CN105792530A - PCB processing technology - Google Patents
PCB processing technology Download PDFInfo
- Publication number
- CN105792530A CN105792530A CN201610256713.3A CN201610256713A CN105792530A CN 105792530 A CN105792530 A CN 105792530A CN 201610256713 A CN201610256713 A CN 201610256713A CN 105792530 A CN105792530 A CN 105792530A
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- CN
- China
- Prior art keywords
- pcb
- unit
- exposure
- jigsaw
- unit pcb
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a PCB processing technology, which comprises the following steps: firstly, a PCB joint board is provided; a through hole is drilled in the PCB joint board, copper is then deposited, and a metallic through hole is formed; panel plating is then carried out; an outer-layer circuit of each unit PCB on the joint board is manufactured, electric measurement is carried out on the PCB joint board, unqualified unit PCBs are marked, an LDI exposure machine is used for selective exposure or a single chip negative film is used for selective exposure on the unqualified unit PCBs, and a graphic transfer process is completed; character screen printing, hot air leveling and contour machining are then carried out to complete the contour of each unit PCB; and finally, electric test, final inspection and packaging are then carried out on each unit PCB, and the PCB final production is completed.
Description
Technical field
The present invention relates to the production technical field of pcb board, particularly to the processing technique of a kind of pcb board.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed wiring board, is called for short printed board, with insulation board for base material, is cut into certain size, at least with a conductive pattern on it.Pcb board is one of vitals of electronics industry.Single sided board, dual platen, and multi-layer sheet can be divided into by the circuit number of plies.Wire be only present in wherein one side on pcb board be called one-sided circuit board.Dual platen is the extension of single sided board, two-sided have cover copper and have cabling, and the circuit between two-layer can be turned on by via, connect so as to form required network.Multi-layer sheet refers to that the conductive pattern layer with more than three layers forms with lamination of being separated by with insulant therebetween, and the printed board that conductive pattern interconnects on request therebetween.
The processing technique of existing pcb board generally comprises the steps: the heavy copper coin plating outer-layer circuit anti-welding surface treatment milling profile electrical measurement of sawing sheet boring examines packaging eventually.In actual production process; for improving production efficiency; multiple unit would generally be combined typesetting; and produce simultaneously; scrapping of individual unit may be there is at each manufacturing process; and scrap unit and also the same with normal cell can carry out indiscriminate subsequent handling processing, this certainly will cause the unnecessary wastes such as follow-up ink, causes that product cost is high, production efficiency is low.
Summary of the invention
The technical problem to be solved is: provide the processing technique of a kind of pcb board, solves the problem of waste of material when multiple unit PCB causes following process when jigsaw produces because of scrapping of unit, reduces cost, improves efficiency.
In order to reach above-mentioned technique effect, the technical solution used in the present invention is:
A kind of processing technique of pcb board, the processing step including following:
A. sawing sheet, it is provided that a PCB jigsaw being made up of multiple unit PCB；
B. hole, holes drilled through on PCB jigsaw；
C. heavy copper, makes the PCB jigsaw hole wall after holes drilled through have electric conductivity, forms plated-through hole；
D. plate plating, to the PCB jigsaw panel plating after plated-through hole；
E. outer-layer circuit: the outer-layer circuit completing each unit PCB on PCB jigsaw makes；
F. electrical measurement, carries out electrical measurement to completing the PCB jigsaw after outer-layer circuit makes, chooses underproof unit PCB and go forward side by side line flag；
G. anti-welding, markd unit PCB uses LDI exposure machine carry out selectivity exposure or use monolithic egative film to carry out selectivity exposure, completes Graphic transitions processing procedure；
H. surface treatment, carries out silk-screen character, hot air leveling to the PCB jigsaw after completing Graphic transitions processing procedure；
I. milling profile, utilizes Digit Control Machine Tool that PCB jigsaw carries out sharp processing, and completes the profile of each unit PCB.
J. electrical measurement: to each unit PCB testing electrical property after machining；
K. eventually inspection, to completing the qualified unit PCB final inspection after testing electrical property；
L. pack, pack examining qualified unit PCB eventually, complete the final processing of pcb board.
Compared with prior art, the present invention has the beneficial effect that: the present invention is direct electrical measurement after being made by outer-layer circuit, to defective unit program communication block mask, exposed by the selectivity of solder resistance process and effectively reduce in later process for processing the material of defective unit PCB, reduce cost, also reduce the time being wasted in processing and detecting on defective unit PCB simultaneously, improve work efficiency, and manufacture method is simple, it is possible to industrialization makes, and possesses good market application foreground.
