CN106462284A - Conductive film for touch panel sensor, touch panel sensor, and touch panel - Google Patents

Abstract

The present invention provides: a conductive film that is for a touch panel sensor and has superior adhesiveness, a lead wire that can be more minute, and high electrical connectivity between the lead wire and a detection electrode; a touch panel sensor; and a touch panel. The conductive film for a touch panel sensor is provided with: a substrate; a detection electrode disposed at least at one surface of the substrate; a patterned coated layer disposed at the periphery of the detection electrode on the surface of the substrate at which the detection electrode is disposed, and having a functional group that interacts with a coating catalyst or a precursor thereof; a lead wire disposed on the patterned coated layer; and a conductive connection section that electrically connects the detection electrode and the lead wire. The lead wire is formed by means of a method having at least a step for imparting the coating catalyst or precursor thereof onto the patterned coated layer, and performing coating processing of the patterned coated layer to which the coating catalyst or precursor thereof has been imparted.

Description

Contact panel sensor conductive film, contact panel sensor, contact panel

Technical field

The present invention relates to contact panel sensor conductive film, contact panel sensor and contact panel.

Background technology

The conductive film being formed with elecroconductive thin line on substrate is widely used in solar cell, inorganic EL (electroluminescent Light, Electro Luminescence) transparency electrode of the various electronic device such as element, organic EL element, various display device Electromagnetic wave shade, contact panel, in transparent planar heat producing body etc..

Particularly in recent years, installation rate on mobile phone, portable game machine etc. for the contact panel rises, being capable of multiple spot The demand of the contact panel sensor conductive film of electrostatic capacitance mode of detection rapidly increases.

As a mode of contact panel sensor conductive film, the mode being provided with as lower component can be enumerated：Base Plate, the setting detecting electrode for detecting input position on the surface of the substrate and for this detecting electrode applied voltage Wiring lead (periphery distribution).It should be noted that from the aspect of productivity ratio, the infringement to each part for the minimizing, conductive Property film is manufactured preferably by low temperature process, and as shown in patent document 1 grade, wiring lead is in most cases using containing Conductive ink (silver-colored ink) etc. of silver and formed.

Prior art literature

Patent document

Patent document 1：No. 4780254 publications of Japan Patent

Content of the invention

Invent problem to be solved

On the other hand, in order that application in small information terminating machine for the contact panel gets along with, guarantees big input area, Require the narrow width (narrow frame) of frame portion.Generally, the frame portion in contact panel has wiring lead, thus in order to Corresponding to above-mentioned urgent expectation it is desirable to the miniaturization (making the narrowed width of wiring lead) of wiring lead.

But, as described above, employing silver-colored ink etc. in patent document 1, in the serigraphy skill of such silver ink In art, there is the limit in the miniaturization of distribution and dimensional accuracy.

In addition, with the miniaturization of wiring lead, from the aspect of durability, also requiring the adaptation of wiring lead to carry High.

And then, for the purpose of the contact detection sensitivity improving contact panel, also require detecting electrode and wiring lead High electrical connectivity.

In view of the foregoing, the problem of the present invention is to provide a kind of contact panel sensor conductive film, this conduction Property film excellent adhesion, there is the wiring lead being capable of miniaturization, wiring lead is high with the electrical connectivity of detecting electrode.

Additionally, the problem of the present invention also resides in provides the contact panel comprising above-mentioned contact panel sensor conductive film Sensor and contact panel.

【Means to solve the problem】

The present inventor has made intensive studies for problem of the prior art, it was found that being contained by configuring on substrate There is the plated coating of particular functional group, give plating catalyst to this plated coating or its precursor to implement plating, formation Wiring lead；And by setting by the connecting portion of detecting electrode and wiring lead electrical connection, can solve the problem that above-mentioned problem.

That is, the inventors discovered that, be configured to solve above-mentioned problem by following.

(1) a kind of contact panel sensor conductive film, it possesses：

Substrate；

Detecting electrode, its configuration is on the surface of at least side of substrate；

The plated coating of pattern-like, it configures the week in detecting electrode on a side surface with detecting electrode of substrate Side, and be there is the functional group being interacted with plating catalyst or its precursor；

Wiring lead, its configuration is on the plated coating of pattern-like；And

Electric conductivity connecting portion, detecting electrode is electrically connected by it with wiring lead；

Wiring lead is the distribution by least having the formation of the method for following operations, in this operation, to pattern-like quilt Coating layer gives plating catalyst or its precursor, and for the pattern-like having been assigned plating catalyst or its precursor, plated coating enters Row plating.

(2) the contact panel sensor conductive film as described in (1), wherein, the plated coating of pattern-like is for plated Coating formation composition gives energy and the layer that formed with pattern-like, and this plated coating formation composition contains and has and plating Cover catalyst or the functional group of its precursor interaction and the compound of polymerizable group.

(3) a kind of contact panel sensor conductive film, it possesses：

Substrate；

Plated coating, this plated coating configures on substrate, and has and plating catalyst or the interaction of its precursor Functional group；

Detecting electrode, this detecting electrode configures on plated coating；

Wiring lead, this wiring lead on plated coating, configuration detecting electrode periphery；And

Electric conductivity connecting portion, detecting electrode is electrically connected by this electric conductivity connecting portion with wiring lead；

Wiring lead is the following distribution being formed：Give plating catalyst or its precursor for plated coating, for being assigned Give plating catalyst or the plated coating of its precursor to carry out plating to form metal level, etching metal layer has been become pattern Shape, is consequently formed this distribution.

(4) the contact panel sensor conductive film as described in any one of (1)～(3), wherein, electric conductivity connecting portion It is the connecting portion being formed by print process using conductive paste or conductive ink.

(5) the contact panel sensor conductive film as described in any one of (1)～(4), wherein, detecting electrode is logical Cross the electrode that sputtering method or vapour deposition method are formed.

(6) the contact panel sensor conductive film as described in any one of (1)～(5), wherein, adjacent with substrate surface Ground connection configuration priming coat.

(7) the contact panel sensor conductive film as described in any one of (1)～(6), wherein, the line of wiring lead A width of 1～10 μm.

(8) a kind of contact panel sensor, it comprises the contact panel sensor described in any one of (1)～(7) with leading Electrically film.

(9) a kind of contact panel, it comprises the contact panel sensor conductive film described in any one of (1)～(7).

【The effect of invention】

In accordance with the invention it is possible to provide a kind of contact panel sensor conductive film, the adaptation of this conductive film is excellent Different, there is the wiring lead being capable of miniaturization, wiring lead is high with the electrical connectivity of detecting electrode.

Additionally, in accordance with the present invention it is further possible to provide comprising the contact panel of above-mentioned contact panel sensor conductive film Sensor and contact panel.

Brief description

Fig. 1 is the top view of the 1st embodiment of the contact panel sensor conductive film of the present invention.

Fig. 2 is the sectional view after being cut off along the cutting line A-A shown in Fig. 1.

Fig. 3 is the sectional view after being cut off along the cutting line B-B shown in Fig. 1.

Fig. 4 is the sectional view of the embodiment of manufacture method illustrating wiring lead by process sequence.

Fig. 5 is the top view of the 2nd embodiment of the contact panel sensor conductive film of the present invention.

Fig. 6 is the sectional view being cut off along the cutting line C-C shown in Fig. 5.

Fig. 7 is the sectional view of the other embodiment of manufacture method illustrating wiring lead by process sequence.

Fig. 8 is the top view of the 3rd embodiment of the contact panel sensor conductive film of the present invention.

Fig. 9 is the sectional view being cut off along the cutting line D-D shown in Fig. 8.

Figure 10 is the top view of the 4th embodiment of the contact panel sensor conductive film of the present invention.

Figure 11 is the sectional view being cut off along the cutting line E-E shown in Figure 10.

Specific embodiment

Below the contact panel sensor of the present invention is carried out with conductive film, contact panel sensor and contact panel in detail Describe in detail bright.

It should be noted that in this manual, use "～" number range that represents refer to comprise "～" before and after remembered The numerical value carrying is as the scope of lower limit and higher limit.In addition, the figure in the present invention is schematic diagram, the thickness relationship of each layer or position Putting relation etc. may not be consistent with actual conditions.

One of characteristic point of contact panel sensor conductive film as the present invention, can enumerate：Specific to having The plated coating of functional group is implemented plating to form wiring lead this point after giving plating catalyst or its precursor；And Arrange the electric conductivity connecting portion this point of detecting electrode and wiring lead electrical engagement.

As a mode of the manufacture method of wiring lead, the very thin figure of live width can be formed by specific patterning The plated coating of case shape, manufactures wiring lead afterwards on the plated coating of pattern-like.That is, by using the substrate as wiring lead The live width miniaturization of the plated coating of layer, can be by the live width miniaturization of the wiring lead being formed.In addition, as wiring lead Manufacture method alternate manner, can enumerate and form metal level after etching for the time being and become the mode of pattern-like, in this approach, lead to Cross the scope to etching to be controlled it is also possible to carry out the miniaturization of the live width of wiring lead.

In addition, by configure plated coating between substrate and wiring lead additionally it is possible to make wiring lead adaptation excellent Different.

It should be noted that the inventor have observed that, in the case of making wiring lead using above-mentioned plated coating, with The zygosity of detecting electrode may not be high.Its detailed reason is still not clear, it is believed that being plated because wiring lead is configured in On layer, thus on detecting electrode when plated coating forms wiring lead, conducting is present such that due to plated coating Property is insufficient.In addition it can be said that when forming detecting electrode on wiring lead, being made due to the impact of the thickness of plated coating Wiring lead and detecting electrode easily produce difference in height, and both zygosities are easily reduced.And it is also believed that due to drawing Distribution is formed by plating, thus the impurity easily producing in plating appears in the table of wiring lead Face, causes the reduction with the zygosity of detecting electrode；Etc..Then, the inventors discovered that, by setting by detecting electrode with draw Go out the electric conductivity connecting portion of distribution electrical connection, can solve the problem that the problems referred to above.

<<1st embodiment>>

The top view of the 1st embodiment of the contact panel sensor conductive film of the present invention is shown in Fig. 1.Fig. 2 It is the sectional view being cut off along cutting line A-A.Fig. 3 is the sectional view after being cut off along cutting line B-B.

As shown in figure 1, the contact panel sensor conductive film 10 of present embodiment has composition input area (making When using for contact panel sensor, this input area can carry out input operation by user) middle section E_I, Yi Jiwei In middle section E_IOutside exterior lateral area E_O.It should be noted that middle section is in other words as the area of configuration detecting electrode Domain；Exterior lateral area E_OConfigure the neighboring area (peripheral region) of wiring lead in other words as the outside in middle section.

