JPH08222852A - Manufacture of through hole filled up with conductor - Google Patents
Manufacture of through hole filled up with conductorInfo
- Publication number
- JPH08222852A JPH08222852A JP4914195A JP4914195A JPH08222852A JP H08222852 A JPH08222852 A JP H08222852A JP 4914195 A JP4914195 A JP 4914195A JP 4914195 A JP4914195 A JP 4914195A JP H08222852 A JPH08222852 A JP H08222852A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- hole
- paste
- glass
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は導体充填スルーホールの
製造方法に関する。さらに詳しくいえば、アルミナを代
表例とする電子部品回路用セラミック基板に銀、銀／パ
ラジウム、銅等の厚膜回路を形成するに当たって、基板
両面の回路の導通をとるために形成する導体充填スルー
ホールの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a conductor-filled through hole. More specifically, when forming a thick film circuit of silver, silver / palladium, copper, etc. on a ceramic substrate for electronic component circuits, which is typified by alumina, a conductor-filled through formed to establish continuity of the circuits on both sides of the substrate. The present invention relates to a hall manufacturing method.
【０００２】[0002]
【関連技術の説明】セラミック基板上に配線（回路）を
形成する方法として、銀や銅などを主成分とする導電材
料粉末ペースト（導体ペースト）を印刷・焼成する厚膜
回路法が用いられている。一般的なセラミック回路基板
は、例えば９６％のアルミナセラミックに銀、銀／パラ
ジウム、銅等の金属粉末を主成分としビヒクルを一定量
混合してなるペーストをスクリーン印刷して基板上に回
路を描き、約８００〜９００℃で焼成して基板に焼付け
ることにより形成される。また、回路密度を向上させる
ために基板両面に回路を設けることも一般的な手法であ
るが、この場合の両面回路間の導通は基板にスルーホー
ルを設けて導電性ペーストを印刷した後焼成しホール壁
面に導体を焼付けることにより行なわれる。ここで導電
性ペーストの印刷は、基板下から吸引しながら通常のス
クリーン印刷技法を用いてスルーホール壁面にペースト
を回りこませる方法により行なわれている。[Description of Related Art] As a method of forming wiring (circuit) on a ceramic substrate, a thick film circuit method of printing and firing a conductive material powder paste (conductor paste) containing silver, copper or the like as a main component is used. There is. A general ceramic circuit board is, for example, a 96% alumina ceramic, which is mainly composed of metal powder such as silver, silver / palladium, and copper, and is mixed with a certain amount of a vehicle. It is formed by baking at about 800 to 900 ° C. and baking on a substrate. It is also a common method to provide circuits on both sides of the substrate in order to improve the circuit density. In this case, the circuit between the two-sided circuits is provided with through holes in the substrate, printed with a conductive paste, and then baked. This is done by baking a conductor on the wall surface of the hole. Here, the printing of the conductive paste is performed by a method of causing the paste to wrap around the wall surface of the through hole by using a normal screen printing technique while sucking from below the substrate.
【０００３】スルーホール壁面に導体を形成させる理由
は、これまで使用されている導電性ペーストでは焼成過
程における収縮の問題があり、スルーホールに導体ペー
ストを充填し焼成した場合、焼成収縮力がセラミック基
板への接着力を上回り、形成される導体がセラミック基
板から剥がれる欠点があるためである。そこで、スクリ
ーン印刷方法などによりスルーホール壁面に導体膜を印
刷・焼成して基板上の配線を層間接続する方法が実施さ
れている。ところが、このような方法では、スルーホー
ル壁から基板表面の回路に至るコーナー部分の膜厚が薄
くなり易く、高電流を流すとコーナー部が発熱して導通
不良を起こす原因となる。そのため、高出力用の製品に
は適さないという問題があった。また、スルーホールの
大きさは配線密度の関係から、従来、直径（φ）0.4mm
程度が標準であり、ホール壁面に形成される導体量が限
られるためスルーホール部分の導体抵抗が大きくなる問
題がある。The reason why the conductor is formed on the wall surface of the through hole is that the conductive paste used so far has a problem of shrinkage in the firing process. When the through hole is filled with the conductor paste and fired, the firing shrinkage force is ceramic. This is because there is a drawback that the formed conductor exceeds the adhesive force to the substrate and the formed conductor is peeled off from the ceramic substrate. Therefore, a method of printing and firing a conductor film on the wall surface of the through hole by a screen printing method or the like to interconnect the wiring on the substrate has been implemented. However, in such a method, the film thickness at the corner portion from the through-hole wall to the circuit on the substrate surface is likely to be thin, and when a high current is applied, the corner portion generates heat and causes conduction failure. Therefore, there is a problem that it is not suitable for high output products. In addition, the size of the through hole is conventionally 0.4 mm in diameter (φ) because of the wiring density.
