JP2018001406A - Polishing device and polishing method - Google Patents

Polishing device and polishing method Download PDF

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Publication number
JP2018001406A
JP2018001406A JP2017196150A JP2017196150A JP2018001406A JP 2018001406 A JP2018001406 A JP 2018001406A JP 2017196150 A JP2017196150 A JP 2017196150A JP 2017196150 A JP2017196150 A JP 2017196150A JP 2018001406 A JP2018001406 A JP 2018001406A
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Prior art keywords
polishing
workpiece
polishing member
polished
shape
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Japanese (ja)
Inventor
均 森永
Hitoshi Morinaga
均 森永
宏 浅野
Hiroshi Asano
宏 浅野
伸悟 大月
Shingo Otsuki
伸悟 大月
玉井　一誠
Kazumasa Tamai
一誠 玉井
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Fujimi Inc
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Fujimi Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/02—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding grooves, e.g. on shafts, in casings, in tubes, homokinetic joint elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/002—Grinding heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/02—Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • B24B9/107—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass for glass plates while they are turning

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a polishing device and a polishing method that can polish polished workpieces which have various outer shapes.SOLUTION: A polishing device comprises a disk-like polishing member (10) which has a polishing plane in a shape conforming with a shape of a polished part of a polished workpiece (K), and a moving mechanism (33) which moves at least one of the polished workpiece (K) and polishing member (10) in a tangential direction of an outer peripheral surface in a radial direction of the polishing member (10), and is configured to polish ends of a plurality of polished workpieces simultaneously with the outer peripheral surface of the polishing member (10).SELECTED DRAWING: Figure 1

Description

本発明は、研磨装置及び研磨方法に関する。   The present invention relates to a polishing apparatus and a polishing method.

特許文献１や特許文献２に記載の研磨装置では、被研磨加工物（研磨加工される対象物）を回転させながら研磨部材に接触させることにより、被研磨加工物の外周を研磨するようにしている。   In the polishing apparatus described in Patent Document 1 or Patent Document 2, the outer periphery of the workpiece to be polished is polished by bringing the workpiece (the object to be polished) into contact with the polishing member while rotating. Yes.

特開平１１−１８８５９０号公報JP 11-188590 A 特開２００１−２０５５４９号公報JP 2001-205549 A

しかし、上述した従来の研磨装置では、回転している被研磨加工物の外周を研磨部材に接触させるようにしているため、被研磨加工物は、円盤状や円筒状等のような外形が正円形状のものに限られてしまい、その他の様々な外形を有した被研磨加工物を研磨することは困難である。   However, in the above-described conventional polishing apparatus, the outer periphery of the rotating workpiece to be polished is brought into contact with the polishing member, so that the workpiece has an outer shape such as a disk shape or a cylindrical shape. It is limited to a circular shape, and it is difficult to polish a workpiece to be polished having various other external shapes.

なお、上記「正円形状」とは、平面上の、ある１点からの距離が等しい点の集合でできた曲線で描かれる形状のことをいう。また、上記「外形」とは、被研磨加工物において研磨される側面に対して直交する面の投影図の形状のことをいう。   The “perfect circle shape” refers to a shape drawn by a curve made up of a set of points on the plane that are equal in distance from one point. The “outer shape” refers to the shape of a projected view of a surface orthogonal to the side surface to be polished in the workpiece.

この発明は、こうした実情に鑑みてなされたものであり、その目的は、様々な外形を有した被研磨加工物を研磨することのできる研磨装置及び研磨方法を提供することにある。   The present invention has been made in view of such circumstances, and an object thereof is to provide a polishing apparatus and a polishing method capable of polishing a workpiece to be polished having various outer shapes.

上記課題を解決する研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   A polishing apparatus that solves the above problem is an apparatus that polishes a workpiece to be polished, a disc-shaped polishing member having a polishing surface that follows a shape of a portion to be polished of the workpiece, and the workpiece. A moving mechanism for moving at least one of the polishing workpiece or the polishing member in a tangential direction on the radial outer peripheral surface of the polishing member, and simultaneously end portions of a plurality of workpieces on the outer peripheral surface of the polishing member Is configured to polish.

また、上記課題を解決する別の研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる第１移動機構と、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の回転軸に対して直交する方向に移動させる第２移動機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   Another polishing apparatus for solving the above-described problem is an apparatus for polishing a workpiece to be polished, and a disc-shaped polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece. A first moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member; and at least one of the workpiece or the polishing member A second moving mechanism for moving the polishing member in a direction perpendicular to the rotation axis of the polishing member, and configured to polish the end portions of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. .

また、上記課題を解決する別の研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   Another polishing apparatus for solving the above-described problem is an apparatus for polishing a workpiece to be polished, and a disc-shaped polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece. And a rotating mechanism for rotating at least one of the workpiece or the polishing member, and configured to polish the end portions of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member.

また、上記課題を解決する別の研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   Another polishing apparatus for solving the above-described problem is an apparatus for polishing a workpiece to be polished, and a disc-shaped polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece. And a pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member, and a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member It is comprised so that the edge part of this may be grind | polished.

また、上記課題を解決する別の研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   Another polishing apparatus for solving the above-described problem is an apparatus for polishing a workpiece to be polished, and a disc-shaped polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece. A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member, and rotating at least one of the workpiece or the polishing member A rotating mechanism, and configured to polish the ends of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member.

また、上記課題を解決する別の研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   Another polishing apparatus for solving the above-described problem is an apparatus for polishing a workpiece to be polished, and a disc-shaped polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece. A moving mechanism that moves at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member A pressing mechanism for pressing in a direction orthogonal to the rotation axis of the member, and configured to polish the ends of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member.

また、上記課題を解決する別の研磨装置は、被研磨加工物を研磨する装置であって、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構とを備え、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されている。   Another polishing apparatus for solving the above-described problem is an apparatus for polishing a workpiece to be polished, and a disc-shaped polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece. A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member, and rotating at least one of the workpiece or the polishing member A rotation mechanism; and a pressing mechanism that presses at least one of the workpiece or the polishing member in a direction perpendicular to the rotation axis of the polishing member, and a plurality of objects to be polished simultaneously on the outer peripheral surface of the polishing member. It is comprised so that the edge part of a workpiece may be grind | polished.

また、上記研磨装置は、研磨部材を下方から回転させるモータを備えたり、研磨部材を上面に載置した状態で研磨部材と一体回転する定盤を備えたりすることが好ましい。
また、上記課題を解決する研磨方法は、上記研磨装置を用いて、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨することを特徴とする。 The polishing apparatus preferably includes a motor that rotates the polishing member from below, or a surface plate that rotates integrally with the polishing member in a state where the polishing member is placed on the upper surface.
In addition, a polishing method that solves the above problem is characterized in that the polishing apparatus is used to simultaneously polish the ends of a plurality of workpieces on the outer peripheral surface of the polishing member.

上記装置や方法では、研磨部材は、被研磨加工物の被研磨部の形状に沿った形状の研磨面を有しているため、被研磨加工物の被研磨部の形状が、例えば曲面や三角形状等のように、平面状とは異なる形状であっても研磨することができる。   In the above apparatus and method, since the polishing member has a polishing surface having a shape that follows the shape of the portion to be polished of the workpiece, the shape of the portion to be polished of the workpiece to be polished is, for example, a curved surface or a triangle. Even if the shape is different from the planar shape, such as the shape, it can be polished.

上記装置や方法において、被研磨加工物または研磨部材の少なくとも一方を、研磨部材の径方向の外周面における接線方向に移動させた場合には、被研磨加工物と研磨部材とが直線状に相対移動するようになる。従って、直線状の外形を有した被研磨加工物を研磨することができる。   In the above apparatus and method, when at least one of the workpiece or the polishing member is moved in a tangential direction on the outer circumferential surface of the polishing member in the radial direction, the workpiece and the polishing member are linearly relative to each other. To move. Therefore, a workpiece to be polished having a linear outer shape can be polished.

上記装置や方法において、被研磨加工物または研磨部材の少なくとも一方を、研磨部材の径方向の外周面における接線方向に移動させるとともに、被研磨加工物または研磨部材の少なくとも一方を、研磨部材の回転軸に対して直交する方向に移動させた場合には、被研磨加工物と研磨部材との位置関係を任意に変化させることが可能になる。そのため、種々の被研磨加工物の外形形状に追従させながら被研磨部材を研磨加工物と接触状態に維持することができる。従って、様々な外形を有した被研磨加工物を研磨することができる。   In the above apparatus or method, at least one of the workpiece or the polishing member is moved in a tangential direction on the radially outer peripheral surface of the polishing member, and at least one of the workpiece or the polishing member is rotated by the polishing member. When moved in a direction perpendicular to the axis, the positional relationship between the workpiece and the polishing member can be arbitrarily changed. Therefore, the member to be polished can be maintained in contact with the polishing workpiece while following the outer shape of various workpieces to be polished. Therefore, a workpiece to be polished having various outer shapes can be polished.

また、上記装置や方法において、被研磨加工物または研磨部材の少なくとも一方を回転させた場合には、被研磨加工物の研磨される面を変更することができる。従って、様々な外形を有する被研磨加工物の例えば外周全体や一部を好適に研磨することができる。   Further, in the above apparatus and method, when at least one of the workpiece or the polishing member is rotated, the surface to be polished of the workpiece can be changed. Therefore, for example, the entire outer periphery or a part of the workpiece to be polished having various outer shapes can be suitably polished.

また、上記装置や方法において、被研磨加工物または研磨部材の少なくとも一方を研磨部材の回転軸に対して直交する方向に押圧した場合には、被研磨加工物の研磨処理を促進させることができるとともに、被研磨加工物及び研磨面の接触状態（いわゆる当たり）の均一化を促すことができる。   In the above apparatus and method, when at least one of the workpiece or the polishing member is pressed in a direction orthogonal to the rotation axis of the polishing member, the polishing process of the workpiece can be promoted. In addition, the contact state (so-called hit) between the workpiece and the polishing surface can be made uniform.

また、上記装置や方法において、研磨部材を下方から回転させたり、研磨部材を定盤の上面に載置した状態で同定盤とともに研磨部材を一体回転させた場合には、軸ぶれなどの少ない安定した研磨部材の回転が得られるようになるため、より高精度な加工を行うことができる。   In the above apparatus and method, when the polishing member is rotated from below, or the polishing member is integrally rotated together with the identification board in a state where the polishing member is placed on the upper surface of the surface plate, there is little stability such as shaft runout. Since the rotation of the polished member can be obtained, more accurate processing can be performed.

本発明によれば、様々な外形を有した被研磨加工物を研磨することができる。   According to the present invention, a workpiece to be polished having various outer shapes can be polished.

一実施形態の研磨装置の概略構成を示す平面図。The top view which shows schematic structure of the grinding | polishing apparatus of one Embodiment. 同実施形態の研磨装置の概略構成を示す側面図。The side view which shows schematic structure of the grinding | polishing apparatus of the embodiment. 同実施形態の変形例における研磨装置の概略構成を示す平面図。The top view which shows schematic structure of the grinding | polishing apparatus in the modification of the embodiment. 図３の変形例における研磨装置を用いて研磨される被研磨加工物の一例を示す平面図。The top view which shows an example of the to-be-polished workpiece grind | polished using the grinding | polishing apparatus in the modification of FIG. 同実施形態の別の変形例における被研磨加工物及び研磨部材の部分側面図。The partial side view of the to-be-polished workpiece and the polishing member in another modification of the embodiment. 同実施形態の別の変形例における被研磨加工物及び研磨部材の部分側面図。The partial side view of the to-be-polished workpiece and the polishing member in another modification of the embodiment. 同実施形態の別の変形例における被研磨加工物及び研磨部材の部分側面図。The partial side view of the to-be-polished workpiece and the polishing member in another modification of the embodiment. 同実施形態の別の変形例における被研磨加工物及び研磨部材の部分側面図。The partial side view of the to-be-polished workpiece and the polishing member in another modification of the embodiment. 同実施形態の別の変形例における被研磨加工物及び研磨部材の部分側面図。The partial side view of the to-be-polished workpiece and the polishing member in another modification of the embodiment. 同実施形態の別の変形例の研磨装置による被研磨加工物の加工態様を示す模式図。The schematic diagram which shows the process aspect of the to-be-polished workpiece by the grinding | polishing apparatus of another modification of the embodiment. 同実施形態の別の変形例の研磨装置による被研磨加工物の加工態様を示す模式図。The schematic diagram which shows the process aspect of the to-be-polished workpiece by the grinding | polishing apparatus of another modification of the embodiment. 同実施形態の別の変形例における圧力付与機構の概略構成を示す模式図。The schematic diagram which shows schematic structure of the pressure provision mechanism in another modification of the embodiment.

以下、本発明の研磨装置及び研磨方法及び被研磨加工物を具体化した一実施形態について、図１及び図２を参照して説明する。
図１に示すように、この研磨装置は、円盤状の研磨部材１０を備えている。この研磨部材１０の径方向の外周面を使って、被研磨加工物Ｋの被研磨部である端部が研磨される。 Hereinafter, an embodiment embodying a polishing apparatus, a polishing method, and a workpiece to be polished according to the present invention will be described with reference to FIGS. 1 and 2.
As shown in FIG. 1, the polishing apparatus includes a disk-shaped polishing member 10. Using the outer peripheral surface of the polishing member 10 in the radial direction, the end portion of the workpiece K to be polished is polished.

被研磨加工物Ｋの外形、つまり同被研磨加工物Ｋにおいて研磨される側面に直交する面の投影形状（図１に示す被研磨加工物Ｋの形状）は四角形状をなしている。より詳細には、四角形の角部は直角ではなく丸みを帯びている。しかし、その他の形状として、四角形の角部が直角になっていてもよい。   The outer shape of the workpiece K, that is, the projected shape of the surface orthogonal to the side surface to be polished in the workpiece K (the shape of the workpiece K shown in FIG. 1) has a quadrangular shape. More specifically, the corners of the rectangle are rounded rather than right. However, as other shapes, the corners of the quadrangle may be perpendicular.

図２に示すように、被研磨加工物Ｋの端部ＫＥの形状（被研磨部の形状）は、予めの加工によって曲面形状にされており、この曲面形状に加工された端部ＫＥが、研磨部材１０で研磨される。   As shown in FIG. 2, the shape of the end KE of the workpiece K (the shape of the portion to be polished) has been made into a curved shape by the previous processing, and the end KE processed into this curved shape is Polishing is performed by the polishing member 10.

研磨部材１０の材質は、端部ＫＥを研磨する上で最適なものを任意に使用できる。例えば、研磨部材１０の材質として樹脂を使用する場合には、任意の合成樹脂を使用することができる。その例としては、熱硬化性樹脂（フェノール樹脂、エポキシ樹脂、ウレタン樹脂、ポリイミドなど）や、熱可塑性樹脂（ポリエチレン、ポリプロピレン、アクリル樹脂、ポリアミド、ポリカーボネートなど）が挙げられる。また、織物、不織布、不織布の樹脂加工品、合成皮革、あるいはこれらの複合品であってもよく、研磨部材１０の研磨面の硬度は、ショアＡ硬度で５以上であることが好ましい。ショアＡ硬度が５以上であるとは、硬度を測定される検体であって研磨面を有する研磨部材１０を、湿度２０〜６０％の乾燥状態で室温に６０分以上置いた後、ＪＩＳ Ｋ６２５３に準拠したゴム硬度計（Ａ型）にて測定される研磨面の硬度が５以上であることをいう。ショアＡ硬度が５以上であれば、被研磨加工物Ｋの表面を好適に加工することができ、また、研磨部材１０の研磨面が短時間の研磨で変形することを抑えることが出来る。   As the material of the polishing member 10, an optimum material for polishing the end KE can be arbitrarily used. For example, when a resin is used as the material of the polishing member 10, any synthetic resin can be used. Examples thereof include a thermosetting resin (phenol resin, epoxy resin, urethane resin, polyimide, etc.) and a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, polycarbonate, etc.). Further, it may be a woven fabric, a non-woven fabric, a non-woven fabric processed resin product, synthetic leather, or a composite product thereof. The hardness of the polishing surface of the polishing member 10 is preferably 5 or more in Shore A hardness. A Shore A hardness of 5 or more means that a polishing member 10 that is a specimen whose hardness is to be measured and has a polishing surface is placed in a dry state at a humidity of 20 to 60% at room temperature for 60 minutes or more, and is then placed in JIS K6253. It means that the hardness of the polished surface measured by a compliant rubber hardness meter (type A) is 5 or more. When the Shore A hardness is 5 or more, the surface of the workpiece K can be suitably processed, and the polishing surface of the polishing member 10 can be prevented from being deformed by short-time polishing.

なお、研磨部材１０の研磨面のショアＡ硬度は、より好ましくは４０以上であり、更に好ましくは７０〜９５、特に好ましくは７０〜８５である。
また、研磨部材１０の材質として金属を使用する場合には、材質として、マグネシウム、アルミニウム、チタン、鉄、ニッケル、コバルト銅、亜鉛、マンガン或いはそれを主成分とする合金を使用することができる。 The Shore A hardness of the polishing surface of the polishing member 10 is more preferably 40 or more, still more preferably 70 to 95, and particularly preferably 70 to 85.
Further, when a metal is used as the material of the polishing member 10, magnesium, aluminum, titanium, iron, nickel, cobalt copper, zinc, manganese, or an alloy mainly composed thereof can be used as the material.

なお、研磨部材１０の材質として、樹脂又は金属を使用する場合には、研磨部材１０は砥粒を有していても良い。使用する砥粒の種類は特に限定されないが、酸化ケイ素、酸化アルミニウム、酸化ジルコニウム、酸化セリウム、酸化マグネシウム、酸化カルシウム、酸化チタニウム、酸化マンガン、酸化鉄、酸化クロムなどの金属酸化物粒子や、炭化ケイ素などの炭化物、その他窒化物、硼化物、ダイヤモンド等を使用することが出来る。   In addition, when using resin or a metal as a material of the grinding | polishing member 10, the grinding | polishing member 10 may have an abrasive grain. The type of abrasive grains used is not particularly limited, but metal oxide particles such as silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, and chromium oxide, and carbonized Carbides such as silicon, other nitrides, borides, diamonds and the like can be used.

また、研磨部材１０の材質としてセラミックスを使用する場合には、材質として、陶磁器やガラスの他、ケイ素、アルミニウム、ジルコニウム、カルシウム、バリウムなどの酸化物、窒化物、ホウ化物、炭化物などや、酸化アルミニウム、酸化ジルコニウム、酸化ケイ素、炭化ケイ素、窒化ケイ素、窒化ホウ素などを使用することができる。   Further, when ceramics are used as the material of the polishing member 10, as materials, ceramics, glass, oxides such as silicon, aluminum, zirconium, calcium, barium, nitrides, borides, carbides, etc. Aluminum, zirconium oxide, silicon oxide, silicon carbide, silicon nitride, boron nitride and the like can be used.

被研磨加工物Ｋの材質も任意のものを使用することができる。例えば、被研磨加工物Ｋの材質として樹脂を使用する場合には、任意の合成樹脂を使用することができる。その例としては、熱硬化性樹脂（フェノール樹脂、エポキシ樹脂、ウレタン樹脂、ポリイミドなど）や、熱可塑性樹脂（ポリエチレン、ポリプロピレン、アクリル樹脂、ポリアミド、ポリカーボネートなど）が挙げられる。   Any material can be used for the workpiece K to be polished. For example, when a resin is used as the material of the workpiece K, any synthetic resin can be used. Examples thereof include a thermosetting resin (phenol resin, epoxy resin, urethane resin, polyimide, etc.) and a thermoplastic resin (polyethylene, polypropylene, acrylic resin, polyamide, polycarbonate, etc.).

また、被研磨加工物Ｋの材質としてセラミックスを使用する場合には、陶磁器、ガラス、ファインセラミックスの他、ケイ素、アルミニウム、ジルコニウム、カルシウム、バリウムなどの酸化物、炭化物、窒化物、ホウ化物などを使用することができる。   When ceramics are used as the material of the workpiece K, ceramics, glass, fine ceramics, oxides such as silicon, aluminum, zirconium, calcium, barium, carbides, nitrides, borides, etc. Can be used.

また、被研磨加工物Ｋの材質として金属を使用する場合には、マグネシウム、アルミニウム、チタン、鉄、ニッケル、コバルト、銅、亜鉛、マンガン或いはそれを主成分とする合金等を使用することができる。   Further, when a metal is used as the material of the workpiece K, magnesium, aluminum, titanium, iron, nickel, cobalt, copper, zinc, manganese or an alloy containing the same as the main component can be used. .

また、被研磨加工物Ｋの具体的な用途についても任意である。例えばホイール、シャフト、容器、筐体（ケース、ハウジングなど）、枠（フレームなど）、ボール、ワイヤ、装飾品などをその用途とすることができる。   The specific use of the workpiece K is also arbitrary. For example, a wheel, a shaft, a container, a housing (a case, a housing, etc.), a frame (a frame, etc.), a ball, a wire, a decorative article, and the like can be used.

研磨部材１０は、円盤状の定盤２０の上面に取り外し可能に固定されている。定盤２０の中心部下面には、第１モータ２１の回転軸が固定されている。第１モータ２１が回転駆動されると、定盤２０及び研磨部材１０はともに回転する。研磨部材１０及び定盤２０の下に第１モータ２１を設けており、定盤２０の上面に配置された研磨部材１０を同定盤２０とともに下から回転させることにより、軸ぶれなどの少ない安定した研磨部材１０の回転が得られるために、より高精度な加工を行うことができる。   The polishing member 10 is detachably fixed to the upper surface of the disk-shaped surface plate 20. A rotation shaft of the first motor 21 is fixed to the lower surface of the center portion of the surface plate 20. When the first motor 21 is driven to rotate, both the surface plate 20 and the polishing member 10 rotate. The first motor 21 is provided under the polishing member 10 and the surface plate 20, and the polishing member 10 disposed on the upper surface of the surface plate 20 is rotated together with the identification plate 20 from the bottom, so that the shaft shake and the like are stable. Since the rotation of the polishing member 10 can be obtained, more accurate processing can be performed.

研磨部材１０の径方向の外周面には、周方向に延びる溝状の曲面形状を有した研磨面１１が設けられている。この研磨面１１の曲面は、被研磨加工物Ｋの端部ＫＥの形状に沿った形にされている。つまり研磨面１１の曲率は、端部ＫＥの曲率と同じにされている。   A polishing surface 11 having a groove-like curved surface extending in the circumferential direction is provided on the outer circumferential surface of the polishing member 10 in the radial direction. The curved surface of the polishing surface 11 is formed along the shape of the end KE of the workpiece K to be polished. That is, the curvature of the polished surface 11 is the same as the curvature of the end KE.

ちなみに、研磨精度を好適に維持できる範囲内で研磨部材１０の直径をできる限り大きくすれば、研磨部材１０の外周面において同時に複数の被研磨加工物Ｋの端部ＫＥを研磨することができるため、生産性を向上させることができる。また、研磨部材１０の直径をできる限り大きくすれば、研磨部材１０の回転速度が同じであっても、外周では大きな線速度が得られるようになるため、研磨加工に際して研磨部材１０の回転速度を比較的低くしても十分な線速度が得られるようになる。そのため、例えば後述する加工液の飛散等を抑えることができる。   Incidentally, if the diameter of the polishing member 10 is made as large as possible within a range where the polishing accuracy can be suitably maintained, the end portions KE of the plurality of workpieces K can be simultaneously polished on the outer peripheral surface of the polishing member 10. , Productivity can be improved. Further, if the diameter of the polishing member 10 is made as large as possible, even if the rotation speed of the polishing member 10 is the same, a large linear velocity can be obtained on the outer periphery. Even if it is relatively low, a sufficient linear velocity can be obtained. For this reason, for example, scattering of the machining liquid described later can be suppressed.

被研磨加工物Ｋは、固定台３２に取り外し可能に保持されている。固定台３２は、第２モータ３０の回転軸３１に固定されている。この第２モータ３０が駆動されることにより、被研磨加工物Ｋは、回転軸３１を中心にして回転される（先の図１に示す矢印Ｒ方向又は矢印Ｌ方向）。なお、第２モータ３０は上記回転機構を構成している。   The workpiece K is detachably held on the fixed base 32. The fixed base 32 is fixed to the rotating shaft 31 of the second motor 30. When the second motor 30 is driven, the workpiece K is rotated around the rotation shaft 31 (in the direction of arrow R or arrow L shown in FIG. 1). The second motor 30 constitutes the rotation mechanism.

第２モータ３０は、モータ移動機構３３に取り付けられている。このモータ移動機構３３は、第２モータ３０を、研磨部材１０の回転軸に対して直交する方向に往復移動させる機構を備えている。なお、以下では、研磨部材１０の回転軸に対して直交する方向を「矢印Ｘ方向」（図２に図示）という。   The second motor 30 is attached to the motor moving mechanism 33. The motor moving mechanism 33 includes a mechanism for reciprocating the second motor 30 in a direction orthogonal to the rotation axis of the polishing member 10. Hereinafter, the direction orthogonal to the rotation axis of the polishing member 10 is referred to as “arrow X direction” (shown in FIG. 2).

また、モータ移動機構３３は、第２モータ３０を、研磨部材１０の径方向の外周面における接線方向に往復移動させる機構も備えている。なお、以下では、研磨部材１０の径方向の外周面における接線方向を「矢印Ｙ方向」という（先の図１に図示）。   The motor moving mechanism 33 also includes a mechanism for reciprocating the second motor 30 in the tangential direction on the outer circumferential surface of the polishing member 10 in the radial direction. In the following, the tangential direction on the outer peripheral surface in the radial direction of the polishing member 10 is referred to as “arrow Y direction” (shown in FIG. 1 above).

モータ移動機構３３によって第２モータ３０が移動されると、第２モータ３０及び回転軸３１及び固定台３２及び被研磨加工物Ｋは、一体となって研磨部材１０の回転軸と直交する方向や研磨部材１０の径方向の外周面における接線方向に移動する。このモータ移動機構３３は、上記第１移動機構及び上記第２移動機構を構成している。   When the second motor 30 is moved by the motor moving mechanism 33, the second motor 30, the rotating shaft 31, the fixed base 32, and the workpiece K to be polished are integrated in a direction orthogonal to the rotating shaft of the polishing member 10. The polishing member 10 moves in the tangential direction on the outer circumferential surface in the radial direction. The motor moving mechanism 33 constitutes the first moving mechanism and the second moving mechanism.

さらに研磨装置は、研磨部材１０の回転軸に対して直交する方向に被研磨加工物Ｋを押圧する押圧機構４０を備えている。この押圧機構４０は、研磨部材１０の研磨面１１に対して被研磨加工物Ｋを圧力Ｐにて押圧する。こうした押圧機構４０による圧力Ｐの調整は、任意に行うことができる。例えば、被研磨加工物Ｋの端部ＫＥと研磨面１１との接触部における接触圧をロードセルなどで測定する。そして、その接触圧が規定の値で一定になるように上記圧力Ｐを調整する。また、接触部の面積に応じて圧力Ｐを調整してもよい（例えば接触部の面積が広い部位では圧力Ｐを高くし、接触部の面積が狭い部位では圧力Ｐを低くするなど）。   The polishing apparatus further includes a pressing mechanism 40 that presses the workpiece K in a direction orthogonal to the rotation axis of the polishing member 10. The pressing mechanism 40 presses the workpiece K with the pressure P against the polishing surface 11 of the polishing member 10. Such adjustment of the pressure P by the pressing mechanism 40 can be arbitrarily performed. For example, the contact pressure at the contact portion between the end KE of the workpiece K and the polishing surface 11 is measured with a load cell or the like. Then, the pressure P is adjusted so that the contact pressure becomes constant at a specified value. Further, the pressure P may be adjusted according to the area of the contact portion (for example, the pressure P is increased at a site where the area of the contact portion is large, and the pressure P is decreased at a site where the area of the contact portion is small).

また、角部などは平面部に比較して上記接触圧が高くなりやすい。そのため、角部などのように接触圧が高くなる被研磨加工物Ｋの部分の研磨時間は短くし、平面部などのように接触圧が高くなる被研磨加工物Ｋの部分の研磨時間は長くするなど、被研磨加工物Ｋの形状等に応じて適切な研磨制御を行ったり、そうした圧力Ｐの調整と併せて加工時間を調整して一定の研磨が行われるようにしたりしてもよい。   Also, the contact pressure tends to be higher at the corners than at the flat part. Therefore, the polishing time of a portion of the workpiece K where the contact pressure increases such as a corner is shortened, and the polishing time of the portion of the workpiece K where the contact pressure increases such as a flat portion is long. For example, appropriate polishing control may be performed according to the shape of the workpiece K to be polished, or the processing time may be adjusted together with the adjustment of the pressure P so that constant polishing is performed.

モータ移動機構３３や押圧機構４０の動力源としては、電力、油圧、空気圧、ガス圧等といった適宜の動力源を使用することができる。また、モータ移動機構３３や押圧機構４０の駆動は、ＣＰＵ、ＲＡＭ、及びＲＯＭ等を備えた制御装置による自動駆動や、研磨装置を操作する操作者のスイッチ操作等によって行われる。   As a power source for the motor moving mechanism 33 and the pressing mechanism 40, an appropriate power source such as electric power, hydraulic pressure, air pressure, gas pressure, or the like can be used. The motor moving mechanism 33 and the pressing mechanism 40 are driven by an automatic drive by a control device including a CPU, a RAM, a ROM, and the like, a switch operation of an operator who operates the polishing apparatus, and the like.

こうしたモータ移動機構３３による第２モータ３０の移動と、押圧機構４０による被研磨加工物Ｋの押圧とにより、被研磨加工物Ｋの端部ＫＥは研磨面１１に押し付けられる。そして、端部ＫＥと研磨面１１との接触部に、適宜の態様で加工液等が供給される。こうした加工液の供給は、端部ＫＥと研磨面１１との接触部に対して外部から直接供給することができる。または、研磨部材１０（より詳細には研磨部材１０が固定された定盤２０）と第１モータ２１との接続部にロータリジョイントなどの加工液供給機構を介在させる。そしてこの加工液供給機構から研磨部材１０の内部に加工液を供給し、研磨部材１０の内部に供給された加工液を、研磨部材１０の内部に形成された供給路を介して上記接触部に供給することもできる。このように研磨部材１０の内部から接触部に向けて加工液を供給することで、加工液をより効率的に供給することができる。また、加工液を効率よく使用するために、研磨部材１０の周囲にカバーを設けて加工液の回収効率を上げる回収装置を備えていると更によい。   The end KE of the workpiece K is pressed against the polishing surface 11 by the movement of the second motor 30 by the motor moving mechanism 33 and the pressing of the workpiece K by the pressing mechanism 40. Then, the processing liquid or the like is supplied to the contact portion between the end KE and the polishing surface 11 in an appropriate manner. Such machining fluid can be supplied directly from the outside to the contact portion between the end KE and the polishing surface 11. Alternatively, a machining fluid supply mechanism such as a rotary joint is interposed between the polishing member 10 (more specifically, the surface plate 20 on which the polishing member 10 is fixed) and the first motor 21. Then, the machining liquid is supplied from the machining liquid supply mechanism to the inside of the polishing member 10, and the machining liquid supplied to the inside of the polishing member 10 is supplied to the contact portion through a supply path formed inside the polishing member 10. It can also be supplied. Thus, by supplying the processing liquid from the inside of the polishing member 10 toward the contact portion, the processing liquid can be supplied more efficiently. Further, in order to use the machining fluid efficiently, it is further preferable to provide a recovery device that provides a cover around the polishing member 10 to increase the recovery efficiency of the machining fluid.

上述した加工液の種類は、被研磨加工物Ｋや研磨部材１０の材質に応じて適切なものを使用出来る。具体的には切削用、研削用加工液やラッピング材、ポリシング剤、化学機械研磨用研磨液などを使用することが出来る。加工液は砥粒を含有していても良い。使用する砥粒の種類は特に限定されないが、酸化ケイ素、酸化アルミニウム、酸化ジルコニウム、酸化セリウム、酸化マグネシウム、酸化カルシウム、酸化チタニウム、酸化マンガン、酸化鉄、酸化クロムなどの金属酸化物粒子や、炭化ケイ素などの炭化物、窒化物、硼化物、ダイヤモンド等を使用することが出来る。   As the type of the above-described machining liquid, an appropriate one can be used according to the material to be polished K or the polishing member 10. Specifically, cutting and grinding working fluids, lapping materials, polishing agents, chemical mechanical polishing polishing fluids, and the like can be used. The processing liquid may contain abrasive grains. The type of abrasive grains used is not particularly limited, but metal oxide particles such as silicon oxide, aluminum oxide, zirconium oxide, cerium oxide, magnesium oxide, calcium oxide, titanium oxide, manganese oxide, iron oxide, and chromium oxide, and carbonized Carbides such as silicon, nitrides, borides, diamonds and the like can be used.

例えば、加工液中の砥粒の含有量は、１質量％以上であることが好ましく、より好ましくは２質量％以上である。また、加工液中の砥粒の含有量は、５０質量％以下であることが好ましく、より好ましくは４０質量％以下である。   For example, the content of abrasive grains in the working fluid is preferably 1% by mass or more, and more preferably 2% by mass or more. Moreover, it is preferable that content of the abrasive grain in a processing liquid is 50 mass% or less, More preferably, it is 40 mass% or less.

加工液中の砥粒の平均二次粒子径は０．１μｍ以上であることが好ましく、より好ましくは０．３μｍ以上である。砥粒の平均二次粒子径が大きくなるにつれて、加工液による加工速度が向上するようになる。   The average secondary particle diameter of the abrasive grains in the working fluid is preferably 0.1 μm or more, more preferably 0.3 μm or more. As the average secondary particle diameter of the abrasive grains increases, the processing speed by the processing liquid is improved.

一方、加工液中の砥粒の平均二次粒子径は、２０μｍ以下であることが好ましく、より好ましくは５μｍ以下である。加工液中の砥粒の平均二次粒子径が小さくなるにつれて、被研磨加工物Ｋの表面をより均一に研磨することができるようになる。ちなみに、砥粒の平均二次粒子径とは、例えば、堀場製作所社製の“ＬＡ−９５０”などのレーザ回折／散乱式粒子径分布測定装置を用いて測定した体積平均粒子径などのことである。   On the other hand, the average secondary particle diameter of the abrasive grains in the working fluid is preferably 20 μm or less, more preferably 5 μm or less. As the average secondary particle diameter of the abrasive grains in the processing liquid decreases, the surface of the workpiece K can be more uniformly polished. Incidentally, the average secondary particle size of abrasive grains is, for example, the volume average particle size measured using a laser diffraction / scattering particle size distribution measuring device such as “LA-950” manufactured by Horiba Ltd. is there.

上記加工液には、必要に応じて、ｐＨ調整剤、エッチング剤、酸化剤、水溶性重合体、共重合体やその塩、誘導体、防食剤、キレート剤、分散助剤、防腐剤、防黴剤等の他の成分を更に含んでも良い。   In the above-mentioned processing liquid, a pH adjuster, an etching agent, an oxidizing agent, a water-soluble polymer, a copolymer and a salt thereof, a derivative, an anticorrosive agent, a chelating agent, a dispersion aid, an antiseptic agent, and an antifungal agent, as necessary It may further contain other components such as an agent.

上記ｐＨ調整剤の例としては、公知の酸、塩基、またはそれらの塩を使用することができる。ｐＨ調整剤として使用できる酸の例としては、例えば、塩酸、硫酸、硝酸、フッ酸、ホウ酸、炭酸、次亜リン酸、亜リン酸、およびリン酸等の無機酸や、ギ酸、酢酸、プロピオン酸、酪酸、吉草酸、２−メチル酪酸、ｎ−ヘキサン酸、３，３−ジメチル酪酸、２−エチル酪酸、４−メチルペンタン酸、ｎ−ヘプタン酸、２−メチルヘキサン酸、ｎ−オクタン酸、２−エチルヘキサン酸、安息香酸、グリコール酸、サリチル酸、グリセリン酸、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、マレイン酸、フタル酸、リンゴ酸、酒石酸、クエン酸、乳酸、ジグリコール酸、２−フランカルボン酸、２，５−フランジカルボン酸、３−フランカルボン酸、２−テトラヒドロフランカルボン酸、メトキシ酢酸、メトキシフェニル酢酸、およびフェノキシ酢酸等の有機酸が挙げられる。   As examples of the pH adjusting agent, known acids, bases, or salts thereof can be used. Examples of acids that can be used as pH adjusters include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid, and phosphoric acid, formic acid, acetic acid, Propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n-heptanoic acid, 2-methylhexanoic acid, n-octane Acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, maleic acid, phthalic acid, malic acid, tartaric acid, citric acid Lactic acid, diglycolic acid, 2-furancarboxylic acid, 2,5-furandicarboxylic acid, 3-furancarboxylic acid, 2-tetrahydrofurancarboxylic acid, methoxyacetic acid, methoxyphene Le acetate, and phenoxy organic acids such as acetic acid.

ｐＨ調整剤として使用できる塩基の例としては、脂肪族アミン、芳香族アミン等のアミン、水酸化第四アンモニウムなどの有機塩基、水酸化カリウム等のアルカリ金属の水酸化物、アルカリ土類金属の水酸化物、およびアンモニア等が挙げられる。   Examples of bases that can be used as pH adjusters include amines such as aliphatic amines and aromatic amines, organic bases such as quaternary ammonium hydroxide, alkali metal hydroxides such as potassium hydroxide, alkaline earth metal A hydroxide, ammonia, etc. are mentioned.

また、上述した酸の代わりに、または上述した酸と組み合わせて、上記酸のアンモニウム塩やアルカリ金属塩等の塩をｐＨ調整剤として用いてもよい。なお、こうしたｐＨ調整剤は、加工液のｐＨ値を、被研磨加工物Ｋの種類によって異なる最適値に調整するために用いられる。   Moreover, you may use salts, such as an ammonium salt of the said acid, an alkali metal salt, etc. as a pH adjuster instead of the acid mentioned above or combining with the acid mentioned above. Such a pH adjuster is used to adjust the pH value of the processing liquid to an optimum value that varies depending on the type of workpiece K to be polished.

上記エッチング剤の例としては、硝酸、硫酸、リン酸などの無機酸、酢酸、クエン酸、酒石酸やメタンスルホン酸などの有機酸、水酸化カリウム、水酸化ナトリウムなどの無機アルカリ、アンモニア、アミン、第四級アンモニウム水酸化物などの有機アルカリ等が挙げられる。   Examples of the etching agent include inorganic acids such as nitric acid, sulfuric acid and phosphoric acid, acetic acid, citric acid, organic acids such as tartaric acid and methanesulfonic acid, inorganic alkalis such as potassium hydroxide and sodium hydroxide, ammonia, amines, And organic alkalis such as quaternary ammonium hydroxides.

上記酸化剤の例としては、過酸化水素、過酢酸、過炭酸塩、過酸化尿素、過塩素酸塩、過硫酸塩等の他、硫酸、硝酸、リン酸及びその塩などのオキソ酸やその塩等が挙げられる。   Examples of the oxidizing agent include hydrogen peroxide, peracetic acid, percarbonate, urea peroxide, perchlorate, persulfate and the like, oxo acids such as sulfuric acid, nitric acid, phosphoric acid and salts thereof, and the like. Examples include salts.

上記水溶性重合体、共重合体やその塩、誘導体の例としては、ポリアクリル酸塩などのポリカルボン酸、ポリホスホン酸、ポリスチレンスルホン酸などのポリスルホン酸、キタンサンガム、アルギン酸ナトリウムなどの多糖類、ヒドロキシエチルセルロース、カルボキシメチルセルロースなどのセルロース誘導体、ポリエチレングリコール、ポリビニルアルコール、ポリビニルピロリドン、ソルビタンモノオレエート、単一種または複数種のオキシアルキレン単位を有するオキシアルキレン系重合体、ノニオン性界面活性剤、アニオン性界面活性剤等が挙げられる。ノニオン性界面活性剤の例としては、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンアルキルフェニルエーテル、ソルビタンモノオレエート、単一種又は複数種のオキシアルキレン単位を有するオキシアルキレン系重合体等が挙げられる。アニオン性界面活性剤の例としては、アルキルスルホン酸系化合物、アルキルベンゼンスルホン酸系化合物、アルキルナフタレンスルホン酸系化合物、メチルタウリン酸系化合物、アルキルジフェニルエーテルジスルホン酸系化合物、α−オレフィンスルホン酸系化合物、ナフタレンスルホン酸縮合物、スルホコハク酸ジエステル系化合物等が挙げられる。   Examples of the above water-soluble polymers, copolymers, salts and derivatives thereof include polycarboxylic acids such as polyacrylates, polysulfonic acids such as polyphosphonic acid and polystyrene sulfonic acid, polysaccharides such as chitansan gum and sodium alginate, hydroxy Cellulose derivatives such as ethyl cellulose and carboxymethyl cellulose, polyethylene glycol, polyvinyl alcohol, polyvinyl pyrrolidone, sorbitan monooleate, oxyalkylene polymers having one or more oxyalkylene units, nonionic surfactants, anionic surfactants Agents and the like. Examples of nonionic surfactants include polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, sorbitan monooleate, oxyalkylene polymers having a single kind or plural kinds of oxyalkylene units. Examples of anionic surfactants include alkyl sulfonic acid compounds, alkyl benzene sulfonic acid compounds, alkyl naphthalene sulfonic acid compounds, methyl tauric acid compounds, alkyl diphenyl ether disulfonic acid compounds, α-olefin sulfonic acid compounds, Naphthalenesulfonic acid condensate, sulfosuccinic acid diester compound and the like.

上記防食剤の例としては、アミン類、ピリジン類、テトラフェニルホスホニウム塩、ベンゾトリアゾール類、トリアゾール類、テトラゾール類、安息香酸等、単環化合物、縮合環を有する多環化合物、複素環式化合物等が挙げられる。   Examples of the anticorrosives include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid, monocyclic compounds, polycyclic compounds having a condensed ring, heterocyclic compounds, etc. Is mentioned.

上記キレート剤の例としては、グルコン酸等のカルボン酸系キレート剤、エチレンジアミン、ジエチレントリアミン、トリメチルテトラアミンなどのアミン系キレート剤、エチレンジアミン四酢酸、ニトリロ三酢酸、ヒドロキシエチルエチレンジアミン三酢酸、トリエチレンテトラミン六酢酸、ジエチレントリアミン五酢酸などのポリアミノポリカルボン系キレート剤、２−アミノエチルホスホン酸、１−ヒドロキシエチリデン−１，１−ジホスホン酸、アミノトリ（メチレンホスホン酸）、エチレンジアミンテトラキス（メチレンホスホン酸）、ジエチレントリアミンペンタ（メチレンホスホン酸）、エタン−１，１−ジホスホン酸、エタン−１，１，２−トリホスホン酸、メタンヒドロキシホスホン酸、１−ホスホノブタン−２，３，４−トリカルボン酸などの有機ホスホン酸系キレート剤、フェノール誘導体、１，３−ジケトン等が挙げられる。   Examples of the chelating agents include carboxylic acid chelating agents such as gluconic acid, amine chelating agents such as ethylenediamine, diethylenetriamine, and trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetramine hexa Polyaminopolycarboxylic chelating agents such as acetic acid and diethylenetriaminepentaacetic acid, 2-aminoethylphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, aminotri (methylenephosphonic acid), ethylenediaminetetrakis (methylenephosphonic acid), diethylenetriaminepenta (Methylenephosphonic acid), ethane-1,1-diphosphonic acid, ethane-1,1,2-triphosphonic acid, methanehydroxyphosphonic acid, 1-phosphonobutane-2,3,4 Organic phosphonic acid chelating agent, such as a tricarboxylic acid, a phenol derivative, 1,3-diketones and the like.

上記分散助剤の例としては、ピロリン酸塩やヘキサメタリン酸塩などの縮合リン酸塩等が挙げられる。
上記防腐剤の例としては、次亜塩素酸ナトリウム等が挙げられる。 Examples of the dispersion aid include condensed phosphates such as pyrophosphate and hexametaphosphate.
Examples of the preservative include sodium hypochlorite and the like.

上記防黴剤の例としては、オキサゾリジン−２，５−ジオンなどのオキサゾリン等が挙げられる。
そして、上述した加工液等の供給とともに、第１モータ２１の回転速度調整が行われることにより、曲面形状の端部ＫＥが研磨される。端部ＫＥの研磨は、例えば、次の工程順で行うことができる。 Examples of the antifungal agent include oxazolines such as oxazolidine-2,5-dione.
Then, the rotation speed of the first motor 21 is adjusted along with the above-described supply of the processing fluid and the like, so that the curved end KE is polished. The polishing of the end KE can be performed, for example, in the following process order.

工程１：モータ移動機構３３によって、被研磨加工物Ｋを、矢印Ｘ方向において研磨部材１０の回転中心に向かって移動させることにより、端部ＫＥと研磨面１１とを接触させる。   Step 1: By moving the workpiece K to the center of rotation of the polishing member 10 in the arrow X direction by the motor moving mechanism 33, the end KE and the polishing surface 11 are brought into contact with each other.

工程２：次に、端部ＫＥと研磨面１１とが接触した状態で押圧機構４０を駆動しつつ、モータ移動機構３３によって被研磨加工物Ｋを矢印Ｙ方向において移動させることにより、端部ＫＥと研磨面１１との接触部位を変えていく。これにより被研磨加工物Ｋの１つの辺の研磨が進んでいく。   Step 2: Next, the workpiece KE is moved in the arrow Y direction by the motor moving mechanism 33 while the pressing mechanism 40 is driven in a state where the end KE and the polishing surface 11 are in contact with each other, thereby the end KE. And the contact part with the polishing surface 11 are changed. As a result, the polishing of one side of the workpiece K progresses.

工程３：被研磨加工物Ｋの１つの辺の研磨が終了すると、押圧機構４０を端部ＫＥから離間させる。そして、モータ移動機構３３によって被研磨加工物Ｋを矢印Ｘ方向において移動させつつ、第２モータ３０によって被研磨加工物Ｋを回転させる。こうして被研磨加工物Ｋと研磨面１１とが接触した状態を維持しつつ被研磨加工物Ｋを回転させることにより、研磨が終了した辺の隣の辺が研磨面１１側に向けられて、研磨される辺が切り替えられる。   Step 3: When the polishing of one side of the workpiece K is finished, the pressing mechanism 40 is separated from the end KE. Then, the workpiece K is rotated by the second motor 30 while the workpiece K is moved in the arrow X direction by the motor moving mechanism 33. By rotating the workpiece K while maintaining the state where the workpiece K and the polishing surface 11 are in contact with each other, the side adjacent to the side where the polishing is finished is directed toward the polishing surface 11, and polishing is performed. The edge to be switched is switched.

そして、工程２及び工程３が繰り返されることにより、被研磨加工物Ｋの４つの辺全てが研磨される。なお、上述した研磨の工程は一例であり、モータ移動機構３３や押圧機構４０の駆動態様は、加工時間等を考慮して適宜変更することができる。   Then, by repeating step 2 and step 3, all four sides of the workpiece K are polished. The above-described polishing process is an example, and the driving mode of the motor moving mechanism 33 and the pressing mechanism 40 can be changed as appropriate in consideration of the processing time and the like.

以上説明した本実施形態によれば、以下の作用効果を得ることができる。
（１）モータ移動機構３３により、被研磨加工物Ｋを、研磨部材１０の径方向の外周面における接線方向（矢印Ｙ方向）に移動させるようにしている。そのため、被研磨加工物Ｋと研磨部材１０とが直線状に相対移動するようになる。従って、線状の辺を有する四角形状の被研磨加工物Ｋの端部ＫＥを研磨することができる。 According to this embodiment described above, the following effects can be obtained.
(1) The workpiece K is moved by the motor moving mechanism 33 in the tangential direction (arrow Y direction) on the radially outer peripheral surface of the polishing member 10. Therefore, the workpiece K and the polishing member 10 are relatively moved linearly. Therefore, the end portion KE of the quadrilateral workpiece K having linear sides can be polished.

（２）第２モータ３０によって被研磨加工物Ｋが回転されることにより、被研磨加工物Ｋにおいて研磨される面（辺）を変更することができる。従って、四角形状の外形を有した被研磨加工物Ｋの外周全体を研磨することができる。   (2) When the workpiece K is rotated by the second motor 30, the surface (side) to be polished in the workpiece K can be changed. Therefore, the entire outer periphery of the workpiece K having a quadrangular outer shape can be polished.

（３）被研磨加工物Ｋの研磨時に、被研磨加工物Ｋを研磨部材１０に押圧するようにしている。そのため、被研磨加工物Ｋの研磨処理を促進させることができる。また、被研磨加工物Ｋ及び研磨面１１の接触状態、いわゆる当たりの均一化を促すことができる。   (3) When the workpiece K is polished, the workpiece K is pressed against the polishing member 10. Therefore, the polishing process of the workpiece K can be promoted. Further, the contact state between the workpiece K and the polishing surface 11, that is, so-called uniform contact can be promoted.

（４）研磨装置は、被研磨加工物Ｋの端部ＫＥの形状に沿った形状の研磨面１１を有する研磨部材１０を備えている。従って、被研磨加工物Ｋの端部ＫＥが平面状とは異なる曲面形状であっても、その端部ＫＥを研磨することができる。   (4) The polishing apparatus includes a polishing member 10 having a polishing surface 11 having a shape along the shape of the end KE of the workpiece K to be polished. Therefore, even if the end KE of the workpiece K is a curved surface shape different from the planar shape, the end KE can be polished.

（５）上述した研磨方法では、研磨装置を用いて被研磨加工物Ｋを研磨するようにしている。従って、被研磨部の形状（端部ＫＥの形状）が平面状とは異なる曲面形状をなしており、かつ四角形状の被研磨加工物Ｋであっても、その外周を研磨することができる。   (5) In the polishing method described above, the workpiece K is polished using a polishing apparatus. Therefore, even if the shape of the portion to be polished (the shape of the end KE) has a curved shape different from the flat shape, and the rectangular workpiece K is polished, the outer periphery thereof can be polished.

なお、上記実施形態は以下のように変更して実施することもできる。
・被研磨加工物Ｋを回転させることにより、被研磨加工物Ｋの外周全体を研磨するようにしたが、その代わりに、被研磨加工物Ｋの外周の一部、例えば被研磨加工物Ｋの１つの辺のみ、あるいは２つの辺のみ、あるいは３つの辺のみを研磨するようにしてもよい。 In addition, the said embodiment can also be changed and implemented as follows.
The entire outer periphery of the workpiece K is polished by rotating the workpiece K, but instead, a part of the outer periphery of the workpiece K, for example, the workpiece K Only one side, only two sides, or only three sides may be polished.

・上記工程３では、被研磨加工物Ｋを、矢印Ｘ方向において研磨部材１０の回転中心から離れる方向へと移動させつつ回転させるようにしたが、その代わりに、研磨の終了した端部ＫＥが研磨面１１から離間するまで被研磨加工物Ｋを矢印Ｙ方向に移動させた後、同被研磨加工物Ｋを回転させてもよい。そして、被研磨加工物Ｋにおける次に研磨しようとする辺が研磨面１１に近づくように被研磨加工物Ｋを矢印Ｙ方向において移動させるようにしてもよい。このようにして研磨する辺を替えるようにしても、被研磨加工物Ｋの各辺をそれぞれ研磨することができる。なお、この変形例の場合には、被研磨加工物Ｋを矢印Ｘ方向に移動させるモータ移動機構３３の機能を省略することができる。   In the above step 3, the workpiece K is rotated while moving in the direction of the arrow X away from the center of rotation of the polishing member 10, but instead, the end KE that has been polished is After the workpiece K is moved in the direction of the arrow Y until it is separated from the polishing surface 11, the workpiece K may be rotated. Then, the workpiece K may be moved in the arrow Y direction so that the next side to be polished in the workpiece K approaches the polishing surface 11. Even if the sides to be polished are changed in this way, each side of the workpiece K can be polished. In the case of this modification, the function of the motor moving mechanism 33 that moves the workpiece K in the arrow X direction can be omitted.

・上記被研磨加工物Ｋの４つの辺のうちで１つの辺だけを研磨するのであれば、モータ移動機構３３は、被研磨加工物Ｋを矢印Ｙ方向に移動させる機能のみを備えるようにし、回転機構（第２モータ３０等）を省略してもよい。この場合でも、モータ移動機構３３によって、被研磨加工物Ｋと研磨部材１０とが直線状に相対移動するようになるため、直線状の辺を有する四角形状の被研磨加工物Ｋの端部ＫＥの１つの辺を研磨することができる。   -If only one side is polished among the four sides of the workpiece K, the motor moving mechanism 33 has only a function of moving the workpiece K in the arrow Y direction, The rotation mechanism (second motor 30 or the like) may be omitted. Even in this case, the workpiece K and the polishing member 10 are linearly moved relative to each other by the motor moving mechanism 33, and therefore, the end portion KE of the rectangular workpiece K having a linear side. One side can be polished.

・上記実施形態では、被研磨加工物Ｋが矢印Ｘ方向及び矢印Ｙ方向に移動可能であるが、それに加えて、研磨部材１０の回転中心を移動させる機構を設けてもよい。そして、被研磨加工物Ｋを矢印Ｘ方向に移動させるとともに、研磨部材１０を矢印Ｙ方向に動かすようにしてもよい。または、被研磨加工物Ｋを矢印Ｙ方向に移動させるとともに、研磨部材１０を矢印Ｘ方向に動かすようにしてもよい。   In the above embodiment, the workpiece K can be moved in the direction of the arrow X and the direction of the arrow Y, but in addition, a mechanism for moving the rotation center of the polishing member 10 may be provided. Then, the workpiece K may be moved in the arrow X direction and the polishing member 10 may be moved in the arrow Y direction. Alternatively, the workpiece K may be moved in the arrow Y direction, and the polishing member 10 may be moved in the arrow X direction.

または、被研磨加工物Ｋ及び研磨部材１０をともに矢印Ｘ方向に移動させたり、被研磨加工物Ｋ及び研磨部材１０をともに矢印Ｙ方向に動かしたりしてもよい。
・上記実施形態では、被研磨加工物Ｋが移動可能であるが、その代わりに、研磨部材１０を移動可能に構成してもよい。図３に、そうした変形例の概略を示す。 Alternatively, both the workpiece K and the polishing member 10 may be moved in the arrow X direction, or both the workpiece K and the polishing member 10 may be moved in the arrow Y direction.
In the above embodiment, the workpiece K is movable, but instead, the polishing member 10 may be configured to be movable. FIG. 3 shows an outline of such a modification.

図３に示すように、四角形状の被研磨加工物Ｋは、適宜の態様にて研磨装置にクランプされている。また、回転駆動される研磨部材１０の回転中心には、同研磨部材を移動させる移動機構５０が設けられている。この移動機構５０は、研磨部材１０の径方向の外周面における接線方向（図３に示す矢印Ｙ方向）に研磨部材１０を移動させる第１移動機構としての機能と、研磨部材１０の回転軸に対して直交する方向（図３に示す矢印Ｘ方向）に研磨部材１０を移動させる第２移動機構としての機能を併せ持っている。こうした移動機構５０としては、適宜の機構を採用することができる。例えばリンク機構や上記モータ移動機構３３に類似した機構などを採用することができる。   As shown in FIG. 3, the rectangular workpiece K is clamped to the polishing apparatus in an appropriate manner. A moving mechanism 50 for moving the polishing member 10 is provided at the rotational center of the polishing member 10 that is rotationally driven. The moving mechanism 50 has a function as a first moving mechanism for moving the polishing member 10 in a tangential direction (in the direction of arrow Y shown in FIG. 3) on the radially outer peripheral surface of the polishing member 10, and a rotating shaft of the polishing member 10. It also has a function as a second moving mechanism for moving the polishing member 10 in a direction orthogonal to the direction (the direction of the arrow X shown in FIG. 3). As such a moving mechanism 50, an appropriate mechanism can be adopted. For example, a link mechanism or a mechanism similar to the motor moving mechanism 33 can be employed.

この変形例における研磨装置では、移動機構５０によって、被研磨加工物Ｋに対する研磨部材１０の位置を任意に変化することが可能になるため、被研磨加工物Ｋの外形形状に追従させながら被研磨加工物Ｋと研磨部材１０との接触状態を維持することができる。つまり、図３に二点鎖線にて示すように、被研磨加工物Ｋの外周（端部ＫＥ）に沿って研磨部材１０を移動させることが可能になる。そのため、こうした変形例でも、四角形状の外形を有した被研磨加工物Ｋの外周全体を研磨することができる。また、こうした変形例の場合には、上記実施形態と比較して、研磨部材１０の大きさが比較的小さくても被研磨加工物Ｋの外周全体を研磨することができる。ちなみに、図３の変形例における移動機構５０に代えて、図３に示す矢印Ｙ方向に研磨部材１０を移動させる移動機構と、図３に示す矢印Ｘ方向に研磨部材１０を移動させる移動機構とを、別々に設けてもよい。また、図３の変形例において、被研磨加工物Ｋの外周の一部、例えば被研磨加工物Ｋの１つの辺のみ、あるいは２つの辺のみ、あるいは３つの辺のみを研磨するようにしてもよい。   In the polishing apparatus in this modified example, the position of the polishing member 10 with respect to the workpiece K can be arbitrarily changed by the moving mechanism 50, so that the workpiece is polished while following the outer shape of the workpiece K to be polished. The contact state between the workpiece K and the polishing member 10 can be maintained. That is, as shown by a two-dot chain line in FIG. 3, the polishing member 10 can be moved along the outer periphery (end portion KE) of the workpiece K to be polished. Therefore, even in such a modification, the entire outer periphery of the workpiece K having a quadrangular outer shape can be polished. Further, in the case of such a modification, the entire outer periphery of the workpiece K can be polished even if the size of the polishing member 10 is relatively small compared to the above embodiment. Incidentally, instead of the moving mechanism 50 in the modification of FIG. 3, a moving mechanism that moves the polishing member 10 in the direction of arrow Y shown in FIG. 3, and a moving mechanism that moves the polishing member 10 in the direction of arrow X shown in FIG. May be provided separately. Further, in the modification of FIG. 3, a part of the outer periphery of the workpiece K, for example, only one side of the workpiece K, only two sides, or only three sides may be polished. Good.

・定盤２０の上面に研磨部材１０を設けるようにしたが、定盤２０を省略して、研磨部材１０の中心に第１モータ２１の回転軸を直接固定してもよい。
・押圧機構４０を駆動させることにより端部ＫＥを研磨面１１に押し付けるようにしたが、モータ移動機構３３により第２モータ３０を矢印Ｘ方向に移動させることにより、端部ＫＥを研磨面１１に押し付けることができるのであれば、押圧機構４０を省略してもよい。 Although the polishing member 10 is provided on the upper surface of the surface plate 20, the surface plate 20 may be omitted and the rotation shaft of the first motor 21 may be directly fixed to the center of the polishing member 10.
Although the end KE is pressed against the polishing surface 11 by driving the pressing mechanism 40, the end KE is moved to the polishing surface 11 by moving the second motor 30 in the arrow X direction by the motor moving mechanism 33. If it can be pressed, the pressing mechanism 40 may be omitted.

・モータ移動機構３３にて、第２モータ３０を、研磨部材１０の回転軸に対して直交する方向（先の図２に示した矢印Ｘ方向）及び研磨部材１０の径方向の外周面における接線方向（先の図１に示した矢印Ｙ方向）に往復移動させるようにしたが、その代わりに、第２モータ３０を研磨部材１０の回転軸に対して直交する方向（先の図２に示した矢印Ｘ方向）に移動させる機構と、第２モータ３０を研磨部材１０の径方向の外周面における接線方向（先の図１に示した矢印Ｙ方向）に移動させる機構とを別々に設けるようにしてもよい。   In the motor moving mechanism 33, the second motor 30 is tangent to the outer circumferential surface in the direction perpendicular to the rotation axis of the polishing member 10 (the direction of the arrow X shown in FIG. 2) and the radial direction of the polishing member 10. However, instead, the second motor 30 is moved in a direction perpendicular to the rotation axis of the polishing member 10 (shown in FIG. 2 above). And a mechanism for moving the second motor 30 in the tangential direction on the radial outer peripheral surface of the polishing member 10 (in the direction of arrow Y shown in FIG. 1 above). It may be.

・被研磨加工物Ｋを移動させるために第２モータ３０を移動させるようにしたが、他の態様で被研磨加工物Ｋを移動させてもよい。
・被研磨加工物Ｋの端部ＫＥを研磨するようにしたが、被研磨部はそうした端部に限定されるものではなく、他の部位でもよい。 Although the second motor 30 is moved to move the workpiece K, the workpiece K may be moved in another manner.
-Although the edge part KE of the workpiece K was grind | polished, a to-be-polished part is not limited to such an edge part, Other parts may be sufficient.

・被研磨加工物Ｋの端部ＫＥの形状は、曲面以外の非平面状であってもよく、例えば図５に示す三角形状や、図６に示すように略三角形状であって頂部が丸みを帯びた形状でもよい。また、被研磨加工物Ｋの端部ＫＥの形状は、図７に示す階段形状や、図８に示すように略階段形状であって角部が丸みを帯びた形状であってもよい。また、図９に示すように、端部ＫＥが、被研磨加工物Ｋの内側に向けて窪んだ曲面形状であってもよい。また、複数の曲率で構成される曲面や、一部に直線部を備える曲面でもよい。これらの変形例においても、研磨部材１０の研磨面１１を、被研磨加工物Ｋの端部ＫＥの形状（被研磨部の形状）に沿った形にすることで、端部ＫＥを研磨することができる。   The shape of the end KE of the workpiece K may be a non-planar shape other than a curved surface, for example, a triangular shape as shown in FIG. 5 or a substantially triangular shape as shown in FIG. The shape may have a tinge. Further, the shape of the end KE of the workpiece K may be a stepped shape shown in FIG. 7 or a substantially stepped shape as shown in FIG. 8 with rounded corners. Further, as shown in FIG. 9, the end KE may have a curved shape that is recessed toward the inner side of the workpiece K. Further, it may be a curved surface composed of a plurality of curvatures or a curved surface partially including a straight line portion. Also in these modifications, the end KE is polished by making the polishing surface 11 of the polishing member 10 along the shape of the end KE of the workpiece K (the shape of the part to be polished). Can do.

・被研磨加工物Ｋの外形は四角形状以外の任意の様々な形状でもよい。例えば複数の平面や曲面からなる形状でもよく、三角形状や、楕円形状でもよい。ちなみに、上記実施形態及びその変形例においては、様々な外形を有した被研磨加工物Ｋを研磨することができ、例えば、外形が円形である円筒形状の被研磨加工物Ｋの周面を研磨することも可能である。   The outer shape of the workpiece K may be any various shape other than a square shape. For example, the shape which consists of a some plane and a curved surface may be sufficient, and triangular shape and elliptical shape may be sufficient. Incidentally, in the above-described embodiment and its modifications, the workpiece K having various outer shapes can be polished, for example, the peripheral surface of a cylindrical workpiece K having a circular outer shape is polished. It is also possible to do.

また、先の図３に示した変形例では、被研磨加工物Ｋに対する研磨部材１０の位置を任意に変えることが可能なため、図４に示すように、被研磨加工物Ｋの外形が複数の曲率で形作られる形状であっても、その外周を研磨することができる。   Further, in the modification shown in FIG. 3, the position of the polishing member 10 with respect to the workpiece K can be arbitrarily changed. Therefore, as shown in FIG. Even if it is a shape formed with the curvature of, the outer periphery can be polished.

また、上記実施形態では、被研磨加工物Ｋの端部ＫＥと研磨面１１とを接触させたり、研磨の終了した端部ＫＥを研磨面１１から離間させたりするために、被研磨加工物Ｋを矢印Ｘ方向に移動させるようにした。ここで、上記モータ移動機構３３によれば、被研磨加工物Ｋを矢印Ｘ方向及び矢印Ｙ方向に移動させることが可能なため、研磨部材１０に対する被研磨加工物Ｋの位置を任意に変えることが可能である。そのため、被研磨加工物Ｋの外形形状に追従させながら被研磨加工物Ｋと研磨部材１０との接触状態を維持することができる。そして、上記実施形態の研磨装置は、被研磨加工物Ｋを回転させる回転機構も備えている。従って、上記実施形態においても、矢印Ｘ方向及び矢印Ｙ方向への被研磨加工物Ｋの移動と、被研磨加工物Ｋの回転とを組み合わせることにより、先の図４に示したような形状の被研磨加工物Ｋ、つまり被研磨加工物Ｋの外形が複数の曲率で形作られる形状であっても、その外周を研磨することができる。   Further, in the above-described embodiment, in order to make the end KE of the workpiece K to be in contact with the polishing surface 11 or to separate the end KE after the polishing from the polishing surface 11, the workpiece K to be polished is used. Was moved in the direction of arrow X. Here, according to the motor moving mechanism 33, the workpiece to be polished K can be moved in the direction of the arrow X and the direction of the arrow Y, so that the position of the workpiece to be polished K with respect to the polishing member 10 can be arbitrarily changed. Is possible. Therefore, the contact state between the workpiece K and the polishing member 10 can be maintained while following the outer shape of the workpiece K. The polishing apparatus of the above embodiment also includes a rotation mechanism that rotates the workpiece K to be polished. Therefore, also in the above-mentioned embodiment, the shape as shown in FIG. 4 is obtained by combining the movement of the workpiece K in the direction of the arrow X and the direction of the arrow Y and the rotation of the workpiece K to be polished. Even if the workpiece K, that is, the outer shape of the workpiece K is formed with a plurality of curvatures, the outer periphery thereof can be polished.

・特徴（Ａ）として、被研磨加工物Ｋまたは研磨部材１０の少なくとも一方を、研磨部材１０の径方向の外周面における接線方向（矢印Ｙ方向）に移動させることを採用すれば、被研磨加工物Ｋの１つの辺を研磨することができる。また、特徴（Ｂ）として、被研磨加工物Ｋまたは研磨部材１０の少なくとも一方を、研磨部材１０の回転軸に対して直交する方向（矢印Ｘ方向）に移動させることと、被研磨加工物Ｋまたは研磨部材１０の少なくとも一方を、研磨部材１０の径方向の外周面における接線方向（矢印Ｙ方向）に移動させることを採用すれば、被研磨加工物Ｋと研磨部材１０との位置関係を任意に変更することができる。また、特徴（Ｃ）として、被研磨加工物Ｋまたは研磨部材１０の少なくとも一方を回転させることを採用すれば、被研磨加工物Ｋにおいて研磨される面を変更することができる。また、特徴（Ｄ）として、被研磨加工物Ｋまたは研磨部材１０の少なくとも一方を研磨部材１０の回転軸に対して直交する方向に押圧することを採用すれば、被研磨加工物の研磨処理を促進させることができるとともに、被研磨加工物及び研磨面の接触状態（いわゆる当たり）の均一化を促すことができる。従って、これらの特徴（Ａ）〜（Ｄ）は被研磨加工物Ｋの形状や加工目的に応じて、適宜組み合わせて採用したり、単独で採用したりすることが可能であり、その場合、採用した特徴（Ａ）〜（Ｄ）に対応した効果を得ることができる。   -As a feature (A), if at least one of the workpiece K or the polishing member 10 is moved in the tangential direction (arrow Y direction) on the radial outer peripheral surface of the polishing member 10, the workpiece to be polished One side of the object K can be polished. Further, as the feature (B), at least one of the workpiece K or the polishing member 10 is moved in a direction (arrow X direction) orthogonal to the rotation axis of the polishing member 10, and the workpiece K Alternatively, if at least one of the polishing members 10 is moved in a tangential direction (arrow Y direction) on the outer circumferential surface of the polishing member 10 in the radial direction, the positional relationship between the workpiece K and the polishing member 10 is arbitrary. Can be changed. Further, as the feature (C), if at least one of the workpiece K or the polishing member 10 is rotated, the surface to be polished in the workpiece K can be changed. Further, as the feature (D), if it is adopted that at least one of the workpiece K or the polishing member 10 is pressed in a direction orthogonal to the rotation axis of the polishing member 10, the polishing treatment of the workpiece is performed. While being able to promote, it can accelerate | stimulate equalization of the contact state (what is called hit) of a to-be-polished workpiece and a grinding surface. Therefore, these features (A) to (D) can be employed in appropriate combination or independently depending on the shape of the workpiece K and the purpose of processing. Effects corresponding to the features (A) to (D) can be obtained.

・研磨部材１０や被研磨加工物Ｋを回転させることにより同被研磨加工物Ｋを研磨する場合、被研磨加工物Ｋの研磨後の面には回転方向に研磨痕が残るおそれがある。そこで、そうした研磨痕を抑えるために、上述した各種機構に加えて、研磨部材１０及び被研磨加工物Ｋの少なくとも一方を、回転方向に対して交差する方向に往復移動させる往復移動機構をさらに備えるようにしてもよい。そうした往復移動機構を先の図２等に示した上記実施形態の研磨装置に設けた場合の２つの例を、図１０及び図１１に示す。   When polishing the workpiece to be polished K by rotating the polishing member 10 or the workpiece to be polished K, polishing marks may remain on the polished surface of the workpiece to be polished K in the rotation direction. Therefore, in order to suppress such polishing marks, in addition to the various mechanisms described above, a reciprocating mechanism that reciprocates at least one of the polishing member 10 and the workpiece K to be polished in a direction crossing the rotation direction is further provided. You may do it. Two examples when such a reciprocating mechanism is provided in the polishing apparatus of the above-described embodiment shown in FIG. 2 and the like are shown in FIGS.

図１０に示す変形例の研磨装置は、研磨部材１０の回転方向に対して直交する方向に被研磨加工物Ｋを揺動させる揺動機構６０を備えている。この揺動機構６０としては、例えばリンク機構など、適宜の機構を採用することができる。   The polishing apparatus according to the modification shown in FIG. 10 includes a swing mechanism 60 that swings the workpiece K in a direction orthogonal to the rotation direction of the polishing member 10. As the swing mechanism 60, an appropriate mechanism such as a link mechanism can be employed.

この変形例では、研磨部材１０を回転させて被研磨加工物Ｋの端部ＫＥを研磨するときに、揺動機構６０を作動させる。この揺動機構６０の作動により、研磨部材１０の回転方向に対して直交する方向（図１０に示す矢印ＲＯ方向）に被研磨加工物Ｋは揺動する。そして、この被研磨加工物Ｋの揺動運動により、回転研磨中の被研磨加工物Ｋの端部ＫＥは、研磨面１１の曲面に沿って揺動する。こうした端部ＫＥの揺動により、端部ＫＥの研磨痕は交差状になり、回転のみの研磨に比べて研磨痕は小さくなる。従って、回転研磨による研磨痕を抑えることができるようになる。   In this modification, when the polishing member 10 is rotated to polish the end KE of the workpiece K, the swing mechanism 60 is operated. By the operation of the swing mechanism 60, the workpiece K is swung in a direction orthogonal to the rotation direction of the polishing member 10 (the direction of the arrow RO shown in FIG. 10). Then, due to the swinging motion of the workpiece K, the end portion KE of the workpiece K during the rotational polishing swings along the curved surface of the polishing surface 11. Due to the swinging of the end KE, the polishing mark at the end KE becomes crossed, and the polishing mark becomes smaller than that of the rotation-only polishing. Accordingly, it is possible to suppress polishing marks caused by rotational polishing.

なお、研磨部材１０の回転方向に対する被研磨加工物Ｋの揺動方向は、必ずしも直交方向に限られるものではなく、研磨部材１０の回転方向に対して少なくとも交差する方向に揺動させるようにすれば、研磨痕は交差状になるため、回転研磨による研磨痕を抑えることができる。また、被研磨加工物Ｋではなく、研磨部材１０を揺動させるようにしてもよい。また、被研磨加工物Ｋ及び研磨部材１０をともに揺動させるようにしてもよい。   Note that the swinging direction of the workpiece K with respect to the rotation direction of the polishing member 10 is not necessarily limited to the orthogonal direction, and the swinging direction is at least crossed with respect to the rotation direction of the polishing member 10. In this case, since the polishing marks are crossed, the polishing marks due to rotational polishing can be suppressed. Further, the polishing member 10 may be rocked instead of the workpiece K to be polished. Further, both the workpiece K and the polishing member 10 may be swung.

図１１に示す変形例の研磨装置は、研磨部材１０の回転方向に対して直交する方向に被研磨加工物Ｋを小さく振動させる振動機構７０を備えている。この振動機構７０としては、例えば超音波振動を利用した機構など、適宜の機構を採用することができる。   The polishing apparatus according to the modification shown in FIG. 11 includes a vibration mechanism 70 that vibrates the workpiece K to a small extent in a direction orthogonal to the rotation direction of the polishing member 10. As the vibration mechanism 70, an appropriate mechanism such as a mechanism using ultrasonic vibration can be employed.

この変形例では、研磨部材１０を回転させて被研磨加工物Ｋの端部ＫＥを研磨するときに、振動機構７０を作動させる。この振動機構７０の作動により、研磨部材１０の回転方向に対して直交する方向（図１１に示す矢印ＵＤ方向）に被研磨加工物Ｋは小さく振動する。そして、この被研磨加工物Ｋの振動により、回転研磨中の被研磨加工物Ｋの端部ＫＥは、研磨面１１の曲面に接触した状態で矢印ＵＤ方向に小さく往復運動する。こうした端部ＫＥの往復運動により、端部ＫＥの研磨痕は交差状になり、回転のみの研磨に比べて研磨痕は小さくなる。従って、この変形例でも、回転研磨による研磨痕を抑えることができるようになる。   In this modification, when the polishing member 10 is rotated to polish the end KE of the workpiece K, the vibration mechanism 70 is operated. By the operation of the vibration mechanism 70, the workpiece K is vibrated slightly in a direction orthogonal to the rotation direction of the polishing member 10 (the direction of the arrow UD shown in FIG. 11). Then, due to the vibration of the workpiece to be polished K, the end KE of the workpiece to be polished K that is being rotationally polished reciprocally moves in the direction of the arrow UD while being in contact with the curved surface of the polishing surface 11. By such reciprocating movement of the end KE, the polishing mark of the end KE becomes crossed, and the polishing mark is smaller than that of the rotation-only polishing. Therefore, even in this modified example, it becomes possible to suppress polishing marks caused by rotational polishing.

なお、研磨部材１０の回転方向に対する被研磨加工物Ｋの振動方向は、必ずしも直交方向に限られるものではなく、研磨部材１０の回転方向に対して少なくとも交差する方向に振動させるようにすれば、研磨痕は交差状になるため、回転研磨による研磨痕を抑えることができる。また、被研磨加工物Ｋではなく、研磨部材１０を振動させるようにしてもよい。また、被研磨加工物Ｋ及び研磨部材１０をともに振動させるようにしてもよい。   In addition, the vibration direction of the workpiece K with respect to the rotation direction of the polishing member 10 is not necessarily limited to the orthogonal direction, and if the vibration is performed in a direction at least crossing the rotation direction of the polishing member 10, Since the polishing marks are crossed, polishing marks due to rotational polishing can be suppressed. Further, the polishing member 10 instead of the workpiece K may be vibrated. Further, both the workpiece K and the polishing member 10 may be vibrated.

ちなみに、上述した往復移動機構は、上記実施形態の変形例における研磨装置（例えば先の図３等に示した研磨装置など）にも同様に適用可能であり、この場合にも回転研磨による研磨痕を抑えることができるようになる。   Incidentally, the above-described reciprocating mechanism can be similarly applied to a polishing apparatus (for example, the polishing apparatus shown in FIG. 3 or the like) in the modified example of the above-described embodiment. Can be suppressed.

・先の図２等に示したように、上述した実施形態では、研磨面１１に対して被研磨加工物Ｋを、研磨部材１０の回転軸と直交する方向（図２等に示す矢印Ｘ方向）に押し付けることにより、被研磨加工物Ｋの端部ＫＥを研磨するようにした。この場合、そうして押し付けられた端部ＫＥについては研磨することができるものの、被研磨加工物Ｋの上面及び下面、つまり研磨部材１０の回転軸が直交する平面に対して平行になる被研磨加工物Ｋの両面については、研磨に際して圧力が余りかからないため、十分に研磨加工することができないおそれがある。そこで、上述した各種機構に加えて、そうした被研磨加工物Ｋの両面に対して垂直な圧力を与える圧力付与機構をさらに備えるようにしてもよい。   As shown in FIG. 2 and the like, in the above-described embodiment, the workpiece K to be polished with respect to the polishing surface 11 is perpendicular to the rotation axis of the polishing member 10 (the direction of the arrow X shown in FIG. 2 and the like). ), The end portion KE of the workpiece K to be polished was polished. In this case, the end KE thus pressed can be polished, but the upper and lower surfaces of the workpiece K, that is, the object to be polished which is parallel to the plane in which the rotation axis of the polishing member 10 is orthogonal. Since both sides of the workpiece K do not require excessive pressure during polishing, there is a possibility that sufficient polishing cannot be performed. Therefore, in addition to the various mechanisms described above, a pressure applying mechanism that applies a pressure perpendicular to both surfaces of the workpiece K may be further provided.

図１２に、そうした圧力付与機構の一例について概略構成を示す。この図１２に示すように、圧力付与機構は、ローラ８０やアクチュエータ８２等で構成されている。ローラ８０は、円盤状であって回転軸８１を中心に回転する。また、ローラ８０の外周面は、研磨部材１０の上面１０Ｕにあってその外周近傍に当接しており、上面１０Ｕの回転に伴ってローラ８０も回転する。なお、ローラ８０と上面１０Ｕとは、少なくとも被研磨加工物Ｋの研磨中において当接していればよい。従って、ローラ８０と上面１０Ｕとは常時当接していてもよいし、被研磨加工物Ｋの研磨中にのみ当接するようにしてもよい。   FIG. 12 shows a schematic configuration of an example of such a pressure applying mechanism. As shown in FIG. 12, the pressure applying mechanism includes a roller 80, an actuator 82, and the like. The roller 80 is disk-shaped and rotates around the rotation shaft 81. Further, the outer peripheral surface of the roller 80 is in contact with the vicinity of the outer periphery of the upper surface 10U of the polishing member 10, and the roller 80 also rotates as the upper surface 10U rotates. The roller 80 and the upper surface 10U only need to be in contact at least during polishing of the workpiece K to be polished. Accordingly, the roller 80 and the upper surface 10U may always be in contact with each other, or may be in contact only during polishing of the workpiece K to be polished.

アクチュエータ８２は、ローラ８０を上面１０Ｕに押し付ける機構であり、電動式や、油圧式等、適宜の機構にて構成されている。被研磨加工物Ｋの研磨中には、アクチュエータ８２の作動により、ローラ８０は上面１０Ｕに押し付けられる（図１２に示す矢印ＶＴ方向）。   The actuator 82 is a mechanism that presses the roller 80 against the upper surface 10U, and is configured by an appropriate mechanism such as an electric type or a hydraulic type. During polishing of the workpiece K, the roller 80 is pressed against the upper surface 10U by the operation of the actuator 82 (in the direction of the arrow VT shown in FIG. 12).

このようにしてローラ８０が上面１０Ｕに押し付けられると、被研磨加工物Ｋの上面ＫＵには、研磨部材１０の研磨面１１を押し付ける押し付け力Ｆが付与される。また、このようにして上面ＫＵに押し付け力Ｆが付与されると、被研磨加工物Ｋの下面ＫＤは、同下面ＫＤが接触する研磨部材１０の研磨面１１に押し付けられるため、結果として、被研磨加工物Ｋの下面ＫＤにも、被研磨加工物Ｋの上面ＫＵと同様な押し付け力Ｆが付与される。こうした被研磨加工物Ｋの上面ＫＵ及び下面ＫＤに対する押し付け力Ｆの付与により、被研磨加工物Ｋの研磨時には、端部ＫＥだけではなく、上面ＫＵ及び下面ＫＤも同時に研磨することができるようになる。ちなみに、図１２に示した変形例では、研磨部材１０の片面（上面Ｕ）を圧力付与機構にて押し付けることにより、被研磨加工物Ｋの上面ＫＵ及び下面ＫＤに対して押し付け力Ｆが付与される。従って、研磨部材１０の両面に圧力付与機構を設ける場合と比較して、当該圧力付与機構の設置数を減らすことができる。   When the roller 80 is pressed against the upper surface 10U in this way, a pressing force F that presses the polishing surface 11 of the polishing member 10 is applied to the upper surface KU of the workpiece K to be polished. Further, when the pressing force F is applied to the upper surface KU in this way, the lower surface KD of the workpiece K is pressed against the polishing surface 11 of the polishing member 10 with which the lower surface KD contacts, and as a result, A pressing force F similar to that of the upper surface KU of the workpiece K is also applied to the lower surface KD of the polished workpiece K. By applying the pressing force F to the upper surface KU and the lower surface KD of the workpiece K, the upper surface KU and the lower surface KD can be polished simultaneously with the end KE when the workpiece K is polished. Become. Incidentally, in the modification shown in FIG. 12, a pressing force F is applied to the upper surface KU and the lower surface KD of the workpiece K by pressing one surface (upper surface U) of the polishing member 10 with a pressure applying mechanism. The Therefore, the number of pressure applying mechanisms can be reduced as compared with the case where pressure applying mechanisms are provided on both surfaces of the polishing member 10.

また、図１２に示した変形例では、ローラ８０をアクチュエータ８２で押し付けるようにしたが、ローラ８０の質量が十分に大きく、ローラ８０の自重だけで十分な押し付け力Ｆを付与することができるのであれば、アクチュエータ８２を省略してもよい。また、同変形例では、研磨部材１０の片面を押し付けるようにしたが、例えば研磨部材１０の両面を挟み込むなどして、両面を押し付けるようにしてもよい。このようにして両面を押し付けるようにすると、片面を押し付ける場合と比較して、例えば研磨部材１０の歪みなどを抑えることができる。また、研磨に際して、研磨部材１０を固定して被研磨加工物Ｋを回転させる場合には、ローラ８０を回転可能に構成する必要がないため、この場合には、例えばローラ８０を単なる重しなどに変更することも可能である。
（付記１）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、を備える
ことを特徴とする研磨装置。
（付記２）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる第１移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の回転軸に対して直交する方向に移動させる第２移動機構と、を備える
ことを特徴とする研磨装置。
（付記３）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、を備える
ことを特徴とする研磨装置。
（付記４）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構と、を備える
ことを特徴とする研磨装置。
（付記５）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、を備える
ことを特徴とする研磨装置。
（付記６）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構と、を備える
ことを特徴とする研磨装置。
（付記７）
被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構と、を備える
ことを特徴とする研磨装置。
（付記８）
前記研磨部材を下方から回転させるモータを備える
付記１〜７のいずれか１項に記載の研磨装置。
（付記９）
前記研磨部材を上面に載置した状態で前記研磨部材と一体回転する定盤を備える
付記１〜８のいずれか１項に記載の研磨装置。
（付記１０）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有しており、
前記被研磨加工物の研磨時に、前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる
ことを特徴とする研磨方法。
（付記１１）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有しており、
前記被研磨加工物の研磨時に、前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の径方向の外周面における接線方向に移動させることと、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に移動させることと、を行う
ことを特徴とする研磨方法。
（付記１２）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有しており、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる
ことを特徴とする研磨方法。
（付記１３）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有しており、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する
ことを特徴とする研磨方法。
（付記１４）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った研磨面を有しており、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させることと、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させることと、を行う
ことを特徴とする研磨方法。
（付記１５）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った研磨面を有しており、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させることと、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧することと、を行う
ことを特徴とする研磨方法。
（付記１６）
研磨部材で被研磨加工物を研磨する方法であって、
前記研磨部材は、前記被研磨加工物の被研磨部の形状に沿った研磨面を有しており、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させることと、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させることと、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧することと、を行う
ことを特徴とする研磨方法。
（付記１７）
前記研磨部材を下方から回転させる
付記１０〜１６のいずれか１項に記載の研磨方法。
（付記１８）
前記研磨部材を定盤の上面に載置した状態で前記定盤とともに前記研磨部材を一体回転させる
付記１０〜１７のいずれか１項に記載の研磨方法。 In the modification shown in FIG. 12, the roller 80 is pressed by the actuator 82, but the mass of the roller 80 is sufficiently large, and a sufficient pressing force F can be applied only by its own weight. If present, the actuator 82 may be omitted. In the modification, one surface of the polishing member 10 is pressed. However, both surfaces may be pressed by sandwiching both surfaces of the polishing member 10, for example. When both sides are pressed in this manner, for example, distortion of the polishing member 10 can be suppressed as compared with the case where one side is pressed. Further, in the case of polishing, when the polishing member 10 is fixed and the workpiece K is rotated, the roller 80 does not need to be configured to be rotatable. In this case, for example, the roller 80 is simply weighted or the like. It is also possible to change to.
(Appendix 1)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
A polishing apparatus comprising: a moving mechanism configured to move at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member.
(Appendix 2)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
A first moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A polishing apparatus comprising: a second moving mechanism configured to move at least one of the workpiece or the polishing member in a direction orthogonal to a rotation axis of the polishing member.
(Appendix 3)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
And a rotating mechanism for rotating at least one of the workpiece or the polishing member.
(Appendix 4)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
And a pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member.
(Appendix 5)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
And a rotating mechanism for rotating at least one of the workpiece or the polishing member.
(Appendix 6)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
And a pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member.
(Appendix 7)
An apparatus for polishing a workpiece to be polished,
A polishing member having a polishing surface having a shape along the shape of a portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A rotation mechanism for rotating at least one of the workpiece or the polishing member;
And a pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member.
(Appendix 8)
The polishing apparatus according to claim 1, further comprising a motor that rotates the polishing member from below.
(Appendix 9)
The polishing apparatus according to any one of appendices 1 to 8, further comprising a surface plate that rotates integrally with the polishing member in a state where the polishing member is placed on an upper surface.
(Appendix 10)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface having a shape along the shape of the part to be polished of the workpiece to be polished,
At the time of polishing the workpiece, at least one of the workpiece or the polishing member is moved in a tangential direction on a radially outer peripheral surface of the polishing member.
(Appendix 11)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface having a shape along the shape of the part to be polished of the workpiece to be polished,
Moving at least one of the workpiece to be polished or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member when polishing the workpiece to be polished;
Moving at least one of the workpiece or the polishing member in a direction perpendicular to the rotation axis of the polishing member.
(Appendix 12)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface having a shape along the shape of the part to be polished of the workpiece to be polished,
A polishing method comprising rotating at least one of the workpiece and the polishing member.
(Appendix 13)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface having a shape along the shape of the part to be polished of the workpiece to be polished,
A polishing method, comprising: pressing at least one of the workpiece or the polishing member in a direction orthogonal to a rotation axis of the polishing member.
(Appendix 14)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface along the shape of the part to be polished of the workpiece to be polished,
Moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A polishing method comprising: rotating at least one of the workpiece and the polishing member.
(Appendix 15)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface along the shape of the part to be polished of the workpiece to be polished,
Moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A polishing method comprising: pressing at least one of the workpiece or the polishing member in a direction orthogonal to a rotation axis of the polishing member.
(Appendix 16)
A method of polishing a workpiece to be polished with an abrasive member,
The polishing member has a polishing surface along the shape of the part to be polished of the workpiece to be polished,
Moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
Rotating at least one of the workpiece or the polishing member;
A polishing method comprising: pressing at least one of the workpiece or the polishing member in a direction orthogonal to a rotation axis of the polishing member.
(Appendix 17)
The polishing method according to any one of appendices 10 to 16, wherein the polishing member is rotated from below.
(Appendix 18)
The polishing method according to any one of appendices 10 to 17, wherein the polishing member is integrally rotated together with the surface plate in a state where the polishing member is placed on an upper surface of the surface plate.

１０…研磨部材、１０Ｕ…（研磨部材の）上面、１１…研磨面、２０…定盤、２１…第１モータ、３０…第２モータ、３１…回転軸、３２…固定台、３３…モータ移動機構、４０…押圧機構、５０…移動機構、Ｋ…被研磨加工物、ＫＥ…（被研磨加工物の）端部、ＫＵ…（被研磨加工物の）上面、ＫＤ…（被研磨加工物の）下面、６０…揺動機構、７０…振動機構、８０…ローラ、８１…回転軸、８２…アクチュエータ。
DESCRIPTION OF SYMBOLS 10 ... Polishing member, 10U ... Upper surface (of polishing member), 11 ... Polishing surface, 20 ... Surface plate, 21 ... First motor, 30 ... Second motor, 31 ... Rotating shaft, 32 ... Fixed base, 33 ... Motor movement Mechanism: 40 ... Pressing mechanism, 50 ... Movement mechanism, K ... Workpiece to be polished, KE ... End of workpiece (to be polished), KU ... Top surface of workpiece (to be polished), KD ... (of workpiece to be polished) ) Lower surface, 60: swing mechanism, 70: vibration mechanism, 80: roller, 81: rotating shaft, 82: actuator.

Claims (15)

被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on the outer circumferential surface of the polishing member in a radial direction,
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる第１移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の回転軸に対して直交する方向に移動させる第２移動機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A first moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A second moving mechanism for moving at least one of the workpiece or the polishing member in a direction perpendicular to the rotation axis of the polishing member;
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A rotation mechanism for rotating at least one of the workpiece or the polishing member,
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member,
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A rotation mechanism for rotating at least one of the workpiece or the polishing member,
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member,
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 被研磨加工物を研磨する装置であって、
前記被研磨加工物の被研磨部の形状に沿った形状の研磨面を有する円盤状の研磨部材と、
前記被研磨加工物または前記研磨部材の少なくとも一方を、前記研磨部材の径方向の外周面における接線方向に移動させる移動機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を回転させる回転機構と、
前記被研磨加工物または前記研磨部材の少なくとも一方を前記研磨部材の回転軸に対して直交する方向に押圧する押圧機構と、を備え、
前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨するように構成されていることを特徴とする研磨装置。 An apparatus for polishing a workpiece to be polished,
A disc-shaped polishing member having a polished surface along the shape of the portion to be polished of the workpiece;
A moving mechanism for moving at least one of the workpiece or the polishing member in a tangential direction on a radially outer peripheral surface of the polishing member;
A rotation mechanism for rotating at least one of the workpiece or the polishing member;
A pressing mechanism that presses at least one of the workpiece or the polishing member in a direction orthogonal to the rotation axis of the polishing member,
A polishing apparatus configured to polish edges of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member. 前記研磨部材を下方から回転させるモータを備える
請求項１〜７のいずれか１項に記載の研磨装置。 The polishing apparatus according to claim 1, further comprising a motor that rotates the polishing member from below. 前記研磨部材を上面に載置した状態で前記研磨部材と一体回転する定盤を備える
請求項１〜８のいずれか１項に記載の研磨装置。 The polishing apparatus according to claim 1, further comprising a surface plate that rotates integrally with the polishing member in a state where the polishing member is placed on an upper surface. 前記被研磨加工物と前記研磨部材との接触圧が規定の値で一定になるように、前記押圧機構の駆動を制御する制御装置をさらに備える
請求項４，６又は７に記載の研磨装置。 The polishing apparatus according to claim 4, further comprising a control device that controls driving of the pressing mechanism such that a contact pressure between the workpiece and the polishing member is constant at a predetermined value. 前記被研磨加工物と前記研磨部材との接触面積に応じて前記押圧機構による圧力が調整されるように、前記押圧機構の駆動を制御する制御装置をさらに備える
請求項４，６又は７に記載の研磨装置。 The control apparatus which controls the drive of the said press mechanism so that the pressure by the said press mechanism may be adjusted according to the contact area of the said to-be-polished workpiece and the said grinding | polishing member is provided. Polishing equipment. 前記被研磨加工物の形状に応じて前記被研磨加工物の研磨時間を調整する制御装置をさらに備える
請求項１〜９のいずれか１項に記載の研磨装置。 The polishing apparatus according to claim 1, further comprising a control device that adjusts a polishing time of the workpiece to be polished in accordance with a shape of the workpiece to be polished. 前記被研磨加工物の形状に応じて、前記移動機構による前記接線方向における前記被研磨加工物または前記研磨部材の移動速度を変更し、それにより前記被研磨加工物の研磨時間を調整する制御装置をさらに備える
請求項１，２，５〜７のいずれか１項に記載の研磨装置。 A control device that changes the moving speed of the workpiece or the polishing member in the tangential direction by the moving mechanism according to the shape of the workpiece, thereby adjusting the polishing time of the workpiece The polishing apparatus according to claim 1, further comprising: 前記被研磨加工物の形状に応じて、前記回転機構による前記被研磨加工物または前記研磨部材の回転速度を変更し、それにより前記被研磨加工物の研磨時間を調整する制御装置をさらに備える
請求項３，５又は７に記載の研磨装置。 The apparatus further includes a control device that changes a rotation speed of the workpiece or the polishing member by the rotation mechanism according to a shape of the workpiece, thereby adjusting a polishing time of the workpiece. Item 8. The polishing apparatus according to Item 3, 5 or 7. 請求項１〜１４のいずれか一項に記載の研磨装置を用いて、前記研磨部材の外周面において同時に複数の被研磨加工物の端部を研磨する研磨方法。
A polishing method for polishing the ends of a plurality of workpieces simultaneously on the outer peripheral surface of the polishing member using the polishing apparatus according to claim 1.
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US20160236314A1 (en) 2016-08-18
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