CN106370327B - Flexible pressure sensor and manufacturing method thereof - Google Patents
Flexible pressure sensor and manufacturing method thereof Download PDFInfo
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- CN106370327B CN106370327B CN201610882536.XA CN201610882536A CN106370327B CN 106370327 B CN106370327 B CN 106370327B CN 201610882536 A CN201610882536 A CN 201610882536A CN 106370327 B CN106370327 B CN 106370327B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
Abstract
The invention discloses a flexible pressure sensor, which comprises two electrode structures which are oppositely arranged, wherein each electrode structure comprises a flexible substrate and a conducting layer arranged on the flexible substrate, and the conducting layers of the two electrode structures are mutually butted and connected in an opposite direction; the flexible substrate comprises a substrate body and a plurality of convex structures arranged on the substrate body, and the conductive layer is arranged on the surface of the flexible substrate with the convex structures in a covering mode. According to the flexible pressure sensor, the characteristic that a plurality of convex structures formed by flexible materials and positioned in the flexible pressure sensor are easy to deform under the action of pressure is utilized, so that the resistance change, adjustment and control caused by the change of the contact area of the conducting layers in two opposite electrode structures when the conducting layers are in contact are realized, and further, the pressure sensing is realized. Compared with the MEMS processing technology generally adopted by the flexible pressure sensor in the prior art, the manufacturing method is simpler and more convenient and has lower cost.
Description
Technical Field
The invention belongs to the technical field of pressure sensors, and particularly relates to a flexible pressure sensor and a manufacturing method thereof.
Background
The flexible pressure sensor is a flexible electronic device capable of converting stress into an electrical signal, and can be widely applied to the fields of flexible touch screens, artificial intelligence, wearable electronics, mobile medical treatment and the like.
According to the signal conversion mechanism, pressure sensors are mainly classified into resistive sensors, capacitive sensors, and piezoelectric sensors. The basic operating principle of the resistive pressure sensor is to convert the change of the measured pressure into the change of the resistance value of the sensor. The resistance type pressure sensor has the advantages of simple device structure, stable and easily-measured resistance signal, high sensitivity and the like. Microstructuring the electrode array of the resistive pressure sensor is one of effective ways to improve the sensitivity and reliability of the sensor.
In the prior art, a micro-nano finger-shaped structure array is prepared by taking silicon as a template, and then Pt film electrodes are sputtered on a Polydimethylsiloxane (PDMS) film to assemble a pressure sensor with a paired electrode structure; there is also a pressure sensor composed of upper and lower substrates and a body circuit, wherein the upper and lower substrates have the same micro-three-dimensional structure technology, such as one or more of V-shaped, U-shaped, triangular pyramid, sine wave, spherical three-dimensional structure, etc.; there are also flexible pressure sensors based on carbon nanotubes and high molecular polymers, which are prepared with triangular pyramids having periodic arrangement as microstructures. Although the above-mentioned technologies all apply the microstructure array to the flexible pressure sensor, the microstructure arrays are all made based on the silicon micro-template method; the silicon micro-template is usually manufactured by using a micro-electro-mechanical system (MEMS) processing technology, which relates to a series of complex processes such as corrosion, bonding, photoetching, oxidation, diffusion, sputtering and the like.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a flexible pressure sensor and a manufacturing method thereof, wherein the flexible pressure sensor utilizes the characteristic that a plurality of convex structures which are formed by flexible materials and are positioned in the flexible pressure sensor are easy to deform under the action of pressure, so that the resistance change, adjustment and control caused by the change of the contact area when electrode layers on the surfaces of two opposite flexible substrates are contacted are realized, and further, the pressure sensing is realized.
In order to achieve the purpose of the invention, the invention adopts the following technical scheme:
a flexible pressure sensor comprises two electrode structures which are oppositely arranged, wherein each electrode structure comprises a flexible substrate and a conducting layer arranged on the flexible substrate, and the conducting layers of the two electrode structures are mutually butted and connected towards each other; the flexible substrate comprises a substrate body and a plurality of convex structures arranged on the substrate body, and the conductive layer is arranged on the surface of the flexible substrate with the convex structures in a covering mode.
Further, the surface shape of the conductive layer is consistent with the surface shape of the flexible substrate with a plurality of convex structures.
Further, a plurality of convex structures in the two electrode structures are arranged oppositely one by one or are arranged in a mutually crossed mode.
Further, the material of the flexible substrate is selected from any one of polydimethylsiloxane, ethylene-vinyl acetate copolymer, polyvinyl alcohol, styrene-butadiene-styrene block copolymer, aromatic random copolymer, styrene-butadiene rubber, polyurethane elastomer, polyolefin elastomer, polyamide elastomer, and the like.
Further, the plurality of convex structures are arranged on the substrate body in an array mode, and the convex structures are spherical in shape; the diameter of the convex structure is 100 nm-1 mm, and the distance between two adjacent convex structures in the same flexible substrate is not more than 1 mm.
Further, the material of the electrode layer is selected from any one of nano gold, nano silver, nano aluminum, nano copper, nano nickel, nano palladium, nano platinum, nano carbon and indium tin oxide.
It is another object of the present invention to provide a method for manufacturing a flexible pressure sensor as defined in any of the above, comprising the steps of: s1, providing a first template, wherein the first template is provided with a plane and a plurality of holes which are arranged in the plane in a concave mode; s2, depositing a flexible material on the plane, wherein the flexible material is filled in the hole and covers the plane; s3, removing the first template to obtain a flexible substrate; wherein the substrate body is formed corresponding to the flexible material on the plane, and the plurality of convex structures are formed corresponding to the flexible material in the plurality of holes; s4, preparing the conducting layer on the surface of the flexible substrate with the convex structures to form the electrode structure; s5, preparing and obtaining two electrode structures according to the steps S1-S4, and enabling the conducting layers of the two electrode structures to face each other to be in butt joint to obtain the flexible pressure sensor.
Further, the method for manufacturing the first template specifically includes: selecting a substrate, and preparing a plurality of salient points on the substrate; depositing a first template material on the substrate, the first template material covering the plurality of bumps; removing the substrate and the plurality of salient points to obtain the first template; and the plurality of holes are correspondingly formed at the positions of the plurality of salient points.
Further, the substrate is made of glass or silicon wafer; the material of the plurality of bumps is selected from any one of polystyrene, polymethyl methacrylate and silicon dioxide; the material of the first template is selected from any one of polydimethylsiloxane, epoxy resin, acrylic resin and vinyl resin.
Further, the plurality of salient points are removed by a soaking method; when the material of the plurality of bumps is polystyrene, the soaking agent is at least one selected from toluene, chloroform, tetrahydrofuran and N, N-dimethylformamide, when the material of the plurality of bumps is polymethyl methacrylate, the soaking agent is at least one selected from acetone, chloroform, dichloromethane, phenol and anisole, and when the material of the plurality of bumps is silicon dioxide, the soaking agent is alkali liquor or hydrofluoric acid.
The invention has the beneficial effects that:
(1) according to the flexible pressure sensor, the two electrode structures with the convex structures are oppositely arranged, and the conductive layers are enabled to be mutually and directionally butted and connected, so that the flexible pressure sensor is obtained; the flexible pressure sensor can utilize the characteristic that the convex structure in the flexible substrate is easy to deform under the action of pressure so as to cause the change of the contact area of the two conducting layers, thereby improving the sensitivity and the reliability.
(2) The flexible pressure sensor preferably selects spherical convex structures, and can realize fine control of an array formed by the convex structures by controlling self-assembly forms such as particle size, distance and the like, so that the micro-electrode is finely manufactured;
(3) the manufacturing method of the flexible pressure sensor adopts the colloid self-assembly and chemical corrosion process to manufacture the flexible substrate; compared with the common MEMS processing technology of the flexible pressure sensor in the prior art, the manufacturing method is simpler and more convenient and has lower cost.
Drawings
The above and other aspects, features and advantages of embodiments of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural view of a flexible pressure sensor according to embodiment 1 of the present invention.
