CN102738375A - Led light source module - Google Patents
Led light source module Download PDFInfo
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- CN102738375A CN102738375A CN2011100916404A CN201110091640A CN102738375A CN 102738375 A CN102738375 A CN 102738375A CN 2011100916404 A CN2011100916404 A CN 2011100916404A CN 201110091640 A CN201110091640 A CN 201110091640A CN 102738375 A CN102738375 A CN 102738375A
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- heat
- light source
- source module
- led light
- conductive
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Abstract
The invention discloses an LED light source module comprising a heat dissipation substrate, an electrically and thermally conductive layer, at least one LED chip, and a plastic package body. The electrically and thermally conductive layer is coated on the heat dissipation substrate, and the plastic package body seals the LED chip on the electrically and thermally conductive layer. According to the LED light source module, a heat dissipation effect of the LED chip can be improved, and an astigmatism range of light of the LED chip can be enlarged.
Description
Technical field
The present invention relates to a kind of led light source module.
Background technology
Light-emitting diode (LED) has long advantage of luminous efficiency height, power saving and life-span, and it is used more and more widely.The led light source module constitutes the LED encapsulation through plastic-sealed body; Existing led light source modular structure is as shown in Figure 1; One led light source module 10; Comprise a heat-radiating substrate 11, be arranged at a heat-conducting plate 12 on the heat-radiating substrate 11, be arranged at a lead frame 13 on the heat-conducting plate 12, be arranged on a circuit board 14 and a led chip 15 in the lead frame 13, wherein led chip 15 is arranged on the circuit board 14, and cooperates the plastic-sealed body 16 of lead frame 13 with led chip 15 plastic packagings.Wherein, this lead frame 13 roughly is round peviform, comprise a base plate 131 and be formed on the base plate 131 according to its edge ring around peripheral wall 132, the lead frame 13 through this kind shape is set so that plastic-sealed body 16 combine with it to stablize.This kind led light source modular structure is complicated, and because led light source module 10 has this lead frame 13, is unfavorable for that the LED heat radiation transmits, and simultaneously, the LED light that sheds is that 132 of peripheral walls stop that to cause the light scope that sheds little.
Summary of the invention
In view of foregoing, be necessary to provide a kind of simple in structure, can improve the led light source module that dispels the heat and enlarge astigmatic scope.
For solving the problems of the technologies described above; The technical scheme that the present invention adopts is: a kind of led light source module is provided; Comprise a heat-radiating substrate, a conductive and heat-conductive layer, at least one led chip; And a plastic-sealed body, said conductive and heat-conductive layer is coated on the heat-radiating substrate, said plastic-sealed body with said led chip plastic packaging on the conductive and heat-conductive layer.
Be different from prior art; This led light source module passes through on heat-radiating substrate, to form a conductive and heat-conductive layer, and led chip is arranged on this conductive and heat-conductive layer, need not lead frame and circuit board; Simple in structure; The heat that led chip sends can be directly delivered on the heat-radiating substrate through the conductive and heat-conductive layer, has shortened the heat transferred path, the heat radiation of being more convenient for; While can enlarge the astigmatic scope of led chip light owing to the peripheral wall obstruction light that the omission lead frame does not have lead frame sheds, and astigmatic scope reaches 180 degree.
Description of drawings
Fig. 1 is the cutaway view of traditional led light source module;
Fig. 2 is the cutaway view of preferred embodiment led light source module of the present invention;
Fig. 3 is the vertical view of led light source module shown in Figure 1.
Embodiment
By specifying technology contents of the present invention, structural feature, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, led light source module 100 of the present invention comprises a heat-radiating substrate 10, a conductive and heat-conductive layer 20, at least one led chip 30, an and plastic-sealed body 40.Said conductive and heat-conductive layer 20 is coated on the said heat-radiating substrate 10, said plastic-sealed body 40 with led chip 30 plastic packagings on conductive and heat-conductive layer 20.
Said heat-radiating substrate 10 is processed for can be materials such as the good aluminium of thermal conductivity, silver, and in the present embodiment, this heat-radiating substrate 10 is an aluminium base.This heat-radiating substrate 10 comprises that one is planar upper surface 11, is formed with said conductive and heat-conductive layer 20 on this upper surface 11.This conductive and heat-conductive layer 20 comprises an insulating bottom layer 21 and a layer printed circuit board 22, and said insulating bottom layer 21 electrically conducts with heat-radiating substrate 10 in order to isolated layer printed circuit board 22, and this insulating bottom layer 21 can be the preferable insulating varnish of heat conductivility and forms.Said layer printed circuit board 22 forms for the electrically conductive ink printing, and it is formed with integrated circuit, in order to electrically connect led chip 30.
