CN105895785B - Light source assembly structure of flip LED chips integration packaging and preparation method thereof - Google Patents
Light source assembly structure of flip LED chips integration packaging and preparation method thereof Download PDFInfo
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- CN105895785B CN105895785B CN201610261522.6A CN201610261522A CN105895785B CN 105895785 B CN105895785 B CN 105895785B CN 201610261522 A CN201610261522 A CN 201610261522A CN 105895785 B CN105895785 B CN 105895785B
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- flip led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
Abstract
The present invention discloses light source assembly structure of flip LED chips integration packaging and preparation method thereof, method：Flip LED chips are arranged in formation chip array on flexible transition basement membrane；Certain thickness packaging plastic is uniformly coated on basement membrane, and is cured；Remove flexible transition basement membrane, carrier substrate of the packaging plastic as chip array after curing；The electrical interconnection that chip chamber electrode is completed on packaging plastic carrier substrate is integrated；Electrically printing thermal conductive insulation glue, curing on the integrated carrier substrate of interconnection, forms each light source assembly unit cell；The light source assembly detached after being cut according to each light source assembly unit cell.The light source assembly and heat-conducting substrate adhesive asserably, realize and are combined into arbitrary source with being electrically connected for external circuit.The method has broken away from current encapsulation circle and has interconnected integration packaging form to separating chips on COB plates, eliminates the process procedures such as patch, die bond on COB plates, simplifies processing procedure.
Description
Technical field
The present invention relates to the technical fields of LED light source, and in particular, to a kind of light source of flip LED chips integration packaging
Modular construction and preparation method thereof.
Background technology
LED (Light Emitting Diode, light emitting diode) is as a kind of novel industry product, with its operating voltage
It is low, the features such as operating current is small, shock resistance and anti-seismic performance are good, reliability is high, long lifespan, more next in the application of people's life
It is more universal.In recent years, various aspects are also increasing to the research dynamics of LED field, the light source being made of LED chip is also therewith
As the research topic paid close attention to.Wherein, the manufacture efficiency of light source is further improved, manufacture cost is reduced and improves luminous
Efficiency and reliability just becomes important research contents.
LED flip chip under its low-voltage, high current bearing capacity, high brightness, high reliability, high saturation current it is close
The product of a new generation that the features such as spending generally has been approved by LED industry circle.LED flip chip is main at present is structurally characterized in that core
The P of piece, N electrode use large area structure, and main light-emitting surface is sapphire face.
LED encapsulate industrial circle, in the production procedure from chip to light source, generally using：By flip LED chips or
So-called no substrate chip grade encapsulates (CSP) chip on COB (Chip On Board, chip on board) substrate with tin cream, silver paste etc.
Paste or pulpous state fluent material put the interconnecting area of two electrodes of P, N being coated on chip respectively, and patch is completed after being heating and curing, real
The P of existing chip, the connection of N electrode and the external circuit on COB plates and the integrated chip in COB plates.The problem of actually encountering be,
In patch heat curing process, often caused due to the point slurry amount in P, twoth area of N electrode is difficult to control chip shifted on COB or
Because of the interval too small of two area's point glue points, cause short-circuit between P, N electrode.If the interval of two glue points is excessive, chip and COB plates can be caused
Contact area reduce, i.e. the heat dissipation channel area of chip becomes smaller, it has directly influenced light efficiency and light under large driven current density
The reliability in source.In addition, the scaling powder included in the materials such as tin cream that current LED encapsulation industry uses volatilizees it in Reflow Soldering
Afterwards, cavity can be easily formed at linkage interface, equally the radiating surface of chip can be made further to reduce.
In addition, often generated after scaling powder volatilization in general tin cream brown object remain in LED core it is unilateral with COB plate faces it
Between, a part of light is absorbed, reduces the light output of light source；Also, the volatile matters such as the residual gas in larger cavity and gap
Temperature raising generates expansion under chip large driven current density, and the contact fastness and reliability for eventually leading to chip electrode reduce.Mesh
Preceding makees electrocondution slurry spot printing on COB plates to the P of each flip-chip, N electrode Liang Ge areas, and chip is more, and solder joint is more,
The probability that above-mentioned many disadvantages occur will be more, and the influence to quality light source is also even more serious.
Invention content
Light source assembly structure of a kind of flip LED chips integration packaging provided by the invention and preparation method thereof, the invention
New type light source component with more high light intensity, it further improves the quality of light source, reduces the manufacture cost of LED light source,
It is urgently to be resolved hurrily in the technical process for completing light source processing procedure and during the use introduced to the market to solve current flip LED chips
The problem of.The present invention is the light source assembly knot of the flip LED chips integration packaging of a kind of novelty developed on the basis of CSP
Structure and manufacturing method.
A kind of production method of the light source assembly structure of flip LED chips integration packaging proposed by the present invention, including：
It is more than on 150 ° and the indeformable flexible transition basement membrane of baking having sticking tolerable temperature, by what is be pre-designed
The regularly arranged upper flip LED chips of chip space requirement；
The P of the flip LED chips, N electrode face are pasted onto to the surface with glue side of the flexible transition basement membrane, formation is fallen
Fill LED chip array；
In the certain thickness uniform packaging plastic of the flexible transition coating on base films, and packaging plastic is cured；
The flexible transition basement membrane is removed, using the packaging plastic after curing as the packaging plastic of flip LED chips array
Carrier substrate；
On the packaging plastic carrier substrate, in order described in the completion of pulpous state fluid, printing technology and heat curing techniques
The electrical interconnection of electrode is integrated between flip LED chips, forms the carrier substrate after electrically interconnection is integrated；
Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, prints thermal conductive insulation glue, and
Cure after planarized processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source assembly list
The P of born of the same parents, N electrode bonding pad are exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue；
Carrier substrate after electrically interconnection is integrated as described in the light source assembly unit cell cutting-up, is divided into light source assembly.
Further, wherein, in the certain thickness uniform packaging plastic of the flexible transition coating on base films；Further
For：
It is certain thickness uniform in the flexible transition coating on base films and do not influence cured packaging plastic, and the encapsulation
The fluorescent glue mixed with fluorescent powder is included in glue.
Further, wherein, the printing technology, further for：Using the screen painting skill of silk screen, steel mesh or flexographic plate
Art.
Further, wherein, the pulpous state fluid is further conductive, solderability and the envelope after heat cure
There is adhesiveness between dress glue and have the material more than 70% reflectivity, and the resin type slurry containing granulated metal to visible ray
Pulpous state fluid.
Further, wherein, printing technology, printing are used second on the carrier substrate after the electrical interconnection is integrated
Thermal conductive insulation glue, further for：Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, and printing is solid
Become the carrier substrate after the electrical interconnection adhered to the thermal conductive insulation glue integrates, the printing thermal conductive insulation glue after change
There is the white thermal conductive insulation glue more than 70% reflectivity for transparent adhesive tape or to visible ray.
Further, wherein, the carrier substrate after electrically interconnection is integrated as described in the light source assembly unit cell cutting-up is divided
Into light source assembly, further for：Using the method for machine cuts, electrically interconnection is integrated as described in the light source assembly unit cell cutting-up
Carrier substrate afterwards, is divided into light source assembly.
The invention also discloses the light source assembly structure of flip LED chips integration packaging, by light source assembly unit cell cutting-up electricity
Property interconnection it is integrated after carrier substrate, be divided into light source assembly, the light source assembly structure, including：Flip LED chips,
The flip LED chips, it is regularly arranged on flexible transition basement membrane by the chip space requirement being pre-designed；By institute
State the P of flip LED chips, N electrode face is pasted onto the surface with glue side of the flexible transition basement membrane, form flip LED chips row
Battle array；In the certain thickness uniform packaging plastic of the flexible transition coating on base films, and packaging plastic is cured；Described in removal
Flexible transition basement membrane, using the packaging plastic after curing as the packaging plastic carrier substrate of flip LED chips array, wherein, institute
Stating flexible transition basement membrane has viscosity, and tolerable temperature is more than 150 ° and baking is indeformable；
On the packaging plastic carrier substrate, in order described in the completion of pulpous state fluid, printing technology and heat curing techniques
The electrical interconnection of electrode is integrated between flip LED chips, forms the carrier substrate after electrically interconnection is integrated；
Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, prints thermal conductive insulation glue, and
Cure after planarized processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source assembly list
The P of born of the same parents, N electrode bonding pad are exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue, to obtain
Obtain the light source assembly unit cell after secondary printing thermal conductive insulation glue.
Further, wherein, the printing technology, further for：Using the screen painting skill of silk screen, steel mesh or flexographic plate
Art；The pulpous state fluid further to be conductive after heat cure, has adhesiveness and pair can between the packaging plastic
See that light has the material more than 70% reflectivity, and the pulpous state fluid has solderability, and the slurry of the resin type containing granulated metal with metal
The pulpous state fluid of material.
Further, wherein, the light source assembly unit cell after the secondary printing thermal conductive insulation glue is in the electrical interconnection
Printing technology is used on carrier substrate after integrated second, and printing has adhesiveness, and has greatly for transparent adhesive tape or to visible ray
In the white thermal conductive insulation glue of 70% reflectivity, and cure after planarized processing, each interconnection integrated unit is considered as one
Light source assembly unit cell so that the P of the light source assembly unit cell, N electrode bonding pad are exposed, other areas of the light source assembly unit cell
Domain is covered and is planarized by thermal conductive insulation glue.
With the structure of the existing integrated packaging power source on COB substrates compared with production method, flip LED core of the invention
Light source assembly structure of piece integration packaging and preparation method thereof realizes following advantageous effect：
(1) light source assembly structure of the present invention and preparation method thereof is at present will paste the progress of LED chip one by one
Piece is compared on the interconnection circuit of COB substrates, simplifies processing procedure；And in the present invention by multiple flip LED chips in transition basement membrane
On be arranged in array form, multiple light sources component can disposably be prepared by printing technology, improve production capacity and shipment rate, drop
The low production cost of light source.
