CN105578769A - Printed circuit board (PCB) fabrication method for preventing copper pulling during drilling - Google Patents
Printed circuit board (PCB) fabrication method for preventing copper pulling during drilling Download PDFInfo
- Publication number
- CN105578769A CN105578769A CN201510982347.5A CN201510982347A CN105578769A CN 105578769 A CN105578769 A CN 105578769A CN 201510982347 A CN201510982347 A CN 201510982347A CN 105578769 A CN105578769 A CN 105578769A
- Authority
- CN
- China
- Prior art keywords
- copper
- orifice ring
- pcb
- core material
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to the technical field of production of a printed circuit board (PCB), in particular to a PCB fabrication method for preventing copper drawing during drilling. Reinforcement legs are arranged at the periphery of a hole ring of an inner-layer core plate and can be used for improving a bonding force between the hole ring and a substrate, and thus, the hole ring cannot be pulled out during drilling and is prevented from being separated from the substrate. The six reinforcement legs are arranged at the periphery of the hole ring at equal intervals, the bonding force between the hole ring and the substrate can be enough large, the hole ring cannot be pulled out during drilling, and heat dissipation is also not affected during drilling. By designing the reinforcement legs connected with the hole rings on the inner-layer core plate, the problem of copper pulling during drilling can be effectively solved.
Description
Technical field
The present invention relates to board production technical field, particularly relate to the manufacture method of a kind of PCB pulling copper that prevents from holing.
Background technology
PCB (PrintedCircuitBoard), Chinese is printed circuit board, and also known as printed substrate, being important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.The technological process of production of PCB is generally as follows: sawing sheet → inner figure → internal layer etching → internal layer AOI → brown → pressing → boring → heavy copper → electric plating of whole board → outer graphics → graphic plating → etching → outer AOI → silk-screen welding resistance, character → surface treatment → shaping → electrical testing → FQC → packaging.In drilling operating, if the copper layer thickness >=2OZ of core material, during boring, the orifice ring of core material is easily pulled, and occurs to loosen between orifice ring and base material.Bored by adjustment at present and chew the problem occurring pulling copper when solving boring, chew mill as controlled brill, bore chew the life-span, structure chewed by change brill (by ST structure change into UC structure or by large knife face bore chew change into little knife face bore chew), by to a certain degree alleviating to boring the adjustment of chewing the problem that copper is pulled in boring, but still cannot solve this problem completely.
Summary of the invention
The present invention is directed to existing adjustment and bore the problem of pulling copper when the method for chewing cannot solve boring completely, provide a kind of and solve the manufacture method that the PCB of copper problem is pulled in boring.
For achieving the above object, the present invention by the following technical solutions.
Prevent from holing a manufacture method of the PCB pulling copper, comprises the following steps:
S1 inner figure: described core material is provided with boring position, described boring position is the position needing to hole in following process; Transfer on core material by negative film technique by the inner figure on the film, described inner figure comprises orifice ring figure and strengthens pin figure, and described orifice ring figure is round boring position, and described reinforcement pin figure is positioned at the periphery of orifice ring figure and is connected with orifice ring figure.
Preferably, the periphery of described orifice ring figure is provided with some reinforcement pin figures be spacedly distributed.Preferred, the periphery of described orifice ring figure is provided with six and strengthens pin figure.
Preferably, the length of described reinforcement pin figure and all wide >=0.1mm.
Preferably, when the copper layer thickness of described core material is 2OZ, the ring width >=0.3mm of described orifice ring figure; During copper layer thickness >=the 3OZ of described core material, the ring width >=0.35mm of described orifice ring figure.
S2 internal layer circuit: by copper exposed on etching removing core material, then take off film, form internal layer circuit by inner figure, form orifice ring by described orifice ring figure, formed by described reinforcement pin figure and strengthen pin.
S3 pressing: core material and outer copper foil pressing are integrated by prepreg, forms multi-layer sheet.
S4 holes: on multilayer boards perpendicular to the boring of boring position.
Operation after S5: according to prior art, makes bored hole metallization by heavy copper and electric plating of whole board operation, then successively through making outer-layer circuit, making solder mask, surface treatment and shaping, multi-layer sheet is processed into PCB finished product.
Compared with prior art, the invention has the beneficial effects as follows: the present invention arranges reinforcement pin by the orifice ring periphery at core material, strengthen the adhesion that pin can increase orifice ring and base material, thus when making boring, orifice ring is not pulled, and prevents orifice ring to be separated with base material.Arrange six reinforcement pin be spacedly distributed in orifice ring periphery, the adhesion of orifice ring and base material can be made enough large, and orifice ring can not be pulled when holing, and does not also affect heat radiation during boring simultaneously.By designing the reinforcement pin be connected with orifice ring on core material, when effectively can solve boring, there is pulling the problem of copper in the present invention.
Accompanying drawing explanation
Fig. 1 is orifice ring figure in embodiment 1, strengthens the schematic diagram of pin figure and boring position.
Embodiment
In order to understand technology contents of the present invention more fully, below in conjunction with specific embodiment, technical scheme of the present invention being described further and being illustrated.
Embodiment 1
The present embodiment provides the manufacture method of a kind of PCB, especially can prevent the manufacture method occurring pulling copper when holing.Concrete making step is as follows:
(1) inner figure
First by sawing sheet, be cut into core material by base material, the copper layer thickness of core material is 2OZ.According to designing requirement, core material is reserved with the position for holing after pressing, this position is called boring position 1, as shown in Figure 1.
Transfer on core material by negative film technique by the inner figure on the film, inner figure comprises orifice ring figure 2 and strengthens pin figure 3, and orifice ring figure 2, round boring position 1, is strengthened pin figure 3 and is positioned at the periphery of orifice ring figure 2 and is connected with orifice ring figure 2.And, the ring width of orifice ring figure 2 is 0.3mm, be spacedly distributed in the periphery of orifice ring figure 2 six and strengthened pin figures 3, strengthened the length of pin figure 3 and be widely 0.1mm (ring width strengthening pin 3 and orifice ring 2 is larger, and the adhesion of orifice ring 2 and base material is larger).
(2) internal layer circuit
By exposed copper on etching removing core material (not by copper that wet film covers), then take off film, form internal layer circuit by inner figure.Wherein, in internal layer circuit, form orifice ring by orifice ring figure 2, form reinforcement pin by reinforcement pin figure 3.
(3) pressing
According to prior art, by prepreg, core material and outer copper foil pressing are integrated, form multi-layer sheet.
(4) hole
Hole on multilayer boards according to borehole data, namely perpendicular to the boring of boring position.
(5) operation afterwards
According to prior art, make bored hole metallization by heavy copper and electric plating of whole board operation, then successively through making outer-layer circuit, make solder mask, surface treatment, shaping, electrical testing and inspection eventually, obtained PCB finished product.
Repeat making 1000 pieces of PCB according to the method for embodiment 1, during boring, do not have PCB to occur pulling copper problem.
Embodiment 2
The present embodiment provides the manufacture method of a kind of PCB, especially can prevent the manufacture method occurring pulling copper when holing.The making step of the present embodiment and the basically identical of embodiment 1, difference is step (1) inner figure, specific as follows:
First by sawing sheet, be cut into core material by base material, the copper layer thickness of core material is 3OZ.According to designing requirement, core material is reserved with the position for holing after pressing, this position is called boring position.
Then transfer on core material by negative film technique by the inner figure on the film, inner figure comprises orifice ring figure and strengthens pin figure, and orifice ring figure, round boring position, is strengthened pin figure and is positioned at the periphery of orifice ring figure and is connected with orifice ring figure.Further, the ring width of orifice ring figure is 0.35mm, has been spacedly distributed six strengthens pin figures in the periphery of orifice ring figure, strengthens the length of pin figure and is widely 0.1mm.
Repeat making 1000 pieces of PCB according to the method for embodiment 2, during boring, do not have PCB to occur pulling copper problem.
Embodiment 3
The present embodiment provides the manufacture method of a kind of PCB, especially can prevent the manufacture method occurring pulling copper when holing.The making step of the present embodiment and the basically identical of embodiment 1, difference is step (1) inner figure, specific as follows:
First by sawing sheet, be cut into core material by base material, the copper layer thickness of core material is 2OZ.According to designing requirement, core material is reserved with the position for holing after pressing, this position is called boring position.
Transfer on core material by negative film technique by the inner figure on the film, inner figure comprises orifice ring figure and strengthens pin figure, and orifice ring figure, round boring position, is strengthened pin figure and is positioned at the periphery of orifice ring figure and is connected with orifice ring figure.Further, the ring width of orifice ring figure is 0.25mm, has been spacedly distributed three strengthens pin figures in the periphery of orifice ring figure, strengthens the length of pin figure and is widely 0.07mm.
Repeat making 1000 pieces of PCB according to the method for embodiment 3, during boring, have the PCB of 5% to occur pulling copper problem.
The above only further illustrates technology contents of the present invention with embodiment, so that reader is easier to understand, but does not represent embodiments of the present invention and is only limitted to this, and any technology done according to the present invention extends or recreation, all by protection of the present invention.
Claims (6)
1. preventing holes pulls a manufacture method of the PCB of copper, it is characterized in that, comprises the following steps:
S1 inner figure: described core material is provided with boring position, described boring position is the position needing to hole in following process; Transfer on core material by negative film technique by the inner figure on the film, described inner figure comprises orifice ring figure and strengthens pin figure, and described orifice ring figure is round boring position, and described reinforcement pin figure is positioned at the periphery of orifice ring figure and is connected with orifice ring figure;
S2 internal layer circuit: by copper exposed on etching removing core material, then take off film, form internal layer circuit by inner figure, form orifice ring by described orifice ring figure, formed by described reinforcement pin figure and strengthen pin;
S3 pressing: core material and outer copper foil pressing are integrated by prepreg, forms multi-layer sheet;
S4 holes: on multilayer boards perpendicular to the boring of boring position;
Operation after S5: according to prior art, makes bored hole metallization by heavy copper and electric plating of whole board operation, then successively through making outer-layer circuit, making solder mask, surface treatment and shaping, multi-layer sheet is processed into PCB finished product.
2. the manufacture method of a kind of PCB pulling copper that prevents from holing according to claim 1, it is characterized in that, the periphery of described orifice ring figure is provided with some reinforcement pin figures be spacedly distributed.
3. the manufacture method of a kind of PCB pulling copper that prevents from holing according to claim 2, is characterized in that, the periphery of described orifice ring figure is provided with six and strengthens pin figures.
4. the manufacture method of a kind of PCB pulling copper that prevents from holing according to claim 1, is characterized in that, the length of described reinforcement pin figure and all wide >=0.1mm.
5. the manufacture method of a kind of PCB pulling copper that prevents from holing according to claim 1, is characterized in that, when the copper layer thickness of described core material is 2OZ, and the ring width >=0.3mm of described orifice ring figure.
6. the manufacture method of a kind of PCB pulling copper that prevents from holing according to claim 1, is characterized in that, during the copper layer thickness >=3OZ of described core material, and the ring width >=0.35mm of described orifice ring figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510982347.5A CN105578769B (en) | 2015-12-24 | 2015-12-24 | A kind of production method for the PCB for preventing drilling from pulling copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510982347.5A CN105578769B (en) | 2015-12-24 | 2015-12-24 | A kind of production method for the PCB for preventing drilling from pulling copper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105578769A true CN105578769A (en) | 2016-05-11 |
| CN105578769B CN105578769B (en) | 2018-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510982347.5A Active CN105578769B (en) | 2015-12-24 | 2015-12-24 | A kind of production method for the PCB for preventing drilling from pulling copper |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012417A (en) * | 2018-01-11 | 2018-05-08 | 广合科技（广州）有限公司 | Prevent the separated pcb board of hole wall and its processing technology |
| CN108770238A (en) * | 2018-07-13 | 2018-11-06 | 深圳崇达多层线路板有限公司 | A kind of inner figure design method for improving drilling and pulling copper |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041623A (en) * | 1996-07-19 | 1998-02-13 | Nippon Avionics Co Ltd | Metal core printed circuit board and manufacturing method therefor |
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
-
2015
- 2015-12-24 CN CN201510982347.5A patent/CN105578769B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041623A (en) * | 1996-07-19 | 1998-02-13 | Nippon Avionics Co Ltd | Metal core printed circuit board and manufacturing method therefor |
| CN102006728A (en) * | 2010-11-09 | 2011-04-06 | 深圳崇达多层线路板有限公司 | Novel production method of board deep-recess line |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108012417A (en) * | 2018-01-11 | 2018-05-08 | 广合科技（广州）有限公司 | Prevent the separated pcb board of hole wall and its processing technology |
| CN108770238A (en) * | 2018-07-13 | 2018-11-06 | 深圳崇达多层线路板有限公司 | A kind of inner figure design method for improving drilling and pulling copper |
| CN108770238B (en) * | 2018-07-13 | 2021-07-06 | 深圳崇达多层线路板有限公司 | Inner layer graph design method for improving copper pulling in drilling |
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| CN105578769B (en) | 2018-06-15 |
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