Said led chip 30 is laid on the said conductive and heat-conductive layer 20; And lead to two leads 32 on each led chip; This two lead 32 in order to layer printed circuit board 22 on two conducting strips 222 electrically connect; Thereby each led chip 30 forms a current circuit, can whether control the luminous of led chip 30 through the circuit turn-on of control layer printed circuit board 22.This led chip 30 is bonding with conductive and heat-conductive layer 20 through a solid crystal layer 23, and these solid crystal layer 23 materials can be organic metal welding compound or soldering paste, and the organic metal bonding machine is the suspended matter of metallic and polymer support.The size of these metallics is generally several microns, is generally laminar silver-colored particle, and this metallic provides the performance of heat conduction and conduction.Polymer support comprises resin, and like epoxy resin, organosilicon or gather inferior phthalein ammonia etc., these resins provide and adhere to and cohesiveness, make the organic metal bonding machine become the sticky object with certain mechanical strength.Soldering paste is mainly lead-free solder, like golden tin solder, and the SAC scolder, thermal conductivity is good, has higher reflux temperature.Right large size chip uses soldering paste that the cavity possibly take place at the faying face place, and causes the problem of heat conduction and stress aspect.Solid crystal layer material adopts the organic metal welding compound in the present embodiment, can be the preferable elargol of thermal conductivity, and elargol mainly is made up of silver powder, glass sand and resin.These led chip 30 bottoms can be provided with heat sink 24; Heat sink being arranged on the conductive and heat-conductive layer 20; And support said led chip 30, this is heat sink to be a fin big than led chip 30 bottom areas, in order to the contact area that enlarges led chip 30 and conductive and heat-conductive layer 20 to improve radiating efficiency.
Said plastic-sealed body 40 is the hemisphere shape, and this plastic-sealed body 40 is bonding with said conductive and heat-conductive layer 20, and with said led chip 30 plastic packagings in it.This plastic-sealed body 40 mainly by organosilicon property fat, fluorescent powder grain, and glue process, be overlying on led chip 30 surfaces fast after evenly mixing in suitable ratio through organosilicon property fat, fluorescent powder grain and glue, and formation after curing.Said organosilicon property fat is to add nanometer grade silica in the epoxy resin to process, and so can make the thermal coefficient of expansion of epoxy resin descend, and toughness increases, and guarantees good transparency simultaneously, and raising and conductive and heat-conductive layer 20 bonding steadiness.This plastic-sealed body 40 has high index of refraction and beam distribution is evenly shed, and guarantees photochromic consistency.
When led light source module 100 was luminous, the heat part that said led chip 30 sends can shed through said plastic-sealed body 40 heat conduction, and another most of heat conducts to heat-radiating substrate 10 by led chip 20 through conductive and heat-conductive layer 20 and sheds.
This led light source module 100 is through being arranged on led chip 30 on the conductive and heat-conductive layer 20; The heat that led chip 30 sends is through conductive and heat-conductive layer 20 and heat-radiating substrate 10 heat loss through conduction; The lead frame that these conductive and heat-conductive layer 20 structures are more traditional combines printed circuit board (PCB); Simple in structure, and thermal conductivity is increased dramatically.The peripheral wall that the light that the while led chip sends does not have lead frame hinders, and the astigmatic expanded range of the light of led chip 30 like this, astigmatic scope can reach 180 degree.
The above is merely embodiments of the invention; Be not so limit claim of the present invention; Every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to be done; Or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. led light source module; It is characterized in that: this led light source module comprises a heat-radiating substrate, a conductive and heat-conductive layer, at least one led chip; And a plastic-sealed body, said conductive and heat-conductive layer is coated on the heat-radiating substrate, said plastic-sealed body with said led chip plastic packaging on the conductive and heat-conductive layer.
2. led light source module as claimed in claim 1 is characterized in that: said heat-radiating substrate upper surface is the plane, and said conductive and heat-conductive layer is plane earth and is coated on the heat-radiating substrate.
3. led light source module as claimed in claim 1 is characterized in that: said heat-radiating substrate is an aluminium base.
4. led light source module as claimed in claim 1; It is characterized in that: said conductive and heat-conductive layer comprises an insulating bottom layer and a layer printed circuit board; Isolated layer printed circuit board of said insulating bottom layer and heat-radiating substrate electrically conduct, and said layer printed circuit board and led chip electrically connect.
5. led light source module as claimed in claim 4 is characterized in that: said insulating bottom layer is that insulating varnish forms.
6. led light source module as claimed in claim 4 is characterized in that: lead to two leads on each said led chip, this two lead and layer printed circuit board electrically connect, and form a current circuit with each led chip.
