CN106211566A - A kind of transparent circuit board - Google Patents
A kind of transparent circuit board Download PDFInfo
- Publication number
- CN106211566A CN106211566A CN201610745998.7A CN201610745998A CN106211566A CN 106211566 A CN106211566 A CN 106211566A CN 201610745998 A CN201610745998 A CN 201610745998A CN 106211566 A CN106211566 A CN 106211566A
- Authority
- CN
- China
- Prior art keywords
- layer
- transparent
- circuit
- circuit board
- conductive substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
Abstract
The present invention relates to a kind of transparent circuit board, it is characterized in that it comprises: transparent conductive substrate, described transparent conductive substrate is provided with at least one of which circuit, there is between described circuit layer and circuit layer insulating barrier, transparency conducting layer, what on described insulating barrier, etching point connected adjacent two layers circuit is conductively connected current potential, and described transparent conductive substrate is coated with the metal material layer of at least two-layer by magnetron sputtering and forms the electrode of described circuit layer.Transparent circuit board of the present invention and manufacture method thereof at least have the advantage that a kind of transparent circuit board and the manufacture method thereof of the present invention, it is that the tradition printed circuit board (PCB) with resin material as substrate is replaced with transparent conductive substrate, therefore it is readily susceptible to apply each big field, has convenience, attractive in appearance, the feature of the firm difficult drop-off of solder joint.
Description
Technical field
The present invention relates to a kind of transparent circuit board and manufacture method thereof, particularly relate to a kind of electro-conductive glass circuit board and
Manufacture method.
Background technology
Improve constantly in people's living standard, quality of life, attractive in appearance, conveniently increasingly become people and select artware to consider
One of factor.Although integrated circuit technique is towards electronic installation digitized, microminiaturization development, but its substrate is also very
Attractive in appearance, convenient.Circuit board is usually using organic resin or pottery as substrate material, it is common that green and opaque.Wherein
Circuit board with organic resin as base material spatters the high temperature crossed caused by processing procedure, and the thermal expansion of resin material by being difficult to bear vacuum
Coefficient (Coefficient of Thermal Expansion, CTE) is very big, the most easily makes to be made in metal thereon
Wire ruptures the situation of (crack)；And though ceramic substrate can bear high temperature, with the circuit with organic resin as base material
Plate is identical, and its surface has holes much more very, and unsightly, inconvenient, fragile.And the quality problems one of circuit board
As have that the green oil of substrate bubbles, green oil comes off, base material is layered, plate warped, Pad off, the bad and aging rear board of upper stannum
The problems such as open circuit occur.
Due to glass have transparent, without definite melting point, more stable characteristic, be used for be added on artware have attractive in appearance, side
Just characteristic, so being used in a lot of field.If using glass as the substrate of circuit board, need to face is the weldering on glass
Point jail is insecure, hold the problem being not easy to pitch.
Traditional glass base circuit board utilizes plated film etch process or low-temperature silver sizing process to make, and plates one in glass pane surface
Layer conductive paste, makes circuit with etching method, is equivalent to electronic circuit and is combined with glass plate by binding agent, then is conducted electricity by spraying
The organic material of metallic particles is further bonded, but this spraying coating process makes conductive paste purity decline, conductive capability
Excessively poor, and it is difficult to solder to electronic component, it is also difficult to realize functional circuit.
Summary of the invention
It is an object of the invention to, overcome the defect that existing circuit board and manufacture method thereof exist, and provide a kind of novel
Transparent circuit board and manufacture method thereof, pressed solve the technical problem that it is more attractive in appearance, be more widely applied, firm welding
Do not allow caducous technical problem.
The object of the invention to solve the technical problems realizes by the following technical solutions.A kind of transparent circuitry
Plate, it is characterised in that it comprises: transparent conductive substrate, described transparent conductive substrate is provided with at least one of which circuit, described circuit
Having insulating barrier, transparency conducting layer between layer and circuit layer, on insulating barrier, etching point connects being conductively connected of adjacent two layers circuit
Current potential, described transparent conductive substrate is coated with the metal material layer of at least two-layer by magnetron sputtering and forms the electricity of described circuit layer
Pole.
