CN106784268B - Miniature substrate-free packaged tricolor LED and packaging method thereof - Google Patents
Miniature substrate-free packaged tricolor LED and packaging method thereof Download PDFInfo
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- CN106784268B CN106784268B CN201611055407.XA CN201611055407A CN106784268B CN 106784268 B CN106784268 B CN 106784268B CN 201611055407 A CN201611055407 A CN 201611055407A CN 106784268 B CN106784268 B CN 106784268B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 21
- 238000012360 testing method Methods 0.000 claims abstract description 16
- 238000005498 polishing Methods 0.000 claims abstract description 15
- 238000004140 cleaning Methods 0.000 claims abstract description 11
- 239000011093 chipboard Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000011265 semifinished product Substances 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 238000012858 packaging process Methods 0.000 claims description 5
- 239000000047 product Substances 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 5
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 8
- 239000013078 crystal Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
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Abstract
The invention discloses a micro base-plate-free packaged tricolor LED and a packaging method thereof, the base-plate-free packaged tricolor LED comprises tricolor LED chips, a primary plastic package layer, conductive balls and a secondary plastic package layer, the base-plate-free packaged tricolor LED is prepared by arranging chips, planting the conductive balls, primary plastic package, secondary plastic package, polishing, cleaning, drying, separating, testing and packaging, the prepared tricolor LED chips are shielded by an opaque primary plastic package layer without forming light interference, electrodes of the tricolor LED chips are planted with the conductive balls and polished after the secondary plastic package is finished, the difference between the thickness and the solid crystal flatness of the tricolor LED chips is completely eliminated, the problem of false welding caused by the thickness difference of the three chips during SMT of a subsequent LED device is avoided, the welding tolerance of flatness is improved, meanwhile, the problems of false welding and the like between the LED chips and a base plate are avoided due to the base-plate-free packaging, the use reliability of the LED device is greatly improved.
Description
Technical Field
The invention relates to micro LED device packaging, in particular to a micro substrate-free packaged tricolor LED and a packaging method thereof.
Background
According to the traditional three-primary-color LED device package, a substrate is used as a carrier, then three-primary-color LED chips are loaded on the substrate, then die bonding, key bonding, mold pressing, packaging and cutting are carried out, and due to the fact that the three-primary-color LED chips are loaded on the substrate, poor problems such as insufficient soldering between the LED chips and the substrate are prone to occurring, and meanwhile, the problem of stress failure between the LED chips and the substrate is prone to occurring during long-time use. In view of the above-mentioned drawbacks, it is necessary to design a micro substrate-less packaged three-primary-color LED and a packaging method thereof.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: a micro substrate-free packaged tricolor LED and a packaging method thereof are provided to solve the problems of insufficient solder joint and stress failure between a tricolor LED chip and a substrate.
In order to solve the technical problems, the technical scheme of the invention is as follows: a micro base-plate-free packaged tricolor LED comprises a tricolor LED chip, a primary plastic package layer, a conductive ball and a secondary plastic package layer, wherein the primary plastic package layer is positioned on the periphery and the top of the tricolor LED chip, the primary plastic package layer is fixedly connected with the tricolor LED chip, the conductive ball is positioned on the top of an electrode arranged on the top of the tricolor LED chip, the conductive ball is welded and connected with the electrode and fixedly connected with the primary plastic package layer, the secondary plastic package layer is positioned at the bottom of the tricolor LED chip, and the secondary plastic package layer is fixedly connected with the tricolor LED chip.
