CN105578753A - Rigid-flex board and manufacturing method thereof - Google Patents
Rigid-flex board and manufacturing method thereof Download PDFInfo
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- CN105578753A CN105578753A CN201610105194.0A CN201610105194A CN105578753A CN 105578753 A CN105578753 A CN 105578753A CN 201610105194 A CN201610105194 A CN 201610105194A CN 105578753 A CN105578753 A CN 105578753A
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- layer
- flexible substrate
- copper foil
- coverlay
- substrate layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0221—Perforating
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a rigid-flex board and a manufacturing method thereof. The rigid-flex board comprises a flexible substrate layer, copper foil layers overlapped on the flexible substrate layer, covering films attached to the copper foil layers, rigid layers overlapped on the covering films and circuit layers overlapped on the rigid layers, wherein each circuit layer is provided with an open window passing through the flexible substrate layer to divide the circuit layer into two oppositely-arranged parts; part of the flexible substrate layer is exposed in the open window; and the flexible substrate layer is connected between two parts of the circuit layer. According to the rigid-flex board and the manufacturing method thereof provided by the embodiment of the invention, through arranging the open window passing through the flexible substrate layer in the circuit layer and using the part exposed in the open window of the flexible substrate layer to connect the two parts of the circuit layer, when board dividing needs to be carried out on the rigid-flex board, a punching die only needs to be adopted to cut off the part, exposed in the open window, of the flexible substrate layer to realize board dividing, the phenomenon that the punching die is likely to be damaged due to cutoff of multiple layers of rigid material can be avoided, and the service life of the punching die is improved.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of Rigid Flex and preparation method thereof.
Background technology
Rigid Flex makes its application more and more extensive because it has the character of soft board and hardboard simultaneously.
At present, when making Rigid Flex, normally producing soft board and hardboard respectively, and then soft board is connected with hardboard pressing.Owing to adopting in this way, dowel between rigid-flex with technique edges is that the mode directly extended with hardboard part is connected, follow-up when carrying out point plate, owing to dowel being covered with hardboard and soft board, therefore, the hardboard dividing board mold to need die-cut multilayer and soft board could be shaping.Because the hardness of hardboard is higher, therefore, when die-cut, it is impaired that multiple-layer stacked soft board together and hardboard carry out the die-cut die cutting die that likely makes, and then affect the life in application of die cutting die.
Summary of the invention
In view of this, the invention provides one and prevent die cutting die impaired, improve the Rigid Flex in the useful life of die cutting die and preparation method thereof.
First aspect, the invention provides a kind of Rigid Flex, described Rigid Flex comprises flexible substrate layer, be laminated in the copper foil layer in described flexible substrate layer, be attached at the coverlay on described copper foil layer, the line layer being laminated in the hard layer on described coverlay and being stacked on described hard layer, described line layer offers through windowing to described flexible substrate layer, described line layer to be divided into the two parts be oppositely arranged, described flexible substrate layer Partial exposure is windowed in described, and the part of windowing described in described flexible substrate layer is exposed to is connected between two parts of described line layer.
Wherein, two parts of described line layer are respectively Part I and Part II, described Part I offers the through ground hole to described copper foil layer, described Part II is provided with technique edges.
Wherein, the inwall of described ground hole has been sticked electromagnetic shielding film.
Wherein, described copper foil layer is two-layer, be respectively the first copper foil layer and the second copper foil layer of being located at the relative both sides of described flexible substrate layer, described coverlay is two-layer, be respectively the first coverlay and the second coverlay, described first coverlay is attached at described first copper foil layer, and described second coverlay is attached at described second copper foil layer.
Second aspect, present invention also offers one and prepare above-mentioned Rigid Flex method, the method comprises the following steps:
Flexible substrate layer etches cabling, obtains copper foil layer, described copper foil layer comprise be arranged side by side routing region, reserved area and scrap region;
Described copper foil layer to be fitted coverlay, cover described copper foil layer completely to make described coverlay;
Remove the coverlay in described reserved area;
Remove described reserved area, with exposed portion flexible substrate layer;
There is provided one piece of hardboard, described hardboard comprises the mainboard, connecting plate and the subplate that are arranged side by side;
Be pressed on by described hardboard on described coverlay, fitting with described routing region and described scrap region respectively to make described mainboard and described subplate is arranged;
Remove described connecting plate, to expose described partially flexible substrate layer.
Wherein, after step " removes described connecting plate, to expose described partially flexible substrate layer ", further comprising the steps of:
Described main board is holed, and through to described copper foil layer, obtain ground hole;
Remove the residue in described ground hole.
Wherein, the hole wall of described ground hole is sticked electromagnetic shielding film.
Wherein, after step " removes described connecting plate, to expose described partially flexible substrate layer ", further comprising the steps of:
Die cutting die is adopted to excise described partially flexible substrate layer, to be separated described subplate and described mainboard.
Wherein, described subplate is provided with technique edges.
Wherein, in step " removes the coverlay in described reserved area ", specifically comprise:
Die cutting die is adopted to carry out die-cut to the coverlay in described reserved area, to remove described coverlay.
Rigid Flex that the embodiment of the present invention provides and preparation method thereof, by offering through windowing to described flexible substrate layer on described line layer, and the part utilizing flexible substrate layer to be exposed to window carrys out two parts of connection line layer, thus when needs carry out point plate to this Rigid Flex, only die cutting die need be adopted flexible substrate layer to be exposed to the part of windowing to excise, a point plate can be realized.Because flexible substrate layer has flexibility, therefore excision is convenient to, instead of on the floor of existing direct-on-line road and carry out excising the way to flexible substrate layer, avoid and carry out multi-layered hard material excision and likely cause die cutting die to occur situation about damaging improve the useful life of die cutting die.
Accompanying drawing explanation
In order to be illustrated more clearly in technical scheme of the present invention, be briefly described to the accompanying drawing used required in execution mode below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic cross-section of the Rigid Flex that the embodiment of the present invention provides;
Fig. 2 is the flow chart preparing the method for Rigid Flex that the embodiment of the present invention provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
For ease of describing, can use such as here " ... under ", " ... below ", D score, " ... on ", " on " etc. space relative terms the relation of an element or feature and another (a bit) element or feature is as illustrated in the drawing described.Be appreciated that, when an element or layer be called as another element or layer " on ", " being connected to " or " being couple to " another element or layer time, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or intervening elements or layer can be there is.
Being appreciated that terminology used here is only to describe specific embodiment, not really wanting to limit the present invention.When here using, clearly state unless context separately has, otherwise singulative " " and " being somebody's turn to do " are also intended to comprise plural form.Further, when using in this manual, term " comprises " and/or shows " comprising " existence of described feature, entirety, step, element and/or assembly, but does not get rid of other features one or more, entirety, step, element, assembly and/or its existence of combining or increase.Specification subsequent descriptions is for implementing better embodiment of the present invention, and right described description is to illustrate for the purpose of rule of the present invention, and is not used to limit scope of the present invention.Protection scope of the present invention is when being as the criterion depending on the claims person of defining.
Refer to Fig. 1, a kind of Rigid Flex 100 provided by the invention, described Rigid Flex 100 comprises flexible substrate layer 10, copper foil layer 20, coverlay 30, hard layer 40 and line layer 50.Described copper foil layer 20 is stacked in described flexible substrate layer 10, and described coverlay 30 is attached on described copper foil layer 20.Described hard layer 40 is stacked at the side of described copper foil layer 20 away from described flexible substrate layer 10.Described line layer 50 is stacked on described hard layer 40, and what described line layer 50 offers through extremely described flexible substrate layer 10 windows 51, so that described line layer 50 is divided into the two parts be oppositely arranged.Described flexible substrate layer 10 Partial exposure windows 51 in described, and described flexible substrate layer 10 be exposed to described in window 51 part be connected between two parts of described line layer 50.Be understandable that, described Rigid Flex 100 can be applicable in mobile terminal, and this mobile terminal can be mobile phone, panel computer, notebook computer etc., and described Rigid Flex 100 is responsible for the conduction between the electronic component in this mobile terminal.
