CN105969242B - Conductive adhesive oxidant layer, electroconductive adhesive sheet, printing distributing board and e-machine - Google Patents
Conductive adhesive oxidant layer, electroconductive adhesive sheet, printing distributing board and e-machine Download PDFInfo
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- CN105969242B CN105969242B CN201610556878.2A CN201610556878A CN105969242B CN 105969242 B CN105969242 B CN 105969242B CN 201610556878 A CN201610556878 A CN 201610556878A CN 105969242 B CN105969242 B CN 105969242B
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- conductive adhesive
- oxidant layer
- adhesive oxidant
- conductive
- layer
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- 239000003054 catalyst Substances 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229920005680 ethylene-methyl methacrylate copolymer Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical class C1(C=CC(N1*)=O)=O 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 150000007974 melamines Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- SPIGUVVOJXSWNX-UHFFFAOYSA-N n-(oxomethylidene)thiohydroxylamine Chemical group SN=C=O SPIGUVVOJXSWNX-UHFFFAOYSA-N 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000004893 oxazines Chemical class 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- FTDXCHCAMNRNNY-UHFFFAOYSA-N phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1 FTDXCHCAMNRNNY-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229940068984 polyvinyl alcohol Drugs 0.000 description 1
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 1
- 229920002620 polyvinyl fluoride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- 125000003698 tetramethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229920006345 thermoplastic polyamide Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
The present invention provides that a kind of interim stickup is good, is difficult to generate adhesion and face face contiguity, have and the connection reliability after the good adhesive strength of metal reinforcing plate and Reflow Soldering also good conductive adhesive oxidant layer, and with its electroconductive adhesive sheet, printing distributing board and e-machine.The conductive adhesive oxidant layer (2) of the present invention is formed in the conductive adhesive oxidant layer (2) used in fissility film (1), the surface roughness Ra of the face B of fissility film (1) side is 3 μm~6 μm, and the surface roughness Ra of the face A of opposite side is 0.2 μm~1.1 μm.
Description
Technical field
The present invention relates to a kind of conductive adhesive oxidant layer.Moreover, it relates to a kind of conductive adhesive phase
Electroconductive adhesive sheet, the printing distributing board and e-machine formed using it.
Background technology
With the further of the e-machines such as office automation (Office Automation, OA) machine, communicating machine
High performance, miniaturization, flexible printed wiring board (being expressed as below " FPC (FlexiblePrinted Circuit) ") are effective
Ground utilizes its flexural property, and is used for such as electronic circuit is assembled to the narrow and complicated internal base plate of e-machine
In.Usually using the FPC for being provided with the electromagnetic wave shielding of electromagnetic wave caused by masking in the electronic circuit.With in recent years
The miniaturization of high frequency and the electronic circuit caused by information content increase of the electronic circuit come, the importance of electromagnetic wave countermeasure
It further increases.
As the FPC with electromagnetic wave shielding, announcement has a kind of utilization conductive adhesive by metal reinforcing plate with connecing
The structure (patent document 1, patent document 2) that ground circuit is connected.Specifically, in order to obtain electromagnetic wave shielding performance and stabilization
Ground transmitting circuit signal is attached the metal reinforcing plate comprising metals such as stainless steels and FPC using electroconductive adhesive sheet, and via
Conductive adhesive oxidant layer makes metal reinforcing plate be electrically connected with each other with earthed circuit.
[existing technical literature]
[patent document]
[patent document 1] International Publication No. 2014/010524
[patent document 2] Japanese Patent Laid-Open 2014-065912 bulletins
Invention content
[problem to be solved by the invention]
Usually conductive adhesive is laminated on the single side of the release-treated fissility film of two interareas in electroconductive adhesive sheet
Laminated body is made, and be wound into web-like in layer, and when use winds off from roller.When being wound off from roller, in conductive adhesive
The phenomenon that being attached to each other between piece, so-called adhesion phenomenon become problem.In addition, it is glued by metal reinforcing plate and FPC with electric conductivity
Mixture layer is with semi-hardened state (state that electroconductive adhesive sheet partly hardens, the whole state do not hardened fully.Also referred to as
B-stage (B-Stage)) fitting (step is known as interim paste), heating crimping is then carried out, and make conductive adhesive oxidant layer
In the step of fully hardening, since the adhesive strength under semi-hardened state is insufficient, there are the interim of generation position offset
The problem of stickup property.And then in the case where the conductive adhesive oxidant layer of electroconductive adhesive sheet is in contact with each other, there are electric conductivity to glue
The problem of surface-to-surface contiguity that mixture interlayer touches without peeling.
On the other hand, it in the installation steps of electronic component, such as is engaged extensively using the solder such as Reflow Soldering.At this
In Reflow Soldering, electronic component is mounted in advance by printing or being coated with the rule to be formed on the printing distributing board of solder part
After positioning is put, printing distributing board is heated to 230 DEG C~280 DEG C left sides together with electronic component using infrared ray reflux etc.
It is right.Make melt solder as a result, and electronic component is engaged with printing distributing board.It is used for and wiring base when by conductive adhesive
Plate when bonding when, the hardening thing of the conductive adhesive is also exposed in hot environment as described above in Reflow Soldering.Cause
This, the hardening thing of conductive adhesive is also required to high-fire resistance.But it can not be solved in the patent document 1, patent document 2
Certainly described problem, and need to solve the problems, such as these technology.
The purpose of the present invention is to provide a kind of interim stickup property it is good, be difficult to generate adhesion and surface-to-surface contiguity, have with
Connection reliability after the good adhesive strength of metal reinforcing plate and Reflow Soldering also good conductive adhesive oxidant layer and
With its electroconductive adhesive sheet, printing distributing board and e-machine.
[technical means to solve problem]
The conductive adhesive oxidant layer of the present invention is formed in the conductive adhesive oxidant layer used in fissility film, finds
Including at least in the laminated body of conductive adhesive oxidant layer and fissility film, by the conductive adhesive of the side with fissility film opposite direction
Layer face B and opposite side conductive adhesive oxidant layer face A (by during laminated body wound into rolls with the stripping of other laminated bodies
Property film contact face) surface roughness Ra control respectively in a specific range, thus can to solve the problem, so as to complete
The present invention.
That is, the present invention relates to a kind of conductive adhesive oxidant layer, it is formed in fissility film to use, fissility film side
The surface roughness Ra of face B is 0.2 μm~1.1 μm, and the surface roughness Ra of the face A of opposite side is 3 μm~6 μm.In other words, originally
Invention is related to a kind of conductive adhesive oxidant layer, in laminated body that the opposite direction of the conductive adhesive oxidant layer with fissility film opposite direction is main
The surface roughness Ra in face is set as 0.2 μm~1.1 μm, by the rough surface of the non-opposite interarea with the opposite interarea opposite side
Degree Ra is set as 3 μ n~6 μm.
Moreover, it relates to the conductive adhesive oxidant layer, 85 ° of gloss values of the face A of opposite side are 0.5~5.
Moreover, it relates to the conductive adhesive oxidant layer, 85 ° of gloss values of the face B of fissility film side for 30~
120。
Moreover, it relates to the conductive adhesive oxidant layer, thickness is 30 μm~70 μm.
Moreover, it relates to the conductive adhesive oxidant layer, glass transition temperature (Tg) is 0 DEG C~80 DEG C.
Moreover, it relates to the conductive adhesive oxidant layer, conductive adhesive oxidant layer is by including thermosetting resin, hard
The conductive resin composition of agent and conductive particle is formed.
Moreover, it relates to a kind of electroconductive adhesive sheet, has the conductive adhesive oxidant layer in fissility film.
Moreover, it relates to a kind of printing distributing board, including the wiring base with signal wiring and insulating properties base material
Plate and the conductive adhesive oxidant layer.
