CN105578724A - Flexible printed circuit board and mobile terminal - Google Patents
Flexible printed circuit board and mobile terminal Download PDFInfo
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- CN105578724A CN105578724A CN201511030170.5A CN201511030170A CN105578724A CN 105578724 A CN105578724 A CN 105578724A CN 201511030170 A CN201511030170 A CN 201511030170A CN 105578724 A CN105578724 A CN 105578724A
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- line layer
- flexible pcb
- flex area
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- 239000010410 layer Substances 0.000 claims description 344
- 239000011241 protective layer Substances 0.000 claims description 67
- 239000004020 conductor Substances 0.000 claims description 48
- 229920000297 Rayon Polymers 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 24
- 238000005452 bending Methods 0.000 description 8
- HHXNVASVVVNNDG-UHFFFAOYSA-N 1,2,3,4,5-pentachloro-6-(2,3,6-trichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C(Cl)=C(Cl)C=2Cl)Cl)=C1Cl HHXNVASVVVNNDG-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible printed circuit board and a mobile terminal. A first dielectric layer comprises an un-bent zone and a bent zone arranged at one side of the un-bent zone; the flexible printed circuit board comprises the first dielectric layer, a first circuit layer, a second circuit layer, a first protection layer and a second protection layer; the first circuit layer is provided with a first wiring terminal corresponding to the non-bent zone and a second wiring terminal corresponding to the bent zone and connected with the first wiring terminal; the second circuit layer is used for covering the non-bent zone; a first electric conduction component is arranged between the second circuit layer and the first wiring terminal; therefore, the bent zone of the flexible printed circuit board only depends on the first circuit layer to realize circuit connection; further the flexibility of the flexible printed circuit board in the bent zone can be improved and the conductivity of the flexible printed circuit board can be improved by virtue of the first circuit layer and the second circuit layer.
Description
Technical field
The present invention relates to display screen field, particularly relate to a kind of flexible PCB and mobile terminal.
Background technology
The application of current flexible PCB is more and more extensive, thus it is more and more stricter to the flexibility requirements of flexible PCB, but current many flexible PCBs adopt multilayer wiring structure for meeting multiple electric conductivity, in order to improve the flexible bending part that the conductor wire of multilayer line can be guided to individual layer line layer, but the arrangement of multiple conductor wire is chaotic on individual layer line layer, there is effect of stress each other, thus make the bending part not easily bending of individual layer line layer, and then impact is flexible.
Summary of the invention
In view of this, the invention provides a kind of flexible PCB and the mobile terminal that improve flexibility.
The invention provides a kind of flexible PCB, wherein, described flexible PCB comprises first medium layer, first line layer, second line layer, first protective layer and the second protective layer, the flex area that described first medium layer comprises two non-flex area and is connected between two described non-flex area, described first line layer fits in described first medium layer side, and cover described non-flex area and described flex area, described first line layer is provided with the first line that described non-flex area is oppositely arranged respectively with two, and be provided with the first terminals disconnected mutually respectively with two described first line, described first line layer relatively described flex area place is provided with the first connecting line be connected between two described first line, and be provided with the second connecting line be connected between two described first terminals, described second connecting line and described first connecting line are arranged side by side, and the length direction of the length direction of described first connecting line and described second connecting line is all parallel to the relative direction of two described non-flex area, described second line layer fits in described first medium layer and deviates from described first line layer side, and the described non-flex area of corresponding covering, and be provided with the second circuit, described second circuit and described first terminals are connected with the first electric-conductor through described first medium layer, described first protective layer and described second protective layer all cover described flex area and described non-flex area, described first protective layer fits in described first line layer and deviates from described first medium layer side, described second protective layer fits in described second line layer and deviates from described first medium layer side.
Wherein, described flexible PCB also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described first line layer and described first protective layer; the described non-flex area of corresponding covering; and respectively near described first line layer and described first protective layer, between described tertiary circuit layer and described first line layer, be connected with the second electric-conductor through described second dielectric layer and described first line layer.
Wherein, described flexible PCB also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described first protective layer; the described non-flex area of corresponding covering; and respectively near described tertiary circuit layer and described first protective layer, be connected with between described 4th line layer and described first line layer successively through the 3rd electric-conductor of described tertiary circuit layer, second dielectric layer and first line layer.
Wherein, described flexible PCB also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described second line layer and described second protective layer; the described non-flex area of corresponding covering; and respectively near described second line layer and described second protective layer, be connected with between described 4th line layer and described first line layer successively through the 3rd electric-conductor of described 4th line layer, the 3rd dielectric layer, tertiary circuit layer, second dielectric layer and described first line layer.
Wherein, described flexible PCB also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described second line layer and described second protective layer; the described non-flex area of corresponding covering; and respectively near described second line layer and described second protective layer, be connected with between described tertiary circuit layer and described first line layer successively through the second electric-conductor of described tertiary circuit layer, described second dielectric layer, the second line layer, described first medium layer and described first line layer.
Wherein, described flexible PCB also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described second protective layer; the described non-flex area of corresponding covering; and respectively near described tertiary circuit layer and described second protective layer, be connected with between described 4th line layer and described first line layer successively through the 3rd electric-conductor of described 4th line layer, the 3rd dielectric layer, tertiary circuit layer, described second dielectric layer, the second line layer, first medium layer and first line layer.
Wherein, described first line layer offers at described first terminals place the via hole being through to and described second line layer connecting described second circuit, and described first electric-conductor is fixed in described via hole.
Wherein, described first protective layer and described second protective layer respectively viscose glue to be adhered on described first line layer and on described second line layer.
Wherein, the number of described first connecting line is multiple, and the number of described second connecting line is multiple.
The present invention also provides a kind of mobile terminal, and wherein, described mobile terminal comprises body, is located at flexible PCB described in the mainboard of described body interior and above-mentioned any one, and described flexible PCB is located at described body interior, and is electrically connected with described mainboard.
Flexible PCB of the present invention and mobile terminal, by described first line layer, corresponding described non-flex area place arranges the first terminals, and the second connecting line connecting described first terminals is set at correspondence described flex area place, described second line layer correspondence is utilized to cover described non-flex area, and the first electric-conductor is set between described second circuit and described first terminals, thus make the flex area of described flexible PCB only utilize described first line layer to carry out connection, described second connecting line and described first connecting line are arranged side by side, and the length direction of the length direction of described first connecting line and described second connecting line is all parallel to the relative direction of two described non-flex area, and then mutually there is not effect of stress in described first connecting line and described second connecting line, thus the flexibility of described flexible PCB in flex area is improved.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the flexible PCB of the first embodiment provided by the invention;
Fig. 2 is the vertical view of the first line layer of the flexible PCB of Fig. 1;
Fig. 3 is the schematic diagram of the flexible PCB of the second embodiment;
Fig. 4 is the vertical view of the first line layer of the flexible PCB of Fig. 3;
Fig. 5 is the schematic diagram of the flexible PCB of the 3rd embodiment;
Fig. 6 is the schematic diagram of the flexible PCB of the 4th embodiment;
Fig. 7 is the schematic diagram of the flexible PCB of the 5th embodiment;
Fig. 8 is the schematic diagram of the flexible PCB of the 6th embodiment.
Embodiment
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
Refer to Fig. 1 and Fig. 2, the invention provides a kind of flexible PCB 100 of the first embodiment, described flexible PCB 100 comprises first medium layer 10, first line layer 20, second line layer 30, first protective layer 40 and the second protective layer 50.The flex area 12 that described first medium layer 10 comprises two non-flex area 11 and is connected between two described non-flex area 11.Described first line layer 20 fits in described first medium layer 10 side, and covers described non-flex area 11 and described flex area 12, described first line layer 20 is provided with the first line (not shown) that described non-flex area 11 is oppositely arranged respectively with two, and is provided with the first terminals (not shown) disconnected mutually respectively with two described first line, described first line layer 20 relatively described flex area 12 place is provided with the first connecting line 21 be connected between two described first line, and be provided with the second connecting line 22 being connected to two described first terminals, described second connecting line 22 and described first connecting line 21 are arranged side by side, the length direction of described second connecting line 22 and the length direction of described first connecting line 21 are all parallel to the relative direction of two described non-flex area 11, described second line layer 30 fits in described first medium layer 10 and deviates from described first line layer 20 side, and the described non-flex area 11 of corresponding covering, and be provided with the second circuit (not shown), second circuit of described second line layer 30 and the first terminals of described first line layer 10 are connected with the first electric-conductor 31 through described first medium layer 10.Described first protective layer 40 and described second protective layer 50 all cover described flex area 12 and described non-flex area 11; described first protective layer 40 fits in described first line layer 20 and deviates from described first medium layer 10 side, and described second protective layer 50 fits in described second line layer 30 and deviates from described first medium layer 10 side.
By described first line layer 20, corresponding described non-flex area 11 place arranges the first terminals, and the second connecting line 22 connecting described first terminals is set at correspondence described flex area 12 place, described second line layer 30 correspondence is utilized to cover described non-flex area 11, and the first electric-conductor 31 is set between described second circuit 30 and described first terminals, thus make the flex area 12 of described flexible PCB 100 only utilize described first line layer 20 to carry out connection, thus the flexibility of described flexible PCB 100 in flex area 12 is improved, and make described flexible PCB 100 that described first line layer 20 and described second line layer 20 can be utilized to improve electric conductivity.
In the present embodiment, described first medium layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described first line layer 20 and described second line layer 30 on described first medium layer 10, and described first medium layer 10 can provide insulation environment for described first line layer 20 and described tertiary circuit layer 40, so that the etching of described first line layer 20 and described second line layer 30.Preferably, the thickness of described first medium layer 10 can be 20 μm.Described non-flex area 11 can be that the both sides being positioned at described flex area 12 are oppositely arranged, thus the conducting making described flexible PCB 100 realize between multiple electronic devices and components and multiple electronic devices and components.
In this side's of enforcement example, described first line layer 20 is plate film being arranged Copper Foil, and the first line on described first line layer 20 and the first connecting line 21 are Copper Foil and form through etching technics according to prescribed route structure.Described first line layer and described first connecting line 21 can be wholely set, and described first line layer and described first connecting line 21 form conducting wire, thus realize the conduction between electric elements.Described first terminals disconnect mutually with described first line, described first terminals can be the one end being arranged at the second connecting line 22, thus described first terminals and described first line do not interfere with each other, so that described second connecting line 22 can be other, more electric elements realize conduction connection.Described first connecting line 21 and described second connecting line 22 are arranged in corresponding described flex area 12 place of described first circuit board, thus make the wiring at described first line layer 20 corresponding described flex area 12 place tight, thus reduce the width of the corresponding described flex area 12 of described first line layer 20, thus the bending part width of described flexible PCB 100 is reduced, improve the flexibility of described flexible PCB 100 further.In other embodiments, described first line and described first connecting line 21 also can be made up of the cable of many same alike results, and the number of described first terminals and described second connecting line 22 also can be multiple.
In the present embodiment, described second line layer 30 is plate film being arranged Copper Foil, and the second circuit on described second line layer 30 is that Copper Foil forms through etching technics according to prescribed route structure.Relatively described first terminals in one end of described second circuit are arranged, thus facilitate one end of described second circuit to be electrically connected described first electric-conductor 31, and described first electric-conductor 31 is electrically connected described first terminals away from one end of described second circuit.Described first electric-conductor 31 runs through described second line layer 30, first medium layer 10 and described first line layer 20, thus the second circuit of described second line layer 30 is electrically connected on the second connecting line 22 on described first line layer 20, thus make described first line layer 20 that multiple circuit can be set at correspondence described flex area 12 place, thus improve the conduction switching performance of described flexible PCB 100, and improve the flex capability of described flexible PCB 100.In other embodiments, the number of described second circuit and described first electric-conductor 211 also can be multiple.
In the present embodiment, it is hot-forming that described first protective layer 40 and described second protective layer 50 can adopt polyester material to carry out.Described first protective layer 40 and described second protective layer 50 are pasted on described first line layer 20 and described second line layer 30 respectively by viscose glue.Concrete, described first protective layer 40 fits on described first line layer 20 completely, and the first line covered on described first line layer 20, first connecting line 21 and the second connecting line 22, to protect described first line, the cabling of the first connecting line 21 and the second connecting line 22 is not lost or is damaged, simultaneously, adopt the mode of paste adhesive, also described first protective layer 40 can be made tightr with the connection of described first line layer 20, described first protective layer 40 is prevented to be shifted and cannot to the part first line exposing the first protective layer 40, first connecting line 21 and the second connecting line 22 are protected.Described second protective layer 50 and the identical setting of described first protective layer 40 structure; unlike; described second protective layer 50 is except fitting on described second line layer 30; also fit on the flex area 12 of described first medium layer 10; thus realize better to the sealing of described second circuit, and improve the switching performance of described second circuit.In other embodiments, described first protective layer 40 and described second protective layer 50 can also be adopt spraying plated film mode to carve to be plated on described first line layer 20 and described second line layer 30.
In the present embodiment, described first line layer 20 offers the via hole 20a being through to and described second line layer 30 connecting described second circuit at described first terminals place, and described first electric-conductor 31 is fixed in described via hole 20a.Concrete, described via hole 20a also runs through described first medium layer 10 and described second line layer 30, and described first electric-conductor 31 is the copper post through described via hole 20a.Described first electric-conductor 31 is successively through described first line layer 20, first medium layer 10 and described second line layer 30, and then make the second circuit of described second line layer 30 can be connected to the second connecting line 22 of described first line layer 20, thus ensure that the multi cabling requirement of described flexible PCB 100.
Further; refer to Fig. 3 and Fig. 4; the present invention also provides the flexible PCB 200 of the second embodiment; roughly the same with described flexible PCB 100; second dielectric layer 210 and tertiary circuit layer 230 is also comprised unlike described flexible PCB 200; described second dielectric layer 210 and described tertiary circuit layer 230 are all laminated between described first line layer 20 and described first protective layer 40; the described non-flex area 11 of corresponding covering, and respectively near described first line layer 20 and described first protective layer 40.Described tertiary circuit layer 40 is provided with tertiary circuit (sign), described first line layer 20 relatively described non-flex area 11 place is provided with the second terminals (sign), and relatively described flex area 12 place is provided with the 3rd connecting line 23 of described second terminals of electrical connection, is connected with the second electric-conductor 41 between the second terminals 22 of described first line layer 20 and described tertiary circuit.
Concrete, described second dielectric layer 210 is roughly the same with described first medium layer 10 structure, unlike, described second dielectric layer 210 is the corresponding non-flex area 11 covering described first medium layer 10 only.Described second dielectric layer 210 provides insulation environment for described tertiary circuit layer 230 and described first line layer 20.Described second dielectric layer 210 can be adopt hot press forming technology to fit on described first line layer 20.Described tertiary circuit layer 230 is the corresponding non-flex area 11 covering described first medium layer 10 only, and the tertiary circuit on described tertiary circuit layer 230 can connect different electronic devices and components respectively from the first line on described first line layer 20.Second terminals 22 of described first line layer 20 are electrically connected described tertiary circuit by described second electric-conductor 41, thus make described tertiary circuit be electrically connected on described 3rd connecting line 23, and then ensure that described flexible PCB 100 can connect more polyelectron components and parts further, put on electric conductivity, make described flexible PCB 100 can only utilize described first line layer 20 cabling by bending part simultaneously, thus described flexible PCB 100 is improved in the flexibility of bending part.Described 3rd connecting line 23 is arranged side by side with described second connecting line 22 and described first connecting line 21, and extends in the same way, thus reduces flex area 12 width of described flexible PCB 200, thus the bending improving described flexible PCB 200 is flexible.Described second electric-conductor 41 and the identical setting of described first electric-conductor 31 structure, described tertiary circuit layer 230, second dielectric layer 210 and first line layer 20 arrange the via hole (sign) connected, described two electric-conductors 41 are arranged in described via hole, described second electric-conductor 41 is successively through described tertiary circuit layer 230, second dielectric layer 210 and first line layer 20, and described second electric-conductor 41 disconnects with described first electric-conductor 31 phase, thus ensure that the conduction property of described flexible PCB 100.
Further; refer to Fig. 5; the present invention also provides the flexible PCB 300 of the 3rd embodiment; roughly the same with described flexible PCB 200; the 3rd dielectric layer 310 and the 4th line layer 340 is also comprised unlike described flexible PCB 300; described 3rd dielectric layer 310 and described 4th line layer 340 are all laminated between described tertiary circuit layer 230 and described first protective layer 40; the described non-flex area 11 of corresponding covering, and respectively near described tertiary circuit layer 230 and described first protective layer 40.Described 4th line layer 340 is provided with the 4th circuit (sign), described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd terminals (not shown), and relatively described flex area 12 place is provided with the 3rd connecting line being electrically connected described 3rd terminals 23, between the 3rd terminals of described first line layer 20 and described 4th circuit, connect the 3rd electric-conductor 51.
Concrete, described 3rd dielectric layer 310 and the identical setting of described second dielectric layer 210 structure, described 3rd dielectric layer 310 is hot-forming between described three line layers 230 and described 4th line layer 340.Described 4th line layer 340 fits between described 3rd dielectric layer 310 and described first protective layer 40.4th circuit of described 4th line layer 340 is connected to the 3rd connecting line on described first line layer 20 through described 3rd electric-conductor 51, thus make described flexible PCB 100 can connect more electronic devices and components further, thus improve the serviceability of described flexible PCB 100, and individual layer line layer still can be set carry out cabling by bending part of described flexible PCB 100, ensure the flexibility of described flexible PCB 100.Described 3rd electric-conductor 51 and the identical setting of described second electric-conductor 41 structure, described 3rd electric-conductor 51 is successively through described 4th line layer 340, the 3rd dielectric layer 310, tertiary circuit layer 230, second dielectric layer 210 and described first line layer 20.
Further, refer to Fig. 6, the present invention also provides the flexible PCB 400 of the 4th embodiment, roughly the same with described flexible PCB 300, unlike, described 3rd dielectric layer 410 and described 4th line layer 440 are all laminated between described second line layer 30 and described second protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described second line layer 30 and described second protective layer 50, described 4th line layer 440 is provided with the 4th circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd terminals 423, and relatively described flex area 12 place is provided with the 3rd connecting line being electrically connected described 3rd terminals 423, the 3rd electric-conductor 451 is connected with between 3rd terminals 423 of described first line layer 20 and described 4th circuit.Described 3rd electric-conductor 451 and the identical setting of described second electric-conductor 41 structure, described 3rd electric-conductor 451 is successively through described 4th line layer 440, the 3rd dielectric layer 410, second line layer 30, first medium layer 10 and described first line layer 20.Described 3rd dielectric layer 410 and described 4th line layer 440 are arranged between described second line layer 30 and described second protective layer 50; make the both sides of described first medium layer 10 that the line layer of the identical number of plies is set; thus make the consistency of thickness of described first medium layer 10 both sides; thus described flexible PCB 100 is increased in non-flex area place connected mode, improve the using function of described flexible PCB 100.
Further, refer to Fig. 7, the present invention also provides the flexible PCB 500 of the 5th embodiment, roughly the same with described flexible PCB 200, unlike, described second dielectric layer 510 and described tertiary circuit 530 layers are all laminated between described second line layer 30 and described second protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described second line layer 30 and described second protective layer 50, described tertiary circuit layer 530 is provided with tertiary circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the second terminals (sign), and relatively described flex area 12 place is provided with the 3rd connecting line of described second terminals of electrical connection, the second electric-conductor 541 is connected with between second terminals of described first line layer 20 and described tertiary circuit.Described second electric-conductor 541 is successively through described tertiary circuit layer 530, described second dielectric layer 510 second line layer 30, described first medium layer 10 and described first line layer 20.
Further, refer to Fig. 8, the present invention also provides the flexible PCB 600 of the 5th embodiment, roughly the same with described flexible PCB 300, unlike, described 3rd dielectric layer 610 and described 4th line layer 640 are all laminated between described tertiary circuit layer 630 and described second protective layer 50, the described non-flex area 11 of corresponding covering, and respectively near described tertiary circuit layer 630 and described second protective layer 50, described 4th line layer 640 is provided with the 4th circuit, described first line layer 20 relatively described non-flex area 11 place is provided with the 3rd terminals (sign), and relatively described flex area 12 place is provided with the 3rd connecting line being electrically connected described 3rd terminals, the 3rd electric-conductor 61 is connected between 3rd terminals of described first line layer 20 and described 4th circuit.Described 3rd electric-conductor 61 is successively through described 4th line layer 640, the 3rd dielectric layer 610, tertiary circuit layer 630, described second dielectric layer 610, second line layer 30, described first medium layer 10 and described first line layer 20.
The present invention also provides a kind of mobile terminal (not shown), described mobile terminal comprises body (not shown), is located at the mainboard (not shown) of described body interior and described flexible PCB 100, described flexible PCB 100 is located at described body interior, and is electrically connected with described mainboard.Described mobile terminal can be mobile phone, computer, flat board, handheld device or media player etc.
Flexible PCB of the present invention and mobile terminal, by described first line layer, corresponding described non-flex area place arranges the first terminals, and the second connecting line connecting described first terminals is set at correspondence described flex area place, described second line layer correspondence is utilized to cover described non-flex area, and the first electric-conductor is set between described second circuit and described first terminals, thus make the flex area of described flexible PCB only utilize described first line layer to carry out connection, thus the flexibility of described flexible PCB in flex area is improved, and make described flexible PCB that described first line layer and described second line layer can be utilized to improve electric conductivity.
Be more than the preferred embodiment of the present invention, it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention, can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a flexible PCB, it is characterized in that, described flexible PCB comprises first medium layer, first line layer, second line layer, first protective layer and the second protective layer, the flex area that described first medium layer comprises two non-flex area and is connected between two described non-flex area, described first line layer fits in described first medium layer side, and cover described non-flex area and described flex area, described first line layer is provided with the first line that described non-flex area is oppositely arranged respectively with two, and be provided with the first terminals disconnected mutually respectively with two described first line, described first line layer relatively described flex area place is provided with the first connecting line be connected between two described first line, and be provided with the second connecting line be connected between two described first terminals, described second connecting line and described first connecting line are arranged side by side, and the length direction of the length direction of described first connecting line and described second connecting line is all parallel to the relative direction of two described non-flex area, described second line layer fits in described first medium layer and deviates from described first line layer side, and the described non-flex area of corresponding covering, and be provided with the second circuit, described second circuit and described first terminals are connected with the first electric-conductor through described first medium layer, described first protective layer and described second protective layer all cover described flex area and described non-flex area, described first protective layer fits in described first line layer and deviates from described first medium layer side, described second protective layer fits in described second line layer and deviates from described first medium layer side.
2. flexible PCB according to claim 1; it is characterized in that; described flexible PCB also comprises second dielectric layer and tertiary circuit layer; described second dielectric layer and described tertiary circuit layer are all laminated between described first line layer and described first protective layer; the described non-flex area of corresponding covering; and respectively near described first line layer and described first protective layer, between described tertiary circuit layer and described first line layer, be connected with the second electric-conductor through described second dielectric layer and described first line layer.
3. flexible PCB according to claim 2; it is characterized in that; described flexible PCB also comprises the 3rd dielectric layer and the 4th line layer; described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described first protective layer; the described non-flex area of corresponding covering; and respectively near described tertiary circuit layer and described first protective layer, be connected with between described 4th line layer and described first line layer successively through the 3rd electric-conductor of described tertiary circuit layer, second dielectric layer and first line layer.
4. flexible PCB according to claim 2, it is characterized in that, described flexible PCB also comprises the 3rd dielectric layer and the 4th line layer, described 3rd dielectric layer and described 4th line layer are all laminated between described second line layer and described second protective layer, the described non-flex area of corresponding covering, and respectively near described second line layer and described second protective layer, be connected with successively through described 4th line layer between described 4th line layer and described first line layer, 3rd dielectric layer, tertiary circuit layer, 3rd electric-conductor of second dielectric layer and described first line layer.
5. flexible PCB according to claim 1, it is characterized in that, described flexible PCB also comprises second dielectric layer and tertiary circuit layer, described second dielectric layer and described tertiary circuit layer are all laminated between described second line layer and described second protective layer, the described non-flex area of corresponding covering, and respectively near described second line layer and described second protective layer, be connected with successively through described tertiary circuit layer between described tertiary circuit layer and described first line layer, described second dielectric layer, second line layer, second electric-conductor of described first medium layer and described first line layer.
6. flexible PCB according to claim 5, it is characterized in that, described flexible PCB also comprises the 3rd dielectric layer and the 4th line layer, described 3rd dielectric layer and described 4th line layer are all laminated between described tertiary circuit layer and described second protective layer, the described non-flex area of corresponding covering, and respectively near described tertiary circuit layer and described second protective layer, be connected with successively through described 4th line layer between described 4th line layer and described first line layer, 3rd dielectric layer, tertiary circuit layer, described second dielectric layer, second line layer, 3rd electric-conductor of first medium layer and first line layer.
7. flexible PCB according to claim 1, is characterized in that, described first line layer offers at described first terminals place the via hole being through to and described second line layer connecting described second circuit, and described first electric-conductor is fixed in described via hole.
8. flexible PCB according to claim 1, is characterized in that, described first protective layer and described second protective layer respectively viscose glue are adhered on described first line layer with on described second line layer.
9. flexible PCB according to claim 1, is characterized in that, the number of described first connecting line is multiple, and the number of described second connecting line is multiple.
10. a mobile terminal, it is characterized in that, described mobile terminal comprises body, is located at the mainboard of described body interior and flexible PCB as described in claim 1 ~ 9 any one, and described flexible PCB is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030170.5A CN105578724B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511030170.5A CN105578724B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB and mobile terminal |
Publications (2)
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| CN105578724B CN105578724B (en) | 2018-09-04 |
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| CN201511030170.5A Expired - Fee Related CN105578724B (en) | 2015-12-29 | 2015-12-29 | Flexible PCB and mobile terminal |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109548277A (en) * | 2018-12-29 | 2019-03-29 | 万奔电子科技股份有限公司 | A kind of bend-resistance flexible circuitry soft board and preparation method thereof |
| CN113597084A (en) * | 2020-04-30 | 2021-11-02 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
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| CN101400219A (en) * | 2007-09-27 | 2009-04-01 | 夏普株式会社 | Multilayer printed wiring board and method for fabrication thereof |
| CN101616537A (en) * | 2008-06-26 | 2009-12-30 | 胜华科技股份有限公司 | Part welding pad wiring structure of flexible printed circuit board |
| US20140158408A1 (en) * | 2012-12-10 | 2014-06-12 | Fujikura Ltd. | Multi-layer wiring board and method of manufacturing the same |
| CN204721708U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of two-layer printed circuit board of resistance to bending |
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| CN101400219A (en) * | 2007-09-27 | 2009-04-01 | 夏普株式会社 | Multilayer printed wiring board and method for fabrication thereof |
| CN101616537A (en) * | 2008-06-26 | 2009-12-30 | 胜华科技股份有限公司 | Part welding pad wiring structure of flexible printed circuit board |
| US20140158408A1 (en) * | 2012-12-10 | 2014-06-12 | Fujikura Ltd. | Multi-layer wiring board and method of manufacturing the same |
| CN204721708U (en) * | 2015-05-07 | 2015-10-21 | 深圳市星之光实业发展有限公司 | A kind of two-layer printed circuit board of resistance to bending |
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| CN109548277A (en) * | 2018-12-29 | 2019-03-29 | 万奔电子科技股份有限公司 | A kind of bend-resistance flexible circuitry soft board and preparation method thereof |
| CN113597084A (en) * | 2020-04-30 | 2021-11-02 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN113597084B (en) * | 2020-04-30 | 2022-08-19 | 鹏鼎控股(深圳)股份有限公司 | Flexible circuit board and manufacturing method thereof |
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| CN105578724B (en) | 2018-09-04 |
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