The present invention further improves as follows:
Further, the rear curing process after anti-welding pre-treatment, printing and the hard baking also included before selectivity exposure of described step G and the exposure of selecting property.
Further, the underproof unit PCB of the labelling in described step F for do concave groove mark on underproof unit PCB.Can easily identify and be quickly found out when can facilitate post-exposure by concave groove mark, save the time.
Further, using LDI exposure machine to carry out selectivity exposure in described step G is the editting function utilizing LDI exposure machine, is compiled as transparent area in the data corresponding at markd unit PCB region.By the editting function of LDI exposure machine can all defective unit PCB on disposable editor same PCB jigsaw, improve work efficiency.
Further, using monolithic egative film to carry out selectivity exposure in described step G is that underproof unit PCB region does not paste the film and directly exposes in qualified unit PCB region patch film exposure.By using monolithic egative film to carry out selectivity exposure, though extending this activity time, but it is effectively shortened follow-up process time and the costs such as material can be saved for following process, reducing the production cost of entirety.
Detailed description of the invention
Below in conjunction with embodiment, the present invention will be further described:
A kind of processing technique of pcb board, the processing step including following:
A. sawing sheet, it is provided that a PCB jigsaw being made up of multiple unit PCB；
B. hole, holes drilled through on PCB jigsaw；
C. heavy copper, makes the PCB jigsaw hole wall after holes drilled through have electric conductivity, forms plated-through hole；
D. plate plating, to the PCB jigsaw panel plating after plated-through hole；
E. outer-layer circuit, the outer-layer circuit completing each unit PCB on PCB jigsaw makes；
F. electrical measurement, carries out electrical measurement to completing the PCB jigsaw after outer-layer circuit makes, chooses underproof unit PCB and go forward side by side line flag；
G. anti-welding, markd unit PCB uses LDI exposure machine carry out selectivity exposure or use monolithic egative film to carry out selectivity exposure, completes Graphic transitions processing procedure；
H. surface treatment, carries out silk-screen character, hot air leveling to the PCB jigsaw after completing Graphic transitions processing procedure；
I. milling profile, utilizes Digit Control Machine Tool that PCB jigsaw carries out sharp processing, and completes the profile of each unit PCB.
J. electrical measurement, to each unit PCB testing electrical property after machining；
K. eventually inspection, to completing the qualified unit PCB final inspection after testing electrical property；
L. pack, pack examining qualified unit PCB eventually, complete the final processing of pcb board.
Compared with prior art, the present invention has the beneficial effect that: the present invention is direct electrical measurement after being completed by outer-layer circuit, and defective unit PCB is carried out labelling and is exposed by the selectivity of solder resistance process, effectively save in later process for processing the material of defective unit PCB, ink etc., reduce cost, also reduce the time being wasted in processing and detecting on defective unit PCB simultaneously, improve work efficiency, and manufacture method is simple, industrialization can make, possess good market application foreground.
The present invention further improves as follows:
Further, the rear curing process after anti-welding pre-treatment, printing and the hard baking also included before selectivity exposure of described step G and the exposure of selecting property.
Further, the underproof unit PCB of the labelling in described step F for do concave groove mark on underproof unit PCB.Can easily identify and be quickly found out when can facilitate post-exposure by concave groove mark, save the time.
Further, using LDI exposure machine to carry out selectivity exposure in described step G is the editting function utilizing LDI exposure machine, is compiled as transparent area in the data corresponding at markd unit PCB region.By the editting function of LDI exposure machine can all defective unit PCB on disposable editor same PCB jigsaw, improve work efficiency.
Further, using monolithic egative film to carry out selectivity exposure in described step G is that underproof unit PCB region does not paste the film and directly exposes in qualified unit PCB region patch film exposure.By using monolithic egative film to carry out selectivity exposure, though extending this activity time, but it is effectively shortened follow-up process time and the costs such as material can be saved for following process, reducing the production cost of entirety.
The present invention is not limited to above-mentioned specific embodiment, for the person of ordinary skill of the art from above-mentioned design, without performing creative labour, done all conversion, all falls within protection scope of the present invention.
Claims (5)
1. the processing technique of a pcb board, it is characterised in that include following processing step:
A. sawing sheet, it is provided that a PCB jigsaw being made up of multiple unit PCB；
B. hole, holes drilled through on PCB jigsaw；
C. heavy copper, makes the PCB jigsaw hole wall after holes drilled through have electric conductivity, forms plated-through hole；
D. plate plating, to the PCB jigsaw panel plating after plated-through hole；
E. outer-layer circuit, the outer-layer circuit completing each unit PCB on PCB jigsaw makes；
F. electrical measurement, carries out electrical measurement to completing the PCB jigsaw after outer-layer circuit makes, chooses underproof unit PCB and go forward side by side line flag；
G. anti-welding, markd unit PCB uses LDI exposure machine carry out selectivity exposure or use monolithic egative film to carry out selectivity exposure, completes Graphic transitions processing procedure；
H. surface treatment, carries out silk-screen character, hot air leveling to the PCB jigsaw after completing Graphic transitions processing procedure；
I. milling profile, utilizes Digit Control Machine Tool that PCB jigsaw carries out sharp processing, and completes the profile of each unit PCB；
J. electrical measurement, to each unit PCB testing electrical property after machining；
K. eventually inspection, to completing the qualified unit PCB final inspection after testing electrical property；
L. pack, pack examining qualified unit PCB eventually, complete the final processing of pcb board.
2. the processing technique of a kind of pcb board according to claim 1, it is characterised in that the rear curing process after anti-welding pre-treatment, printing and the hard baking also included before selectivity exposure of described step G and the exposure of selecting property.
3. the processing technique of a kind of pcb board according to claim 1, it is characterised in that the underproof unit PCB of labelling in described step F for do concave groove mark on underproof unit PCB.
4. the processing technique of a kind of pcb board according to claim 1, it is characterized in that, using LDI exposure machine to carry out selectivity exposure in described step G is the editting function utilizing LDI exposure machine, is compiled as transparent area in the data corresponding at markd unit PCB region.
5. the processing technique of a kind of pcb board according to claim 1, it is characterised in that using monolithic egative film to carry out selectivity exposure in described step G is that underproof unit PCB region does not paste the film and directly exposes in qualified unit PCB region patch film exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610256713.3A CN105792530B (en) | 2016-04-25 | 2016-04-25 | A kind of processing technology of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610256713.3A CN105792530B (en) | 2016-04-25 | 2016-04-25 | A kind of processing technology of pcb board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105792530A true CN105792530A (en) | 2016-07-20 |
| CN105792530B CN105792530B (en) | 2019-01-29 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060033075A (en) * | 2004-10-14 | 2006-04-19 | 브이케이 주식회사 | A marking method of installed parts on pcb |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN102364999A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of mechanical conduction hole circuit board without holes on surface |
| CN103533783A (en) * | 2013-10-24 | 2014-01-22 | 东莞康源电子有限公司 | Manufacturing method of multi-layer PCB (printed circuit board) |
| CN105407653A (en) * | 2015-12-02 | 2016-03-16 | 日彩电子科技(深圳)有限公司 | Manufacturing method of circuit board |
-
2016
- 2016-04-25 CN CN201610256713.3A patent/CN105792530B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060033075A (en) * | 2004-10-14 | 2006-04-19 | 브이케이 주식회사 | A marking method of installed parts on pcb |
| CN101951736A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Process for producing circuit board metallized semi-holes |
| CN102364999A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of mechanical conduction hole circuit board without holes on surface |
| CN103533783A (en) * | 2013-10-24 | 2014-01-22 | 东莞康源电子有限公司 | Manufacturing method of multi-layer PCB (printed circuit board) |
| CN105407653A (en) * | 2015-12-02 | 2016-03-16 | 日彩电子科技(深圳)有限公司 | Manufacturing method of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105792530B (en) | 2019-01-29 |
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Effective date of registration: 20201209 Address after: No.619, Jingtang Road, PCB Industrial Park, Guangde Economic Development Zone, Xuancheng City, Anhui Province Patentee after: Guangde Wang Intelligent Circuit Technology Co.,Ltd. Address before: 215000 Zhanshangcun, Huangqiao Town, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: WANG'S CIRCUIT BOARD Co.,Ltd. |