CN106141446B - 脆性物件切断装置及其切断方法 - Google Patents
脆性物件切断装置及其切断方法 Download PDFInfo
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- CN106141446B CN106141446B CN201510201011.0A CN201510201011A CN106141446B CN 106141446 B CN106141446 B CN 106141446B CN 201510201011 A CN201510201011 A CN 201510201011A CN 106141446 B CN106141446 B CN 106141446B
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- heating
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CN201510201011.0A CN106141446B (zh) | 2015-04-24 | 2015-04-24 | 脆性物件切断装置及其切断方法 |
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CN201510201011.0A CN106141446B (zh) | 2015-04-24 | 2015-04-24 | 脆性物件切断装置及其切断方法 |
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CN106141446A CN106141446A (zh) | 2016-11-23 |
CN106141446B true CN106141446B (zh) | 2020-09-25 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020089711A (ko) * | 2001-05-23 | 2002-11-30 | 삼성전자 주식회사 | 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치 |
CN1939636A (zh) * | 2005-09-30 | 2007-04-04 | 富士迈半导体精密工业(上海)有限公司 | 雷射切割装置与方法 |
CN1978121A (zh) * | 2005-12-09 | 2007-06-13 | 富士迈半导体精密工业(上海)有限公司 | 雷射切割装置 |
CN101108446A (zh) * | 2006-07-21 | 2008-01-23 | 富士迈半导体精密工业(上海)有限公司 | 激光切割装置及方法 |
TW200827081A (en) * | 2006-12-22 | 2008-07-01 | Foxsemicon Integrated Tech Inc | Laser cutting system and method for cutting a brittle substrate using the same |
JP2013107090A (ja) * | 2011-11-17 | 2013-06-06 | Hitachi High-Technologies Corp | 脆性基板加工装置 |
KR20140030808A (ko) * | 2012-09-04 | 2014-03-12 | (주)하드램 | 유리 기판 레이저 절단 장치 및 방법 |
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Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020089711A (ko) * | 2001-05-23 | 2002-11-30 | 삼성전자 주식회사 | 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치 |
CN1939636A (zh) * | 2005-09-30 | 2007-04-04 | 富士迈半导体精密工业(上海)有限公司 | 雷射切割装置与方法 |
CN1978121A (zh) * | 2005-12-09 | 2007-06-13 | 富士迈半导体精密工业(上海)有限公司 | 雷射切割装置 |
CN101108446A (zh) * | 2006-07-21 | 2008-01-23 | 富士迈半导体精密工业(上海)有限公司 | 激光切割装置及方法 |
TW200827081A (en) * | 2006-12-22 | 2008-07-01 | Foxsemicon Integrated Tech Inc | Laser cutting system and method for cutting a brittle substrate using the same |
JP2013107090A (ja) * | 2011-11-17 | 2013-06-06 | Hitachi High-Technologies Corp | 脆性基板加工装置 |
KR20140030808A (ko) * | 2012-09-04 | 2014-03-12 | (주)하드램 | 유리 기판 레이저 절단 장치 및 방법 |
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CN106141446A (zh) | 2016-11-23 |
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Inventor after: Lv Hongtu Inventor after: Meer Hanjourshenko Inventor after: Naumov Alexander Inventor after: Xu Zhipeng Inventor after: Xu Weinong Inventor before: Lv Hongtu Inventor before: Meer Hanjourshenko Inventor before: Naumov Alexander |
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Effective date of registration: 20170306 Address after: The British West Island Dakaiman Cayman Islands India Orient Road KY1-1208 Applicant after: British Cayman Islands Business Limited by Share Ltd Nanor Address before: Suzhou City, Jiangsu province 215300 die Wulian road Kunshan City High-tech Industrial Park No. 38 Applicant before: Kunshan Nano New Material Technology Co., Ltd. |
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