(2) light source assembly structure of the present invention and preparation method thereof uses mode of printing, ensure that chip P, N electrode
Gap between interconnection line avoids and forms cavity between P, N electrode short circuit and chip and COB plate faces, phenomena such as residue.Make core
Piece heat dissipation area maximizes, and ensure that flip LED photoelectric characteristic and reliability, and the electric current for bearing bigger and the light for providing bigger are defeated
Go out.
(3) light source assembly structure of the present invention and preparation method thereof uses mode of printing, ensure that Illuminant chromaticity
Uniformity.
(4) light source assembly structure of the present invention and preparation method thereof is arranged into array shape using flip LED chips
Formula, the disposable preparation for completing multiple light sources component, can obtain multiple miniaturization light source assemblies after segmentation.Meanwhile Ke Yicong
The size of light source assembly is reduced in global design, it is user-friendly.
Description of the drawings
Attached drawing described herein is used to provide further understanding of the present invention, and forms the part of the present invention, this hair
Bright illustrative embodiments and their description do not constitute improper limitations of the present invention for explaining the present invention.In the accompanying drawings：
Fig. 1 is the flow diagram of the light source assembly production method of flip LED integration packaging of the present invention；
Fig. 2A is the vertical view of the light source assembly structure of flip LED integration packaging of the present invention；
Fig. 2 B are the side view of the light source assembly structure of flip LED integration packaging of the present invention；
Fig. 3 is that the flow of the light source assembly production method Application Example of flip LED integration packaging of the present invention is shown
It is intended to；
Fig. 4 is the sectional view that flip LED chips of the present invention form flip LED chips array on flexible transition basement membrane；
Fig. 5 is sectional view of the flip LED chips of the present invention after flexible transition coating on base films encapsulates adhesive curing；
Fig. 6 is the sectional view of formation flip LED chips array after present invention removal flexible transition basement membrane；
Fig. 7 present invention first time electrocondution slurries (pulpous state fluid) after printing curing formed after electrically interconnection is integrated
The sectional view of carrier substrate after electrically interconnection is integrated；
Fig. 8 is the section view after the unicellular electrode surface planarization of light source assembly after second printing thermal conductive insulation glue of the present invention
Figure；
Fig. 9 is cuing open for the flip LED chips array that the present invention shows flip LED chips light source assembly unit cell split position
View；
Figure 10 is the sectional view of flip LED chips light source assembly formed after the present invention is divided.
Specific embodiment
Some vocabulary has such as been used to censure specific components in specification and claim.Those skilled in the art should
It is understood that hardware manufacturer may call same component with different nouns.This specification and claims are not with name
The difference of title is used as the mode for distinguishing component, but is used as the criterion of differentiation with the difference of component functionally.Such as logical
The "comprising" of piece specification and claim mentioned in is an open language, therefore should be construed to " include but do not limit
In "." substantially " refer in receivable error range, those skilled in the art can be described within a certain error range solution
Technical problem basically reaches the technique effect.Specification subsequent descriptions are to implement the better embodiment of the present invention, so described
Description is for the purpose of illustrating the rule of the present invention, is not limited to the scope of the present invention.Protection scope of the present invention
When subject to appended claims institute defender.
Embodiment 1
Fig. 1 is the flow diagram of the light source assembly production method of flip LED integration packaging of the present invention, referring to figure
1, the production method of light source assembly structure described in the present embodiment includes the following steps：
Step 101 is having sticking tolerable temperature more than 150 ° and on the indeformable flexible transition basement membrane of baking, presses
The regularly arranged upper flip LED chips of chip space requirement being pre-designed；
Step 102, the surface with glue one that the P of the flip LED chips, N electrode face are pasted onto to the flexible transition basement membrane
Side forms flip LED chips array；
Step 103, in the certain thickness uniform packaging plastic of the flexible transition coating on base films, and to the packaging plastic
Cured；
Specifically, it by attaching the box dam 40 of certain altitude around the flip LED array on flexible transition basement membrane 20, presses
Come even application, the thickness for controlling packaging plastic 50 according to the height of the box dam of setting；
Step 104, the removal flexible transition basement membrane, arrange the packaging plastic 50 after curing as flip LED chips
The packaging plastic carrier substrate of battle array；
Step 105, on the packaging plastic carrier substrate, in order with pulpous state fluid, printing technology and heat curing techniques
Electrically interconnecting for electrode integrates between completing the flip LED chips, forms the carrier substrate electrically interconnected after integrating；
Step 106 uses printing technology for the second time on the carrier substrate after the electrical interconnection is integrated, and printing heat conduction is exhausted
Edge glue, and cure after planarized processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source
The P of component unit cell, the bonding pad of N electrode are exposed, and other regions of the light source assembly unit cell are covered and put down by thermal conductive insulation glue
Smoothization；
Step 107 electrically interconnects the carrier substrate after integrating as described in the light source assembly unit cell cutting-up, is divided into light source
Component.