Fig. 2 to 3 are schematic views showing the operation of the flexible pressure sensor according to embodiment 1 of the present invention.
Fig. 4 is a schematic structural view of a flexible pressure sensor according to embodiment 2 of the present invention.
Fig. 5 is an operational view of a flexible pressure sensor according to embodiment 2 of the present invention.
Fig. 6 to 11 are process flow charts of a method of manufacturing a flexible pressure sensor according to embodiment 3 of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided to explain the principles of the invention and its practical application to thereby enable others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated. In the drawings, the shapes and sizes of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or similar elements.
Example 1
Fig. 1 is a schematic structural view of a flexible pressure sensor according to embodiment 1 of the present invention.
As shown in fig. 1, the flexible pressure sensor according to the present embodiment includes two electrode structures 1 disposed opposite to each other, each electrode structure 1 includes a flexible substrate 11 and a conductive layer 12 disposed on the flexible substrate 11, and the conductive layers 12 of the two electrode structures 1 are connected to each other in an abutting manner toward each other; each flexible substrate 11 includes a substrate body 111 and a plurality of convex structures 112 disposed on the substrate body 111, and the conductive layer 12 is disposed on the surface of the flexible substrate 11 having the plurality of convex structures 112, thereby forming a complete flexible pressure sensor.
In each flexible substrate 11, a plurality of convex structures 112 are preferably formed integrally with the substrate body 111; meanwhile, the conductive layer 12 completely covers the plurality of convex structures 112 and covers the surface of the substrate body 111 between the plurality of convex structures 112, that is, the conductive layer 12 on the surface of each flexible substrate 11 undulates with the concave-convex structure on the surface of the flexible substrate 11, and is a continuous whole body, so as to ensure that a good conductive effect is achieved.
In the present embodiment, the plurality of convex structures 112 in the two flexible substrates 11 are arranged in a one-to-one manner. In the same flexible substrate 11, the distance between two adjacent convex structures 112 is controlled to be not more than 1mm, wherein the distance refers to the shortest distance between the edges of the two adjacent convex structures; it can be seen that the distance between two adjacent convex structures 112 is adjustable, and the distance between the two adjacent convex structures can be reduced until the two convex structures contact each other, namely, the above-mentioned state where the distance is zero.
Preferably, in the present embodiment, the convex structures 112 are all spherical in shape, and the diameter thereof is controlled to be 100nm to 1mm, so as to finally form a convex structure array.
It is worth noting that when the diameter of the convex structure 112 is larger and the distance between two adjacent convex structures 112 is larger, the number of the convex structures 112 which can be arranged on the substrate body 111 with the same area is smaller, which results in the reduction of the testing accuracy and sensitivity of the obtained flexible pressure sensor.
Specifically, the material of the flexible substrate 11 is polydimethylsiloxane (abbreviated as PDMS), but of course, other flexible materials such as ethylene-vinyl acetate copolymer, polyvinyl alcohol, styrene-butadiene-styrene block copolymer, aromatic random copolymer, styrene-butadiene rubber, polyurethane elastomer, polyolefin elastomer, polyamide elastomer, and the like are also possible.
More specifically, the conductive layer 12 is made of nano-gold, but may be made of other conductive materials such as nano-silver, nano-aluminum, nano-copper, nano-nickel, nano-palladium, nano-platinum, nano-carbon, and Indium Tin Oxide (ITO). At the same time, those skilled in the art will appreciate that the conductive layer 12 here only functions to be electrically conductive to enable the flexible pressure sensor to be used properly, and therefore, the thickness of the conductive layer 12 need not be required.
The flexible pressure sensor 10 of the present embodiment is tested, specifically referring to fig. 2, two ends of a lead 21 are respectively connected to the two electrode layers 12 of the flexible pressure sensor 10 to form a current loop, and meanwhile, a test instrument 22 is connected to the current loop to detect characteristic parameters such as resistance and current.
