CN115873386A - Composite organic temperature sensing material, preparation method thereof and fuse - Google Patents
Composite organic temperature sensing material, preparation method thereof and fuse Download PDFInfo
- Publication number
- CN115873386A CN115873386A CN202310135490.5A CN202310135490A CN115873386A CN 115873386 A CN115873386 A CN 115873386A CN 202310135490 A CN202310135490 A CN 202310135490A CN 115873386 A CN115873386 A CN 115873386A
- Authority
- CN
- China
- Prior art keywords
- parts
- acid
- composite organic
- modified
- fuse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention belongs to the technical field of fuse materials, and discloses a composite organic temperature sensing material, a preparation method thereof and a fuse. The composite organic temperature-sensing material comprises, by weight, 50-70 parts of succinic anhydride, 12-50 parts of modified dihydroxy ethyl terephthalate, 1-8 parts of polyethylene wax, 12-20 parts of mixed acid and 3-10 parts of modified polyethylene; the mixed acid comprises phthalic acid and at least two of stearic acid, malic acid and succinic acid; the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: mixing dihydroxy ethyl terephthalate, a silane coupling agent, phosphorus trichloride and a solvent, and performing ultrasonic dispersion; the process for preparing the modified polyethylene comprises the following steps: mixing phthalic acid, polyethylene, triethanolamine, acetanilide, an antioxidant and silane substances, and heating for reaction. The variation range of the melting temperature of the composite organic temperature sensing material is +/-1.0 ℃, and the time for complete melting does not exceed 1.1 seconds.
Description
Technical Field
The invention belongs to the technical field of fuse materials, and particularly relates to a composite organic temperature sensing material, a preparation method thereof and a fuse.
Background
The fuse has the effect of protecting a circuit or an electronic component, and when the temperature rises to reach a certain preset value due to abnormal reasons in the use process of an electric appliance, materials in the fuse can be fused, so that the circuit is disconnected, the circuit or the electronic component is protected, and the fire prevention device has a remarkable effect.
The materials of the fuse which are fused due to the temperature rise to a preset value are divided into two main types, one is an alloy material, and the other is an organic temperature sensing material. The sensitivity of the melting temperature of the organic temperature sensing material in the prior art is relatively low, the complete melting can be carried out only when the temperature difference of at least +/-2 ℃ exists, and the time for complete melting is at least 2 seconds. In other words, such a fuse requires at least 2 seconds to blow to protect the circuit, and within 2 seconds, it is likely to cause a fire or other electrical appliance to burn. Therefore, in the prior art, the low sensitivity and the long time can not be completely melted, and the protection requirement of high-end electronic equipment cannot be met. Potential safety hazards also exist for protecting common household appliances.
Therefore, it is highly desirable to provide a new organic temperature sensitive material, which has high sensitivity to the melting temperature and shorter melting time, and when the organic temperature sensitive material is applied to a fuse, the protection of the electronic device is significantly improved.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art described above. Therefore, the invention provides a composite organic temperature sensing material, a preparation method thereof and a fuse. The variation range of the melting temperature of the composite organic temperature sensing material is +/-1.0 ℃, and the time for complete melting is not more than 1.1 seconds. The composite organic temperature-sensing material has high sensitivity to melting temperature and shorter melting time, and when the composite organic temperature-sensing material is applied to a fuse, the protection of the fuse on electronic equipment is obviously improved.
The invention conception of the invention is as follows: the composite organic temperature-sensing material takes succinic anhydride as a main raw material component, and is matched with specific dosage of modified dihydroxy ethyl terephthalate, polyethylene wax, mixed acid and modified polyethylene. The invention adopts silane coupling agent and phosphorus trichloride to modify dihydroxy ethyl terephthalate, adopts phthalic acid, polyethylene, triethanolamine, acetanilide, tris [2,4-di-tert-butylphenyl ] phosphite and N-aminoethyl-3-aminopropylmethyldimethoxysilane to modify polyethylene, and then is matched with specific mixed acid, so that the sensitivity of the composite organic temperature sensing material to melting temperature is improved and shorter melting time is achieved.
A first aspect of the present invention provides a composite organic temperature sensitive material.
Specifically, the composite organic temperature sensing material comprises, by weight, 50-70 parts of succinic anhydride, 12-50 parts of modified dihydroxy ethyl terephthalate, 1-8 parts of polyethylene wax, 12-20 parts of mixed acid and 3-10 parts of modified polyethylene;
the mixed acid comprises phthalic acid and at least two of stearic acid, malic acid and succinic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: mixing dihydroxy ethyl terephthalate, a silane coupling agent, phosphorus trichloride and a solvent, and performing ultrasonic dispersion to obtain the modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: mixing phthalic acid, polyethylene, triethanolamine, acetanilide, an antioxidant and silane substances, and heating for reaction to obtain the modified polyethylene.
Preferably, the antioxidant is tris (2,4-di-tert-butylphenyl) phosphite.
Preferably, the silane material is N-aminoethyl-3-aminopropylmethyldimethoxysilane.
Preferably, the mixed acid is phthalic acid, stearic acid and malic acid in a weight ratio of 1: (0.5-1.8): (0.5-2.2).
Preferably, the mixed acid is phthalic acid, stearic acid, malic acid and succinic acid in a weight ratio of 1: (0.5-1.8): (0.5-2.2): (0.1-0.5).
Preferably, the process for preparing the modified bishydroxyethyl terephthalate comprises the following steps: the method comprises the following steps of (1) mixing dihydroxy ethyl terephthalate, a silane coupling agent, phosphorus trichloride and a solvent according to a weight ratio of 10: (0.1-5): (0.1-3): (10-30), and ultrasonically dispersing at the temperature of 50-65 ℃ to obtain the modified dihydroxy ethyl terephthalate.
Preferably, the process for preparing the modified bishydroxyethyl terephthalate comprises the following steps: the method comprises the following steps of (1) mixing dihydroxy ethyl terephthalate, a silane coupling agent, phosphorus trichloride and a solvent according to a weight ratio of 10: (1-3): (0.5-2): (10-30), and ultrasonically dispersing at the temperature of 50-65 ℃ to obtain the modified dihydroxy ethyl terephthalate.
Preferably, the solvent comprises at least one of carbon tetrachloride, toluene and ethanol.
Preferably, the silane coupling agent is selected from at least one of gamma- (2,3-glycidoxy) propyltrimethoxysilane or gamma-aminopropyltriethoxysilane.
Preferably, the polyethylene wax has an average molecular weight of 3000 to 5000; further preferably, the polyethylene wax has an average molecular weight of 3800-4700.
Preferably, the process for preparing the modified polyethylene comprises the following steps: mixing 5-10 parts of phthalic acid, 80-95 parts of polyethylene, 3-8 parts of triethanolamine, 1-5 parts of acetanilide, 0.5-2 parts of tris [2,4-di-tert-butylphenyl ] phosphite, 0.5-2 parts of antioxidant and 0.5-2 parts of silane substances, and heating to 140-165 ℃ for reaction under a closed condition to prepare the modified polyethylene.