Wherein conductive, transparent substrate design circuit by the way of etched circuit.
Described transparent conductive substrate is the conductive, transparent substrate that sheet resistance is less than 35 Ω, to ensure circuit board conductive ability.
Described transparency conducting layer is ITO, alkenes conductive layer, to ensure the independent operating of adjacent two circuit.
In order to ensure the unobstructed operation of transparency carrier conductive capability and circuit, described transparent conductive substrate passes through magnetic control
The first layer metal material layer that plates of sputtering is molybdenum, one or more alloys of niobium, second layer metal material layer be copper, nickel, titanium,
One or more alloys of graphite, third layer metal material layer is copper, nickel, titanium, one or more alloys of rare earth metal.
In order to ensure Weldability, described first layer metal layer thickness is 5-100 nanometer, described second layer metal material
Thickness of feed layer is 10-300 nanometer, and described third layer metal material layer thickness is 30-500 nanometer.
In addition to the circuit design on basis, it is also possible to setting up signal transfer functions, described metal material layer is provided with 10-
20 μm metallic transmission holding wires.
By technique scheme, transparent circuit board of the present invention and manufacture method thereof at least have the advantage that the present invention
A kind of transparent circuit board and manufacture method, be with electrically conducting transparent base by the tradition printed circuit board (PCB) with resin material as substrate
Plate replaces, and is therefore readily susceptible to apply each big field, has convenience, attractive in appearance, the feature of the firm difficult drop-off of solder joint.
In sum, the present invention has above-mentioned plurality of advantages and practical value, and though its product structure, manufacture method or
The most all there is bigger improvement, have the most progressive technically, and create handy and practical effect, and more existing
Circuit board and manufacture method thereof have multinomial effect of enhancement, thus more suitable for practicality, and have the extensive exploitation value of industry
Value, is really a new and innovative, progressive, practical new design.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of description, and in order to allow the above and other objects, features and advantages of the present invention can
Become apparent, below especially exemplified by preferred embodiment, and coordinate accompanying drawing, describe in detail as follows.
Accompanying drawing explanation
Fig. 1 is embodiment one, two transparent circuit board structure chart；
Fig. 2 position embodiment three transparent circuit board structure chart.
Specific implementation method
By further illustrating the technological means and effect that the present invention taked by reaching predetermined goal of the invention, below in conjunction with accompanying drawing
And preferred embodiment, the glass circuit plate structure proposed according to the present invention is described in detail.
Embodiment one
As it is shown in figure 1, transparent circuit board of the present invention, having transparent conductive substrate 1, this transparent conductive substrate is that sheet resistance is little
In the conductive, transparent substrate of 35 Ω, transparent conductive substrate 1 is provided with one layer of circuit 2, circuit 2 has and is coated with by magnetron sputtering
The metal material layer of two-layer forms the electrode 3 of circuit layer.
Wherein, first layer metal material layer 301 is molybdenum, one or more alloys of niobium, and thickness is 5-100 nanometer.
Second layer metal material layer 302 is metallic copper, and thickness is 10-300 nanometer.
Third layer metal material layer 303 is nickel and rare earth element alloy, and thickness is 30-500 nanometer.
Being provided with 10-20 μm metallic transmission holding wire on this transparency carrier, metallic transmission holding wire is fixed on and electricity
On the metal material layer that path electrode is identical.
Embodiment two
As it is shown in figure 1, transparent circuit board of the present invention, having transparent conductive substrate 1, this transparent conductive substrate is that sheet resistance is little
In the conductive, transparent substrate of 35 Ω, transparent conductive substrate 1 is provided with one layer of circuit 2, circuit 2 has and is coated with by magnetron sputtering
The metal material layer of two-layer forms the electrode 3 of circuit layer.
Wherein, first layer metal material layer 301 is molybdenum, and thickness is 5-100 nanometer.
Second layer metal material layer 302 is metallic copper, and thickness is 10-300 nanometer.
Third layer metal material layer 303 is nickel or nickel and rare earth element alloy, and thickness is 30-500 nanometer.
