CN1939636A - 雷射切割装置与方法 - Google Patents
雷射切割装置与方法 Download PDFInfo
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- CN1939636A CN1939636A CN200510094679.6A CN200510094679A CN1939636A CN 1939636 A CN1939636 A CN 1939636A CN 200510094679 A CN200510094679 A CN 200510094679A CN 1939636 A CN1939636 A CN 1939636A
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200510094679.6A CN100482398C (zh) | 2005-09-30 | 2005-09-30 | 激光切割装置与方法 |
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CN200510094679.6A CN100482398C (zh) | 2005-09-30 | 2005-09-30 | 激光切割装置与方法 |
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Publication Number | Publication Date |
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CN1939636A true CN1939636A (zh) | 2007-04-04 |
CN100482398C CN100482398C (zh) | 2009-04-29 |
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CN200510094679.6A Expired - Fee Related CN100482398C (zh) | 2005-09-30 | 2005-09-30 | 激光切割装置与方法 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101844865A (zh) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | 基板切割装置和利用该基板切割装置切割基板的方法 |
CN101279403B (zh) * | 2007-04-06 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 激光加工方法 |
CN101530951B (zh) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 激光切割脆性基板的方法及脆性基板 |
CN102574244A (zh) * | 2009-10-08 | 2012-07-11 | 特摩劳吉克公司 | 用于切割的控制规则及变量 |
CN102643017A (zh) * | 2011-03-14 | 2012-08-22 | 京东方科技集团股份有限公司 | 非接触式裂片方法、设备及切割和裂片的方法、设备 |
CN101462822B (zh) * | 2007-12-21 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | 具有通孔的脆性非金属工件及其加工方法 |
CN103608145A (zh) * | 2011-04-07 | 2014-02-26 | 特摩劳吉克公司 | 使用切割控制规则和变量在一块材料上切割多个工件的方法、***和计算机程序 |
CN105798470A (zh) * | 2016-05-27 | 2016-07-27 | 京东方科技集团股份有限公司 | 一种激光切割机及其切割方法 |
CN106141446A (zh) * | 2015-04-24 | 2016-11-23 | 昆山纳诺新材料科技有限公司 | 脆性物件切断装置及其切断方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6218642B1 (en) * | 1999-07-12 | 2001-04-17 | J. F. Helmold & Bro., Inc. | Laser hardened steel cutting rule |
US7157038B2 (en) * | 2000-09-20 | 2007-01-02 | Electro Scientific Industries, Inc. | Ultraviolet laser ablative patterning of microstructures in semiconductors |
KR100673073B1 (ko) * | 2000-10-21 | 2007-01-22 | 삼성전자주식회사 | 레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치 |
KR100794284B1 (ko) * | 2001-09-29 | 2008-01-11 | 삼성전자주식회사 | 비금속 기판 절단 방법 |
DE10257544A1 (de) * | 2002-12-10 | 2004-07-08 | Schott Glas | Verfahren zum Brechen von lasergeritzten, flachen Werkstücken aus sprödem Material |
KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
-
2005
- 2005-09-30 CN CN200510094679.6A patent/CN100482398C/zh not_active Expired - Fee Related
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101279403B (zh) * | 2007-04-06 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 激光加工方法 |
US8518280B2 (en) | 2007-12-21 | 2013-08-27 | Hon Hai Precision Industry Co., Ltd. | Brittle non-metallic workpiece with through hole and method for making same |
CN101462822B (zh) * | 2007-12-21 | 2012-08-29 | 鸿富锦精密工业(深圳)有限公司 | 具有通孔的脆性非金属工件及其加工方法 |
CN101530951B (zh) * | 2008-03-13 | 2012-03-14 | 富士迈半导体精密工业(上海)有限公司 | 激光切割脆性基板的方法及脆性基板 |
CN101844865B (zh) * | 2009-03-25 | 2013-06-05 | 三星显示有限公司 | 基板切割装置和利用该基板切割装置切割基板的方法 |
CN101844865A (zh) * | 2009-03-25 | 2010-09-29 | 三星移动显示器株式会社 | 基板切割装置和利用该基板切割装置切割基板的方法 |
CN102574244A (zh) * | 2009-10-08 | 2012-07-11 | 特摩劳吉克公司 | 用于切割的控制规则及变量 |
CN102574244B (zh) * | 2009-10-08 | 2014-10-22 | 特摩劳吉克公司 | 用于切割的控制规则及变量 |
CN102643017A (zh) * | 2011-03-14 | 2012-08-22 | 京东方科技集团股份有限公司 | 非接触式裂片方法、设备及切割和裂片的方法、设备 |
CN103608145A (zh) * | 2011-04-07 | 2014-02-26 | 特摩劳吉克公司 | 使用切割控制规则和变量在一块材料上切割多个工件的方法、***和计算机程序 |
CN106141446A (zh) * | 2015-04-24 | 2016-11-23 | 昆山纳诺新材料科技有限公司 | 脆性物件切断装置及其切断方法 |
CN106141446B (zh) * | 2015-04-24 | 2020-09-25 | 英属开曼群岛商纳诺股份有限公司 | 脆性物件切断装置及其切断方法 |
CN105798470A (zh) * | 2016-05-27 | 2016-07-27 | 京东方科技集团股份有限公司 | 一种激光切割机及其切割方法 |
CN105798470B (zh) * | 2016-05-27 | 2017-09-29 | 京东方科技集团股份有限公司 | 一种激光切割机及其切割方法 |
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Publication number | Publication date |
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CN100482398C (zh) | 2009-04-29 |
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Address after: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
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Address after: 201600 Shanghai City Industrial Zone of Songjiang science and Technology Park Wen Ji Road No. 500 Patentee after: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee after: Foxsemicon Integrated Technology Inc. Address before: 201600 Shanghai city Songjiang District industrial zone of Songjiang science and Technology Park No. 500 Wen Ji Lu Patentee before: Foxsemicon Integrated Technology (Shanghai) Inc. Patentee before: Foxsemicon Integrated Technology Inc. |
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Granted publication date: 20090429 Termination date: 20210930 |
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