In above-mentioned steps 102, the flexible transition basement membrane has viscosity, indeformable in 150 degree of bakings, also, the envelope
Dress glue is coated in the curing for not influencing the packaging plastic on the transition basement membrane, after the encapsulation adhesive curing, with the transition
Basement membrane detaches.
In the certain thickness uniform packaging plastic of the flexible transition coating on base films；It is further：
It is certain thickness uniform in the flexible transition coating on base films and do not influence cured packaging plastic, and the encapsulation
The fluorescent glue mixed with fluorescent powder is included in glue.
In above-mentioned steps 103 and step 104, the packaging plastic cures on transition basement membrane, is detached after curing with basement membrane, together
When, the packaging plastic has adhesiveness with the flip LED chips, will not be to the flip LED core in curing process is coated
The electrode surface of piece causes to stain.It is further：Using the packaging plastic after curing as the flip LED chips array of no contamination
Packaging plastic carrier substrate.
In above-mentioned steps 105 and step 106, the P of the flip LED chips array, the interconnection of N electrode and thermal conductive insulation glue
Planarization using printing technology realize, printing technology use silk screen, steel mesh or flexographic plate screen printing technology.
In above-mentioned steps 105, the pulpous state fluid is further conductive, solderability and the envelope after heat cure
There is adhesiveness between dress glue and have the material more than 70% reflectivity, and the resin type slurry containing granulated metal to visible ray
Pulpous state fluid.
In above-mentioned steps 106, printing technology, printing are used second on the carrier substrate after the electrical interconnection is integrated
Thermal conductive insulation glue, further for：Printing technology, printing tool are used on the carrier substrate after the electrical interconnection is integrated second
There is an adhesiveness, and have for transparent adhesive tape or to visible ray white thermal conductive insulation glue more than 70% reflectivity.
In above-mentioned steps 107, the carrier substrate after electrically interconnection is integrated as described in the light source assembly unit cell cutting-up, segmentation
Into light source assembly, further for：Using the method for machine cuts, electrically interconnection is integrated as described in the light source assembly unit cell cutting-up
Carrier substrate afterwards, is divided into light source assembly.
It is provided by the present invention compared with traditional method that chip electrode interconnection integration packaging is realized on COB substrates
In the above method, electrical interconnection line is made on no substrate package glue between the electrode of the flip LED chips array of separation, eliminates
Interconnection circuit on COB substrates simplifies processing procedure, substantially increases production capacity and shipment rate, reduce life to chip patch one by one
Produce cost and equipment cost.In addition, the method for the present invention also eliminated conventional method and be easy to cause electricity in patch on COB substrates
Intereelectrode short-circuit between chip face and COB plates the phenomenon that formation cavity, residue, realizes flip LED chips passage of heat area
It maximizes, ensure that flip LED chips photoelectric characteristic and trustworthiness, the electric current of bigger can be born, and the light of bigger can be provided
Output.
Embodiment 2
As shown in Fig. 2A, Fig. 2 B, for the present invention flip LED chips integration packaging light source assembly structure vertical view and
Side view, the light source assembly structure of flip LED chips integration packaging are electrically interconnected the load after integrating by light source assembly unit cell cutting-up
Body substrate, is divided into light source assembly, the light source assembly structure, including：Flip LED chips 10；
The flip LED chips are by the regularly arranged flexible transition basement membrane of the chip space requirement being pre-designed；By described in
The P electrode 31 of flip LED chips, 32 face of N electrode are pasted onto the surface with glue side of the flexible transition basement membrane, form flip LED
Chip array；In the certain thickness uniform packaging plastic 50 of the flexible transition coating on base films, and packaging plastic 50 is consolidated
Change；The flexible transition basement membrane is removed, using the packaging plastic 50 after curing as the packaging plastic carrier of flip LED chips array
Substrate, wherein, the flexible transition basement membrane has viscosity, and tolerable temperature is more than 150 ° and baking is indeformable.
On the packaging plastic carrier substrate, in order described in the completion of pulpous state fluid, printing technology and heat curing techniques
The electrical interconnection of electrode is integrated between flip LED chips, forms the carrier substrate 61 after electrically interconnection is integrated.
Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, prints thermal conductive insulation glue, and
Cure after planarized processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source assembly list
The P of born of the same parents, N electrode bonding pad are exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue, to obtain
Obtain the light source assembly unit cell after secondary printing thermal conductive insulation glue.
Further, the flip LED chips 10, including：LED core sheet body and electrode.
In the present invention, electrical interconnection line is made on the packaging plastic of no substrate between the electrode that the flip LED of separation integrates, it is clear that
It is different from the method that chip electrode interconnection integration packaging is realized on COB substrates traditional at present.This mode eliminates at present
Traditional in patch process, be easy to cause inter-electrode short-circuit on COB substrates, and cavity is formed between chip face and COB plate faces, residual
Object etc. is stayed, the maximization of chip passage of heat area is realized, ensure that flip LED photoelectric characteristic and reliability, bigger can be born
Electric current and provide bigger light output.
The light source assembly Illuminant chromaticity of flip LED integration packaging in the present invention is uniform, realizes the miniaturization of light source, opens up
Wide use scope and flexibility, have provided facility to the user.
Embodiment 3
The production method Application Example of the light source assembly structure of flip LED chips integration packaging of the present invention presented below,
Referring to Fig. 3, including：
Step 201, by more flip LED chips 10 by design chip space requirement it is regularly arranged in flexible transition basement membrane
On (conversion basement membrane) 20, the P electrode 31 of flip LED chips 10,32 face of N electrode are pasted onto to the surface with glue of flexible transition basement membrane 20
Side, formed flip LED chips array, referring to Fig. 4.
Wherein, flip LED chips 10 are the chips according to the excitation wavelength of fluorescent powder and after sorting.By flip LED chips
It is spaced substantially equidistant on flexible transition basement membrane 20 by design requirement, the electrode surface of flip LED chips 10 is adhered to certain viscous
On the flexible transition basement membrane 20 of degree, which at least needs resistance to 150 DEG C of high temperature and baking is indeformable, and can ensure
Packaging plastic 50 coated in thering is glue to be cured on one side on film, specifically according to the property of flexible transition basement membrane 20 depending on, will cure
Packaging plastic carrier substrate of the packaging plastic 50 afterwards as flip LED chips array.Equidistant in the present invention refers to multiple
Spread length of the flip-chip light emitting device in x-axis and y-axis direction is equal.Here flexible transition basement membrane 20 at least needs resistance to 150
DEG C high temperature, and toast indeformable, and it is not that so simple question is replaced using general or common basement membrane.
The box dam 40 of certain altitude is attached around step 202, the flip LED array on flexible transition basement membrane 20, according to
The height of the box dam of setting comes even application, the thickness for controlling packaging plastic 50, referring to Fig. 5.
Wherein, the material of box dam 40 can be flexible membrane (such as plastic foil) or hard plate material (such as sheet metal).Envelope
It is a kind of high-transmission rate (＞ 95%, 450nm) to fill glue 50), high refractive index, the silica gel of (preferred refractive index be more than 1.50),
It can cure on flexible transition basement membrane 20, have good adhesiveness with chip and convenient for cutting.Packaging plastic 50 can be according to the thickness of glue
Degree and chromaticity requirements add in fluorescent powder allotment.The mode of coating glue can be dispensing or spraying, complete including a gluing
It is completed into gluing twice, the glue of coating can be without the packaging plastic or fluorescent glue for mixing fluorescent powder.
Step 203 removes above-mentioned box dam 40 after the packaging plastic 50 curing, referring to Fig. 6.Specifically, for described in removal
Flexible transition basement membrane 20, using the packaging plastic 50 after curing as the packaging plastic carrier substrate of flip LED chips array.
Step 204, on the packaging plastic carrier substrate, in order with pulpous state fluid, printing technology and heat curing techniques
Electrically interconnecting for electrode integrates between completing the flip LED chips, forms the carrier substrate electrically interconnected after integrating；Specifically
For P, N electrode area and 71 printing hole of pulpous state fluid (slurry) in galley will be interconnected between flip LED chips on packaging plastic 50
Alignment prints pulpous state fluid, removes galley, the pulpous state fluid after the printing that is heating and curing, electrode between completion flip LED chips
It goes here and there and is electrically connected (electrically interconnection is integrated), the carrier substrate 61 after electrically interconnection is integrated is formed, referring to Fig. 2 B and Fig. 7.
Wherein, 10 array of flip LED chips on packaging plastic 50 is printed by different series-parallel systems, completes to meet design
It is required that multiple light sources component unit cell in P electrode 31, N electrode 32 electrical connection.As the printing being electrically interconnected in the present invention
Pulpous state fluid (slurry) can be printing silver paste or other highly conductive, high reflections or highly transmissive granular or linear nano metal with
The slurry of organic matter mixing, i.e., described pulpous state fluid are further conductive, solderability and the envelope after heat cure
There is adhesiveness between dress glue and have the material more than 70% reflectivity, and the resin type slurry containing granulated metal to visible ray
Pulpous state fluid.
Step 205 uses printing technology for the second time on the carrier substrate 61 after the electrical interconnection is integrated, prints heat conduction
Insulating cement 81, and curing (forming the region such as in Fig. 2 B and Fig. 8 62) after planarized processing, each interconnection integrated unit regard
For a light source assembly unit cell so that the P of the light source assembly unit cell, N electrode bonding pad are exposed, the light source assembly unit cell
Other regions are covered and are planarized by thermal conductive insulation glue.
Wherein, the process of planarization uses insulation, heat conduction, high reflection or highly transmissive high viscosity colloidal liquid (including just
The printing thermal conductive insulation glue of assembling structure patch, the white oil that reflector coats in lamps and lanterns etc.), it is then heating and curing, realizes flat
Change.After secondary printing, the P of light source assembly unit cell, N electrode draw-out area (also referred to as bonding pad) are exposed.
Step 206 electrically interconnects the carrier substrate 61 after integrating as described in the light source assembly unit cell cutting-up, is divided into light
Source component.I.e.：The integrated chip carrier for including multiple light sources component unit cell is pasted onto on sticking blue film or tunica albuginea, is pressed
Unit cell size is cut, cutting position 70 shown in Figure 9, and then pour mask forms the light source assembly of separation on another blue film,
Referring to Figure 10.
Wherein, cutting is using mechanical cutting method.Light source assembly is completed (to be also referred to as with the electrode draw-out area on heat-radiating substrate
Bonding pad) welding and both the fitting closely of contact interface (such as heat-conducting glue realization can be used), be finally assembling to light source.Component
Surface and light source substrate between to have good thermally-conductive interface.
The making of the light source assembly of flip LED integration packaging is so completed, is fallen made of method using the present invention
It fills and is not limited to blue light without extraction electrode or lead, emission wavelength on the main light-emitting surface of LED light emitting device, can also include entire
Visible light wave range, ultraviolet and infrared band or the mixed light being made of the light of above-mentioned wave band.
The present embodiment illustrates that the present invention is sealed in separation 10 array of flip LED chips without basic plate by taking light emitting diode as an example
A kind of high-voltage great-current light source assembly structure and production method that chip chamber electrode interconnection integrates are realized on dress glue 50.
On the whole, the LED flip chip of separation is arranged in the flexibility of certain viscosity by the present invention by certain spacing
On transition basement membrane flexible transition basement membrane, certain thickness uniform packaging plastic (alternatively referred to as fluorescent glue) is then coated with, and to envelope
Fill adhesive curing；Flexible transition basement membrane is removed, the packaging plastic after curing has become the carrier substrate of flip LED array；In the encapsulation
It is mutual using the techniques such as printing technology completion chip chamber electrode according to design requirement on the carrier substrate of the flip LED array of glue encapsulation
Even integrated, each interconnection integrated unit can be considered a light source assembly unit cell；The integrated flip LED of interconnection is completed herein again
Thermal conductive insulation glue is printed on the carrier substrate of array using printing technology and is heating and curing for second.The P of light source assembly unit cell, N
The bonding pad of electrode is exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue；By light source group
Carrier substrate after electrically interconnection is integrated described in part unit cell cutting-up, is divided into multiple light sources component；The light source assembly and heat conduction base
Plate (COB substrates such as such as aluminium, aluminium oxide etc.) adhesive asserably realizes that electrical connection is combined into arbitrary source.
According to upper described, the present invention be completely free of current encapsulation circle it is traditional realized on COB plates it is mutual to separation flip LED
Even integration packaging form, eliminate the almost all process procedure such as patch, die bond on COB plates in a package, and solve by
This and a series of problems for bringing.Industrial chain is reduced, reduces cost, substantially increases production capacity.It is a kind of innovative structure
With the integrated packaging power source component of processing procedure, there are the huge market space and potential economic value.
It should be pointed out that above-mentioned light source assembly can electrically be interconnected with heat-conducting substrate and heat dissipation interface is bonded and assemblies
Flip LED chips integrated optical source.
In the present embodiment, the light source assembly is to be arranged by the production method in above-described embodiment using flip LED chips
The form of battle array integration packaging, the disposable production method for completing multiple light sources modular construction are prepared.It can be from global design
Upper to reduce the size that light source assembly is prepared, the light source assembly that can be minimized after segmentation is user-friendly.
By above each embodiment it is found that the light source assembly structure of novel flip LED chips integration packaging of the invention
And preparation method thereof existing for advantageous effect be：
(1) the flip LED encapsulation technology phase of light source assembly structure of the present invention and preparation method thereof and the prior art
Than eliminating and carrying out the works such as LED chip patch one by one, curing, coating packaging plastic resolidification to LED chip on COB substrates
Sequence simplifies the preparation process of flip LED packaged light source component；And upside-down mounting is formed by multiple flip LED chips in the present invention
The form of LED chip array can disposably prepare multiple uniform light source assemblies so that preparation process can be with industrialization, greatly
The production capacity of light source assembly is improved, and reduce the production cost of light source assembly to a certain extent greatly.
(2) the flip LED encapsulation technology phase of light source assembly structure of the present invention and preparation method thereof and the prior art
Than by being electrically interconnected between the electrode of the flip LED chips of separation integrated being carried out on no substrate package glue, it is entirely avoided at present
Patch process in because of a slurry amount difficulty control, chip is displaced even short circuit after causing curing.
(3) light source assembly structure of the present invention and preparation method thereof is interconnected collection plastic using packaging plastic, electrically and led
Thermal insulation glue carries out on encapsulation gel carrier surface successively, ensure that the gap between P, N electrode solder joint.The covering of thermal conductive insulation glue
Avoiding the cavity between above-mentioned chip and COB substrate interfaces ensures chip cooling area, ensure that flip LED photoelectric characteristic and
Reliability, and the electric current of bigger can be born and the light output of bigger is provided.
(4) light source assembly structure of the present invention and preparation method thereof is interconnected collection plastic using packaging plastic, electrically and led
Thermal insulation glue seriatim coats on the basis of the basement membrane with flip LED chips array, will not form cavity or leave residual
Object improves the luminous efficiency for preparing light source assembly, and ensure that the uniformity of Illuminant chromaticity.
