CN105578769B - A kind of production method for the PCB for preventing drilling from pulling copper - Google Patents
A kind of production method for the PCB for preventing drilling from pulling copper Download PDFInfo
- Publication number
- CN105578769B CN105578769B CN201510982347.5A CN201510982347A CN105578769B CN 105578769 B CN105578769 B CN 105578769B CN 201510982347 A CN201510982347 A CN 201510982347A CN 105578769 B CN105578769 B CN 105578769B
- Authority
- CN
- China
- Prior art keywords
- orifice ring
- drilling
- copper
- foot
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to board production technical field, specially a kind of production method for the PCB for preventing drilling from pulling copper.The present invention strengthens foot by being set in the orifice ring periphery of core material, and the binding force of orifice ring and base material can be increased by strengthening foot, and orifice ring is not pulled during so as to make drilling, prevents orifice ring from being detached with base material.Six reinforcement feet being spacedly distributed are set in orifice ring periphery, the binding force that can make orifice ring and base material is sufficiently large, and orifice ring will not be pulled in drilling, while heat dissipation when nor affecting on drilling.The present invention can effectively solve the problems, such as occur pulling copper during drilling by designing the reinforcement foot being connected with orifice ring on core material.
Description
Technical field
The present invention relates to board production technical field more particularly to a kind of production methods for the PCB for preventing drilling from pulling copper.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, also known as printed wiring board, is important
Electronic unit, be electronic component supporter, be electronic component electrical connection carrier.The technological process of production of PCB
It is general as follows：Sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → pressing → drilling → heavy copper → electric plating of whole board
→ outer graphics → graphic plating → etching → outer layer AOI → silk-screen welding resistance, character → surface treatment → molding → electrical testing →
FQC → packaging.In drilling operating, if copper layer thickness >=2OZ of core material, the orifice ring of core material is easily pulled during drilling
Go out, loosened between orifice ring and base material.At present by adjusting bore nozzle come solve the problems, such as drilling when occur pulling copper, such as control bore
Nozzle mill is secondary, bore the nozzle service life, nozzle structure (being changed to UC structures by ST structures or bored nozzle by big knife face be changed to small knife face brill nozzle) is bored in change,
By the way that the adjustment for boring nozzle a degree of the problem of copper is pulled in drilling can be mitigated, but it can not still be fully solved the problem.
Invention content
The problem of method that the present invention bores nozzle for existing adjustment pulls copper when can not be fully solved drilling, providing one kind can solve
The production method that certainly PCB of copper problem is pulled in drilling.
To achieve the above object, the present invention uses following technical scheme.
A kind of production method for the PCB for preventing drilling from pulling copper, includes the following steps：
S1 inner figures：The core material is equipped with drilling position, and the drilling position is to need to drill in following process
Position；The inner figure on the film is transferred on core material by negative film technique, the inner figure includes orifice ring figure
Shape and strengthen foot figure, the orifice ring figure around drilling position, it is described strengthen foot figure be located at orifice ring figure periphery and with
Orifice ring figure is connected.
Preferably, the periphery of the orifice ring figure is equipped with several reinforcement foot figures being spacedly distributed.It is it is furthermore preferred that described
Strengthen foot figure there are six setting in the periphery of orifice ring figure.
Preferably, it is described strengthen foot figure length and width >=0.1mm.
Preferably, when the copper layer thickness of the core material is 2OZ, ring width >=0.3mm of the orifice ring figure；In described
During copper layer thickness >=3OZ of layer core plate, ring width >=0.35mm of the orifice ring figure.
S2 internal layer circuits：Copper exposed on core material is removed by etching, film is then taken off, internal layer is formed by inner figure
Circuit forms orifice ring by the orifice ring figure, is formed by the reinforcement foot figure and strengthens foot.
S3 is pressed：Core material and outer copper foil are press-fitted together as one by prepreg, form multi-layer board.
S4 drills：On multilayer boards perpendicular to the drilling of drilling position.
Process after S5：According to the prior art, bored hole metallization is made by heavy copper and electric plating of whole board process, then successively
By making outer-layer circuit, making solder mask, surface treatment and molding, multi-layer board is processed into PCB finished products.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention in the orifice ring periphery of core material by setting
Strengthen foot, the binding force of orifice ring and base material can be increased by strengthening foot, and orifice ring is not pulled during so as to make drilling, prevents orifice ring and base material
Separation.Six reinforcement feet being spacedly distributed are set in orifice ring periphery, the binding force that can make orifice ring and base material is sufficiently large, and orifice ring is not
Heat dissipation when can be pulled in drilling, while nor affect on drilling.The present invention on core material by designing and orifice ring phase
Reinforcement foot even can effectively solve the problems, such as occur pulling copper during drilling.
Description of the drawings
Fig. 1 is the schematic diagram of orifice ring figure in embodiment 1, reinforcement foot figure and the position that drills.
Specific embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
Embodiment 1
The present embodiment provides a kind of production methods of PCB, especially can be prevented from the production method for pulling copper occur during drilling.
Specific making step is as follows：
(1) inner figure
First by sawing sheet, core material is cut by base material, the copper layer thickness of core material is 2OZ.It will according to design
It asks, the position for drilling after pressing is reserved on core material, which is known as the position 1 that drills, as shown in Figure 1.
The inner figure on the film is transferred on core material by negative film technique, inner figure includes orifice ring figure 2
With strengthen foot figure 3, orifice ring figure 2 around drilling position 1, strengthen foot figure 3 be located at orifice ring figure 2 periphery and with orifice ring figure
Shape 2 is connected.Also, the ring width of orifice ring figure 2 is 0.3mm, and being spacedly distributed in the periphery of orifice ring figure 2, there are six strengthen foot figure
Shape 3, it is that (ring width for strengthening foot 3 and orifice ring 2 is bigger, the binding force of orifice ring 2 and base material by 0.1mm to strengthen the length of foot figure 3 and width
It is bigger).
(2) internal layer circuit
Copper exposed on core material (copper not covered by wet film) is removed by etching, film is then taken off, by inner figure
Form internal layer circuit.Wherein, in internal layer circuit, orifice ring is formed by orifice ring figure 2, reinforcement foot is formed by reinforcement foot figure 3.
(3) it presses
According to the prior art, core material and outer copper foil are press-fitted together as one by prepreg, form multi-layer board.
(4) it drills
It is drilled on multilayer boards according to borehole data, i.e., perpendicular to the drilling of drilling position.
(5) process afterwards
According to the prior art, bored hole metallization is made by heavy copper and electric plating of whole board process, then in turn through making
Outer-layer circuit makes solder mask, surface treatment, molding, electrical testing and final inspection, and PCB finished products are made.
It is repeated to make 1000 pieces of PCB according to the method for embodiment 1, when drilling does not have PCB to occur pulling copper problem.
Embodiment 2
The present embodiment provides a kind of production methods of PCB, especially can be prevented from the production method for pulling copper occur during drilling.
The making step of the present embodiment is basically identical with embodiment 1, specific as follows the difference lies in step (1) inner figure：
First by sawing sheet, core material is cut by base material, the copper layer thickness of core material is 3OZ.It will according to design
It asks, the position for drilling after pressing is reserved on core material, which is known as the position that drills.
Then the inner figure on the film is transferred on core material by negative film technique, inner figure includes orifice ring figure
Shape and strengthen foot figure, orifice ring figure around drilling position, strengthen foot figure be located at orifice ring figure periphery and with orifice ring figure
It is connected.Also, the ring width of orifice ring figure is 0.35mm, is spacedly distributed in the periphery of orifice ring figure there are six reinforcement foot figure,
The length and width for strengthening foot figure are 0.1mm.
It is repeated to make 1000 pieces of PCB according to the method for embodiment 2, when drilling does not have PCB to occur pulling copper problem.
Embodiment 3
The present embodiment provides a kind of production methods of PCB, especially can be prevented from the production method for pulling copper occur during drilling.
The making step of the present embodiment is basically identical with embodiment 1, specific as follows the difference lies in step (1) inner figure：
First by sawing sheet, core material is cut by base material, the copper layer thickness of core material is 2OZ.It will according to design
It asks, the position for drilling after pressing is reserved on core material, which is known as the position that drills.
The inner figure on the film is transferred on core material by negative film technique, inner figure include orifice ring figure and
Strengthen foot figure, orifice ring figure strengthens foot figure and be located at the periphery of orifice ring figure and be connected with orifice ring figure around drilling position.
Also, the ring width of orifice ring figure is 0.25mm, is spacedly distributed in the periphery of orifice ring figure there are three foot figure is strengthened, strengthens foot
The length and width of figure are 0.07mm.
It is repeated to make 1000 pieces of PCB according to the method for embodiment 3, when drilling has 5% PCB to occur pulling copper problem.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (4)
1. a kind of production method for the PCB for preventing drilling from pulling copper, which is characterized in that include the following steps：
S1 inner figures：The core material is equipped with drilling position, and the drilling position is the position for needing to drill in following process
It puts；The inner figure on the film is transferred on core material by negative film technique, the inner figure include orifice ring figure and
Strengthen foot figure, the orifice ring figure is around drilling position, periphery and and the orifice ring strengthened foot figure and be located at orifice ring figure
Figure is connected；The periphery of the orifice ring figure sets that there are six the reinforcement foot figures that are spacedly distributed；
S2 internal layer circuits：Copper exposed on core material is removed by etching, film is then taken off, interior layer line is formed by inner figure
Road forms orifice ring by the orifice ring figure, is formed by the reinforcement foot figure and strengthens foot；
S3 is pressed：Core material and outer copper foil are press-fitted together as one by prepreg, form multi-layer board；
S4 drills：On multilayer boards perpendicular to the drilling of drilling position；
Process after S5：According to the prior art, bored hole metallization is made by heavy copper and electric plating of whole board process, then in turn through
It makes outer-layer circuit, make solder mask, surface treatment and molding, multi-layer board is processed into PCB finished products.
A kind of 2. production method for the PCB for preventing drilling from pulling copper according to claim 1, which is characterized in that the reinforcement foot
The length and width of figure >=0.1mm.
A kind of 3. production method for the PCB for preventing drilling from pulling copper according to claim 1, which is characterized in that the internal layer core
When the copper layer thickness of plate is 2OZ, ring width >=0.3mm of the orifice ring figure.
A kind of 4. production method for the PCB for preventing drilling from pulling copper according to claim 1, which is characterized in that the internal layer core
During copper layer thickness >=3OZ of plate, ring width >=0.35mm of the orifice ring figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510982347.5A CN105578769B (en) | 2015-12-24 | 2015-12-24 | A kind of production method for the PCB for preventing drilling from pulling copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510982347.5A CN105578769B (en) | 2015-12-24 | 2015-12-24 | A kind of production method for the PCB for preventing drilling from pulling copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578769A CN105578769A (en) | 2016-05-11 |
| CN105578769B true CN105578769B (en) | 2018-06-15 |
Family
ID=55888272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510982347.5A Active CN105578769B (en) | 2015-12-24 | 2015-12-24 | A kind of production method for the PCB for preventing drilling from pulling copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105578769B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012417A (en) * | 2018-01-11 | 2018-05-08 | 广合科技（广州）有限公司 | Prevent the separated pcb board of hole wall and its processing technology |
| CN108770238B (en) * | 2018-07-13 | 2021-07-06 | 深圳崇达多层线路板有限公司 | Inner layer graph design method for improving copper pulling in drilling |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041623A (en) * | 1996-07-19 | 1998-02-13 | Nippon Avionics Co Ltd | Metal core printed circuit board and manufacturing method therefor |
-
2015
- 2015-12-24 CN CN201510982347.5A patent/CN105578769B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105578769A (en) | 2016-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105578801B (en) | A kind of preparation method in the back drill hole of the consent of solder mask half | |
| JP4126052B2 (en) | Printed circuit board manufacturing method and thin printed circuit board | |
| CN104717846B (en) | The preparation method of metallization slotted eye in a kind of PCB | |
| CN104333979B (en) | Method of carrying out secondary hole drilling in multi-layer board | |
| TW200623318A (en) | Method for fabricating a multi-layer circuit board with fine pitch | |
| CN106961806B (en) | The production method for burying copper billet is substituted in a kind of wiring board | |
| JP2004311927A (en) | Manufacturing method for multilayer printed-circuit board | |
| CN104540338B (en) | High Aligning degree HDI production methods | |
| CN105792527B (en) | A kind of production method of etchback printed circuit board | |
| CN105744765B (en) | A method of making short slot on PCB | |
| CN105848428B (en) | A method of making metalized blind vias on PCB | |
| CN104540320B (en) | The preparation method of filling holes with resin in a kind of PCB | |
| WO2007103949A3 (en) | Processes for manufacturing printed wiring boards possessing electrically conductive constraining cores | |
| CN104507257A (en) | Printed circuit board (PCB) molding method | |
| CN105682363B (en) | A kind of production method of the PCB of edges of boards metallization | |
| CN105578769B (en) | A kind of production method for the PCB for preventing drilling from pulling copper | |
| CN104768331B (en) | The method for repairing and mending of open lines in a kind of PCB | |
| CN104378931A (en) | Method for manufacturing metallized counterbore in PCB | |
| CN105491805B (en) | A kind of method that character is made on PCB thickness copper coins | |
| CN110167289A (en) | A kind of production method of multilayer circuit board | |
| JP2008078343A (en) | Printed wiring board and its manufacturing method | |
| JP2017098433A (en) | Intermediate body of printed wiring board and printed wiring board, method of manufacturing printed wiring board | |
| KR102046006B1 (en) | High-current transfer methods utilizing the printed circuit board | |
| CN105682380B (en) | A kind of production method of the thick gold PCB of parcel plating | |
| CN110461085B (en) | Circuit board capable of realizing crimping of components in stepped groove and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |