CN105407631A - Flexible circuit board laminated structure and mobile terminal - Google Patents
Flexible circuit board laminated structure and mobile terminal Download PDFInfo
- Publication number
- CN105407631A CN105407631A CN201511025226.8A CN201511025226A CN105407631A CN 105407631 A CN105407631 A CN 105407631A CN 201511025226 A CN201511025226 A CN 201511025226A CN 105407631 A CN105407631 A CN 105407631A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- circuit board
- laminated structure
- flexible circuit
- foil layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a flexible circuit board laminated structure and a mobile terminal. The flexible circuit board laminated structure includes a substrate layer, a copper foil layer, a covering film and a shielding film; the copper foil layer is arranged on the substrate; the covering film is stacked on the copper foil layer; at least one through window is formed in the covering film; the at least one through window is communicated with the copper foil layer; the shielding film is stacked arranged on the covering film; and the shielding film is connected with the copper foil layer through the at least one through window. According to the flexible circuit board laminated structure provided by the invention, the shielding film is attached to the upper part of the covering film, and by means of the through windows in the covering film, the shielding film can be connected with the copper foil layer, so that the shielding film can be grounded, and therefore, a reference loop can be provided for wiring having impedance control requirements, and the impedance signals of a signal line can be more continuous; since the shielding film is attached directly to the upper part of the covering film, an attaching process is simple, and operation can be facilitated, and therefore, processing cost can be reduced; and a mode in which the upper part of a covering film is coated with silver slurry in the prior art can be replaced, and the problem of poor continuity of impedance signals cased by unevenness of the coating of the silver slurry can be solved.
Description
Technical field
The present invention relates to the communications field, particularly relate to a kind of flexible circuit board laminated structure and mobile terminal.
Background technology
Along with the development of electronic technology, operating frequency, the transmission rate of mobile terminal (as smart mobile phone etc.) are more and more higher, when adopting the interface protocol such as mobile Industry Processor Interface (MobileIndustryProcessorInterfaceMIPI) or mobile display digital interface (MobileDisplayDigitalInterfaceMDDI), the resistance requirements of its differential transfer to cabling controls in certain limit, and this just requires differential transfer to signal to the reference planes that should have one deck.
In existing technology, in order to realize the cabling resistance requirements of above-mentioned interface, the Copper Foil increasing one deck or two layers can be adopted as the reference planes of circuit when single-layer-flex circuit (FlexiblePrintedCircuitFPC) designs.But employing aforesaid way, cost can be multiplied, and increases the Copper Foil number of plies simultaneously and the thickness of FPC can be made to increase, cause the bending performance of FPC greatly to reduce, and reduces FPC and bends the times influence life-span of product; If but do not make reference plane in bent area, cannot resistance requirements be met, reduce properties of product.Although the way that more existing employings directly apply one deck silver slurry layer on the Copper Foil of flexible PCB at present substitutes the mode increasing the above-mentioned Copper Foil number of plies and increase; But, higher to technological requirement owing to directly applying silver slurry layer on Copper Foil, the coating uniformity of silver slurry layer need be ensured when applying, being coated with the uneven impedance continuity that easily causes is bad; In addition, because silver slurry layer is easily oxidized, therefore, also need to arrange layer protecting film above silver slurry layer, while operation is comparatively complicated, processing cost is corresponding increase also, so be unfavorable for producing and controlling cost.
Summary of the invention
Embodiment of the present invention technical problem to be solved is, provides a kind of and is convenient to process and the lower flexible circuit board laminated structure of processing cost and mobile terminal.
To achieve these goals, embodiment of the present invention provides following technical scheme:
First aspect, the invention provides a kind of flexible circuit board laminated structure, described flexible PCB laminated construction comprises substrate layer, copper foil layer, coverlay and screened film, described copper foil layer is located on described base material, described coverlay is stacked on described copper foil layer, described coverlay is provided with at least one logical window, at least one logical window described is communicated to described Copper Foil, described screened film is stacked on described coverlay, and described screened film is electrically connected by least one logical window described and described copper foil layer.
In conjunction with first aspect, in the first possible implementation of first aspect, described copper foil layer comprises cabling district, the complete coated described cabling district of described coverlay, and described at least one, logical window is opened in the position in the corresponding described cabling district of described coverlay, and described screened film is connected to described cabling district by least one logical window described.
In conjunction with the first possible implementation of first aspect, in the implementation that the second of first aspect is possible, described copper foil layer also comprises access area, and described coverlay exposes described access area, described screened film extends to described access area by described coverlay, and is connected with described access area.
In conjunction with first aspect, in the third possible implementation of first aspect, described screened film by paste adhesive on described coverlay.
In conjunction with first aspect, in the 4th kind of possible implementation of first aspect, described coverlay by paste adhesive on described copper foil layer, on described viscose glue, corresponding at least one logical window position described is provided with at least one opening, and at least one opening described is communicated with at least one logical window described.
In conjunction with the 4th kind of possible implementation of first aspect, in the 5th kind of possible implementation of first aspect, the area of at least one logical window described and at least one opening described is all greater than 0.8mm
2.
In conjunction with first aspect, in the 6th kind of possible implementation of first aspect, described screened film is the metal mixture of argentiferous, and described screened film is connected on described copper foil layer by conducting resinl.
In conjunction with first aspect, in the 7th kind of possible implementation of first aspect, described screened film is emi shielding film.
In conjunction with first aspect, in the 8th kind of possible implementation of first aspect, the thickness of described screened film is 12 μm ~ 25 μm.
Second aspect, present invention also offers a kind of mobile terminal, described mobile terminal comprises body, is located at the mainboard of described body interior and flexible circuit board laminated structure as above-mentioned in first aspect, and described flexible circuit board laminated structure is located at described body interior, and is electrically connected with described mainboard.
Flexible circuit board laminated structure provided by the invention by being sticked one deck screened film above coverlay, and the screened film utilizing the logical window on coverlay to be can be connected on copper foil layer, thus the object making screened film ground connection can be reached, the cabling required for having impedance Control provides reference loop, makes the control that is more continuous and impedance of the impedance signal of holding wire more stable.Because screened film is directly sticked above coverlay; therefore the technique that is sticked is simple; convenient operation; cut down finished cost, instead of existing employing and apply silver slurry layer above coverlay, avoid and easily occur the uneven problem causing impedance signal continuity bad of silver slurry layer coating; simultaneously because screened film is not easy oxidized; so without the need to arranging protective layer on screened film, reduce manufacturing procedure further, cut down finished cost.
Mobile terminal provided by the invention, body interior is located at by flexible circuit board laminated structure, and be electrically connected with mainboard, due to the shielding character of screened film that flexible circuit board laminated structure is arranged, thus the interference of external radiation signal and the interference of electrostatic can be prevented, ensure the signal continuity on flexible circuit board laminated structure and mainboard, and then ensure the normal use of mobile terminal.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the flexible circuit board laminated structure that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, a kind of mobile terminal that the embodiment of the present invention provides, comprise body (not indicating in figure), be located at the mainboard (not indicating in figure) of described body interior and flexible circuit board laminated structure 100, described flexible circuit board laminated structure 100 is located at described body interior, and is electrically connected with described mainboard.
Described mobile terminal can be the intelligent mobile terminals such as mobile phone, computer, flat board, handheld device or media player.In the present embodiment, for described mobile terminal for mobile phone is described.
Described flexible circuit board laminated structure 100 comprises substrate layer 10, copper foil layer 20, coverlay 30 and screened film 40.Described copper foil layer 20 is located on described base material 10, is particularly stacked on a surface of described base material 10.Described coverlay 30 is stacked on described copper foil layer 20, described coverlay 30 is provided with at least one logical window 31, and at least one logical window 31 described is communicated to described copper foil layer 20.Described screened film 40 is stacked on described coverlay 30, and described screened film 40 is electrically connected with described copper foil layer 20 by least one logical window 31 described.
The flexible circuit board laminated structure 100 that the embodiment of the present invention provides by being sticked one deck screened film 40 above described coverlay 30, screened film 40 is utilized to be connected on copper foil layer 20 by least one logical window 31 described on coverlay 30, thus form signal with reference to ground, make the impedance environment of holding wire continuous, and then make the control of impedance more stable.Adopting the way of described screened film 40, making flexible circuit board laminated structure without the need to increasing unnecessary copper foil layer, or on coverlay brushing silver slurry layer, make the processing of flexible circuit board laminated structure more simple, operation is more succinct, and convenient operation is processed, and then can cut down finished cost.
Specifically, described base material 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that when arranging described copper foil layer 20 on described base material 10, insulation environment can be provided, so that the etching of described copper foil layer 20.Preferably, the thickness of described base material 10 can be 20 μm.
Described copper foil layer 20 comprises cabling district (not indicating in figure), and the complete coated described cabling district of described coverlay 30, is not lost to protect described copper foil layer 20 or damage.In the present embodiment, described cabling district is located at described base material 10 surface, and particularly, described cabling district can be positioned at center or the edge of described copper foil layer 20.When described cabling district is positioned at the center of described copper foil layer 20, at least one logical window 31 described is opened in the position in the corresponding described cabling district of described coverlay 30, so that follow-up described screened film 40 can be connected to described cabling by least one logical window 31 described.
Further, described copper foil layer 20 also comprises access area (not indicating in figure).Described access area can be positioned at center or the edge of described copper foil layer 20.When described access area is positioned at the marginal position of described copper foil layer 20, described coverlay 30 exposes described access area, described screened film 40 extends to described access area by described coverlay 30, and be connected with described access area, thus described screened film 40 is connected with ground (GND) network on described copper foil layer 20 or electric power network, make described screened film 40 as circuit reference planes, can realize the impedance Control of signal lead described in differential pair.
Described coverlay 30 is pasted on described copper foil layer 20 by viscose glue 50.In the present embodiment; described coverlay 30 is attached in the cabling district of described copper foil layer 20 by described viscose glue 50; do not lost to protect the cabling in described cabling district or damaged; simultaneously; adopt the mode of paste adhesive; also described coverlay 30 can be made tightr with the connection in described cabling district, prevent described coverlay 30 be shifted and cannot protect the described cabling district 21 of part.
Further, at least one logical window 31 described is for being opened in the square aperture on described coverlay 30, and the area of at least one logical window 31 described is greater than 0.8mm
2, to ensure that described screened film 40 can be connected to described cabling district 21 by least one logical window 31 described.Preferably, the area of at least one logical window 31 described is 10mm
2, thus while the covering protection effect ensureing described coverlay 30, can also ensure the connection in described screened film 40 and described cabling district.Be understandable that, in other embodiments, at least one logical window 31 described also can be the opening of other shapes, as U-shaped or circle etc.The area of at least one logical window 31 described also can be selected according to reality processing adjustment.
On described viscose glue 50, corresponding at least one logical window 31 position described is provided with at least one opening 51, and at least one opening 51 described is communicated with at least one logical window 31 described.In the present embodiment, because described viscose glue 50 is located between described copper foil layer 20 and described coverlay 30, when offering at least one logical window 31 described on described coverlay 30, so that when the described screened film 40 be positioned on described coverlay 30 can be connected with described copper foil layer 20 by least one logical window 31 described, the insulating effect had to prevent described viscose glue 50 and stop the connection of described screened film 40 and described copper foil layer 20, corresponding at least one the logical window 31 described of described viscose glue 50 offers at least one opening 51 described, so that the connection of described screened film 40 and described copper foil layer 20.Preferably, at least one opening 51 described is the square aperture matched with at least one logical window 31 described, and the area of at least one opening 51 described is consistent with the area of at least one logical window 31 described, is all greater than 0.8mm
2, and further preferably, the area of at least one opening 51 described is 1mm
2.Be understandable that, the opening shape of at least one opening 51 described and aperture area all can adjust by corresponding at least one logical window 31 described.
In the present embodiment, described screened film 40 is the metal mixture of argentiferous, thus make when described screened film 40 is connected with described copper foil layer 20 by least one logical window 31 described, described screened film 40 can be formed with reference to ground with the zone network on described copper foil layer 20 or electric power network, thus makes the impedance of signal lead thereon controlled more continuously.In addition, described screened film 40 is electromagnetic interference (EMI) screened film, thus external radiation signal can be prevented while the interference of signal lead, also external electrostatic can be produced and lead on described copper foil layer 20, thus prevent electrostatic further.Meanwhile, in order to ensure the anti-tampering characteristic of described screened film 40 further and reduce the integral thickness of described flexible circuit board laminated structure 100, the thickness of described screened film 40 is preferably 12 μm ~ 25 μm.Be understandable that, in other embodiments, the thickness of described screened film 40 also can select adjustment according to actual processing.