(5) light source assembly structure of the present invention and preparation method thereof uses the form of flip LED chips array, once
Property complete multiple light sources component preparation, the size that light source assembly is prepared can be reduced from global design, can after segmentation
It is user-friendly to obtain the light source assembly of multiple miniaturizations, convenient for industrialization and improve production capacity.
According to upper described, the present invention be completely free of current encapsulation circle it is traditional realized on COB plates it is mutual to separation flip LED
Even integration packaging form, eliminates and solves band therefrom in almost all process procedures such as patch, the die bonds of COB chip on board
A series of problems, such as such as " cavity " come.The reliability of light source is improved, reduces cost, improves production capacity.It is a kind of wound
The integrated packaging power source component of new structure and processing procedure has huge application market space and potential economic value.
It should be understood by those skilled in the art that, the structure of the embodiment of the present invention offer LED integrated packaging power source components,
Method, apparatus, material etc..Therefore, the present invention can be used complete hardware embodiment, complete software embodiment or combine software and
The form of the embodiment of hardware aspect.
Several alternative embodiments of the present invention have shown and described in above description, but as previously described, it should be understood that the present invention
Be not limited to form disclosed herein, be not to be taken as the exclusion to other embodiment, and available for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through in the scope of the invention is set forth herein
It is modified.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be in this hair
In the protection domain of bright appended claims.
Claims (9)
1. a kind of production method of the light source assembly structure of flip LED chips integration packaging, which is characterized in that including：
It is more than on 150 ° and the indeformable flexible transition basement membrane of baking having sticking tolerable temperature, by the core being pre-designed
The regularly arranged upper flip LED chips of piece space requirement；
The P of the flip LED chips, N electrode face are pasted onto to the surface with glue side of the flexible transition basement membrane, form upside-down mounting
LED chip array；
In the certain thickness uniform packaging plastic of the flexible transition coating on base films, and the packaging plastic is cured；
The flexible transition basement membrane is removed, using the packaging plastic after curing as the packaging plastic carrier of flip LED chips array
Substrate；
On the packaging plastic carrier substrate, the upside-down mounting is completed with pulpous state fluid, printing technology and heat curing techniques in order
The electrical interconnection of electrode is integrated between LED chip, forms the carrier substrate after electrically interconnection is integrated；
Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, prints thermal conductive insulation glue, and through flat
Cure after smoothization processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source assembly unit cell
P, the bonding pad of N electrode is exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue；
Carrier substrate after electrically interconnection is integrated as described in the light source assembly unit cell cutting-up, is divided into light source assembly.
2. the production method of the light source assembly structure of flip LED chips integration packaging according to claim 1, feature exist
In in the certain thickness uniform packaging plastic of the flexible transition coating on base films；It is further：
It is certain thickness uniform in the flexible transition coating on base films and do not influence cured packaging plastic, and in the packaging plastic
Include the fluorescent glue mixed with fluorescent powder.
3. the production method of the light source assembly structure of flip LED chips integration packaging according to claim 1, feature exist
In, the printing technology, further for：Using the screen printing technology of silk screen, steel mesh or flexographic plate.
4. the production method of the light source assembly structure of flip LED chips integration packaging according to claim 1, feature exist
In the pulpous state fluid, further to have adhesiveness after heat cure between conductive, solderability and the packaging plastic
And there is the material more than 70% reflectivity to visible ray, and the pulpous state fluid of the resin type slurry containing granulated metal.
5. the production method of the light source assembly structure of flip LED chips integration packaging according to claim 1, feature exist
In, on the carrier substrate after the electrical interconnection is integrated second using printing technology, print thermal conductive insulation glue, further
For：Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, is become after printing curing and is led with described
Carrier substrate after the attached electrical interconnection of thermal insulation gluing is integrated, the printing thermal conductive insulation glue is for transparent adhesive tape or to visible
Light has the white thermal conductive insulation glue more than 70% reflectivity.
6. the production method of the light source assembly structure of flip LED chips integration packaging according to claim 1, feature exist
In the carrier substrate after electrically interconnection is integrated as described in the light source assembly unit cell cutting-up is divided into light source assembly, further
For：Using the method for machine cuts, the carrier substrate after electrically interconnection is integrated as described in the light source assembly unit cell cutting-up, segmentation
Into light source assembly.
7. a kind of light source assembly structure of flip LED chips integration packaging, which is characterized in that electrical by light source assembly unit cell cutting-up
Carrier substrate after interconnection is integrated, is divided into light source assembly, the light source assembly structure, including：Flip LED chips,
The flip LED chips, it is regularly arranged on flexible transition basement membrane by the chip space requirement being pre-designed；It is fallen by described in
The P of dress LED chip, N electrode face are pasted onto the surface with glue side of the flexible transition basement membrane, form flip LED chips array；
The certain thickness uniform packaging plastic of flexible transition coating on base films, and packaging plastic is cured；Remove the flexibility
Transition basement membrane, using the packaging plastic after curing as the packaging plastic carrier substrate of flip LED chips array, wherein, it is described soft
Property transition basement membrane there is viscosity, tolerable temperature is more than 150 ° and baking is indeformable；
On the packaging plastic carrier substrate, the upside-down mounting is completed with pulpous state fluid, printing technology and heat curing techniques in order
The electrical interconnection of electrode is integrated between LED chip, forms the carrier substrate after electrically interconnection is integrated；
Printing technology is used on the carrier substrate after the electrical interconnection is integrated second, prints thermal conductive insulation glue, and through flat
Cure after smoothization processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source assembly unit cell
P, N electrode bonding pad is exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue, to obtain two
Light source assembly unit cell after secondary printing thermal conductive insulation glue.
8. the light source assembly structure of flip LED chips integration packaging according to claim 7, which is characterized in that the print
Brush technology, further for：Using the screen printing technology of silk screen, steel mesh or flexographic plate；The pulpous state fluid is further thermosetting
Between conductive after change, solderability and the packaging plastic there is adhesiveness and have visible ray more than 70% reflectivity
Material, and the pulpous state fluid of the resin type slurry containing granulated metal.
9. the light source assembly structure of flip LED chips integration packaging according to claim 7, which is characterized in that described two
Light source assembly unit cell after secondary printing thermal conductive insulation glue is to be used for second on the carrier substrate after the electrical interconnection is integrated
Printing technology, printing has adhesiveness, and has for transparent adhesive tape or to visible ray white thermal conductive insulation glue more than 70% reflectivity,
And cure after planarized processing, each interconnection integrated unit is considered as a light source assembly unit cell so that the light source assembly
The P of unit cell, N electrode bonding pad are exposed, and other regions of the light source assembly unit cell are covered and planarized by thermal conductive insulation glue.
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| CN201610261522.6A CN105895785B (en) | 2016-04-25 | 2016-04-25 | Light source assembly structure of flip LED chips integration packaging and preparation method thereof |
| PCT/CN2016/097979 WO2017185580A1 (en) | 2016-04-25 | 2016-09-03 | Integrated and packaged light source assembly structure of flip led chips and manufacturing method therefor |
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| CN105895785B (en) * | 2016-04-25 | 2018-06-29 | 湘能华磊光电股份有限公司 | Light source assembly structure of flip LED chips integration packaging and preparation method thereof |
| CN106449939A (en) * | 2016-10-18 | 2017-02-22 | 湘能华磊光电股份有限公司 | Structure of CSP chip with simplified upside-down-mounted LED structure and production method thereof |
| CN106784268B (en) * | 2016-11-25 | 2020-03-31 | 安徽巨合电子科技有限公司 | Miniature substrate-free packaged tricolor LED and packaging method thereof |
| CN106531731A (en) * | 2016-12-07 | 2017-03-22 | 鸿利智汇集团股份有限公司 | Stentless LED packaging structure and manufacturing method thereof |
| WO2018148858A1 (en) * | 2017-02-17 | 2018-08-23 | 林立宸 | Method for preparing substrate-free package, and use thereof |
| CN106848036B (en) * | 2017-03-14 | 2018-10-30 | 华进半导体封装先导技术研发中心有限公司 | A kind of LED encapsulation structure and its packaging method |
| CN107093600A (en) * | 2017-04-10 | 2017-08-25 | 导装光电科技（深圳）有限公司 | Without substrate LED white chips and its manufacture craft |
| CN106932951B (en) | 2017-04-14 | 2018-11-23 | 深圳市华星光电技术有限公司 | LED lamp source and its manufacturing method, backlight module |
| CN107731985B (en) * | 2017-10-18 | 2019-08-06 | 湘能华磊光电股份有限公司 | A kind of high-precision locating method of LED chip array arrangement |
| CN108520873B (en) * | 2018-04-29 | 2020-07-10 | 浙江唯唯光电科技股份有限公司 | Serial L ED chip assembly and assembling method thereof |
| CN110544634A (en) * | 2018-05-28 | 2019-12-06 | 浙江清华柔性电子技术研究院 | chip integration method |
| CN108987558A (en) * | 2018-09-20 | 2018-12-11 | 东莞市春瑞电子科技有限公司 | LED support integrates plate |
| CN109445192B (en) * | 2019-01-03 | 2022-04-22 | 京东方科技集团股份有限公司 | Area light source and manufacturing method thereof, backlight module and display device |
| CN110060965A (en) * | 2019-04-30 | 2019-07-26 | 苏州固锝电子股份有限公司 | Exempt to encapsulate diode and its processing technology |
| CN112435999A (en) * | 2019-08-26 | 2021-03-02 | 中国科学院半导体研究所 | Surface-mounted LED packaging light source and preparation method |
| JP7474770B2 (en) * | 2019-09-18 | 2024-04-25 | 泉州三安半導体科技有限公司 | Light Emitting Diode Package Assembly |
| CN111640737A (en) * | 2020-06-02 | 2020-09-08 | 上海九山电子科技有限公司 | Mold and backlight source packaging method |
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