JPH06325670A - Alloy type temperature fuse - Google Patents
Alloy type temperature fuseInfo
- Publication number
- JPH06325670A JPH06325670A JP13939893A JP13939893A JPH06325670A JP H06325670 A JPH06325670 A JP H06325670A JP 13939893 A JP13939893 A JP 13939893A JP 13939893 A JP13939893 A JP 13939893A JP H06325670 A JPH06325670 A JP H06325670A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- fuse
- alloy
- weight
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
Landscapes
- Fuses (AREA)
Abstract
Description
【０００１】本発明は合金型温度ヒュ−ズに関するもの
である。The present invention relates to an alloy type temperature fuse.
【０００２】合金型温度ヒュ−ズにおいては、一対のリ
−ド線間に低融点可溶合金片（ヒュ−ズエレメント）を
橋設し、低融点可溶合金片上にフラックスを塗布し、こ
のフラックス塗布合金片を絶縁体で包囲してあり、保護
すべき電気機器に取り付けて使用される。In the alloy type temperature fuse, a low melting point fusible alloy piece (fuse element) is bridged between a pair of lead wires, and flux is applied onto the low melting point fusible alloy piece. The flux coated alloy piece is surrounded by an insulator and is used by attaching it to the electrical equipment to be protected.
【０００３】この場合、電気機器が過電流により発熱す
ると、その発生熱により低融点可溶合金片が液相化さ
れ、その溶融金属がフラックスとの共存下、表面張力に
より球状化され、球状化の進行により分断されて機器へ
の通電が遮断される。In this case, when the electric equipment generates heat due to overcurrent, the generated heat transforms the low melting point alloy pieces into a liquid phase, and the molten metal is spheroidized by the surface tension in the coexistence with the flux to be spheroidized. Is cut off by the progress of, and the power supply to the equipment is cut off.
【０００４】上記低融点可溶合金に要求される要件の一
つは、固相線と液相線との間の固液共存域が狭いことで
ある。すなわち、通常、合金においては、固相線と液相
線との間に固液共存域が存在し、この領域においては、
液相中に固相粒体が分散した状態にあり、液相様の性質
も備えているために、上記の球状化分断が発生する可能
性があり、従って、液相線温度（この温度をＴとする）
以前に固液共存域に属する温度範囲（ΔＴとする）で、
低融点可溶合金片が球状化分断される可能性がある。而
して、かかる低融点可溶合金片を用いた温度ヒュ−ズに
おいては、ヒュ−ズエレメント温度が（Ｔ−ΔＴ）〜Ｔ
となる温度範囲で動作するものとして取り扱わなければ
ならず、従って、ΔＴが小であるほど、すなわち、固液
共存域が狭いほど、温度ヒュ−ズの作動温度範囲のバラ
ツキを小として、温度ヒュ−ズを所定の設定温度で作動
させることができる。One of the requirements for the low melting point fusible alloy is that the solid-liquid coexistence region between the solidus and liquidus is narrow. That is, normally, in an alloy, a solid-liquid coexistence region exists between the solidus line and the liquidus line, and in this region,
Since the solid phase granules are dispersed in the liquid phase and also have liquid phase-like properties, the above spheroidization fragmentation may occur, and therefore the liquidus temperature (this temperature T)
In the temperature range (ΔT) that belonged to the solid-liquid coexistence region before,
The low melting point fusible alloy piece may be fragmented into spheres. Thus, in a temperature fuse using such a low melting point fusible alloy piece, the fuse element temperature is (T-ΔT) to T
Therefore, the smaller the ΔT is, that is, the narrower the solid-liquid coexistence region is, the smaller the variation in the operating temperature range of the temperature fuse is, and the smaller the temperature fuse is. It is possible to operate the nozzle at a predetermined set temperature.
【０００５】従って、温度ヒュ−ズのヒュ−ズエレメン
トとして使用される合金には、まず固液共存域が狭いこ
とが要求される。また、ヒュ−ズエレメントの電気抵抗
が高いと、ヒュ−ズエレメントの自己発熱に基づく温度
上昇が大となり、機器の温度上昇が機器の運行上障害と
ならない範囲内であっても、ヒュ−ズエレメントの温度
が融点に達し、温度ヒュ−ズが作動してしまうことがあ
り、かかる誤作動排除のために、充分に低抵抗であるこ
とが要求される。更に、温度ヒュ−ズのヒュ−ズエレメ
ントは、線状片の形態で使用されるから、線引加工が可
能であることが要求される。Therefore, an alloy used as a fuse element for a temperature fuse is required to have a narrow solid-liquid coexistence region. Further, if the electric resistance of the fuse element is high, the temperature rise due to self-heating of the fuse element becomes large, and even if the temperature rise of the equipment is within a range that does not hinder the operation of the equipment, fuse The temperature of the element may reach the melting point and the temperature fuse may operate, and it is required that the resistance is sufficiently low in order to eliminate such malfunction. Furthermore, since the fuse element of the temperature fuse is used in the form of a linear piece, it is required that wire drawing can be performed.
【０００６】[0006]
【発明が解決しようとする課題】従来、実用化されてい
る合金型温度ヒュ−ズには、動作温度７３．５±２．５
℃、９８±２℃、１１２±３℃、１２６±３℃、１３０
±２℃、１４５±２℃並びに１６４．５±２．５℃のも
のが存在する。The alloy type temperature fuse which has been practically used in the past has an operating temperature of 73.5 ± 2.5.
℃, 98 ± 2 ℃, 112 ± 3 ℃, 126 ± 3 ℃, 130
There are ± 2 ° C, 145 ± 2 ° C and 164.5 ± 2.5 ° C.
【０００７】而るに、動作温度７３．５±２．５℃と９
８±２℃との差が、他の動作温度差（ほぼ１５℃）に較
べて広すぎ、この間の温度を保護温度とする電気機器の
適切な保護を全うし難く、動作温度が８０℃〜９０℃に
ある合金型温度ヒュ−ズの出現が望まれている。Thus, the operating temperature is 73.5 ± 2.5 ° C. and 9
The difference between 8 ± 2 ℃ is too wide compared to other operating temperature differences (approximately 15 ℃), and it is difficult to properly protect electrical equipment that uses the temperature between these temperatures as the protection temperature. The advent of alloy type temperature fuses at 90 ° C is desired.
【０００８】従来、固液共存域が８０℃〜９０℃の間に
在り、その領域の巾が温度ヒュ−ズの作動上許容できる
範囲（４℃以内）にある低融点可溶合金として、Bi−In
−Sn共晶合金（共晶点温度８２℃、共晶組成Sn４６重量
％，In５０重量％，Bi４重量％）が公知であるが、脆性
が高く、ヒュ−ズエレメントとしての加工が至難であ
り、温度ヒュ−ズのヒュ−ズエレメントとしての使用は
困難である。Conventionally, as a low melting point soluble alloy having a solid-liquid coexistence region between 80 ° C. and 90 ° C. and a width of the region within an allowable range (within 4 ° C.) for operating the temperature fuse, −In
-Sn eutectic alloy (eutectic point temperature 82 ° C, eutectic composition Sn 46% by weight, In 50% by weight, Bi 4% by weight) is known, but it has high brittleness and is difficult to process as a fuse element. It is difficult to use the temperature fuse as a fuse element.
【０００９】かかる現況下、本発明者において、作動温
度が８０℃〜９０℃の範囲に属する合金型温度ヒュ−ズ
を得るべく、鋭意検討したところ、InとBiとを主成分と
し、これにSnを添加剤として微量加えた合金組成をヒュ
−ズエレメントに使用することにより、作動温度が８６
℃〜８９℃の合金型温度ヒュ−ズを前記した性能上、製
作上の要件を充足して得ることができた。Under these circumstances, the present inventor has made earnest studies in order to obtain an alloy type temperature fuse whose operating temperature is in the range of 80 ° C. to 90 ° C. As a result, In and Bi are the main components. By using the alloy composition with a slight addition of Sn as an additive in the fuse element, the operating temperature is 86
The alloy type temperature fuse of ℃ to 89 ℃ was obtained by satisfying the above-mentioned performance and manufacturing requirements.
【００１０】本発明の目的は、かかる成果を基礎とし
て、作動温度が８６℃〜８９℃の合金型温度ヒュ−ズを
容易に製作できる合金型温度ヒュ−ズを提供することに
ある。An object of the present invention is to provide an alloy type temperature fuse which can easily manufacture an alloy type temperature fuse having an operating temperature of 86 ° C. to 89 ° C. based on the above results.
【００１１】[0011]
【課題を解決するための手段】本発明の合金型温度ヒュ
−ズは、低融点可溶合金をヒュ−ズエレメントとする温
度ヒュ−ズにおいて、低融点可溶合金の合金組成が、S
n：０．３〜１．５重量％、In：５１〜５４重量％、残
部Biであることを特徴とする構成である。The alloy type temperature fuse of the present invention is a temperature fuse having a low melting point fusible alloy as a fuse element, wherein the alloy composition of the low melting point fusible alloy is S
The composition is characterized in that n: 0.3 to 1.5% by weight, In: 51 to 54% by weight, and the balance Bi.
【００１２】[0012]
【作用】基準組成Sn：１．０重量％，In：５２．５重量
％，Bi：４６．５重量％の液相線温度が８７℃、固液共
存域巾が３℃であり、通常ヒュ−ズエレメントの溶断温
度よりも約２℃高い温度が温度ヒュ−ズの動作温度とな
り、動作温度８６〜８９℃の合金型温度ヒュ−ズが得ら
れる。The liquid composition of standard composition Sn: 1.0% by weight, In: 52.5% by weight, Bi: 46.5% by weight has a liquidus temperature of 87 ° C and a solid-liquid coexistence region width of 3 ° C. The temperature of the temperature fuse is about 2 ° C. higher than the fusing temperature of the element, and an alloy type temperature fuse having an operating temperature of 86 to 89 ° C. is obtained.
【００１３】[0013]
【実施例】本発明の合金型温度ヒュ−ズの形式には、ケ
−ス型、基板型、或いは、樹脂ディッピング型の何れを
も使用できる。ケ−ス型においては、互いに一直線上に
対向するリ−ド線間に線状片のヒュ−ズエレメントが溶
接により橋設され、ヒュ−ズエレメント上にフラックス
が塗布され、このフラックス塗布ヒュ−ズエレメント上
にセラミックス筒が挿通され、該筒の各端と各リ−ド線
との間がエポキシ樹脂で封止される。または、平行リ−
ド線間の先端に線状片のヒュ−ズエレメントが溶接によ
り橋設され、ヒュ−ズエレメント上にフラックスが塗布
され、このフラックス塗布ヒュ−ズエレメント上に扁平
なセラミックキャップが被せられ、このキャップの開口
とリ−ド線との間がエポキシ樹脂で封止される。The alloy type temperature fuse of the present invention may be of a case type, a substrate type or a resin dipping type. In the case type, a fuse element, which is a linear piece, is bridged by welding between lead wires that face each other in a straight line, flux is applied on the fuse element, and this flux applying fuse is used. A ceramic cylinder is inserted through the element, and each end of the cylinder and each lead wire are sealed with epoxy resin. Or parallel reel
A fuse element of a linear piece is bridged by welding at the tip between the lead wires, flux is applied on the fuse element, and a flat ceramic cap is covered on the flux application fuse element. An epoxy resin seals between the opening of the cap and the lead wire.
【００１４】上記樹脂ディッピング型においては、セラ
ミックキャップの包囲に代え、フラックス塗布ヒュ−ズ
エレメント上にエポキシ樹脂液への浸漬によるエポキシ
樹脂被覆層が設けられる。In the resin dipping type, instead of surrounding the ceramic cap, an epoxy resin coating layer is provided on the flux applying fuse element by dipping in an epoxy resin liquid.
【００１５】上記基板型においては、片面に一対の層状
電極を設けた絶縁基板のその電極間先端に線状片のヒュ
−ズエレメントが溶接により橋設され、ヒュ−ズエレメ
ント上にフラックスが塗布され、各電極の後端にリ−ド
線が接続され、絶縁基板片面上にエポキシ樹脂被覆層が
設けられる。In the above-mentioned substrate type, a fuse element of a linear piece is bridged by welding at the tip between the electrodes of an insulating substrate having a pair of layered electrodes on one surface, and flux is applied on the fuse element. A lead wire is connected to the rear end of each electrode, and an epoxy resin coating layer is provided on one surface of the insulating substrate.
【００１６】ヒュ−ズエレメントには、Sn：０．３〜
１．５重量％、In：５１〜５４重量％、残部Biの合金母
材を線引きすることにより得られ、断面丸形のまま、ま
たは、さらに扁平に圧縮加工して使用される。In the fuse element, Sn: 0.3-
It is obtained by drawing an alloy base material of 1.5 wt%, In: 51 to 54 wt%, and the balance Bi, and is used as it is with a round cross section, or by further flattening it.
【００１７】上記の合金組成に対する基準組成、Sn：
１．０重量％，In：５２．５重量％，残部Biの液相線温
度は８７℃、固液共存域巾は３℃である。Reference composition for the above alloy composition, Sn:
1.0% by weight, In: 52.5% by weight, the liquidus temperature of the balance Bi is 87 ° C, and the solid-liquid coexistence region width is 3 ° C.
【００１８】合金型温度ヒュ−ズにおいては、温度ヒュ
−ズ表面とヒュ−ズエレメントとの間の熱抵抗のため
に、ヒュ−ズエレメント温度に較べ温度ヒュ−ズ表面温
度がほぼ２℃高くなり、上記標準組成をヒュ−ズエレメ
ントとする温度ヒュ−ズの作動温度は８９℃〜８６℃と
なる。In the alloy type temperature fuse, the temperature fuse surface temperature is approximately 2 ° C. higher than the fuse element temperature because of the thermal resistance between the temperature fuse surface and the fuse element. Therefore, the operating temperature of the temperature fuse having the standard composition as a fuse element is 89 ° C to 86 ° C.
【００１９】上記組成の合金においては、Inにより線引
きに必要な延性が与えられ、Biにより融点が９０℃に近
い低融合金とされ、Snにより上記の延性を保持しつつ８
４℃〜８７℃の融点（固相線と液相線との間の温度）に
設定される。In the alloy having the above composition, In gives ductility necessary for drawing, Bi makes it a low fusion alloy having a melting point close to 90 ° C., and Sn keeps the ductility while maintaining the ductility of 8%.
It is set to a melting point (temperature between solidus line and liquidus line) of 4 ° C to 87 ° C.
【００２０】上記合金組成におけるSn，In，Bi等の上限
と下限は、温度ヒュ−ズの動作温度の巾を±３℃（８
７．５℃を中心として）以内に納めるのに必要な限定で
ある。The upper and lower limits of Sn, In, Bi, etc. in the above alloy composition have a range of operating temperature of the temperature fuse of ± 3 ° C. (8
It is a limitation necessary to set within (about 7.5 ℃).
【００２１】本発明によれば、動作温度が８６℃〜８９
℃にある合金型温度ヒュ−ズを良好な歩留まりで製造す
ることができる。このことは次の実施例からも明らかで
ある。According to the present invention, the operating temperature is 86 ° C to 89 ° C.
The alloy type temperature fuse at ℃ can be manufactured with a good yield. This is clear from the following examples.
【００２２】実施例 Sn：１．０重量％、In：５２．５重量％、残部Biの合金
組成の母材を線引きして直径０．６ｍｍの線に加工し
た。１ダイスについての引落率を６．５％とし、線引き
速度を４５ｍ／ｍｉｎとしたが、断線は皆無であった。
この線の抵抗値を測定したところ、１．９Ω／ｍであ
り、既存の合金型温度ヒュ−ズのヒュ−ズエレメントの
抵抗値と同オ−ダであり、抵抗上、何ら問題はなかっ
た。Example Sn: 1.0% by weight, In: 52.5% by weight, the balance of the base material having an alloy composition was drawn to form a wire having a diameter of 0.6 mm. The drop rate for one die was 6.5% and the drawing speed was 45 m / min, but there was no disconnection.
When the resistance value of this line was measured, it was 1.9 Ω / m, which was the same order as the resistance value of the fuse element of the existing alloy type temperature fuse, and there was no problem in terms of resistance. .
【００２３】この線を長さ６ｍｍに切断してヒュ−ズエ
レメントとし、筒型温度ヒュ−ズを作成した。リ−ド線
には外径０．６ｍｍの錫メッキ銅線を、筒体には内径
１．５ｍｍのセラミックス筒を使用した。This wire was cut into a length of 6 mm to form a fuse element, and a cylindrical temperature fuse was prepared. A tin-plated copper wire having an outer diameter of 0.6 mm was used as the lead wire, and a ceramic cylinder having an inner diameter of 1.5 mm was used as the cylindrical body.
【００２４】この実施例品５０箇を、０．１アンペアの
電流を通電しつつ、昇温速度１℃／１分のオイルバスに
浸漬し、溶断による通電遮断時のオイル温度を測定した
ところ、８７±１℃の範囲内であった。50 pieces of the products of this embodiment were immersed in an oil bath at a rate of temperature rise of 1 ° C./1 minute while applying a current of 0.1 amperes, and the oil temperature at the time of interruption of energization by fusing was measured. It was within the range of 87 ± 1 ° C.
【００２５】また、上記した合金組成の範囲内であれ
ば、動作温度を８７．５℃を中心として±３℃の範囲内
に納めることができた。If the alloy composition is within the above range, the operating temperature can be set within the range of ± 3 ° C. centering on 87.5 ° C.
【００２６】なお、共晶点温度８２℃、共晶組成Sn４６
重量％，In５０重量％，Bi４重量％の合金を用いて温度
ヒュ−ズを製作することを試みたが、ヒュ−ズエレメン
トを製造することができず、実現できなかった。A eutectic point temperature of 82 ° C. and a eutectic composition of Sn46
An attempt was made to manufacture a temperature fuse using an alloy containing 50% by weight, 50% by weight of In, and 4% by weight of Bi, but the fuse element could not be manufactured and could not be realized.
【００２７】[0027]
【発明の効果】本発明によれば、低融点可溶合金母材の
能率のよい線引きでヒュ−ズエレメントを製造し、この
ヒュ−ズエレメントを用いて動作温度が８６℃〜８９℃
で、かつ自己発熱を充分に防止できる合金型温度ヒュ−
ズを得ることができ、保護温度が８０〜９０℃程度の機
器の保護に有用な合金型温度ヒュ−ズを良好な生産性で
得ることができる。According to the present invention, a fuse element is manufactured by efficiently drawing a low melting point fusible alloy base material, and the operating temperature is 86 ° C to 89 ° C using this fuse element.
And an alloy type temperature fuse that can sufficiently prevent self-heating
It is possible to obtain alloy type temperature fuses useful for protecting equipment having a protection temperature of about 80 to 90 ° C. with good productivity.
Claims (1)
る温度ヒュ−ズにおいて、低融点可溶合金の合金組成
が、Sn：０．３〜１．５重量％、In：５１〜５４重量
％、残部Biであることを特徴とする合金型温度ヒュ−
ズ。1. A temperature fuse comprising a low melting point fusible alloy as a fuse element, wherein the alloy composition of the low melting point fusible alloy is Sn: 0.3 to 1.5% by weight, In: 51 to 54. Alloy type temperature fuse, characterized by weight% and balance Bi
Z.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13939893A JP3995058B2 (en) | 1993-05-17 | 1993-05-17 | Alloy type temperature fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13939893A JP3995058B2 (en) | 1993-05-17 | 1993-05-17 | Alloy type temperature fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06325670A true JPH06325670A (en) | 1994-11-25 |
| JP3995058B2 JP3995058B2 (en) | 2007-10-24 |
Family
ID=15244355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13939893A Expired - Lifetime JP3995058B2 (en) | 1993-05-17 | 1993-05-17 | Alloy type temperature fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3995058B2 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5229235A (en) * | 1988-06-27 | 1993-07-20 | Sony Corporation | Electrophotographic process using melted developer |
| JP2003013165A (en) * | 2001-06-28 | 2003-01-15 | Sorudaa Kooto Kk | Fusible alloy and wire rod for thermal fuse, and thermal fuse |
| US6774761B2 (en) | 2002-03-06 | 2004-08-10 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6819215B2 (en) | 2002-03-06 | 2004-11-16 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US7038569B2 (en) | 2002-05-02 | 2006-05-02 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element |
| US7042327B2 (en) | 2002-10-30 | 2006-05-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| US7064648B2 (en) | 2003-03-04 | 2006-06-20 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| US7142088B2 (en) | 2002-11-26 | 2006-11-28 | Uchibashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| US7160504B2 (en) | 2002-03-06 | 2007-01-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US7199697B2 (en) | 2002-11-26 | 2007-04-03 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| WO2022050185A1 (en) * | 2020-09-04 | 2022-03-10 | 株式会社新菱 | Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit |
-
1993
- 1993-05-17 JP JP13939893A patent/JP3995058B2/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5229235A (en) * | 1988-06-27 | 1993-07-20 | Sony Corporation | Electrophotographic process using melted developer |
| JP2003013165A (en) * | 2001-06-28 | 2003-01-15 | Sorudaa Kooto Kk | Fusible alloy and wire rod for thermal fuse, and thermal fuse |
| US7160504B2 (en) | 2002-03-06 | 2007-01-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6819215B2 (en) | 2002-03-06 | 2004-11-16 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6911892B2 (en) | 2002-03-06 | 2005-06-28 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US6774761B2 (en) | 2002-03-06 | 2004-08-10 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element thereof |
| US7038569B2 (en) | 2002-05-02 | 2006-05-02 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and fuse element |
| US7042327B2 (en) | 2002-10-30 | 2006-05-09 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and wire member for a thermal fuse element |
| US7142088B2 (en) | 2002-11-26 | 2006-11-28 | Uchibashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| US7199697B2 (en) | 2002-11-26 | 2007-04-03 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| US7064648B2 (en) | 2003-03-04 | 2006-06-20 | Uchihashi Estec Co., Ltd. | Alloy type thermal fuse and material for a thermal fuse element |
| WO2022050185A1 (en) * | 2020-09-04 | 2022-03-10 | 株式会社新菱 | Low melting-point bonding member, method for producing same, semiconductor electronic circuit, and method for mounting said semiconductor electronic circuit |
| JP2022043721A (en) * | 2020-09-04 | 2022-03-16 | 株式会社新菱 | Low-melting-point joint member and method of manufacturing the same, and semiconductor electronic circuit and method of mounting the same |
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| Publication number | Publication date |
|---|---|
| JP3995058B2 (en) | 2007-10-24 |
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