CN105555019B - Rigid Flex, terminal and Rigid Flex production method - Google Patents
Rigid Flex, terminal and Rigid Flex production method Download PDFInfo
- Publication number
- CN105555019B CN105555019B CN201610109682.9A CN201610109682A CN105555019B CN 105555019 B CN105555019 B CN 105555019B CN 201610109682 A CN201610109682 A CN 201610109682A CN 105555019 B CN105555019 B CN 105555019B
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- layer
- copper foil
- rigid
- flexible circuit
- steel reinforcement
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of Rigid Flex, terminal and Rigid Flex production methods, the Rigid Flex includes flexible circuit board, rigid insulation layer and steel reinforcement, the flexible circuit board includes substrate layer and copper foil layer, the copper foil layer fits on the substrate layer, the rigid insulation layer fits on the flexible circuit assembly, and copper foil layer described in covering part, the steel reinforcement fits in the rigid insulation layer and deviates from the flexible circuit assembly side, and corresponding with the rigid insulation layer size.It is fitted on the flexible circuit board by the rigid insulation layer, the steel reinforcement fits in the rigid insulation layer and deviates from the flexible circuit board side, realize the hardboard structure of the Rigid Flex, and using the heat conduction fast characteristic of the steel reinforcement, improve the heat dissipation effect of the Rigid Flex.
Description
Technical field
The present invention relates to a kind of electronic device field more particularly to Rigid Flex, terminal and Rigid Flex making sides
Method.
Background technology
With the fast development of electronic product, the fuselage of electronic product is increasingly intended to thin, light and handyization, and electronics produces
Space layout inside product also can be more and more compacter.Since electronic product will produce heat when working and running, and the source of heat
It is to be loaded with the Rigid Flex of electronic component, therefore smaller and smaller in electronic product inner space, topology layout is more and more tighter
Gather, it is intensive in the case of, the heat source on Rigid Flex is unable to get preferable diffusion, causes to be unable to get inside electronic product
Preferable heat dissipation effect, so that the Wen Sheng of electronic product cannot be satisfied corresponding standard value；Or electronic product is for a long time in height
Under the working condition of temperature, its reliability decrease can be caused.
Invention content
In view of this, the present invention provides a kind of Rigid Flex, terminal and Rigid Flex with better heat dissipation effect
Production method.
The present invention provides a kind of Rigid Flex, wherein the Rigid Flex includes flexible circuit board, rigid insulation
Layer and steel reinforcement, the flexible circuit board includes substrate layer and copper foil layer, and the copper foil layer fits on the substrate layer, institute
It states rigid insulation layer to fit on the flexible circuit assembly, and copper foil layer described in covering part, the steel reinforcement fits in institute
It states rigid insulation layer and deviates from the flexible circuit assembly side, and is corresponding with the rigid insulation layer size.
Wherein, the Rigid Flex include two flexible circuit boards and two layers of rigid insulation layer, two layers
The rigid insulation layer is located between two flexible circuit boards, the steel reinforcement be located at two layers rigid insulation layer it
Between.
Wherein, the steel reinforcement is adhered between two layers of rigid insulation layer.
Wherein, the steel reinforcement is equipped with signal via, and the signal via is penetrated through to two flexible circuit boards
Copper foil layer, the interior setting of the signal via are electrically connected the signal conductor of the copper foil layer, the signal conductor and the signal mistake
Insulating cement is set between the madial wall of hole.
Wherein, the steel reinforcement is equipped with the ground via that is isolated with the signal via, the ground via penetrate through to
The copper foil layer, the ground via is interior to be arranged earth conductor, and the earth conductor is electrically connected to the copper foil layer and the steel
Reinforcement.
Wherein, the flexible circuit board includes two layers of copper foil layer, and two layers of copper foil layer fits in described respectively
Substrate layer both sides.
Wherein, it is connected with the electric conductor across the substrate layer between two layers of copper foil layer.
Wherein, the flexible PCB further includes cover film, and the cover layer is laminated on the substrate layer away from described hard
Matter insulating layer side, and cover the copper foil layer.
The present invention also provides a kind of terminals, wherein the terminal include ontology, set on the body interior mainboard and
Rigid Flex described in above-mentioned any one, the Rigid Flex is set to the body interior, and is electrically connected with the mainboard.