Since the degree is standard and the amount of conductor formed on the wall surface of the hole is limited, there is a problem that the conductor resistance in the through hole portion becomes large.
【０００４】近年、電子機器の小型化、高性能化が進
み、電子部品の高密度実装が可能な信頼性の高い多層配
線セラミック基板が求められているが、多層配線基板を
製造する印刷多層法あるいはグリンシート多層法におい
てもスルーホールによる層間接続に問題を有している。
すなわち、印刷多層法では、絶縁層の印刷時にスルーホ
ールにペーストが入ってしまうため信頼性のある絶縁層
がスルーホール上で形成できず、スルーホールの孔を避
けて配線を印刷する必要があり高密度化に支障をきた
す。また、セラミック基板上にガラスセラミックからな
るグリーンシートを積層し、これを焼成してシート間あ
るいはシート上に高密度配線を形成するグリーンシート
多層法の場合にはスルーホールが空洞であるため、積層
したグリーンシート（ガラスセラミック）がスルーホー
ル内に沈み込み周囲に亀裂を生じシート表面に設けた配
線が断線する不都合がある。In recent years, electronic devices have become smaller and higher in performance, and highly reliable multilayer wiring ceramic substrates capable of high-density mounting of electronic components have been demanded. The printing multilayer method for manufacturing multilayer wiring substrates is required. Alternatively, the green sheet multilayer method also has a problem in interlayer connection by through holes.
That is, in the printing multi-layer method, since the paste enters the through holes when the insulating layer is printed, a reliable insulating layer cannot be formed on the through holes, and it is necessary to print the wiring while avoiding the holes of the through holes. It hinders high density. In the case of the green sheet multi-layer method in which a green sheet made of glass ceramic is laminated on a ceramic substrate and is fired to form a high-density wiring between sheets, the through holes are hollow, so The green sheet (glass ceramic) is sunk into the through hole to cause a crack in the periphery, and the wiring provided on the surface of the sheet is broken.
【０００５】そこで、本出願人は、従来のものに比べて
焼成収縮率が格段に低く焼成前後の形状安定性に優れた
スルーホール充填用の導体ペーストを先に提案した（特
願平5-167439号、特願平6-51306 号）。この導体ペース
トによれば、基板上の配線とスルーホール導体との接続
の信頼性が向上し、しかもスルーホール内に多量に充填
できるためスクリーン印刷によるスルーホール壁面のみ
をメタライズする従来の方法によるものに比べて導体抵
抗が下がり、また、スルーホール内への絶縁層ペースト
の入り込みやグリーンシートの沈み込みによる亀裂など
の欠陥が発生せず、短絡や断線などの不都合がない信頼
性の高い配線を基板上に構築できるという利点を有す
る。Therefore, the present applicant previously proposed a conductor paste for filling through-holes, which has a significantly lower firing shrinkage than the conventional one and is excellent in shape stability before and after firing (Japanese Patent Application No. No. 167439, Japanese Patent Application No. 6-51306). By using this conductor paste, the reliability of the connection between the wiring on the substrate and the through-hole conductor is improved, and since a large amount can be filled in the through-hole, the conventional method of metalizing only the wall surface of the through-hole by screen printing is used. Conductor resistance is lower than that of the above, and defects such as cracks due to penetration of the insulating layer paste into the through holes and sinking of the green sheet do not occur, and there is no inconvenience such as short circuit or disconnection. It has the advantage that it can be built on a substrate.
【０００６】低収縮率の導体をセラミック基板のスルー
ホール中に充填させる際、作業効率上スルーホールより
も大きな径、例えば、φ＝0.4mm のスルーホールに対し
てφ＝0.6mm のパッド径で印刷を行なう必要があるが、
回路基板を作製する際には余分な導体を取り除く必要が
ある。また、この低収縮率導体にはガラス等のセラミッ
クとの接合成分が含まれていないためセラミック表面に
残っていると接着強度の低下を招く。When a conductor having a low shrinkage ratio is filled in a through hole of a ceramic substrate, a diameter larger than that of the through hole is used for work efficiency, for example, a pad diameter of φ = 0.6 mm for a through hole of φ = 0.4 mm. Need to print,
When manufacturing a circuit board, it is necessary to remove extra conductors. Further, since the low-shrinkage conductor does not contain a bonding component with a ceramic such as glass, if it remains on the surface of the ceramic, the adhesive strength is lowered.