Contact panel sensor conductive film 10 possesses substrate 12 and configuration (table on the interarea of the side of substrate 12 On face) detecting electrode 14, the plated coating of pattern-like 16, wiring lead 18 and electric conductivity connecting portion 24.Detecting electrode 14 with draw Go out distribution 18 to be electrically connected by electric conductivity connecting portion 24.It should be noted that as shown in figure 3, wiring lead 18 is configured in It is configured above the plated coating of pattern-like 16 on substrate 12 surface.In other words, the plated coating of pattern-like 16 is located at substrate 12 And wiring lead 18 between.

Below above-mentioned composition is described in detail.First to the plated coating of pattern-like 16 He as feature of present invention point Wiring lead 18 and electric conductivity connecting portion 24 are described in detail.

[the plated coating of pattern-like 16 and wiring lead 18]

(the plated coating of pattern-like 16)

The plated coating of pattern-like 16 is configured in periphery (exterior lateral area E of detecting electrode 14_O), for having and plating catalysis The layer of the pattern-like of functional group's (being hereinafter also referred to simply as " interaction group ") of agent or the interaction of its precursor is (plated Coating).The plated coating of pattern-like 16 is according to the function of interaction group for making the plating being used during wiring lead Cover catalyst or its precursor is adsorbed (attachment).That is, the plated coating of pattern-like is good as plating catalyst or its precursor Receiving layer given play to function.

The plated coating of pattern-like 16 is located between substrate 12 and wiring lead 18.That is, the plated coating of pattern-like 16 is configured The position being configured in wiring lead 18.It should be noted that as described later, the allocation position of the plated coating of pattern-like 16 is not It is limited to the mode of Fig. 1, preferred disposition exterior lateral area E on the substrate 12_OAt least a portion (detecting electrode 14 on substrate 12 Periphery at least a portion) it is also possible to spread all over exterior lateral area E_OEntire surface configured.

The thickness of the plated coating of pattern-like 16 is not particularly limited, from the aspect of productivity ratio, preferably 0.01～10 μ M, more preferably 0.2～5 μm, more preferably 0.25～1.0 μm.

Additionally, the live width of the plated coating of pattern-like 16 is not particularly limited, from configured on the plated coating of pattern-like From the aspect of the low resistive of wiring lead, preferably less than 30 μm, more preferably less than 15 μm, more preferably 10 μm Hereinafter, preferably more than 0.5 μm, more preferably more than 1.0 μm.

With regard to the interaction group contained by the plated coating of pattern-like 16 species in following paragraph specifically Bright.

The material constituting the plated coating of pattern-like 16 is not particularly limited, and generally can enumerate resin (such as (methyl) third Olefin(e) acid system resin (including crosslinked and noncrosslinking (methyl) acrylic resin)), heat-curing resin or thermoplastic can be enumerated The insulative resins such as property resin.Interaction group is contained in these materials.So-called (methyl) acrylic resin Refer to the concept of acrylic resin and methacrylic resin.

More specifically, as heat-curing resin, for example can enumerate epoxy resin, phenol resin, polyimide resin, Polyester resin, bimaleimide resin, vistanex, isocyanate resin, crosslinking (methyl) acrylic resin etc..Make For thermoplastic resin, for example can enumerate phenoxy resin, polyether sulfone, polysulfones, PPSU, polyphenylene sulfide, polyphenyl ether, PEI, noncrosslinking (methyl) acrylic resin etc..

With regard to the forming method of the plated coating of pattern-like 16, as long as the figure with specific interaction group can be formed The layer of case shape is just not particularly limited, and can suitably enumerate the mode using plated coating formation composition described later.

(wiring lead 18)

Wiring lead 18 is the part undertaking for the effect to detecting electrode 14 applied voltage.Wiring lead 18 is located at base Exterior lateral area E on plate 12_O, it is electrically connected with the detecting electrode 14 corresponding to its one end by electric conductivity connecting portion 24, another End is located at the position that flexible printed circuit board etc. is configured.

In addition, in FIG, wiring lead 18 describes 5, but this number there is no particular restriction, generally according to detection electricity The number of pole 14 arranges more than 2.

The thickness of wiring lead 18 is not particularly limited, and can suitably select optimal thickness according to application target, from leading From the aspect of electrical characteristics, preferably more than 0.1 μm, more preferably more than 0.5 μm, more preferably 1～30 μm.

The live width of wiring lead 18 is not particularly limited, from the aspect of the low resistive of wiring lead, preferably 30 μ Below m, more preferably less than 15 μm, more preferably less than 10 μm, preferably more than 0.5 μm, be more preferably 1.0 μm with On.

Additionally, the species of metal constituting wiring lead 18 is not particularly limited, for example can enumerate copper, chromium, lead, nickel, Gold, silver, tin, zinc etc., from the aspect of electric conductivity, preferably copper, gold, silver, more preferably copper, silver.

(manufacture method of the plated coating of pattern-like and wiring lead)

The manufacture method of the plated coating of pattern-like 16 and wiring lead 18 is not particularly limited, from the wiring lead being formed From the aspect of 18 miniaturization is easy, preferably be implemented on substrate formed the plated coating of pattern-like operation (operation 1) and The operation (operation 2) of wiring lead is formed on the plated coating of pattern-like.

Below component materials used in each operation and its process are described in detail.

[operation 1：Pattern-like plated coating formation process]

Operation 1 is following operations：To containing being there is the functional group being interacted with plating catalyst or its precursor and be polymerized Property group compound plated coating formation composition with pattern-like give energy, on substrate formed pattern-like be plated Layer.More specifically, first, as shown in Fig. 4 (A), form the film 20 of plated coating formation composition on the substrate 12, such as Shown in Fig. 4 (B), give energy thus promoting polymerizable group with pattern-like as indicated by black arrows for obtained film 20 React, solidified, then, remove the region being not endowed with energy, obtain the plated coating of pattern-like 16 (Fig. 4 (C)).

The plated coating of pattern-like 16 being formed using above-mentioned operation is according to the function of interaction group in work described later In sequence 2, (attachment) is adsorbed to plating catalyst or its precursor.Additionally, polymerizable group is by the solidification being given based on energy Process and be used in compound combination each other, the plated coating 16 of the excellent pattern-like of stiffness can be obtained.

Hereinafter, the material first this operation being used is described in detail, and thereafter the process of operation is carried out in detail Explanation.It should be noted that with regard to the substrate being used, describing in detail in paragraph below.

(plated coating formation composition)

The compound with interaction group and polymerizable group is contained in plated coating formation composition.

Interaction group means to urge with the plating being imparted to the plated coating of pattern-like in operation described later Agent or the functional group of its precursor generation interaction, for example, can use and can form electrostatic with plating catalyst or its precursor The functional group that the interacts or nitrogen-containing functional group of coordination, sulfur-bearing functional group can be formed, contain with plating catalyst or its precursor Oxygen functional group etc..

As interaction group, more specifically, can enumerate：Amino, amide groups, imide, urea groups, tertiary ammonia Base, ammonium, amidino groups, triazine ring, triazole ring, BTA base, imidazole radicals, benzimidazolyl, quinolyl, pyridine radicals, pyrimidine radicals, Pyrazinyl, quinazolyl, quinoxalinyl, purine radicals, triazine radical, piperidyl, piperazinyl, pyrrolidinyl, pyrazolyl, anilino-, Group containing alkyl amine structure, the group containing isocyanide urea structure, nitro, nitroso, azo group, diazo, azido, cyanogen The nitrogen-containing functional groups such as base, cyanic acid ester group (R-O-CN)；Ether, hydroxyl, phenolic hydroxyl group, carboxyl, carbonate group, carbonyl, ester group, contain The oxygen-containing functional groups such as the group of N- oxide structure, the group containing S- oxide structure, the group containing N- hydroxyl structure；Thiophene Fen base, thiol base, ghiourea group, thio cyanuric acid base, benzothiazolyl, mercapto-triazine base, thioether group, sulphur epoxide (チ オ キ シ Base), sulfoxide group, sulfuryl, sulfurous acid alkali, the group containing sulphoxide imine structure, the group containing sulfoxide salt structure, sulfonic acid The sulfur-bearing functional groups such as base, the group containing sulfonic acid ester structure；Phosphate (ホ ス Off ォ ト) base, phosphinylidyne amido, phosphino-, contain The phosphorous functional group such as group of phosphate ester structure；Group containing halogen atoms such as chlorine, bromines etc., in the functional group that can adopt salt structure In, their salt can also be used.

Wherein, the reason high for polarity and plating catalyst or its precursor etc. adsorption capacity is high, preferably carboxyl, sulphur Acidic group, phosphate and boronate isoiony polar group, ether or cyano group, more preferably carboxyl or cyano group.

In compound, interaction group can comprise two or more.Additionally, contained phase interaction in compound It is not particularly limited with the number of property group, can be 1, can also be more than 2.

Polymerizable group is to give, by energy, the functional group that can form chemical bonding, for example, can enumerate radical polymerization Property group, cationic polymerizable group etc..Wherein, from the aspect of reactivity is more excellent, preferably free-radical polymerised base Group.As free-radical polymerised group, for example, can enumerate acrylate-based (acryloxy), methacrylic acid ester group (first Base acryloxy), itaconic acid ester group, butenoic acid ester group, methacrylate ester group, the unsaturated carboxylic acid ester group such as maleic acid ester group, Styryl, vinyl, acrylamido, methacryl amido etc..Wherein preferred methacryloxy, acryloyl-oxy Base, vinyl, styryl, acrylamido, methacryl amido, particularly preferred methacryloxy, acryloyl-oxy Base, styryl.

In compound, polymerizable group can comprise two or more.Additionally, contained polymerizable group in compound Number be not particularly limited, can for 1, can also be more than 2.

Above-claimed cpd can be low molecular compound, can also be macromolecular compound.Low molecular compound means point The compound less than 1000 for the son amount, macromolecular compound means the compound that molecular weight is more than 1000.

It should be noted that the low molecular compound with above-mentioned polymerizable group is equivalent to so-called monomer (monomer).In addition, so-called macromolecular compound can also be the polymer with specific repetitive.

Additionally, can be only using a kind it is also possible to share two or more as compound.

In the case that above-claimed cpd is polymer, the weight average molecular weight of polymer is not particularly limited, from dissolubility etc. From the aspect of treatability is more excellent, less than less than preferably more than 1,000 70 ten thousand, more preferably more than 2,000 20 ten thousand. Particularly from the aspect of polymerization sensitivity, preferably more than 20000.

The synthetic method of such polymer with polymerizable group and interaction group is not particularly limited, can Using known synthetic method (referring to patent paragraph [0097]～[0125] of open No. 2009-280905).

(suitable way 1 of polymer)

As the 1st preferred embodiment of polymer, the weight comprising that there is the polymerizable group represented by following formula (a) can be enumerated Multiple unit (also taking the circumstances into consideration referred to as polymerizable group unit below) and the repetition with the interaction group represented by following formula (b) The copolymer of unit (also taking the circumstances into consideration referred to as interaction group unit below).