The Rigid Flex 100 that the embodiment of the present invention provides, by offer on described line layer 50 through to described flexible substrate layer 10 window 51, and utilize described flexible substrate layer 10 be exposed to described in window 51 part to connect two parts of described line layer 50, thus when needs carry out point plate to this Rigid Flex 100, only need adopt die cutting die flexible substrate layer 10 is exposed to described in window 51 part excise, a point plate can be realized.Because described flexible substrate layer 10 has flexibility, therefore excision is convenient to, instead of on the floor of existing direct-on-line road and carry out excising the way to flexible substrate layer, prevent the harder material such as line layer and hard layer directly to excise and the damage caused die cutting die, improve the useful life of die cutting die.
In the present embodiment, described flexible substrate layer 10 can adopt the material such as polyimides or the two stupid diformates (PolyethyleneterephthalatePET) of polyethylene, so that arrange described copper foil layer 20 in described flexible substrate layer 10, and described flexible substrate layer 10 can provide insulation environment for described copper foil layer 20 so that on described copper foil layer 20 etching signal cabling and ground connection cabling.Preferably, the thickness of described flexible substrate layer 10 can be 20 μm.
In the present embodiment, described copper foil layer 20 is plate film being arranged Copper Foil, and the ground connection cabling on described copper foil layer 20 and signal lead are Copper Foil and form through etching technics according to prescribed route structure.Ground connection cabling on described copper foil layer 20 and signal lead can be wholely set, and the signal lead on described copper foil layer 20 realizes the conduction between electric elements, and the ground connection cabling on described copper foil layer 20 carries out ground connection.
In the present embodiment, described copper foil layer 20 is two-layer, be respectively the first copper foil layer 21 and the second copper foil layer 22 being located at the relative both sides of described flexible substrate layer 10, described first copper foil layer 21 offers the through via 211 to described second copper foil layer 22, electric-conductor (not shown) is provided with in described via 221, described electric-conductor connects described first copper foil layer 21 and the second copper foil layer 22, realizes signal conduction to make described first copper foil layer 21 and the second copper foil layer 22.
In the present embodiment, it is hot-forming that described coverlay 30 can adopt polyester material to carry out.Described coverlay 30 by paste adhesive on described copper foil layer 20.Concrete; described coverlay 30 fits on described copper foil layer 20 completely; and the signal lead partly covered on described copper foil layer 20 and ground connection cabling; do not lost to protect signal lead and ground connection cabling on described copper foil layer 20 or damaged; simultaneously; adopt the mode of paste adhesive, described coverlay 30 also can be made tightr with the connection of described copper foil layer 20, prevent described cover layer 30 be shifted and cannot protect the part cabling exposing described coverlay 30.
Further, described coverlay 30 is two-layer, and be respectively the first coverlay 31 and the second coverlay 32, described first coverlay 31 is attached at described first copper foil layer 21, and described second coverlay 32 is attached at described second copper foil layer 22.In order to realize the ground connection of described first copper foil layer 21 and the second copper foil layer 22, described first coverlay 31 offers ground connection window (not shown), described ground connection window can adopt the mode of laser-induced thermal etching, described for part the first coverlay 31 is carried out etching to remove, with the first copper foil layer 21 described in exposed portion.
In the present embodiment, described hard layer 40 adopts polyethylene material, and described hard layer 40 has insulating properties characteristic, and described line layer 50 and described copper foil layer 20 are completely cut off mutually, thus facilitates the trace arrangements variation of described Rigid Flex 100.
In the present embodiment, described line layer 50 also can be that Copper Foil is shaping through etch process.Described line layer 50 can arrange circuit, thus the circuit configuration of described Rigid Flex 100 can be increased.
In the present embodiment, described in window and 51 can adopt die-cut mode or adopt the mode of laser-induced thermal etching to be formed.In order to make the edges of boards of the described Rigid Flex 100 formed along comparatively smooth, described in window and 51 can be rectangular window.Described line layer 50 51 is divided into Part I 52 and Part II 53 by described windowing, and described Part I 52 offers the through ground hole 521 to described copper foil layer 20, described Part II 53 is provided with technique edges 531.Particularly, described ground hole 521 can be one or more, and described ground hole 521 can be circular hole or square opening etc.And in order to ensure its ground connection performance, the hole wall of described ground hole 521 has been sticked electromagnetic shielding film (not shown), with shield electromagnetic signals, ensure the ground connection between described line layer 50 and described copper foil layer 20, prevent from being directly connected between described line layer 50 with described copper foil layer 20 and causing short circuit.
Refer to Fig. 2, be the method for the described Rigid Flex of preparation that the embodiment of the present invention provides, the method comprises the following steps:
S1: etch cabling in flexible substrate layer, obtains copper foil layer, described copper foil layer comprise be arranged side by side routing region, reserved area and scrap region.
The object of this step is to form described copper foil layer in described flexible substrate layer, so that cabling and connection electronic devices and components, provides basis to described Rigid Flex for electronic devices and components realize electrically conducting.In the present embodiment, described copper foil layer is divided into be arranged side by side routing region, reserved area and scrap region so that follow-up carrying out described copper foil layer to remove according to different regions when removing material, be convenient to manufacture.
S2: coverlay of fitting on described copper foil layer, covers described copper foil layer completely to make described coverlay.
The object of this step is to protect the cabling on described copper foil layer, utilizes the covering protection effect of described coverlay, thus can prevent the cabling on copper foil layer from occurring situation about damaging.Preferably, described coverlay adopts the mode be sticked to be sticked on described copper foil layer.
S3: remove the coverlay in described reserved area.
The object of this step is removed by the coverlay in described reserved area, to expose described reserved area.
In the present embodiment, the concrete steps of this step are as follows:
Die cutting die is adopted to carry out die-cut to the coverlay in described reserved area, to remove described coverlay.Adopt die cutting die to carry out die-cut mode, can prevent other regions on described copper foil layer, as the coverlay on routing region and scrap region causes damage, better to the removal effect of the coverlay in described reserved area.
S4: remove described reserved area, with exposed portion flexible substrate layer.
The object of this step is removed described reserved area, thus can exposed portion flexible substrate layer, so that follow-up point plate.In the present embodiment, the mode of laser-induced thermal etching can be adopted described reserved area to be removed, because it has efficient and that etching face is comparatively smooth advantage, thus can prevent from causing damage to flexible substrate layer.
S5: provide one piece of hardboard, described hardboard comprises the mainboard, connecting plate and the subplate that are arranged side by side.
The object of this step is to hardboard and above-mentioned flexible substrate layer be fitted, so that form described Rigid Flex.In the present embodiment, described subplate is provided with technique edges, so that assist the plug-in unit of described hardboard to arrange when making described hardboard.
S6: be pressed on by described hardboard on described coverlay, fits with described routing region and described scrap region respectively to make described mainboard and described subplate and arranges.
The object of this step is in order to hardboard and soft board are carried out pressing, so that form described Rigid Flex.Particularly, the mode of pressing machine pressing can be adopted, by hardboard and soft board pressing, thus ensure the pressing compactness both it.
S7: remove described connecting plate, to expose described partially flexible substrate layer.
In the present embodiment, die cutting die can be adopted to be removed by described connecting plate, thus expose described partially flexible substrate layer.Now, described flexible substrate layer is between described mainboard and described subplate, and because described flexible substrate layer is flexible material, its material is softer, therefore, it is possible to be convenient to follow-up cutting.
Further, after the step of " removing described connecting plate, to expose described partially flexible substrate layer ", further comprising the steps of:
S61: adopt die cutting die to excise described partially flexible substrate layer, to be separated described subplate and described mainboard.
The object of this step is to be removed by the described partially flexible substrate layer be connected between described mainboard and described subplate, so that be separated with described subplate by described mainboard, thus reaching the object of point plate.Because the material of described flexible substrate layer is softer, therefore, when adopting die cutting die to carry out die-cut, can die-cutly rapidly complete, substituted for and existingly directly on the hardboard of a monoblock, carry out die-cut mode, prevent die cutting die in blanking process from causing the situation of damage, improve the useful life of die cutting die.
Further, in order to ensure the ground connection performance of described Rigid Flex, after step " removes described connecting plate, to expose described partially flexible substrate layer ", further comprising the steps of:
S62: described main board is holed, and through to described copper foil layer, obtain ground hole.
The object of this step is the ground connection performance in order to realize between the main board of hardboard and soft board, prevents short circuit.Preferably, this ground hole can adopt the mode of laser drill to be formed, this ground hole can be one, two or more.In the present embodiment, this ground hole can be circular port or square opening etc.
S63: remove the residue in described ground hole.
The object of this step is the residue in order to ensure in described ground hole, remains in prevent residue the ground connection affected between described hardboard and soft board in described ground hole.
Further, in order to ensure the ground connection between described hardboard and soft board, the hole wall of ground hole has been sticked electromagnetic shielding film, to mask unnecessary electromagnetic interference, ensures the earthing effect of described ground hole further.
The preparation method of the Rigid Flex that the embodiment of the present invention provides, by when preparing soft board, first removes the coverlay of soft board part and copper foil layer, exposed portion flexible substrate layer; Then hardboard is pressed together on soft board, the material of the position of hardboard corresponding part flexible substrate layer is also removed, thus realize this partially flexible substrate layer to expose, this partially flexible substrate layer is connected between the mainboard of hardboard and subplate.When follow-up needs carry out point plate, only this partially flexible substrate layer need be removed, point plate of Rigid Flex can be realized, instead of and existingly directly carry out being die-cut to soft board part on hardboard, prevent from causing die cutting die to occur situation about damaging improve the useful life of die cutting die because the material of hardboard is comparatively hard in blanking process.
Rigid Flex that the embodiment of the present invention provides and preparation method thereof, by offering through windowing to described flexible substrate layer on described line layer, and the part utilizing flexible substrate layer to be exposed to window carrys out two parts of connection line layer, thus when needs carry out point plate to this Rigid Flex, only die cutting die need be adopted flexible substrate layer to be exposed to the part of windowing to excise, a point plate can be realized.Because flexible substrate layer has flexibility, therefore excision is convenient to, instead of on the floor of existing direct-on-line road and carry out excising the way to flexible substrate layer, avoid carrying out multi-layered hard material excision and likely cause die cutting die to occur situation about damaging improve the useful life of die cutting die.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example ", " some examples " or similar " the first embodiment " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.
Claims (10)
1. a Rigid Flex, it is characterized in that, described Rigid Flex comprises flexible substrate layer, be laminated in the copper foil layer in described flexible substrate layer, be attached at the coverlay on described copper foil layer, the line layer being laminated in the hard layer on described coverlay and being stacked on described hard layer, described line layer offers through windowing to described flexible substrate layer, described line layer is divided into the two parts be oppositely arranged by described windowing, described flexible substrate layer Partial exposure is windowed in described, and the part of windowing described in described flexible substrate layer is exposed to is connected between two parts of described line layer.
2. Rigid Flex according to claim 1, is characterized in that, two parts of described line layer are respectively Part I and Part II, described Part I offers the through ground hole to described copper foil layer, described Part II is provided with technique edges.
3. Rigid Flex according to claim 2, is characterized in that, the inwall of described ground hole has been sticked electromagnetic shielding film.
4. Rigid Flex according to claim 1, it is characterized in that, described copper foil layer is two-layer, be respectively the first copper foil layer and the second copper foil layer of being located at the relative both sides of described flexible substrate layer, described coverlay is two-layer, be respectively the first coverlay and the second coverlay, described first coverlay is attached at described first copper foil layer, and described second coverlay is attached at described second copper foil layer.
5. prepare a method for Rigid Flex described in claim 1, it is characterized in that, it comprises the following steps:
Flexible substrate layer etches cabling, obtains copper foil layer, described copper foil layer comprise be arranged side by side routing region, reserved area and scrap region;
Described copper foil layer to be fitted coverlay, cover described copper foil layer completely to make described coverlay;
Remove the coverlay in described reserved area;
Remove described reserved area, with exposed portion flexible substrate layer;
There is provided one piece of hardboard, described hardboard comprises the mainboard, connecting plate and the subplate that are arranged side by side;
Be pressed on by described hardboard on described coverlay, fitting with described routing region and described scrap region respectively to make described mainboard and described subplate is arranged;
Remove described connecting plate, to expose described partially flexible substrate layer.
6. preparation method according to claim 5, is characterized in that, after step " removes described connecting plate, to expose described partially flexible substrate layer ", further comprising the steps of:
Described main board is holed, and through to described copper foil layer, obtain ground hole;
Remove the residue in described ground hole.
7. preparation method according to claim 6, is characterized in that, the hole wall of described ground hole is sticked electromagnetic shielding film.
8. preparation method according to claim 1, is characterized in that, after step " removes described connecting plate, to expose described partially flexible substrate layer ", further comprising the steps of:
Die cutting die is adopted to excise described partially flexible substrate layer, to be separated described subplate and described mainboard.
9. preparation method according to claim 1, is characterized in that, described subplate is provided with technique edges.
10. preparation method according to claim 1, is characterized in that, in step " removes the coverlay in described reserved area ", specifically comprises:
Die cutting die is adopted to carry out die-cut to the coverlay in described reserved area, to remove described coverlay.
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| CN107995800A (en) * | 2017-12-28 | 2018-05-04 | 信利光电股份有限公司 | The soft board and hardboard associated methods of a kind of Rigid Flex |
| CN109688730A (en) * | 2019-02-02 | 2019-04-26 | 维沃移动通信有限公司 | A kind of production method and Rigid Flex of Rigid Flex |
| CN110970729A (en) * | 2019-09-06 | 2020-04-07 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure and antenna |
| CN110994164A (en) * | 2019-09-06 | 2020-04-10 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure and antenna |
| CN111447747A (en) * | 2020-05-15 | 2020-07-24 | 深圳市实锐泰科技有限公司 | Flexible printed board shape manufacturing method |
| CN112165761A (en) * | 2020-08-24 | 2021-01-01 | Oppo（重庆）智能科技有限公司 | Rigid-flex board, circuit board, electronic equipment and method for preparing rigid-flex board |
| CN114698225A (en) * | 2020-12-31 | 2022-07-01 | 深南电路股份有限公司 | Battery protection plate, manufacturing method thereof and electronic device |
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| CN107995800A (en) * | 2017-12-28 | 2018-05-04 | 信利光电股份有限公司 | The soft board and hardboard associated methods of a kind of Rigid Flex |
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| CN110970729A (en) * | 2019-09-06 | 2020-04-07 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure and antenna |
| CN110994164A (en) * | 2019-09-06 | 2020-04-10 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure and antenna |
| CN110970729B (en) * | 2019-09-06 | 2021-08-27 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure and antenna |
| CN110994164B (en) * | 2019-09-06 | 2023-02-17 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure |
| CN111447747A (en) * | 2020-05-15 | 2020-07-24 | 深圳市实锐泰科技有限公司 | Flexible printed board shape manufacturing method |
| CN112165761A (en) * | 2020-08-24 | 2021-01-01 | Oppo（重庆）智能科技有限公司 | Rigid-flex board, circuit board, electronic equipment and method for preparing rigid-flex board |
| CN112165761B (en) * | 2020-08-24 | 2022-02-08 | Oppo（重庆）智能科技有限公司 | Rigid-flex board, circuit board, electronic equipment and method for preparing rigid-flex board |
| CN114698225A (en) * | 2020-12-31 | 2022-07-01 | 深南电路股份有限公司 | Battery protection plate, manufacturing method thereof and electronic device |
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| CN105578753B (en) | 2018-09-04 |
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