【０００７】そこで、本出願人が先に提案している上述
の低収縮性充導体ペーストをスルーホールに充填する方
法について検討したところ、薄膜導体配線間のスルーホ
ールによる導通性が改善された。しかし、充填導体とス
ルーホール壁面との接着力に問題があり、ラッピング加
工処理時に充填導体が欠けたり、充填導体がスルーホー
ルから抜けることがあることが判明した。Therefore, when the method of filling the through-hole with the above-mentioned low-contraction filling conductor paste, which the applicant of the present invention has previously proposed, was examined, the conductivity by the through-hole between the thin film conductor wirings was improved. However, it has been found that there is a problem in the adhesive force between the filling conductor and the wall surface of the through hole, and the filling conductor may be chipped or the filling conductor may come off from the through hole during the lapping process.
【０００８】[0008]
【発明が解決しようとする課題】従って、本発明の課題
はセラミック基板中のスルーホールに導体を充填させた
基板に回路を形成する工程で必要な平面化処理の際に充
填導体の欠けやスルーホールからの抜けが生じることの
ない、接着力の改善された導体充填スルホールの製造方
法を提供することにある。SUMMARY OF THE INVENTION Therefore, the object of the present invention is to prevent the filling conductor from being chipped or passing through during the planarization process required in the step of forming a circuit in the substrate in which the through holes are filled in the ceramic substrate. It is an object of the present invention to provide a method of manufacturing a conductor-filled through hole with improved adhesion, which does not come off from the hole.
【０００９】[0009]
【課題の解決手段】本発明者等はセラミック基板と導体
ペーストの接着性について鋭意検討した結果、スルーホ
ールに導体ペーストを充填する前に、ガラス層またはガ
ラス成分を含有する導体層をスルーホール壁面に形成し
た後、導体ペーストを充填し焼成することにより、セラ
ミック基板と導体とが強固に接合されることを確認し本
発明を完成するに至った。Means for Solving the Problems As a result of intensive studies made by the present inventors on the adhesiveness between a ceramic substrate and a conductor paste, a glass layer or a conductor layer containing a glass component is formed on the wall surface of the through hole before filling the through hole with the conductor paste. After the formation, the conductive paste was filled and fired, and it was confirmed that the ceramic substrate and the conductor were firmly bonded, and the present invention was completed.
【００１０】[0010]
【発明の開示】すなわち、本発明は （１）セラミック基板のスルーホール壁面に、ガラスペ
ーストを印刷焼成してガラス層を形成した後、低収縮性
充填用導体ペーストを充填し焼成することを特徴とする
導体充填スルーホールの製造方法、（２）セラミック基
板のスルーホール壁面に、導電材料粉末を含有するガラ
スペーストを印刷焼成してガラス成分含有導体層を形成
した後、低収縮性充填用導体ペーストを充填し焼成する
ことを特徴とする導体充填スルーホールの製造方法、お
よび（３）低収縮の充填用導体ペーストが、銀粉末また
は銅粉末を主成分とする導電材料粉末に酸化ルテニウム
粉末あるいはロジウム粉末を 0.1重量％以上添加してな
る混合粉末のペーストである上記１または２に記載の導
体充填スルーホールの製造方法を提供する。DISCLOSURE OF THE INVENTION That is, the present invention is characterized in that (1) a glass paste is printed and fired on a wall surface of a through hole of a ceramic substrate to form a glass layer, and then a low-shrinkage filling conductor paste is filled and fired. And (2) a glass paste containing a conductive material powder is printed and fired on the wall surface of the through hole of the ceramic substrate to form a glass component-containing conductor layer, and then a low shrinkage filling conductor. A method for manufacturing a conductor-filled through hole, which comprises filling and firing a paste, and (3) a low-shrinkage conductor paste for filling, wherein ruthenium oxide powder or ruthenium oxide powder is added to a conductive material powder containing silver powder or copper powder as a main component. 3. A method for manufacturing a conductor-filled through hole according to 1 or 2 above, which is a mixed powder paste containing 0.1% by weight or more of rhodium powder. That.
【００１１】以下、本発明による導体充填スルーホール
の製造方法について、その工程を示す図１を参照して説
明する。本発明の方法において、ガラス層またはガラス
成分を含有する導体層は、原料ペーストを用い、一般的
な厚膜印刷法に従ってセラミック基板１のスルーホール
２壁面２ａに形成される。A method of manufacturing a conductor-filled through hole according to the present invention will be described below with reference to FIGS. In the method of the present invention, the glass layer or the conductor layer containing the glass component is formed on the wall surface 2a of the through hole 2 of the ceramic substrate 1 by using a raw material paste and a general thick film printing method.
