CN203535979U - Short circuit chip for surface gold-coated microwave circuit - Google Patents
Short circuit chip for surface gold-coated microwave circuit Download PDFInfo
- Publication number
- CN203535979U CN203535979U CN201320633633.7U CN201320633633U CN203535979U CN 203535979 U CN203535979 U CN 203535979U CN 201320633633 U CN201320633633 U CN 201320633633U CN 203535979 U CN203535979 U CN 203535979U
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- covered
- electrode layer
- golden
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 239000010931 gold Substances 0.000 title claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 238000003466 welding Methods 0.000 claims abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 6
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 claims description 3
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910000792 Monel Inorganic materials 0.000 claims description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 239000011224 oxide ceramic Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000000034 method Methods 0.000 description 10
- 238000007747 plating Methods 0.000 description 6
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000003854 Surface Print Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model discloses a short circuit chip for a surface gold-coated microwave circuit. The short circuit chip comprises a ceramic substrate and an electrode layer which is covered on the surface of the ceramic substrate, the electrode layer is composed of inner metal films and outer gold films, four or more surfaces of the ceramic substrate are covered with the inner metal films, and four or more surfaces of the inner metal films are covered with the outer gold films. The short circuit chip for the surface gold-coated microwave circuit is simple in structure, good in welding resistance, simple in manufacturing and low in production cost, and has good microwave characteristics and reliability, and surfaces are smooth.
Description
Technical field
The utility model relates to a kind of microwave circuit short-circuit piece, especially relates to a kind of surface and covers golden microwave circuit short-circuit piece.
Background technology
Short-circuit piece for microwave circuit (Microwave Circuit Shorts is called for short MCS) is to adapt to microwave circuit module high frequency, highly integrated, microminiaturization, the new ceramics element that the requirement of low-power consumption and high reliability grows up.Microwave integrated circuit is more and more towards the future development of high frequency, and in circuit, increasing electronic component requires ground connection, or the different components in circuit requires to interconnect.
Chinese patent ZL200810026894.6 discloses a kind of structure and manufacture method of microwave film short-circuit piece.This patent provides two kinds to ceramic body, to carry out metallized method, a kind of is print process, another kind is magnetron sputtering method, print process described in it metallizes to ceramic body, be gold paste on four or more surface of ceramic body or four surface printings, then sintering curing gold on surface of ceramic body is coated forms short-circuit piece.The shortcoming of print process mainly contains two aspects, and the first, gold layer surface irregularity, product lossy microwave is large; The second, metal structure is single gold layer, and the heat-resisting welding performance of this metal structure is bad, and when soldering, gold layer is easy to be melting in tin, thereby causes the poor reliability of product.Magnetron sputtering method described in it metallizes to ceramic body, is that ceramic body carries out deposit metal films in magnetron sputtering machine.The method must use expensive magnetron sputtering machine, so product cost is high, is unfavorable for promoting the use of of product.
Utility model content
It is a kind of simple in structure that the purpose of this utility model is to provide, surfacing, and soldering resistance can be good, has good microwave property and reliability, manufactures simply, and golden microwave circuit short-circuit piece is covered on the surface that production cost is low.
To achieve these goals, the utility model adopts following technical scheme:
A golden microwave circuit short-circuit piece is covered on surface, comprises ceramic substrate and the electrode layer that covers described ceramic substrate surface, and described electrode layer is comprised of inner layer metal film and outer gold film.
Further, described inner layer metal film covers on four or more surface of described ceramic substrate.
Further, described outer gold film covers on four or more surface of described inner layer metal film.
Further, the electrode layer of described ceramic substrate lower surface is for ground connection welding, and the electrode layer of upper surface is for Bonding, and remaining surface electrode layer is all connected with upper surface and lower surface electrode layer.
Further, described inner layer metal film is copper film, nickel film or monel film.
Further, described ceramic substrate is alundum (Al2O3), aluminium nitride or beryllium oxide ceramics substrate, and selecting the purity that high frequency characteristics is good is to be more than or equal to 99.6% alundum (Al2O3) ceramic substrate.
Compared with prior art, golden microwave circuit is covered on surface of the present utility model has inner layer metal film with short-circuit piece in four or more surface coverage of described ceramic substrate, on described inner layer metal film, be coated with outer gold film, thereby it is simple in structure with short-circuit piece to have guaranteed that golden microwave circuit is covered on surface of the present utility model, surfacing, soldering resistance can be good, has good microwave property and reliability, manufacture simply, production cost is low.