Referring to fig. 3, the working principle of the flexible pressure sensor of the present embodiment is as follows: under the action of the applied pressure F, the plurality of convex structures 112 in the flexible pressure sensor 10 deform, so that the contact area of the two conductive layers 12 in the two electrode structures 1 is increased; the pressure F is different in size, and the contact areas of the two conductive layers 12 are also different, so that the characteristic parameters of the flexible pressure sensor, such as resistance current and the like, are correspondingly changed; when the pressure F is reduced or removed, the flexible substrate 11 is made of a flexible material, and the flexible material has an automatic recovery capability of an elastic body, so that the contact area of the two conductive layers 12 on the surface of the flexible substrate 11 is gradually reduced or recovered to the original position, characteristic parameters such as resistance and current of the flexible pressure sensor are correspondingly changed at the same time, and the magnitude and the change of the pressure F can be estimated by detecting the change of the characteristic parameters such as resistance and current in the test instrument 22.
Example 2
In the description of embodiment 2, the same points as those of embodiment 1 will not be described again, and only the differences from embodiment 1 will be described. Referring to fig. 4, embodiment 2 is different from embodiment 1 in that the arrangement of the plurality of convex structures 112 in the two flexible substrates 11 is different; in this embodiment, the convex structures 112 in the two flexible substrates 11 are arranged to cross each other. Still referring to the structure and materials in example 1, another flexible pressure sensor was obtained.
The flexible pressure sensor of this example was tested by the same test method as in example 1 above. The plurality of convex structures 112 in the flexible pressure sensor of the present embodiment deform as shown in fig. 5 when subjected to an applied pressure F. As can be seen from fig. 5, although the convex structures 112 on the two flexible substrates 11 are arranged in an intersecting manner in this embodiment, when an external pressure F is applied, the contact area between the two conductive layers 12 is increased, and after the pressure F is decreased or removed, the convex structures 112 recover to the shape, and the contact area between the two conductive layers 12 is decreased, so that the characteristic parameters of the flexible pressure sensor, such as resistance and current, are changed accordingly, and then the magnitude and the change of the pressure F can be estimated by detecting the change of the characteristic parameters, such as resistance and current, in the process.
Example 3
The present embodiment discloses a manufacturing method of the flexible pressure sensor in embodiment 1, and with reference to fig. 6 to 11 in particular, the manufacturing method of the flexible pressure sensor according to the present embodiment includes the following steps:
q1, selecting a substrate 41, and preparing a plurality of bumps 42 on the substrate 41; the shape and arrangement of the bumps 42 are the same as those of the plurality of bumps 112 in the flexible pressure sensor in embodiment 1, as shown in fig. 6.
In this embodiment, the substrate 41 is made of glass, and the bump 42 is made of Polystyrene (PS); the bump 42 is preferably spherical in shape, and the particle diameter thereof is controlled to be 100nm to 1mm, preferably 20 μm in this embodiment.
Of course, the material of the substrate 41 may also be a silicon wafer or a plastic product with a smooth surface, and the material of the bumps 42 may also be monodisperse micro/nano-sphere emulsion or colloid such as polymethyl methacrylate (PMMA), silicon dioxide, and the like.
Specifically, in the present embodiment, a gravity self-settling method is used to prepare a single-layer self-assembled PS microsphere array on the surface of the substrate 41 to form the plurality of bumps 42; meanwhile, the distance between the plurality of bumps 42 is controlled not to exceed 1mm, preferably 2 μm in this embodiment, by selecting a suitable solvent for the dispersion and controlling the concentration of the PS microsphere emulsion.
Of course, the method for forming the plurality of bumps 42 on the substrate 41 may also be, for example, a vertical deposition method, a dip-coating method, an inclined substrate method, an interface self-assembly method, a spin-coating method, or the like.
Q2, depositing a first template material on the substrate 41, the first template material covering the plurality of bumps 42, resulting in a first template precursor 43a, as shown in fig. 7.
In this embodiment, since the material of the prefabricated first template is polydimethylsiloxane (abbreviated as PDMS), a PDMS prepolymer with a mass ratio of 5:1 to 12:1, preferably 10:1 is mixed with a curing agent used in combination with the PDMS prepolymer to serve as the first template material; uniformly mixing the two, and spin-coating the first template material on the side of the substrate 41 with the plurality of bumps 42 at a rotation speed of 200rpm for 10s to obtain a first template precursor 43a with a thickness of 800 μm; and (3) placing the first template precursor 43a in an oven with the temperature of 100-150 ℃ for heating and curing for 10 min-2 h, preferably in the oven with the temperature of 150 ℃ for heating and curing for 30min in the embodiment, and cooling to room temperature.