【００１２】ガラス層を形成する場合の原料ペースト
は、ガラス粉末にビヒクルを添加・混練したものであ
り、ガラス成分を含有する導体層を形成する場合の原料
ペーストは、ガラス粉末と導体粉末との混合粉末にビヒ
クルを添加・混練したものである。ガラス粉末の平均粒
径は１〜６μｍ程度がよい。ここで、ガラス成分として
は、ＰｂＯ、Ｂ2 Ｏ3 、ＺｎＯ、ＣａＯ、ＳｉＯ2、Ａ
ｌ2 Ｏ3 など一般的なガラス成分からなるものでよく、
ガラス軟化点（Ｔｓ）が５００〜１０００℃、好ましく
は６００〜９００℃のものである。ガラス軟化点が５０
０℃未満では充填用導体の焼成時にこの接合用のガラス
粘度が下がり過ぎて充填用導体側への移行量が多くなり
充填用導体とスルーホール壁面との接合に寄与しなくな
るばかりでなく充填用導体の収縮を増大させスルーホー
ルから充填用導体を剥離させる原因となる。また、ガラ
ス軟化点が１０００℃を超えると充填用導体ペーストを
焼成する際の熱でガラスが良好に軟化せず、接着性に影
響を及ぼす。The raw material paste for forming the glass layer is glass powder to which a vehicle is added and kneaded. The raw material paste for forming the conductor layer containing a glass component is composed of glass powder and conductor powder. This is a mixture of powder and vehicle mixed and kneaded. The average particle size of the glass powder is preferably about 1 to 6 μm. Here, as the glass component, PbO, B 2 O 3 , ZnO, CaO, SiO 2 , A
It may consist of general glass components such as l 2 O 3 ,
It has a glass softening point (Ts) of 500 to 1000 ° C, preferably 600 to 900 ° C. Glass softening point is 50
If the temperature is lower than 0 ° C, the viscosity of the glass for joining will be too low during firing of the filling conductor, and the amount of transfer to the filling conductor side will increase, which will not contribute to the joining of the filling conductor and the wall surface of the through-hole, but also for filling. This increases contraction of the conductor and causes the filling conductor to peel off from the through hole. Further, when the glass softening point exceeds 1000 ° C., the glass does not soften favorably by the heat when firing the filling conductor paste, and the adhesiveness is affected.
【００１３】導体材料粉末としては、銀粉末または銅粉
末などの金属粉末を主成分とするものが使用される。導
体材料粉末の粒径は一般に厚膜印刷用ペーストとして利
用されているものと同様に平均粒径１〜６μｍ程度のも
のが好ましく、その形状は、球状、塊状、燐片状など任
意のものが使用できる。また、このペースト材料として
は、セラミック基板用として調整されている市販の導体
ペースト、例えば銀、銀／白金、銀／パラジウム、銅な
どの導体ペーストを使用することもできる。As the conductor material powder, one containing metal powder such as silver powder or copper powder as a main component is used. The conductive material powder preferably has an average particle size of about 1 to 6 μm, which is the same as that generally used as a paste for thick film printing. Can be used. Further, as the paste material, a commercially available conductor paste prepared for a ceramic substrate, for example, a conductor paste of silver, silver / platinum, silver / palladium, copper or the like can be used.
【００１４】ガラス粉末に添加するビヒクルは結合剤お
よび溶剤からなる。結合剤としてはエチルセルロース、
アクリル樹脂等が用いられ、溶剤としてはエチルカルビ
トールアセテート、テルピネオール等が用いられる。結
合剤の使用量は上記ガラス粉末を均一に分散保持し、ペ
ースト状態を維持し得る程度の量であればよく、また、
溶剤の使用量は結合剤の種類によっても異るが、ペース
トに適度の粘性を付与する量であればよい。具体的に
は、ビヒクルとして上記粉末１００重量部に対して１０
〜４５重量部程度が使用される。The vehicle added to the glass powder consists of a binder and a solvent. Ethyl cellulose as a binder,
Acrylic resin or the like is used, and as the solvent, ethyl carbitol acetate, terpineol, or the like is used. The amount of the binder used may be such an amount that the glass powder is uniformly dispersed and held, and the paste state can be maintained.
The amount of the solvent used varies depending on the kind of the binder, but may be any amount as long as it imparts an appropriate viscosity to the paste. Specifically, it is 10 as a vehicle with respect to 100 parts by weight of the above powder.
About 45 parts by weight are used.