【Change 1】

In above-mentioned formula (a) and formula (b), R¹～R⁵Represent hydrogen atom or substituted or unsubstituted alkyl (example independently of one another As methyl, ethyl, propyl group, butyl etc.).It should be noted that the species of substituent is not particularly limited, methoxy can be enumerated Base, chlorine atom, bromine atoms or fluorine atom etc..

It should be noted that as R¹, preferably hydrogen atom, methyl or the methyl being replaced by bromine atoms.As R², preferably hydrogen Atom, methyl or the methyl being replaced by bromine atoms.As R³, preferably hydrogen atom.As R⁴, preferably hydrogen atom.As R⁵, preferably Hydrogen atom, methyl or the methyl being replaced by bromine atoms.

In above-mentioned formula (a) and formula (b), X, Y and Z represent that singly-bound or substituted or unsubstituted divalent are organic independently of one another Group.As divalent organic group, (preferably carbon number is 1～8 can to enumerate substituted or unsubstituted divalent aliphatic alkyl. For example, the alkylidene such as methylene, ethylidene, propylidene), (preferably carbon number is substituted or unsubstituted divalent aromatic hydrocarbyl 6～12.Such as phenylene) ,-O- ,-S- ,-SO₂-、-N(R)-(R：Alkyl) ,-CO- ,-NH- ,-COO- ,-CONH- or by it The group (such as alkylidene epoxide, alkylidene Epoxide carbonyl, alkylidene carbonyl acyloxy etc.) combining etc..

As X, Y and Z, from the synthesis of polymer easily, the adaptation of wiring lead more excellent from the aspect of, preferably Singly-bound, ester group (- COO-), amide groups (- CONH-), ether (- O-) or substituted or unsubstituted divalent aromatic hydrocarbyl, more excellent Menu key, ester group (- COO-), amide groups (- CONH-).

In above-mentioned formula (a) and formula (b), L¹And L²Represent singly-bound or substituted or unsubstituted divalent organic group independently of one another Group.As the definition of divalent organic group, identical with the implication of the divalent organic group of narration in above-mentioned X, Y and Z.

As L¹, from the synthesis of polymer easily, the adaptation of wiring lead more excellent from the aspect of, preferred fat Race's alkyl or the divalent organic group (such as aliphatic alkyl) with amino-formate bond or urea bond, wherein preferably total carbon are former Subnumber is 1～9.It should be noted that herein, L¹Total carbon atom number refer to by L¹The substituted or unsubstituted divalent representing is organic Total carbon atom number contained by group.

In addition, from the aspect of the adaptation of wiring lead is more excellent, L²Be preferably singly-bound or for divalent fat Race's alkyl, divalent aromatic hydrocarbyl or the group that they are combined.Wherein, L²Being preferably singly-bound or total carbon atom number is 1 ～15, particularly preferably unsubstituted.It should be noted that herein, L²Total carbon atom number refer to by L²Represented replacement or nothing take The total carbon atom number contained by divalent organic group in generation.

In above-mentioned formula (b), W represents interaction group.Interaction group is as defined above.

From the aspect of gelation when reactive (curability, polymerism) and suppression synthesis, with respect in polymer Whole repetitives, the content of above-mentioned polymerizable group unit is preferably 5～50 moles of %, more preferably 5～40 moles of %.

Additionally, from the aspect of the adsorptivity for plating catalyst or its precursor, with respect to whole in polymer Repetitive, the content of above-mentioned interaction group unit is preferably 5～95 moles of %, more preferably 10～95 moles of %.

(suitable way 2 of polymer)

As the 2nd preferred embodiment of polymer, can enumerate and comprise following formula (A), formula (B) and the repetition represented by formula (C) The copolymer of unit.

【Change 2】

Repetitive represented by formula (A) is identical with the repetitive represented by above-mentioned formula (a), the explanation also phase of each group With.

The R in repetitive represented by formula (B)⁵, X and L²With the R in the repetitive represented by above-mentioned formula (b)⁵, X and L²Identical, the explanation of each group is also identical.

Wa in formula (B) represent hydrophilic radical or its precursor group represented by except V described later in addition to urge with plating Agent or the group of its precursor interaction.Wherein preferred cyano group, ether.

In formula (C), R⁶Represent hydrogen atom or substituted or unsubstituted alkyl independently of one another.

In formula (C), U represents singly-bound or substituted or unsubstituted divalent organic group.The definition of divalent organic group with upper X, the Y stating is identical with the divalent organic group implication represented by Z.As U, easy, wiring lead closely sealed from the synthesis of polymer Property more excellent from the aspect of, preferably singly-bound, ester group (- COO-), amide groups (- CONH-), ether (- O-) or replace or Unsubstituted divalent aromatic hydrocarbyl.

In formula (C), L³Represent singly-bound or substituted or unsubstituted divalent organic group.The definition of divalent organic group with upper The L stating¹And L²Represented divalent organic group implication is identical.As L³, easy, wiring lead closely sealed from the synthesis of polymer From the aspect of property is more excellent, preferably singly-bound or divalent aliphatic alkyl, divalent aromatic hydrocarbyl or they combine Group.

In formula (C), V represents hydrophilic radical or its precursor group.With regard to hydrophilic radical, as long as representing hydrophily Group be just not particularly limited, for example can enumerate hydroxyl, carboxylic acid group etc..Additionally, the precursor group of so-called hydrophilic radical Refer to generate the group of hydrophilic radical using acid or alkali by specific process (process for example, carrying out), for example permissible Enumerate carboxyl protected by THP (2- THP trtrahydropyranyl) etc..

As hydrophilic radical, from the interaction of plating catalyst or its precursor from the aspect of, preferably ion Property polar group.As ionic polar group, specifically, carboxylic acid group, sulfonic group, phosphate, boronate can be enumerated.Its In, from the aspect of appropriate acidity (not decomposing other functional groups) is such, optimization acid's base.

In 2nd preferred embodiment of above-mentioned polymer, the preferred content of each unit is as follows.

From the aspect of gelation when reactive (curability, polymerism) and suppression synthesis, with respect in polymer Whole repetitives, the content of the repetitive represented by formula (A) is preferably 5～50 moles of %, more preferably 5～30 rubs You are %.

From the aspect of the adsorptivity for plating catalyst or its precursor, repeat list with respect to whole in polymer Unit, the content of the repetitive represented by formula (B) is preferably 5～75 moles of %, more preferably 10～70 moles %.

From the aspect of the developability based on the aqueous solution and moisture-proof adaptation, repeat list with respect to whole in polymer Unit, the content of the repetitive represented by formula (C) is preferably 10～70 moles of %, more preferably 20～60 moles %, further It is preferably 30～50 moles of %.

As the concrete example of above-mentioned polymer, for example, can enumerate the paragraph of Japanese Unexamined Patent Publication 2009-007540 publication [0106] in the polymer described in～[0112], paragraph [0065]～[0070] of Japanese Unexamined Patent Publication 2006-135271 publication The polymer of record, No. US2010-080964 polymer described in paragraph [0030]～[0108] etc..

This polymer can be manufactured using known method (for example, the method in the above-mentioned document enumerated).

(suitable way of monomer)

In the case that above-claimed cpd is for so-called monomer, as one of suitable way, formula (X) can be enumerated represented Compound.

【Change 3】

In formula (X), R¹¹～R¹³Represent hydrogen atom or substituted or unsubstituted alkyl independently of one another.As unsubstituted Alkyl, methyl, ethyl, propyl group or butyl can be enumerated.In addition, as replacing alkyl, can enumerate former by methoxyl group, chlorine Substituted methyl, ethyl, propyl group, the butyl such as son, bromine atoms or fluorine atom.It should be noted that as R¹¹, preferably hydrogen atom or Methyl.As R¹², preferably hydrogen atom.As R¹³, preferably hydrogen atom.

L¹⁰Represent singly-bound or divalent organic group.As divalent organic group, substituted or unsubstituted aliphatic can be enumerated Alkyl (preferably carbon number be 1～8), substituted or unsubstituted aromatic hydrocarbyl (preferably carbon number is 6～12) ,-O- ,- S-、-SO₂-、-N(R)-(R：Alkyl) ,-CO- ,-NH- ,-COO- ,-CONH- or group that they are combined (for example sub- Alkyl oxy, alkylidene Epoxide carbonyl, alkylidene carbonyl acyloxy etc.) etc..

As substituted or unsubstituted aliphatic alkyl, preferably methylene, ethylidene, propylidene or butylidene or this A little groups are replaced, by methoxyl group, chlorine atom, bromine atoms or fluorine atom etc., the group obtaining.

As substituted or unsubstituted aromatic hydrocarbyl, preferably unsubstituted phenylene or by methoxyl group, chlorine atom, The phenylene that the replacement such as bromine atoms or fluorine atom obtains.

In formula (X), as L¹⁰One of suitable way ,-NH- aliphatic alkyl-or-CO- aliphatic hydrocarbon can be enumerated Base-.

The definition of W is identical with the implication of the definition of the W in formula (b), represents interaction group.Interaction group As defined above.

In formula (X), as the suitable way of W, ionic polar group, more preferably carboxylic acid group can be enumerated.

In the case that above-claimed cpd is so-called monomer, as one of other suitable way, formula (1) institute can be enumerated The compound representing.

【Change 4】

In formula (1), R¹⁰Represent hydrogen atom, metal cation or quaternary ammonium cation.As metal cation, for example, can lift Go out alkali metal cation (sodium ion, calcium ion), copper ion, palladium ion, silver ion etc..It should be noted that as metal sun Ion, mainly uses the metal cation of 1 valency or divalent, in the case of using divalent metal cation (such as palladium ion), after The n stating represents 2.

As quaternary ammonium cation, for example, can enumerate tetramethyl ammonium, potassium ion etc..

Wherein, from the aspect of the metallic residue after the attachment of plating catalyst or its precursor and patterning, preferably hydrogen Atom.

L in formula (1)¹⁰Definition and above-mentioned formula (X) in L¹⁰Definition implication identical, represent singly-bound or divalent organic group Group.Divalent organic group is as defined above.

R in formula (1)¹¹～R¹³Definition and above-mentioned formula (X) in R¹¹～R¹³Definition implication identical, represent hydrogen former Sub or substituted or unsubstituted alkyl.It should be noted that R¹¹～R¹³Suitable way as described above.

N represents 1 or 2 integer.Wherein, from the acquired aspect of compound, preferably n is 1.

As the suitable way of the compound represented by formula (1), the compound represented by formula (2) can be enumerated.

【Change 5】

In formula (2), R¹⁰、R¹¹As defined above with n.