Moreover, it relates to the printing distributing board, further includes metal reinforcing plate.
Moreover, it relates to a kind of e-machine, including the printing distributing board.
[The effect of invention]
According to the present invention, following excellent effect is obtained：One kind can be provided, and stickup property is good temporarily, is difficult to generate adhesion
And surface-to-surface contiguity, have and the connection reliability after the good adhesive strength of metal reinforcing plate and Reflow Soldering is also good leads
Conductive adhesive layer and with its electroconductive adhesive sheet, printing distributing board and e-machine.
Description of the drawings
Fig. 1 is the bonding for wiring substrate and metal reinforcing plate for representing the electroconductive adhesive sheet using this implementation form
The schematic diagram of step.
Fig. 2 is the schematic diagram of the resistance to adhesion test in A faces.
Fig. 3 is the schematic diagram of the interim stickup property experiment in A faces.
Fig. 4 (a) to Fig. 4 (f) is the schematic diagram of connection reliability experiment.
Reference numeral：
1：Fissility film
2：Conductive adhesive oxidant layer
2-A：The A faces of conductive adhesive oxidant layer
2-B：The B faces of conductive adhesive oxidant layer
3：Electroconductive adhesive sheet
4：Metal reinforcing plate
5：The laminated body of metal reinforcing plate and conductive adhesive oxidant layer
20：Wiring substrate
21、24、31：Polyimide film
22：Insulating properties adhesive phase
23：Polyimide cover layer
25：Signal circuit
26：Earthed circuit
27、34：Through-hole
32A、32B：Copper foil circuit
33：Cover film
41：Glass plate
42：Sliding weight of steelyard
43：PET film
44：Acrylic acid adhesion coating
Specific embodiment
Hereinafter, for conductive adhesive oxidant layer, electroconductive adhesive sheet and the printing distributing board of the present invention, explain in detail suitable
Suitable embodiment.Furthermore the numerical value such as surface roughness Ra specific in the present specification, gloss value, thickness, Tg refer to pass through
Value in aftermentioned embodiment or embodiment calculated by recorded method.
<Electroconductive adhesive sheet>
The electroconductive adhesive sheet of this implementation form is included in the layer that conductive adhesive oxidant layer is at least laminated in fissility film
Stack.The laminated body is usually wound into web-like, winds off when in use.Conductive adhesive oxidant layer will be aftermentioned.
<Conductive adhesive oxidant layer>
The conductive adhesive oxidant layer of this implementation form is formed in fissility film to use.Fissility film is by electric conductivity
Adhesive phase is attached in bonded body temporarily after, usually it is stripped.It, will be with stripping in the laminated body of conductive adhesive oxidant layer
The surface of the interarea, i.e. the face B (hereinafter, being only denoted as " B faces " sometimes) of the conductive adhesive oxidant layer of fissility film side of property film opposite direction
Roughness Ra is set as 0.2 μm~1.1 μm, will be as the face A of the conductive adhesive oxidant layer of the opposite side in the face of the opposite side of face B
(the face of side Chong Die with the fissility film of other laminated bodies during wound into rolls.Hereinafter, being only denoted as " A faces " sometimes) rough surface
Degree Ra is set as 3 μm~6 μm.
Conductive adhesive oxidant layer may include the individual layer of conductive and adhesiveness layer (hereinafter also referred to as adhesive layer),
It can also be set as being laminated with the stepped construction of functional layer on the adhesive layer.Functional layer can be conductive or exhausted
Edge.As functional layer, can illustrate：Adhesion coating, oxygen barrier, water vapor barrier layer, abrasion performance layer, bonding help layer (so-called
Easy adhesive phase, improve the layer of the adhesiveness of adhesive phase) etc..The thickness of functional layer is simultaneously not limited, but is 0.01 μm~10 μ
M or so.That is, the conductive adhesive oxidant layer of this implementation form, which has, shows adhesive layer of the electric conductivity as main function, it can
Functional layer is laminated without departing from the spirit and scope of the invention.In the range of the condition is met, conductive adhesive oxidant layer
Stacking composition during with stepped construction is not particularly limited.Such as functional layer can be set in most surface.It in addition, can be in function
Setting shows the adhesive layer of electric conductivity on two interareas of layer.When conductive adhesive oxidant layer has stepped construction, most surface
Surface roughness must satisfy the range.In other words, when the most surface in A faces becomes functional layer, the most surface of functional layer
Surface roughness Ra must satisfy 3 μm~6 μm of range.In addition, when the most surface layer in B faces becomes functional layer, the functional layer
The surface roughness Ra of most surface must satisfy 0.2 μm~1.1 μm.It is described when carrying out reflow process in subsequent step
Functional layer considers connection reliability to select.
The A faces of conductive adhesive oxidant layer and the difference of the surface roughness Ra in B faces are preferably 1.9~5.8.By by electric conductivity
The A faces of adhesive phase and the Ra in B faces are controlled in particular range respectively, can control the contact area of film surface, therefore work as and wind off
During the electroconductive adhesive sheet of web-like, the adhesion in A faces can inhibit.In addition, in behind the step of, the surface-to-surface that can inhibit in B faces is close
It connects.
[surface roughness Ra]
Conductive adhesive oxidant layer at least has aftermentioned comprising thermosetting resin, curing agent and conductive particle
Formed adhesive phase is dried after being coated in fissility film in conductive resin composition.Conductive adhesive oxidant layer preferably becomes
It is used into the product form of electroconductive adhesive sheet.At this point, at product form time point, the electric conductivity in electroconductive adhesive sheet is glued
Mixture layer is the semi-hardened state (B-stage) that curing agent is partly reacted with thermosetting resin.
The A faces of conductive adhesive oxidant layer and the surface roughness Ra in B faces are by measuring the rough surface of the most surface in each face
It spends to be obtained.Specifically, when conductive adhesive oxidant layer includes the individual layer of adhesive phase, A faces are obtained conductive adhesive
The surface roughness of formed conductive adhesive oxidant layer is dried in agent after being coated in fissility film.Work as conductive adhesive
When the A faces of layer are functional layer (when the most surface of A surface sides is functional layer), asked by measuring the surface roughness of the functional layer
Go out.Therefore, the A bread stated below is containing both described surface.
In addition, the surface roughness Ra in the B faces of conductive adhesive oxidant layer is by being directed to the A faces of conductive adhesive oxidant layer
It is laminated on polyimide film etc., carries out paste temporarily after, the face B that fissility film is removed and is exposed measures surface roughness
Ra is obtained.That is, the surface roughness in the B faces of the conductive adhesive oxidant layer of fissility film side is as the state after interim paste
Semi-hardened state (B-stage) when surface roughness.In addition, when B faces are functional layer (when the most surface of B surface sides is function
During layer), it is obtained by measuring the surface roughness of the functional layer.Therefore, the B bread stated below is containing both described table
Face.
As the condition of lamination, such as using hot roll laminator, with 90 DEG C, 3kgf/cm2Condition glued temporarily
Patch.
[gloss value]
The gloss value in the A faces of the conductive adhesive oxidant layer of this implementation form is preferably set to 0.5~5.By being set as the range,
The concave-convex degree on the surface in the A faces of conductive adhesive oxidant layer moderately becomes larger, for fissility film or metal reinforcing plate and FPC
The contact area of essence is reduced, therefore resistance to blocking improves.More preferable 1~3.
The gloss value preferably 30~120 in the B faces of conductive adhesive oxidant layer.By being set as the range, surface-to-surface contiguity can be promoted
Property.More preferable 40~100.
In order to the A faces of conductive adhesive oxidant layer assign as defined in surface roughness Ra or gloss value, such as can illustrate with
Under method.
Such as the electrically conductive microparticle that average particle size distribution D90 is 5 μm~120 μm is included by conductive resin composition
Son, until the protrusion of conductive particle easily projects to the surface section in A faces of conductive adhesive oxidant layer, and can be in surface section shape
Into bumps.In addition, as other methods, by implementing mechanical grinding to the conductive adhesive layer surface being formed in fissility film
The processing such as mill can adjust surface roughness and gloss value.In addition, by the way that appropriate delustering agent is added to electroconductive resin group
It closes in object, bumps can also be formed in conductive adhesive layer surface.The method for assigning surface roughness and gloss value can be one
Kind arbitrarily combines.
The delustering agent appropriately inorganic compound or organic compound.As inorganic compound, can enumerate：Titanium dioxide
Silicon, aluminium oxide, aluminium hydroxide, magnesium hydroxide, barium sulfate, calcium carbonate, titanium oxide, zinc oxide, antimony trioxide, magnesia, talcum,
Montmorillonite, kaolin, bentonite etc..In addition, as organic compound, can enumerate：Polyethylene, polypropylene, polytetrafluoroethylene (PTFE)
(Polytetrafluoroethylene, PTFE) etc..Among these compounds, more preferably make the silanol group of silica surface
The hydrophobic silica reacted is carried out with halogenated silane.
Relative to 100 mass parts of thermosetting resin, delustering agent preferably allocates the mass parts of 7 mass parts~50, and more preferable 15
The mass parts of mass parts~40.By allocating the mass parts of 7 mass parts~50, resistance to blocking can be kept, and make temporarily stickup property become
Well.
For surface roughness Ra or gloss value as defined in being assigned to the B faces of conductive adhesive oxidant layer, such as can illustrate such as
The following method.
It is concave-convex to be formed on the lift-off processing face of fissility film by blasting treatment, mechanical lapping etc. in advance.By
Conductive adhesive oxidant layer is formed on the surface, the bumps of fissility film can be transferred in conductive adhesive layer surface, and is assigned
Surface roughness and gloss value as defined in giving.
[film thickness]
Preferably 30 μm~70 μm, more preferable 35 μm~65 μm of the thickness of conductive adhesive oxidant layer.By the way that thickness is set as 30 μ
The range of m~70 μm can make the good connection resistance value after Reflow Soldering and resistance to blocking and deposit.
The survey that the assay method of the thickness of conductive adhesive oxidant layer can be observed by using the film thickness gauge and section of contact
Amount etc. measures.In the present invention, it is set as the value calculated by using the method described in embodiment.
[glass transition temperature (Tg)]
Preferably 0 DEG C~80 DEG C, more preferable 10 DEG C~70 DEG C of the glass transition temperature (Tg) of conductive adhesive oxidant layer.Pass through
The glass transition temperature of conductive adhesive oxidant layer is set as 80 DEG C hereinafter, interim to carry out for example when the heat lamination by 90 DEG C
During stickup, the mobility of conductive adhesive oxidant layer is temporarily increased, and interim stickup property is promoted.In addition, by being set as 0 DEG C or more, it can
The mobility of conductive adhesive oxidant layer during inhibition cold insulation, therefore resistance to blocking can be promoted.
[conductive resin composition]
It is preferable to use by micro- comprising thermosetting resin, curing agent and electric conductivity for the conductive adhesive oxidant layer of this implementation form
The adhesive phase with conductive characteristic that the conductive resin composition of particle is formed.Conductive adhesive is just effectively given play to
For the viewpoint of the function of oxidant layer, conductive adhesive oxidant layer preferably only includes having containing the conductive resin composition and leads
The adhesive phase of electrical characteristics.
(thermosetting resin)
Thermosetting resin is that have multiple resins that can be used for the functional group by heating caused cross-linking reaction.Function
Base can for example be enumerated：Hydroxyl, phenolic hydroxyl group, carboxyl, amino, epoxy group, oxetanylmethoxy, oxazoline group, oxazines base, aziridine
Base, mercapto, isocyanate group, block type isocyanate group, silanol group.
Thermosetting resin with the functional group can for example be enumerated：Acrylic resin, malein acid ester resin, poly- fourth
Diolefin resins, polyester resin, condensed type polyester resin, add-on type polyester resin, melmac, polyurethanes tree
Fat, polyurethanes carbamide resin, epoxy resin, oxetane resin, phenoxy resin, polyimide resin, polyamide
Resin, polyamide-imide resin, phenol resin, alkyd resin, amino resins, polylactic resin, oxazoline resin, benzo are disliked
Piperazine resin, silicone resin, fluororesin.Among these resins, preferably polyurethane resin, polyurethanes carbamide resin,
Epoxy resin, add-on type polyester resin, polyimide resin, polyamide, polyamide-imide resin.
In this embodiment, in addition to thermosetting resin, thermoplastic resin can and be used.As the thermoplastic resin
Fat can be enumerated：Polyolefin-based resins, vinyl resin without the hardenability functional group, styrene acrylic system
Resin, terpene resin, Petropols, cellulose-based resin, polyamide, polyurethane resin, gathers diolefin resins
Ester resin, polycarbonate resin, polyimides system resins, fluororesin etc..
Homopolymers or the copolymers such as the polyolefin-based resins optimal ethylene, propylene, alpha-olefin compound.Specifically,
It can enumerate：Skep, olefin series thermoplastic elastomer, alpha-olefine polymers etc..
The polymer and ethylene that the vinyl resin is preferably obtained by the polymerization of the vinyl acetates such as vinyl acetate
The copolymer of the olefin(e) compounds such as ester and ethylene.Specifically, it can enumerate：It is vinyl-vinyl acetate copolymer, partly-hydrolysed poly-
Vinyl alcohol etc..
Styrene acrylic system resin preferably comprises styrene, (methyl) acrylonitrile, acrylic amide, (methyl)
The homopolymer or copolymer of acrylate, maleimide class etc..Specifically, it can enumerate：Syndiotactic polytyrene, poly- third
Alkene nitrile, acrylic copolymer, ethylene methyl methacrylate copolymer etc..
The preferred butadiene of the diolefin resins, the homopolymer of isoprene equiconjugate diolefin compound or copolymer and
Their hydride.Specifically, it can enumerate：SBR styrene butadiene rubbers, styrene-isoprene block copolymer etc..Terpene
Olefine resin preferably comprises the polymer or its hydride of terpenes.Specifically, it can enumerate：Aromatic modified terpene resin, terpene
Alkene phenol resin, hydrogenated terpene resin.
The preferred dicyclopentadiene-type Petropols of the petroleum line resin, hydrogenated petroleum resin.Cellulose-based resin is preferred
Cellulose acetate-butyrate resin.The preferred bisphenol-a polycarbonate of polycarbonate resin.Polyimides system resins preferred thermoplastic polyamides
Imines, polyamide-imide resin, polyamic acid polyimide type resin.
(curing agent)
Curing agent can be in order to play by cross-linking reaction to form conductive adhesive oxidant layer time-varying into semi-hardened state
Function, but can not also such as be reacted when forming electroconductive adhesive sheet suitable for selection, and to wiring substrate or metal reinforcing plate
Carried out during heating crimping the curing agent of sclerous reaction.Curing agent can be enumerated：Epoxy based compound, the hardening of isocyanates system
Agent, amine system curing agent, aziridine system curing agent, imidazoles system curing agent.
As the epoxide, such as preferred diglycidyl ether type epoxy compound, glycidyl amine epoxy
Close object, glycidyl ester type epoxy compound, annular aliphatic (alicyclic ring type) epoxide.
As the diglycidyl ether type epoxy compound, such as can enumerate：Bisphenol A type epoxy compound, Bisphenol F type ring
Oxygen compound, bisphenol S type epoxy compound, bisphenol-A D-ring oxygen compound, cresol novolak type epoxy compound, phenol phenol
Novolac type ring oxygen compound, alpha-Naphthol novolak type epoxy compounds, bisphenol A-type novolak type epoxy compounds, two
Cyclopeutadiene type epoxide, tetrabromobisphenol A type ring oxygen compound, brominated phenol novolak type epoxy compounds, three (contractings
Water glycerine phenyl) methane, four (glycidoxypropyl phenyl) ethane.
As the glycidyl amine epoxy compound, such as can enumerate：Four glycidyl group diamino-diphenyl first
Alkane, triglycidyl group para-aminophenol, triglycidyl meta-aminophenol, four glycidyl group m-xylene diamine.
As the glycidyl ester type epoxy compound, such as can enumerate：O-phthalic acid diglycidyl ester, hexahydro
O-phthalic acid diglycidyl ester, tetrahydrophthalic acid 2-glycidyl ester.
As the annular aliphatic (alicyclic ring type) epoxide, such as can enumerate：Epoxycyclohexyl-methyl-epoxide ring
Cyclohexane carboxylic-acid ester, bis- (epoxycyclohexyl) adipate esters.
Isocyanates system curing agent can for example be enumerated：Toluene di-isocyanate(TDI), methyl diphenylene diisocyanate, six
Methylene diisocyanate, isophorone diisocyanate, eylylene diisocyanate, dicyclohexyl methyl hydride diisocyanate
Ester, 1,5- naphthalene diisocyanates, tetramethyl xylylen diisocyanate, trimethyl hexamethylene diisocyanate.
The amine system curing agent can for example be enumerated：Diethylenetriamine, three second tetramines, di-2-ethylhexylphosphine oxide (2- chloroanilines), methylene
Bis- (2- methyl -6- methylanilines), 1,5- naphthalene diisocyanates, normal-butyl benzyl phthalic acid.
Aziridine system curing agent can for example be enumerated：- three-β of trimethylolpropane-'-aziridino propionic ester, four hydroxyl first
- three-β of methylmethane-'-aziridino propionic ester, N, N '-diphenyl methane -4,4 '-bis- (1- aziridine Carboxylamides), N, N '-six
Methylene -1,6- is bis- (1- aziridine Carboxylamide).
Imidazoles system curing agent can for example be enumerated：2-methylimidazole, 2- heptadecyl imidazoles, 2- phenyl -4- methyl miaows
Azoles, 1- cyano ethyl -2- undecyl imidazole trimellitic acid salt.
Relative to 100 mass parts of thermosetting resin, curing agent preferably allocates the mass parts of 0.3 mass parts~80 respectively, more
It is preferred that 1 mass parts~50 mass parts.By allocating the mass parts of 0.3 mass parts~80, electroconductive adhesive sheet can be made after semi-harden
It is difficult to flow, therefore easily inhibits adhesion.
(conductive particle)
Conductive particle preferably conductive metals and its alloy and electric conductive polymer such as gold, platinum, silver, copper and nickel,
The particulate of the nano-carbon materials such as carbon nanotube, graphene, graphite etc..In addition, in terms of reducing costs, it preferably will be golden
Belong to or resin is as nucleome, and using electric conductivity higher than the clad on the surface of the raw material formation cladding nucleome of nucleome
The particulate of composite microparticle rather than single composition.Nucleome is preferably selected from nickel, silica, copper and resin, is more preferably led
Electrical metal and its alloy.
As long as the conductive raw material of clad, preferably conductive metal or electric conductive polymer.It is conductive
Property metal can for example be enumerated：Gold, platinum, silver, tin, manganese and indium etc. and its alloy.In addition, electric conductive polymer can enumerate polyphenyl
Amine, polyacetylene etc..It is preferably silver-colored in terms of electric conductivity among these.
Conductive particle can be used alone, can also and with two or more.
Composite microparticle has cladding preferably with respect to 100 mass parts of nucleome, with the ratio of the mass parts of 1 mass parts~40
Layer, the mass parts of more preferable 5 mass parts~30.If being coated with the mass parts of 1 mass parts~40, electric conductivity can be maintained on one side,
It further reduces the cost on one side.Furthermore the preferred clad of composite microparticle fully covers nucleome.But it there are in fact core
The situation that a part for body is exposed.In this case, if conductive material covers more than 70% core surface area, hold
Easily maintain electric conductivity.
As long as the shape of conductive particle can obtain desired electric conductivity, shape is simultaneously not limited.Such as preferably
Spherical, laminar, lobate, dendroid, plate, needle-shaped, rodlike, botryoidalis.Furthermore in order to efficiently form metal reinforcing plate
The guiding path of longitudinal direction between wiring substrate, more preferable spherical and dendroid.
The preferred D90 average grain diameters of average grain diameter of conductive particle are 1 μm~120 μm, more preferable 5 μm~60 μm.It is logical
It crosses D90 average grain diameters to be in the range of 1 μm~120 μm, the adhesion in the A faces of conductive adhesive oxidant layer becomes excellent.Furthermore
D90 average grain diameters can be obtained by laser diffraction scattering method particle size distribution device.
Relative to 100 mass parts of thermosetting resin, conductive particle preferably allocates the mass parts of 50 mass parts~1500,
The mass parts of more preferable 100 mass parts~1000.
The adjustable solvent of conductive resin composition, heat-resisting stabilizing agent, pigment, dyestuff, adhesion in this implementation form are assigned
Resin, plasticiser, silane coupling agent, ultra-violet absorber, antifoaming agent, levelling regulator etc. is given to be used as any other ingredient.
Each ingredient can be mixed and be stirred and obtain by conductive resin composition.Existing stir can be used in stirring
Mix device, usually high speed dispersor (Dispermat), but homogenizer (Homogenizer) it is also preferred that.
Such as utilize cutter painting, die coating, lip type coating, roller coating, honest and clean painting, rod coating, intaglio plate coating, the coating of soft version, dip-coating, spray
It applies and the method for spin coating is by release surface of the conductive resin composition coated in fissility film, be heated commonly to 40 DEG C
Thus~200 DEG C of temperature removes the volatile ingredients such as solvent, and can form the conductive adhesive of conductive adhesive phase
Piece.
[fissility film]
As long as fissility film has carried out one or two sides the film of demoulding processing, then can unlimitedly use.
An example of base material as fissility film can be enumerated：Polyethylene terephthalate, polyethylene naphthalate,
Polyvinyl fluoride, polyvinylidene fluoride, Hard PVC, polyvinylidene chloride, nylon, polyimides, polystyrene, polyethylene
Alcohol, ethylene-vinyl alcohol copolymer, makrolon, polyacrylonitrile, polybutene, soft PVC, polyvinylidene fluoride, poly- second
Plastic sheet of alkene, polypropylene, polyurethanes, vinyl-vinyl acetate copolymer, polyvinyl acetate etc. etc., glassine paper,
The stationeries such as glazed printing paper (woodfree paper), brown paper, coating paper, various non-woven fabrics, synthetic paper, metal foil or by they
Composite membrane being composed etc..
The surface of fissility film can optionally carry out delustring processing.Delustring processing can be enumerated：Sand delustring, applies etching delustring
Cloth delustring, mediates delustring etc. at chemical quenching.
Releasing agent can be coated on base material and obtain by fissility film.As releasing agent, can be used：Polyethylene, polypropylene
Wait hydrocarbon systems resin, higher fatty acids and its metal salt, higher fatty acids soap, wax, animal and plant fat, mica, talcum, silicone-based table
Face activating agent, silicone oil, silicone resin, fluorine system surfactant, fluororesin, the silicone resin containing fluorine, melamine series resin,
Acrylic resin etc..As the coating method of releasing agent, previous existing mode, such as plate gravure coating method, kiss can be passed through
Close coating method, die coating mode, lip type coating method, unfilled corner wheel coating method, blade coating method, roll coating model, cutter painting side
Formula, spraying method, rod coating mode, spin coating mode, dip coating manner etc. carry out.
<Printing distributing board>
The printing distributing board of this implementation form preferably include the wiring substrate at least with signal wiring and insulating properties base material,
Conductive adhesive oxidant layer, optionally including metal reinforcing plate.The crimping of metal reinforcing plate can be for example enumerated to wiring substrate with leading
Conductive adhesive layer and metal reinforcing plate carry out overlapping crimping, the method for then installing electronic component, but the sequence crimped has no
It limits.
When conductive adhesive oxidant layer includes thermosetting resin, for promoting the viewpoint of hardening, the crimping is special excellent
Choosing is carried out at the same time heating.On the other hand, even if in the case where conductive adhesive oxidant layer includes thermoplastic resin, it is also preferred that carrying out
Heating, reason are：Contiguity easily becomes secured.Preferably 150 DEG C~180 DEG C or so of temperature during heating, pressure during crimping
The preferred 3kg/cm of power2~30kg/cm2Left and right.Tablet press-connection machine or roll-in can be used to pick for compression bonding apparatus, and be crimped when using tablet
During machine, due to can fixed pressure be applied regular time, preferably.As long as crimp time wired circuit board, conduction
Property bonding sheet and metal reinforcing plate are fully touched, therefore be not particularly limited, but usually 1 minute~1 hour or so.
When crimping the time in short-term, formally hardened with 30 minutes~1 hour using 150 DEG C~180 DEG C of baking oven preferably after crimping.
[metal reinforcing plate]
Metal reinforcing plate can for example be enumerated：The conductive metals such as gold, silver, copper, iron and stainless steel.Among these, with regard to conduct
For in terms of the intensity of reinforcing plate, cost and chemical stability, preferred stainless steel.The thickness of metal reinforcing plate is usually 0.04mm
~1mm or so.
Metal reinforcing plate is preferably formed with nickel layer in the whole surface of metallic plate.Nickel layer preferably by electrolytic ni plating method come
It is formed.The thickness of nickel layer is 0.5 μm~5 μm or so, more preferable 1 μm~4 μm.
[manufacturing method of printing distributing board]
Using Fig. 1, together with step a~step d to the manufacturing method of printing distributing board and conductive adhesive oxidant layer
The face B of fissility film side and the face A of opposite side are illustrated.
In the part wound off from roller, the face (face with the back side side contacts of fissility film) that is not contacted with fissility film
For A faces (2-A of Fig. 1), after A faces are fitted on other base materials, the face that fissility film is removed and exposed is equivalent to B faces (Fig. 1
2-B).
As the manufacturing method of printing distributing board, the method that can be listed below etc.：Electroconductive adhesive sheet is pasted onto temporarily
Laminated body is formed in metal reinforcing plate, be attached to the laminated body at least has signal wiring and insulating properties base material thereafter
On wiring substrate, thus to obtain printing distributing board.
" step a "
It is rolled into a roll to remove when by the electroconductive adhesive sheet 3 for being laminated with conductive adhesive layer in fissility film 1
During fortune keeping, the A faces of conductive adhesive oxidant layer 2 are contacted with the fissility film of B surface sides.
" step b "
The electroconductive adhesive sheet 3 of web-like is wound off and cuts into defined size.The A faces of conductive adhesive oxidant layer 2 need
Resistance to blocking.
" step c "
Step c is that electroconductive adhesive sheet is pasted onto temporarily in metal reinforcing plate and forms laminated body, thereafter by the layer
Stack, which is attached at least, to be had on signal wiring and the wiring substrate of insulating properties base material, thus to obtain the method for printing distributing board.
<Step c-1>First, the A faces (2-A) of the conductive adhesive oxidant layer 2 in electroconductive adhesive sheet 3 and metal are enhanced
Plate 4 is bonded.At the time point, conductive adhesive oxidant layer 2 is semi-hardened state, A faces and metal reinforcing plate need to prevent by
The floating after floating or cutting off processing when fissility film 1 is removed is drawn with the floating in the laminating step of wiring substrate 20
The adhesive strength (stickup property temporarily) of the position offset risen.
<Step c-2>Fissility film 1 is removed and exposes B faces (2-B).Thereafter, cutting off processing is into defined size.
<Step c-3>Cutting off processing is into the conductive adhesive oxidant layer 2 of defined size and the laminated body 5 of metal reinforcing plate 4
Be fitted in (step c-4) behind on wiring substrate 20, but before this in a period of, protected in the form of laminated body 5
Pipe, transport.It is interior during this period, multiple major parts are accommodated in container, because vibrated etc., the B of conductive adhesive oxidant layer 2
The very high frequency that face (2-B) is in contact with each other and is overlapped.If the state that the B faces overlap each other continues, there are B faces to touch each other
(surface-to-surface contiguity) is without the situation of peeling, it is therefore desirable to the conductive adhesive oxidant layer without surface-to-surface contiguity.
<Step c-4>On the earthed circuit 26 of wiring substrate 20, B faces (2-B) side of laminated body 5 is pasted onto and set temporarily
It is equipped on the position of through-hole 27.
" step d "
Laminated body progress to metal reinforcing plate 4, conductive adhesive oxidant layer 2, wiring substrate 20 obtained in step c
Heating crimping, thus makes conductive adhesive oxidant layer 2 fully harden and bond metal reinforcing plate 4 and wiring substrate 20.It will lead
Conductive adhesive layer is embedded into the through-hole 27 being arranged on earthed circuit 26, and obtains earthed circuit 26 and metal reinforcing plate 3
It is electrically connected and assigns the printing distributing board for having electromagnetic wave shielding performance.
The printing distributing board of this implementation form can be mounted in such as mobile phone, smart mobile phone, notebook type individual calculus certainly
In the e-machines such as machine (Note PC), digital camera, liquid crystal display, can also suitably be mounted in automobile, electric car, ship,
In the transportation machines such as aircraft.
It, can be with low cost (because can inhibit the production yield of FPC by having the conductive adhesive oxidant layer of this implementation form
Decline) obtain the excellent e-machine of shielding character.
[embodiment]
Hereinafter, enumerate embodiment, comparative example to further illustrate the present invention, but the present invention be not limited to it is following
Embodiment.Furthermore following " part " and " % " is respectively the value based on " mass parts " and " quality % ".In addition, electrically conductive microparticle
The average grain diameter of son and the glass transition temperature (Tg) of conductive adhesive oxidant layer are measured by the following method.
<The average grain diameter of conductive particle>
Average grain diameter is to use laser diffraction scattering method particle size distribution device LS13320 (Beckman Kurts
(Beckman Coulter) company manufactures), and pass through cyclone drying powder sample module (tornado dry powder
Sample module) measure conductive particle and the numerical value of D90 average grain diameters that obtains, and in particle-size accumulation distribution
Accumulated value is 90% grain size.Furthermore the setting of refractive index is set as 1.6.
<The glass transition temperature (Tg) of conductive adhesive oxidant layer>
The measure of glass transition temperature (Tg) is manufactured using plum Teller-support benefit (Mettler Toledo) (share)
" DSC (Differential Scanning Calorimeter analysis) -1 " carry out.
Material used in following presentation embodiment and comparative example.
<Thermosetting resin>
Carbamate resins 1：(thermosetting resin acid value=10mgKOH/g, amine value=0.1mgKOH/g) Japan
(Toyochem) company manufacture
Carbamate resins 2：(thermosetting resin acid value=10mgKOH/g, amine value=0.1mgKOH/g) Japan
Company manufactures
Carbamate resins 3：(thermosetting resin acid value=12mgKOH/g, amine value=0.4mgKOH/g) Japan
Company manufactures
Carbamate resins 4：(thermosetting resin acid value=14mgKOH/g, amine value=0.2mgKOH/g) Japan
Company manufactures
Carbamate resins 5：(thermosetting resin acid value=11mgKOH/g, amine value=0.1mgKOH/g) Japan
Company manufactures
Carbamate resins 6：(thermosetting resin acid value=16mgKOH/g, amine value=0.3mgKOH/g) Japan
Company manufactures
Carbamate resins 7：(thermosetting resin acid value=9mgKOH/g, amine value=0.2mgKOH/g) Japan
Company manufactures
<Conductive particle>
Conductive particle 1 (composite microparticle 1)：(copper to be used for the dendroid particle of clad for nucleome, by silver
D90 average grain diameter=20.8 μm) manufacture of Bo Fen industrial groups of FUKUDA METAL
Conductive particle 2 (composite microparticle 2)：(copper to be used for the dendroid particle of clad for nucleome, by silver
D90 average grain diameter=31.1 μm) manufacture of Bo Fen industrial groups of FUKUDA METAL
<Curing agent>
Curing agent 1 (epoxide)：" JER828 " (bisphenol A type epoxy resin epoxide equivalent=189g/eq) Mitsubishi
Company manufactures
Curing agent 2 (aziridine cpd)：The manufacture of catalyst company of " Kai meter Tai Te (Chemitite) PZ-33 " Japan
<Delustering agent>
Delustering agent：Silica " Ai Luoxier (AEROSIL) R972 " wins the manufacture of wound (EVONIK) company
<Fissility film>
Film A：Surface roughness Ra sand delustring is processed into 0.05 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm polyethylene terephthalate (Polyethylene terephthalate, PET) film
Film B：Surface roughness Ra sand delustring is processed into 0.2 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm of PET film
Film C：Surface roughness Ra sand delustring is processed into 0.4 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm of PET film
Film D：Surface roughness Ra sand delustring is processed into 0.7 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm of PET film
Film E：Surface roughness Ra sand delustring is processed into 0.9 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm of PET film
Film F：Surface roughness Ra sand delustring is processed into 1.0 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm of PET film
Film G：Surface roughness Ra sand delustring is processed into 1.2 μm and two sides has been carried out at stripping using alkyd amino
The thickness of reason is 50 μm of PET film
<Metal reinforcing plate>
The commercially available SUS304 plates that the thickness that surface is formed with the nickel layer that thickness is 2 μm is 0.2mm
The details of mechanical material used in the evaluation of following presentation embodiment and comparative example.
Layer of rolls press：The manufacture of small desk test laminating machine " SA-1010 " detection machine industry (Tester Sangyo) company
Fusion welding is bathed：" square solder bath POT100C " Tai Yang motors industry companies manufacture
Cupping machine：" small desk testing machine EZ-TEST " company of Shimadzu Seisakusho Ltd. manufactures
Grossmeters：" the miniature Grossmeters in BYK Gartners (Gardner micro-gloss) " Toyo Seiki company manufactures
Surface roughness meter：" husky husband khoum (SURFCOM) 480A " Tokyo Micronics Inc. manufactures
Resistance value analyzer：" Luo Laisita (Loresta) GPMCP-T600 " Mitsubishi Chemical Ind manufactures
[embodiment 1]
The conductive particle 1 of 100 parts of 1,400 part of carbamate resins is added in into container, with it is non-volatile into
The mode that point concentration becomes 40% adds toluene: isopropanol (mass ratio=2: mixed solvent 1) is simultaneously mixed.Then, add
Add the curing agent 2 of 40 parts of 1,1.0 part of curing agent and 20 parts of delustering agent and stirred 10 minutes using dispersion machine and make conduction
Property resin combination.
Using scraper, in a manner that dried thickness becomes 60 μm, the conductive resin composition obtained is applied
Drying in 2 minutes is carried out on the face through sand delustring processing of fissility film D, and using 100 DEG C of electric dry oven, thus to obtain conduction
Property bonding sheet.The thickness of the conductive adhesive oxidant layer of the electroconductive adhesive sheet obtained is 60 μm, the glass of conductive adhesive oxidant layer
Glass transition temperature is 50 DEG C.The surface of the electroconductive adhesive sheet, i.e., the face not contacted with fissility film D are A faces.
[2~embodiment of embodiment 19,1~comparative example of comparative example 4]
Except the change composition of conductive resin composition of embodiment 1 and blending amount (quality as described in table 1 or table 2
Part) with other than the thickness of conductive adhesive oxidant layer, the type of fissility film, carrying out, thus obtaining respectively similarly to Example 1
The electroconductive adhesive sheet of 2~embodiment of embodiment 19,1~comparative example of comparative example 4.
[embodiment 20]
Except on the electroconductive adhesive sheet obtained in example 2 and then with the epoxy insulating resin that film thickness is 1 μm
Other than layer, electroconductive adhesive sheet is made similarly to Example 2.Furthermore epoxy system resin layer is the functional layer for promoting adhesive,
The surface roughness of the face A of conductive adhesive oxidant layer in this case is the Ra values of epoxy insulating resin layer.
[table 1]
[table 2]
《The measure of the physics value of conductive adhesive oxidant layer》
For the conductive adhesive oxidant layer obtained, physics value is measured as follows.
<Surface roughness Ra>
Surface roughness Ra is according to JIS B0601 ' 2001, is measured with following condition.Ra refers to arithmetic average
Roughness Ra, and for through defined center line average roughness.
[Ra in the A faces of conductive adhesive oxidant layer]
With the measure of the surface roughness Ra of the face A (A faces) of the conductive adhesive oxidant layer of the back side side contacts of fissility film
The progress as following.Prepare the electroconductive adhesive sheet of width 10cm length 10cm, showed out with the A of conductive adhesive oxidant layer
Mode is placed on smooth glass plate, and by do not generate it is loose in a manner of be fixed using adhesive tape.Then, it is thick using surface
Roughnessmeter measures surface with the condition of finding speed 0.03mm/s, measured length 2mm, cutoff value (cutoff value) 0.8mm
Roughness Ra.The average value for changing the Ra at obtained 5 that locates is set as to the Ra in the A faces of conductive adhesive oxidant layer.
[Ra in the B faces of conductive adhesive oxidant layer]
The measure of the surface roughness Ra of the face B (B faces) of the conductive adhesive oxidant layer of fissility film side is carried out as following.
First, make in a contact fashion the A faces of the conductive adhesive oxidant layer in the electroconductive adhesive sheet of width 10cm length 10cm with
Polyimide film (" kapton (Kapton) 200EN " of the manufacture of Dong Li E.I.Du Pont Company) weight of width 12cm length 12cm
It is folded, and with 90 DEG C, 3kgf/cm2Condition carry out heated lamination and attach.Thereafter, fissility film is removed and glues electric conductivity
The B of mixture layer is showed out, and surface roughness Ra is measured with the condition identical with the A faces of conductive adhesive oxidant layer.
<85 ° of gloss values>
85 ° of gloss values are measured according to JIS 8741.Measure is the sample with measuring Ra using the Grossmeters
Similarly A faces and B faces are measured.
《The evaluation of conductive adhesive oxidant layer》
The evaluation of obtained conductive adhesive oxidant layer is carried out with following methods.It will be evaluation result is shown in table in 3.
<The resistance to blocking in the A faces of conductive adhesive oxidant layer>
If the resistance to blocking in the A faces of conductive adhesive oxidant layer is insufficient, when being wound off in the electroconductive adhesive sheet from web-like
When, the electroconductive adhesive sheet contacted with fissility film sticks together.
Prepare the electroconductive adhesive sheet of 2 width 10cm length 10cm, by the A faces of conductive adhesive oxidant layer such as Fig. 2
It overlaps on the fissility film surface of another electroconductive adhesive sheet.Utilize the glass of width 15cm length 15cm thickness 2mm
Plate 41 will sandwich up and down, be placed 24 hours in the environment of 50 DEG C after loading the sliding weight of steelyard 42 of 2kg.Thereafter, it is led from coincidence face stripping
Electrical bonding sheet, and resistance to blocking is evaluated by following benchmark.
++：(opposite fissility film surface and conductive adhesive layer surface during coincidence between the electroconductive adhesive sheet of superposition
Between) do not attach.It is excellent.
+：Floating is generated in a part for conductive adhesive oxidant layer.It can be practical.
NG：(opposite fissility film surface and conductive adhesive layer surface during coincidence between the electroconductive adhesive sheet of superposition
Between) attach, the part fracture of conductive adhesive oxidant layer.It can not be practical.
<The interim stickup property in the A faces of conductive adhesive oxidant layer>
If the interim stickup property in the A faces of conductive adhesive oxidant layer is insufficient, the electroconductive adhesive sheet attached is from regulation
Position on deviate, workability significantly declines.
With 90 DEG C, 3kgf/cm2Condition carry out heating roll laminating, and the electric conductivity of width 25mm length 100mm is glued
After the A face pastes of the conductive adhesive oxidant layer of conjunction piece are attached in the metal reinforcing plate 4 of width 30mm length 150mm, by fissility
Film is removed.The Japan for cutting into width 25mm length 150mm will be attached on the B faces for the conductive adhesive oxidant layer exposed
Acrylic acid series adhesive tape " DF715 " (35 μm/PET of acrylic acid adhesion coating, 50 μm/acrylic acid adhesion coating, 35 μ of company manufacture
M) 44, then attach 25 μm of PET films 43 be used as supporter be set as measure sample (Fig. 3).Using cupping machine, to stretch
Speed 50mm/min carries out T disbonded tests, and measures the adhesive strength between conductive adhesive oxidant layer and SUS plates.
++：Adhesive strength is more than 0.5N/cm.It is excellent.
+：Adhesive strength is more than 0.3N/cm, less than 0.5N/cm.It can be practical.
NG：The less than 0.3N/cm of adhesive strength.It can not be practical.
<The surface-to-surface adhesion in the B faces of conductive adhesive oxidant layer>
If the mutual adhesion in B faces of conductive adhesive oxidant layer, i.e. surface-to-surface adhesion are high, then for example when to identical
It is put into container in the part for being bonded conductive adhesive oxidant layer with metal reinforcing plate and the way transported, B faces are each other
The problem of during contiguity, generating and do not peeled off on the interface in B faces, and the part can not be used.
Using layer of rolls press, with 90 DEG C, 3kgf/cm2Condition by the electroconductive adhesive sheet of width 25mm length 25mm
In the A face pastes of conductive adhesive oxidant layer be attached on SUS plates.Thereafter, fissility film is removed and made the B of conductive adhesive oxidant layer
It shows out.Make another identical test film, the B faces for the conductive adhesive oxidant layer for making 2 test films are coincided with one another and
Winner is set as evaluation sample.Then, the sliding weight of steelyard of about 500g is placed in the evaluation with being put in the environment of 25 DEG C after on sample
It puts 24 hours.Both removed from coincidence face, and surface-to-surface adhesion is evaluated by following benchmark.
++：It easily peels off each other in the B faces of conductive adhesive oxidant layer.It is excellent
+：The mutual part in B faces of conductive adhesive oxidant layer attaches, if but light drawing, it peels off.It can be practical
NG：B faces attach and can not peel off each other.It can not be practical
<Connection reliability after Reflow Soldering>
In order to which metal reinforcing plate is made to show electromagnetic wave shielding performance, it is important that metal reinforcing plate is via conductive adhesive oxidant layer
And it is electrically connected with earthed circuit, and ensure guiding path.In general, when being connect with earthed circuit, to through being arranged on ground connection
Conductive adhesive is filled in the through-hole of coating on circuit, and is bonded, therefore ensures that conducting.If at this point, with connecing
There are the gaps such as bubble on the linkage interface of ground circuit, then foam after Reflow Soldering, and connection resistance value deteriorates and electromagnetic wave shielding
Property also deteriorates.
By the A faces of the conductive adhesive oxidant layer in the electroconductive adhesive sheet of width 15mm length 20mm and width 20mm
The SUS plates overlapping of length 20mm, using layer of rolls press with 90 DEG C, 3kgf/cm2, 1m/min condition attached and tried
Sample.
As shown in Fig. 4 (a), fissility film is removed from sample, using layer of rolls press with 90 DEG C, 3kgf/cm2、1m/
The B face pastes for the conductive adhesive oxidant layer exposed are attached to flexible printed wiring board (in the polyamides that thickness is 25 μm by the condition of min
Copper foil circuit 32A and copper foil circuit 32B that the thickness not being electrically connected mutually is 18 μm are formed in imines film 31, in copper foil electricity
It is laminated on the 32A of road and includes the thickness with adhesiveness as 37.5 μm, the wiring of the cover film 33 of the through-hole 34 of a diameter of 1.2mm
Plate) on.
Moreover, after being crimped with 170 DEG C, 2MPa, the condition of 5 minutes to them, 60 are carried out in 160 DEG C of electric dry oven
Minute heating, thus to obtain sample is measured.
Then, after carrying out heat treatment in 90 seconds to the measure sample obtained in 280 DEG C of electric dry oven, such as Fig. 4 (d)
Shown in plan view, using resistance value analyzer and BSP probe assay resistance values, thus to copper foil circuit 32A and copper foil circuit 32B
Between connection reliability (connection reliability after Reflow Soldering) evaluated.Furthermore D-D ' the sectional views that Fig. 4 (b) is Fig. 4 (a),
Fig. 4 (c) is the C-C ' sectional views of Fig. 4 (a).Similarly, Fig. 4 (e) is the D-D ' sectional views of Fig. 4 (d), and Fig. 4 (f) is Fig. 4's (d)
C-C ' sectional views.The evaluation criteria of connection reliability is as described below.
++：Connect the less than 20m Ω/ of resistance value.It is excellent.
+：Connection resistance value is 20m Ω/more than, less than 300m Ω/.It can be practical.
NG：Connection resistance value is 300m Ω/more than.It can not be practical.
[table 3]
According to the result of table 3, it is known that the A faces of the conductive adhesive oxidant layer of the conductive adhesive oxidant layer of the present embodiment it is anti-stick
Connect property and the surface-to-surface in the B faces of stickup property and conductive adhesive oxidant layer is touched well temporarily.And then the connection electricity after Reflow Soldering
The reliability of resistance value is also good, therefore can provide a kind of improvement yield in the manufacturing step of FPC and contribute to the promotion of yield
Electroconductive adhesive sheet.
In addition, the conductive adhesive oxidant layer with functional layer about embodiment 20, Ra, gloss value are also same with embodiment 2
Deng, the resistance to blocking in the A faces of conductive adhesive oxidant layer and temporarily stickup property, conductive adhesive oxidant layer B faces surface-to-surface contiguity
Well, the reliability of the connection resistance value and after Reflow Soldering is also comparably good.
It can be identified through the conductive adhesive oxidant layer with the present embodiment, it is possible to provide a kind of good, difficult by stickup property temporarily
To generate adhesion and surface-to-surface contiguity, there is the good adhesive strength with metal reinforcing plate and bring the production yield of FPC excellent
Printing distributing board and Reflow Soldering after the good e-machine of connection reliability.
[industrial utilizability]
The conductive adhesive oxidant layer of the present invention may be suitably used to need electric conductivity and all purposes of adhesiveness.As suitable
Suitable example has the use for being electrically connected the earthed circuit of printing distributing board and metal reinforcing plate via conductive adhesive oxidant layer
On the way.Conductive adhesive oxidant layer can suitably be used as the electroconductive adhesive sheet being layered in fissility film.The electric conductivity of the present invention is glued
Mixture layer and electroconductive adhesive sheet may be suitably used to all electric machines for representative with printing distributing board etc..
Claims (10)
1. a kind of conductive adhesive oxidant layer is formed in fissility film to use, it is characterised in that：
The surface roughness Ra of the face B of fissility film side is 0.2 μm~1.1 μm,
The surface roughness Ra of the face A of opposite side is 3 μm~6 μm.
2. conductive adhesive oxidant layer according to claim 1, it is characterised in that：85 ° of gloss values of the face A of opposite side are
0.5~5.
3. conductive adhesive oxidant layer according to claim 1 or 2, it is characterised in that：85 ° of light of the face B of fissility film side
Pool value is 30~120.
4. conductive adhesive oxidant layer according to claim 1 or 2, it is characterised in that：Thickness is 30 μm~70 μm.
5. conductive adhesive oxidant layer according to claim 1 or 2, it is characterised in that：Glass transition temperature is 0 DEG C~80
℃。
6. conductive adhesive oxidant layer according to claim 1 or 2, it is characterised in that：By including thermosetting resin, hardening
The conductive resin composition of agent and conductive particle is formed.
7. a kind of electroconductive adhesive sheet, it is characterised in that：Have in fissility film according to any one of claim 1 to 6 institute
The conductive adhesive oxidant layer stated.
8. a kind of printing distributing board, it is characterised in that including：Distributing board with signal wiring and insulating properties base material and use root
The conductive adhesive oxidant layer formed according to the electroconductive adhesive sheet described in claim 7.
9. printing distributing board according to claim 8, it is characterised in that further include：Metal reinforcing plate.
10. a kind of e-machine, it is characterised in that including：Printing distributing board according to claim 8 or claim 9.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-142038 | 2015-07-16 | ||
| JP2015142038 | 2015-07-16 | ||
| JP2015188423A JP5871098B1 (en) | 2015-07-16 | 2015-09-25 | Conductive adhesive layer, conductive adhesive sheet and printed wiring board |
| JP2015-188423 | 2015-09-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105969242A CN105969242A (en) | 2016-09-28 |
| CN105969242B true CN105969242B (en) | 2018-06-08 |
Family
ID=55362122
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610556878.2A Active CN105969242B (en) | 2015-07-16 | 2016-07-14 | Conductive adhesive oxidant layer, electroconductive adhesive sheet, printing distributing board and e-machine |
| CN201620743099.9U Withdrawn - After Issue CN205874290U (en) | 2015-07-16 | 2016-07-14 | Electric conductivity adhesive phase, electric conductivity bonding sheet, printing distributing board and electron machine |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620743099.9U Withdrawn - After Issue CN205874290U (en) | 2015-07-16 | 2016-07-14 | Electric conductivity adhesive phase, electric conductivity bonding sheet, printing distributing board and electron machine |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP5871098B1 (en) |
| KR (1) | KR101794147B1 (en) |
| CN (2) | CN105969242B (en) |
| TW (1) | TWI703199B (en) |
| WO (1) | WO2017010101A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5871098B1 (en) * | 2015-07-16 | 2016-03-01 | 東洋インキＳｃホールディングス株式会社 | Conductive adhesive layer, conductive adhesive sheet and printed wiring board |
| KR20170116624A (en) * | 2016-04-11 | 2017-10-20 | 주식회사 잉크테크 | Conductive Paste Composition and method for Bonding Structures Using the same |
| JP6893084B2 (en) * | 2016-10-19 | 2021-06-23 | 日東シンコー株式会社 | Thermosetting adhesive sheet |
| CN108990261A (en) * | 2017-06-05 | 2018-12-11 | 昆山雅森电子材料科技有限公司 | The preparation method of nano metal substrate and preparation method and the wiring board containing the substrate |
| JP7054998B2 (en) * | 2017-09-11 | 2022-04-15 | Ａｇｃコーテック株式会社 | Coating film and substrate with coating film |
| JP6329314B1 (en) * | 2017-09-28 | 2018-05-23 | タツタ電線株式会社 | Conductive adhesive sheet |
| JP6546975B2 (en) * | 2017-10-16 | 2019-07-17 | タツタ電線株式会社 | Conductive adhesive |
| JP6371460B1 (en) * | 2017-12-06 | 2018-08-08 | タツタ電線株式会社 | Reinforcing board for wiring board |
| JP2019125529A (en) * | 2018-01-18 | 2019-07-25 | タツタ電線株式会社 | Conductive adhesive film and electromagnetic wave shield film including the same |
| JP6431998B1 (en) | 2018-03-20 | 2018-11-28 | タツタ電線株式会社 | Conductive adhesive layer |
| TWI796476B (en) * | 2018-10-22 | 2023-03-21 | 日商拓自達電線股份有限公司 | Conductive Bonding Sheet |
| TWI771595B (en) * | 2018-10-29 | 2022-07-21 | 日商拓自達電線股份有限公司 | Electromagnetic wave shielding film, manufacturing method of shielding printed wiring board, and shielding printed wiring board |
| TWI782213B (en) * | 2018-10-29 | 2022-11-01 | 日商拓自達電線股份有限公司 | Electromagnetic wave shielding film, manufacturing method of shielding printed wiring board, and shielding printed wiring board |
| WO2020122166A1 (en) * | 2018-12-12 | 2020-06-18 | タツタ電線株式会社 | Shield printed wiring board and method of manufacturing shield printed wiring board |
| JP6904464B2 (en) * | 2019-06-12 | 2021-07-14 | 東洋インキＳｃホールディングス株式会社 | Printed wiring board |
| TWI703197B (en) * | 2019-07-16 | 2020-09-01 | 東莞爵士先進電子應用材料有限公司 | Preparation method of self-adhesive composite conductive tape |
| CN112592668B (en) * | 2020-12-15 | 2024-05-28 | 珠海冠宇电池股份有限公司 | Single-layer hot melt adhesive, soft package battery and preparation method thereof |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114591694B (en) * | 2022-03-05 | 2023-12-01 | 安徽强达电子有限公司 | High-temperature-resistant adhesive tape and preparation process thereof |
| JP7231124B1 (en) * | 2022-03-30 | 2023-03-01 | 東洋インキＳｃホールディングス株式会社 | Bonding agent for metal plate, reinforcing member for printed wiring board and manufacturing method thereof, and wiring board and manufacturing method thereof |
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- 2015-09-25 JP JP2015188423A patent/JP5871098B1/en active Active
- 2015-12-21 JP JP2015248632A patent/JP2017025284A/en active Pending
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2016
- 2016-07-14 CN CN201610556878.2A patent/CN105969242B/en active Active
- 2016-07-14 CN CN201620743099.9U patent/CN205874290U/en not_active Withdrawn - After Issue
- 2016-07-14 WO PCT/JP2016/003323 patent/WO2017010101A1/en active Application Filing
- 2016-07-14 KR KR1020177005137A patent/KR101794147B1/en active IP Right Grant
- 2016-07-15 TW TW105122307A patent/TWI703199B/en active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2017025280A (en) | 2017-02-02 |
| TW201704412A (en) | 2017-02-01 |
| TWI703199B (en) | 2020-09-01 |
| WO2017010101A1 (en) | 2017-01-19 |
| CN205874290U (en) | 2017-01-11 |
| KR101794147B1 (en) | 2017-11-07 |
| CN105969242A (en) | 2016-09-28 |
| JP5871098B1 (en) | 2016-03-01 |
| KR20170036034A (en) | 2017-03-31 |
| JP2017025284A (en) | 2017-02-02 |
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