【００１５】ペースト材料としては上記の成分以外に
も、既知のペースト同様に、例えば適度の流動性を付与
する等の目的で脂肪酸エステルなどを添加することがで
きる。かくして調製された原料ペーストは、一般的な厚
膜技術によりスルーホール（φ＝0.15〜0.6 ｍｍ）壁面
に印刷、焼成されて、ガラス層またはガラス成分含有導
体層３が形成される。具体的には、基板下から吸引しな
がら原料ペーストをスクリーン印刷によりスルーホール
壁面２ａに印刷した後、８００〜９００℃にて焼成する
ことによって形成される。ガラス層またはガラス成分含
有導体層の膜厚は、後工程で充填される導体の電気的特
性を低下させることがないようなるべく薄い方がよく、
例えば２０μｍ以下、さらには１０μｍ以下が好まし
い。As the paste material, in addition to the above-mentioned components, fatty acid ester or the like can be added in the same manner as known pastes for the purpose of imparting appropriate fluidity. The raw material paste thus prepared is printed on a wall surface of a through hole (φ = 0.15 to 0.6 mm) and fired by a general thick film technique to form a glass layer or a glass component-containing conductor layer 3. Specifically, it is formed by printing the raw material paste on the through hole wall surface 2a by screen printing while sucking from below the substrate, and then firing at 800 to 900 ° C. The film thickness of the glass layer or the glass component-containing conductor layer is preferably as thin as possible so as not to deteriorate the electrical characteristics of the conductor filled in the subsequent step,
For example, it is preferably 20 μm or less, more preferably 10 μm or less.
【００１６】ガラス層またはガラス成分含有導体層が形
成されたスルーホールに低収縮性の導体ペースト４を充
填・焼成して充填スルーホールを得る（図１（ｃ））。
ここで、低収縮性の導体ペーストとしては、焼成時の収
縮率が小さい導体ペーストであれば特に限定されるもの
ではないが、具体例としては、本出願人が先に開発した
スルーホール充填用導体（特願平5-167439号、特願平6-
51306 号）、すなわち、銀粉末または銅粉末を主成分と
する導電粉末に、酸化ルテニウム粉末あるいはロジウム
粉末を添加してなる混合粉末にビヒクルを配合し、混練
したもの等が利用できる。The through-hole in which the glass layer or the glass component-containing conductor layer is formed is filled with the low-shrinking conductor paste 4 and fired to obtain a filled through-hole (FIG. 1 (c)).
Here, the low-shrinkage conductor paste is not particularly limited as long as it is a conductor paste having a small shrinkage rate during firing, but as a specific example, for the through-hole filling developed by the applicant of the present invention. Conductor (Japanese Patent Application No. 5-167439, Japanese Patent Application No. 6-
No. 51306), that is, a mixed powder obtained by adding a ruthenium oxide powder or a rhodium powder to a conductive powder containing silver powder or copper powder as a main component and kneading the vehicle, and the like can be used.
【００１７】導体ペースト原料粉末の形状としては、例
えば、球状、塊状、燐片状など任意のものが使用でき
る。その粒径は、導電粉末では平均粒径５〜１０μｍ程
度、酸化ルテニウム粉末あるいはロジウム粉末では平均
粒径0.5 〜２μｍ程度のものが使用できる。酸化ルテニ
ウム粉末あるいはロジウム粉末の添加量は、熱収縮率の
低減化の点から導電粉末に対して0.1 重量％以上が適当
であり、酸化ルテニウム粉末の場合は0.1 〜１５重量％
が、ロジウム粉末の場合は0.1 〜３重量％がそれぞれ好
ましい。これら粉末の配合量が上記の範囲を超えても熱
収縮率の低減効果に変化がなく経済的に好ましくないば
かりか、導電粉末の割合が相対的に減少し導体の電気抵
抗が増加する。また、ビヒクルとしては上記ガラスペー
ストまたはガラス成分含有導電材料ペーストについて述
べたのと同様のものが用いられる。混合粉末とビヒクル
の配合割合は、混合粉末１００重量部に対して、予め溶
剤１００重量部に対して結合剤を５〜３０重量部程度溶
解してなるビヒクル１０〜４５重量部である。As the shape of the raw material powder for the conductor paste, for example, any shape such as spherical, lumpy, and scaly can be used. The average particle size of the conductive powder can be about 5 to 10 μm, and the average particle size of ruthenium oxide powder or rhodium powder can be about 0.5 to 2 μm. The amount of ruthenium oxide powder or rhodium powder added is suitably 0.1% by weight or more with respect to the conductive powder from the viewpoint of reducing the heat shrinkage ratio, and 0.1 to 15% by weight for ruthenium oxide powder.
However, in the case of rhodium powder, 0.1 to 3% by weight is preferable. Even if the blending amount of these powders exceeds the above range, there is no change in the effect of reducing the heat shrinkage ratio, which is not economically preferable, and the ratio of the conductive powder is relatively decreased and the electric resistance of the conductor is increased. As the vehicle, the same one as described above for the glass paste or the glass component-containing conductive material paste is used. The mixing ratio of the mixed powder and the vehicle is 10 to 45 parts by weight of the vehicle in which about 5 to 30 parts by weight of the binder is previously dissolved in 100 parts by weight of the solvent based on 100 parts by weight of the mixed powder.