L¹¹Represent ester group (- COO-), amide groups (- CONH-) or phenylene.Wherein, if L¹¹For amide groups, then obtained The polymerism of plated coating and solvent resistance (such as alkali solvent tolerance) improve.

L¹²Represent singly-bound, divalent aliphatic alkyl (preferably carbon number be 1～8, more preferably carbon number be 3～5) or 2 Valency aromatic hydrocarbyl.Aliphatic alkyl can be straight-chain, branched, ring-type.It should be noted that in L¹²Situation for singly-bound Under, L¹¹Represent phenylene.

The molecular weight of the compound represented by formula (1) is not particularly limited, from volatility, dissolubility in a solvent, one-tenth The aspect such as film and treatability is set out, and preferably 100～1000, more preferably 100～300.

The content of the above-claimed cpd in plated coating formation composition is not particularly limited, with respect to total composition It is preferably 2～50 mass %, more preferably 5～30 mass %.If in above range, then the treatability of composition excellent, hold The thickness of the plated coating of pattern-like easy to control.

From the aspect of treatability, in plated coating formation composition, preferably comprise solvent.

The solvent that can use is not particularly limited, for example, can enumerate：Water；Methyl alcohol, ethanol, propyl alcohol, ethylene glycol, 1- first The alcohols solvents such as epoxide -2- propyl alcohol, glycerine, propylene glycol monomethyl ether；The acid such as acetic acid；The ketones such as acetone, methyl ethyl ketone, cyclohexanone Solvent；The amide solvents such as formamide, dimethylacetylamide, 1-METHYLPYRROLIDONE；The nitrile solvents such as acetonitrile, propionitrile；Acetic acid The esters solvents such as methyl esters, ethyl acetate；The carbonate-based solvent such as dimethyl carbonate, diethyl carbonate；In addition with ether solvent, Glycolic solvents, amine solvent, thio-alcohol solvent, halogen based solvents etc..

Wherein, preferably alcohols solvent, amide solvent, ketones solvent, nitrile solvents, carbonate-based solvent.

The content of the solvent in plated coating formation composition is not particularly limited, and is preferably with respect to total composition 50～98 mass %, more preferably 70～95 mass %.If in above range, then the treatability of composition is excellent, easy control Thickness of the plated coating of pattern shape etc..

Polymerization initiator can be contained in plated coating formation composition.By containing polymerization initiator, further Form the combination and compound and substrate between compound, can get the more excellent extraction of adaptation as a result and join Line.

It is not particularly limited as the polymerization initiator being used, for example, can be drawn using thermal polymerization, photopolymerization Send out agent etc..As the example of Photoepolymerizationinitiater initiater, benzophenone, acetophenones, alpha-aminoalkyl benzophenone class, benzene can be enumerated Acyloin class, ketone, thioxanthene ketone class, benzil class, benzyl ketals class, oxime esters, anthrone class, tetramethylthiuram monosulfide class, Double acylphosphine oxide class, acylphosphine oxide class, Anthraquinones, azo-compound etc. and its derivative.

Additionally, as the example of thermal polymerization, diazonium based compound or peroxide based compound etc. can be enumerated.

In the case of containing polymerization initiator in plated coating formation composition, the content of polymerization initiator with respect to Total composition is preferably 0.01～1 mass %, more preferably 0.1～0.5 mass %.When this content is in above range, group The treatability of compound is excellent, and the adaptation of obtained wiring lead is more excellent.

Monomer can be contained (wherein do not include above-mentioned formula (X) or formula (1) is represented in plated coating formation composition Compound).By containing monomer, can suitably control crosslink density in the plated coating of pattern-like etc..

The monomer being used is not particularly limited, and for example, can enumerate as the compound with addition polymerization and have The compound of ethylenic unsaturated bond, can enumerate the compound with epoxy radicals as the compound with ring-opening polymerization Deng.Wherein, from improve the plated coating of pattern-like crosslink density, further improve wiring lead adaptation in terms of examine Consider, preferably use polyfunctional monomer.So-called polyfunctional monomer refers to the monomer with more than 2 polymerizable groups.Specifically, Preferably use the monomer with 2～6 polymerizable groups.

The aspect of the transport properties of molecules from the cross-linking reaction bringing impact to reactivity, as the many officials being used The molecular weight of energy monomer is preferably 150～1000, more preferably 200～700.Additionally, as multiple polymerisms Interval (distance) between group, is preferably 1～15, more preferably less than more than 6 10 in terms of atomicity.

Plated coating formation composition can be added as needed on other additives (for example sensitizer, curing agent, Polymerization inhibitor, antioxidant, antistatic additive, ultra-violet absorber, filler, particle, fire retardant, surfactant, lubricant, plasticising Agent etc.).

It should be noted that hereinbefore for containing the compound with interaction group and polymerizable group Plated coating formation is described with composition, but is not limited to which, for example, it is also possible to be containing having interaction Property group compound and have polymerizable group compound plated coating formation composition.

Interaction group and polymerizable group are as defined above.

The so-called compound with interaction group is the compound with interaction group.Interaction Group is as defined above.As such compound, can be low molecular compound, can also be macromolecular compound. As the suitable way of the compound with interaction group, the repetition having represented by above-mentioned formula (b) can be enumerated The macromolecule (such as polyacrylic acid) of unit.It should be noted that not comprising in the compound with interaction group Polymerizable group.

The compound with polymerizable group is so-called monomer, more excellent from the hardness of the plated coating being formed From the aspect of, preferably there is the polyfunctional monomer of the polymerizable group of more than 2.With regard to polyfunctional monomer, in particular, it is preferred that Using the monomer with 2～6 polymerizable groups.The side of the transport properties of molecules from the cross-linking reaction that impact is brought on reactivity Set out in face, the molecular weight as the polyfunctional monomer being used is preferably 150～1000, more preferably 200～700.Separately Outward, as the interval (distance) between multiple polymerizable groups, in terms of atomicity preferably 1～15, more preferably 6～ 10.

(process of operation 1)

In operation 1, plated coating formation composition is configured on substrate first, its method is not particularly limited, example Above-mentioned plated coating formation composition is made to contact to form plated coating formation composition on substrate as enumerated The method of film (plated coating precursor layer).As the method, for example, can enumerate and above-mentioned plated coating shape is coated with substrate The method (rubbing method) of one-tenth composition.

In the case of rubbing method, the method being coated with plated coating formation composition on substrate is not particularly limited, Known method (such as spin coating, die coating, dip coated etc.) can be used.

From the aspect of treatability, manufacture efficiency, preferably following manner：Plated coating formation group is coated with substrate Compound, is dried as needed and processes the solvent removing residual, forms film.

It should be noted that the condition of dried process is not particularly limited, from the aspect of productivity ratio is more excellent, excellent It is selected in room temperature～220 DEG C 1～30 minute (preferably 1～10 minute) of (preferably 50～120 DEG C) enforcement.

The method giving energy with pattern-like to the film containing above-claimed cpd on substrate is not particularly limited.Example As, preferably use heating, exposure-processed (photo-irradiation treatment) etc., from the aspect of process terminates at short notice, excellent Select exposure-processed.By giving energy to film, the polymerizable group in compound is activated, and produces the crosslinking between compound, Carry out the solidification of layer.

In exposure-processed, using light irradiation based on UV (ultraviolet light) lamp, luminous ray etc. etc..As light source, for example There are mercury lamp, metal halide lamp, xenon lamp, chemical lamp, carbon arc lamp etc..As radioactive ray, also electron ray, X-ray, ion Bundle, far infrared etc..As specific mode it may be preferred to enumerate the scan exposure based on infrared laser, xenon discharge lamp etc. High illumination flash exposure, infrared lamp exposure etc..

Different, between usually 10 seconds～5 hours as time for exposure, the reactivity according to compound and light source.Make The scope of the degree being 10～8000mJ for exposure energy, preferably 50～3000mJ.

It should be noted that the method implementing above-mentioned exposure-processed with pattern-like is not particularly limited, can adopt known Method, for example, across mask, film irradiation exposure is used up.

Additionally, in the case of giving using heating as energy, it is possible to use blast drier, baking oven, infrared ray Drying machine, heating drum etc..

Then, remove the part that energy imparting is not carried out in film, form the plated coating of pattern-like.

Above-mentioned removing method is not particularly limited, and the compound according to being used properly selects the best approach.For example may be used To enumerate using alkaline solution (preferably pH：13.0～13.8) as the method for developer solution.Removing energy using alkaline solution In the case of not giving region, can enumerate by the substrate with the film having been assigned energy impregnate method in the solution, Method of coating developer solution etc. on the substrate, the method preferably being impregnated.In the case of the method being impregnated, from life The aspects such as producing property workability are set out, and are preferably 1 minute to 30 minutes about as dip time.

Additionally, as other methods, can enumerate the solvent of dissolving above-claimed cpd as developer solution, dipping is wherein Method.

[operation 2：Wiring lead formation process]

Operation 2 is following operations：To in above-mentioned operation 1 formed the plated coating of pattern-like give plating catalyst or its Precursor, for the pattern-like having been assigned plating catalyst or its precursor, plated coating carries out plating, plated in pattern-like Wiring lead is formed on coating.As shown in Fig. 4 (D), by implementing this operation, configuration extraction on the plated coating of pattern-like 16 is joined Line 18.

It is divided into the plated coating to pattern-like below and give the operation (operation 2-1) of plating catalyst or its precursor and right Said in the operation (operation 2-2) that the plated coating of the pattern-like having been assigned plating catalyst or its precursor carries out plating Bright.

(operation 2-1：Plating catalyst gives operation)

In this operation, first to pattern-like, plated coating gives plating catalyst or its precursor.Above-claimed cpd is originated Interaction group adhere to plating catalyst or its precursor that (absorption) is given according to its function.More specifically, And it is endowed plating catalyst or its precursor on plated clad surface in plated coating.

Plating catalyst or its precursor are as the catalyst of plating or electrode function.Therefore, the plating being used Cover catalyst or the species of its precursor suitably determines according to the species of plating.

It should be noted that the plating catalyst being used or its precursor be preferably electroless plating catalyst or its before Body.Mainly electroless plating catalyst or its precursor etc. are described in detail below.

With regard to the electroless plating catalyst used in this operation, as long as active nucleus during electroless plating can be become, Then any electroless plating catalyst all can use, and specifically, can enumerate the catalysis energy with self catalyzed reduction reaction Metal (being known as the metal carrying out electroless plating that ionization tendency is less than Ni) of power etc..Specifically, can enumerate Pd, Ag, Cu, Ni, Pt, Au, Co etc..Wherein, from the aspect of the height of catalytic capability, particularly preferred Ag, Pd, Pt, Cu.

As this electroless plating catalyst, it is possible to use metallic colloid.

