CN105977227B - A kind of integrated antenna package of composite substrate - Google Patents
A kind of integrated antenna package of composite substrate Download PDFInfo
- Publication number
- CN105977227B CN105977227B CN201610462452.0A CN201610462452A CN105977227B CN 105977227 B CN105977227 B CN 105977227B CN 201610462452 A CN201610462452 A CN 201610462452A CN 105977227 B CN105977227 B CN 105977227B
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- Prior art keywords
- heat
- chip
- fixed
- silica gel
- dielectric layer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of integrated antenna packages of composite substrate, its substrate is made of bottom plate, heat dissipation graphite film and heat-conducting silica gel sheet, the upper surface of bottom plate is fixed with heat dissipation graphite film, the upper surface of heat dissipation graphite film is fixed with heat-conducting silica gel sheet, it is fixed with dielectric layer on the upper surface of heat-conducting silica gel sheet, IC chip is pasted and fixed on the middle part of dielectric layer by crystal-bonding adhesive, dielectric layer below IC chip is provided with the heat sink strip of several cylinders, against on the ic chip, the lower end of heat sink strip is resisted against heat conductive silica gel on piece for the upper end of heat sink strip.The present invention is located at the IC chip being fixed on substrate using the substrate of composite heat-conducting structure and radiates, and improves the service life of IC chip.
Description
Technical field：
The present invention relates to the technical fields of integrated circuit, are sealed more specifically to a kind of integrated circuit of composite substrate
Dress.
Background technology：
Electronic industry constantly reduces the size of electronic component, and is continuing to increase function in electronic component so that integrated electricity
The function and complexity on road are constantly promoted.And this trend also drives the encapsulation technology of integrated circuit component towards small size, height
The direction of foot number and high electricity/thermal efficiency is developed, and meets scheduled industrial standard.Some existing integrated antenna packages are by base
Plate, IC chip and corresponding packaging plastic composition, IC chip are sealingly fastened in by packaging plastic on substrate, then on substrate top
Line, although this structure encapsulation is convenient and efficient, heat dissipation effect is poor, so the integrated antenna package of such structure needs to design phase
The radiator structure answered.
Invention content：
The purpose of the present invention and provides a kind of integrated circuit envelope of composite substrate aiming at the deficiency of the prior art
Dress uses the substrate of composite heat-conducting structure to be located at the IC chip being fixed on substrate and radiates, improves the use of IC chip
Service life.
To achieve the above object, technical scheme is as follows：
A kind of integrated antenna package of composite substrate, including substrate and IC chip, substrate is by bottom plate, heat dissipation graphite film and leads
Hot silica gel piece composition, the upper surface of bottom plate are fixed with heat dissipation graphite film, and the upper surface for the graphite film that radiates is fixed with heat-conducting silica gel sheet,
Dielectric layer is fixed on the upper surface of heat-conducting silica gel sheet, IC chip is pasted and fixed on the middle part of dielectric layer, IC cores by crystal-bonding adhesive
Dielectric layer below piece is provided with the heat sink strip of several cylinders, and the upper end of heat sink strip is against on the ic chip, under heat sink strip
End is resisted against heat conductive silica gel on piece, and heat sink strip is evenly distributed on the lower section of IC chip, and the heat-conducting silica gel sheet uses sil-pad
Heat Conduction Material, packaging plastic is covered on the outer surface of IC chip, and packaging plastic is fixed on the dielectric layer.
Crystal-bonding adhesive coating zone on the dielectric layer is more than the bottom surface of IC chip.
The beneficial effects of the present invention are：It uses the substrate of composite heat-conducting structure to be located at the IC chip being fixed on substrate
It radiates, improves the service life of IC chip.
Description of the drawings：
Fig. 1 is the structural schematic diagram of invention section view；
Fig. 2 is the structural schematic diagram for inventing another angle；
In figure：1, substrate；11, bottom plate；12, radiate graphite film；13, heat-conducting silica gel sheet；2, dielectric layer；3, heat sink strip；4、
IC chip；5, packaging plastic；6, crystal-bonding adhesive.
Specific implementation mode：
Embodiment：See Fig. 1, shown in 2, a kind of integrated antenna package of composite substrate, including substrate 1 and IC chip 4, substrate
1 is made of bottom plate 11, heat dissipation graphite film 12 and heat-conducting silica gel sheet 13, and the upper surface of bottom plate 11 is fixed with heat dissipation graphite film 12, dissipates
The upper surface of hot graphite film 12 is fixed with heat-conducting silica gel sheet 13, and dielectric layer 2, IC cores are fixed on the upper surface of heat-conducting silica gel sheet 13
Piece 4 is pasted and fixed on the middle part of dielectric layer 2 by crystal-bonding adhesive 6, and the dielectric layer 2 of 4 lower section of IC chip is provided with several cylinders
The upper end of heat sink strip 3, heat sink strip 3 is resisted against in IC chip 4, and the lower end of heat sink strip 3 is resisted against on heat-conducting silica gel sheet 13.