【００１８】ガラス層またはガラス成分含有導体層が形
成されたスルーホールへの導体ペーストの充填は、スク
リーン印刷法など従来の厚膜法により行なわれる。次い
で、例えば８００〜９００℃の温度で焼成することによ
り、導体がスルーホール壁面に堅固に接着した充填スル
ーホールが作製される。本発明の方法により製造された
充填スルーホールは、その後例えば表面処理（ラッピン
グあるいは平滑化処理）をした後、常法により導体パタ
ーン５を形成し、セラミック配線基板が製造される（図
１（ｄ）および（ｅ））。The filling of the conductor paste into the through holes formed with the glass layer or the glass component-containing conductor layer is carried out by a conventional thick film method such as a screen printing method. Then, by firing at a temperature of, for example, 800 to 900 ° C., a filled through hole in which the conductor is firmly adhered to the wall surface of the through hole is produced. The filled through-hole produced by the method of the present invention is then subjected to, for example, surface treatment (lapping or smoothing treatment), and then the conductor pattern 5 is formed by an ordinary method to produce a ceramic wiring board (FIG. 1 (d). ) And (e)).
【００１９】[0019]
【実施例】以下、本発明を実施例および比較例により具
体的に説明するが、本発明は下記の例に限定されるもの
ではない。EXAMPLES The present invention will be described in detail below with reference to examples and comparative examples, but the present invention is not limited to the following examples.
【００２０】実施例１：スルーホール壁面にガラス層を
設けた充填スルーホール基板の製造平均粒径3.5 μｍの
Ｂ2 Ｏ3 −ＺｎＯ−ＰｂＯ系ガラス粉末（旭硝子社製，
ASF-1400）１００重量部に対して、テルピオネール８０
重量％とエチルセルロース（結合剤）２０重量％からな
るビヒクルを２０重量部を加えて混練し、ガラスペース
トを調製した。このガラスペーストを、φ＝0.2mm のス
ルーホール（６００個）を有する純度９６％のアルミナ
基板（縦84.0mm×横69.0mm×厚さ0.635 mm）のスルーホ
ール壁面にスクリーン印刷した後、８００℃で４０分間
焼成してガラス層を形成した。ガラス層の膜厚は７μｍ
であった。次いで、この基板のスルーホール内に平均粒
径１０μｍの銀粉末、平均粒径１μｍのロジウム粉末お
よびビヒクル（田中貴金属インターナショナル社製TRD-
１）から調製してなる充填用導体ペーストを印刷充填し
た後、８５０℃で６０分間焼成して導体充填セラミック
基板を得た。次いで、このセラミック基板の表面を鏡面
となるまで研磨加工を行なった後、導体充填スルーホー
ル部分を観察したところ、導体が欠落したものは皆無で
あった。Example 1: Production of a filled through-hole substrate having a glass layer on the wall surface of the through-hole B 2 O 3 -ZnO-PbO-based glass powder having an average particle size of 3.5 μm (manufactured by Asahi Glass Co., Ltd.,
ASF-1400) to 100 parts by weight of terpionel 80
A glass paste was prepared by adding 20 parts by weight of a vehicle composed of 20% by weight of ethyl cellulose (binder) and kneading. This glass paste was screen-printed on the wall surface of a through hole of a 96% pure alumina substrate (84.0 mm long × 69.0 mm wide × 0.635 mm thick) having φ = 0.2 mm through holes (600 pieces) and then 800 ° C And baked for 40 minutes to form a glass layer. The thickness of the glass layer is 7 μm
Met. Then, in the through hole of this substrate, a silver powder having an average particle size of 10 μm, a rhodium powder having an average particle size of 1 μm and a vehicle (TRD- manufactured by Tanaka Kikinzoku International Co., Ltd.
After the filling conductor paste prepared from 1) was printed and filled, it was fired at 850 ° C. for 60 minutes to obtain a conductor-filled ceramic substrate. Then, after polishing the surface of this ceramic substrate to a mirror surface and observing the conductor-filled through-holes, no conductor was missing.
【００２１】実施例２：スルーホール壁面にガラス成分
含有導体層を設けた充填スルーホール基板の製造 ガラス成分を含有する市販の銀／白金ペースト（DuPont
社製，QS-171，Ａｇ／Ｐｔ＝１００／１）を使用して膜
厚１０μｍのガラス含有導体層をスルーホール壁面に形
成したほかは実施例１と同様にして導体充填セラミック
基板を作製し、セラミック基板の表面を鏡面加工して、
導体充填スルーホール部を観察したところ、導体が欠落
したものは皆無であった。Example 2 Production of Filled Through-Hole Substrate with Conductive Layer Containing Glass Component on Wall of Through Hole Commercially available silver / platinum paste (DuPont) containing glass component
A conductor-filled ceramic substrate was produced in the same manner as in Example 1 except that a glass-containing conductor layer having a thickness of 10 μm was formed on the wall surface of the through hole using QS-171, Ag / Pt = 100/1) manufactured by Co. , The surface of the ceramic substrate is mirror-finished,
Observation of the conductor-filled through-holes revealed that none of the conductors were missing.
【００２２】比較例 ガラス層を形成しないこと以外は、実施例１と同様に充
填スルーホール基板を作製し、実施例１と同様に、セラ
ミック基板の表面を鏡面加工し、導体充填スルーホール
部を観察したところ、導体の欠けが６５％、充填導体の
抜けが１２％確認された。Comparative Example A filled through-hole substrate was prepared in the same manner as in Example 1 except that the glass layer was not formed, and the surface of the ceramic substrate was mirror-polished in the same manner as in Example 1 to form conductor-filled through-hole portions. As a result of observation, the chipping of the conductor was 65%, and the dropout of the filled conductor was 12%.
【００２３】[0023]
【発明の効果】本発明はセラミック基板に形成されたス
ルーホールの壁面にガラス層またはガラス成分含有導体
層を形成した後、低収縮性の充填用導体ペーストを充填
・焼成することを特徴とする導体充填スルーホールの製
造方法を提供したものである。ガラス層またはガラス含
有導体層がセラミック基板のスルーホール壁面と充填導
体との接着性を高め、厚膜回路あるいは薄膜回路を作製
する際の平滑化加工処理時に充填導体の欠けや抜けを生
じない。また、本発明では焼成収縮率が低い充填用導体
ペーストを使用するため、焼成前後の形状安定に優れ、
この導体ペーストをスルーホールに充填することによ
り、基板表面の配線とスルーホール導体との接続の信頼
性が向上し、従来のタイプのものに比べてスルーホール
内の導体量が増加し導体抵抗が低減化し、またスルーホ
ール内部が導体ペーストで満たされるのでグリーンシー
ト積層多層配線セラミック基板製造時におけるグリーン
シートの沈み込みによる亀裂などの欠陥が発生せず、断
線などの不都合がない信頼性の高い配線を基板上に構築
できる。The present invention is characterized in that a glass layer or a glass component-containing conductor layer is formed on the wall surface of a through hole formed in a ceramic substrate, and then a low-shrinking conductor paste for filling is filled and fired. A method for manufacturing a conductor-filled through hole is provided. The glass layer or the glass-containing conductor layer enhances the adhesiveness between the through-hole wall surface of the ceramic substrate and the filling conductor, so that the filling conductor is not chipped or missing during smoothing processing when manufacturing a thick film circuit or a thin film circuit. Further, in the present invention, since the filling conductor paste having a low firing shrinkage is used, it is excellent in shape stability before and after firing,
By filling this through paste with this conductor paste, the reliability of the connection between the wiring on the substrate surface and the through hole conductor is improved, the amount of conductor in the through hole is increased, and the conductor resistance is increased compared to the conventional type. Since the inside of the through-hole is filled with a conductive paste, the number of layers is reduced, and defects such as cracks do not occur due to the sinking of the green sheet during manufacturing of the green sheet multilayer multilayer wiring. Can be built on a substrate.
【図１】 本発明の充填スルーホールの製造方法による
セラミック配線基板製造工程の一例を示す概略断面図で
ある。FIG. 1 is a schematic cross-sectional view showing an example of a ceramic wiring board manufacturing process according to the method of manufacturing a filled through hole of the present invention.
１ セラミック基板 ２ スルーホール ３ ガラス含有層 ４ 充填導体 ５ 導体パターン 1 Ceramic Substrate 2 Through Hole 3 Glass Containing Layer 4 Filling Conductor 5 Conductor Pattern
Claims (3)
ガラスペーストを印刷焼成してガラス層を形成した後、
低収縮性充填用導体ペーストを充填し焼成することを特
徴とする導体充填スルーホールの製造方法。1. A through hole wall surface of a ceramic substrate,
After forming the glass layer by printing and firing the glass paste,
A method for manufacturing a conductor-filled through hole, which comprises filling a conductor paste for low-shrinkage filling and firing the paste.
導電材料粉末を含有するガラスペーストを印刷焼成して
ガラス成分含有導体層を形成した後、低収縮性充填用導
体ペーストを充填し焼成することを特徴とする導体充填
スルーホールの製造方法。2. The through hole wall surface of the ceramic substrate,
A method for producing a conductor-filled through-hole, comprising: printing and firing a glass paste containing a conductive material powder to form a glass component-containing conductor layer, and then filling and firing a low-shrinkage filling conductor paste.
または銅粉末を主成分とする導電材料粉末に酸化ルテニ
ウム粉末あるいはロジウム粉末を 0.1重量％以上添加し
てなる混合粉末のペーストである請求項１または２に記
載の導体充填スルーホールの製造方法。3. The low-shrinkage filling conductor paste is a mixed powder paste prepared by adding 0.1% by weight or more of ruthenium oxide powder or rhodium powder to a conductive material powder containing silver powder or copper powder as a main component. Item 3. A method of manufacturing a conductor-filled through hole according to Item 1 or 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7049141A JP2807976B2 (en) | 1995-02-14 | 1995-02-14 | Manufacturing method of through hole filled with conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7049141A JP2807976B2 (en) | 1995-02-14 | 1995-02-14 | Manufacturing method of through hole filled with conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08222852A true JPH08222852A (en) | 1996-08-30 |
| JP2807976B2 JP2807976B2 (en) | 1998-10-08 |
Family
ID=12822814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7049141A Expired - Lifetime JP2807976B2 (en) | 1995-02-14 | 1995-02-14 | Manufacturing method of through hole filled with conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2807976B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG86345A1 (en) * | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
| EP1087649A3 (en) * | 1999-09-27 | 2003-08-13 | Sony Corporation | Printed wiring board and display apparatus |
| JP2011187588A (en) * | 2010-03-05 | 2011-09-22 | Seiko Instruments Inc | Electronic device and method of manufacturing the same |
| JP2012044136A (en) * | 2010-08-13 | 2012-03-01 | Samsung Electro-Mechanics Co Ltd | Manufacturing method of ceramic substrate, and ceramic substrate manufactured thereby |
| CN110248466A (en) * | 2018-03-08 | 2019-09-17 | 斯坦雷电气株式会社 | The manufacturing method of circuit substrate, electronic-circuit device and circuit substrate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593993A (en) * | 1982-06-29 | 1984-01-10 | 日本電気株式会社 | Method of producing thin film circuit board |
| JPH02277279A (en) * | 1989-04-18 | 1990-11-13 | Narumi China Corp | Simultaneously baked ceramic circuit board |
| JPH03134905A (en) * | 1989-10-19 | 1991-06-07 | Showa Denko Kk | Copper paste |
| JPH04299888A (en) * | 1991-03-28 | 1992-10-23 | Toshiba Lighting & Technol Corp | Printed circuit board |
| JPH0581922A (en) * | 1991-05-10 | 1993-04-02 | Asahi Glass Co Ltd | Conductor paste composition and ceramic multiple layer substrate |
| JPH06326459A (en) * | 1993-05-17 | 1994-11-25 | Mitsubishi Materials Corp | Through-hole conductor forming method |
-
1995
- 1995-02-14 JP JP7049141A patent/JP2807976B2/en not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593993A (en) * | 1982-06-29 | 1984-01-10 | 日本電気株式会社 | Method of producing thin film circuit board |
| JPH02277279A (en) * | 1989-04-18 | 1990-11-13 | Narumi China Corp | Simultaneously baked ceramic circuit board |
| JPH03134905A (en) * | 1989-10-19 | 1991-06-07 | Showa Denko Kk | Copper paste |
| JPH04299888A (en) * | 1991-03-28 | 1992-10-23 | Toshiba Lighting & Technol Corp | Printed circuit board |
| JPH0581922A (en) * | 1991-05-10 | 1993-04-02 | Asahi Glass Co Ltd | Conductor paste composition and ceramic multiple layer substrate |
| JPH06326459A (en) * | 1993-05-17 | 1994-11-25 | Mitsubishi Materials Corp | Through-hole conductor forming method |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG86345A1 (en) * | 1998-05-14 | 2002-02-19 | Matsushita Electric Ind Co Ltd | Circuit board and method of manufacturing the same |
| EP1087649A3 (en) * | 1999-09-27 | 2003-08-13 | Sony Corporation | Printed wiring board and display apparatus |
| US7417867B1 (en) | 1999-09-27 | 2008-08-26 | Sony Corporation | Printed wiring board and display apparatus |
| JP2011187588A (en) * | 2010-03-05 | 2011-09-22 | Seiko Instruments Inc | Electronic device and method of manufacturing the same |
| JP2012044136A (en) * | 2010-08-13 | 2012-03-01 | Samsung Electro-Mechanics Co Ltd | Manufacturing method of ceramic substrate, and ceramic substrate manufactured thereby |
| CN110248466A (en) * | 2018-03-08 | 2019-09-17 | 斯坦雷电气株式会社 | The manufacturing method of circuit substrate, electronic-circuit device and circuit substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2807976B2 (en) | 1998-10-08 |
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