As long as electroless plating catalyst precarsor used can become electroless plating by chemical reaction and urge in this operation Agent just can use without particular limitation.The main gold that the metal as above-mentioned electroless plating catalyst enumerated is used Belong to ion.Metal ion as electroless plating catalyst precarsor is become by reduction reaction and is used as electroless plating catalyst 0 valency metal.As electroless plating catalyst precarsor metal ion be imparted to the plated coating of pattern-like after, dipping Before in electroless plating bath, 0 valency metal can be changing into by other reduction reaction and become electroless plating and cover catalysis Agent.In addition it is also possible to be immersed in electroless plating bath with the state of electroless plating catalyst precarsor, using electroless plating Reducing agent in bath is changing into metal (electroless plating catalyst).

Metal ion as electroless plating catalyst precarsor preferably uses slaine and is imparted to pattern-like and is plated Layer 16.As the slaine being used, as long as being dissolved in suitable solvent to be dissociated into metal ion and alkali (anion) Person, is not particularly limited, and can enumerate M (NO₃)_n、MCl_n、M_2/n(SO₄)、M_3/n(PO₄) (M represents the metallic atom of n valency) Deng.As metal ion, the metal ion that above-mentioned slaine dissociation obtains can be suitably used.For example can enumerate Ag from Son, Cu ion, Ni ion, Co ion, Pt ion, Pd ion.Wherein preferably can multiple tooth coordination metal ion, from can join From the aspect of the species number of functional group of position and catalytic capability, particularly preferred Ag ion, Pd ion, Cu ion.

In this operation, directly electroplated to not carry out electroless plating, as the catalyst being used, also may be used With using 0 valency metal.

Method as giving plating catalyst or its precursor to the plated coating of pattern-like 16, for example, can prepare and will plate Cover catalyst or its precursor dispersion or be dissolved in solution (plating catalyst liquid) in suitable solvent, by this solution coating It is immersed in this solution on the plated coating of pattern-like or by the substrate being formed with the plated coating of pattern-like.

As above-mentioned solvent, suitably using water or organic solvent.As organic solvent, preferably saturable plated to pattern-like Solvent in coating, for example, can use acetone, methyl acetoacetate, ethyl acetoacetate, ethylene acetate, hexamethylene Ketone, acetylacetone,2,4-pentanedione, acetophenone, 2- (1- cyclohexenyl group) cyclohexanone, propylene-glycol diacetate, glycerol triacetate, diethylene glycol (DEG) two Acetic acid esters, dioxane, 1-METHYLPYRROLIDONE, dimethyl carbonate, ethylene glycol dimethyl ether etc..

The pH that catalyst containing plating catalyst or its precursor and solvent gives liquid is not particularly limited, from described later During plating easily desired position formed desired amount metal level from the aspect of, this pH be preferably 3.0～ 7.0th, more preferably 3.2～6.8, more preferably 3.5～6.6.

The preparation method that catalyst gives liquid is not particularly limited, by specific dissolving metal salts in suitable solvent, Using acid or alkali, pH is adjusted to specific scope as needed.

The concentration of the plating catalyst in solution or its precursor is not particularly limited, preferably 0.001～50 mass %, more It is preferably 0.005～30 mass %.

Additionally, as time of contact, preferably 30 seconds～24 hours about, more preferably 1 minute～1 hour about.

Plating catalyst with regard to the plated coating of pattern-like 16 or the adsorbance of its precursor, according to the plating bath being used Kind, catalyst metals kind, the interaction group kind of the plated coating of pattern-like 16, using method etc. and different, from plating The aspect of precipitation property is set out, preferably 5～1000mg/m², more preferably 10～800mg/m², particularly preferably 20～600mg/ m².

(operation 2-2：Plating operation)

Then, to the pattern-like having been assigned plating catalyst or its precursor, plated coating carries out plating.

The method of plating is not particularly limited, for example, can enumerate electroless plating or electrolytic coating is processed (electroplating processes).In this operation, can individually implement electroless plating it is also possible to implement electroless plating Implement electrolytic coating afterwards further to process.

It should be noted that in this manual, so-called silver mirror reaction is as one kind of above-mentioned electroless plating And include.It is thus possible to making accompanying reducing metal ions, form desired pattern-like gold by such as silver mirror reaction etc. Belong to layer, and then electrolytic coating can be implemented thereafter and process.

Below electroless plating is covered with process and the process of electrolytic coating process is described in detail.

So-called electroless plating refers to operations described below：Using dissolving be hopeful in the form of plating separate out metal from The solution of son, makes metal separate out by chemical reaction.

Electroless plating in this operation is for example preferably as follows and carries out：Have been assigned electroless plating catalyst to possessing The substrate of the plated coating of pattern-like is washed, and after removing unnecessary electroless plating catalyst (metal), is immersed in electroless In plating bath, thus to carry out electroless plating.As the electroless plating bath being used, it is possible to use known electroless plating Cover bath.

Additionally, will be provided with the absorption of electroless plating catalyst precarsor or in the state of penetrating in the plated coating of pattern-like The substrate having been assigned the plated coating of pattern-like of electroless plating catalyst precarsor is impregnated into the situation in electroless plating bath Under, preferred pair substrate is impregnated into electroless after carrying out washing the unnecessary electroless plating catalyst precarsor (slaine etc.) of removing In plating bath.In this case, carry out the reduction and and then of electroless plating catalyst precarsor in electroless plating bath Electroless plating.As electroless plating bath as used herein it is also possible to use known electroless as described above Plating bath.

It should be noted that the reduction with regard to electroless plating catalyst precarsor is it is also possible to use no as described above Separately prepare catalytic activity liquid (reducing solution), as the other operations before electroless plating outside the mode of electrolytic coating liquid Come to carry out.

As the composition of general electroless plating bath, in addition to solvent (such as water), mainly comprise：1. plating Metal ion, 2. reducing agent, 3. make the stability-enhanced additive (stabilizer) of metal ion.In this plating bath, except Outside these compositions, the known additive such as stabilizer of plating bath can also be comprised.

As organic solvent used in electroless plating bath, it is preferably soluble in the solvent of water, from this viewpoint, preferably Using alcohols such as the ketones such as acetone, methyl alcohol, ethanol, isopropanols.Species as metal used in electroless plating bath it is known that There are copper, tin, lead, nickel, gold, silver, palladium, rhodium, wherein, from the aspect of electric conductivity, preferably copper, silver, gold, more preferably copper.And Optimal reducing agent, additive are selected according to above-mentioned metal.

As the dip time in electroless plating bath, preferably 1 minute～6 hours about, more preferably 1 minute～ 3 hours about.

In this operation, have as electrode in the plating catalyst or its precursor being imparted to the plated coating of pattern-like In the case of function, catalyst can be had been assigned to this or the plated coating of pattern-like of its precursor is electroplated.

It should be noted that as described above, in this operation, can be as needed after above-mentioned electroless plating Carry out electrolytic coating process.Profit in such a way, can suitably adjust the thickness of formed wiring lead.

As electric plating method, it is possible to use existing known method.It should be noted that as gold used in plating Belong to, copper, chromium, lead, nickel, gold, silver, tin, zinc etc. can be enumerated, from the aspect of electric conductivity, preferably copper, gold, silver, more preferably Copper.

[electric conductivity connecting portion]

Electric conductivity connecting portion 24 is the connecting portion being electrically connected detecting electrode 14 with wiring lead 18.Electric conductivity connecting portion 24 are configured according to the mode being connected respectively with detecting electrode 14 and wiring lead 18.By configuring electric conductivity connecting portion 24, Detecting electrode 14 is improved further with the conduction of wiring lead 18.

The material constituting electric conductivity connecting portion 24 is not particularly limited, as long as being the material showing electric conductivity, example As metal (inclusion alloy), the electroconductive resins etc. such as golden (Au), silver-colored (Ag), copper (Cu), aluminium (Al) can be enumerated.Need explanation It is, as metal, the form of metal particle can be enumerated.

The forming method of electric conductivity connecting portion 24 is not particularly limited, and preferably uses conductive composition (so-called conduction Property thickener or conductive ink) mode.That is, electric conductivity connecting portion 24 is preferably the connecting portion being formed by conductive composition. Specifically, conductive composition is pressed using print processes such as ink-jet method, silk screen print method, aniline printing method, woodburytypes It is coated according to the mode connecting with detecting electrode 14 and wiring lead 18, implement curing process as needed, be consequently formed and lead Electrical junction 24.

It should be noted that the difference of conductive paste and conductive ink is the difference of the viscosity together with decentralized medium Different, in conductive paste, typically contain macromolecule component as decentralized medium, thus viscosity is high, can suitably apply silk Net print process, aniline printing method etc..In conductive ink, typically contain low molecular composition as decentralized medium, thus viscosity Low, can suitably apply ink-jet method etc..

[substrate]

Substrate 12 has 2 interareas, for undertaking the part of following effects：In middle section E_ISupporting detecting electrode 14, with When in exterior lateral area E_OThe supporting plated coating of pattern-like 16.

The species of substrate 12 is not particularly limited, for example, can enumerate insulated substrate, more specifically, it is possible to use resin Substrate, ceramic substrate, glass substrate etc..

As the material of resin substrate, for example, can enumerate polyethylene terephthalate, poly- naphthalenedicarboxylic acid ethylene glycol Ester, polyether sulfone, polyacrylic based resin, polyurethane series resin, polyester, Merlon, polysulfones, polyamide, polyarylate, polyene Hydrocarbon, cellulose-based resin, polyvinyl chloride, cyclic olefine resin etc..Wherein preferred polyethylene terephthalate, poly- naphthalene diformazan Sour glycol ester or polyolefin.

The thickness (mm) of substrate 12 is not particularly limited, from the aspect of the balance of treatability and slimming, preferably 0.05～2mm, more preferably 0.1～1mm.

Additionally, substrate 12 preferably properly passes through light.Specifically, the total light transmittance of substrate 12 be preferably 85～ 100%.

(priming coat (closely sealed auxiliary layer))

The adaptation of substrate and the plated coating of pattern-like (or plated coating) also can be subject to the surface state, just of substrate sometimes The impact of property.Therefore, suitably can be configured to improve substrate and the plated coating of pattern-like on substrate according to the species of substrate The priming coat of the adaptation of (or plated coating).In other words, can between substrate and the plated coating of pattern-like (or plated coating) There are priming coat.

In order to improve the adaptation of the plated coating of pattern-like (or plated coating) using priming coat, control surface can be taken Energy and plated coating form chemical bond or using the various means improving closing force such as adhesion strength based on stress relaxation. In the case of surface energy control, for example, can use the low molecule layer close with the surface energy of plated coating or macromolecule Layer.In the case of forming chemical bond, it is possible to use there is low molecule layer or the macromolecule layer at polymerization activity position.Utilizing In the case of the adhesion strength of stress relaxation, it is possible to use low rubbery resin of elastic modelling quantity etc..