A packaging method of a miniature substrate-free packaged tricolor LED is characterized by comprising the following steps:
1) chip arrangement: taking a single R, G, B tricolor LED chip as an independent unit to be arrayed and horizontally placed on a planar carrier plate provided with a bonding and fixing film, wherein the non-electrode surface of the tricolor LED chip is attached to the planar carrier plate, the planeness of the planar carrier plate is less than or equal to 0.005mm, and R, G, B tricolor LED chips in the independent unit are arranged in a shape of Chinese character 'pin';
2) placing a conductive ball: implanting conductive balls on the electrodes of the distributed tricolor LED chips, wherein the conductive balls are used for conducting electricity, and the thickness of each conductive ball is 0.005mm-0.08 mm;
3) primary plastic package: carrying out primary plastic package on the top surface and the side surface of the tricolor LED chip implanted with the conductive balls by adopting a mold packaging process to obtain a primary plastic package chip plate, wherein the primary plastic package material is an opaque plastic package material with temperature resistance of not less than 200 ℃;
4) secondary plastic package: separating the planar carrier plate from the primary plastic package chip plate prepared in the step 3), and then carrying out secondary plastic package on the bottom surface of the separated primary plastic package chip plate by adopting a mold package process to prepare a secondary plastic package chip plate, wherein the plastic package material is transparent;
5) polishing: polishing the top surface of the secondary plastic package chip board prepared in the step 4) by using a polisher until 1/2-2/3 of the section of the conductive ball on the electrode of the tricolor LED chip is exposed;
6) cleaning and drying: cleaning the polished secondary plastic package chip board by using an ultrasonic cleaning machine, and drying the cleaned secondary plastic package chip board by using an oven, wherein the drying temperature is 50-80 ℃, and the drying time is 10-30 min;
7) separation: adhering a layer of adhesive fixing film on the bottom surface of the secondary plastic package chip board processed in the step 6), separating the independent units on the secondary plastic package chip board by using a cutting machine, and finally, adhering glass on the fixing film to the independent units to obtain a substrate-free three-primary-color LED semi-finished product, wherein the cutting machine does not cut off the adhesive fixing film;
8) testing and packaging: and (3) carrying out photoelectric parameter test on the substrate-free three-primary-color LED semi-finished product prepared in the step 7), and packaging to obtain the substrate-free three-primary-color LED finished product after the test is qualified.
The invention is further improved as follows:
further, the three-primary-color LED chip is any one of a two-electrode LED chip and a flip-chip LED chip with a transparent substrate.
The effective effect is as follows: the invention carries out the subsequent process to the tricolor LED chips by taking the carrier plate as the unit module, so that the subsequent packaging production process is simpler, the formed tricolor LED chips are shielded by an opaque one-time plastic packaging layer without forming light interference, the electrodes of the tricolor LED chips are implanted with the conductive balls, polishing is carried out after secondary plastic package is finished, the difference between the thickness of the tricolor LED chip and the die bonding flatness is completely eliminated, the false welding caused by the thickness difference of three chips in the SMT of a subsequent LED device is avoided, the welding tolerance of the flatness is improved, meanwhile, no substrate is packaged, therefore, the problems of insufficient soldering between the LED chip and the substrate and the like do not exist, the use reliability of the LED device is greatly improved, the packaging size of the tricolor LED is not limited, the miniaturization can be synchronized with the miniaturization development of the cutting size of the tricolor LED chip and the improvement of the mounting precision of the mounting equipment.
Drawings
FIG. 1 is a schematic view of a substrate-free tricolor LED structure
FIG. 2 shows a flow chart of the present invention
Primary plastic package layer 2 of three-primary-color LED chip 1
Electrode 101
Detailed Description
Example 1
As shown in fig. 1 and 2, the technical solution of the present invention is: a miniature substrate-free packaged tricolor LED comprises a tricolor LED chip 1, a primary plastic package layer 2, a conductive ball 3 and a secondary plastic package layer 4, wherein the primary plastic package layer 2 is positioned on the periphery and the top of the tricolor LED chip 1, the primary plastic package layer 2 is fixedly connected with the tricolor LED chip 1, the conductive ball 3 is positioned on the top of an electrode 101 arranged on the top of the tricolor LED chip 1, the conductive ball 3 is connected with the electrode 101 in a welding manner and is fixedly connected with the primary plastic package layer 2, the secondary plastic package layer 4 is positioned at the bottom of the tricolor LED chip 1, the secondary plastic package layer 4 is fixedly connected with the tricolor LED chip 1, and the tricolor LED chip is any one of a double-electrode LED chip with a transparent substrate and an inverted LED chip.