Preferably, the process for preparing the modified polyethylene comprises the following steps: mixing 5-10 parts of phthalic acid, 80-95 parts of polyethylene, 3-8 parts of triethanolamine, 1-5 parts of acetanilide, 0.5-2 parts of tris [2,4-di-tert-butylphenyl ] phosphite and 0.5-2 parts of N-aminoethyl-3-aminopropylmethyldimethoxysilane, and heating to 140-165 ℃ under a closed condition for reaction to prepare the modified polyethylene.
Preferably, the polyethylene wax can be replaced by modified polyethylene wax, and the preparation method of the modified polyethylene wax comprises the following steps: polyethylene wax, trihydroxybenzene, a silane coupling agent and an alcohol solvent are mixed according to the weight ratio of 5: (1-4): (0.1-2): (8-20), and dispersing for 4-8 hours under the ultrasonic condition to obtain the modified polyethylene wax. The modified polyethylene wax is used for replacing polyethylene wax, so that the sensitivity of the composite organic temperature sensing material to the melting temperature can be improved, and the shorter melting time can be achieved.
Preferably, the preparation method of the modified polyethylene wax comprises the following steps: mixing polyethylene wax, trihydroxybenzene and a silane coupling agent according to a weight ratio of alcohol solvent to solvent of 5: (2-4): (0.5-1.5): (10-20), and dispersing for 4-8 hours under the ultrasonic condition to obtain the modified polyethylene wax.
Preferably, the alcohol solvent comprises ethanol or glycerol.
Preferably, the composite organic temperature sensing material comprises, by weight, 55-65 parts of succinic anhydride, 22-39 parts of modified dihydroxy ethyl terephthalate, 3-7 parts of polyethylene wax, 15-18 parts of mixed acid and 3-9 parts of polyethylene.
Preferably, the thermal melting temperature of the composite organic temperature sensing material is 70-190 ℃; further preferably, the thermal melting temperature of the composite organic temperature sensing material is 90-170 ℃. And selecting a proper component ratio to adjust the thermal melting temperature of the composite organic temperature sensing material according to the required temperature.
The second aspect of the present invention provides a method for preparing a composite organic temperature sensitive material.
Specifically, the preparation method of the composite organic temperature sensing material comprises the following steps:
and heating and melting the mixed acid, then adding succinic anhydride, stirring and mixing, then adding the rest components, mixing, granulating and drying to obtain the composite organic temperature sensing material.
Preferably, the temperature of the heating and melting is 170-260 ℃; further preferably, the temperature for heating and melting is 185-230 ℃.
Said granulation is a means of ordinary skill in the art. For example, granulation is carried out in a granulator.
A third aspect of the invention provides a fuse.
A fuse comprises the composite organic temperature sensing material.
Preferably, the fuse further comprises a cylindrical shell, the shell is made of insulating materials, the shell comprises a bottom plate, a through hole for the first lead to pass through is formed in the bottom plate, the shell further comprises an opening, the opening is located on the other side of the bottom plate, a cover body fixedly connected with the shell is arranged on the opening, the cover body is made of insulating materials, and a second lead is arranged on the cover body; the temperature sensing body is cylindrical, a through cavity is formed in the temperature sensing body, a conductive tension spring is arranged in the cavity, a first touch pad is fixedly arranged at one end of the conductive tension spring, and the other end of the conductive tension spring is detachably connected with the first lead; the second lead is fixedly provided with a second contact disc, the first contact disc is electrically connected with the second contact disc, an insulating spring is further arranged between the first contact disc and the second contact disc, and the first contact disc, the second contact disc and the insulating spring are all located in the shell.
Preferably, a conductive plate is fixedly arranged on the first lead, the conductive plate is arranged in the shell, and the conductive plate is buckled with the conductive tension spring.
Preferably, the periphery of the first contact pad is provided with a salient point, the periphery of the second contact pad is provided with a bulge, the bulge is mutually abutted against the salient point, and two ends of the insulating spring are respectively abutted against the middle part of the first contact pad and the middle part of the second contact pad.
Preferably, the shell is provided with an exhaust hole.
Preferably, the casing includes the periphery wall, the periphery wall with bottom plate fixed connection, the inboard of periphery wall is equipped with wedge lug, wedge lug with first touch pad butt.
Compared with the prior art, the invention has the following beneficial effects:
(1) The composite organic temperature sensing material takes succinic anhydride as a main raw material component, and is matched with specific dosage of modified dihydroxy ethyl terephthalate, polyethylene wax, mixed acid and modified polyethylene. According to the invention, the silane coupling agent and phosphorus trichloride are adopted to modify the dihydroxy ethyl terephthalate, phthalic acid, polyethylene, triethanolamine, arginine, an antioxidant and silane substances are adopted to modify polyethylene, and then specific mixed acid is matched, so that the sensitivity of the composite organic temperature sensing material to the melting temperature is improved and the shorter melting time is achieved. The variation range of the melting temperature of the composite organic temperature sensing material is +/-1.0 ℃, and the time for complete melting is not more than 1.1 seconds, even as low as 0.8 seconds.
(2) The modified polyethylene wax is used for replacing polyethylene wax, so that the sensitivity of the composite organic temperature sensing material to the melting temperature can be improved, and the shorter melting time can be achieved.
(3) The fuse realizes the power on and off of the two leads directly through the two contact pads, and compared with the traditional method that the fuse needs to realize conductive communication through the shell, the fuse has the advantages of simpler structure, more convenient manufacture and lower cost.
Drawings
FIG. 1 is a schematic diagram of the construction of the fuse of the present invention;
FIG. 2 is a schematic diagram of the use of the fuse of the present invention.
Detailed Description
In order to make the technical solutions of the present invention more apparent to those skilled in the art, the following examples are given for illustration. It should be noted that the following examples are not intended to limit the scope of the claimed invention.
The starting materials, reagents or apparatuses used in the following examples are conventionally commercially available or can be obtained by conventionally known methods, unless otherwise specified.
Example 1: preparation of composite organic temperature sensing material
A composite organic temperature-sensing material comprises, by weight, 55 parts of succinic anhydride, 18 parts of modified bis (hydroxyethyl) terephthalate, 5 parts of polyethylene wax, 12 parts of mixed acid and 5 parts of modified polyethylene;
the mixed acid comprises 3 parts of phthalic acid, 3 parts of stearic acid and 3 parts of malic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: dihydroxy ethyl terephthalate, a silane coupling agent (gamma-aminopropyltriethoxysilane), phosphorus trichloride, a solvent (formed by mixing carbon tetrachloride and toluene according to a weight ratio of 1:1) according to a weight ratio of 10:1:1.5:14, ultrasonic dispersion is carried out for 2 hours, the temperature of the ultrasonic dispersion is 55 ℃, and modified dihydroxy ethyl terephthalate is prepared;
the process for preparing the modified polyethylene comprises the following steps: 6 parts of phthalic acid, 90 parts of polyethylene, 4 parts of triethanolamine, 5 parts of acetanilide, 1 part of tris [2,4-di-tert-butylphenyl ] phosphite and 1 part of N-aminoethyl-3-aminopropylmethyldimethoxysilane are mixed and reacted for 1 hour at 150 ℃ under a closed condition, so that the modified polyethylene is prepared.