The thickness of priming coat be not particularly limited it is often preferred that 0.01～100 μm, more preferably 0.05～20 μm, enter One step is preferably 0.05～10 μm.

The material of priming coat is not particularly limited, preferably good with the adaptation of substrate resin.Tool as resin Style, for example, can be heat-curing resin, can be thermoplastic resin, can be additionally their mixture, for example, make For heat-curing resin, epoxy resin, phenol resin, polyimide resin, polyester resin, BMI tree can be enumerated Fat, polyolefin-based resins, isocyanates system resin etc..As thermoplastic resin, for example, can enumerate phenoxy resin, polyethers Sulfone, polysulfones, PPSU, polyphenylene sulfide, polyphenyl ether, PEI, ABS resin etc..

Thermoplastic resin and heat-curing resin can be used alone respectively it is also possible to two or more share.In addition permissible Using the resin containing cyano group, specifically, it is possible to use ABS resin, Japanese Unexamined Patent Publication 2010-84196 [0039]～ [0063] " polymer containing the unit in side chain with cyano group " recorded.

The rubber constituent such as NBR rubber (acrylonitrile butadiene rubber), SBR rubber (butadiene-styrene rubber) additionally can be used.

As one of suitable way of material constituting priming coat, can enumerate and there is the conjugated diene that can be hydrogenated The polymer of compound units.Conjugated diene compound unit refers to the repetitive in conjugated diene compound source.As conjugation Diolefin compound, as long as being that the compound with following molecular structures is just not particularly limited, this molecular structure has by one Two carbon-to-carbon double bonds that singly-bound separates.

One of suitable way of repetitive as conjugated diene compound source, can enumerate by having butadiene The polymerisation of the compound of skeleton and the repetitive that generates.

Above-mentioned conjugated diene compound unit can be hydrogenated, in the feelings containing the conjugated diene compound unit being hydrogenated Under condition, the adaptation of pattern-like metal level improves further, is preferred.That is, the repetitive in conjugated diene compound source In double bond can be hydrogenated.

In the polymer with the conjugated diene compound unit that can be hydrogenated, above-mentioned interaction can be contained Property group.

As the suitable way of this polymer, can enumerate nitrile rubber (NBR), containing XNBR (XNBR), third Alkene nitrile-butadiene-isoprene rubber (NBIR), acrylonitrile-butadiene-styrene copolymer (ABS resin) or their hydrogen Compound (such as hydrogenated nitrile-butadiene rubber) etc..

Other additive (such as sensitizer, antioxidant, antistatic additive, ultraviolet radiation absorption can be contained in priming coat Agent, filler, particle, fire retardant, surfactant, lubricant, plasticizer etc.).

The forming method of priming coat is not particularly limited, and can enumerate：The method of the resin that lamination is used on substrate； Necessary composition is dissolved in soluble solvent, is coated with dry method on the surface of the substrate using methods such as coatings； Etc..

With regard to the acid extraction in coating process, select the condition that coating solvent can fully be dried, from system From the aspect of making adaptive, preferably select heating-up temperature be less than 200 DEG C, the time be 60 minutes within scope fire-bar Part, more preferably select heating-up temperature be 40～100 DEG C, the time be 20 minutes within scope heating condition.Need explanation It is that the solvent being used can properly select optimal solvent (such as cyclohexanone, methyl ethyl ketone) according to the resin being used.

[detecting electrode]

Detecting electrode 14 is the contact panel sensing in the contact panel sensor conductive film comprising present embodiment Perceive the sensing electrode of electrostatic capacitance change in device, constitute sense part (detecting means).That is, if making finger tip contact with contact panel, Then the mutual electrostatic capacitance between detecting electrode 14 and other electrode changes, based on this variable quantity utilize IC (integrated circuit, Integrated circuit) circuit enters row operation to the position of finger tip.

Detecting electrode 14 has for close to middle section E_IThe input position of the X-direction of operator's finger detected Effect, there is the function of producing electrostatic capacitance at it and finger between.Detecting electrode 14 extends in the 1st direction (X-direction), is The electrode arranging across predetermined distance in the 2nd direction (Y-direction) orthogonal with the 1st direction.It is provided with 5 detection electricity in FIG Pole 14, this number is not particularly limited, as long as being more than 2.

In FIG, detecting electrode 14 is solid membrane but it is also possible to comprise the specific pattern of netted grade.

The material constituting detecting electrode 14 is not particularly limited, for example, can enumerate tin indium oxide (ITO), tin oxide, oxygen Change the metal oxides such as zinc, cadmium oxide, gallium oxide, titanium dioxide.Further, it is also possible to using golden (Au), silver-colored (Ag), copper (Cu), Metal or alloy such as aluminium (Al) etc..

The forming method of detecting electrode 14 is not particularly limited, and can adopt known method, for example, it is preferable to concrete sputtering method Or vapour deposition method is forming.

Although it should be noted that not shown in FIG, wiring lead 18 the other end (not for detection electricity The end of pole 14 side) location can configure flexible printed circuit board etc..Flexible printed circuit board is to be provided with 2 on substrate Individual above distribution and the plate of terminal, the other end respective with wiring lead 18 is connected, and has given play to electrostatic capacitive touch surface The effect that plate sensor and external device (ED) (such as display device) are attached.

[manufacture method of contact panel sensor conductive film]

The manufacture method of above-mentioned contact panel sensor conductive film 10 is not particularly limited, and can adopt known side Method, mainly can enumerate following 2 method.

(method 1)：On the substrate 12 detecting electrode 14 is configured behind specific position, on the substrate 12 by pattern-like quilt Coating layer 16 configures in specific position, configures wiring lead 18 on the plated coating of pattern-like 16, and configuration electric conductivity connects thereafter The method of socket part 24

(method 2)：On the substrate 12 plated for pattern-like coating 16 is configured behind specific position, be plated in pattern-like Configure wiring lead 18 on layer 16, on the substrate 12 detecting electrode 14 is configured in specific position thereafter, configure conductive afterwards The method of property connecting portion 24

As the process manufacturing the plated coating of pattern-like 16 and wiring lead 18 using said method 1 and method 2, preferably in fact Apply the process of explanation in above-mentioned [manufacture method of the plated coating of pattern-like and wiring lead].

Above-mentioned contact panel sensor conductive film 10 can be suitably used for contact panel sensor.

For example, it is possible to prepare 2 contact panel sensors with conductive film (film A and film B), according to the detection electricity in film A Detecting electrode 14 in pole 14 and film B is opposed and film A in detecting electrode 14 mode orthogonal with the detecting electrode 14 in film B Film A and film B is pasted sticker, connects other parts (such as flexible printed circuit substrate) as needed, obtain electrostatic capacitance The contact panel sensor of formula.

Further, it is also possible to prepare 2 contact panel sensors with conductive film (film A and film B), according to the detection in film A Substrate 12 in electrode 14 and film B is opposed and film A in detecting electrode 14 mode orthogonal with the detecting electrode 14 in film B will Film A and film B pastes sticker, connects other parts (such as flexible printed circuit substrate) as needed, obtains electrostatic capacitive Contact panel sensor.

Above-mentioned such contact panel sensor can be suitably employed in contact panel (particularly electrostatic capacitive touch surface Plate) in.

<<2nd embodiment>>

The top view of the 2nd embodiment of the contact panel sensor conductive film of the present invention is shown in Fig. 5.Fig. 6 It is the sectional view being cut off along cutting line C-C.

Contact panel sensor conductive film 100 shown in Fig. 5 possesses substrate 12 and configuration in the side of substrate 12 Interarea on the detecting electrode 14 on (on surface), the plated coating of pattern-like 160, wiring lead 18 and electric conductivity connecting portion 24.Need It is noted that in Figure 5, the plated coating of pattern-like 160 spreads all over exterior lateral area E_OWhole region configured.In other words, In middle section E_IThe plated coating of pattern-like 160 is configured on the surface of substrate 12 in addition.

Contact panel sensor shown in Fig. 5 with conductive film 100, except the configuration bit of the plated coating of pattern-like 160 Put beyond this point, with the contact panel sensor conductive film 10 shown in Fig. 1, there is same composition, thus for identical Constitutive requirements give identical reference marks the description thereof will be omitted, below main coating 160 plated to pattern-like be described in detail.

In pattern-like plated coating 160 and the 1st embodiment, the plated coating of pattern-like 16 of explanation has same composition, Allocation position only on the substrate 12 is different.

As the forming method of the plated coating of pattern-like 160, the pattern with explanation in above-mentioned 1st embodiment can be enumerated The same process of the forming method of the plated coating of shape 16, makes above-mentioned [operation 1：Pattern-like plated coating formation process] in tax The region giving energy is whole exterior lateral area E_O?.

In the present embodiment, the manufacture method of wiring lead 18 is not particularly limited, can suitably enumerate following Operation 3 (wiring lead formation process).Below the process of operation 3 is described in detail.

[operation 3：Wiring lead formation process]

Operation 3 is following operations：To pattern-like, plated coating gives plating catalyst or its precursor, for having been assigned plating Cover catalyst or the plated coating of its precursor carries out plating, the plated coating of pattern-like forms metal level, will be obtained Etching metal layer become pattern-like, form wiring lead.More specifically, first, as shown in Fig. 7 (A), prepare configuration pattern-like The substrate 12 of plated coating 160；Then, as shown in Fig. 7 (B), to pattern-like plated coating 160 give plating catalyst or its before Body, implements plating, forms metal level 30 on the plated coating of pattern-like 160；Then, as shown in Fig. 7 (C), by metal level 30 are etched with pattern-like, obtain wiring lead 18.

In this operation, to pattern-like, plated coating 160 gives plating catalyst or its precursor, for having been assigned plating The plated coating of pattern-like 160 of catalyst or its precursor carries out plating, forms metal level on the plated coating of pattern-like 160 30, the process of this operation is identical with operation 2-1 of narration in the 1st above-mentioned embodiment and the process of operation 2-2, thus saves Slightly its detailed description.

Carry out specifically below for the process that metal level 30 is etched into the operation that pattern-like to form wiring lead 18 Bright.

In the formation of wiring lead 18, any method all can use, specifically, using commonly known subtractive process (mask of pattern-like is set on the metal layer, after the region not forming mask being etched process, removes mask, formation is drawn The method going out distribution), semi-additive process (on the metal layer arrange pattern-like mask, formed according in the region not forming mask The mode of metal level carries out plating, removes mask, is etched processing, the method forming wiring lead).

