CN105762044B - A kind of Thermal Cutoffs and its organic temperature sensor - Google Patents
A kind of Thermal Cutoffs and its organic temperature sensor Download PDFInfo
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- CN105762044B CN105762044B CN201610190384.7A CN201610190384A CN105762044B CN 105762044 B CN105762044 B CN 105762044B CN 201610190384 A CN201610190384 A CN 201610190384A CN 105762044 B CN105762044 B CN 105762044B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/165—Casings
- H01H85/175—Casings characterised by the casing shape or form
Abstract
The invention belongs to fuse technical field more particularly to a kind of organic compound type Thermal Cutoffs and its organic temperature sensor；Organic temperature sensor includes the composition of following weight percent：Organic acid 10% ~ 30%, succinic anhydride 40% ~ 60%, dimethyl terephthalate (DMT) 20% ~ 40%, adhesive 2% ~ 10%, organic solvent 5% ~ 20%, thixotropic agent 1% ~ 10%.Compared with prior art, it is 60 ~ 180 DEG C of organic temperature sensor that the present invention can be deployed into heat fusing temperature by said components and proportioning, and the organic temperature sensor of gained has strong high mechanical strength, antioxygenic property, high sensitivity of fusion temperature, the fireballing advantage of fusing.
Description
Technical field
The invention belongs to fuse technical field more particularly to a kind of organic compound type Thermal Cutoffs and its organic senses
Wen Ti.
Background technology
It is well known that in household electrical appliance and industrial equipment, electroluminescent fever in order to prevent excessively leads to fire, in addition to carrying out
Except stream protection, it is also necessary to carry out overheat protector；Due to Thermal Cutoffs is small, technology maturation, reliable in action and price just
Preferably, therefore, Thermal Cutoffs is widely used in household appliances as over-temperature protection element.
Currently, Thermal Cutoffs product is roughly divided into two classes.One kind is to use conjunction of the low-melting alloy as temperature-sensing element
Metal type Thermal Cutoffs；It is another kind of, it is that the organic compound type temperature using organic material compression molding as temperature sensor is protected
Dangerous silk, using the temperature sensor intensity and electrode slice is in contact with a lead electrode by the elastic force of a thick compression spring, formed
Single contact conductive structure, organic temperature sensor fusing when environment temperature reaches predetermined temperature, another thin compression spring will be by electrode slice
It is separated with lead electrode, thus by circuitry cuts.So organic temperature sensor, which is organic compound type Thermal Cutoffs, plays fusing
The core component of effect, the quality of performance will directly decide the quality of fuse performance.
But organic temperature sensor at present on the market has following defect：
1) mechanical strength is low, when it is crimped with the bulky spring of compression it is possible that fragmentation phenomenon, so as to cause insurance
Silk failure；
2) precision of fusion temperature it is low, fusing speed it is slow, to occur fusing not in time and cause circuit damage feelings
Condition greatly reduces the security reliability of product；
3) durability and duration are poor, it may appear that aged deterioration, easily distil situations such as becoming smaller, and causes its service life short.
In view of this, it is necessory to research and develop, the precision of a kind of high mechanical strength, operating temperature is high, fusing is fireballing has
Machine temperature sensor and the Thermal Cutoffs for using organic temperature sensor.
Invention content
It is an object of the present invention to：A kind of spirit of high mechanical strength, fusion temperature is provided in view of the deficiencies of the prior art
Sensitivity is high, fuse organic temperature sensor that speed is fast, endurance quality is good, and the adjustable hot melting temperature range set of organic temperature sensor is wide.
The second object of the present invention is：A kind of Thermal Cutoffs using organic temperature sensor is provided, which makes
Wide with range, operating temperature precision is high, and durability and duration are good, and current-carrying is big, reacts fast and stable and reliable for performance to environment temperature.