A preparation method of a composite organic temperature sensing material comprises the following steps:
heating the mixed acid to 195 ℃ for melting, then adding succinic anhydride, stirring and mixing, then adding the rest components for mixing, granulating by using a granulator, and drying for 8 hours at 70 ℃ to obtain the composite organic temperature sensing material.
Example 2: preparation of composite organic temperature sensing material
A composite organic temperature-sensing material comprises, by weight, 61 parts of succinic anhydride, 27 parts of modified dihydroxy ethyl terephthalate, 5 parts of polyethylene wax, 15 parts of mixed acid and 4 parts of modified polyethylene;
the mixed acid comprises 4 parts of phthalic acid, 5 parts of stearic acid and 6 parts of malic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: dihydroxy ethyl terephthalate, a silane coupling agent (gamma-aminopropyltriethoxysilane), phosphorus trichloride, a solvent (formed by mixing carbon tetrachloride and toluene according to a weight ratio of 1:1) according to a weight ratio of 10:1.2:1.6:16, and ultrasonically dispersing for 3 hours at the temperature of 50 ℃ to prepare modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: 5 parts of phthalic acid, 85 parts of polyethylene, 5 parts of triethanolamine, 4 parts of acetanilide, 0.5 part of tris [2,4-di-tert-butylphenyl ] phosphite and 0.5 part of N-aminoethyl-3-aminopropylmethyldimethoxysilane are mixed, and the mixture is heated to 160 ℃ under a closed condition to react for 1 hour, so that the modified polyethylene is prepared.
A preparation method of a composite organic temperature sensing material comprises the following steps:
heating the mixed acid to 195 ℃ for melting, then adding succinic anhydride, stirring and mixing, then adding the rest components for mixing, granulating by using a granulator, and drying for 8 hours at 70 ℃ to obtain the composite organic temperature sensing material.
Example 3: preparation of composite organic temperature sensing material
A composite organic temperature-sensing material comprises, by weight, 65 parts of succinic anhydride, 30 parts of modified dihydroxy ethyl terephthalate, 6 parts of polyethylene wax, 18 parts of mixed acid and 5 parts of modified polyethylene;
the mixed acid comprises 4.5 parts of phthalic acid, 5 parts of stearic acid, 8 parts of malic acid and 0.5 part of succinic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: dihydroxy ethyl terephthalate, a silane coupling agent (gamma-aminopropyltriethoxysilane), phosphorus trichloride, a solvent (formed by mixing carbon tetrachloride and toluene according to a weight ratio of 1:2) according to a weight ratio of 10:2:2:20, and performing ultrasonic dispersion for 3 hours at the temperature of 50 ℃ to prepare modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: 6 parts of phthalic acid, 90 parts of polyethylene, 4 parts of triethanolamine, 4 parts of acetanilide, 1 part of tris [2,4-di-tert-butylphenyl ] phosphite and 1 part of N-aminoethyl-3-aminopropylmethyldimethoxysilane are mixed, and the mixture is heated to 155 ℃ under a closed condition to react for 1 hour, so that the modified polyethylene is prepared.
A preparation method of a composite organic temperature sensing material comprises the following steps:
heating the mixed acid to 195 ℃ for melting, then adding succinic anhydride, stirring and mixing, then adding the rest components for mixing, granulating by using a granulator, and drying for 8 hours at 70 ℃ to obtain the composite organic temperature sensing material.
Example 4: preparation of composite organic temperature sensing material
A composite organic temperature-sensing material comprises, by weight, 61 parts of succinic anhydride, 27 parts of modified dihydroxy ethyl terephthalate, 5 parts of modified polyethylene wax, 15 parts of mixed acid and 4 parts of modified polyethylene;
the mixed acid comprises 4 parts of phthalic acid, 5 parts of stearic acid and 6 parts of malic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: dihydroxy ethyl terephthalate, a silane coupling agent (gamma-aminopropyltriethoxysilane), phosphorus trichloride, a solvent (formed by mixing carbon tetrachloride and toluene according to a weight ratio of 1:1) according to a weight ratio of 10:1.2:1.6:16, and ultrasonically dispersing for 3 hours at the temperature of 50 ℃ to prepare modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: mixing 5 parts of phthalic acid, 85 parts of polyethylene, 5 parts of triethanolamine, 4 parts of acetanilide, 0.5 part of tris [2,4-di-tert-butylphenyl ] phosphite and 0.5 part of N-aminoethyl-3-aminopropylmethyldimethoxysilane, and heating to 160 ℃ under a closed condition to react for 1 hour to prepare modified polyethylene;
the preparation method of the modified polyethylene wax comprises the following steps: polyethylene wax, trihydroxybenzene, a silane coupling agent (gamma-aminopropyltriethoxysilane) and an alcohol solvent (ethanol) are mixed according to the weight ratio of 5:2:1:12, and dispersing for 6 hours under the ultrasonic condition to obtain the modified polyethylene wax.
A preparation method of a composite organic temperature sensing material comprises the following steps:
heating the mixed acid to 195 ℃ for melting, then adding succinic anhydride, stirring and mixing, then adding the rest components for mixing, granulating by using a granulator, and drying for 8 hours at 70 ℃ to obtain the composite organic temperature sensing material.
Example 5: preparation of composite organic temperature sensing material
A composite organic temperature-sensing material comprises, by weight, 65 parts of succinic anhydride, 30 parts of modified dihydroxy ethyl terephthalate, 6 parts of modified polyethylene wax, 18 parts of mixed acid and 5 parts of modified polyethylene;
the mixed acid comprises 4.5 parts of phthalic acid, 5 parts of stearic acid, 8 parts of malic acid and 0.5 part of succinic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: the method comprises the following steps of mixing dihydroxyethyl terephthalate, a silane coupling agent (gamma-aminopropyltriethoxysilane), phosphorus trichloride and a solvent (the solvent is formed by mixing carbon tetrachloride and toluene according to the weight ratio of 1:2) according to the weight ratio of 10:2:2:20, and ultrasonically dispersing for 3 hours at the temperature of 50 ℃ to prepare modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: mixing 5 parts of phthalic acid, 85 parts of polyethylene, 5 parts of triethanolamine, 4 parts of acetanilide, 0.5 part of tris [2,4-di-tert-butylphenyl ] phosphite and 0.5 part of N-aminoethyl-3-aminopropylmethyldimethoxysilane, and heating to 160 ℃ under a closed condition to react for 1 hour to prepare modified polyethylene;
the preparation method of the modified polyethylene wax comprises the following steps: polyethylene wax, trihydroxybenzene, a silane coupling agent (gamma-aminopropyltriethoxysilane) and an alcohol solvent (ethanol) are mixed according to the weight ratio of 5:2.5:1.2:15, and dispersing for 6 hours under the ultrasonic condition to obtain the modified polyethylene wax.
A preparation method of a composite organic temperature sensing material comprises the following steps:
heating the mixed acid to 195 ℃ for melting, then adding succinic anhydride, stirring and mixing, then adding the rest components for mixing, granulating by using a granulator, and drying for 8 hours at 70 ℃ to obtain the composite organic temperature sensing material.
Example 6: preparation of composite organic temperature sensing material
A composite organic temperature-sensing material comprises, by weight, 62 parts of succinic anhydride, 35 parts of modified dihydroxy ethyl terephthalate, 6 parts of modified polyethylene wax, 14 parts of mixed acid and 6 parts of modified polyethylene;
the mixed acid comprises 4 parts of phthalic acid, 5 parts of stearic acid and 1 part of succinic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: the method comprises the following steps of mixing bis-hydroxyethyl terephthalate, a silane coupling agent (gamma- (2,3-epoxypropoxy) propyl trimethoxy silane), phosphorus trichloride and a solvent (the solvent is formed by mixing carbon tetrachloride and toluene according to the weight ratio of 1:2) according to the weight ratio of 10:1.6:1.8:25, and ultrasonically dispersing for 3 hours at the temperature of 65 ℃ to prepare modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: mixing 7 parts of phthalic acid, 89 parts of polyethylene, 4 parts of triethanolamine, 4 parts of acetanilide, 1 part of tris [2,4-di-tert-butylphenyl ] phosphite and 1 part of N-aminoethyl-3-aminopropylmethyldimethoxysilane, and heating to 160 ℃ for reaction for 1 hour under a closed condition to prepare modified polyethylene;
the preparation method of the modified polyethylene wax comprises the following steps: polyethylene wax, trihydroxybenzene, a silane coupling agent (gamma-aminopropyltriethoxysilane) and an alcohol solvent (ethanol) are mixed according to the weight ratio of 5:2.5:1.2:15, and dispersing for 6 hours under the ultrasonic condition to obtain the modified polyethylene wax.
A preparation method of a composite organic temperature sensing material comprises the following steps:
heating the mixed acid to 195 ℃ for melting, then adding succinic anhydride, stirring and mixing, then adding the rest components for mixing, granulating by using a granulator, and drying for 10 hours at 70 ℃ to obtain the composite organic temperature sensing material.
Comparative example 1
Comparative example 1 differs from example 2 only in that the same amount of adipic acid was used in place of the mixed acid in example 2 in comparative example 1, and the rest of the procedure was the same as in example 2.
Comparative example 2
Comparative example 2 is different from example 2 only in that the mixed acid in comparative example 2 is 4 parts of adipic acid, 5 parts of stearic acid and 6 parts of suberic acid, and the rest of the procedure is the same as in example 2.
Comparative example 3
Comparative example 3 is different from example 2 only in that dimethyl terephthalate is used in place of the modified bishydroxyethyl terephthalate of example 2 in comparative example 3, and the rest of the procedure is the same as in example 2.
Comparative example 4
Comparative example 4 is different from example 2 only in that polyethylene is used in comparative example 4 instead of the modified polyethylene of example 2, and the rest of the procedure is the same as example 2.
Product effectiveness testing
Fuses were made from the composite organic temperature sensitive materials prepared in examples 2 and 4 and comparative examples 1 to 4, and then the melting temperature (which may be referred to as the fuse operating temperature) and the melting time (which may be referred to as the fusing time, which is the time required from reaching a predetermined fusing temperature to the occurrence of fusing of the fuse) of the corresponding fuses were measured, and the results are shown in table 1.
TABLE 1
| Melting temperature (. Degree.C.) | Melting time(s) | |
| Example 2 | 128±1.0 | 1.1 |
| Example 4 | 125±0.8 | 0.8 |
| Comparative example 1 | 118±2.0 | 2.5 |
| Comparative example 2 | 113±2.4 | 2.7 |
| Comparative example 3 | 133±1.9 | 2.8 |
| Comparative example 4 | 126±1.4 | 1.4 |
As can be seen from table 1, the sensitivity of the fuses corresponding to the composite organic temperature-sensitive materials prepared in examples 2 and 4 of the present invention to the melting temperature is significantly higher than that of the fuses corresponding to comparative examples 1 to 4 (i.e., the fluctuation range of the fuses corresponding to the composite organic temperature-sensitive materials prepared in examples 2 and 4 to the melting temperature is smaller than that of the fuses corresponding to comparative examples 1 to 4). And the melting time of the fuse corresponding to the composite organic temperature sensing material prepared in the embodiments 2 and 4 of the invention is obviously shorter than that of the comparative examples 1 to 4, and is obviously shorter than 2s, even less than 1.1 s.
As can be inferred from table 1 above, the specific selection of the mixed acid, the modification treatment of the polyethylene wax, and the modification treatment of the polyethylene in the composite organic temperature sensitive material of the present invention affect the sensitivity of the melting temperature and the melting time when the composite organic temperature sensitive material is applied to the fuse.
The level of effect of the other embodiments of the present invention is similar to that of embodiment 2 or embodiment 4.
In addition, the invention also provides a heating wire which comprises a temperature sensing body, wherein the temperature sensing body is prepared by applying the composite organic temperature sensing material. Meanwhile, the structure of the heating wire is optimized, and the use performance of the heating wire is further improved.
Specifically, referring to fig. 1, the present invention provides a fuse, which includes a cylindrical housing 100, wherein the housing 100 is made of an insulating high temperature resistant plastic material, and compared with a conventional metal material, the housing 100 is made of a plastic material, so that the production cost can be reduced; the casing 100 is specifically cylindrical, and comprises a bottom plate 110 and an outer circumferential wall 120, the casing 100 further comprises an opening 130, the opening 130 is opposite to the bottom plate 110, the aperture of the opening 130 is almost the same as the inner diameter of the outer circumferential wall 120, and a through hole for a lead to pass through is arranged in the middle of the bottom plate 110;
a first lead 210 is fixedly arranged on the bottom plate 110, the first lead 210 is a tinned copper wire and has good conductivity, a conductive plate 150 is fixedly arranged at the end of the first lead 210, and the outer diameter of the conductive plate 150 is smaller than the inner diameter of the opening 130 and larger than the inner diameter of the through hole; when the lead frame is manufactured, the first lead 210 is first welded and fixed to the conductive plate 150, then the first lead 210 is inserted through the casing 100 from the opening and is led out from the through hole of the bottom plate 110, and finally the first lead 210 is fixed to the bottom plate 110 by means of adhesion.
A cover 140 is fixedly disposed on the opening 130, the cover 140 is also made of an insulating plastic material, and a second lead 220 is fixedly disposed on the cover 140. The second lead 220 has one end extending into the case 100 and the other end extending out of the case 100.
Meanwhile, the shell 100 further comprises a temperature-sensing body 300 made of the composite organic temperature-sensing material, wherein the temperature-sensing body 300 is cylindrical, and a through cavity is formed in the temperature-sensing body 300; a conductive tension spring 400 made of a metal material and having good conductive performance, and an insulating spring 500 made of a rubber material and having good insulating performance; in addition, the housing 100 further includes a first contact pad 610 and a second contact pad 620 for conducting the first lead 210 and the second lead 220. The first contact pad 610 and the second contact pad 620 are made of metal materials, in this embodiment, the first contact pad 610 and the second contact pad 620 have the same shape and structure, the first contact pad 610 includes a disc-shaped disc 611, and an outer diameter of the disc 611 is slightly smaller than an inner diameter of the opening 130 of the housing 100; a plurality of salient points 612 are arranged on the periphery of the disc body 611, correspondingly, a plurality of protrusions 622 are arranged on the second contact disc 620, and the salient points 612 correspond to the protrusions 622. Two ends of the insulating spring 500 are respectively fixed between the first contact pad 610 and the second contact pad 620. The end of the second lead 220 is fixedly connected with the second contact pad 620, and the two can be fixed together by welding; the outer diameter of the conductive tension spring 400 is smaller than the inner diameter of the cavity of the temperature sensing body, the conductive tension spring 400 is sleeved in the temperature sensing body 300, one end of the conductive tension spring 400 is fixedly connected with the first contact disc 610, and the other end of the conductive tension spring is fastened with the conductive plate 150.
It is understood that the outer diameter of the temperature sensing body 300 is smaller than the outer diameter of the conductive plate 150 and the outer diameter of the first contact pad 610. Meanwhile, in a free state, the length of the conductive tension spring 400 is smaller than the thickness of the temperature sensing body 300. When the temperature sensing device is installed, the conductive tension spring 400 may be welded to the first contact pad 610, the temperature sensing body 300 is sleeved outside the conductive tension spring 400, and then the other end of the conductive tension spring 400 is pulled out of the temperature sensing body 300 and fastened to the conductive plate 150. The manner of the clasp may be varied and the structure of the clasp is also common in the art and therefore will not be described further herein. After the installation is completed, the temperature sensing body 300 is clamped between the first contact pad 610 and the conductive plate 150, the first contact pad 610 and the conductive plate 150 are electrically connected through the conductive tension spring 400, and the first contact pad 610 and the conductive plate 150 are both pulled by the conductive tension spring 400.
Referring to fig. 1, when the heater is assembled, the temperature-sensing body 300, the first contact pad 610, the conductive tension spring 400, the conductive plate 150, and the first lead 210 are first assembled to form a first component. Then, the first component is inserted into the opening 130 of the housing 100, so that the first lead 210 passes through the through hole of the bottom plate 110, and the conductive plate 150 is tightly attached to the bottom plate 110; then, the first lead 210 is fixed on the bottom plate 110 by means of adhesion, or the first lead 210 is fixed between the bottom plate 110 and the conductive plate 150 by means of adhesion, so that the bump 612 of the first contact pad 610 faces the opening 130;
then, the insulating spring 500 is sleeved into the housing 100 and abuts against the disc 611 of the first contact pad 610;
then, the second lead 220 and the second contact pad 620 are placed into the housing 100, with the protrusion 622 of the second contact pad 620 facing away from the opening 130; at this time, an opposite accommodating space is formed between the convex point 612 and the convex point 622, and the insulating spring 500 is placed in the accommodating space;
then, the second contact pad 620 is pressed by force to compress the insulating spring 500, so that the second contact pad 620 integrally enters the housing 100, and the protrusions 622 of the second contact pad 620 are ensured to be tightly abutted with the bumps 612 of the first contact pad 610;
finally, the cover 140 is sealed, so that the second contact pad 620 is tightly attached to the cover 140, and the cover 140 and the housing 100 are tightly fixed together.
After the assembly is completed, the second lead 220 sequentially passes through the second contact pad 620, the first contact pad 610, the conductive tension spring 400 and the conductive plate 150, and then is electrically conducted with the first lead 210. At this time, the insulating spring 500 is in a compressed state, and the conductive tension spring 400 is in a stretched state.
When the fuse is used, the fuse is installed on a circuit, the first lead 210 and the second lead 220 are conducted, when current passes through the fuse, the fuse generates heat due to the fact that the fuse has certain resistance, the heat generation amount of the fuse is increased along with the increase of time, the heat generation speed is determined by the size of the current and the resistance, the heat consumption speed is determined by the structure of the fuse and the installation condition of the fuse, and if the heat generation speed is smaller than the heat dissipation speed, the fuse cannot be fused. If the rate of heat generation is equal to the rate of heat dissipation, it will not melt for a long period of time, and if the rate of heat generation is greater than the rate of heat dissipation, the amount of heat generation will be greater, the increase in heat will cause a temperature increase, and when the temperature rises above the melting point of temperature-sensitive body 300, temperature-sensitive body 300 will melt due to heating.
Referring to fig. 2, after the temperature sensing body 300 is heated and melted, because the first contact pad 610 and the conductive plate 150 lose support, under the combined action of the insulating spring 500 and the conductive tension spring 400, the first contact pad 610 rapidly moves in a direction away from the second contact pad 620, so that the first contact pad 610 and the second contact pad 620 are separated, and the circuit between the first lead 210 and the second lead 220 is cut off, thereby protecting the circuit.
Referring to fig. 1, when the fuse is not disconnected, the end surface of the conductive plate 150 is tightly attached to the bottom plate 110, and the first contact pad 610 and the conductive plate 150 are relatively fixed in position because a solid temperature-sensing body 300 is interposed therebetween; meanwhile, the second contact pad 620 is tightly attached to the cover 140, and the cover 140 is firmly fixed to the housing 100, so that the first contact pad 610 and the second contact pad 620 can always keep good contact, and the insulating spring 500 can be in a compressed state and fixed in the housing 100.
When the current through the fuse is too large, the excessive current generates too much heat, and when the heat is enough to melt the temperature sensing body 300, the temperature sensing body 300 is rapidly transformed from a solid state to a liquid state or a gas state. After the temperature sensing body 300 is melted, the first contact pad 610 loses support, and under the working action of the conductive tension spring 400 and the insulating spring 500, the first contact pad 610 rapidly moves towards the direction away from the second contact pad 620, and because the second contact pad 620 is relatively fixed on the cover body 140 and the insulating spring 500 is arranged between the first contact pad 610 and the second contact pad, after the first contact pad 610 moves towards the direction away from the second contact pad 620, the two contact pads are no longer in contact, so that the power failure of the first lead 210 and the second lead 220 is realized. When the fuse is electrically disconnected, the fuse will not heat.
The fuse wire provided by the invention does not need to realize the conduction of a circuit through the shell, and realizes the conductive conduction of the two leads by virtue of the two contact discs and the conductive tension spring, so that the fuse wire is simpler in structure, more convenient to install and lower in production cost. Simultaneously, because the temperature sensing body is by first touch pad, the current conducting plate centre gripping, and the electrically conductive extension spring also wears to establish in the middle of the temperature sensing body moreover, when the electric current of fuse was too big, first touch pad, current conducting plate and electrically conductive extension spring all can produce too big heat, and the heating area that the temperature sensing body received this moment is bigger, can further shorten the melting time of temperature sensing body to further improve the sensitivity and the melting time of the melting temperature of fuse, improve the comprehensive properties of fuse.
In addition, in order to prevent the first contact pad 610 from being reset accidentally after the power is cut off, a wedge-shaped protrusion is provided on the inner side of the outer peripheral wall 120 of the housing 100, and the wedge-shaped protrusion is relatively close to one side of the first lead 210. When the power is off, the first contact pad 610 moves from the second lead 220 to the first lead 210, and the first contact pad 610 can easily pass over the wedge-shaped bump because of certain elasticity between the wedge-shaped bump and the first contact pad 610; however, when the first contact pad 610 passes over the wedge-shaped bump, the wedge-shaped bump abuts against the end surface of the first contact pad 610, so that the first contact pad 610 is blocked by the wedge-shaped bump, and the first contact pad 610 cannot move from the first lead 210 to the second lead 220.
In addition, when the fuse is overheated and the power is cut off, since the temperature sensing body 300 is melted from a solid state to a liquid state or a gaseous state, when the temperature sensing body 300 is melted to the gaseous state, the air pressure of the housing 100 is significantly increased, and in order to maintain the air pressure balance in the housing 100, further, as a preferred embodiment, the housing 100 is further provided with an exhaust hole which is arranged on the outer circumferential wall close to the temperature sensing body 300. The exhaust hole is a through hole formed in the outer circumferential wall 120 of the housing 100, and completely penetrates through the outer circumferential wall, so that the cavity of the housing 100 can communicate with the outside.
The fuse wire provided by the invention has the advantages that the material components of the temperature sensing body are optimized, the internal structure of the fuse wire is optimized, so that the fuse wire has higher sensitivity and shorter response time, and the electronic element is effectively protected.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that the present invention is not limited to the details of the embodiments shown and described, but is capable of numerous equivalents and substitutions without departing from the spirit of the invention as set forth in the claims appended hereto.
Claims (13)
1. The composite organic temperature-sensing material is characterized by comprising, by weight, 50-70 parts of succinic anhydride, 12-50 parts of modified dihydroxy ethyl terephthalate, 1-8 parts of polyethylene wax, 12-20 parts of mixed acid and 3-10 parts of modified polyethylene;
the mixed acid comprises phthalic acid and at least two of stearic acid, malic acid and succinic acid;
the process for preparing the modified dihydroxy ethyl terephthalate comprises the following steps: mixing dihydroxy ethyl terephthalate, a silane coupling agent, phosphorus trichloride and a solvent, and performing ultrasonic dispersion to obtain modified dihydroxy ethyl terephthalate;
the process for preparing the modified polyethylene comprises the following steps: mixing phthalic acid, polyethylene, triethanolamine, acetanilide, an antioxidant and silane substances, and heating for reaction to obtain the modified polyethylene.
2. The composite organic temperature-sensing material of claim 1, wherein the process of preparing the modified polyethylene comprises the steps of: according to parts by weight, 5-10 parts of phthalic acid, 80-95 parts of polyethylene, 3-8 parts of triethanolamine, 1-5 parts of acetanilide, 0.5-2 parts of antioxidant and 0.5-2 parts of silane substances are mixed, and the mixture is heated to 140-165 ℃ under a closed condition for reaction to prepare the modified polyethylene.
3. The composite organic temperature-sensing material according to claim 1, wherein the mixed acid is phthalic acid, stearic acid, malic acid in a weight ratio of 1: (0.5-1.8): (0.5-2.2).
4. The composite organic temperature-sensing material of claim 1, wherein the mixed acid is phthalic acid, stearic acid, malic acid, succinic acid in a weight ratio of 1: (0.5-1.8): (0.5-2.2): (0.1-0.5).
5. The composite organic temperature sensing material of claim 1, wherein the process of preparing the modified bishydroxyethyl terephthalate comprises the steps of: the method comprises the following steps of (1) mixing bis-hydroxyethyl terephthalate, a silane coupling agent, phosphorus trichloride and a solvent according to a weight ratio of 10: (0.1-5): (0.1-3): (10-30), and ultrasonically dispersing at the temperature of 50-65 ℃ to obtain the modified dihydroxy ethyl terephthalate.
6. The composite organic temperature-sensitive material of any one of claims 1 to 4, wherein the polyethylene wax is replaced with a modified polyethylene wax, and the preparation method of the modified polyethylene wax comprises the steps of: polyethylene wax, trihydroxybenzene, a silane coupling agent and an alcohol solvent are mixed according to the weight ratio of 5: (1-4): (0.1-2): (8-20), and dispersing for 4-8 hours under the ultrasonic condition to obtain the modified polyethylene wax.
7. The method of preparing a composite organic temperature sensing material according to any one of claims 1 to 6, comprising the steps of:
and heating and melting the mixed acid, then adding succinic anhydride, stirring and mixing, then adding the rest components, mixing, granulating and drying to obtain the composite organic temperature sensing material.
8. A fuse comprising a temperature-sensitive body made of the composite organic temperature-sensitive material according to any one of claims 1 to 6.
9. The fuse according to claim 8, further comprising a cylindrical housing, wherein the housing is made of an insulating material, the housing comprises a bottom plate, the bottom plate is provided with a through hole for the first lead to pass through, the housing further comprises an opening, the opening is located at the other side of the bottom plate, the opening is provided with a cover body fixedly connected with the housing, the cover body is made of an insulating material, and the cover body is provided with a second lead; the temperature sensing body is cylindrical, a through cavity is formed in the temperature sensing body, a conductive tension spring is arranged in the cavity, a first touch pad is fixedly arranged at one end of the conductive tension spring, and the other end of the conductive tension spring is detachably connected with the first lead; the second lead is fixedly provided with a second contact disc, the first contact disc is electrically connected with the second contact disc, an insulating spring is further arranged between the first contact disc and the second contact disc, and the first contact disc, the second contact disc and the insulating spring are all located in the shell.
10. The fuse of claim 9, wherein a conductive plate is fixed to the first lead, the conductive plate is disposed in the housing, and the conductive plate is fastened to the conductive tension spring.
11. The fuse according to claim 9, wherein the first contact pad has a protrusion on its outer periphery, the second contact pad has a protrusion on its outer periphery, the protrusion and the protrusion abut against each other, and two ends of the insulating spring abut against the middle of the first contact pad and the middle of the second contact pad, respectively.
12. The fuse of claim 9, wherein the housing is provided with a vent hole.
13. The fuse according to claim 9, wherein the housing comprises a peripheral wall fixedly connected to the base plate, and a wedge-shaped protrusion is provided on an inner side of the peripheral wall and abuts against the first contact pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310135490.5A CN115873386A (en) | 2023-02-20 | 2023-02-20 | Composite organic temperature sensing material, preparation method thereof and fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310135490.5A CN115873386A (en) | 2023-02-20 | 2023-02-20 | Composite organic temperature sensing material, preparation method thereof and fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115873386A true CN115873386A (en) | 2023-03-31 |
Family
ID=85761359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310135490.5A Pending CN115873386A (en) | 2023-02-20 | 2023-02-20 | Composite organic temperature sensing material, preparation method thereof and fuse |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115873386A (en) |
Citations (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4224541A (en) * | 1978-05-26 | 1980-09-23 | Westinghouse Electric Corp. | Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member |
| ATE25992T1 (en) * | 1982-12-21 | 1987-04-15 | Kuraray Co | POLYESTER, GLUES BASED ON THIS POLYESTER AND LAMINATES MADE OF THIS POLYESTER. |
| JPH03283223A (en) * | 1990-03-29 | 1991-12-13 | Nec Kansai Ltd | Manufacture of thermal fuse |
| JP2001049092A (en) * | 1999-08-05 | 2001-02-20 | Daicel Chem Ind Ltd | Polyester block copolymer composition and heat sensing material |
| JP2001334394A (en) * | 2000-05-23 | 2001-12-04 | Nec Schott Components Corp | Flux, flux-filled low melting point alloy and protective element using the same |
| US20050088272A1 (en) * | 2003-10-28 | 2005-04-28 | Nec Schott Components Corporation | Thermal pellet incorporated thermal fuse and method of producing thermal pellet |
| CN1629215A (en) * | 2004-10-28 | 2005-06-22 | 复旦大学 | Temperature sensing material with negative temperature coefficient effect and method for preparing same |
| CN1647224A (en) * | 2002-04-24 | 2005-07-27 | 恩益禧肖特电子零件有限公司 | Temperature sensing material type thermal fuse |
| CN1772799A (en) * | 2005-10-27 | 2006-05-17 | 复旦大学 | Thermosensitive temperature sensing material and its prepn |
| CN101143530A (en) * | 2006-09-15 | 2008-03-19 | 株式会社理光 | Thermosensitive recording material |
| CN101197224A (en) * | 2006-12-08 | 2008-06-11 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
| DE102008050523A1 (en) * | 2007-10-05 | 2009-04-09 | Nec Schott Components Corp., Koka | Thermal fuse with a heat-sensitive pellet |
| CN101465252A (en) * | 2008-12-31 | 2009-06-24 | 上海长园维安电子线路保护股份有限公司 | Thin type temperature fuse and fluxing medium therefore |
| JP2009152219A (en) * | 2003-10-28 | 2009-07-09 | Nec Schott Components Corp | Thermosensitive pellet type thermal fuse, and manufacturing method for thermosensitive pellet |
| JP2009187732A (en) * | 2008-02-05 | 2009-08-20 | Nec Schott Components Corp | Temperature-sensitive pellet type thermal fuse |
| CN101764002A (en) * | 2009-12-25 | 2010-06-30 | 上海神沃电子有限公司 | Fluxing agent as well as preparation method and application thereof |
| CN101777467A (en) * | 2009-12-31 | 2010-07-14 | 上海长园维安电子线路保护股份有限公司 | Fluxing resin for temperature fuse and preparation method thereof and preparation method of temperature fuse |
| CN103280379A (en) * | 2013-05-27 | 2013-09-04 | 江阴市志翔电子科技有限公司 | Thermal link for electric cooker |
| JP5395288B1 (en) * | 2013-03-04 | 2014-01-22 | 日油技研工業株式会社 | Temperature control material |
| CN103533753A (en) * | 2013-10-23 | 2014-01-22 | 江苏彤明高科汽车电器有限公司 | Printed circuit board for preventing device from short circuiting |
| CN203553081U (en) * | 2013-09-18 | 2014-04-16 | 深圳市伙伴科技有限公司 | Spring used in thermal cutoff, and thermal cutoff |
| CN105679621A (en) * | 2016-02-25 | 2016-06-15 | 漳州雅宝电子有限公司 | High-stability thermal link for thermal fuse and preparation method of high-stability thermal link |
| CN105762044A (en) * | 2016-03-29 | 2016-07-13 | 东莞市贝特电子科技股份有限公司 | Temperature fuse and organic temperature-sensing body thereof |
| CN207834245U (en) * | 2017-10-27 | 2018-09-07 | 梁溪区昊星工业设计工作室 | A kind of Thermal Cutoffs structure |
| CN109517563A (en) * | 2018-11-14 | 2019-03-26 | 金丽丹 | A kind of preparation method of heat-resisting low-melting point polyester hot melt adhesive |
| CN111100307A (en) * | 2018-10-29 | 2020-05-05 | 中国石油化工股份有限公司 | Thermochromic low-melting-point polyester master batch and preparation method thereof |
| CN111098577A (en) * | 2018-10-29 | 2020-05-05 | 中国石油化工股份有限公司 | Thermochromic low-melting-point polyester film and preparation method thereof |
| CN113088241A (en) * | 2021-05-08 | 2021-07-09 | 郑州中原思蓝德高科股份有限公司 | Hot melt adhesive and preparation method thereof |
| CN114864351A (en) * | 2022-05-24 | 2022-08-05 | 漳州雅宝电子股份有限公司 | High-stability hot melt block, preparation method thereof and thermal fuse link |
-
2023
- 2023-02-20 CN CN202310135490.5A patent/CN115873386A/en active Pending
Patent Citations (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4224541A (en) * | 1978-05-26 | 1980-09-23 | Westinghouse Electric Corp. | Fluid solventless epoxy-anhydride compositions containing metal acetylacetonate accelerators and organic carboxylic acid co-accelerators for use on an electrical member |
| ATE25992T1 (en) * | 1982-12-21 | 1987-04-15 | Kuraray Co | POLYESTER, GLUES BASED ON THIS POLYESTER AND LAMINATES MADE OF THIS POLYESTER. |
| JPH03283223A (en) * | 1990-03-29 | 1991-12-13 | Nec Kansai Ltd | Manufacture of thermal fuse |
| JP2001049092A (en) * | 1999-08-05 | 2001-02-20 | Daicel Chem Ind Ltd | Polyester block copolymer composition and heat sensing material |
| JP2001334394A (en) * | 2000-05-23 | 2001-12-04 | Nec Schott Components Corp | Flux, flux-filled low melting point alloy and protective element using the same |
| CN1647224A (en) * | 2002-04-24 | 2005-07-27 | 恩益禧肖特电子零件有限公司 | Temperature sensing material type thermal fuse |
| US20050179516A1 (en) * | 2002-04-24 | 2005-08-18 | Tokihiro Yoshikawa | Temperature sensing material type thermal use |
| CN1612277A (en) * | 2003-10-28 | 2005-05-04 | 恩益禧肖特电子零件有限公司 | Thermal pellet incorporated thermal fuse and method of producing thermal pellet |
| US20050088272A1 (en) * | 2003-10-28 | 2005-04-28 | Nec Schott Components Corporation | Thermal pellet incorporated thermal fuse and method of producing thermal pellet |
| JP2009152219A (en) * | 2003-10-28 | 2009-07-09 | Nec Schott Components Corp | Thermosensitive pellet type thermal fuse, and manufacturing method for thermosensitive pellet |
| CN1629215A (en) * | 2004-10-28 | 2005-06-22 | 复旦大学 | Temperature sensing material with negative temperature coefficient effect and method for preparing same |
| CN1772799A (en) * | 2005-10-27 | 2006-05-17 | 复旦大学 | Thermosensitive temperature sensing material and its prepn |
| CN101143530A (en) * | 2006-09-15 | 2008-03-19 | 株式会社理光 | Thermosensitive recording material |
| CN101197224A (en) * | 2006-12-08 | 2008-06-11 | 比亚迪股份有限公司 | Fusing agent and temperature fuse containing the same |
| DE102008050523A1 (en) * | 2007-10-05 | 2009-04-09 | Nec Schott Components Corp., Koka | Thermal fuse with a heat-sensitive pellet |
| JP2009187732A (en) * | 2008-02-05 | 2009-08-20 | Nec Schott Components Corp | Temperature-sensitive pellet type thermal fuse |
| CN101465252A (en) * | 2008-12-31 | 2009-06-24 | 上海长园维安电子线路保护股份有限公司 | Thin type temperature fuse and fluxing medium therefore |
| CN101764002A (en) * | 2009-12-25 | 2010-06-30 | 上海神沃电子有限公司 | Fluxing agent as well as preparation method and application thereof |
| CN101777467A (en) * | 2009-12-31 | 2010-07-14 | 上海长园维安电子线路保护股份有限公司 | Fluxing resin for temperature fuse and preparation method thereof and preparation method of temperature fuse |
| JP5395288B1 (en) * | 2013-03-04 | 2014-01-22 | 日油技研工業株式会社 | Temperature control material |
| CN103280379A (en) * | 2013-05-27 | 2013-09-04 | 江阴市志翔电子科技有限公司 | Thermal link for electric cooker |
| CN203553081U (en) * | 2013-09-18 | 2014-04-16 | 深圳市伙伴科技有限公司 | Spring used in thermal cutoff, and thermal cutoff |
| CN103533753A (en) * | 2013-10-23 | 2014-01-22 | 江苏彤明高科汽车电器有限公司 | Printed circuit board for preventing device from short circuiting |
| CN105679621A (en) * | 2016-02-25 | 2016-06-15 | 漳州雅宝电子有限公司 | High-stability thermal link for thermal fuse and preparation method of high-stability thermal link |
| CN105762044A (en) * | 2016-03-29 | 2016-07-13 | 东莞市贝特电子科技股份有限公司 | Temperature fuse and organic temperature-sensing body thereof |
| CN207834245U (en) * | 2017-10-27 | 2018-09-07 | 梁溪区昊星工业设计工作室 | A kind of Thermal Cutoffs structure |
| CN111100307A (en) * | 2018-10-29 | 2020-05-05 | 中国石油化工股份有限公司 | Thermochromic low-melting-point polyester master batch and preparation method thereof |
| CN111098577A (en) * | 2018-10-29 | 2020-05-05 | 中国石油化工股份有限公司 | Thermochromic low-melting-point polyester film and preparation method thereof |
| CN109517563A (en) * | 2018-11-14 | 2019-03-26 | 金丽丹 | A kind of preparation method of heat-resisting low-melting point polyester hot melt adhesive |
| CN113088241A (en) * | 2021-05-08 | 2021-07-09 | 郑州中原思蓝德高科股份有限公司 | Hot melt adhesive and preparation method thereof |
| CN114864351A (en) * | 2022-05-24 | 2022-08-05 | 漳州雅宝电子股份有限公司 | High-stability hot melt block, preparation method thereof and thermal fuse link |
Non-Patent Citations (1)
| Title |
|---|
| 刘西文: "塑料配混（中、高级）培训教程", 文化发展出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3677295B2 (en) | PTC element and battery assembly using the same | |
| AU752684B2 (en) | Thermal fuse | |
| JP2009087920A (en) | Protection circuit board for secondary battery, and secondary battery using the same | |
| CA2496960C (en) | Electrical heater | |
| CN115873386A (en) | Composite organic temperature sensing material, preparation method thereof and fuse | |
| CN109744899B (en) | Food preparation machine that heating efficiency is high | |
| US20200373112A1 (en) | Thermally protected varistor | |
| JP4342443B2 (en) | Cord temperature fuse and sheet temperature fuse | |
| US5173593A (en) | Electric cigar lighter having a thermal safety fuse | |
| CN2874754Y (en) | Composite overflow and overheat protector | |
| US20100243345A1 (en) | Battery safety features | |
| JP6392381B2 (en) | Compact protective device for car cigarette lighter and power outlet | |
| CN105428179B (en) | A kind of alloy-type thermal fuse-link of resistance to turn-off current | |
| US20080315983A1 (en) | Safety Device For Preventing Propagation in Fracture of Ceramic Element | |
| US3246105A (en) | Protector for electric circuits | |
| CN205335210U (en) | Alloy type thermal -link of resistant turn -off current | |
| CN217061995U (en) | Alloy type thermal link with metal cover plate | |
| CN217333995U (en) | Flexible temperature fuse | |
| KR100420148B1 (en) | Protector and secondary battery mounting the such | |
| CN216198589U (en) | Protection architecture and starter | |
| JPH11238440A (en) | Alloy type thermal fuse | |
| JP4138920B2 (en) | Thermal fuse with temperature sensor | |
| CN210225771U (en) | Assembly of PTC heating device and contain its electrical apparatus | |
| CN202196735U (en) | Integrated thermal fuse | |
| JP3066284B2 (en) | plug |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |