JP6337162B2 - 電動機駆動装置 - Google Patents
電動機駆動装置 Download PDFInfo
- Publication number
- JP6337162B2 JP6337162B2 JP2017009677A JP2017009677A JP6337162B2 JP 6337162 B2 JP6337162 B2 JP 6337162B2 JP 2017009677 A JP2017009677 A JP 2017009677A JP 2017009677 A JP2017009677 A JP 2017009677A JP 6337162 B2 JP6337162 B2 JP 6337162B2
- Authority
- JP
- Japan
- Prior art keywords
- middle base
- base portion
- electric motor
- motor drive
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 claims description 28
- 238000009434 installation Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 229910001369 Brass Inorganic materials 0.000 claims description 3
- 239000010951 brass Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/30—Structural association with control circuits or drive circuits
- H02K11/33—Drive circuits, e.g. power electronics
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P29/00—Arrangements for regulating or controlling electric motors, appropriate for both AC and DC motors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motor Or Generator Cooling System (AREA)
- Control Of Electric Motors In General (AREA)
- Inverter Devices (AREA)
Description
Claims (7)
- ベース部;
上記ベース部の上部に配置されるミドルベース部;
上記ベース部に安着されて上記ミドルベース部の間に配置され、上記ミドルベース部の底面の面積より小さい設置面積を有する放熱部;及び
上記放熱部の側部に位置するように配置されるよう、上記ミドルベース部に固定されるコンデンサー部;
上記ミドルベース部の上部に配置されるパワーPCB部;
上記パワーPCB部の上部に離隔して配置されるEMCPCB部;
上記パワーPCB部の側部に結合されるコントロールPCB部;
上記EMCPCB部を固定して、上記放熱部との接地端子台を形成する黄銅サポーター
を含み、
上記放熱部の上端は、上記ミドルベース部の下部に位置されるように上記ミドルベース部に結合され、
上記放熱部は上記ベース部の上面面積より小さい設置面積を有することを特徴とする電動機駆動装置。 - 上記ミドルベース部には、
上記コンデンサー部が差し込まれて固定される一つまたは多数の貫通孔部が形成されることを特徴とする、請求項1に記載の電動機駆動装置。 - 上記貫通孔部は、
上記コンデンサー部が差し込まれる貫通孔と、
上記貫通孔から下方へ延長され、上記コンデンサー部の周りに密着されるように包む固定体を含むことを特徴とする、請求項2に記載の電動機駆動装置。 - 上記放熱部の上端両側部には、一対のスライディング溝が形成され、
上記ミドルベース部の両側部には、上記一対のスライディング溝に差し込まれて結合される一対のスライディングレールが形成されることを特徴とする、請求項1ないし請求項3のいずれか1項に記載の電動機駆動装置。 - 上記ミドルベース部には、
上記パワーPCB部を上方に離隔して固定する固定リーブが形成されることを特徴とする、請求項1ないし請求項4のいずれか1項に記載の電動機駆動装置。 - 上記パワーPCB部の側部には突出される固定突起が形成され、
上記コントロールPCB部には、上記固定突起が差し込まれて固定される固定孔が形成されることを特徴とする、請求項1ないし請求項5のいずれか1項に記載の電動機駆動装置。 - 上記パワーPCB部には、
上記EMCPCB部を固定し、上記EMCPCB部に入力される電流を上記パワーPCB部に伝達する導電性のホルダーが備えられることを特徴とする、請求項1ないし請求項5のいずれか1項に記載の電動機駆動装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2016-0021750 | 2016-02-24 | ||
KR1020160021750A KR101835954B1 (ko) | 2016-02-24 | 2016-02-24 | 전동기 구동 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017153347A JP2017153347A (ja) | 2017-08-31 |
JP6337162B2 true JP6337162B2 (ja) | 2018-06-06 |
Family
ID=57909473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017009677A Active JP6337162B2 (ja) | 2016-02-24 | 2017-01-23 | 電動機駆動装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9936600B2 (ja) |
EP (1) | EP3211981A1 (ja) |
JP (1) | JP6337162B2 (ja) |
KR (1) | KR101835954B1 (ja) |
CN (1) | CN107124848B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102478290B1 (ko) * | 2018-04-26 | 2022-12-16 | 엘에스일렉트릭(주) | 전동기 구동장치 |
KR102082207B1 (ko) * | 2018-05-02 | 2020-02-27 | 엘에스산전 주식회사 | 전동기 구동장치 |
USD1025049S1 (en) * | 2021-05-27 | 2024-04-30 | Siemens Aktiengesellschaft | Computer |
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-
2016
- 2016-02-24 KR KR1020160021750A patent/KR101835954B1/ko not_active Application Discontinuation
-
2017
- 2017-01-20 US US15/411,809 patent/US9936600B2/en active Active
- 2017-01-23 JP JP2017009677A patent/JP6337162B2/ja active Active
- 2017-01-25 EP EP17153014.0A patent/EP3211981A1/en not_active Withdrawn
- 2017-01-25 CN CN201710060683.3A patent/CN107124848B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20170245387A1 (en) | 2017-08-24 |
JP2017153347A (ja) | 2017-08-31 |
US9936600B2 (en) | 2018-04-03 |
KR20170099549A (ko) | 2017-09-01 |
CN107124848A (zh) | 2017-09-01 |
EP3211981A1 (en) | 2017-08-30 |
KR101835954B1 (ko) | 2018-04-19 |
CN107124848B (zh) | 2020-02-07 |
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