A packaging method of a miniature substrate-free packaged tricolor LED is characterized by comprising the following steps:
1) chip arrangement: taking a single R, G, B tricolor LED chip as an independent unit to be arrayed and horizontally placed on a planar carrier plate provided with a bonding and fixing film, wherein the non-electrode surface of the tricolor LED chip is attached to the planar carrier plate, the planeness of the planar carrier plate is less than or equal to 0.005mm, and R, G, B tricolor LED chips in the independent unit are arranged in a shape of Chinese character 'pin';
2) placing a conductive ball: implanting conductive balls on the electrodes of the distributed tricolor LED chips, wherein the conductive balls are used for conducting electricity, and the thickness of each conductive ball is 0.08 mm;
3) primary plastic package: carrying out primary plastic package on the top surface and the side surface of the tricolor LED chip implanted with the conductive balls by adopting a mold packaging process to obtain a primary plastic package chip plate, wherein the primary plastic package material is an opaque plastic package material with temperature resistance of not less than 200 ℃;
4) secondary plastic package: separating the planar carrier plate from the primary plastic package chip plate prepared in the step 3), and then carrying out secondary plastic package on the bottom surface of the separated primary plastic package chip plate by adopting a mold package process to prepare a secondary plastic package chip plate, wherein the plastic package material is transparent;
5) polishing: polishing the top surface of the secondary plastic package chip board prepared in the step 4) by using a polishing machine until 2/3 of the section of the conductive ball on the electrode of the tricolor LED chip is exposed;
6) cleaning and drying: cleaning the polished secondary plastic package chip board by using an ultrasonic cleaning machine, and drying the cleaned secondary plastic package chip board by using an oven, wherein the drying temperature is-80 ℃, and the drying time is 30 min;
7) separation: adhering a layer of adhesive fixing film on the bottom surface of the secondary plastic package chip board processed in the step 6), separating the independent units on the secondary plastic package chip board by using a cutting machine, and finally, adhering glass on the fixing film to the independent units to obtain a substrate-free three-primary-color LED semi-finished product, wherein the cutting machine does not cut off the adhesive fixing film;
8) testing and packaging: and (3) carrying out photoelectric parameter test on the substrate-free three-primary-color LED semi-finished product prepared in the step 7), and packaging to obtain the substrate-free three-primary-color LED finished product after the test is qualified.
Example 2
As shown in fig. 1 and 2, the technical solution of the present invention is: a miniature substrate-free packaged tricolor LED comprises a tricolor LED chip 1, a primary plastic package layer 2, a conductive ball 3 and a secondary plastic package layer 4, wherein the primary plastic package layer 2 is positioned on the periphery and the top of the tricolor LED chip 1, the primary plastic package layer 2 is fixedly connected with the tricolor LED chip 1, the conductive ball 3 is positioned on the top of an electrode 101 arranged on the top of the tricolor LED chip 1, the conductive ball 3 is connected with the electrode 101 in a welding manner and is fixedly connected with the primary plastic package layer 2, the secondary plastic package layer 4 is positioned at the bottom of the tricolor LED chip 1, the secondary plastic package layer 4 is fixedly connected with the tricolor LED chip 1, and the tricolor LED chip is any one of a double-electrode LED chip with a transparent substrate and an inverted LED chip.