In order to be convenient to assembling further, described screened film 40 is pasted on described coverlay 30 by viscose glue 60.Adopting aforesaid way, making described screened film 40 more easy when being attached at described coverlay 30, instead of the uneven and discontinuous problem of signal lead that is that cause of the existing employing brushing that brushing silver slurry layer likely occurs on described coverlay 30.Meanwhile, owing to adopting in the method for paste, make processing staff to add man-hour more easy, operation is also more simple, is convenient to processing staff's operation.In addition, due to the noiseproof feature of screened film 40, so without the need to the layer protective layer that is sticked again on screened film 40, while reducing manufacturing procedure further, processing cost is also reduced.
Further, described screened film 40 is connected on described copper foil layer 20 by conducting resinl 70, connects to realize conduction.Described conducting resinl 70 is located at least one logical window 31 described and opening 51 described at least one, to realize connecting.Preferably, described conducting resinl 70 can be anisotropic conductive (AnisotropicConductiveFilmACF).
Flexible circuit board laminated structure provided by the invention by being sticked one deck screened film above coverlay, and the screened film utilizing the logical window on coverlay to be can be connected on copper foil layer, thus the object making screened film ground connection can be reached, the cabling required for having impedance Control provides reference loop, makes the control that is more continuous and impedance of the impedance signal of holding wire more stable.Because screened film is directly sticked above coverlay; therefore the technique that is sticked is simple; convenient operation; cut down finished cost, instead of existing employing and apply silver slurry layer above coverlay, avoid and easily occur the uneven problem causing impedance signal continuity bad of silver slurry layer coating; simultaneously because screened film is not easy oxidized; so without the need to arranging protective layer on screened film, reduce manufacturing procedure further, cut down finished cost.
Mobile terminal provided by the invention, body interior is located at by flexible circuit board laminated structure, and be electrically connected with mainboard, due to the shielding character of screened film that flexible circuit board laminated structure is arranged, thus the interference of external radiation signal and the interference of electrostatic can be prevented, ensure the signal continuity on flexible circuit board laminated structure and mainboard, and then ensure the normal use of mobile terminal.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a flexible circuit board laminated structure, it is characterized in that: described flexible PCB laminated construction comprises substrate layer, copper foil layer, coverlay and screened film, described copper foil layer is located on described base material, described coverlay is stacked on described copper foil layer, described coverlay is provided with at least one logical window, at least one logical window described is communicated to described copper foil layer, and described screened film is stacked on described coverlay, and described screened film is electrically connected by least one logical window described and described copper foil layer.
2. flexible circuit board laminated structure as claimed in claim 1, it is characterized in that: described copper foil layer comprises cabling district, the complete coated described cabling district of described coverlay, and described at least one, logical window is opened in the position in the corresponding described cabling district of described coverlay, and described screened film is connected to described cabling district by least one logical window described.
3. flexible circuit board laminated structure as claimed in claim 2, it is characterized in that: described copper foil layer also comprises access area, described coverlay exposes described access area, and described screened film extends to described access area by described coverlay, and is connected with described access area.
4. flexible circuit board laminated structure as claimed in claim 1, is characterized in that: described screened film by paste adhesive on described coverlay.
5. flexible circuit board laminated structure as claimed in claim 1, it is characterized in that: described coverlay by paste adhesive on described copper foil layer, on described viscose glue, corresponding at least one logical window position described is provided with at least one opening, and at least one opening described is communicated with at least one logical window described.
6. flexible circuit board laminated structure as claimed in claim 5, is characterized in that: the area of at least one logical window described and at least one opening described is all greater than 0.8mm
2.
7. flexible circuit board laminated structure as claimed in claim 1, is characterized in that: described screened film is the metal mixture of argentiferous, and described screened film is connected on described copper foil layer by conducting resinl.
8. flexible circuit board laminated structure as claimed in claim 1, is characterized in that: described screened film is emi shielding film.
9. flexible circuit board laminated structure as claimed in claim 1, is characterized in that: the thickness of described screened film is 12 μm ~ 25 μm.
10. a mobile terminal, it is characterized in that: described mobile terminal comprises body, is located at the mainboard of described body interior and flexible circuit board laminated structure as described in claim 1 ~ 9 any one, described flexible circuit board laminated structure is located at described body interior, and is electrically connected with described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025226.8A CN105407631A (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board laminated structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511025226.8A CN105407631A (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board laminated structure and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105407631A true CN105407631A (en) | 2016-03-16 |
Family
ID=55472804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511025226.8A Pending CN105407631A (en) | 2015-12-29 | 2015-12-29 | Flexible circuit board laminated structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105407631A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN108765628A (en) * | 2018-05-04 | 2018-11-06 | 深圳佰维存储科技股份有限公司 | Black box |
| CN109275263A (en) * | 2018-11-23 | 2019-01-25 | 威创集团股份有限公司 | A kind of preparation method and FPC plate of FPC plate |
| CN110942723A (en) * | 2019-11-29 | 2020-03-31 | 武汉华星光电技术有限公司 | Display device and manufacturing method thereof |
| CN111651089A (en) * | 2020-06-16 | 2020-09-11 | 京东方科技集团股份有限公司 | Touch panel, manufacturing method thereof and display device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104113992A (en) * | 2013-04-16 | 2014-10-22 | 富葵精密组件(深圳)有限公司 | Double-sided flexible circuit board possessing shielding structure and method for manufacturing same |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN204906843U (en) * | 2015-07-27 | 2015-12-23 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board |
-
2015
- 2015-12-29 CN CN201511025226.8A patent/CN105407631A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104113992A (en) * | 2013-04-16 | 2014-10-22 | 富葵精密组件(深圳)有限公司 | Double-sided flexible circuit board possessing shielding structure and method for manufacturing same |
| CN104754855A (en) * | 2013-12-31 | 2015-07-01 | 富葵精密组件(深圳)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN204906843U (en) * | 2015-07-27 | 2015-12-23 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108738226A (en) * | 2018-05-04 | 2018-11-02 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN108765628A (en) * | 2018-05-04 | 2018-11-06 | 深圳佰维存储科技股份有限公司 | Black box |
| CN108738226B (en) * | 2018-05-04 | 2020-11-13 | 华显光电技术（惠州）有限公司 | Flexible circuit board structure, backlight assembly and mobile terminal |
| CN109275263A (en) * | 2018-11-23 | 2019-01-25 | 威创集团股份有限公司 | A kind of preparation method and FPC plate of FPC plate |
| CN110942723A (en) * | 2019-11-29 | 2020-03-31 | 武汉华星光电技术有限公司 | Display device and manufacturing method thereof |
| CN111651089A (en) * | 2020-06-16 | 2020-09-11 | 京东方科技集团股份有限公司 | Touch panel, manufacturing method thereof and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105407631A (en) | Flexible circuit board laminated structure and mobile terminal | |
| JP4468464B2 (en) | Flexible printed wiring board and electronic device | |
| TWI610614B (en) | Flexible flat cable | |
| KR20140130368A (en) | Flexible printed circuit board and Manufacturing method Thereof | |
| JP2013051387A (en) | Electronic circuit board | |
| JP2011014656A (en) | Electronic apparatus and flexible printed wiring board | |
| JP7307819B2 (en) | terminal | |
| CN108633165B (en) | Signal anti-attenuation shielding structure of flexible circuit board | |
| WO2022045084A1 (en) | Transparent antenna and display module | |
| CN105657958B (en) | Mobile terminal, flexible PCB and its manufacturing method | |
| WO2021208325A1 (en) | Transparent coil board and manufacturing method therefor, transparent electromagnetic induction board and display device | |
| TWI573498B (en) | The flattened cladding structure of soft circuit board | |
| CN101924270B (en) | Wireless communication device and portable electronic device using same | |
| CN105430878A (en) | Flexible circuit board and mobile terminal | |
| CN215819295U (en) | Array substrate, display panel and terminal | |
| CN105430883B (en) | Flexible PCB and mobile terminal | |
| KR20200129341A (en) | Flexible cable | |
| CN113179578B (en) | Stacked FPC board and mobile phone | |
| CN206212422U (en) | High-frequency transmission line | |
| JP4772919B2 (en) | Flexible printed wiring board | |
| CN105578724B (en) | Flexible PCB and mobile terminal | |
| JP2007048639A (en) | Coaxial cable finished goods | |
| CN111212514B (en) | Conductive line structure including conductive resin layer | |
| CN210247138U (en) | Printed circuit board structure and terminal equipment | |
| CN105430880A (en) | Flexible circuit board and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160316 |