With regard to subtractive process, specifically following methods：The metal level being formed arranges resist layer, by pattern Exposure, development are formed and the wiring lead identical pattern being formed, and using Resist patterns as mask, are removed using etching solution Metal level, forms wiring lead.Any material can be used as resist, it is possible to use minus, eurymeric, liquid, membranaceous Resist.Additionally, as engraving method, any method being used in the manufacture of tellite all can use, and can make With Wet-type etching, dry-etching etc., as long as arbitrarily selecting.With regard to the operating aspect of operation, from the simplicity of device etc. From the aspect of, preferably Wet-type etching.As etching solution, for example, can use the aqueous solution of copper chloride, iron chloride (III) etc..

With regard to semi-additive process, specifically following methods：Resist layer is arranged on the metal level being formed, by figure Case exposure, development are formed and non-metallic layer drafting department identical pattern, Resist patterns is carried out electrolytic coating as mask, removes Implementing fast-etching after going Resist patterns, removing metal level by pattern-like, thus forming wiring lead.Resist, etching solution Etc. can use and subtractive process identical material.Additionally, the method processing as electrolytic coating, it is possible to use the side of above-mentioned record Method.

It should be noted that when stating the etch processes of metal level on the implementation, removed gold can will be located at as needed The metallic particles that the reducing metal ions belonging to contained in the plated coating of pattern of underface of layer are formed removes in the lump.

It should be noted that the removing method of above-mentioned metallic particles is not particularly limited, by adjusting used etching The species of liquid, etching period are it is also possible to implement the removing of metallic particles together with the removing of metal level.

<<3rd embodiment>>

The top view of the 3rd embodiment of the contact panel sensor conductive film of the present invention is shown in Fig. 8.Fig. 9 It is the sectional view being cut off along cutting line D-D.

Contact panel sensor conductive film 200 shown in Fig. 8 possesses substrate 12, configuration being plated on the substrate 12 Layer 22 and detecting electrode 14 on plated coating 22 for the configuration, wiring lead 18 and electric conductivity connecting portion 24.In fig. 8, quilt Coating layer 22 configures the whole region on the surface in substrate 12, configuration detecting electrode 14 and wiring lead on plated coating 22 18.

The plated coating of pattern-like 16 is not used to use quilt in contact panel sensor conductive film 200 shown in Fig. 8 Coating layer 22, and change the configuration of each part, in addition to these aspects, conductive with the contact panel sensor shown in Fig. 1 Property film 10 there is same composition, give identical reference marks the description thereof will be omitted thus for identical constitutive requirements, main below Plated coating 22 is described in detail.

In plated coating 22 and the 1st embodiment, the plated coating of pattern-like 16 of explanation has identical and constitutes, only in base Configuring area on plate 12 is different.Specifically, plated coating 22 has interaction group.

The forming method of plated coating 22 is not particularly limited, and can enumerate the process same with above-mentioned 1st embodiment, Make above-mentioned [operation 1：Pattern-like plated coating formation process] in imparting energy region be substrate 12 whole region be Can.

Additionally, the manufacture method of wiring lead 18 is not particularly limited, can suitably enumerate in above-mentioned 2nd embodiment The operation 3 (wiring lead formation process) of narration.

<<4th embodiment>>

In the 1st embodiment to the 3rd embodiment, for plated in the one side configuration detecting electrode of substrate, pattern-like The mode of coating (or plated coating), wiring lead and electric conductivity connecting portion has carried out narration but it is also possible to two-sided in substrate Configuration detecting electrode, the plated coating of pattern-like (or plated coating), wiring lead and electric conductivity connecting portion.

Figure 10 shows the top view of the 4th embodiment of the contact panel sensor conductive film of the present invention.Figure 11 It is the sectional view being cut off along cutting line D-D.

As shown in Figure 10, contact panel sensor conductive film 300 possesses substrate 12 and configures the two of substrate 12 The plated coating of detecting electrode 14 on face, pattern-like 16, wiring lead 18 and electric conductivity connecting portion 24.It should be noted that such as Shown in Figure 10, on the surface of substrate 12 detecting electrode 14 of configuration with the configuration of the back side of substrate 12 detecting electrode 14 according to Orthogonal mode is configured.

Embodiment

Below by embodiment, the present invention is illustrated in further detail, but the present invention is not limited to these.

(synthesis example：Polymer 1)

Add ethyl acetate 1L, 2- ethylaminoethanol 159g in the there-necked flask of 2L, cooled down using ice bath.It is adjusted to Interior temperature is less than 20 DEG C and drips 2- bromo isobutyl acylbromide 150g thereto.Thereafter interior temperature is made to rise to room temperature (25 DEG C) and react 2 Hour.After reaction terminating, additional distilled water 300mL makes reaction stop.Thereafter using distilled water 300mL, ethyl acetate phase is carried out 4 cleanings, are dried using magnesium sulfate afterwards, and then ethyl acetate are distilled off, thus obtaining raw material A 80g.

Then, raw material A 47.4g, pyridine 22g, ethyl acetate 150mL are added in the there-necked flask of 500mL, using ice Bath is cooled down.Being adjusted to interior temperature is less than 20 DEG C dropping acryloyl chloride 25g thereto.Thereafter rise to room temperature and to react 3 little When.After reaction terminating, additional distilled water 300mL makes reaction stop.Thereafter using distilled water 300mL, 4 are carried out to ethyl acetate phase Secondary cleaning, is dried using magnesium sulfate afterwards, and then ethyl acetate is distilled off.Thereafter obtain following list using column chromatography Body M1 (20g).

【Change 6】

Add DMA 8g in the there-necked flask of 500mL, be heated to 65 DEG C under nitrogen flowing.Using 4 The time of hour drips monomer M1 thereto：14.3g, acrylonitrile (Tokyo HuaCheng Industry Co., Ltd's manufacture) 3.0g, acrylic acid The DMAC N,N' dimethyl acetamide 8g solution of (Tokyo chemical conversion manufactures) 6.5g, V-65 (and pure medicine manufacture) 0.4g.

After completion of dropwise addition, reaction solution is stirred further 3 hours.Thereafter add DMA 41g, will be anti- Solution is answered to be cooled to room temperature.4- hydroxyl TEMPO (Tokyo chemical conversion manufactures) 0.09g, DBU (phenodiazine is added in above-mentioned reaction solution Miscellaneous bicyclic endecatylene) 54.8g, carry out reaction in 12 hours at room temperature.70 mass % methanesulfonic acids are added in its backward reactant liquor Aqueous solution 54g.After reaction terminating, carry out reprecipitation using water, take out solid matter, obtain polymer 1 (12g).

Polymer 1 obtained by being carried out using IR (infrared, infrared) measuring machine ((strain) hole field makes manufactured) Identification.In mensure, so that polymer is dissolved in acetone, carried out using KBr crystal.The result being measured according to IR, 2240cm^-1Nearby observe peak value it is known that acrylonitrile is directed in polymer as nitrile unit.Additionally, passing through acid value measuring Understand that acrylic acid is imported into as carboxylic acid.And, so that polymer is dissolved in deuterated DMSO (dimethyl sulfoxide (DMSO)), utilize The NMR (nuclear magnetic resonance, Nuclear Magnetic Resonance) (AV-300) of the 300MHz that Bruker manufactures is measured. Understand, observe the broad peak corresponding to nitrile group-containing unit in 2.5-0.7ppm (5H), in 7.8-8.1ppm (1H), 5.8-5.6ppm (1H), 5.4-5.2ppm (1H), 4.2-3.9ppm (2H), 3.3-3.5ppm (2H), 2.5-0.7ppm (6H) observe corresponding to Broad peak containing polymerizable group unit, observes corresponding to the broad peak containing carboxylic acid in 2.5-0.7ppm (3H divides), containing polymerization Property group unit:Nitrile group-containing unit:Carboxylic acid group unit=30:30:40 (mol%).

【Change 7】

<The preparation of plated coating formation composition>

Water (18.95 mass parts), propylene glycol monomethyl ether (75.8 matter are added in the 200ml beaker insert magnetic agitation Amount part), polymer 1 (5 mass parts) and IRGACURE OXE 02 (manufacture of BASF society) (0.25 mass parts), modulation liquid, obtain Plated coating formation composition.

<Embodiment 1>

By glass substrate (Corning manufacture) after 150 DEG C of heat dryings 1 hour, at 1500 rpm on the glass substrate Spin coating priming coat is formed with composition (Nipol1561 (Japanese Zeon manufactures) water dispersion solution (total solid content concentration 40.5 matter Amount part)) 1 minute, it is dried 30 minutes at 120 DEG C, form priming coat.Then, on priming coat, the plated coating of spin coating forms use Composition, in 80 DEG C of dryings 5 minutes.Thereafter, pass through and there is the negative of the pattern that live width/spacing (line/space) is 3 μm/3 μm Type mask carries out UV irradiation (energy under air to substrate：2J, 10mW, wavelength：256nm), entered using 1% sodium acid carbonate Row development, thus form pattern-like plated coating (thickness：0.25μm).

After the face being unpatterned the glass substrate of the plated coating of shape is utilized maintenance band (day, east electrician manufactured) to cover, Under room temperature, Pd catalyst is only being given in liquid MAT-2 (industry of upper village manufactures) by the glass substrate with the plated coating of pattern-like MAT-2A carry out 5 times dilution after (catalyst give liquid, pH：3.5) impregnate 5 minutes in solution, cleaned 2 times using pure water. Then impregnate 5 minutes in reducing agent MAB (industry of upper village manufactures) at 36 DEG C, cleaned 2 times using pure water.Thereafter at room temperature In activation liquid MEL-3 (industry of upper village manufactures), dipping 5 minutes, in the case of not being carried out, divides at room temperature Dipping 60 minutes not in electroless plating covering liquid Thru-cup PEA (industry of upper village manufactures).Peel off the band covering, using pure water Cleaning 2 times, obtains the glass substrate possessing pattern-like layers of copper (being equivalent to wiring lead) on the plated coating of pattern-like.

Then, 95 are compared with tin oxide for weight using indium oxide:5 composition, packed density are 98% indium oxide-oxidation Tin target, forms ITO layer by the region not configuring pattern-like layers of copper on obtained glass substrate for the sputtering method, using photograph Phase lithography by Resist patterning, be etched, obtain the ITO layer (being equivalent to detecting electrode) of pattern-like.

And then, between pattern-like layers of copper and ITO layer, the conductive ink containing silver nano-grain is dripped by ink-jet method (Harima Chemicals NPS-JL), process of implementing to be heating and curing, formed pattern-like layers of copper and ITO layer electrical connection The electric conductivity connecting portion being made up of silver, obtains conductive film.