Being provided with 10-20 μm metallic transmission holding wire on this transparency carrier, metallic transmission holding wire is fixed on and electricity
On the metal material layer that path electrode is identical.
Embodiment three
As it is shown in figure 1, transparent circuit board of the present invention, having transparent conductive substrate 1, this transparent conductive substrate is that sheet resistance is little
In the conductive, transparent substrate of 35 Ω, transparent conductive substrate 1 is provided with one layer of circuit 2, circuit 2 has and is coated with by magnetron sputtering
The metal material layer of two-layer forms the electrode 3 of circuit layer.
Wherein, first layer metal material layer 301 is molybdenum, niobium one or two kinds of alloy, and thickness is 5-100 nanometer.
Second layer metal material layer 302 is metallic copper, nickel, one or more alloys of titanium and rare earth element alloy, thickness
For 10-300 nanometer.
Being provided with 10-20 μm metallic transmission holding wire on this transparency carrier, metallic transmission holding wire is fixed on and electricity
On the metal material layer that path electrode is identical.
Embodiment four
On the basis of the basis of embodiment one to three or the differentiation of embodiment one to three, this transparent circuit board as shown in Figure 2
Conductive, transparent substrate 1 is provided with first circuit the 2, first circuit 2 and is etched on ground floor transparency conducting layer, and second circuit 2 etches
On second layer transparency conducting layer, second circuit 2 by insulating barrier 5, isolation, connected a little two circuit in the insulating barrier 5 upper moment
Be conductively connected position 501.
On the substrate being etched the first circuit 2, second circuit 2, be there is the gold being coated with two-layer by magnetron sputtering
Belong to material layer and form the electrode 3 of circuit layer.
This insulating barrier 5 main material is the transparent insulation materials such as dielectric ink, silicon dioxide, aluminium sesquioxide, transparent leads
Electric layer is mainly ITO, alkenes conductive layer.
The above, be only presently preferred embodiments of the present invention, and the present invention not makees any pro forma restriction, though
So the present invention is disclosed above with preferred embodiment, but is not limited to the present invention, any technology people being familiar with this specialty
Member, in the range of without departing from technical solution of the present invention, when the technology contents of available the disclosure above make a little change or
It is modified to the Equivalent embodiments of equivalent variations, as long as being that the technology according to the present invention is real without departing from technical solution of the present invention content
Any simple modification, equivalent variations and the modification that confrontation above example is made, all still falls within the scope of technical solution of the present invention
In.
Claims (6)
1. a transparent circuit board, it is characterised in that it comprises: transparent conductive substrate, described transparent conductive substrate is provided with at least
One layer of circuit, has insulating barrier, transparency conducting layer between described circuit layer and circuit layer, on described insulating barrier, etching point connects phase
Adjacent two-tier circuit be conductively connected current potential, described transparent conductive substrate is coated with the metal material layer of at least two-layer by magnetron sputtering
Form the electrode of described circuit layer.
Transparent circuit board the most according to claim 1, it is characterised in that described transparent conductive substrate is that sheet resistance is less than 35 Ω
Conductive, transparent substrate.
Transparent circuit board the most according to claim 1, it is characterised in that described transparency conducting layer is ITO, alkenes conduction
Layer.
Transparent circuit board the most according to claim 1, it is characterised in that pass through magnetron sputtering on described transparent conductive substrate
The first layer metal material layer plated is molybdenum, one or more alloys of niobium class, and second layer metal material layer is copper, nickel, titanium, stone
One or more alloys of ink, third layer metal material layer is copper, nickel, titanium, one or more alloys of rare earth metal.
Transparent circuit board the most according to claim 3, it is characterised in that described first layer metal layer thickness is 5-
100 nanometers, described second layer metal layer thickness is 10-300 nanometer, and described third layer metal material layer thickness is 30-500
Nanometer.
