precipitated by chemical reaction in the solution of son.

For example preferably following progress of electroless plating in this process: electroless plating catalyst is had been assigned to having The substrate that pattern-like is plated coating is washed, and after removing extra electroless plating catalyst (metal), is immersed in electroless In plating bath, thus electroless plating is carried out.As used electroless plating bath, well known electroless plating can be used Cover bath.

In addition, adsorbing or penetrate into the state that pattern-like is plated in coating in electroless plating catalyst precarsor will be provided with The pattern-like for having been assigned electroless plating catalyst precarsor is plated the substrate of coating and is impregnated into situation in electroless plating bath Under, preferably to substrate carry out washing remove be impregnated into after extra electroless plating catalyst precarsor (metal salt etc.) it is electroless In plating bath.In this case, the reduction and and then of electroless plating catalyst precarsor is carried out in electroless plating bath Electroless plating.It, can also be as described above using well known electroless as electroless plating bath as used herein Plating bath.

It should be noted that the reduction about electroless plating catalyst precarsor, can also use nothing as described above Separately prepare catalytic activity liquid (reducing solution) except the mode of electrolytic coating liquid, as the other process before electroless plating Come carry out.

Mainly include other than solvent (such as water) as the composition of general electroless plating bath: 1. plating The stability-enhanced additive (stabilizer) that metal ion, 2. reducing agents, 3. make metal ion.In the plating bath, in addition to It can also include additive well known to stabilizer of plating bath etc. outside these ingredients.

As organic solvent used in electroless plating bath, it is preferably soluble in the solvent of water, from this viewpoint, preferably Use the alcohols such as the ketones such as acetone, methanol, ethyl alcohol, isopropanol.Type as metal used in electroless plating bath, it is known that There are copper, tin, lead, nickel, gold, silver, palladium, rhodium, wherein from electric conductivity aspect, preferably copper, silver, gold, more preferable copper.And Optimal reducing agent, additive are selected according to above-mentioned metal.

As the dip time in electroless plating bath, preferably 1 minute~6 hours or so, more preferably 1 minute~ 3 hours or so.

In this process, have in the plating catalyst or its precursor for being imparted to the plated coating of pattern-like as electrode In the case where function, the plated coating of pattern-like that catalyst or its precursor can be had been assigned to this is electroplated.

It should be noted that as described above, in this process, can according to need after above-mentioned electroless plating Carry out electrolytic coating processing.Benefit in such a way, can suitably adjust the thickness for being formed by and drawing wiring.

As electric plating method, conventionally known method can be used.It should be noted that as gold used in plating Belong to, copper, chromium, lead, nickel, gold, silver, tin, zinc etc. can be enumerated, from electric conductivity aspect, preferably copper, gold, silver, more preferably Copper.

[electric conductivity interconnecting piece]

Electric conductivity interconnecting piece 24 is the interconnecting piece that will test electrode 14 and draw the electrical connection of wiring 18.Electric conductivity interconnecting piece 24 are configured in the way of connecting respectively with detecting electrode 14 and extraction wiring 18.By configuring electric conductivity interconnecting piece 24, Detecting electrode 14 is further increased with the conduction for drawing wiring 18.

The material for constituting electric conductivity interconnecting piece 24 is not particularly limited, as long as the material for showing electric conductivity, example Golden (Au), silver-colored (Ag), copper (Cu), aluminium (Al) metal (including alloy), electroconductive resin etc. can such as be enumerated.It needs to illustrate It is that, as metal, the form of metal particle can be enumerated.

The forming method of electric conductivity interconnecting piece 24 is not particularly limited, it is preferable to use conductive composition (so-called conduction Property thickener or conductive ink) mode.That is, electric conductivity interconnecting piece 24 is preferably the interconnecting piece formed by conductive composition. Specifically, conductive composition is pressed using print processes such as ink-jet method, silk screen print method, aniline printing method, gravure printing methods It is coated according to the mode to connect with detecting electrode 14 and extraction wiring 18, implements curing process as needed, be consequently formed and lead Electrical junction 24.

It should be noted that the difference of conductive paste and conductive ink is the difference of the viscosity associated with decentralized medium It is different, in conductive paste, macromolecule component is typically contained as decentralized medium, thus viscosity is high, can suitably apply silk Net print process, aniline printing method etc..In conductive ink, low molecular composition is typically contained as decentralized medium, thus viscosity It is low, it can be suitably using ink-jet method etc..

[substrate]

Substrate 12 has 2 interareas, for the component for undertaking following effects: in middle section E_IDetecting electrode 14 is supported, together When in outer side region E_OIt supports pattern-like and is plated coating 16.

The type of substrate 12 is not particularly limited, for example, more specifically resin can be used in insulating substrate Substrate, ceramic substrate, glass substrate etc..

