CN104394665A - Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board - Google Patents
Manufacturing method of ultrathin printed circuit board, and ultrathin printed circuit board Download PDFInfo
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- CN104394665A CN104394665A CN201410545265.XA CN201410545265A CN104394665A CN 104394665 A CN104394665 A CN 104394665A CN 201410545265 A CN201410545265 A CN 201410545265A CN 104394665 A CN104394665 A CN 104394665A
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- copper foil
- ultra
- supporting bracket
- manufacture method
- thin printed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a manufacturing method of an ultrathin printed circuit board, and an ultrathin printed circuit board. According to the manufacturing method, copper foils and bonding plates are laminated at a support plate in hot-pressing mode and the thin copper foils and the thin bonding plates are supported by the support plate. Therefore, plate thickness limitation by equipment in production of electroplating and graph transferring and the like can be effectively eliminated; deformation like warping, bending, and small wrinkle existence and the like of carriers including a first copper foil, a second copper foil and a conductive layer and the like during the lamination and hot pressing process can be effectively improved; and problems of scrapping of the printed circuit board and low yield of the board due to insufficient hardness and poor smoothness of the laminated object can be solved.
Description
Technical field
The present invention relates to the manufacture field of wiring board, particularly a kind of manufacture method of ultra-thin printed substrate and ultra-thin printed substrate.
Background technology
Printed substrate (Printed Circuit Board), being called for short PCB, also known as printed board, is one of vitals of electronic product.Figure due to printed substrate has repeatability (reproducibility) and consistency, decreases the mistake of wiring and assembling, saves the maintenance of equipment, debugging and review time.Can standardization in design, be beneficial to exchange; Printed substrate wiring density is high, and volume is little, lightweight, is beneficial to the miniaturization of electronic equipment; Be beneficial to mechanization, automated production, improve labor productivity and reduce the cost of electronic equipment.
Wiring board is towards trend developments such as light, thin, little and high density interconnects in recent years, will reprint more microdevice on limited surface, and this just impels the deisgn approach high density of printed substrate, high accuracy, multiple stratification and the development of aspect, small-bore.In order to adapt to the demand for development that electronic product becomes more meticulous, electronic product is also continuous to thinner future development.This brings new challenge also to the manufacture craft of printed substrate.Preparation for ultra-thin printed substrate must research and development new technology, new equipment, to avoid in production process equipment to plate thickness restriction or and to avoid the problems such as the distortion of production development plate, warpage.
Summary of the invention
An object of the present invention is to overcome deficiency of the prior art, provides a kind of manufacture method being applicable to ultra-thin printed substrate.
For realizing above object, the present invention is achieved through the following technical solutions:
The manufacture method of ultra-thin printed substrate, is characterized in that, comprises the steps:
A., one supporting bracket is provided; At least one surface of described supporting bracket is provided with locating template; Described locating template is for locating the first Copper Foil; Described locating template is provided with positioning pattern;
B. one first Copper Foil is set on the surface of locating template; Described first Copper Foil aligns with described locating template; The area of described first Copper Foil is less than the area of described supporting bracket; One first bonding sheet is provided to cover described first Copper Foil; Described first bonding sheet area is suitable with described supporting bracket;
C. arrange one second Copper Foil on the surface of described first bonding sheet, described second Copper Foil area is suitable with described supporting bracket; Hot pressing, makes described second Copper Foil, described first bonding sheet, the first described Copper Foil and described supporting bracket bonding; Before described steps d or step e, the boring of described positioning pattern place is formed the positioning through hole running through described second Copper Foil, the first bonding sheet and supporting bracket;
D. on the second Copper Foil, carry out laser drill, chemical plating and electro-coppering make, and the second Copper Foil is connected with the first Copper Foil electric conduction;
E. Graphic transitions is carried out to described second Copper Foil, form the second conducting wire;
F. according to the position of positioning through hole, adopt the product that the longitudinal cutting step e of cutting tool obtains, the first mutually bonding Copper Foil, the first bonding sheet and the second conducting wire are peeled off from described supporting bracket, obtains the laminated sheet that at least one comprises the first Copper Foil, the first bonding sheet and the second conducting wire;
G. Graphic transitions is carried out to the first Copper Foil of described laminated sheet, form the first conducting wire; Final obtained described ultra-thin printed substrate.
