CN106158789A - 散热器固定装置和包括该散热器固定装置的散热器组件 - Google Patents

散热器固定装置和包括该散热器固定装置的散热器组件 Download PDF

Info

Publication number
CN106158789A
CN106158789A CN201510166446.6A CN201510166446A CN106158789A CN 106158789 A CN106158789 A CN 106158789A CN 201510166446 A CN201510166446 A CN 201510166446A CN 106158789 A CN106158789 A CN 106158789A
Authority
CN
China
Prior art keywords
radiator
fixer
heat
supporting part
main part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510166446.6A
Other languages
English (en)
Chinese (zh)
Inventor
朴熙准
李啓源
吴熺善
金钟闰
崔光周
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN106158789A publication Critical patent/CN106158789A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201510166446.6A 2014-10-28 2015-04-09 散热器固定装置和包括该散热器固定装置的散热器组件 Pending CN106158789A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0147284 2014-10-28
KR1020140147284A KR20160049731A (ko) 2014-10-28 2014-10-28 히트 싱크 체결장치 및 이를 포함하는 히트 싱크 어셈블리

Publications (1)

Publication Number Publication Date
CN106158789A true CN106158789A (zh) 2016-11-23

Family

ID=56020876

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510166446.6A Pending CN106158789A (zh) 2014-10-28 2015-04-09 散热器固定装置和包括该散热器固定装置的散热器组件

Country Status (2)

Country Link
KR (1) KR20160049731A (ko)
CN (1) CN106158789A (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102621397B1 (ko) * 2022-01-10 2024-01-09 (주)리치텍코리아 히트싱크 고정용 스프링 핀 조립체

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161085A1 (en) * 2002-02-27 2003-08-28 Shu-Chen Teng Heat sink fastener
CN101132682A (zh) * 2006-08-25 2008-02-27 富准精密工业(深圳)有限公司 固定件及其制造方法、应用该固定件的散热装置组合
CN202084528U (zh) * 2011-04-15 2011-12-21 鸿富锦精密工业（深圳）有限公司 具有散热片的散热装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030161085A1 (en) * 2002-02-27 2003-08-28 Shu-Chen Teng Heat sink fastener
CN101132682A (zh) * 2006-08-25 2008-02-27 富准精密工业(深圳)有限公司 固定件及其制造方法、应用该固定件的散热装置组合
CN202084528U (zh) * 2011-04-15 2011-12-21 鸿富锦精密工业（深圳）有限公司 具有散热片的散热装置

Also Published As

Publication number Publication date
KR20160049731A (ko) 2016-05-10

Similar Documents

Publication Publication Date Title
CN100521199C (zh) 散热电子装置及其形成方法
US8385080B2 (en) Semiconductor module, socket for the same, and semiconductor module/socket assembly
KR101403901B1 (ko) 열방사를 위한 방열체
US20090129026A1 (en) Heat sink for semiconductor device and semiconductor module assembly including the heat sink
CN109588006B (zh) 扩充卡的散热装置以及具散热功能的扩充卡总成
CN104066291B (zh) 外壳及具有该外壳的电源模块
CA3078843C (en) Heat sink, integrated circuit chip and circuit board
CN104066290A (zh) 外壳及具有该外壳的电源模块
US20150115424A1 (en) Electronic system comprising stacked electronic devices provided with integrated-circuit chips
US20120267078A1 (en) Heat dissipation mechanism
KR101010351B1 (ko) 나노 분말을 이용한 방열장치
JP6741164B2 (ja) 回路ブロック集合体
CN110880483A (zh) 半导体装置及其制造方法
US11721742B2 (en) Memory modules and memory packages including graphene layers for thermal management
KR100922433B1 (ko) 히트파이프를 이용한 엘이디 조명장치의 방열구조
CN101466244B (zh) 散热器
CN103050455A (zh) 堆叠封装结构
JP2010205863A (ja) 車載用電子制御装置
CN106158789A (zh) 散热器固定装置和包括该散热器固定装置的散热器组件
JP6337162B2 (ja) 電動機駆動装置
JP2016071269A (ja) 電子機器、及びシステム
CN105324009A (zh) 散热器固定装置和包括该散热器固定装置的散热器组件
WO2007102710A1 (en) Heat-sink device
US10672684B2 (en) Heat sink hold down system for direct attachment to printed circuit board
JP2004079940A (ja) メモリモジュール放熱装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20161123

WD01 Invention patent application deemed withdrawn after publication