As the material of resin substrate, for example, polyethylene terephthalate, poly- naphthalenedicarboxylic acid ethylene glycol Ester, polyether sulfone, polyacrylic based resin, polyurethane series resin, polyester, polycarbonate, polysulfones, polyamide, polyarylate, polyene Hydrocarbon, cellulose-based resin, polyvinyl chloride, cyclic olefine resin etc..Wherein preferred polyethylene terephthalate, poly- naphthalene diformazan Sour glycol ester or polyolefin.

The thickness (mm) of substrate 12 is not particularly limited, from the aspect of treatability and the balance of slimming, preferably 0.05~2mm, more preferably 0.1~1mm.

In addition, substrate 12 preferably properly penetrates light.Specifically, the total light transmittance of substrate 12 be preferably 85~ 100%.

(priming coat (closely sealed auxiliary layer))

The adaptation that substrate and pattern-like are plated coating (or plated coating) also will receive the surface state, just of substrate sometimes The influence of property.Therefore, it can suitably be configured to improve substrate on substrate according to the type of substrate and pattern-like is plated coating The priming coat of the adaptation of (or plated coating).In other words, being plated in substrate and pattern-like can between coating (or plated coating) With there are priming coats.

In order to improve the adaptation that pattern-like is plated coating (or plated coating) using priming coat, control surface can be taken Energy forms the means for the various raising closing forces such as being chemically combined or utilize the adhesion strength based on stress relaxation with plated coating. In the case where surface energy control, it can be used for example and low molecule layer or macromolecule similar in the surface energy of plated coating Layer.In the case where forming chemical bonding, low molecule layer or macromolecule layer with polymerization activity position can be used.It is utilizing In the case where adhesion strength based on stress relaxation, the low rubbery resin etc. of elasticity modulus can be used.

The thickness of priming coat is not particularly limited, it is often preferred that 0.01~100 μm, more preferably 0.05~20 μm, into One step is preferably 0.05~10 μm.

The material of priming coat is not particularly limited, preferably with the good resin of the adaptation of substrate.Tool as resin Body example, such as can be heat-curing resin, can be thermoplastic resin, additionally can be their mixture, for example, making For heat-curing resin, epoxy resin, phenol resin, polyimide resin, polyester resin, bismaleimide tree can be enumerated Rouge, polyolefin-based resins, isocyanates system resin etc..As thermoplastic resin, for example, phenoxy resin, polyethers Sulfone, polysulfones, polyphenylsulfone, polyphenylene sulfide, polyphenyl ether, polyetherimide, ABS resin etc..

Thermoplastic resin can be used alone respectively with heat-curing resin, two or more can also share.It furthermore can be with Using the resin containing cyano, specifically, can be used ABS resin, Japanese Unexamined Patent Publication 2010-84196 [0039]~ [0063] " polymer containing the unit in side chain with cyano " recorded.

The rubber constituents such as NBR rubber (acrylonitrile butadiene rubber), SBR rubber (butadiene-styrene rubber) additionally can be used.

As one of the suitable way of material for constituting priming coat, can enumerate with the conjugated diene that can be hydrogenated The polymer of compound units.Conjugated diene compound unit refers to the repetitive unit in conjugated diene compound source.As conjugation Diolefin compound is not particularly limited as long as the compound with following molecular structures, which has by one Two carbon-to-carbon double bonds that singly-bound separates.

One of the suitable way of repetitive unit as conjugated diene compound source, can enumerate by with butadiene The polymerization reaction of the compound of skeleton and the repetitive unit generated.

Above-mentioned conjugated diene compound unit can be hydrogenated, in the feelings containing the conjugated diene compound unit being hydrogenated Under condition, the adaptation of pattern-like metal layer is further increased, and is preferred.That is, the repetitive unit in conjugated diene compound source In double bond can be hydrogenated.

In the polymer with the conjugated diene compound unit that can be hydrogenated, above-mentioned interaction can be contained Property group.

As the suitable way of the polymer, nitrile rubber (NBR) can be enumerated, containing carboxy nitrile rubber (XNBR), third Alkene nitrile-butadiene-isoprene rubber (NBIR), acrylonitrile-butadiene-styrene copolymer (ABS resin) or their hydrogen Compound (such as hydrogenated nitrile-butadiene rubber) etc..

Other additives (such as sensitizer, antioxidant, antistatic agent, ultraviolet radiation absorption can be contained in priming coat Agent, filler, particle, fire retardant, surfactant, lubricant, plasticizer etc.).

The forming method of priming coat is not particularly limited, and can enumerate: the method for resin used in lamination on substrate； Necessary ingredient is dissolved in soluble solvent, is coated with dry method on the surface of the substrate using the methods of coating； Etc..

About the acid extraction in coating method, the condition for selecting coating solvent that can sufficiently dry, from system From the aspect of making adaptive, the fire-bar that heating temperature is 200 DEG C or less, the time is the range within 60 minutes is preferably selected Part, more preferably selecting heating temperature is the heating condition of range within 20 minutes for 40~100 DEG C, time.It needs to illustrate It is that used solvent can properly select optimal solvent (such as cyclohexanone, methyl ethyl ketone) according to used resin.

[detecting electrode]

Detecting electrode 14 is the touch panel sensing in the contact panel sensor conductive film comprising present embodiment The sensing electrode that electrostatic capacitance change is perceived in device, is constituted sense part (detecting means).That is, if contacting finger tip with touch panel, Then the mutual electrostatic capacitance between detecting electrode 14 and other electrodes changes, based on the variable quantity using IC (integrated circuit, Integrated circuit) position progress operation of the circuit to finger tip.

Detecting electrode 14 has for close to middle section E_IThe input position of X-direction of operator's finger detected Effect, have and generate the function of electrostatic capacitance between finger at it.Detecting electrode 14 extends in the 1st direction (X-direction), is In the electrode that 2nd direction (Y-direction) orthogonal with the 1st direction is arranged across specified interval.5 detection electricity are provided in Fig. 1 Pole 14, the number are not particularly limited, as long as being 2 or more.

In Fig. 1, detecting electrode 14 is solid membrane, but also may include the specific pattern such as netted.

The material for constituting detecting electrode 14 is not particularly limited, for example, tin indium oxide (ITO), tin oxide, oxygen Change the metal oxides such as zinc, cadmium oxide, gallium oxide, titanium dioxide.Further, it is also possible to using golden (Au), silver-colored (Ag), copper (Cu), Metal or alloy such as aluminium (Al) etc..

The forming method of detecting electrode 14 is not particularly limited, and well known method can be used, for example, it is preferable to concrete sputtering method Or vapour deposition method is formed.

It should be noted that (being not detection electricity in the other end for drawing wiring 18 although not shown in Fig. 1 The end of 14 side of pole) the location of can configure flexible printed circuit board etc..Flexible printed circuit board is that 2 are equipped on substrate The plate of a above wiring and terminal, connect with the respective other end of wiring 18 is drawn, plays electrostatic capacitance touch surface The effect that plate sensor and external device (ED) (such as display device) are attached.

[manufacturing method of contact panel sensor conductive film]

Above-mentioned contact panel sensor is not particularly limited with the manufacturing method of conductive film 10, and well known side can be used Method can mainly enumerate 2 following methods.

(method 1): it will test the configuration of electrode 14 on the substrate 12 behind specific position, on the substrate 12 by pattern-like quilt The configuration of coating layer 16 is plated configuration on coating 16 in pattern-like and draws wiring 18, configure electric conductivity thereafter and connect in specific position The method of socket part 24

(method 2): pattern-like is plated the configuration of coating 16 behind specific position on the substrate 12, is plated in pattern-like Wiring 18 is drawn in configuration on layer 16, will test the configuration of electrode 14 on the substrate 12 thereafter in specific position, configuration is conductive later The method of property interconnecting piece 24

The process that pattern-like is plated coating 16 and extraction wiring 18 is manufactured as using the above method 1 and method 2, preferably in fact Apply the process illustrated in above-mentioned [pattern-like is plated coating and draws the manufacturing method of wiring].

Above-mentioned contact panel sensor conductive film 10 can be suitably used for contact panel sensor.

For example, 2 contact panel sensor conductive films (film A and film B) can be prepared, according to the detection electricity in film A Detecting electrode 14 in pole 14 and film B is opposed and film A in the mode orthogonal with the detecting electrode 14 in film B of detecting electrode 14 Film A and film B is pasted into sticker, other components (such as flexible printed circuit substrate) is connected as needed, obtains electrostatic capacitance The contact panel sensor of formula.

Further, it is also possible to prepare 2 contact panel sensor conductive films (film A and film B), according to the detection in film A Substrate 12 in electrode 14 and film B is opposed and film A in the mode orthogonal with the detecting electrode 14 in film B of detecting electrode 14 will Film A and film B pastes sticker, connects other components (such as flexible printed circuit substrate) as needed, obtains electrostatic capacitance Contact panel sensor.

Above-mentioned such contact panel sensor can be suitably employed in touch panel (especially electrostatic capacitance touch surface Plate) in.

<<the 2nd embodiment>>

The top view of the 2nd embodiment of contact panel sensor conductive film of the invention is shown in Fig. 5.Fig. 6 For the sectional view cut off along cutting line C-C.

Contact panel sensor conductive film 100 shown in fig. 5 has substrate 12 and configuration in the side of substrate 12 Interarea on detecting electrode 14 (on surface), pattern-like be plated coating 160, draw wiring 18 and electric conductivity interconnecting piece 24.It needs It is noted that pattern-like is plated coating 160 throughout lateral area E in Fig. 5_OWhole region configured.In other words, In middle section E_IPattern-like is configured on the surface of substrate 12 in addition is plated coating 160.

Contact panel sensor shown in fig. 5 is in conductive film 100, in addition to pattern-like is plated the configuration bit of coating 160 It sets other than this point, there is same composition with contact panel sensor shown in FIG. 1 conductive film 10, thus for identical Constitutive requirements assign identical reference marks and the description thereof will be omitted, are mainly plated coating 160 to pattern-like below and are described in detail.