Transparent circuit board the most according to claim 4 and manufacture method thereof, it is characterised in that: on described metal material layer
It is provided with 10-20 μm metallic transmission holding wire.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610745998.7A CN106211566A (en) | 2016-08-29 | 2016-08-29 | A kind of transparent circuit board |
| PCT/CN2017/097974 WO2018040950A1 (en) | 2016-08-29 | 2017-08-18 | Transparent circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610745998.7A CN106211566A (en) | 2016-08-29 | 2016-08-29 | A kind of transparent circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211566A true CN106211566A (en) | 2016-12-07 |
Family
ID=57527289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610745998.7A Pending CN106211566A (en) | 2016-08-29 | 2016-08-29 | A kind of transparent circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106211566A (en) |
| WO (1) | WO2018040950A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018040950A1 (en) * | 2016-08-29 | 2018-03-08 | 广州市祺虹电子科技有限公司 | Transparent circuit board |
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|---|---|---|---|---|
| CN101807501A (en) * | 2010-03-15 | 2010-08-18 | 彩虹集团公司 | Method for producing film type FED (Field Emission Display) bottom substrate |
| CN102279675A (en) * | 2010-06-12 | 2011-12-14 | 陈维钏 | Method for manufacturing touch panel |
| CN103384869A (en) * | 2011-02-11 | 2013-11-06 | 万佳雷射有限公司 | Method for making a two-layer capacitive touch sensor panel |
| CN103430133A (en) * | 2010-10-29 | 2013-12-04 | 株式会社Tmay | Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method |
| CN103855194A (en) * | 2012-11-30 | 2014-06-11 | 三星电子株式会社 | Semiconductor materials, transistors including the same, and electronic devices including transistors |
| TW201501920A (en) * | 2013-03-26 | 2015-01-16 | Kaneka Corp | Conductive film substrate, transparent conductive film, method for producing transparent conductive film, and touch panel |
| CN105051657A (en) * | 2013-03-29 | 2015-11-11 | 昭和电工株式会社 | Method for producing transparent conductive substrate, and transparent conductive substrate |
| TW201609413A (en) * | 2014-06-23 | 2016-03-16 | ３Ｍ新設資產公司 | Method of patterning a metal on a transparent conductor |
| CN206118168U (en) * | 2016-08-29 | 2017-04-19 | 广州市祺虹电子科技有限公司 | Transparent circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211566A (en) * | 2016-08-29 | 2016-12-07 | 广州市祺虹电子科技有限公司 | A kind of transparent circuit board |
-
2016
- 2016-08-29 CN CN201610745998.7A patent/CN106211566A/en active Pending
-
2017
- 2017-08-18 WO PCT/CN2017/097974 patent/WO2018040950A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807501A (en) * | 2010-03-15 | 2010-08-18 | 彩虹集团公司 | Method for producing film type FED (Field Emission Display) bottom substrate |
| CN102279675A (en) * | 2010-06-12 | 2011-12-14 | 陈维钏 | Method for manufacturing touch panel |
| CN103430133A (en) * | 2010-10-29 | 2013-12-04 | 株式会社Tmay | Method for manufacturing pad for touch panel, and pad for touch panel manufactured by method |
| CN103384869A (en) * | 2011-02-11 | 2013-11-06 | 万佳雷射有限公司 | Method for making a two-layer capacitive touch sensor panel |
| CN103855194A (en) * | 2012-11-30 | 2014-06-11 | 三星电子株式会社 | Semiconductor materials, transistors including the same, and electronic devices including transistors |
| TW201501920A (en) * | 2013-03-26 | 2015-01-16 | Kaneka Corp | Conductive film substrate, transparent conductive film, method for producing transparent conductive film, and touch panel |
| CN105051657A (en) * | 2013-03-29 | 2015-11-11 | 昭和电工株式会社 | Method for producing transparent conductive substrate, and transparent conductive substrate |
| TW201609413A (en) * | 2014-06-23 | 2016-03-16 | ３Ｍ新設資產公司 | Method of patterning a metal on a transparent conductor |
| CN206118168U (en) * | 2016-08-29 | 2017-04-19 | 广州市祺虹电子科技有限公司 | Transparent circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018040950A1 (en) * | 2016-08-29 | 2018-03-08 | 广州市祺虹电子科技有限公司 | Transparent circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018040950A1 (en) | 2018-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |