CN106189267A - 用于形成二氧化硅层的组成物、二氧化硅层及电子装置 - Google Patents

用于形成二氧化硅层的组成物、二氧化硅层及电子装置 Download PDF

Info

Publication number
CN106189267A
CN106189267A CN201510282712.1A CN201510282712A CN106189267A CN 106189267 A CN106189267 A CN 106189267A CN 201510282712 A CN201510282712 A CN 201510282712A CN 106189267 A CN106189267 A CN 106189267A
Authority
CN
China
Prior art keywords
silicon dioxide
dioxide layer
constituent
forming
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510282712.1A
Other languages
English (en)
Chinese (zh)
Inventor
尹熙灿
金佑翰
高尚兰
郭泽秀
金补宣
金真敎
罗隆熙
卢健培
朴玺美
裵镇希
司空峻
李殷善
任浣熙
张俊英
郑日
黄丙奎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung SDI Co Ltd
Original Assignee
Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of CN106189267A publication Critical patent/CN106189267A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/20—Diluents or solvents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones

Landscapes

  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Inorganic Insulating Materials (AREA)
  • Silicon Compounds (AREA)
CN201510282712.1A 2014-10-07 2015-05-28 用于形成二氧化硅层的组成物、二氧化硅层及电子装置 Pending CN106189267A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2014-0135157 2014-10-07
KR20140135157 2014-10-07
KR1020140188905A KR101806328B1 (ko) 2014-10-07 2014-12-24 실리카계 막 형성용　조성물, 실리카계 막, 및 전자 디바이스
KR10-2014-0188905 2014-12-24

Publications (1)

Publication Number Publication Date
CN106189267A true CN106189267A (zh) 2016-12-07

Family

ID=55916785

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510282712.1A Pending CN106189267A (zh) 2014-10-07 2015-05-28 用于形成二氧化硅层的组成物、二氧化硅层及电子装置

Country Status (4)

Country Link
JP (1) JP6599640B2 (ko)
KR (1) KR101806328B1 (ko)
CN (1) CN106189267A (ko)
TW (1) TWI575024B (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105838034A (zh) * 2016-05-24 2016-08-10 中国广州分析测试中心 一种聚硅氮烷原位生成二氧化硅增强环氧树脂复合材料
CN108164711A (zh) * 2016-12-08 2018-06-15 三星Sdi株式会社 用于形成硅氧层的组成物、制造硅氧层的方法及电子装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102194975B1 (ko) 2017-10-13 2020-12-24 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막의 제조방법 및 실리카 막
KR102471747B1 (ko) * 2017-12-26 2022-11-25 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 실리카 막, 및 전자소자
KR102432933B1 (ko) 2019-05-17 2022-08-12 삼성에스디아이 주식회사 실리카 막 형성용 조성물, 그로부터 형성된 실리카 막, 및 상기 실리카 막을 포함하는 전자 소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136130A (ja) * 1992-10-26 1994-05-17 Sumitomo Electric Ind Ltd ポリシラザンの高分子量化方法、高分子量化されたポリシラザン、及び該ポリシラザンを塗布焼付けた耐熱絶縁電線
CN102153951A (zh) * 2010-01-07 2011-08-17 Az电子材料（日本）株式会社 含有聚硅氮烷的涂布组合物
CN102874813A (zh) * 2011-07-15 2013-01-16 第一毛织株式会社 填充间隙的填料、其制备方法及制造半导体电容器的方法
CN104513613A (zh) * 2013-10-01 2015-04-15 三星Sdi株式会社 用于形成基于二氧化硅的层的组合物和基于二氧化硅的层

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2651464B2 (ja) * 1987-08-13 1997-09-10 財団法人石油産業活性化センター 改質ポリシラザン、その製造方法及びその用途
JP3364691B2 (ja) * 1992-12-28 2003-01-08 東燃ゼネラル石油株式会社 ポリシラザンの低分子量化方法
US6218497B1 (en) * 1997-04-21 2001-04-17 Alliedsignal Inc. Organohydridosiloxane resins with low organic content
US6177199B1 (en) * 1999-01-07 2001-01-23 Alliedsignal Inc. Dielectric films from organohydridosiloxane resins with low organic content
JP5020425B2 (ja) * 2000-04-25 2012-09-05 Ａｚエレクトロニックマテリアルズ株式会社 微細溝をシリカ質材料で埋封する方法
JP6104785B2 (ja) * 2013-12-09 2017-03-29 アーゼッド・エレクトロニック・マテリアルズ（ルクセンブルグ）ソシエテ・ア・レスポンサビリテ・リミテ ペルヒドロポリシラザン、およびそれを含む組成物、ならびにそれを用いたシリカ質膜の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06136130A (ja) * 1992-10-26 1994-05-17 Sumitomo Electric Ind Ltd ポリシラザンの高分子量化方法、高分子量化されたポリシラザン、及び該ポリシラザンを塗布焼付けた耐熱絶縁電線
CN102153951A (zh) * 2010-01-07 2011-08-17 Az电子材料（日本）株式会社 含有聚硅氮烷的涂布组合物
CN102874813A (zh) * 2011-07-15 2013-01-16 第一毛织株式会社 填充间隙的填料、其制备方法及制造半导体电容器的方法
CN104513613A (zh) * 2013-10-01 2015-04-15 三星Sdi株式会社 用于形成基于二氧化硅的层的组合物和基于二氧化硅的层

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105838034A (zh) * 2016-05-24 2016-08-10 中国广州分析测试中心 一种聚硅氮烷原位生成二氧化硅增强环氧树脂复合材料
CN108164711A (zh) * 2016-12-08 2018-06-15 三星Sdi株式会社 用于形成硅氧层的组成物、制造硅氧层的方法及电子装置
CN108164711B (zh) * 2016-12-08 2021-02-09 三星Sdi株式会社 用于形成硅氧层的组成物、制造硅氧层的方法及电子装置

Also Published As

Publication number Publication date
JP6599640B2 (ja) 2019-10-30
KR101806328B1 (ko) 2017-12-07
TWI575024B (zh) 2017-03-21
KR20160041728A (ko) 2016-04-18
TW201614007A (en) 2016-04-16
JP2016074875A (ja) 2016-05-12

Similar Documents

Publication Publication Date Title
US20150093545A1 (en) Composition for a silica based layer, silica based layer, and method of manufacturing a silica based layer
CN106189267A (zh) 用于形成二氧化硅层的组成物、二氧化硅层及电子装置
TWI621666B (zh) 用於形成氧化矽層的組成物、製造氧化矽層的方法、氧化矽層及電子裝置
US10427944B2 (en) Composition for forming a silica based layer, silica based layer, and electronic device
US9738787B2 (en) Composition for forming silica-based insulating layer, method for preparing composition for forming silica-based insulating layer, silica-based insulating layer, and method for manufacturing silica-based insulating layer
US9240443B2 (en) Process of preparing a gap filler agent, a gap filler agent prepared using same, and a method for manufacturing semiconductor capacitor using the gap filler agent
US10316216B2 (en) Composition for forming silica layer, and silica layer
CN105713512A (zh) 用于形成二氧化硅类层的组成物、用于制造二氧化硅类层的方法以及电子装置
CN106147604A (zh) 用于形成二氧化硅层的组成物、用于制造二氧化硅层的方法、二氧化硅层以及电子装置
KR20150039084A (ko) 실리카계 막 형성용 조성물, 실리카계 막 및 실리카계 막의 제조방법
US9902873B2 (en) Composition for forming silica based layer, and method for manufacturing silica based layer
CN112409824B (zh) 用于形成二氧化硅层的组成物、二氧化硅层和电子器件
TW201811671A (zh) 用於形成二氧化矽層的組成物、二氧化矽層和電子裝置
US10020185B2 (en) Composition for forming silica layer, silica layer, and electronic device
CN111944320B (zh) 用于形成二氧化硅层的组成物、二氧化硅层及电子装置
TW201821561A (zh) 用於形成矽氧層的組成物、製造矽氧層的方法以及電子裝置
KR20180056606A (ko) 실리카 막 형성용 조성물, 실리카 막의 제조방법 및 실리카 막
TW201439153A (zh) 塡隙劑製備製程、由其製備的塡隙劑、使用該塡隙劑的半導體電容器的製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20161207

RJ01 Rejection of invention patent application after publication