7. led light source module as claimed in claim 1 is characterized in that: said led light source module also comprises elargol, and this led chip is bonding through this elargol and layer printed circuit board.
8. led light source module as claimed in claim 7 is characterized in that: said elargol is made up of silver powder, glass sand and resin.
9. led light source module as claimed in claim 1 is characterized in that: said plastic-sealed body by organosilicon property fat, fluorescent powder grain, and glue process, this organosilicon property fat is to add nanometer grade silica in the epoxy resin to process.
10. led light source module as claimed in claim 1 is characterized in that: said led chip bottom is provided with heat sink, heat sink being arranged on the conductive and heat-conductive layer, and support said led chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100916404A CN102738375A (en) | 2011-04-12 | 2011-04-12 | Led light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100916404A CN102738375A (en) | 2011-04-12 | 2011-04-12 | Led light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102738375A true CN102738375A (en) | 2012-10-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100916404A Pending CN102738375A (en) | 2011-04-12 | 2011-04-12 | Led light source module |
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| CN (1) | CN102738375A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105938869A (en) * | 2016-06-21 | 2016-09-14 | 深圳市兆驰节能照明股份有限公司 | Double-layer chip scale package (CSP) light source and manufacturing method thereof |
| CN105957943A (en) * | 2016-06-17 | 2016-09-21 | 深圳市兆驰节能照明股份有限公司 | Chip-level packaging light-emitting device and manufacturing method thereof |
| CN109256051A (en) * | 2018-09-20 | 2019-01-22 | 深圳市海讯高科技术有限公司 | A kind of COB display screen and its packaging method |
| CN109599474A (en) * | 2018-12-25 | 2019-04-09 | 江苏罗化新材料有限公司 | A kind of the CSP packaging method and its encapsulating structure of LED chip |
| CN110660891A (en) * | 2018-06-29 | 2020-01-07 | 合肥彩虹蓝光科技有限公司 | Flip-chip device packaging method and structure |
| US10893924B2 (en) | 2015-02-27 | 2021-01-19 | Colgate-Palmolive Company | Oral treatment system |
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| CN1622346A (en) * | 2003-11-25 | 2005-06-01 | 诠兴开发科技股份有限公司 | High thermal conductivity PCB type surface binding light emitting diode |
| CN1649182A (en) * | 2005-03-02 | 2005-08-03 | 友达光电股份有限公司 | Light emitting diode light source module |
| CN1702141A (en) * | 2004-05-25 | 2005-11-30 | 安捷伦科技有限公司 | Mold compound with fluorescent material and a light-emitting device made therefrom |
| CN101022144A (en) * | 2006-02-15 | 2007-08-22 | 深圳市量子光电子有限公司 | Large power light-emitting diode |
| CN101034231A (en) * | 2006-03-09 | 2007-09-12 | 京东方科技集团股份有限公司 | LED back light module |
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2011
- 2011-04-12 CN CN2011100916404A patent/CN102738375A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622346A (en) * | 2003-11-25 | 2005-06-01 | 诠兴开发科技股份有限公司 | High thermal conductivity PCB type surface binding light emitting diode |
| CN1702141A (en) * | 2004-05-25 | 2005-11-30 | 安捷伦科技有限公司 | Mold compound with fluorescent material and a light-emitting device made therefrom |
| CN1649182A (en) * | 2005-03-02 | 2005-08-03 | 友达光电股份有限公司 | Light emitting diode light source module |
| CN101022144A (en) * | 2006-02-15 | 2007-08-22 | 深圳市量子光电子有限公司 | Large power light-emitting diode |
| CN101034231A (en) * | 2006-03-09 | 2007-09-12 | 京东方科技集团股份有限公司 | LED back light module |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10893924B2 (en) | 2015-02-27 | 2021-01-19 | Colgate-Palmolive Company | Oral treatment system |
| CN105957943A (en) * | 2016-06-17 | 2016-09-21 | 深圳市兆驰节能照明股份有限公司 | Chip-level packaging light-emitting device and manufacturing method thereof |
| CN105938869A (en) * | 2016-06-21 | 2016-09-14 | 深圳市兆驰节能照明股份有限公司 | Double-layer chip scale package (CSP) light source and manufacturing method thereof |
| CN110660891A (en) * | 2018-06-29 | 2020-01-07 | 合肥彩虹蓝光科技有限公司 | Flip-chip device packaging method and structure |
| CN109256051A (en) * | 2018-09-20 | 2019-01-22 | 深圳市海讯高科技术有限公司 | A kind of COB display screen and its packaging method |
| CN109599474A (en) * | 2018-12-25 | 2019-04-09 | 江苏罗化新材料有限公司 | A kind of the CSP packaging method and its encapsulating structure of LED chip |
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Application publication date: 20121017 |