Pattern-like, which is plated the plated coating 16 of the pattern-like illustrated in 160 and the 1st embodiment of coating, has same composition, Allocation position only on the substrate 12 is different.

It is plated the forming method of coating 160 as pattern-like, can enumerate and the pattern that illustrates in the first embodiment described above Shape is plated the same process of forming method of coating 16, makes the tax in above-mentioned [process 1: pattern-like is plated coating formation process] The region for giving energy is entire lateral area E_O?.

In the present embodiment, the manufacturing method for drawing wiring 18 is not particularly limited, can be suitably enumerated following Process 3 (draw wiring formation process).The process of process 3 is described in detail below.

[process 3: drawing wiring formation process]

Process 3 is following processes: being plated coating to pattern-like and assigns plating catalyst or its precursor, for having been assigned plating The plated coating for covering catalyst or its precursor carries out plating, is plated form metal layer on coating in pattern-like, will be acquired Etching metal layer at pattern-like, formed and draw wiring.More specifically, firstly, as shown in Fig. 7 (A), prepare configuration pattern-like The substrate 12 of plated coating 160；Then, as shown in Fig. 7 (B), to pattern-like be plated coating 160 assign plating catalyst or its before Body implements plating, is plated form metal layer 30 on coating 160 in pattern-like；Then, as shown in Fig. 7 (C), by metal layer 30 are etched with pattern-like, obtain drawing wiring 18.

In this process, coating 160 is plated to pattern-like and assigns plating catalyst or its precursor, for having been assigned plating The pattern-like of catalyst or its precursor is plated coating 160 and carries out plating, is plated form metal layer on coating 160 in pattern-like 30, the process of process 2-1 and process 2-2 described in the process of this process and the 1st above-mentioned embodiment is identical, thus saves Slightly its detailed description.

The process that the process for drawing wiring 18 is formed below for metal layer 30 is etched into pattern-like carries out specifically It is bright.

In the formation for drawing wiring 18, any method be can be used, specifically, using commonly known subtractive process (mask of pattern-like is set on the metal layer, after being etched to the region of not formed mask, removes mask, formation is drawn The method of wiring out), semi-additive process (on the metal layer be arranged pattern-like mask, formed according in the region of not formed mask The mode of metal layer carries out plating, removes mask, is etched, and forms the method for drawing wiring).

About subtractive process, specifically following methods: resist layer being arranged on being formed by metal layer, passes through pattern Exposure, development are formed pattern identical with extraction wiring is formed by and are removed using resist pattern as mask using etching solution Metal layer forms and draws wiring.Any material can be used as resist, minus, eurymeric, liquid, membranaceous can be used Resist.In addition, in the manufacture of printed circuit board, used any method be can be used as engraving method, can make With wet etching, dry-etching etc., as long as any selection.About the operating aspect of operation, from the simplicity of device etc. From the aspect of, preferred wet etching.As etching solution, the aqueous solution of copper chloride, iron chloride (III) etc. can be used for example.

About semi-additive process, specifically following methods: resist layer being arranged on being formed by metal layer, passes through figure Case exposure, development form pattern identical with non-metallic layer drafting department, carry out electrolytic coating for resist pattern as mask, remove Implement fast-etching after going resist pattern, metal layer is removed by pattern-like, to form extraction wiring.Resist, etching solution Etc. material identical with subtractive process can be used.In addition, the method as electrolytic coating processing, can be used the side of above-mentioned record Method.

It should be noted that removed gold will can be located at as needed when stating the etching process of metal layer on the implementation Metal ion contained in the plated coating of the pattern of the underface of category layer restores the metallic particles to be formed and removes together.

It should be noted that the removing method of above-mentioned metallic particles is not particularly limited, by adjusting used etching Type, the etching period of liquid can also implement the removing of metallic particles together with the removing of metal layer.

<<the 3rd embodiment>>

The top view of the 3rd embodiment of contact panel sensor conductive film of the invention is shown in Fig. 8.Fig. 9 For the sectional view cut off along cutting line D-D.

Contact panel sensor conductive film 200 shown in Fig. 8 has substrate 12, configuration being plated on the substrate 12 Detecting electrode 14, extraction wiring 18 and the electric conductivity interconnecting piece 24 of layer 22 and configuration on plated coating 22.In fig. 8, quilt Coating layer 22 configures the whole region on the surface of substrate 12, and detecting electrode 14 is configured on plated coating 22 and draws wiring 18。

Contact panel sensor shown in Fig. 8 uses quilt with the plated coating 16 of pattern-like is not used in conductive film 200 Coating layer 22, and the configuration of each component is changed, it is conductive with contact panel sensor shown in FIG. 1 other than these aspects Property film 10 have it is same constitute, thus assign identical reference marks for identical constitutive requirements and the description thereof will be omitted, it is main below Plated coating 22 is described in detail.

The pattern-like illustrated in plated 22 and the 1st embodiment of coating is plated the composition having the same of coating 16, only in base Configuring area on plate 12 is different.Specifically, plated coating 22 has interaction property group.

The forming method of plated coating 22 is not particularly limited, and can enumerate process same as the first embodiment described above, Make the whole region of the region substrate 12 of the imparting energy in above-mentioned [process 1: pattern-like is plated coating formation process] i.e. It can.

In addition, the manufacturing method for drawing wiring 18 is not particularly limited, can suitably enumerate in above-mentioned 2nd embodiment The process 3 (drawing wiring formation process) of narration.

<<the 4th embodiment>>

It is plated for single side configuration detecting electrode, the pattern-like in substrate in the 1st embodiment into the 3rd embodiment The mode of coating (or plated coating), extraction wiring and electric conductivity interconnecting piece is described, but can also be in the two-sided of substrate Configure detecting electrode, pattern-like is plated coating (or plated coating), draws wiring and electric conductivity interconnecting piece.

Figure 10 shows the top view of the 4th embodiment of contact panel sensor conductive film of the invention.Figure 11 For the sectional view cut off along cutting line D-D.

As shown in Figure 10, contact panel sensor conductive film 300 has substrate 12 and configuration the two of substrate 12 Detecting electrode 14, pattern-like on face are plated coating 16, draw wiring 18 and electric conductivity interconnecting piece 24.It should be noted that such as Shown in Figure 10, the detecting electrode 14 that is configured on the surface of substrate 12 and the detecting electrode 14 that is configured at the back side of substrate 12 according to Orthogonal mode is configured.

Embodiment

The present invention is illustrated in further detail below by embodiment, but the present invention is not limited to these.

(synthesis example: polymer 1)

Ethyl acetate 1L, 2- ethylaminoethanol 159g are added in the three-necked flask of 2L, is cooled down using ice bath.It is adjusted to Interior temperature is 20 DEG C or less and 2- bromo isobutyl acylbromide 150g is added dropwise thereto.Thereafter so that interior temperature is risen to room temperature (25 DEG C) and react 2 Hour.After reaction terminating, additional distilled water 300mL stops reaction.Thereafter ethyl acetate phase is carried out using distilled water 300mL 4 cleanings, are dried, and then ethyl acetate is distilled off, to obtain raw material A 80g later using magnesium sulfate.

Then, raw material A 47.4g, pyridine 22g, ethyl acetate 150mL are added into the three-necked flask of 500mL, utilizes ice Bath is cooled down.Being adjusted to interior temperature is 20 DEG C or less dropwise addition acryloyl chloride 25g thereto.Thereafter it rises to room temperature and reaction 3 is small When.After reaction terminating, additional distilled water 300mL stops reaction.Thereafter 4 are carried out to ethyl acetate phase using distilled water 300mL Secondary cleaning, is dried using magnesium sulfate later, and then ethyl acetate is distilled off.Thereafter list below is obtained using column chromatography Body M1 (20g).

[changing 6]

N,N-dimethylacetamide 8g is added in the three-necked flask of 500mL, is heated to 65 DEG C under nitrogen flowing.Utilize 4 Monomer M1:14.3g, acrylonitrile (Tokyo Chemical Industry Co., Ltd's manufacture) 3.0g, acrylic acid is added dropwise in the time of hour thereto The DMAC N,N' dimethyl acetamide 8g solution of (Tokyo chemical conversion manufacture) 6.5g, V-65 (and pure medicine manufacture) 0.4g.

After completion of dropwise addition, reaction solution is futher stirred 3 hours.Thereafter n,N-dimethylacetamide 41g is added, it will be anti- Solution is answered to be cooled to room temperature.4- hydroxyl TEMPO (Tokyo chemical conversion manufacture) 0.09g, DBU (phenodiazine is added into above-mentioned reaction solution Miscellaneous bicyclic endecatylene) 54.8g, it carries out reacting for 12 hours at room temperature.70 mass % methanesulfonic acids are added in its backward reaction solution Aqueous solution 54g.After reaction terminating, reprecipitation is carried out using water, solid matter is taken out, obtains polymer 1 (12g).

Obtained polymer 1 is carried out using IR (infrared, infrared) measuring machine (manufactured by the production of (strain) hole field) Identification.In the assay, make polymer dissolution in acetone, carried out using KBr crystal.According to IR measurement as a result, 2240cm^-1Nearby observe peak value, it is known that acrylonitrile is directed in polymer as nitrile unit.In addition, passing through acid value measuring Know that acrylic acid is imported into as carboxylic acid.Also, it is dissolved in polymer in deuterated DMSO (dimethyl sulfoxide), utilizes The NMR (nuclear magnetic resonance, Nuclear Magnetic Resonance) (AV-300) of the 300MHz of Bruker manufacture is measured. It is found that the broad peak corresponding to nitrile group-containing unit is observed in 2.5-0.7ppm (5H), in 7.8-8.1ppm (1H), 5.8-5.6ppm (1H), 5.4-5.2ppm (1H), 4.2-3.9ppm (2H), 3.3-3.5ppm (2H), 2.5-0.7ppm (6H) are observed and are corresponded to The broad peak of the unit containing polymerizable group is observed in 2.5-0.7ppm (3H points) and corresponds to the broad peak containing carboxylic acid, containing polymerization Property group unit: nitrile group-containing unit: carboxylic acid group's unit=30:30:40 (mol%).

[changing 7]

<plated coating forms the preparation for using composition>

Water (18.95 mass parts), propylene glycol monomethyl ether (75.8 matter are added in the 200ml beaker that merging has magnetic agitation Measure part), polymer 1 (5 mass parts) and IRGACURE OXE 02 (manufacture of BASF society) (0.25 mass parts), modulation liquid obtains Composition is used in plated coating formation.

<embodiment 1>

By glass substrate (Corning manufacture) at 150 DEG C after heat drying 1 hour, at 1500 rpm on the glass substrate Spin coating priming coat forms composition (Nipol1561 (Japanese Zeon is manufactured) water dispersion solution (40.5 matter of total solid content concentration Measure part)) 1 minute, it is 30 minutes dry at 120 DEG C, form priming coat.Then, spin coating is plated coating and forms use on priming coat Composition, it is 5 minutes dry at 80 DEG C.Thereafter, through the negative of the pattern for being 3 μm/3 μm with line width/spacing (line/space) Type carries out UV irradiation (energy: 2J, 10mW, wavelength: 256nm) to substrate under atmosphere with mask, using 1% sodium bicarbonate into Row development, so that forming pattern-like is plated coating (thickness: 0.25 μm).

After the face for being unpatterned the glass substrate that shape is plated coating is covered using maintenance band (day east electrician manufacture), At room temperature by the glass substrate for being plated coating with pattern-like in Pd catalyst only to be assigned to liquid MAT-2 (upper village's industry manufacture) MAT-2A impregnate 5 minutes in (catalyst assign liquid, pH:3.5) solution after 5 times of dilutions, utilize pure water cleaning 2 times. Then it is cleaned 2 times dipping 5 minutes in reducing agent MAB (upper village's industry manufacture) using pure water at 36 DEG C.Thereafter at room temperature Dipping 5 minutes in activation liquid MEL-3 (upper village's industry manufacture), without cleaning, divide at room temperature Not dipping 60 minutes in electroless plating covering liquid Thru-cup PEA (upper village's industry manufacture).The band for removing covering, utilizes pure water Cleaning 2 times obtains being plated the glass substrate for having pattern-like layers of copper (be equivalent to and draw wiring) on coating in pattern-like.

Then, using indium oxide and tin oxide is the composition of weight ratio 95:5, packed density is 98% indium oxide-oxidation Tin target forms ITO layer by the region that is not configured pattern-like layers of copper of the sputtering method on obtained glass substrate, utilizes photograph Phase lithography by it is Resist patterning, be etched, obtain the ITO layer (being equivalent to detecting electrode) of pattern-like.

In turn, the conductive ink containing silver nano-grain is added dropwise by ink-jet method between pattern-like layers of copper and ITO layer (Harima Chemicals NPS-JL) implements the processing that is heating and curing, and is formed pattern-like layers of copper and ITO layer electrical connection The electric conductivity interconnecting piece being made of silver, obtains conductive film.

<embodiment 2>

By glass substrate (Corning manufacture) at 150 DEG C after heat drying 1 hour, at 1500 rpm on the glass substrate Spin coating priming coat forms composition (Nipol1561 (Japanese Zeon is manufactured) water dispersion solution (40.5 matter of total solid content concentration Measure part)) 1 minute, it is 30 minutes dry at 120 DEG C, form priming coat.Then, spin coating is plated coating and forms use on priming coat Composition, it is 5 minutes dry at 80 DEG C.Thereafter, under atmosphere to film entire surface carry out UV irradiation (energy: 2J, 10mW, wavelength: 256nm), it is formed plated coating (thickness: 0.25 μm).

After the face of the glass substrate of not formed plated coating is covered using maintenance band (day east electrician manufacture), at room temperature To there is the glass substrate of plated coating to carry out in the MAT-2A only assigned Pd catalyst in liquid MAT-2 (upper village's industry manufacture) It impregnates 5 minutes in solution after 5 times of dilutions, is cleaned 2 times using pure water.Then in reducing agent MAB (upper village's industry system at 36 DEG C Make) middle dipping 5 minutes, utilize pure water to clean 2 times.Thereafter at room temperature in activation liquid MEL-3 (upper village's industry manufacture) Middle dipping 5 minutes, without cleaning, at room temperature respectively in (the upper village electroless plating covering liquid Thru-cup PEA Industry manufacture) middle dipping 60 minutes.The band for removing covering is cleaned 2 times using pure water, obtains having layers of copper on plated coating Glass substrate.

