CN105629663B - 感光性树脂组合物 - Google Patents
感光性树脂组合物 Download PDFInfo
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- CN105629663B CN105629663B CN201510812533.4A CN201510812533A CN105629663B CN 105629663 B CN105629663 B CN 105629663B CN 201510812533 A CN201510812533 A CN 201510812533A CN 105629663 B CN105629663 B CN 105629663B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020140163483A KR102329586B1 (ko) | 2014-11-21 | 2014-11-21 | 포지티브형 감광성 수지 조성물 및 이로부터 제조된 경화막 |
KR10-2014-0163483 | 2014-11-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105629663A CN105629663A (zh) | 2016-06-01 |
CN105629663B true CN105629663B (zh) | 2021-01-15 |
Family
ID=56044744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510812533.4A Active CN105629663B (zh) | 2014-11-21 | 2015-11-20 | 感光性树脂组合物 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6941416B2 (ja) |
KR (1) | KR102329586B1 (ja) |
CN (1) | CN105629663B (ja) |
TW (1) | TWI702472B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7058214B2 (ja) * | 2015-11-06 | 2022-04-21 | ローム・アンド・ハース・エレクトロニック・マテリアルズ・コリア・リミテッド | 感光性樹脂組成物及びそれから調製される硬化膜 |
KR102539889B1 (ko) * | 2016-08-11 | 2023-06-05 | 동우 화인켐 주식회사 | 화학증폭형 감광성 수지 조성물 및 이로부터 제조된 절연막 |
CN107918249A (zh) * | 2016-10-05 | 2018-04-17 | 罗门哈斯电子材料韩国有限公司 | 感光性树脂组合物和由其制备的固化膜 |
KR102472024B1 (ko) * | 2016-10-05 | 2022-11-30 | 롬엔드하스전자재료코리아유한회사 | 감광성 수지 조성물 및 이로부터 제조된 경화막 |
KR20180135375A (ko) * | 2017-06-12 | 2018-12-20 | 롬엔드하스전자재료코리아유한회사 | 착색 감광성 수지 조성물 및 이로부터 제조된 차광성 스페이서 |
KR20190056088A (ko) | 2017-11-16 | 2019-05-24 | 롬엔드하스전자재료코리아유한회사 | 감광성 수지 조성물 및 이로부터 제조된 경화막 |
CN109904212B (zh) * | 2019-03-28 | 2021-07-20 | 昆山国显光电有限公司 | 一种有机发光显示面板及其制作方法 |
CN111607082A (zh) * | 2020-06-05 | 2020-09-01 | 北京大学 | 一种低热膨胀系数聚酰亚胺薄膜的制备方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009251538A (ja) * | 2008-04-11 | 2009-10-29 | Nippon Zeon Co Ltd | 感放射線樹脂組成物 |
CN101784958A (zh) * | 2007-08-24 | 2010-07-21 | 东丽株式会社 | 感光性组合物、由该组合物形成的固化膜、以及具有固化膜的元件 |
CN101937172A (zh) * | 2009-06-29 | 2011-01-05 | Jsr株式会社 | 正型放射线敏感性组合物、固化膜、层间绝缘膜及其形成方法、显示元件以及硅氧烷聚合物 |
JP2011253035A (ja) * | 2010-06-02 | 2011-12-15 | Toray Ind Inc | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
CN102667625A (zh) * | 2009-12-22 | 2012-09-12 | 东丽株式会社 | 正型感光性树脂组合物、由该组合物形成的固化膜及具有固化膜的元件 |
CN102725692A (zh) * | 2010-01-15 | 2012-10-10 | 富士胶片株式会社 | 感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置及液晶显示装置 |
CN103547966A (zh) * | 2011-05-20 | 2014-01-29 | 日产化学工业株式会社 | 感光性树脂组合物 |
CN104011596A (zh) * | 2011-12-26 | 2014-08-27 | 东丽株式会社 | 感光性树脂组合物和半导体元件的制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101404005B1 (ko) * | 2010-04-28 | 2014-06-05 | 제이에스알 가부시끼가이샤 | 포지티브형 감방사선성 조성물, 표시 소자용 층간 절연막 및 그 형성 방법 |
JPWO2012086370A1 (ja) * | 2010-12-24 | 2014-05-22 | 株式会社Adeka | 感光性樹脂組成物 |
CN103443707A (zh) * | 2011-03-30 | 2013-12-11 | 日本瑞翁株式会社 | 树脂组合物和半导体元件基板 |
TWI446111B (zh) * | 2012-04-20 | 2014-07-21 | Chi Mei Corp | 感光性樹脂組成物、黑色矩陣、彩色濾光片及其液晶顯示元件 |
TWI470359B (zh) * | 2012-09-27 | 2015-01-21 | Chi Mei Corp | 感光性樹脂組成物、保護膜及具有保護膜的元件 |
CN103116246B (zh) * | 2013-02-27 | 2016-07-06 | 村上精密制版(昆山)有限公司 | 一种感光性树脂组合物及其应用 |
-
2014
- 2014-11-21 KR KR1020140163483A patent/KR102329586B1/ko active IP Right Grant
-
2015
- 2015-11-04 JP JP2015216601A patent/JP6941416B2/ja active Active
- 2015-11-12 TW TW104137382A patent/TWI702472B/zh active
- 2015-11-20 CN CN201510812533.4A patent/CN105629663B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101784958A (zh) * | 2007-08-24 | 2010-07-21 | 东丽株式会社 | 感光性组合物、由该组合物形成的固化膜、以及具有固化膜的元件 |
JP2009251538A (ja) * | 2008-04-11 | 2009-10-29 | Nippon Zeon Co Ltd | 感放射線樹脂組成物 |
CN101937172A (zh) * | 2009-06-29 | 2011-01-05 | Jsr株式会社 | 正型放射线敏感性组合物、固化膜、层间绝缘膜及其形成方法、显示元件以及硅氧烷聚合物 |
CN102667625A (zh) * | 2009-12-22 | 2012-09-12 | 东丽株式会社 | 正型感光性树脂组合物、由该组合物形成的固化膜及具有固化膜的元件 |
CN102725692A (zh) * | 2010-01-15 | 2012-10-10 | 富士胶片株式会社 | 感光性树脂组合物、固化膜的形成方法、固化膜、有机el显示装置及液晶显示装置 |
JP2011253035A (ja) * | 2010-06-02 | 2011-12-15 | Toray Ind Inc | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
CN103547966A (zh) * | 2011-05-20 | 2014-01-29 | 日产化学工业株式会社 | 感光性树脂组合物 |
CN104011596A (zh) * | 2011-12-26 | 2014-08-27 | 东丽株式会社 | 感光性树脂组合物和半导体元件的制造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20160061055A (ko) | 2016-05-31 |
TW201624135A (zh) | 2016-07-01 |
TWI702472B (zh) | 2020-08-21 |
CN105629663A (zh) | 2016-06-01 |
JP6941416B2 (ja) | 2021-09-29 |
JP2016128901A (ja) | 2016-07-14 |
KR102329586B1 (ko) | 2021-11-22 |
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