Preferably, described supporting bracket comprises macromolecular material central layer and is arranged on locating template and the positioning pattern of macromolecular material core plate surface; In described step a, location Copper Foil is set at least one surface of described supporting bracket; Described location Copper Foil is bonding with described macromolecular material central layer; Described Copper Foil is etched or cut formation groove, makes described location Copper Foil form described locating template and the location copper frame around described locating template.
Be preferably, described positioning pattern is for being formed for posting through-thickness being removed part or all or will remove part or all removal formation by all the other posting through-thickness except positioning pattern.
Preferably, in described step b, according to the position of the first Copper Foil, adopt sideline, infrared ray mark location; In step c, determine described second Copper Foil position according to sideline, described location.
Preferably, in described step b, hot pressing makes described first bonding sheet described first Copper Foil bonding with described supporting bracket be held between described first bonding sheet and supporting bracket.
Preferably, in described step e, identify the position of positioning pattern, according to the position relationship between described positioning pattern and described first Copper Foil, determine cutting path.
Preferably, in described step e, milling cutter is adopted longitudinally to cut the product worn step f and obtain along between described second circuit pattern edge and described first Copper Foil edge.
Preferably, in described step g, also comprise described laminated sheet is holed, chemical plating, plating or etch processes.
Preferably, in described step g, after forming the first conducting wire, one deck protection against oxidation film is set on the surface of described first conducting wire.
Preferably, in described step e, after forming the second conducting wire, few one deck bonding sheet and Copper Foil is stacked at described second conducting wire superficial layer; Make described bonding sheet between described second conducting wire and Copper Foil or both sides Copper Foil; It is bonding that each layer Copper Foil and the second conducting wire and each layer Copper Foil pass through bonding sheet; Under covering before one deck bonding sheet, first the Copper Foil in outside is made conductive hole and circuit.
Preferably, after the Copper Foil being positioned at outside being carried out laser drill, chemical plating, electro-coppering, Graphic transitions process, forming conductive hole and circuit, more stacked lower one deck adhesive sheet and Copper Foil.
Preferably, step a-g is carried out respectively at the upper surface of supporting bracket and lower surface; One or more layers laminated sheet is formed respectively at the upper surface of described supporting bracket and lower surface.
Preferably, the thickness of described supporting bracket is not less than 0.35mm, or is not less than the minimum thickness of slab requirement of production equipment.
Preferably, the thickness of described laminated sheet is less than 0.05mm.
Preferably, in described steps d, be the position with reference to determining to hole according to the position of described positioning through hole.
Preferably, in described step e, be with reference to carrying out Graphic transitions processing according to the position of described positioning through hole.
Preferably, X-ray is adopted to irradiate the position identifying positioning pattern; Utilize the light transmittance at positioning pattern place different to identify the position of positioning pattern, and then locating and machining through hole.
Two of object of the present invention is to overcome deficiency of the prior art, provides a kind of ultra-thin printed substrate.
For realizing above object, the present invention is achieved through the following technical solutions:
Ultra-thin printed substrate, is characterized in that, adopts aforementioned manufacturing method to produce.
The manufacture method of ultra-thin printed substrate provided by the invention, Copper Foil and bonding sheet are hot stacked in thickness to be greater than in the supporting bracket of 0.35mm, by the Copper Foil that supporting bracket support thickness is thinner, bonding sheet, effectively avoid plating, in the production such as Graphic transitions, equipment limits plate thickness, effective carrier that to improve in Graphic transitions or laminating hot pressing process is (as the first Copper Foil, second Copper Foil, conductive layer etc.) be out of shape (as warpage, bending, little wrinkle etc.), problem that is not enough due to laminate hardness and planarization difference is avoided to cause printed substrate to scrap, the problem that yield is low.
Ultra-thin printed substrate due to thickness little, each layer rigidity is little, therefore cannot use conventional production methods directly by Copper Foil, bonding sheet lamination.When using produced in conventional processes, because each layer thickness is little, some production equipments cannot be produced by the restriction of thickness of slab, or easily clamp occur, and the distortion such as slab warping, bending, fold easily occur, has a strong impact on product quality.By the method providing support plate, the present invention solves that each layer rigidity is not enough, plate thin cause distortion, the problem such as cannot to produce.Utilize supporting bracket to provide support Copper Foil, bonding sheet, prevent it to be out of shape in lamination process.Supporting bracket uses macromolecular material central layer and location Copper Foil, can be placed on locating template by the first Copper Foil, the first Copper Foil can be prevented bonding with macromolecular material central layer and cause peeling off.Adopt locating template, its position can be determined easily, in conjunction with the use of infrared position line, the position of the second Copper Foil and all the other Copper Foils can be determined easily, multilayer copper foil is alignd.Because bonding sheet area is greater than the first Copper Foil, cover after on the first Copper Foil, the position of the first Copper Foil is not easily determined, therefore, the present invention adopts and arranges positioning pattern as with reference to mark, in the follow-up course of processing, using positioning pattern as with reference to position, conveniently process and multilayer line pattern alignment.Locating template and positioning pattern all use copper material to be processed to form, and the first Copper Foil namely can be prevented bonding with macromolecular material central layer, and line pattern processing technology can be utilized again easily to process.Positioning pattern in the present invention, locating template can utilize the techniques such as etching to be processed to form easily, can utilize existing line board machining process, without the need to carrying out large-scale redevelopment to production line.Utilize positioning pattern, even if covered completely by the first Copper Foil, also can determine its position easily.Positioning pattern in the present invention, adopt the figure running through posting, its shape can be determined according to actual use occasion, as adopted the various shapes such as circle, annulus, square.Positioning pattern set-up mode in the present invention, easy to use, when use x-ray bombardment time, X ray can through macromolecule central layer from positioning pattern through.Therefore, present invention utilizes conventional material, not only make use of X ray and can not penetrate copper material, but also make use of the feature that X ray can penetrate macromolecule core material, adopted the positioning pattern location running through posting.
In the present invention, the first Copper Foil is between bonding sheet and supporting bracket, and the area due to the first Copper Foil is less than the area of bonding sheet and supporting bracket, thus makes the edge of bonding sheet can be bonding with supporting bracket, is gripped by the first Copper Foil.In actual production, if without positioning pattern location, the position of at every turn being placed on the supporting plate by the first Copper Foil is all not identical.After the bonding sheet being greater than the first Copper Foil when area covers the first copper foil surface, operating personnel cannot see the first Copper Foil at all, namely cannot determine the first Copper Foil physical location on the supporting plate, this is follow-up stacked new copper-foil conducting electricity, make conductive hole, conductive pattern, mechanical milling be separated supporting bracket and the first Copper Foil and all bring trouble.If the position of the first Copper Foil that operating personnel judge and the physical location generation deviation of the first Copper Foil, the conducting wire of follow-up making will be caused to offset, the phenomenons such as the conductive pattern region of the first Copper Foil are dropped in the position of punching, cutting, affect product quality, even cause scrapping.In traditional handicraft, for avoiding punching, the position of cutting drop on the first Copper Foil conductive pattern region in cause product rejection, can increase the area of supporting bracket and adhesive sheet, make it much larger than the first Copper Foil, the probability in the conductive pattern region of the first Copper Foil is dropped in the position of reduction punching, cutting.Raw materials consumption amount can be increased like this, add production cost.
The present invention, by arranging locating template on the surface of supporting bracket and offering positioning through hole, makes the first Copper Foil, bonding sheet, the second Copper Foil and insulating barrier stacked on the second Copper Foil, conductive layer all can be accurately positioned in assigned address in supporting bracket.Place corresponding with the copper sheet position of locating template for the first Copper Foil, located assigned address on the supporting plate by copper sheet.Follow-up bonding sheet, the second Copper Foil, insulating barrier, conductive layer are sequentially laminated in the first copper foil surface process, even if operating personnel's naked eyes cannot see the first Copper Foil, also identifier identification positioning through hole can be adopted, by the position relationship of positioning through hole and copper sheet, determine the first Copper Foil physical location on the supporting plate, make bonding sheet, the second Copper Foil, insulating barrier, conductive layer successively accurate layer be stacked in the surface of the first Copper Foil.Avoid conducting wire to offset, drop on the generation of the phenomenons such as the conductive pattern region of the first Copper Foil in the position of punching, cutting, improves product quality and yields.Can raw-material consumption be down to minimum simultaneously, save production cost.
Employing cutting tool cuts supporting bracket after cutting the insulating barrier overdrawed on fagging, the first bonding sheet, copper sheet, and cutting path in the form of a ring, and make the bonding portion of the first bonding sheet and supporting bracket depart from the first Copper Foil, the first Copper Foil is separated with supporting bracket.First Copper Foil and copper sheet position are placed mutually accordingly, except playing positioning action, also the first Copper Foil can be avoided directly to contact with supporting bracket, thus prevent the first Copper Foil and supporting bracket in hot pressing from bonding together, after guaranteeing cutting, the first Copper Foil is separated smoothly with supporting bracket.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the supporting bracket in the present invention;
Fig. 2 is the vertical view of the supporting bracket after step a of the present invention completes;
Fig. 3 is the A-A cutaway view of Fig. 2;
Fig. 4 is supporting bracket and the first Copper Foil, the first bonding sheet cutaway view schematic diagram of step b in embodiment 1;
Fig. 5 is supporting bracket and the first Copper Foil, the first bonding sheet cutaway view schematic diagram of the step b of embodiment 1;
Fig. 6 is the product structure cutaway view after the step b of embodiment 1 completes;
Fig. 7 is the product structure cutaway view after the step c of embodiment 1 completes;
Fig. 8 is the product structure cutaway view after completing in the step e of embodiment 1;
Fig. 9 be in embodiment 1 step f complete after product structure cross-sectional schematic;
Figure 10 is the product structure cutaway view after the step g of embodiment 1 completes;
Figure 11 is the product structure cutaway view after the step c process of embodiment 2;
Figure 12 is the product structure cutaway view after the step c of embodiment 2 completes;
Figure 13 is the structure cutaway view of the ultra-thin printed substrate that embodiment 2 obtains;
Figure 14 is the structure cutaway view of the ultra-thin printed substrate that embodiment 3 obtains;
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
Embodiment 1
The manufacture method of ultra-thin printed substrate, is characterized in that, comprises the steps:
A. as shown in Figure 1, provide macromolecular material central layer 14, upper surface and lower surface arrange a location Copper Foil 20 respectively, location Copper Foil 20 is bonding with macromolecular material central layer 14.As shown in Figure 2 and Figure 3, Graphic transitions, etching or milling are carried out to location Copper Foil 20 and forms groove 23, make location Copper Foil 20 form locating template 21 and posting 22.Posting 22 is around locating template 21.Posting 22 is processed to form positioning pattern 24.Positioning pattern 24 is formed for posting 22 through-thickness being removed part or all or except positioning pattern 24, will remove part or all removal formation by all the other posting through-thickness, its shape and number can be determined according to use occasion, the figure that can be rule, as circular, annular or square, rectangle, also can be irregular shape.The processing method of positioning pattern 24 can adopt the mode of Graphic transitions, etching or milling.In preferred exemplary as shown in the figure, positioning pattern 24 place is less than other part thickness of posting 22.Finally form supporting bracket 10.Supporting bracket 10 both can be that one side uses, and also can be two-sided use.In the present invention, the two-sided use of preferred supporting bracket 10, namely all arranges locating template 21, posting 22 and positioning pattern 24 in the upper and lower surface of macromolecular material central layer 14.Positioning pattern 24 number is four, is circular positioning pattern.The thickness H of supporting bracket 10 is not less than 0.35mm, or is not less than the minimum thickness of slab requirement of production equipment.
B. as shown in Figure 4, provide one first Copper Foil 4, first Copper Foil 4 suitable with the shape size of locating template 21.As shown in Figure 5, the first Copper Foil 4 is placed on locating template 21, and the two position is mutually corresponding.Adopt sideline, infrared ray mark location, use four infrared radiations at the first Copper Foil 4 edge, as location graticule.In subsequent machining technology, sideline, location is lighted all the time, facilitates other Copper Foil to locate.The area providing one first bonding sheet 5 to cover the first Copper Foil 4, first bonding sheet 5 is greater than the area of the first Copper Foil 4, and preferably it is identical with supporting bracket 10 area in the present invention.Hot pressing, makes the first bonding sheet 5 bond together with the upper surface 11 of supporting bracket 10, the first Copper Foil 4 is clamped in centre.
Repeat abovementioned steps, by the lower surface 12 of supporting bracket 10 upward, the first Copper Foil 4 and the first bonding sheet 5 is set on the lower surface.After completing, its structure as shown in Figure 5.
C. as shown in Figure 6, one second Copper Foil 6 is set on the surface of the first bonding sheet 5.Determined the position of the second Copper Foil 6 by sideline, infrared location, make the second Copper Foil 6 cover sideline, four location, that is to say and cover the first Copper Foil 4.Lamination, makes the second Copper Foil 6 bonding with the first bonding sheet 5.
D. on the second Copper Foil 6, carry out laser drill, chemical plating and electro-coppering make, and the second Copper Foil 6 is electrically connected with the first Copper Foil 4.
E. as described in Figure 7, Graphic transitions is carried out to the second Copper Foil 6, forms the second conducting wire 61.Graphic transitions adopts prior art, comprises pad pasting, exposure, development, etching etc.
In steps d and e, the position of boring, the location of the film all need accurately to determine.Also reference by location is needed to mark the position accurately could determining line pattern during exposure.Before steps d or step e, X-ray is first utilized to irradiate the position identifying positioning pattern 24.Because the thickness at positioning pattern 24 place is different from peripheral thickness, light transmittance when therefore X-ray irradiates is also different.Positioning pattern 24 is formed for posting 22 through-thickness being removed part or all, then all the other part thickness of posting 22 of the Thickness Ratio at positioning pattern 24 place are little, then the light transmittance at positioning pattern 24 place is high, and the figure brightness that X-ray is radiated at the formation of this position is high.If positioning pattern 24 is by removing part or all removal formation by all the other posting through-thickness except positioning pattern 24, then the thickness at positioning pattern 23 place is large, then the light transmittance at positioning pattern 24 place is low, and the image brightness formed at positioning pattern 23 place after X-ray irradiates is low.Identify and process a positioning through hole 13 (as shown in Figure 8) in the position of positioning pattern 24, using positioning through hole 13 as telltale mark in the position that positioning pattern 24 is right.The position of the first Copper Foil 4 can be determined accordingly, also can using location positioning through hole 13 as reference position, and continue to use in follow-up processing.Can guarantee that the conducting wire being separately positioned on different layers can be aimed at, conveniently be electrically connected processing, prevent skew.
F. as shown in Figure 8, according to the position of positioning through hole 13, adopt the product that the longitudinal cutting step e of cutting tool obtains, cutting path 25 is around the first Copper Foil 4, first bonding sheet 5 and the second conducting wire 61.As shown in Figure 9, after having cut, the first mutually bonding Copper Foil 4, first bonding sheet 5 and the second conducting wire 61 are peeled off from described supporting bracket 10, obtains the laminated sheet 7 that at least one comprises the first Copper Foil 4, first bonding sheet 5 and the second conducting wire 61.Cutting path 25 between the second conducting channel 61 edge and the first Copper Foil 4 edge, or along the edge of the first Copper Foil 4, cuts around the second conducting wire 61.Second conducting wire 61 is that the first Copper Foil 4 is determined with the relative position of positioning through hole 13, therefore easily and accurately can determine the cutting path 25 of milling cutter according to the position of positioning through hole 13 according to the position of positioning through hole 13 for reference to making.
Longitudinally after cutting, the second conducting wire 61, first bonding sheet 5 mutually bondd and the first Copper Foil 4 are peeled off from supporting bracket 10, obtains two laminated sheets 7 as shown in Figure 9.The thickness of laminated sheet 7 is less than 0.05mm.
G. Graphic transitions process is carried out to the first Copper Foil 4 of ground floor pressing plate 7, form the first conducting wire 41, obtained ultra-thin printed substrate 9.
For preventing conducting wire to be oxidized, protection against oxidation film (not shown) can be set on the surface of the first conducting wire 41 and the second conducting wire 61, guarantee good electric conductivity.Namely the setting of protection against oxidation film can be carried out after being formed a conducting wire wherein, also can unify to arrange after conducting wire is all formed.
Embodiment 2
As shown in figure 11, the present embodiment, on the basis of embodiment 1, in step e, will be positioned at outermost second Copper Foil 6 and be processed as after the second conducting wire 61 formed, at the second conducting wire 61 surface coverage second bonding sheet 81 and the 3rd Copper Foil 82.Second bonding sheet 81 covers the second conducting wire 61.Sideline, infrared location is utilized to determine the position of the 3rd Copper Foil 82.According to the position of positioning through hole 13 after lamination, boring, plating, make the 3rd Copper Foil 82 be electrically connected with one of both the second conducting wire 61 and first Copper Foil 4 or both.As shown in figure 12, according to the position of positioning through hole 13, Graphic transitions process is carried out to the 3rd Copper Foil 82, make it formation the 3rd conducting wire 83.
In step f, the product that the longitudinal cutting step e of mechanical milling cutter obtains.According to the position of positioning through hole 13, determine that cutting path does not damage the second conducting wire 61, the 3rd conducting wire 83.The 3rd bonding sheet 81, second conducting wire 61, first, conducting wire 83, second bonding sheet 5 mutually bondd and the first Copper Foil 4 are peeled off from supporting bracket 10.
In addition to the above, the other guide of the present embodiment is all identical with embodiment 1.The present embodiment obtains the ultra-thin printed substrate 20 that two have three layers of conducting wire as shown in fig. 13 that.
Embodiment 3
On the basis of embodiment 2, in step e, will be positioned at after outermost 3rd Copper Foil 82 is processed as the 3rd conducting wire 83, the 3rd conducting wire 83 surface coverage the 3rd bonding sheet 91 and the 4th Copper Foil.3rd bonding sheet 91 covers the 3rd conducting wire 83.According to the position of positioning through hole 13 after lamination, boring, plating, make the 4th Copper Foil and the 3rd conducting wire, conducting wire 83, second 61 and the first Copper Foil 4 thrin or both or three be electrically connected.According to the position of positioning through hole 13, Graphic transitions process is carried out to the 4th Copper Foil, make it formation the 4th conducting wire 93.
In step f, the product that the longitudinal cutting step e of mechanical milling cutter obtains.According to the position of positioning through hole 13, determine that cutting path does not damage the 4th conducting wire 61, conducting wire 93, second, the 3rd conducting wire 83.The 4th conducting wire 93 mutually bondd, the 3rd bonding sheet 91, the 3rd bonding sheet 81, second conducting wire 61, first, conducting wire 83, second bonding sheet 5 and the first Copper Foil 4 are peeled off from supporting bracket 10.
In addition to the above, the other guide of the present embodiment is all identical with embodiment 2.The present embodiment obtains two ultra-thin printed substrates 30 with three layers of conducting wire as shown in figure 14.
Upper and lower in the present invention is all reference with Fig. 1, for clearly the present invention being described and the relative concept that uses, longitudinally refers to the above-below direction in Fig. 1.Thickness direction refers to above-below direction.Cutaway view of the present invention is all that the A-A in Fig. 2 analyses and observe direction.
Embodiment in the present invention, only for the present invention will be described, does not form the restriction to right, other equivalent in fact substituting, all in scope that those skilled in that art can expect.
Claims (18)
1. the manufacture method of ultra-thin printed substrate, is characterized in that, comprises the steps:
A., one supporting bracket is provided; At least one surface of described supporting bracket is provided with locating template; Described locating template is for locating the first Copper Foil; Described locating template is provided with positioning pattern;
B. one first Copper Foil is set on the surface of locating template; Described first Copper Foil aligns with described locating template; The area of described first Copper Foil is less than the area of described supporting bracket; One first bonding sheet is provided to cover described first Copper Foil; Described first bonding sheet area is suitable with described supporting bracket;
C. arrange one second Copper Foil on the surface of described first bonding sheet, described second Copper Foil area is suitable with described supporting bracket; Hot pressing, makes described second Copper Foil, described first bonding sheet, the first described Copper Foil and described supporting bracket bonding; Before described steps d or step e, the boring of described positioning pattern place is formed the positioning through hole running through described second Copper Foil, the first bonding sheet and supporting bracket;
D. on the second Copper Foil, carry out laser drill, chemical plating and electro-coppering make, and the second Copper Foil is connected with the first Copper Foil electric conduction;
E. Graphic transitions is carried out to described second Copper Foil, form the second conducting wire;
F. according to the position of positioning through hole, adopt the product that the longitudinal cutting step e of cutting tool obtains, the first mutually bonding Copper Foil, the first bonding sheet and the second conducting wire are peeled off from described supporting bracket, obtains the laminated sheet that at least one comprises the first Copper Foil, the first bonding sheet and the second conducting wire;
G. Graphic transitions is carried out to the first Copper Foil of described laminated sheet, form the first conducting wire; Final obtained described ultra-thin printed substrate.
2. the manufacture method of ultra-thin printed substrate according to claim 1, is characterized in that, described supporting bracket comprises macromolecular material central layer and is arranged on locating template and the positioning pattern of macromolecular material core plate surface; In described step a, location Copper Foil is set at least one surface of described supporting bracket; Described location Copper Foil is bonding with described macromolecular material central layer; Described Copper Foil is etched or cut formation groove, makes described location Copper Foil form described locating template and the location copper frame around described locating template.
3. the manufacture method of ultra-thin printed substrate according to claim 2, it is characterized in that, described positioning pattern is formed for posting through-thickness being removed part or all or except positioning pattern, will remove part or all removal formation by all the other posting through-thickness.
4. the manufacture method of ultra-thin printed substrate according to claim 2, is characterized in that, in described step b, according to the position of the first Copper Foil, adopts sideline, infrared ray mark location; In step c, determine described second Copper Foil position according to sideline, described location.
5. the manufacture method of ultra-thin printed substrate according to claim 1, is characterized in that, in described step b, hot pressing makes described first bonding sheet described first Copper Foil bonding with described supporting bracket be held between described first bonding sheet and supporting bracket.
6. the manufacture method of ultra-thin printed substrate according to claim 1, is characterized in that, in described step e, identifies the position of positioning pattern, according to the position relationship between described positioning pattern and described first Copper Foil, determines cutting path.
7. according to the manufacture method of claim 1 or described ultra-thin printed substrate, it is characterized in that, in described step e, adopt milling cutter longitudinally to cut the product worn step f and obtain along between described second circuit pattern edge and described first Copper Foil edge.
8. the manufacture method of ultra-thin printed substrate according to claim 1, is characterized in that, in described step g, also comprises and holing to described laminated sheet, chemical plating, plating, etch processes.
9. the manufacture method of ultra-thin printed substrate according to claim 1, is characterized in that, in described step g, after forming the first conducting wire, arranges one deck protection against oxidation film on the surface of described first conducting wire.
10. the manufacture method of ultra-thin printed substrate according to claim 1, is characterized in that, in described step e, after forming the second conducting wire, is stacked to few one deck bonding sheet and Copper Foil at described second conducting wire superficial layer; Make described bonding sheet between described second conducting wire and Copper Foil or both sides Copper Foil; It is bonding that each layer Copper Foil and the second conducting wire and each layer Copper Foil pass through bonding sheet; Under covering before one deck bonding sheet, first the Copper Foil in outside is made conductive hole and circuit.
The manufacture method of 11. ultra-thin printed substrates according to claim 10, is characterized in that, the Copper Foil being positioned at outside is being carried out laser drill, chemical plating, plating, Graphic transitions process, after forming conductive hole and circuit, more stacked lower one deck adhesive sheet and Copper Foil.
The manufacture method of 12. ultra-thin printed substrates according to claim 1, is characterized in that, carries out step a-g respectively at the upper surface of supporting bracket and lower surface; One or more layers laminated sheet is formed respectively at the upper surface of described supporting bracket and lower surface.
The manufacture method of 13. ultra-thin printed substrates according to claim 1, it is characterized in that, the thickness of described supporting bracket is greater than 0.35mm.
The manufacture method of 14. ultra-thin printed substrates according to claim 1, it is characterized in that, the thickness of described laminated sheet is less than 0.05mm.
The manufacture method of 15. ultra-thin printed substrates according to claim 1, is characterized in that, in described steps d, is the position with reference to determining to hole according to the position of described positioning through hole.
The manufacture method of 16. ultra-thin printed substrates according to claim 1, is characterized in that, in described step e, is with reference to carrying out Graphic transitions processing according to the position of described positioning through hole.
The manufacture method of 17. ultra-thin printed substrates according to claim 1,6,15 or 16, it is characterized in that, adopt X-ray to irradiate and identify positioning pattern, utilize the light transmittance at positioning pattern place different to identify the position of positioning pattern, and then locating and machining through hole.
18. ultra-thin printed substrates, is characterized in that, adopt method described in the arbitrary claim of claim 1 to 17 to produce.
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