It is to be noted that the thickness of the first template precursor 43a only needs to be ensured to be not less than the height of the bumps 42.
Q3, removing the substrate 41 and the bumps 42 to obtain the first template 43, as shown in fig. 8.
Specifically, the substrate 41 is first directly peeled off; then soaking the first template 43 carrying the plurality of bumps 42 in tetrahydrofuran for 24h, dissolving and removing the bumps 42 taking PS as a material by the tetrahydrofuran, and only keeping the first template 43, wherein the plurality of bumps 42 are formed as a plurality of holes 431 on the plane of the first template 43, and the shapes of the holes 431 are matched with the shapes of the plurality of convex structures in the prefabricated flexible pressure sensor; in other words, the first template 43 has a plane, and a plurality of holes 431 are concavely provided in the plane.
Of course, when the material of the plurality of bumps 42 is different, the soaking agent for dissolution removal is also different, and when the material of the bumps 42 is polystyrene, the soaking agent may also be selected from at least one of toluene, chloroform, and N, N-dimethylformamide; when the material of the bump 43 is polymethyl methacrylate, the soaking agent may be at least one selected from acetone, chloroform, dichloromethane, phenol, and anisole; when the material of the bumps 43 is silicon dioxide, the soaking agent is strong alkali solution or hydrofluoric acid.
Meanwhile, the material of the first template 43 is not limited to PDMS in the present embodiment, and may be selected from epoxy resin, acrylic resin, vinyl resin, and the like.
Q4, depositing a flexible material 11a onto the planar surface of first template 43, the flexible material 11a filling in holes 431 and covering the planar surface, as shown in fig. 9.
In this embodiment, the pre-prepared flexible substrate 11 is made of PDMS, and thus the flexible material 11a is formed by mixing the PDMS prepolymer and the curing agent in a mass ratio of 3:1 to 15:1, preferably 12: 1; spin coating the first template 43 at a rotation speed of 500rpm for 20s, wherein the thickness of the first template is controlled to be 50 μm to 1mm, preferably 500 μm in this embodiment; then curing the mixture for 2 to 24 hours at the room temperature to 100 ℃; in the embodiment, the mixture is preferably placed in an oven with the temperature of 80 ℃ for heating and curing for 2 hours, and the mixture is cooled to the room temperature.
Of course, the material that can be used as the flexible substrate 11 is not limited to PDMS in the present embodiment, but may be a flexible material such as an ethylene-vinyl acetate copolymer, polyvinyl alcohol, a styrene-butadiene-styrene block copolymer, an aromatic random copolymer, styrene-butadiene rubber, a polyurethane-based elastomer, a polyolefin-based elastomer, a polyamide-based elastomer, or the like.
Q5, removing the first template 43, obtaining the flexible substrate 11, wherein the flexible substrate 11 comprises a substrate body 111 and a plurality of convex structures 112 arranged on the substrate body 111, as shown in fig. 10.
Specifically, the substrate body 111 is formed corresponding to the flexible material 11a on the plane of the first template 43, and the plurality of convex structures 112 are formed corresponding to the flexible material 11a in the plurality of holes 431.
Q6, preparing the conductive layer 12 on the surface of the flexible substrate 11 with the convex structure 112, and forming the electrode structure 1, as shown in fig. 11.
In the present embodiment, the material of the conductive layer 12 is nanogold; of course, the material that can be used as the conductive layer 12 may also be a conductive material such as nano silver, nano aluminum, nano copper, nano nickel, nano palladium, nano platinum, nano carbon, indium tin oxide (abbreviated as ITO), and the like.
Specifically, the first template 43 is peeled off first; the flexible substrate 11 is then placed in an evaporation apparatus, and a layer of nanogold is evaporated as the conductive layer 12 on the surface of the flexible substrate 11 having the convex structure 112.