<Embodiment 2>

By glass substrate (Corning manufacture) after 150 DEG C of heat dryings 1 hour, at 1500 rpm on the glass substrate Spin coating priming coat is formed with composition (Nipol1561 (Japanese Zeon manufactures) water dispersion solution (total solid content concentration 40.5 matter Amount part)) 1 minute, it is dried 30 minutes at 120 DEG C, form priming coat.Then, on priming coat, the plated coating of spin coating forms use Composition, in 80 DEG C of dryings 5 minutes.Thereafter, film entire surface is carried out with UV irradiation (energy under air：2J, 10mW, wavelength： 256nm), form plated coating (thickness：0.25μm).

After the face not forming the glass substrate of plated coating is utilized maintenance band (day, east electrician manufactured) to cover, at room temperature MAT-2A in Pd catalyst imparting liquid MAT-2 (industry of upper village manufactures) is only being carried out by the glass substrate with plated coating Impregnate 5 minutes in solution after 5 times of dilutions, cleaned 2 times using pure water.Then in reducing agent MAB (upper village's industry system at 36 DEG C Make) in dipping 5 minutes, using pure water clean 2 times.Thereafter at room temperature activation liquid MEL-3 (industry of upper village manufactures) Middle dipping 5 minutes, in the case of not being carried out, at room temperature respectively in electroless plating covering liquid Thru-cup PEA (upper village Industry manufacture) in dipping 60 minutes.Peel off the band covering, cleaned 2 times using pure water, obtain possessing layers of copper on plated coating Glass substrate.

Using vacuum laminator, (name mechanism is made made：MVLP-600) will be dried under conditions of 70 DEG C, 0.2MPa against corrosion Agent film (Hitachi's chemical conversion system；15 μm of RY3315, thickness) it is laminated in obtained layers of copper.Next, it is against corrosion to make to be laminated with drying The substrate of agent film is close with the glass mask that can form combed distribution specified in JPCA-ET01 (according to JPCA-BU01-2007) Close, using the exposure machine for 405nm for the centre wavelength, resist is irradiated with the light energy of 70mJ.With 0.2MPa spray to exposure after Substrate spray attachment 1%Na₂CO₃The aqueous solution, is developed.The washing and drying of followed by substrate, forming live width/spacing is 8 μ M/8 μm of Resist patterns.

At 40 DEG C of temperature, the substrate being formed with Resist patterns is immersed in FeCl₃In/HCl/water solution (etching solution), Thus it is etched, the removal of the layers of copper existing for the region of Resist patterns will not formed.Thereafter, spraying with 0.2MPa The spray attachment 3%NaOH aqueous solution on substrate, by swelling for Resist patterns stripping, using 10% aqueous sulfuric acid be neutralized process, Washed, thus obtaining the glass substrate possessing pattern-like layers of copper (being equivalent to wiring lead).

Using obtained glass substrate, form ITO layer and the electric conductivity of pattern-like according to process same as Example 1 Connecting portion, obtains conductive film.

<Comparative example 1>

Pattern-like layers of copper is not used to use conductive ink (Harima Chemicals society manufactures NPS-JL), using spray The method of the use of ink and water (FUJIFILM Dimatix society manufactures DMP2831) pattern-making shape silver layer (being equivalent to wiring lead), in addition, presses Obtain conductive film according to process same as Example 1.

Wherein, in the ink-jet method using conductive ink, due to the problem in the performance of device, only obtained live width/ Spacing is 100 μm/100 μm of pattern-like silver layer.

<Miniaturization is evaluated>

The size of the live width/spacing of the pattern-like silver layer of the pattern-like layers of copper with regard to embodiment 1 and 2 and comparative example 1, according to Following benchmark is evaluated.

“A”：Can be formed live width/spacing amplitude be less than 5 μm pattern situation

“B”：The amplitude that live width/spacing can be formed is all higher than 5 μm and the situation for less than 10 μm of pattern

“C”：Only define live width/spacing amplitude be all higher than 10 μm pattern situation

<Adaptation is evaluated>

(adhesive tape peel test)

As evaluation method, carry out after forming the pattern-like layers of copper of embodiment 1 and 2 and the pattern-like silver layer of comparative example 1 Adhesive tape peel test, unstripped and remain in the remaining on substrate for pattern-like layers of copper or pattern-like silver layer according to following benchmark Rate is evaluated.

It should be noted that adhesive tape peel test to be implemented according to JIS K5600-5-6.

“A”：The situation of remaining 90～100%

“B”：Situation more than 10% stripping

<Connectivity is evaluated>

(connection resistance measurement)

As evaluation method, to resistance value and pattern-like ITO layer between for the above-mentioned pattern-like layers of copper (or pattern-like silver layer) It is measured (Zhi motor society manufactures, Milliohm HiTester 3540), evaluated according to following benchmark.

“A”：Resistance value is the situation of below 10m Ω

“B”：Resistance value is more than the situation of 10m Ω

“C”：Cannot determine resistance value, substantially occur break situation

Above-mentioned evaluation result one is listed in table 1.

It should be noted that in table 1, " X " in " processing method " one hurdle refers to formation figure on the plated coating of pattern-like The method of case shape layers of copper, the method that " Y " refers to layers of copper is etched to form pattern-like layers of copper.

【Table 1】

	Plated coating	Processing method	Miniaturization is evaluated	Adaptation is evaluated	Resistive is evaluated
						Embodiment 1	Have	X	A	A	A
Embodiment 2	Have	Y	B	A	A
						Comparative example 1	No	―	C	B	A

Pattern-like layers of copper as shown in above-described embodiment 1 and 2, in the contact panel sensor conductive film of the present invention (being equivalent to wiring lead) can carry out miniaturization, and adaptation is also excellent simultaneously.And, pattern-like layers of copper and ITO layer (are equivalent to Detecting electrode) electrical connectivity also increase.

On the other hand, in the comparative example 1 using conductive ink, pattern-like silver layer (being equivalent to wiring lead) is originally no Method miniaturization, and the adaptation of the pattern-like silver layer being formed is also poor.

<Embodiment 3>

By glass substrate (Corning manufacture) after 150 DEG C of heat dryings 1 hour, at 1500 rpm on the glass substrate Spin coating priming coat is formed with composition (Nipol1561 (Japanese Zeon manufactures) water dispersion solution (total solid content concentration 40.5 matter Amount part)) 1 minute, it is dried 30 minutes at 120 DEG C, form priming coat.Then, in 1500rpm, on priming coat, spin coating is plated Layer is formed uses composition 1 minute, in 80 DEG C of dryings 5 minutes.Thereafter, substrate is entered under air through specific minus mask Row UV irradiates (energy：2J, 10mW, wavelength：256nm), developed using 1% sodium acid carbonate, thus in the pattern with Fig. 1 The same position of shape plated coating 16 forms the plated coating of pattern-like.

Using the obtained glass substrate with the plated coating of pattern-like, according to process same as Example 1 in figure Pattern-making shape layers of copper on the plated coating of case shape.Obtained pattern-like layers of copper is located at same position with the wiring lead 18 of Fig. 1 Put.

Then, make ITO layer using sputtering method, photolithography, make ITO layer configure the detecting electrode 14 in Fig. 1 Position.

And then, using ink-jet method, by the conductive ink containing silver nano-grain, (Harima Chemicals society manufactures NPS-JL) it is added drop-wise to the electric conductivity connecting portion 24 to form Fig. 1 between pattern-like layers of copper and ITO layer, process of implementing to be heating and curing, Form the electric conductivity connecting portion being made up of silver.

It should be noted that obtained contact panel conductive film show similarly to Example 1 desired Effect (miniaturization, low resistive, high adhesion).

In addition, forming the plated coating of pattern-like in the same position of coating 160 plated with the pattern-like of Fig. 5, in addition, Obtain contact panel conductive film according to process same as described above.

And then, by implementing said process on the two sides of glass substrate, the contact panel having obtained mode shown in Figure 10 is used Conductive film.

The explanation of symbol

10,100,200,300 contact panel sensor conductive films

12 substrates

14 detecting electrodes

The plated coating of 16,160 pattern-likes

18 wiring leads

20 films

22 plated coating

24 electric conductivity connecting portions

30 metal levels

Claims (9)

1. a kind of contact panel sensor conductive film, it possesses：

Substrate；

Detecting electrode, this detecting electrode configures on the surface of at least side of aforesaid substrate；

The plated coating of pattern-like, the plated coating of this pattern-like is joined on a side surface with above-mentioned detecting electrode of aforesaid substrate Put the periphery in above-mentioned detecting electrode, and be there is the functional group being interacted with plating catalyst or its precursor；

Wiring lead, this wiring lead configures on the plated coating of above-mentioned pattern-like；And

Electric conductivity connecting portion, above-mentioned detecting electrode is electrically connected by this electric conductivity connecting portion with above-mentioned wiring lead；

Above-mentioned wiring lead is the distribution by least having the formation of the method for following operations, in this operation, to above-mentioned pattern The plated coating of shape gives plating catalyst or its precursor, for the above-mentioned pattern-like quilt having been assigned plating catalyst or its precursor Coating layer carries out plating.

2. contact panel sensor conductive film as claimed in claim 1, wherein, the plated coating of above-mentioned pattern-like be for Plated coating formation composition gives energy and the layer that formed with pattern-like, and this plated coating formation composition contains and has The functional group interacting with plating catalyst or its precursor and the compound of polymerizable group.

3. a kind of contact panel sensor conductive film, it possesses：

Substrate；

Plated coating, this plated coating configures on aforesaid substrate, and has and plating catalyst or the interaction of its precursor Functional group；

Detecting electrode, this detecting electrode configures on above-mentioned plated coating；

Wiring lead, this wiring lead configures the periphery in above-mentioned detecting electrode on above-mentioned plated coating；And

Electric conductivity connecting portion, above-mentioned detecting electrode is electrically connected by this electric conductivity connecting portion with above-mentioned wiring lead；

Above-mentioned wiring lead is the following distribution being formed：Give plating catalyst or its precursor to above-mentioned plated coating, for upper State and have been assigned the plated coating of plating catalyst or its precursor and carry out plating to form metal level, above-mentioned metal level is lost It is carved into pattern-like, be consequently formed this distribution.

4. the contact panel sensor conductive film as described in any one of claims 1 to 3, wherein, above-mentioned electric conductivity is even Socket part is the connecting portion being formed by print process using conductive paste or conductive ink.

5. the contact panel sensor conductive film as described in any one of Claims 1 to 4, wherein, above-mentioned detecting electrode It is the electrode being formed by sputtering method or vapour deposition method.

6. the contact panel sensor conductive film as described in any one of Claims 1 to 5, wherein, with aforesaid substrate table Face adjacently configures priming coat.

7. the contact panel sensor conductive film as described in any one of claim 1～6, wherein, above-mentioned wiring lead Live width be 1～10 μm.

8. a kind of contact panel sensor, the contact panel sensor that it comprises described in any one of claim 1～7 is conductive Property film.

9. a kind of contact panel, it comprises the contact panel sensor conductive film described in any one of claim 1～7.