Packaging plastic 5 is covered on the outer surface of the IC chip 4, packaging plastic 5 is fixed on dielectric layer 2.
The heat sink strip 3 is evenly distributed on the lower section of IC chip 4, and the local that heat sink strip 3 is concentrated is heat sink strip area, heat sink strip
The area in area is more than the bottom surface of IC chip, and the heat-conducting silica gel sheet 13 uses sil-pad Heat Conduction Materials.
6 coating zone of crystal-bonding adhesive on the dielectric layer 2 is more than the bottom surface of IC chip 4.
Operation principle：The present invention is a kind of integrated antenna package, what main technical point was existing through glue package
Radiator structure is added on integrated circuit to realize that hermetically sealed IC chip 4 radiates, 3 heat conduction of heat sink strip on dielectric layer 2,
The base for the combined type that the substrate 1 of traditional monoblock type is changed to be made of bottom plate 11, heat dissipation graphite film 12 and heat-conducting silica gel sheet 13
The substrate 1 of plate 1, combined type has efficient heat dissipation performance, can be fast to deliver heat to the substrate 1 of combined type by heat sink strip 3
Speed is that IC chip 4 radiates.
Claims (2)
1. a kind of integrated antenna package of composite substrate, including substrate (1) and IC chip (4), it is characterised in that：Substrate (1) by
Bottom plate (11), heat dissipation graphite film (12) and heat-conducting silica gel sheet (13) composition, the upper surface of bottom plate (11) is fixed with heat dissipation graphite film
(12), the upper surface of heat dissipation graphite film (12) is fixed with heat-conducting silica gel sheet (13), is fixed on the upper surface of heat-conducting silica gel sheet (13)
There are dielectric layer (2), IC chip (4) to be pasted and fixed on the middle part of dielectric layer (2), Jie below IC chip (4) by crystal-bonding adhesive (6)
Electric layer (2) is provided with the heat sink strip (3) of several cylinders, and the upper end of heat sink strip (3) is resisted against in IC chip (4), heat sink strip (3)
Lower end be resisted against on heat-conducting silica gel sheet (13), heat sink strip (3) is evenly distributed on the lower section of IC chip (4), the thermal conductive silicon
Film (13) uses sil-pad Heat Conduction Materials, and packaging plastic (5) is covered on the outer surface of IC chip (4), and packaging plastic (5) is fixed
On dielectric layer (2).
2. a kind of integrated antenna package of composite substrate according to claim 1, it is characterised in that：The dielectric layer (2)
On crystal-bonding adhesive (6) coating zone be more than IC chip (4) bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462452.0A CN105977227B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated antenna package of composite substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610462452.0A CN105977227B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated antenna package of composite substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105977227A CN105977227A (en) | 2016-09-28 |
| CN105977227B true CN105977227B (en) | 2018-10-09 |
Family
ID=57022624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610462452.0A Active CN105977227B (en) | 2016-06-20 | 2016-06-20 | A kind of integrated antenna package of composite substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105977227B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108417544A (en) * | 2018-04-13 | 2018-08-17 | 业成科技（成都）有限公司 | Heat dissipation element, using the production method of its electronic device and electronic device |
| CN109887863B (en) * | 2019-01-31 | 2021-02-02 | 王晓青 | IC packaging board installer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637815A (en) * | 2012-04-16 | 2012-08-15 | 深圳市安培盛科技有限公司 | High-heat-conduction LTCC (low temperature co-fired ceramic) substrate |
| CN105514059A (en) * | 2016-01-23 | 2016-04-20 | 北京大学 | Efficient cooling system of graphene composite/silicon nitride/silicon chip |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2803603B2 (en) * | 1995-09-18 | 1998-09-24 | 日本電気株式会社 | Multi-chip package structure |
-
2016
- 2016-06-20 CN CN201610462452.0A patent/CN105977227B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637815A (en) * | 2012-04-16 | 2012-08-15 | 深圳市安培盛科技有限公司 | High-heat-conduction LTCC (low temperature co-fired ceramic) substrate |
| CN105514059A (en) * | 2016-01-23 | 2016-04-20 | 北京大学 | Efficient cooling system of graphene composite/silicon nitride/silicon chip |
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| Publication number | Publication date |
|---|---|
| CN105977227A (en) | 2016-09-28 |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20180827 Address after: 318050 Shang Jiang Village, Feng Jiang, Luqiao District, Taizhou, Zhejiang (metal profile Park) Applicant after: Zhejiang Hu te Motor Co., Ltd. Address before: 523000 productivity building 406, high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong Applicant before: Dongguan Lianzhou Intellectual Property Operation Management Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20210712 Address after: No.18-91, Gongye Road, South Taihu high tech Industrial Park, Wuxing District, Huzhou City, Zhejiang Province Patentee after: Zhejiang julibao Textile Technology Co., Ltd Address before: 318050 Shang Jiang Village, Feng Jiang, Luqiao District, Taizhou, Zhejiang (metal profile Park) Patentee before: Zhejiang Hu Te Electric Machine Co.,Ltd. |
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| TR01 | Transfer of patent right |