Accompanying drawing explanation
Fig. 1 is the utility model overall structure schematic diagram;
Fig. 2 is the A-A profile of Fig. 1.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated to the utility model.
Refer to Fig. 1 and Fig. 2, golden microwave circuit short-circuit piece is covered on a kind of surface, comprise ceramic substrate 1 and the electrode layer 2 that covers described ceramic substrate surface, described ceramic substrate 1 is alundum (Al2O3), aluminium nitride or beryllium oxide ceramics substrate, preferentially selecting the purity that high frequency characteristics is good is to be more than or equal to 99.6% alundum (Al2O3) ceramic substrate, described electrode layer 2 is comprised of inner layer metal film 21 and outer gold film 22, described inner layer metal film 21 is copper film, nickel film or monel film etc., method with the form of barrel plating or the plating of shaking by chemical plating is plated on described ceramic substrate 1 four or more surface, described inner layer metal film 21 four or more surfaces are coated with outer gold film 22 with the form of barrel plating or the plating of shaking by electric plating method, described outer gold film 22 thickness are 0.01 micron-20 microns.The electrode layer 2 of described ceramic substrate 1 lower surface is for ground connection welding, and the electrode layer 2 of upper surface is for Bonding, and remaining surface electrode layer 2 is all connected with upper surface and lower surface electrode layer 2, plays short circuit effect.
Golden microwave circuit is covered on surface of the present utility model has inner layer metal film 21 with short-circuit piece in described ceramic substrate 1 four or more surface coverage, on described inner layer metal film 21, be coated with again outer gold film 22, thereby it is simple in structure with short-circuit piece to have guaranteed that golden microwave circuit is covered on surface of the present utility model, surfacing, soldering resistance can be good, have good microwave property and reliability, manufacture simply, production cost is low.
Above combination most preferred embodiment is described the utility model, but the utility model is not limited to the embodiment of above announcement, and should contain the various modifications of carrying out according to essence of the present utility model, equivalent combinations.
Claims (6)
1. a golden microwave circuit short-circuit piece is covered on surface, it is characterized in that: comprise ceramic substrate and the electrode layer that covers described ceramic substrate surface, described electrode layer is comprised of inner layer metal film and outer gold film.
2. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described inner layer metal film covers on four or more surface of described ceramic substrate.
3. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described outer gold film covers on four or more surface of described inner layer metal film.
4. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: the electrode layer of described ceramic substrate lower surface is for ground connection welding, the electrode layer of upper surface is for Bonding, and remaining surface electrode layer is all connected with upper surface and lower surface electrode layer.
5. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described inner layer metal film is copper film, nickel film or monel film.
6. golden microwave circuit short-circuit piece is covered on surface as claimed in claim 1, it is characterized in that: described ceramic substrate is alundum (Al2O3), aluminium nitride or beryllium oxide ceramics substrate, selecting the purity that high frequency characteristics is good is to be more than or equal to 99.6% alundum (Al2O3) ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320633633.7U CN203535979U (en) | 2013-10-14 | 2013-10-14 | Short circuit chip for surface gold-coated microwave circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320633633.7U CN203535979U (en) | 2013-10-14 | 2013-10-14 | Short circuit chip for surface gold-coated microwave circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203535979U true CN203535979U (en) | 2014-04-09 |
Family
ID=50422161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320633633.7U Expired - Lifetime CN203535979U (en) | 2013-10-14 | 2013-10-14 | Short circuit chip for surface gold-coated microwave circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203535979U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489506A (en) * | 2013-10-14 | 2014-01-01 | 广州天极电子科技有限公司 | Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
-
2013
- 2013-10-14 CN CN201320633633.7U patent/CN203535979U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489506A (en) * | 2013-10-14 | 2014-01-01 | 广州天极电子科技有限公司 | Short circuit chip for surface gold-coated microwave circuit and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 511453 No.6, Changli Road, Dongyong Town, Nansha District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Tianji Electronic Technology Co.,Ltd. Address before: 510288 the west side of the fifth floor, 10th floor, No.5 Industrial Zone, nanhuaxi Enterprise Group Co., Ltd., daganwei, Haizhu District, Guangzhou City, Guangdong Province Patentee before: AURORA TECHNOLOGIES Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140409 |