A packaging method of a miniature substrate-free packaged tricolor LED is characterized by comprising the following steps:
1) chip arrangement: taking a single R, G, B tricolor LED chip as an independent unit to be arrayed and horizontally placed on a planar carrier plate provided with a bonding and fixing film, wherein the non-electrode surface of the tricolor LED chip is attached to the planar carrier plate, the planeness of the planar carrier plate is less than or equal to 0.005mm, and R, G, B tricolor LED chips in the independent unit are arranged in a shape of Chinese character 'pin';
2) placing a conductive ball: implanting conductive balls on the electrodes of the distributed tricolor LED chips, wherein the conductive balls are used for conducting electricity, and the thickness of each conductive ball is 0.005 mmmm;
3) primary plastic package: carrying out primary plastic package on the top surface and the side surface of the tricolor LED chip implanted with the conductive balls by adopting a mold packaging process to obtain a primary plastic package chip plate, wherein the primary plastic package material is an opaque plastic package material with temperature resistance of not less than 200 ℃;
4) secondary plastic package: separating the planar carrier plate from the primary plastic package chip plate prepared in the step 3), and then carrying out secondary plastic package on the bottom surface of the separated primary plastic package chip plate by adopting a mold package process to prepare a secondary plastic package chip plate, wherein the plastic package material is transparent;
5) polishing: polishing the top surface of the secondary plastic package chip board prepared in the step 4) by using a polishing machine until 1/2 of the section of the conductive ball on the electrode of the tricolor LED chip is exposed;
6) cleaning and drying: cleaning the polished secondary plastic package chip board by using an ultrasonic cleaning machine, and drying the cleaned secondary plastic package chip board by using an oven, wherein the drying temperature is 50 ℃, and the drying time is 10 min;
7) separation: adhering a layer of adhesive fixing film on the bottom surface of the secondary plastic package chip board processed in the step 6), separating the independent units on the secondary plastic package chip board by using a cutting machine, and finally, adhering glass on the fixing film to the independent units to obtain a substrate-free three-primary-color LED semi-finished product, wherein the cutting machine does not cut off the adhesive fixing film;
8) testing and packaging: and (3) carrying out photoelectric parameter test on the substrate-free three-primary-color LED semi-finished product prepared in the step 7), and packaging to obtain the substrate-free three-primary-color LED finished product after the test is qualified.
Example 3
As shown in fig. 1 and 2, the technical solution of the present invention is: a miniature substrate-free packaged tricolor LED comprises a tricolor LED chip 1, a primary plastic package layer 2, a conductive ball 3 and a secondary plastic package layer 4, wherein the primary plastic package layer 2 is positioned on the periphery and the top of the tricolor LED chip 1, the primary plastic package layer 2 is fixedly connected with the tricolor LED chip 1, the conductive ball 3 is positioned on the top of an electrode 101 arranged on the top of the tricolor LED chip 1, the conductive ball 3 is connected with the electrode 101 in a welding manner and is fixedly connected with the primary plastic package layer 2, the secondary plastic package layer 4 is positioned at the bottom of the tricolor LED chip 1, the secondary plastic package layer 4 is fixedly connected with the tricolor LED chip 1, and the tricolor LED chip is any one of a double-electrode LED chip with a transparent substrate and an inverted LED chip.
A packaging method of a miniature substrate-free packaged tricolor LED is characterized by comprising the following steps:
1) chip arrangement: taking a single R, G, B tricolor LED chip as an independent unit to be arrayed and horizontally placed on a planar carrier plate provided with a bonding and fixing film, wherein the non-electrode surface of the tricolor LED chip is attached to the planar carrier plate, the planeness of the planar carrier plate is less than or equal to 0.005mm, and R, G, B tricolor LED chips in the independent unit are arranged in a shape of Chinese character 'pin';
2) placing a conductive ball: implanting conductive balls on the electrodes of the distributed tricolor LED chips, wherein the conductive balls are used for conducting electricity, and the thickness of each conductive ball is 0.0065 mm;
3) primary plastic package: carrying out primary plastic package on the top surface and the side surface of the tricolor LED chip implanted with the conductive balls by adopting a mold packaging process to obtain a primary plastic package chip plate, wherein the primary plastic package material is an opaque plastic package material with temperature resistance of not less than 200 ℃;
4) secondary plastic package: separating the planar carrier plate from the primary plastic package chip plate prepared in the step 3), and then carrying out secondary plastic package on the bottom surface of the separated primary plastic package chip plate by adopting a mold package process to prepare a secondary plastic package chip plate, wherein the plastic package material is transparent;
5) polishing: polishing the top surface of the secondary plastic package chip board prepared in the step 4) by using a polishing machine until 3/5 of the section of the conductive ball on the electrode of the tricolor LED chip is exposed;
6) cleaning and drying: cleaning the polished secondary plastic package chip board by using an ultrasonic cleaning machine, and drying the cleaned secondary plastic package chip board by using an oven, wherein the drying temperature is 65 ℃, and the drying time is 20 min;
7) separation: adhering a layer of adhesive fixing film on the bottom surface of the secondary plastic package chip board processed in the step 6), separating the independent units on the secondary plastic package chip board by using a cutting machine, and finally, adhering glass on the fixing film to the independent units to obtain a substrate-free three-primary-color LED semi-finished product, wherein the cutting machine does not cut off the adhesive fixing film;
8) testing and packaging: and (3) carrying out photoelectric parameter test on the substrate-free three-primary-color LED semi-finished product prepared in the step 7), and packaging to obtain the substrate-free three-primary-color LED finished product after the test is qualified.
The present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make various modifications without creative efforts from the above-described conception, and fall within the scope of the present invention.
Claims (1)
1. A packaging method of a miniature substrate-free packaged tricolor LED is characterized by comprising the following steps:
1) chip arrangement: taking a single R, G, B tricolor LED chip as an independent unit to be arrayed and horizontally placed on a planar carrier plate provided with a bonding and fixing film, wherein the non-electrode surface of the tricolor LED chip is attached to the planar carrier plate, the planeness of the planar carrier plate is less than or equal to 0.005mm, and R, G, B tricolor LED chips in the independent unit are arranged in a shape of Chinese character 'pin';
2) placing a conductive ball: implanting conductive balls on the electrodes of the distributed tricolor LED chips, wherein the conductive balls are used for conducting electricity, and the thickness of each conductive ball is 0.005mm-0.08 mm;
3) primary plastic package: carrying out primary plastic package on the top surface and the side surface of the tricolor LED chip implanted with the conductive balls by adopting a mold packaging process to obtain a primary plastic package chip plate, wherein the primary plastic package material is an opaque plastic package material with temperature resistance of not less than 200 ℃;
4) secondary plastic package: separating the planar carrier plate from the primary plastic package chip plate prepared in the step 3), and then carrying out secondary plastic package on the bottom surface of the separated primary plastic package chip plate by adopting a mold package process to prepare a secondary plastic package chip plate, wherein the plastic package material is transparent;
5) polishing: polishing the top surface of the secondary plastic package chip board prepared in the step 4) by using a polisher until the exposed cross section area of the conductive ball is 1/2-2/3 of the center cross section of the conductive ball on the tricolor LED chip electrode;
6) cleaning and drying: cleaning the polished secondary plastic package chip board by using an ultrasonic cleaning machine, and drying the cleaned secondary plastic package chip board by using an oven, wherein the drying temperature is 50-80 ℃, and the drying time is 10-30 min;
7) separation: adhering a layer of adhesive fixing film on the bottom surface of the secondary plastic package chip board treated in the step 6), separating the independent units on the secondary plastic package chip board by using a cutting machine, and finally, coating glass on the independent units from the adhesive fixing film to obtain a substrate-free three-primary-color LED semi-finished product, wherein the cutting machine does not cut off the adhesive fixing film;
8) testing and packaging: and (3) carrying out photoelectric parameter test on the substrate-free three-primary-color LED semi-finished product prepared in the step 7), and packaging to obtain the substrate-free three-primary-color LED finished product after the test is qualified.
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| CN103021883A (en) * | 2012-12-09 | 2013-04-03 | 华天科技（西安）有限公司 | Flat package part manufacturing process based on corrosion plastic package body |
| CN105895785A (en) * | 2016-04-25 | 2016-08-24 | 湘能华磊光电股份有限公司 | Optical source assembly structure of flip LED chip integrated package and manufacturing method thereof |
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| CN104409615A (en) * | 2014-10-30 | 2015-03-11 | 广东威创视讯科技股份有限公司 | Flip LED chip and manufacturing method thereof, and flip LED chip packaging body and manufacturing method thereof |
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| CN103021883A (en) * | 2012-12-09 | 2013-04-03 | 华天科技（西安）有限公司 | Flat package part manufacturing process based on corrosion plastic package body |
| CN105895785A (en) * | 2016-04-25 | 2016-08-24 | 湘能华磊光电股份有限公司 | Optical source assembly structure of flip LED chip integrated package and manufacturing method thereof |
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