The present invention also provides a kind of Rigid Flex production methods, which is characterized in that the Rigid Flex production method
Including：
Cut the rigid insulation layer of preset shape；
The steel reinforcement for cutting preset shape, steel reinforcement is adhered on rigid insulation layer；
It is molded flexible circuit board, the flexible circuit board has substrate layer, and fits in the copper of the substrate layer
Layers of foil；
The flexible circuit board is adhered to the rigid insulation layer and deviates from steel reinforcement side, the flexible circuit
Substrate covers the rigid insulation layer.
Rigid Flex, terminal and the Rigid Flex production method of the present invention, is fitted in by the rigid insulation layer
On the flexible circuit board, the steel reinforcement fits on the rigid insulation layer, and the steel reinforcement can quickly absorb institute
The heat on flexible circuit board is stated, and heat is distributed into air, to using the heat conduction fast characteristic of the steel reinforcement, carry
The heat dissipation effect of the high Rigid Flex.
Description of the drawings
In order to illustrate more clearly of technical scheme of the present invention, attached drawing needed in embodiment will be made below
Simply introduce, it should be apparent that, the accompanying drawings in the following description is only some embodiments of the present invention, general for this field
For logical technical staff, without creative efforts, other drawings may also be obtained based on these drawings.
Fig. 1 is the schematic cross-section of Rigid Flex provided by the invention；
Fig. 2 is the flow diagram of Rigid Flex production method provided by the invention.
Specific implementation mode
Below in conjunction with the attached drawing in embodiment of the present invention, the technical solution in embodiment of the present invention is carried out clear
Chu is fully described by.
Referring to Fig. 1, a kind of Rigid Flex 100 provided by the invention, the Rigid Flex 100 includes flexible circuit
Substrate 10, rigid insulation layer 20 and steel reinforcement 30.The flexible circuit board 10 includes substrate layer 11 and copper foil layer 12, the copper
Layers of foil 12 fits on the substrate layer 11.The rigid insulation layer 20 fits on the flexible circuit assembly 10, and covers
The part copper foil layer 12, the steel reinforcement 30 fit in the rigid insulation layer 20 and deviate from the flexible circuit assembly 10 1
Side, and it is corresponding with 20 size of rigid insulation layer.
It is fitted on the flexible circuit board 10 by the rigid insulation layer 20, the steel reinforcement 30 fits in described
Rigid insulation layer 20 deviates from 10 side of the flexible circuit board, realizes the hardboard structure of the Rigid Flex 100, and utilize
The heat conduction fast characteristic of the steel reinforcement 30, improves the heat dissipation effect of the Rigid Flex.
The flexible circuit assembly 10 can be FPC (Flexible Printed Circuit board, flexible circuit
Plate).Specifically, polyimides or the double stupid diformate (Polyethylene of polyethylene can be used in the substrate layer 11
Terephthalate PET) etc. materials, in order to which the copper foil layer 12, and the base material are arranged on the substrate layer 11
Layer 11 can be that the copper foil layer 12 provides insulation environment, in order to which the etching signal cabling on the copper foil layer 12 and ground connection are walked
Line.Preferably, the thickness of the substrate layer 11 can be 20 μm.Flex region 11a can be arranged in the substrate layer 11 and flex region is hard
Property area 11b, the flex region 11a is flexible for rendering, and the Soft Bonding plate 100 is facilitated to generate deformation, so it is convenient described in
Rigid Flex 100 connects external device, and flex region hardness area 11b can fix hard plate, described soft to improve
The rigidity of property board 100, to facilitate the Soft Bonding plate 100 to be assemblied in terminal.
In present embodiment, the copper foil layer 12 is the plate that copper foil is arranged on film, the ground connection on the copper foil layer 12
Cabling and signal lead are that copper foil is formed according to the etched technique of prescribed route structure.Ground connection cabling on the copper foil layer 12
Can be wholely set with signal lead, the signal lead on the copper foil layer 12 realizes the conduction between electric elements, described
Ground connection cabling on copper foil layer 12 is grounded.The flexible circuit board 10 may include two layers of copper foil layer 12, two layers
The copper foil layer 12 fits in 11 both sides of the substrate layer respectively.In other embodiments, the flexible circuit board 10 is gone back
Can be that the unilateral copper foil layer 12 is set, copper foil layer 12 fits on the substrate layer 11 described in single layer, the rigid insulation
Layer 20 fits in copper foil layer 12 described in single layer and deviates from 11 side of the substrate layer；Copper foil layer 12 and the rigid insulation described in single layer
Layer 20 can also be the both sides for fitting in the substrate layer 11 respectively.
In present embodiment, the substrate layer 10 further includes cover film 13, and the cover film 13 is laminated in the substrate layer
11 deviate from 20 side of rigid insulation layer, and cover the copper foil layer 12.Specifically, two layers of copper foil layer 12 is patch respectively
Together in the first copper foil layer 121 and the second copper foil layer 122 of 11 both sides of the substrate layer.The rigid insulation layer 20 fits in described
On first copper foil layer 121, the cover film 13 fits on second copper foil layer 122.The cover film 13 may be used poly-
Ester material carries out hot-forming.The cover film 13 is by paste adhesive on second copper foil layer 122.More specifically,
The cover film 13 is fitted in completely on second copper foil layer 122, and the signal being completely covered on second copper foil layer 122
Cabling and ground connection cabling, i.e., the described cover film 13 are opposite with the flex region 11a of the substrate layer 11 and flex region hardness area 11b
It answers, to protect signal lead and ground connection cabling on second copper foil layer 122 not lost or damaged, meanwhile, using viscous
The mode of glue prevents described cover it is also possible that the cover film 13 and the connection of second copper foil layer 122 are closer
Epiphragma layer 13 is shifted and can not be protected to the part cabling for exposing the cover film 13.In other embodiments, if institute
It states flexible circuit board 10 and single layer copper foil layer 12 is set, then the cover film 13 can also be mounted directly on the substrate layer 11
On.
In present embodiment, the rigid insulation layer 20 uses polyethylene material, the rigid insulation layer 20 to have insulation
Property characteristic so that first copper foil layer 121 and the steel reinforcement 30 mutually completely cut off, to avoid the steel reinforcement 30 to described
Signal lead short circuit on second copper foil layer 121.The rigid insulation layer 20 corresponds to the flex region hardness of the substrate layer 11
Area 11b.Utilize the rigidity of the rigid insulation layer 20 so that the Rigid Flex 100 is on flex region hardness area 11b
Intensity increase so that the Rigid Flex 100 is not easy bending in flex region hardness area 11b, and then realizes hardboard knot
Structure.Meanwhile circuit of 20 pairs of the rigid insulation floor, first copper foil layer 121 at flex region hardness area 11b carries out
Protection, increases the structural soundness of the Rigid Flex 100.
In present embodiment, in the form of sheets, the steel reinforcement 30 takes shape in institute using punching press cutting process for the steel reinforcement 30
It states on rigid insulation layer 20.30 shape size of steel reinforcement is identical as 20 size shape of rigid insulation layer, to improve
30 precision of steel reinforcement punctures first copper foil layer 121 to avoid the steel reinforcement 41 oversized, described in raising
The service life of Rigid Flex 100.The steel reinforcement 30 fits on the rigid insulation layer 20, to further enhance
The flex region 11a bend-resistances of the substrate layer 11, improve the assembly performance of the Rigid Flex 100.And the steel is mended
Strong 30 have heat conduction unique soon, can quickly absorb the heat of first copper foil layer 121 and second copper foil layer 122,
And by the side of the steel reinforcement 30 by heat diffusion, to improve the heat dissipation performance of the Rigid Flex 100.
Further, the Rigid Flex 100 includes that two flexible circuit boards 10 and two layers of hard are exhausted
Edge layer 20.Two layers of rigid insulation layer 20 is located between two flexible circuit boards 10, and the steel reinforcement 30 is located at two
Between the layer rigid insulation layer 20.In present embodiment, two flexible circuit boards 10 are respectively arranged at the steel and mend
Strong 30 both sides, then four layers of copper foil layer 12 are arranged in the Rigid Flex 100, so that the Rigid Flex 100 is real
Existing multi-line connection, and it is respectively arranged at the Rigid Flex using the cover film of two flexible circuit boards 10 13
It realizes the protection to the copper foil layer 12, and increases the service life of the Rigid Flex 100 in 100 outermost both sides.
30 both sides of steel reinforcement are respectively arranged at by two flexible circuit boards 10, it is also possible that the Rigid Flex
100 is easy to make, simple in structure, and the making of the Rigid Flex 100 can be realized merely with making soft board technique, compared to
Hardboard technique is made after first making soft board technique, improves shaping efficiency.Specifically, first flexible PCB can be used to make work
Skill is molded the flexible circuit assembly 10, between the steel reinforcement 30 is then adhered to two layers of rigid insulation layer 20, most
The flexible circuit assembly 10 is adhered on the rigid insulation layer 20 afterwards, so that 100 structure of the Rigid Flex
Firm, assembly is easy.
Further, the steel reinforcement 30 is equipped with signal via 31, the perforation of the signal via 31 to two flexibilities
The copper foil layer 12 of circuit board 10, the interior setting of the signal via 31 is electrically connected the signal conductor 311 of the copper foil layer 12, described
Insulating cement 312 is set between 31 madial wall of signal conductor 311 and the signal via.In present embodiment, the signal via
31 run through the steel reinforcement 30 and two rigid insulation layers 20.The both ends of the signal conductor 311 are connected to two layers
In the signal lead of first copper foil layer 121, to the signal conduction on two first copper foil layers 121, using described
The signal conductor 311 and the steel reinforcement 30 is isolated in insulating cement 312, to prevent the steel reinforcement 30 to described
The circuit of one copper foil layer 121 carries out short circuit, effectively improves the safety of the Rigid Flex 100.
Further, the steel reinforcement 30 is equipped with the ground via 32 being isolated with the signal via 31, the ground connection
The perforation of via 32 is to the copper foil layer 12, and the ground via 32 is interior to be arranged earth conductor 321, and the earth conductor 321 is electrically connected
It is connected to the copper foil layer 12 and the steel reinforcement 30.In present embodiment, the earth conductor 321 can be conduction copper column or aluminium
Column, the earth conductor 321 can be that one end is connected to the steel reinforcement 30, and the other end is connected to first copper foil layer 121,
To realize, wherein one layer of first copper foil layer 121 is grounded；The earth conductor 321 can also be that both ends are connected to two
Layer first copper foil layer 121, the part between both ends connects the steel reinforcement 30, to realize two layers of first copper foil layer
121 are grounded.Certainly, in other embodiments, the ground via 32 may also extend through the substrate layer 11, so that described
Earth conductor 321 is connected between second copper foil layer 122 and the steel reinforcement 30, to realize second copper foil layer
122 ground connection.
Further, it is connected with across the substrate layer between two layers of the flexible circuit board 10 copper foil layer 12
11 electric conductor 14.Specifically, first copper foil layer 121 is equipped with perforation to the through-hole 123 of second copper foil layer 122, institute
State the electric conductor 14 that setting in through-hole 123 connects first copper foil layer 121 and second copper foil layer 122.
In present embodiment, first copper foil layer 121 and second copper foil layer 122 are respectively equipped with different circuits,
To increase the circuit layout space of the Rigid Flex 100, the electric conductivity of the Rigid Flex 100 is improved.It is described logical
Hole 123 is opened in circuit one end of first copper foil layer 121, and the circuit towards second copper foil layer 122 extends.Specifically,
The through-hole 123 also extends through the substrate layer 1, and the conduct piece 14 is the copper post across the through-hole 123.The conduct piece 14
First copper foil layer 121 and second copper foil layer 122 conducting are realized, to ensure that the more of the Rigid Flex 100
The requirement of circuit cabling.The through-hole 123 is opened in the flex region 11a of the substrate layer 11 relatively of the copper foil layer 12, to cut
Subtract the copper foil layer 12 flex region 11a stress so that Rigid Flex 100 is in flex region 11a remitted its furys, thus
The flexible circuit board 10 is fixed in the steel reinforcement 30 can cover at the through-hole 123, described soft or hard to ensure
The structural strength of board 100 prevents the copper foil layer 10 of the Rigid Flex 100 to be broken.In other embodiments, described
The number of through-hole 123 can be multiple, and the electric conductor 14 may be implemented earth-continuity and either realize signal conduction.
The present invention also provides a kind of terminal (not shown), the terminal includes ontology (not shown), is set in the ontology
The mainboard (not shown) and the Rigid Flex 100 in portion, the Rigid Flex 100 be set to the body interior, and with
The mainboard electrical connection.The terminal can be mobile phone, computer, tablet, handheld device or media player etc..
Referring to Fig. 2, the present invention also provides a kind of Rigid Flex production methods, including：
S01：Cut the rigid insulation layer 20 of preset shape.
The preset shape can be rectangle, circle or polygon or the polymorphic structure that extends along curve.It is described hard
Polypropylene or polyethylene material may be used in matter insulating layer 20.
S02：The steel reinforcement 30 for cutting preset shape, steel reinforcement 30 is adhered on rigid insulation layer 20.
The shape of the steel reinforcement 30 is identical as the rigid insulation layer 20, improves the structure of the Rigid Flex 100
Stability avoids the steel reinforcement 30 from being layered with the rigid insulation layer 20.In present embodiment, the rigid insulation layer 20
Two sides is bonded with the steel reinforcement 30.
S03：It is molded flexible circuit board 10, the flexible circuit board 10 has substrate layer 11, and fits in described
The copper foil layer 12 of substrate layer 11.In present embodiment, using flexible circuit board 10, the base described in making FPC technological formings
The both sides of material layer 11 are etched with the copper foil layer 12, wherein going back Vacuum Deposition on one layer of copper foil layer 12 sets cover film 13.
S04：The flexible circuit board 10 is adhered to 20 layers of the insulating rigid and deviates from 30 side of steel reinforcement, institute
State 10 groups of coverings of flexible circuit layer rigid insulation layer 20.In present embodiment, by flexible circuit board 10 described in two groups
First copper foil layer 121 is adhered on the rigid insulation layer 20 so that flexible circuit board 10 described in two groups be clamped it is described
Rigid insulation layer 20 and the steel reinforcement 30, to obtain the Rigid Flex 100.
It is understood that the step of Rigid Flex production method provided by the present invention sequence is not restricted by.
Rigid Flex, terminal and the Rigid Flex production method of the present invention, is fitted in by the rigid insulation layer
On the flexible circuit board, the steel reinforcement fits in the rigid insulation layer and deviates from the flexible circuit board side, real
The hardboard structure of the existing Rigid Flex, and using the heat conduction fast characteristic of the steel reinforcement, improve the Rigid Flex
Heat dissipation effect.
It is the preferred embodiment of the present invention above, it is noted that for those skilled in the art,
Various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as this hair
Bright protection domain.
Claims (9)
1. a kind of Rigid Flex, which is characterized in that the Rigid Flex includes flexible circuit board, rigid insulation layer and steel
Reinforcement, the flexible circuit board include substrate layer and copper foil layer, and the copper foil layer fits on the substrate layer, the hard
Insulating layer fits on the flexible circuit assembly, and copper foil layer described in covering part, and the steel reinforcement fits in the hard
On insulating layer, it is located at side opposite with the flexible circuit board, orthographic projection of the steel reinforcement on the rigid insulation layer
Region coincides with the rigid insulation layer；
Wherein, the Rigid Flex includes flexible circuit board and two layers of rigid insulation layer described in two groups, described in two layers
Rigid insulation layer is located between two flexible circuit boards, and the steel reinforcement is located between two layers of rigid insulation layer.
2. Rigid Flex according to claim 1, which is characterized in that it is exhausted that the steel reinforcement is adhered to two layers of hard
Between edge layer.
3. Rigid Flex according to claim 1, which is characterized in that the steel reinforcement is equipped with signal via, the letter
Number via is penetrated through to the copper foil layer of flexible circuit board described in two groups, in the signal via setting be electrically connected the copper foil layer
Insulating cement is arranged between the signal conductor and the signal via madial wall in signal conductor.
4. Rigid Flex according to claim 3, which is characterized in that the steel reinforcement is equipped with and the signal via phase
The ground via of isolation, the ground via is penetrated through to the copper foil layer, the interior setting earth conductor of the ground via, described to connect
Earthed conductor is electrically connected to the copper foil layer and the steel reinforcement.
5. Rigid Flex according to claim 1, which is characterized in that the flexible circuit board includes two layers of the copper
Layers of foil, two layers of copper foil layer fit in the substrate layer both sides respectively.
6. Rigid Flex according to claim 5, which is characterized in that be connected with across institute between two layers of copper foil layer
State the electric conductor of substrate layer.
7. Rigid Flex according to claim 1, which is characterized in that the flexible PCB further includes cover film, institute
It states cover layer to be fixed on the substrate layer, is located at side opposite with the rigid insulation layer, and cover the copper foil layer.
8. a kind of Rigid Flex, which is characterized in that the Rigid Flex includes flexible circuit board, rigid insulation layer and steel
Reinforcement, the flexible circuit board include substrate layer and copper foil layer, and the copper foil layer fits on the substrate layer, the hard
Insulating layer fits on the flexible circuit assembly, and copper foil layer described in covering part, and the steel reinforcement fits in the hard
On insulating layer, it is located at side opposite with the flexible circuit board, orthographic projection of the steel reinforcement on the rigid insulation layer
Region coincides with the rigid insulation layer；
The steel reinforcement is equipped with the ground via being isolated with signal via, and the ground via is penetrated through to the copper foil layer, institute
It states and earth conductor is set in ground via, the earth conductor is electrically connected to the copper foil layer and the steel reinforcement.
9. a kind of terminal, which is characterized in that the terminal includes ontology, set on the mainboard of the body interior and as right is wanted
Rigid Flex described in 1~8 any one is sought, the Rigid Flex is set to the body interior, and is electrically connected with the mainboard
It connects.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810952919.9A CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
| CN201610109682.9A CN105555019B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex, terminal and Rigid Flex production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610109682.9A CN105555019B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex, terminal and Rigid Flex production method |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810952919.9A Division CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105555019A CN105555019A (en) | 2016-05-04 |
| CN105555019B true CN105555019B (en) | 2018-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810952919.9A Expired - Fee Related CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
| CN201610109682.9A Active CN105555019B (en) | 2016-02-25 | 2016-02-25 | Rigid Flex, terminal and Rigid Flex production method |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810952919.9A Expired - Fee Related CN109041405B (en) | 2016-02-25 | 2016-02-25 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI604763B (en) * | 2016-11-18 | 2017-11-01 | 同泰電子科技股份有限公司 | Rigid-flex board structure |
| CN107318225B (en) * | 2017-08-02 | 2019-12-17 | 常熟东南相互电子有限公司 | Composite multilayer circuit board |
| CN108495448B (en) * | 2018-05-23 | 2019-05-10 | 江西鸿宇电路科技有限公司 | A kind of flexible printed circuit board |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
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| CN202535639U (en) * | 2012-07-17 | 2012-11-14 | 深圳唯一科技股份有限公司 | Flexible circuit board applied to capacitive touch screen |
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| US6943302B2 (en) * | 2002-01-07 | 2005-09-13 | Achilles Corporation | Flexible printed circuit board |
| CN100574554C (en) * | 2007-04-10 | 2009-12-23 | 鸿富锦精密工业（深圳）有限公司 | Flexible PCB, processing method of said flexible circuit board and electronic installation |
| CN102427676B (en) * | 2011-11-18 | 2013-08-14 | 景旺电子（深圳）有限公司 | Heat dissipation type rigid-flexible combined board and manufacturing method thereof |
| CN104320908A (en) * | 2014-11-14 | 2015-01-28 | 镇江华印电路板有限公司 | Heat dissipating type multilayer soft and hardness combined printing plate |
| CN104968140B (en) * | 2015-06-10 | 2018-08-10 | 江西鑫力华数码科技有限公司 | Flexible folding wiring board |
-
2016
- 2016-02-25 CN CN201810952919.9A patent/CN109041405B/en not_active Expired - Fee Related
- 2016-02-25 CN CN201610109682.9A patent/CN105555019B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202535639U (en) * | 2012-07-17 | 2012-11-14 | 深圳唯一科技股份有限公司 | Flexible circuit board applied to capacitive touch screen |
| CN104885578A (en) * | 2013-02-26 | 2015-09-02 | 大自达电线股份有限公司 | Reinforcing member for flexible printed wiring substrate, flexible printed wiring substrate, and shield printed wiring substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109041405B (en) | 2020-07-10 |
| CN109041405A (en) | 2018-12-18 |
| CN105555019A (en) | 2016-05-04 |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., Ltd. |
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