Using vacuum laminator, (name mechanism is made made: MVLP-600) will be dry against corrosion under conditions of 70 DEG C, 0.2MPa Agent film (Hitachi's chemical conversion system；15 μm of RY3315, film thickness) it is laminated in obtained layers of copper.Next, making to be laminated with dry against corrosion The substrate of agent film and the glass mask that can form combed wiring specified in JPCA-ET01 (according to JPCA-BU01-2007) are close It closes, irradiates the light energy of 70mJ to resist using the exposure machine that central wavelength is 405nm.With spraying to after exposure for 0.2MPa Substrate spray attachment 1%Na₂CO₃Aqueous solution develops.The followed by washing and drying of substrate, forming line width/spacing is 8 μ M/8 μm of resist pattern.

The substrate for being formed with resist pattern is immersed in FeCl at 40 DEG C of temperature₃In/HCL aqueous solution (etching solution), Thus it is etched, the layers of copper present in the region of not formed resist pattern is removed.Thereafter, spraying with 0.2MPa Resist pattern is swollen and removes by spray attachment 3%NaOH aqueous solution on substrate, be neutralized using 10% aqueous sulfuric acid, It is washed, to obtain the glass substrate for having pattern-like layers of copper (be equivalent to and draw wiring).

Using obtained glass substrate, the ITO layer and electric conductivity of pattern-like are formed according to process same as Example 1 Interconnecting piece obtains conductive film.

<comparative example 1>

Without using pattern-like layers of copper using conductive ink (Harima Chemicals society manufactures NPS-JL), spray is utilized The method of the use of ink and water (FUJIFILM Dimatix society manufactures DMP2831) pattern-making shape silver layer (be equivalent to and draw wiring), in addition to this, is pressed Conductive film is obtained according to process same as Example 1.

Wherein, using conductive ink ink-jet method in, due to the problem in the performance of device, only obtained line width/ The pattern-like silver layer that spacing is 100 μm/100 μm.

<miniaturization evaluation>

Line width/spacing size of the pattern-like silver layer of pattern-like layers of copper and comparative example 1 about Examples 1 and 2, according to Benchmark below is evaluated.

" A ": it is capable of forming the case where line width/spacing amplitude is 5 μm of patterns below

" B ": it is capable of forming the case where line width/spacing amplitude is all larger than 5 μm and is 10 μm of patterns below

" C ": the case where line width/spacing amplitude is all larger than 10 μm of pattern is only formd

<adaptation evaluation>

(adhesive tape peel test)

As evaluation method, carried out after the pattern-like silver layer of the pattern-like layers of copper and comparative example 1 that form Examples 1 and 2 Adhesive tape peel test, it is unstripped for pattern-like layers of copper or pattern-like silver layer according to following benchmark and remain in the remaining on substrate Rate is evaluated.

It should be noted that adhesive tape peel test is implemented according to JIS K5600-5-6.

" A ": remaining 90~100% the case where

" B ": the case where being removed more than 10%

<connectivity evaluation>

(connection resistance measurement)

As evaluation method, to the resistance value between above-mentioned pattern-like layers of copper (or pattern-like silver layer) and pattern-like ITO layer It is measured and (sets motor society manufacture, Milliohm HiTester 3540 day), evaluated according to benchmark below.

" A ": resistance value is the situation of 10m Ω or less

" B ": resistance value is greater than the case where 10m Ω

" C ": can not determine resistance value, substantially there is a situation where break

Above-mentioned evaluation result one is listed in table 1.

It should be noted that " X " in " processing method " column, which refers to, is plated formation figure on coating in pattern-like in table 1 The method of case shape layers of copper, " Y " refer to the method being etched to layers of copper to form pattern-like layers of copper.

[table 1]

	Plated coating	Processing method	Miniaturization evaluation	Adaptation evaluation	Resistive evaluation
						Embodiment 1	Have	X	A	A	A
Embodiment 2	Have	Y	B	A	A
						Comparative example 1	Nothing	―	C	B	A

Pattern-like layers of copper as shown in above-mentioned Examples 1 and 2, in contact panel sensor conductive film of the invention (be equivalent to and draw wiring) is able to carry out miniaturization, while adaptation is also excellent.Also, pattern-like layers of copper (is equivalent to ITO layer Detecting electrode) electrical connectivity also increase.

On the other hand, in the comparative example 1 using conductive ink, pattern-like silver layer (be equivalent to draw wiring) originally without Method miniaturization, and the adaptation for being formed by pattern-like silver layer is also poor.

<embodiment 3>

By glass substrate (Corning manufacture) at 150 DEG C after heat drying 1 hour, at 1500 rpm on the glass substrate Spin coating priming coat forms composition (Nipol1561 (Japanese Zeon is manufactured) water dispersion solution (40.5 matter of total solid content concentration Measure part)) 1 minute, it is 30 minutes dry at 120 DEG C, form priming coat.Then, in 1500rpm, spin coating is plated on priming coat Layer, which is formed, to be used composition 1 minute, 5 minutes dry at 80 DEG C.Thereafter, through specific minus mask under atmosphere to substrate into Row UV irradiates (energy: 2J, 10mW, wavelength: 256nm), is developed using 1% sodium bicarbonate, thus in the pattern with Fig. 1 Shape is plated the same position of coating 16 and forms the plated coating of pattern-like.

Using the obtained glass substrate for being plated coating with pattern-like, scheming according to process same as Example 1 Case shape is plated pattern-making shape layers of copper on coating.The extraction wiring 18 of obtained pattern-like layers of copper and Fig. 1 are located at same position It sets.

Then, ITO layer is made using sputtering method, photolithography, makes ITO layer configuration in the detecting electrode 14 of Fig. 1 Position.

In turn, using ink-jet method, by the conductive ink containing silver nano-grain, (Harima Chemicals society is manufactured NPS-JL it) is added drop-wise between pattern-like layers of copper and ITO layer and forms the electric conductivity interconnecting piece 24 of Fig. 1, implement the processing that is heating and curing, Form the electric conductivity interconnecting piece being made of silver.

It should be noted that obtained touch panel shown similarly to Example 1 with conductive film it is desired Effect (miniaturization, low resistive, high adhesion).

In addition, forming pattern-like in position same as the plated coating 160 of the pattern-like of Fig. 5 is plated coating, in addition to this, Touch panel conductive film is obtained according to process same as described above.

In turn, by implementing the above process on the two sides of glass substrate, the touch panel for having obtained mode shown in Figure 10 is used Conductive film.

The explanation of symbol

10,100,200,300 contact panel sensor conductive films

12 substrates

14 detecting electrodes

16,160 pattern-likes are plated coating

18 draw wiring

20 films

22 plated coating

24 electric conductivity interconnecting pieces

30 metal layers

Claims (10)

1. a kind of contact panel sensor conductive film, has:

Substrate；

Detecting electrode, the detecting electrode configure on the surface of at least side of aforesaid substrate；

Pattern-like is plated coating, which is plated coating and matches on the side surface with above-mentioned detecting electrode of aforesaid substrate It sets on the periphery of above-mentioned detecting electrode, and there is the functional group to interact with plating catalyst or its precursor；

Wiring is drawn, extraction wiring configuration is plated on coating in above-mentioned pattern-like；And

Above-mentioned detecting electrode and above-mentioned extraction wiring are electrically connected by electric conductivity interconnecting piece, the electric conductivity interconnecting piece；

Above-mentioned extraction wiring is the wiring formed by the method at least with following processes, in this process, to above-mentioned pattern Shape is plated coating and assigns plating catalyst or its precursor, for the above-mentioned pattern-like quilt for having been assigned plating catalyst or its precursor Coating layer carries out plating.

2. contact panel sensor conductive film as described in claim 1, wherein above-mentioned electric conductivity interconnecting piece is described The detecting electrode and the extraction wiring are passed through into print process using conductive paste or conductive ink with postponing on substrate The interconnecting piece of formation.

3. contact panel sensor conductive film as claimed in claim 1 or 2, wherein above-mentioned pattern-like is plated coating and is For being plated coating formation composition with the layer that pattern-like assigns energy and is formed, which contains Compound with functional group and polymerizable group with plating catalyst or the interaction of its precursor.

4. a kind of contact panel sensor conductive film, has:

Substrate；

Plated coating, the plated coating configuration have and interact with plating catalyst or its precursor on aforesaid substrate Functional group；

Detecting electrode, the detecting electrode configure on above-mentioned plated coating；

Wiring is drawn, the extraction wiring is in configuration on above-mentioned plated coating on the periphery of above-mentioned detecting electrode；And

Above-mentioned detecting electrode and above-mentioned extraction wiring are electrically connected by electric conductivity interconnecting piece, the electric conductivity interconnecting piece；

Above-mentioned extraction wiring is the wiring formed as follows: plating catalyst or its precursor is assigned to above-mentioned plated coating, for upper It states and has been assigned the plated coating of plating catalyst or its precursor and carry out plating and form metal layer, above-mentioned metal layer is lost It is carved into pattern-like, the wiring is consequently formed.

5. contact panel sensor conductive film as claimed in claim 4, wherein above-mentioned electric conductivity interconnecting piece is described The detecting electrode and the extraction wiring are passed through into print process using conductive paste or conductive ink with postponing on substrate The interconnecting piece of formation.

6. such as described in any item contact panel sensor conductive films of claim 1,2,4 and 5, wherein above-mentioned detection Electrode is the electrode formed by sputtering method or vapour deposition method.

7. such as described in any item contact panel sensor conductive films of claim 1,2,4 and 5, wherein with above-mentioned base Plate surface adjacently configures priming coat.

8. such as described in any item contact panel sensor conductive films of claim 1,2,4 and 5, wherein above-mentioned extraction The line width of wiring is 1~10 μm.

9. a kind of contact panel sensor, it includes described in any item contact panel sensors of claim 1~8 conductions Property film.

10. a kind of touch panel, it includes described in any item contact panel sensor conductive films of claim 1~8.