Q7, preparing two electrode structures 1 by referring to the above steps Q1-Q6, and abutting and connecting the conductive layers 12 of the two electrode structures 1 toward each other to obtain the flexible pressure sensor.
It is worth noting that in the present embodiment, when two electrode structures 1 are oppositely stacked together, a flexible pressure sensor as shown in fig. 1 in embodiment 1 is obtained by arranging a plurality of convex structures 112 in a one-to-one manner.
Example 4
This embodiment discloses a method for manufacturing a flexible pressure sensor as in embodiment 2 above; the manufacturing method of this embodiment is the same as the manufacturing method of embodiment 3, and is not repeated herein, and only the differences from embodiment 3 are described. Embodiment 4 differs from embodiment 3 in that in step Q7, when two electrode structures 1 are oppositely buckled together, a plurality of convex structures 112 are crossed with each other, so that a flexible pressure sensor as shown in fig. 4 in embodiment 2 is obtained.
While the invention has been shown and described with reference to certain embodiments, those skilled in the art will understand that: various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (8)
1. A method for manufacturing a flexible pressure sensor is characterized by comprising the following steps:
s1, providing a first template, wherein the first template is provided with a plane and a plurality of holes which are arranged in the plane in a concave mode;
s2, depositing a flexible material on the plane, wherein the flexible material is filled in the hole and covers the plane;
s3, removing the first template to obtain a flexible substrate; wherein a substrate body is formed corresponding to the flexible material on the plane, and a plurality of convex structures are formed corresponding to the flexible material in the plurality of holes;
s4, preparing a conductive layer on the surface of the flexible substrate with the convex structures, wherein the conductive layer is coated on the surface of the flexible substrate with the convex structures to form an electrode structure;
s5, preparing and obtaining two electrode structures according to the steps S1-S4, and enabling the conducting layers of the two electrode structures to face each other to be in butt joint to obtain the flexible pressure sensor.
2. The manufacturing method according to claim 1, wherein the manufacturing method of the first template specifically includes:
selecting a substrate, and preparing a plurality of salient points on the substrate;
depositing a first template material on the substrate, the first template material covering the plurality of bumps;
removing the substrate and the plurality of salient points to obtain the first template; and the plurality of holes are correspondingly formed at the positions of the plurality of salient points.
3. The manufacturing method according to claim 2, wherein the substrate is made of glass or silicon wafer; the material of the plurality of bumps is selected from any one of polystyrene, polymethyl methacrylate and silicon dioxide; the material of the first template is selected from any one of polydimethylsiloxane, epoxy resin, acrylic resin and vinyl resin.
4. The method of claim 3, wherein the bumps are removed by a dipping process; when the material of the plurality of bumps is polystyrene, the soaking agent is at least one selected from toluene, chloroform, tetrahydrofuran and N, N-dimethylformamide, when the material of the plurality of bumps is polymethyl methacrylate, the soaking agent is at least one selected from acetone, chloroform, dichloromethane, phenol and anisole, and when the material of the plurality of bumps is silicon dioxide, the soaking agent is alkali liquor or hydrofluoric acid.
5. The method of manufacturing according to claim 1, wherein a surface shape of the conductive layer conforms to a surface shape of the flexible substrate having a plurality of convex structures.
6. The method according to claim 1, wherein the flexible material is selected from any one of polydimethylsiloxane, ethylene-vinyl acetate copolymer, polyvinyl alcohol, styrene-butadiene-styrene block copolymer, aromatic random copolymer, styrene-butadiene rubber, polyurethane elastomer, polyolefin elastomer, and polyamide elastomer.
7. The manufacturing method of claim 1, wherein the diameter of the convex structure is 100nm to 1mm, and the distance between two adjacent convex structures in the same flexible substrate is not more than 1 mm.
8. The method according to claim 1, wherein the conductive layer is made of a material selected from the group consisting of nanogold, nanosilver, nanoaluminum, nanocopper, nanonickel, nanopalladium, nanoplatinum, nanocarbon, and indium tin oxide.
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