To achieve the goals above, the present invention uses following solution：
A kind of organic temperature sensor of Thermal Cutoffs, includes the composition of following weight percent：
Organic acid 10%~30%
Succinic anhydride 40%~60%
Dimethyl terephthalate (DMT) 20%~40%
Adhesive 2%~10%
Organic solvent 5%~20%
Thixotropic agent 1%~10%,
The organic acid is adipic acid, malonic acid, succinic acid, palmitic acid, oxalic acid, stearic acid, glutaric acid, pimelic acid, lemon
At least one of lemon acid, benzoic acid, suberic acid, azelaic acid, decanedioic acid, maleic acid and tartaric acid；
The adhesive is polyethylene, polypropylene, polystyrene, makrolon, polyvinyl acetate, polyamide and epoxy
At least one of resin；
The organic solvent is at least one of ethyl alcohol, methanol, acetone, chloroform and carbon tetrachloride；
The thixotropic agent is at least one of polyamide wax, silica, organobentonite or rilanit special.
Main material is organic acid, succinic anhydride and dimethyl terephthalate (DMT) in inventive formulation, wherein organic acid melts
Point is 55~185 DEG C, and the fusing point of succinic anhydride is 119.6 DEG C, and the fusing point of dimethyl terephthalate (DMT) is 140.6 DEG C；Auxiliary material is
Adhesive, organic solvent and thixotropic agent, therefore, can be formulated into heat fusing temperature by said components and content is 60~180 DEG C
Organic temperature sensor, and the precision of each temperature sensor operating temperature can reach ± 2 DEG C.The wherein described adhesive mainly plays bonding
With the effect of heat cure, organic solvent is used for dissolving main material, adhesive and thixotropic agent.Thixotropic agent is added in production technology and is led
In material, main material can be made to have higher consistency when static；Become low consistency fluid again under external force so that main material
It is uniformly mixed with auxiliary material, finally obtains the temperature sensor of high comprehensive performance.
Preferably, the organic temperature sensor of a kind of Thermal Cutoffs, includes the composition of following weight percent：
Organic acid 10%~20%
Succinic anhydride 40%~50%
Dimethyl terephthalate (DMT) 25%~35%
Adhesive 5%~10%
Organic solvent 5%~15%
Thixotropic agent 5%~10%.
More preferably, the organic temperature sensor of a kind of Thermal Cutoffs, includes the composition of following weight percent：
Organic acid 12%
Succinic anhydride 40%
Dimethyl terephthalate (DMT) 25%
Adhesive 8%
Organic solvent 10%
Thixotropic agent 5%.
Wherein, a kind of above-mentioned organic temperature sensor of Thermal Cutoffs, preparation method are as follows：By the weight proportion, first
Organic acid, succinic anhydride and dimethyl terephthalate (DMT) are mixed, after being heated to fusing, sequentially add adhesive, organic solvent
And thixotropic agent, it stirs evenly, is then to obtain organic temperature sensor through granulation, compacting and baking step.
Wherein, the drying temperature is 30~45 DEG C.Drying temperature is too low, can so that drying rate is slow；Drying temperature mistake
Height can make organic temperature sensor melt.
A kind of Thermal Cutoffs using above-mentioned organic temperature sensor, including metal shell and setting are inside metal shell
Fuse-link, one end of the metal shell is provided with the first pin, and the other end of the metal shell is provided with second pin,
First pin is connect by sealing with the fuse-link, and the fuse-link includes organic temperature sensor.
Wherein, the fuse-link further include the first disk, the second disk, the first spring, second spring, electrode slice and
One end of ceramic insulator, first spring is connect with the ceramic insulator, the other end of first spring with it is described
Electrode slice connects, and the electrode slice is crimped with first disk, and second disk is crimped with organic temperature sensor, described
Second spring is arranged between first disk and second disk.
Wherein, first spring and the second spring are in compressive state.
Effective triggering parts of fuse-link are not lead Organic Electricity temperature sensor made of above-mentioned formula in the present invention；Normal
Operation temperature under, solid organic temperature sensor withstands second spring, and the first pin and electrode slice is made to be kept in contact to form contact；
At this point, the flow direction of electric current is the first pin → contact → metal shell → second pin.When reaching a certain scheduled temperature, have
Machine temperature sensor can be molten into liquid so that compressed second spring is loosened, and the first spring just pushes electrode slice to leave first
Pin, circuit is just by safety cut-off.
Preferably, the joint filling material is at least one in epoxy resin, Lauxite, polyamide and phenolic resin
Kind.
Preferably, the metal shell is imprinted with mark, described to be identified as in lines, bar code, character, word and pattern
It is at least one.With Typical spray or ink print ratio, the present invention is marked product identification in shell by technologies such as laser beam markings
On, mark can be prevented to be corroded or high temperature falls off, while convenient for carrying out product after sale by the electric parameter on shell
Repair and replacement.
The beneficial effects of the present invention are：
1) a kind of organic temperature sensor of Thermal Cutoffs of the present invention, includes the composition of following weight percent：Organic acid 10%
~30%, succinic anhydride 40%~60%, dimethyl terephthalate (DMT) 20%~40%, adhesive 2%~10%, organic solvent
5%~20%, thixotropic agent 1%~10%；It is 60~180 DEG C that can be deployed into heat fusing temperature by said components and proportioning
Organic temperature sensor, the organic temperature sensor of gained have high mechanical strength, antioxygenic property strong, high sensitivity of fusion temperature, fusing
Fireballing advantage.
2) present invention is wide using the Thermal Cutoffs use scope of above-mentioned organic temperature sensor, and operating temperature precision is high, durable
Property and duration it is good, current-carrying is big, reacts fast to environment temperature, and stable and reliable for performance.
Description of the drawings
Fig. 1 is the structural schematic diagram of Thermal Cutoffs in the present invention.
In figure：1- metal shells；2- fuse-links；21- ceramic insulators；The first springs of 22-；23- electrode slices；24- first
Disk；25- second springs；The second disks of 26-；The organic temperature sensors of 27-；The first pins of 3-；4- second pins；5- is sealed.
Specific implementation mode
The present invention and advantage are made further specifically below in conjunction with specific implementation mode and Figure of description
Bright, still, specific implementation mode of the invention is not limited thereto.
Embodiment 1
The preparation of organic temperature sensor 27：
First 10% adipic acid, 60% succinic anhydride and 20% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 3% polyethylene, 5% ethyl alcohol and 2% polyamide wax, stir evenly, then through granulation, compacting and
Baking step obtains organic temperature sensor 27 of embodiment 1.Fusion temperature analysis is carried out to organic temperature sensor 27, learns that this has
The fusion temperature of machine temperature sensor 27 is 142 ± 2 DEG C.
The preparation of Thermal Cutoffs：
The Thermal Cutoffs includes metal shell 1 and the fuse-link being arranged inside metal shell 12, on metal shell 1
It is imprinted with product identification；One end of metal shell 1 is provided with the first pin 3, and the other end of metal shell 1 is provided with second pin
4, the first pin 3 is connect by sealing 5 with fuse-link 2, and 5 materials of sealing are epoxy resin；Fuse-link 2 includes organic temperature sensor
27, the first disk 24, the second disk 26, the first spring 22, second spring 25, electrode slice 23 and ceramic insulator 21, first
One end of spring 22 is connect with ceramic insulator 21, and the other end of the first spring 22 is connect with electrode slice 23, electrode slice 23 and
One disk 24 crimps, and the second disk 26 is crimped with organic temperature sensor 27, and the setting of second spring 25 is justified in the first disk 24 and second
Between piece 26；Wherein, the first spring 22 and second spring 25 are in compressive state.
Concrete operations are：By organic temperature sensor 27 of above-mentioned preparation, the second disk 26, second spring 25, the first disk 24,
Electrode slice 23, the first spring 22, ceramic insulator 21 put metal shell 1 into crimping successively, then by the first pin 3 through pottery
Porcelain simultaneously extends to outside metal shell 1, then is used as 5 materials of sealing by epoxy resin and is sealed, finally by laser beam marking skill
Art marks the information such as the electric parameter of product and trade mark on metal shell 1 to get to the Thermal Cutoffs of embodiment 1.It surveys
The operating temperature of Thermal Cutoffs is tried, is 143 ± 2 DEG C, mean value is 143.5 DEG C.
Embodiment 2
The preparation of organic temperature sensor 27 as different from Example 1：
First 30% malonic acid, 40% succinic anhydride and 20% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 4% polypropylene, 5% ethyl alcohol and 1% rilanit special, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 2 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, learns this
The fusion temperature of organic temperature sensor 27 is 132 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 133 ± 2 DEG C, mean value is 132.6 DEG C.
Embodiment 3
The preparation of organic temperature sensor 27 as different from Example 1：
First 30% succinic acid, 40% succinic anhydride and 20% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 2% polystyrene, 6% methanol and 2% organobentonite, stir evenly, then through being granulated, pressing
System and baking step obtain organic temperature sensor 27 of embodiment 3.Fusion temperature analysis is carried out to organic temperature sensor 27, is learnt
The fusion temperature of organic temperature sensor 27 is 178 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 179 ± 2 DEG C, mean value is 178.8 DEG C.
Embodiment 4
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% palmitic acid, 40% succinic anhydride and 20% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 5% makrolon, 20% acetone and 5% silica, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 4 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, learns this
The fusion temperature of organic temperature sensor 27 is 85 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 86 ± 2 DEG C, mean value is 86.4 DEG C.
Embodiment 5
The preparation of organic temperature sensor 27 as different from Example 1：
First 30% stearic acid, 40% succinic anhydride and 20% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 2% polyvinyl acetate, 5% ethyl alcohol and 3% silica, stir evenly, then through be granulated,
Compacting and baking step obtain organic temperature sensor 27 of embodiment 5.Fusion temperature analysis is carried out to organic temperature sensor 27, is obtained
Know that the fusion temperature of organic temperature sensor 27 is 62 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 63 ± 2 DEG C, mean value is 63.5 DEG C.
Embodiment 6
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% glutaric acid, 50% succinic anhydride and 20% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 10% polyamide, 5% ethyl alcohol and 5% rilanit special, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 6 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, learns this
The fusion temperature of organic temperature sensor 27 is 118 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 119 ± 2 DEG C, mean value is 118.7 DEG C.
Embodiment 7
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% pimelic acid, 40% succinic anhydride and 40% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 3% makrolon, 5% chloroform and 2% rilanit special, stir evenly, then through making
Grain, compacting and baking step obtain organic temperature sensor 27 of embodiment 7.Fusion temperature point is carried out to organic temperature sensor 27
Analysis learns that the fusion temperature of organic temperature sensor 27 is 122 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 123 ± 2 DEG C, mean value is 122.2 DEG C.
Embodiment 8
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% citric acid, 40% succinic anhydride and 30% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 5% makrolon, 5% carbon tetrachloride and 10% polyamide wax, stir evenly, then through be granulated,
Compacting and baking step obtain organic temperature sensor 27 of embodiment 8.Fusion temperature analysis is carried out to organic temperature sensor 27, is obtained
Know that the fusion temperature of organic temperature sensor 27 is 137 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 138 ± 2 DEG C, mean value is 138.5 DEG C.
Embodiment 9
The preparation of organic temperature sensor 27 as different from Example 1：
First 20% benzoic acid, 40% succinic anhydride and 25% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 5% polypropylene, 5% acetone and 5% polyamide wax, stir evenly, then through granulation, compacting and
Baking step obtains organic temperature sensor 27 of embodiment 9.Fusion temperature analysis is carried out to organic temperature sensor 27, learns that this has
The fusion temperature of machine temperature sensor 27 is 128 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 129 ± 2 DEG C, mean value is 128.6 DEG C.
Embodiment 10
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% suberic acid, 45% succinic anhydride and 30% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 2% polypropylene, 10% acetone and 3% organobentonite, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 10 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, is learnt
The fusion temperature of organic temperature sensor 27 is 135 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 136 ± 2 DEG C, mean value is 135.1 DEG C.
Embodiment 11
The preparation of organic temperature sensor 27 as different from Example 1：
First 15% azelaic acid, 40% succinic anhydride and 30% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 3% polyethylene, 8% ethyl alcohol and 4% organobentonite, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 11 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, is learnt
The fusion temperature of organic temperature sensor 27 is 123 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 124 ± 2 DEG C, mean value is 124.3 DEG C.
Embodiment 12
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% decanedioic acid, 40% succinic anhydride and 35% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 4% polystyrene, 5% ethyl alcohol and 6% silica, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 12 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, is learnt
The fusion temperature of organic temperature sensor 27 is 130 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 131 ± 2 DEG C, mean value is 131.4 DEG C.
Embodiment 13
The preparation of organic temperature sensor 27 as different from Example 1：
First 10% oxalic acid, 40% succinic anhydride and 30% dimethyl terephthalate (DMT) are mixed, are heated to melting
Afterwards, sequentially add 8% epoxy resin, 7% acetone and 5% rilanit special, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 13 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, is learnt
The fusion temperature of organic temperature sensor 27 is 109 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 110 ± 2 DEG C, mean value is 110.5 DEG C.
Embodiment 14
The preparation of organic temperature sensor 27 as different from Example 1：
First 12% maleic acid, 40% succinic anhydride and 32% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 4% epoxy resin, 8% acetone and 4% rilanit special, stir evenly, then through being granulated, pressing
System and baking step obtain organic temperature sensor 27 of embodiment 14.Fusion temperature analysis is carried out to organic temperature sensor 27, is obtained
Know that the fusion temperature of organic temperature sensor 27 is 134 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 135 ± 2 DEG C, mean value is 135.8 DEG C.
Embodiment 15
The preparation of organic temperature sensor 27 as different from Example 1：
First 12% tartaric acid, 40% succinic anhydride and 25% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, sequentially add 8% makrolon, 10% ethyl alcohol and 5% polyamide wax, stir evenly, then through being granulated, suppressing
Organic temperature sensor 27 of embodiment 15 is obtained with baking step.Fusion temperature analysis is carried out to organic temperature sensor 27, is learnt
The fusion temperature of organic temperature sensor 27 is 172 ± 2 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 173 ± 2 DEG C, mean value is 172.6 DEG C.
Comparative example 1
The preparation of organic temperature sensor 27 as different from Example 1：
First 12% tartaric acid, 40% succinic anhydride and 25% dimethyl terephthalate (DMT) are mixed, are heated to melting
After change, 13% makrolon and 10% ethyl alcohol are sequentially added, is stirred evenly, is then through granulation, compacting and baking step
Obtain organic temperature sensor 27 of comparative example 1.Fusion temperature analysis is carried out to organic temperature sensor 27, learns organic temperature sensor 27
Fusion temperature be 170 ± 6 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 171 ± 6 DEG C, mean value is 172.8 DEG C.
Comparative example 2
The preparation of organic temperature sensor 27 as different from Example 1：
First by 77% tartaric acid for heating to after melting, 8% makrolon, 10% ethyl alcohol and 5% are sequentially added
Polyamide wax stirs evenly, and then obtains organic temperature sensor 27 of comparative example 2 through granulation, compacting and baking step.Have to this
Machine temperature sensor 27 carries out fusion temperature analysis, learns that the fusion temperature of organic temperature sensor 27 is 171 ± 4 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 173 ± 4 DEG C, mean value is 169.8 DEG C.
Comparative example 3
The preparation of organic temperature sensor 27 as different from Example 1：
After 77% succinic anhydride is first heated to fusing, 8% makrolon, 10% ethyl alcohol and 5% are sequentially added
Polyamide wax, stir evenly, then through granulation, compacting and baking step i.e. obtain organic temperature sensor 27 of comparative example 3.To this
Organic temperature sensor 27 carries out fusion temperature analysis, learns that the fusion temperature of organic temperature sensor 27 is 119 ± 5 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 120 ± 5 DEG C, mean value is 117.8 DEG C.
Comparative example 4
The preparation of organic temperature sensor 27 as different from Example 1：
After 77% dimethyl terephthalate (DMT) is first heated to fusing, 8% makrolon, 10% second are sequentially added
Alcohol and 5% polyamide wax, stir evenly, then through granulation, compacting and baking step i.e. obtain organic temperature sensor of comparative example 4
27.Fusion temperature analysis is carried out to organic temperature sensor 27, learns that the fusion temperature of organic temperature sensor 27 is 140 ± 5 DEG C.
Remaining is repeated no more with embodiment 1.
The operating temperature of the Thermal Cutoffs is tested, is 142 ± 5 DEG C, mean value is 143.8 DEG C.
Fusing time, operating temperature and organic are carried out to the Thermal Cutoffs of embodiment 1~15 and comparative example 1~4 respectively
The fusing degree of temperature sensor 27 carries out experiment test, and test result is shown in Table 1.
The performance test results of 1 embodiment and comparative example of table
By the test result of watch 1, it is found that the Temperature protection of the present invention has, fusing time is fast, operating temperature precision is high
The advantages of；From embodiment 15 and comparative example 1 it is found that addition thixotropic agent can improve the sensitivity of temperature sensor operating temperature；From
Embodiment 15 and comparative example 2~4 are it is found that compared with using single main material, and the present invention is using organic acid, succinic anhydride and right
The mixing main material of rutgers, comprehensive performance are obviously more reliable and more stable.
According to the disclosure and teachings of the above specification, those skilled in the art in the invention can also be to above-mentioned embodiment party
Formula is changed and is changed.Therefore, the invention is not limited in above-mentioned specific implementation mode, every those skilled in the art exist
Made any conspicuously improved, replacement or modification all belongs to the scope of protection of the present invention on the basis of the present invention.This
Outside, although having used some specific terms in this specification, these terms are merely for convenience of description, not to the present invention
Constitute any restrictions.
Claims (10)
1. a kind of organic temperature sensor of Thermal Cutoffs, which is characterized in that include the composition of following weight percent：
Organic acid 10% ~ 30%
Succinic anhydride 40% ~ 60%
Dimethyl terephthalate (DMT) 20% ~ 40%
Adhesive 2% ~ 10%
Organic solvent 5% ~ 20%
Thixotropic agent 1% ~ 10%,
The organic acid be adipic acid, malonic acid, succinic acid, palmitic acid, oxalic acid, stearic acid, glutaric acid, pimelic acid, citric acid,
At least one of benzoic acid, suberic acid, azelaic acid, decanedioic acid, maleic acid and tartaric acid；
The adhesive is polyethylene, polypropylene, polystyrene, makrolon, polyvinyl acetate, polyamide and epoxy resin
At least one of；
The organic solvent is at least one of ethyl alcohol, methanol, acetone, chloroform and carbon tetrachloride；
The thixotropic agent is at least one of polyamide wax, silica, organobentonite or rilanit special；
Wherein, the fusing point of organic acid is 55 ~ 185 DEG C, and the fusing point of succinic anhydride is 119.6 DEG C, and dimethyl terephthalate (DMT) melts
Point is 140.6 DEG C；Organic temperature sensor that heat fusing temperature is 60 ~ 180 DEG C is can be formulated by said components and content, and each
The precision of temperature sensor operating temperature can reach ± 2 DEG C.
2. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 1, which is characterized in that including following weight percent
The composition of ratio：
Organic acid 10% ~ 20%
Succinic anhydride 40% ~ 50%
Dimethyl terephthalate (DMT) 25% ~ 35%
Adhesive 5% ~ 10%
Organic solvent 5% ~ 15%
Thixotropic agent 5% ~ 10%.
3. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 2, which is characterized in that including following weight percent
The composition of ratio：
Organic acid 12%
Succinic anhydride 40%
Dimethyl terephthalate (DMT) 25%
Adhesive 8%
Organic solvent 10%
Thixotropic agent 5%.
4. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 1, which is characterized in that preparation method is as follows：It presses
Organic acid, succinic anhydride and dimethyl terephthalate (DMT) are first mixed, after being heated to fusing, are sequentially added by the weight proportion
Adhesive, organic solvent and thixotropic agent, stir evenly, and are then to obtain organic sense through granulation, compacting and baking step
Wen Ti.
5. the organic temperature sensor of a kind of Thermal Cutoffs according to claim 4, it is characterised in that：The drying temperature is 30
~45℃。
6. a kind of Thermal Cutoffs, including metal shell and the fuse-link that is arranged inside metal shell, the metal shell
One end be provided with the first pin, the other end of the metal shell is provided with second pin, and first pin passes through sealing
It is connect with the fuse-link, the fuse-link includes organic temperature sensor, it is characterised in that：Organic temperature sensor is claim
The organic temperature sensor of 1 ~ 5 any one of them.
7. a kind of Thermal Cutoffs according to claim 6, it is characterised in that：The fuse-link further include the first disk,
Second disk, the first spring, second spring, electrode slice and ceramic insulator, one end and the ceramics of first spring
Insulator connects, and the other end of first spring is connect with the electrode slice, and the electrode slice is crimped with first disk,
Second disk is crimped with organic temperature sensor, and the second spring is arranged in first disk and second disk
Between.
8. a kind of Thermal Cutoffs according to claim 7, it is characterised in that：First spring and the second spring
It is in compressive state.
9. a kind of Thermal Cutoffs according to claim 6, it is characterised in that：The joint filling material is epoxy resin, urea
At least one of urea formaldehyde, polyamide and phenolic resin.
10. a kind of Thermal Cutoffs according to claim 6, it is characterised in that：The metal shell is imprinted with mark, institute
It states and is identified as at least one of lines, bar code, character, word and pattern.
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| CN201610190384.7A CN105762044B (en) | 2016-03-29 | 2016-03-29 | A kind of Thermal Cutoffs and its organic temperature sensor |
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| CN105762044B true CN105762044B (en) | 2018-09-11 |
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| CN111237728A (en) * | 2020-02-14 | 2020-06-05 | 厦门普为光电科技有限公司 | Protection system for lamp tube |
| CN115873386A (en) * | 2023-02-20 | 2023-03-31 | 广东金驭科技有限公司 | Composite organic temperature sensing material, preparation method thereof and fuse |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200305904A (en) * | 2002-04-24 | 2003-11-01 | Nec Schott Components Corp | Temperature sensing material type thermal fuse |
| CN200997367Y (en) * | 2007-01-08 | 2007-12-26 | 张志盛 | Temperature fuse structure |
| CN101143530A (en) * | 2006-09-15 | 2008-03-19 | 株式会社理光 | Thermosensitive recording material |
| CN101764002A (en) * | 2009-12-25 | 2010-06-30 | 上海神沃电子有限公司 | Fluxing agent as well as preparation method and application thereof |
-
2016
- 2016-03-29 CN CN201610190384.7A patent/CN105762044B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200305904A (en) * | 2002-04-24 | 2003-11-01 | Nec Schott Components Corp | Temperature sensing material type thermal fuse |
| CN101143530A (en) * | 2006-09-15 | 2008-03-19 | 株式会社理光 | Thermosensitive recording material |
| CN200997367Y (en) * | 2007-01-08 | 2007-12-26 | 张志盛 | Temperature fuse structure |
| CN101764002A (en) * | 2009-12-25 | 2010-06-30 | 上海神沃电子有限公司 | Fluxing agent as well as preparation method and application thereof |
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