CN105493648B - Electronic control device for vehicle - Google Patents
Electronic control device for vehicle Download PDFInfo
- Publication number
- CN105493648B CN105493648B CN201480047283.3A CN201480047283A CN105493648B CN 105493648 B CN105493648 B CN 105493648B CN 201480047283 A CN201480047283 A CN 201480047283A CN 105493648 B CN105493648 B CN 105493648B
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- CN
- China
- Prior art keywords
- thermal diffusion
- diffusion cover
- generating components
- heat generating
- substrate
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
A kind of electronic control device for vehicle (10,100), it has：Heat generating components (20)；The substrate (30) of heat generating components (20) is installed；And store the storage shell (40) of heat generating components (20) and substrate (30), heat generating components (20) and substrate (30) are sealed in storage shell (40) by the resin portion (60) for being filled in the inside for storing shell (40), the electronic control device for vehicle (10, 100) the thermal diffusion cover (50) being also made with metal, the thermal diffusion cover (50) is installed on the 1st mounting surface (30a) of substrate (30) with covering the state of heat generating components (20) with heat generating components (20) with separating predetermined distance, and it is sealed in by being filled in the resin portion (60) for the inside for storing shell (40) in storage shell (40).
Description
Technical field
The present invention relates to electronic control device for vehicle, more particularly to the substrate reception of heat generating components will be installed in storage
In shell, and control dress in the vehicle electronic stored potting resin in shell and substrate and heat generating components is sealed in storage shell
Put.
Background technology
In recent years, in the electronic control device for vehicle for being equipped on the vehicle such as motor bike or motor-driven carriage, adopt
With following structure：In order to ensure its water-proof function and dust reduction capability and raising impact resistance and freedom from vibration, and it will install
There are the structure members such as the electronic circuit board of electronic unit to be accommodated in storage shell, and in order to which the knot stored in shell will be accommodated in
Structure part seals and fixes and storing potting resin in shell.
In such a case, patent document 1 discloses electronic-controlled installation, the electronic-controlled installation passes through in circuit base
Potting resin in gap between plate and the storage shell for having stored circuit substrate, and circuit substrate is sealed and storage shell is fixed on
Inside, so as to attempt to ensure water-proof function and dust reduction capability and improve impact resistance and freedom from vibration.In the structure shown here, in electricity
Heat generating components is installed on base board, storage is delivered to from the hot resin stored via being filled in shell that heat generating components is produced
Shell, and from shell is stored to external cooling.
In addition, function required by electronic control device for vehicle high level, installs a large amount of heating parts sometimes
Part.As this heat generating components, for example, it can enumerate in the drive circuit for drive motor, densely installed in circuit
Switch element on substrate.As such switch element, typically using FET (Field-Effect Transistor：Field effect
Answer transistor) it is more.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2011-35106 publications
The content of the invention
The invention problem to be solved
But, learnt according to the research of present inventor：In the structure of patent document 1, because from being installed on circuit substrate
On the heat that produces of heat generating components store the resin in shell and be delivered to storage shell via being filled in, and dissipated from shell is stored to outside
Heat, rises therefore, it is possible to suppress the temperature in electronic-controlled installation, still, and the heat produced sometimes by heat generating components, which can exceed, to be filled out
The heat that can be conducted heat in the resin stored in shell is filled, its result is, because heat retention is in the resin being filled in storage shell,
And with the trend in the region for producing localized hyperthermia.
In addition, the trend becomes apparent if when being FET of progress switch motion at high speed etc. if heater element, especially many
Individual FET is installed under the more present situation of the situation of circuit substrate with high density state, is produced when drive motor etc. by multiple FET
Heat and cause temperature easily to rise, produce localized hyperthermia region trend it is more notable.
That is, under present situation, in such situation：Expect to realize a kind of electronic control device for vehicle of new structure,
It can be reliably suppressed the region that localized hyperthermia is produced due to the heat produced in the heat generating components such as switch element.
The present invention is to study and complete more than, its object is to provide a kind of electronic control device for vehicle, should
Electronic control device for vehicle is by being conducted heat and to external cooling from the heat that heat generating components is produced, and can efficiently press down
System produces the region of localized hyperthermia.
Means for solving the problems
In order to realize the above object the 1st aspect of the present invention is a kind of electronic control device for vehicle, it has：Heating
Part；The heat generating components is installed on substrate, the substrate；And shell is stored, it stores the heat generating components and the substrate,
The heat generating components and the base plate seals are stored in shell in described by the resin for the inside for being filled in the storage shell, institute
State the 1st thermal diffusion cover that electronic control device for vehicle is also made with metal, the 1st thermal diffusion cover with the heat generating components
Cover heat generating components state with separating predetermined distance is installed on the 1st mounting surface of the substrate, and passes through filling
It is sealed in the resin of the inside of the storage shell in the storage shell.
In addition the present invention the described 1st aspect on the basis of, its 2nd aspect be, the electronic control device for vehicle
The 2nd thermal diffusion cover being also made with metal, the 2nd thermal diffusion cover is installed on the 2nd mounting surface of the substrate, the 2nd peace
Dress face is the back side of the 1st mounting surface, the 2nd thermal diffusion cover cover on the 2nd mounting surface with the 1st mounting surface
The corresponding region in region of the heat generating components is installed, and by the resin of the inside that is filled in the storage shell
It is sealed in the storage shell.
In addition the present invention the described 2nd aspect on the basis of, its 3rd aspect be, the electronic control device for vehicle
The secure component being also made with resin, the secure component is warm with the described 2nd by the 1st thermal diffusion cover by means of the substrate
Diffusion shell is fastened to each other.
The present invention is in the described 1st to the 3rd aspect on the basis of either side in addition, and its 4th aspect is to be filled in institute
The resin of inside of the 1st thermal diffusion cover and the 2nd thermal diffusion cover is stated along the other ministrys of electronics industry for being installed on the substrate
Part and relative to the heat generating components be offsettingly configured at it is described storage shell in.
The present invention is in the described 1st to the 4th aspect on the basis of either side in addition, and its 5th aspect is, described to store
The pyroconductivity of resin portion is big described in the thermal conductivity ratio of shell.
Invention effect
According to the structure of the 1st of the present invention the aspect, the present invention is a kind of electronic control device for vehicle, and it has heating part
Part, the substrate for being provided with heat generating components and the storage shell for storing heat generating components and substrate, the inside of shell is stored by being filled in
Resin by heat generating components and base plate seals in storing in shell, the electronic control device for vehicle be also made with metal the 1st
Thermal diffusion cover, the 1st thermal diffusion cover is installed on substrate with heat generating components is covered with heat generating components state with separating predetermined distance
The 1st mounting surface, and by be filled in store shell inside resin and be sealed in storage shell in, thereby, it is possible to efficient
The heat produced from heat generating components is conducted heat and to external cooling, can suppress to produce the region of localized hyperthermia in ground.
If here, the interval between the 1st thermal diffusion cover and heat generating components is too far, can not solve to produce the area of localized hyperthermia
The problem in domain.Therefore, previously according to simulation etc., occur setting heat in the range of localized hyperthermia in the state of no thermal diffusion cover
Diffusion shell.Thus, the 1st thermal diffusion cover is by the warm produced in heat generating components, and the 1st thermal expansion that can be made by metal
The high thermoconductivity for dissipating cover transfers heat to heat diffusivity in the sealing resin around the 1st thermal diffusion cover.Thus, the 1st thermal expansion
Rise with dissipating the temperature diffusivity around cover, on the other hand can reduce the temperature in the 1st thermal diffusion cover, can very practicably
Reduce the region of localized hyperthermia.
In addition, according to the present invention the 2nd aspect structure, the electronic control device for vehicle be also made with metal the 2nd
Thermal diffusion cover, the 2nd thermal diffusion cover is installed on the 2nd mounting surface at the back side as the 1st mounting surface of substrate, and covering the 2nd
Region corresponding with the region for being provided with heat generating components of the 1st mounting surface on mounting surface, and the 2nd thermal diffusion cover is by filling out
Fill and be sealed in the resin for the inside for storing shell in storage shell, thereby, it is possible to make be installed on the heating part of the 1st mounting surface
The heat for producing and being conducted heat via substrate to the 2nd mounting surface in part is efficiently conducted heat in the same manner as the effect in the 1st thermal diffusion cover
And to external cooling, the region for producing localized hyperthermia can be reliably suppressed.
In addition, according to the present invention the 3rd aspect structure, the electronic control device for vehicle also with resin be made it is tight
Though part, the 1st thermal diffusion cover and the 2nd thermal diffusion cover are fastened to each other by the secure component by means of substrate, thus, energy
Enough that the 1st thermal diffusion cover and the 2nd thermal diffusion cover are installed on into substrate without soldering, there is no need for be soldered on substrate
Layout research or the space of substrate for soldering, can make the installation of electronic unit and the winding of circuit pattern have from
By spending, and due to not being to be installed on substrate by riveting the 1st thermal diffusion cover that metal is made and the 2nd thermal diffusion cover, therefore
Can reduce cause to produce on substrate from the metal powder that the 1st thermal diffusion cover and the 2nd thermal diffusion cover are produced during due to being riveted
The phenomenon such as short circuit possibility.
In addition, according to the structure of the 4th of the present invention the aspect, being filled in the inside of the 1st thermal diffusion cover and the 2nd thermal diffusion cover
Resin is offsettingly configured in storage shell along the other electronic units for being installed on substrate relative to heat generating components, thus, energy
Increase heat transfer region with enough avoiding other electronic units of poor heat resistance, other electronic unit spokes to poor heat resistance can be reduced
The heat penetrated.
In addition, according to the structure of the 5th of the present invention the aspect, the pyroconductivity for storing shell is configured to pass than the heat of resin portion
Conductance is big, so that store shell efficiently can bear what is produced by heat generating components to diffusivity via thermal diffusion cover and resin portion
Heat, so that more reliably to the external cooling for storing shell.
Brief description of the drawings
Figure 1A is the stereogram for showing the electronic control device for vehicle in the 1st embodiment of the present invention, and to split
Its state for storing a part for shell is indicated.
Figure 1B is to have unloaded the state carry out table of the thermal diffusion cover of the electronic control device for vehicle in present embodiment
The Figure 1A shown partial enlarged drawing.
Fig. 2 is the sectional view along line A-A in the state of a part for the storage shell for having splitted Figure 1A.
Fig. 3 A are to show heat produced by the heat generating components of the electronic control device for vehicle in present embodiment to outside
Equivalent to Fig. 2 on the schematic diagram of the situation of heat transfer, position.
Fig. 3 B be electronic control device for vehicle in present embodiment is shown heat generating components is covered by thermal diffusion cover
The top view of the Temperature Distribution around heat generating components under state.
Fig. 3 C be electronic control device for vehicle in present embodiment is shown heat generating components is not covered by thermal diffusion cover
In the state of heat generating components around Temperature Distribution top view.
Fig. 4 is having splitted it and storing one of shell for the electronic control device for vehicle in the 2nd embodiment of the present invention
Equivalent to Fig. 2 on sectional view in the state of point, position.
Embodiment
Hereinafter, it is appropriate that the electronic control device for vehicle in the embodiments of the present invention is carried out in detail referring to the drawings
Explanation.In addition, in figure, x-axis, y-axis and z-axis constitute 3 axle orthogonal coordinate systems, the direction of z-axis corresponds to above-below direction.
(the 1st embodiment)
It is appropriate below that the electronic control device for vehicle in the 1st embodiment of the present invention is carried out specifically referring to the drawings
It is bright.
The structure ＞ of ＜ electronic control device for vehicle
First, the structure of the electronic control device for vehicle in present embodiment is carried out referring to Figure 1A to Fig. 2 detailed
Describe in detail bright.
Figure 1A is the stereogram for showing the electronic control device for vehicle in present embodiment, and shell is stored to have splitted it
The state of a part is indicated, and Figure 1B is to have unloaded the partial enlargement for Figure 1A that the state of its thermal diffusion cover is indicated
Figure.In addition, Fig. 2 is the sectional view along line A-A in the state of a part for the storage shell for having splitted Figure 1A.In addition, in Figure 1A
In Figure 1B, for convenience of explanation, and the electronic unit beyond heat generating components, connector and the diagram of resin portion are eliminated,
In fig. 2, for convenience of explanation, the diagram of the resin portion of the inside of thermal diffusion cover is eliminated.
As shown in Figure 1A to Fig. 2, electronic control device for vehicle 10 in present embodiment mainly have heat generating components 20,
Substrate 30, storage shell 40, thermal diffusion cover 50, resin portion 60 and connector 70.
On heat generating components 20, the switch element such as multiple FET typically by constituting drive circuit is constituted.Heat generating components 20
Generated heat when motor of diagram etc. is omitted in driving due to carrying out switch motion.That is, heat generating components 20 is when its action of progress
Shi Fare part, and as shown in Figure 1B, multiple heat generating components 20 are densely installed on the 1st installation of substrate 30 by soldering etc.
On the 30a of face, therefore, the region for installing the heat generating components 20 easily becomes high temperature when carrying out its action.
On substrate 30, the typically circuit substrate such as glass epoxy substrate, the substrate 30 has the 1st mounting surface
30a and the 2nd mounting surface 30b at the back side as the 1st mounting surface 30a.Multiple ministrys of electronics industry are installed on the 1st mounting surface 30a
Part 13a, 13b, heat generating components 20 and connector 70, and the thermal diffusion cover 50 of covering heat generating components 20 is installed.The opposing party
Face, is provided with multiple electronic unit 13c on the 2nd mounting surface 30b.The electronic unit 13a being installed on the 1st mounting surface 30a is
Height on above-below direction is than the heat generating components 20 and electronic unit 13b that are installed on the 1st mounting surface 30a and is installed on the 2nd
Higher part part high electronic unit 13c on mounting surface 30b.
Store shell 40 to be typically formed from a resin, the storage shell 40 housing electronic part 13a, 13b, 13c, heat generating components
20th, a part for substrate 30, thermal diffusion cover 50 and connector 70.Shell 40 is stored to be configured at one end have to external open
Opening portion 41 it is bag-shaped, a part for connector 70 is protruding to the outside from opening portion 41.In the y-axis direction for storing shell 40
Centre portion is provided with the high top wall portion 42 of the positive direction extension from opening portion 41 towards x-axis, is configured with the lower section of high top wall portion 42
The electronic unit such as capacitor as higher part part 13a.The upper wall portions beyond the high top wall portion 42 of shell 40 are stored for highly than high
The low low top wall portion 43 of top wall portion 42, be configured with the lower section of low top wall portion 43 compared with electronic unit 13a realize respectively it is low
Heat generating components 20, electronic unit 13b and the electronic unit 13c of dwarfing.Thereby, it is possible to make electronic control device for vehicle 10 small
Type, and reduce the volume of resin portion 60.
Thermal diffusion cover 50 is typically made up of metals such as iron, and the thermal diffusion cover 50 is separated with heat generating components 20 between regulation
The state for covering heat generating components 20 every ground is installed on the 1st mounting surface 30a of substrate 30 by soldering etc..
In more detail, thermal diffusion cover 50 is the box part of the rectangular-shape of opened downward, and the thermal diffusion cover 50 has：
Recess 51, it is used to store heat generating components 20；4 side of sidewall portion 52a, 52b, 52c, 52d, they are arranged at around recess 51；
Multiple foots 54, they from 4 side of sidewall portion 52a, 52b, 52c, 52d bottom 53a, 53b, 53c, 53d further downwards
It is extended, and the multiple hole portions being correspondingly formed in the omission diagram of substrate 30 are embedded in and are fixed on substrate by soldering etc.
30；Multiple clearance portions 55, they be respectively formed as with 4 side of sidewall portion 52a, 52b, 52c, 52d adjacent side wall each other it
Between correspondence；And top plate portion 56.Recess 51 is marked off by 4 side of sidewall portion 52a, 52b, 52c, 52d and top plate portion 56.In addition,
When thermal diffusion cover 50 is installed on into substrate 30, thermal diffusion cover 50 bottom 53a, 53b, 53c, 53d and substrate 30 the 1st
Between mounting surface 30a, there are multiple clearance portions 90 to be formed independently.Clearance portion 55 and clearance portion 90 are arranged for flowing into resin
The inside of thermal diffusion cover 50.
In addition, thermal diffusion cover 50 is not limited to the box of rectangular-shape, can also be set to can separate with heat generating components 20
Defined compartment of terrain covers the arbitrary shape of heat generating components 20.In addition, on thermal diffusion cover 50, in order that resin is easily flowed into
The inside of thermal diffusion cover 50, in addition to being provided with clearance portion 55 and clearance portion 90, can also set in the grade of top plate portion 56 and connect
The outside of thermal diffusion cover 50 and internal through hole or otch.
The resin material with mobility for being filled in the inside for storing shell 40 flows into the inside and outside of thermal diffusion cover 50
After-hardening and form resin portion 60.Now, the resin material with mobility for the inside for storing shell 40 is filled in from thermal diffusion
The clearance portion 55 and clearance portion 90 of cover 50 are flowed into the inside of thermal diffusion cover 50.The hair that resin portion 60 will be covered by thermal diffusion cover 50
Thermal part 20 seals and is fixed on the inside of thermal diffusion cover 50, and by electronic unit 13a, 13b, 13c, substrate 30, thermal diffusion
A part for cover 50 and connector 70 seals and is fixed on the inside for storing shell 40.
Realized here, the interval between the shape and heat generating components 20 and thermal diffusion cover 50 of thermal diffusion cover 50 is set
There must be the structure of resin portion 60 between heat generating components 20 and thermal diffusion cover 50, to avoid producing heat generating components 20 and thermal expansion
Dissipate the part that cover 50 is directly contacted.Moreover, what storage shell 40 and metal that the resin portion 60 that is made of resin, resin are made were made
The mode that the respective pyroconductivity of thermal diffusion cover 50 is configured to the pyroconductivity maximum of thermal diffusion cover 50 is set.
Thus, the heat produced in heat generating components 20 will not be unnecessarily shrouded in its periphery, and via thermal diffusion cover 50
Internal resin portion 60 is conducted heat to the diffusivity of thermal diffusion cover 50, and is being inhibited again to the resin portion inside thermal diffusion cover 50
60 heat transfer forms under thermal diffusion cover 50 itself components interior conduct heat, while via thermal diffusion cover 50 to thermal diffusion cover 50 with
Store shell 40 between resin portion 60 conduct heat, and via thermal diffusion cover 50 and store shell 40 between resin portion 60 to store shell 40
Conduct heat to diffusivity, afterwards, to the external cooling for storing shell 40.
In addition, the respective pyroconductivity of storage shell 40 that resin portion 60 and resin that resin is made are made is preferably set to
The pyroconductivity for storing the thermal conductivity ratio resin portion 60 of shell 40 is big.Thus, shell 40 is stored via thermal diffusion cover 50 and resin portion
60 efficiently and diffusivity bear the heat that is produced in heat generating components 20, so as to more reliably be dissipated to the outside for storing shell 40
Heat.
In addition, the interval between the shape and heat generating components 20 and thermal diffusion cover 50 of thermal diffusion cover 50 is so set：
In the state of no thermal diffusion cover 50, beforehand through simulation or actual measurement hold the 1st mounting surface 30a sides turn into set point of temperature with
The position of upper high temperature, the region be certain about, should conducted heat based on the position as high temperature so held.
Specifically, it is provided with predetermined distance r1 between the top plate portion 56 and heat generating components 20 of thermal diffusion cover 50.In heat
Between the side of sidewall portion 52a and heat generating components 20 of diffusion shell 50, predetermined distance r2 is provided with, and in the side of sidewall portion of thermal diffusion cover 50
Between 52c and heat generating components 20, predetermined distance r3 is provided with.Here, it is preferred that between these intervals r1, r2, r3, there is interval
R1 ＜ intervals r2 ＜ interval r3 relation, thermal diffusion cover 50 and its internal resin portion 60 are covered with the ground of heater element 20 from the hair
Thermal element 20 is inclined to the positive direction side of x-axis along electronic unit 13a.If for example, being configured at y-axis just relative to heater element 20
The electronic unit 13a of direction side is the relatively low electronic unit of heat resistance, then by set like this interval r1, r2, r3 it
Between size magnitude relationship, bias thermal diffusion cover 50 and its internal resin portion 60, the heat produced in heat generating components 20
The form that its heat transfer region can be increased via the resin portion 60 inside thermal diffusion cover 50 with the positive direction side in x-axis is passed
Heat simultaneously is transmitted to thermal diffusion cover 50 to avoid heat from unnecessarily shrouding the periphery in heat generating components 20 and avoid electronic unit
13a, and the heat thermal diffusion cover 50 itself components interior heat transfer and from thermal diffusion cover 50 via storing shell 40 and thermal expansion
Dissipate the resin portion 60 between cover 50 to conduct heat to shell 40 is stored, then to the external cooling for storing shell 40.That is, can more reduce pair with
Heater element 20 it is close electronic unit 13a radiating heat, in addition, also can further reduce contrast electronic unit 13a from
The heat of the remote electronic unit 13b radiatings of heater element 20.
In addition, certainly between the side of sidewall portion 52b and heat generating components 20 of thermal diffusion cover 50, and in the side of thermal diffusion cover 50
Between wall portion 52d and heat generating components 20, the predetermined distance for omitting diagram is provided with.
It is with omitting the recessed of the pairing side-connector cooperation of diagram that connector 70, which has fitting portion 70a, fitting portion 70a,
Portion, and the connector 70 has connection terminal 71, and the connection terminal 71 is formed by the metal parts of bending long plate shape, and
A part is to the outside prominent of connector 70.The state that connector 70 is soldered in substrate 30 with connection terminal 71 is installed on substrate
On 30 the 1st mounting surface 30a.That is, on connection terminal 71, its one end is inserted into the omission diagram to be formed on substrate 30
In through hole and be soldered, and the other end expose in fitting portion 70a and can be with the omission diagram of pairing side-connector company
Connecting terminal etc. is connected.
The assemble method ＞ of ＜ electronic control device for vehicle
Then, referring to assemble methods of Figure 1A to the Fig. 2 to the electronic control device for vehicle 10 in present embodiment
It is described in detail.
First, heat generating components 20 and electronic unit 13a, 13b are installed on to the 1st mounting surface of substrate 30 by soldering etc.
On 30a, and electronic unit 13c is installed on the 2nd mounting surface 30b of substrate 30 by soldering etc..
Then, in the state of heat generating components 20 is covered by thermal diffusion cover 50, by 54 points of multiple foots of thermal diffusion cover 50
It is not inlaid in accordingly in the 1st mounting surface 30a multiple hole portions of substrate 30, then they is soldered on substrate 30, by heat
Diffusion shell 50 is installed on substrate 30.In addition, the installation of thermal diffusion cover 50 to substrate 30 is not limited to soldering, can also use fastening or
The mounting structures such as riveting.
In the lump by the soldering of connection terminal 71 of connector 70 to substrate 30, connector 70 is installed on substrate 30.
Then, electronic unit 13a, 13b, 13c, heat generating components 20 and connector 70 will be installed and thermal expansion is installed
The substrate 30 for dissipating cover 50 is received into the inside for storing shell 40 from the opening portion 41 for storing shell 40.
Finally, flow into the resin material with mobility to the inside for storing shell 40 from opening portion 41 to be filled, then
It is allowed to harden, thus, in the state of heat generating components 20 is covered by thermal diffusion cover 50, by electronic unit 13a, 13b, 13c, hair
Thermal part 20, substrate 30, thermal diffusion cover 50 and a part of of connector 70 seal and are fixed in storage shell 40.Now, quilt
The resin material with mobility for being filled in the inside for storing shell 40 is gone back from the clearance portion 55 and clearance portion 90 of thermal diffusion cover 50
Inside and the hardening of thermal diffusion cover 50 are flowed into, thus, heat generating components 20 is sealed and the inside of thermal diffusion cover 50 is fixed on.
The febrile state ＞ of ＜ heat generating components adstante febres
Then, below referring also to Fig. 3 A to Fig. 3 C to the heating on the electronic control device for vehicle 10 in present embodiment
The febrile state of the adstante febre of part 20 is described in detail.
Fig. 3 A are to show that the heat that the heat generating components of the electronic control device for vehicle in present embodiment is produced is passed to outside
Equivalent to Fig. 2 on the schematic diagram of the situation of heat, position.In addition, Fig. 3 B are to show the vehicle electronic control in present embodiment
The top view of Temperature Distribution around the heat generating components covered by thermal diffusion cover in the state of heat generating components of device, Fig. 3 C are
The heating not covered by thermal diffusion cover in the state of heat generating components of electronic control device for vehicle in present embodiment is shown
The top view of Temperature Distribution around part.In addition, in figure 3 a, for convenience of explanation, only showing heat generating components 20, substrate
30th, thermal diffusion cover 50 and non-heat generating components 80, in Fig. 3 B and Fig. 3 C, only show heat generating components 20, substrate 30 and thermal expansion
Dissipate cover 50.
As shown in Figure 3A, the heat produced in heat generating components 20 is radial in thermal expansion as shown in Fig. 3 A arrow D1
Dissipate in the resin portion 60 inside cover 50 and conduct heat, and reach thermal diffusion cover 50.Now, because in heat generating components 20 and thermal diffusion cover 50
The contact area of the resin portion 60 in portion is more relatively large than the contact area of heat generating components 20 and substrate 30, therefore in heat generating components 20
The ratio that the heat of middle generation is conducted heat to substrate 30 is relatively low.In addition, in figure 3 a, for convenience of explanation, and saving slightly towards under
The diagram of the heat transfer of side.
Components interior of the heat of thermal diffusion cover 50 in thermal diffusion cover 50 itself as shown in Fig. 3 A arrow D2 is reached to pass
Heat.Now, because the pyroconductivity of the thermal conductivity ratio thermal diffusion cover 50 of resin portion 60 inside thermal diffusion cover 50 is low, therefore energy
The heat in the components interior heat transfer of thermal diffusion cover 50 itself is enough reliably suppressed again to the resin portion 60 inside thermal diffusion cover 50
Heat transfer.
Thermal diffusion cover 50 itself components interior conduct heat heat as shown in Fig. 3 A arrow D3 from thermal diffusion cover 50
To the radial heat transfer of resin portion 60 outside thermal diffusion cover 50, and reach storage shell 40.
Then, the external cooling for storing the heat of shell 40 to storage shell 40 is reached.Now, because the heat that storage shell 40 is born is
Produced by heat generating components 20 heat via the resin portion 60 inside thermal diffusion cover 50, thermal diffusion cover 50 and thermal diffusion cover 50 outside
Resin portion 60 and diffusivity transmit the heat come, therefore will not concentrate to the heat for the external cooling for storing shell 40 and reject heat to presence
In the non-heat generating components 80 such as electronic unit 13a, 13b of the outside of thermal diffusion cover 50, it can reduce and non-heat generating components 80 is applied
Plus heat affecting.
Then, reference picture 3B and Fig. 3 C is to the temperature under the heat condition of heat generating components 20 of electronic control device for vehicle 10
Distribution is described in detail.
Here, in Fig. 3 B and Fig. 3 C, representing that temperature is uprised according to temperature t1, t2, t3 ... order with equitemperature difference.Separately
Outside, Fig. 3 B and Fig. 3 C represent to make the temperature of the adstante febre of heat generating components 20 under the same conditions in addition to whether having thermal diffusion cover 50
Distribution.
In the electronic control device for vehicle 10 shown in Fig. 3 B of heat generating components 20 is covered as thermal diffusion cover 50, closer to
The temperature of heat generating components 20 more rises, but its Temperature Distribution correspond to thermal diffusion cover 50 configuring area and relatively equalization, peace
The temperature in the temperature highest region equipped with heat generating components 20 is t5 or so.
On the other hand, the electronic control device for vehicle shown in Fig. 3 C of heat generating components 20 is not being covered as thermal diffusion cover 50
In, more sharp rise closer to the temperature of heat generating components 20, the temperature in the temperature highest region for being provided with heat generating components 20
It is t10.
Learnt more than, because temperature t5 is lower than temperature t10, therefore heat generating components 20 is being covered using thermal diffusion cover 50
In the case of, compared with the situation that unused thermal diffusion cover 50 covers heat generating components 20, the thermal diffusion of the adstante febre of heat generating components 20
Conducted heat and equalization, can make the maximum temperature of electronic control device for vehicle 10 reduces.In addition, Fig. 3 B and Fig. 3 C are shown
On the 1st mounting surface 30a of substrate 30 Temperature Distribution, the trend on the 2nd mounting surface 30b of substrate 30 Temperature Distribution
It is same.
The structure of present embodiment more than, has heat generating components 20, peace in electronic control device for vehicle 10
The storage shell 40 of substrate 30 and storage heat generating components 20 and substrate 30 equipped with heat generating components 20, by being filled in storage shell
Heat generating components 20 and substrate 30 are sealed in storage shell 40 by the resin portion 60 of 40 inside, the electronic control device for vehicle 10
The thermal diffusion cover 50 being also made with metal, the thermal diffusion cover 50 with heat generating components 20 to cover heating part with separating predetermined distance
The state of part 20 is installed on the 1st mounting surface 30a of substrate 30, and by being filled in the resin portion 60 for the inside for storing shell 40
And be sealed in storage shell 40, thereby, it is possible to efficiently be conducted heat and dissipated to outside to the heat produced from heat generating components 20
Heat, can suppress to produce the region of localized hyperthermia.
In addition, according to the structure of present embodiment, thermal diffusion cover 50 and the resin portion 60 being filled in inside thermal diffusion cover 50
Offsettingly it is configured in storage shell 40 relative to heat generating components 20 along the other electronic unit 13a for being installed on substrate 30, thus
Increase heat transfer region while the low other electronic unit 13a of heat resistance can be avoided, can reduce to the low other electronics of heat resistance
The heat of part 13a radiation.
In addition, according to the structure of present embodiment, by the way that the pyroconductivity for storing shell 40 is set to than resin portion 60
Pyroconductivity is big, stores shell 40 and efficiently bears to diffusivity heat generating components 20 via thermal diffusion cover 50 and resin portion 60 and produce
Heat, and can more reliably to store shell 40 external cooling.
(the 2nd embodiment)
Then, it is appropriate below that the electronic control device for vehicle in the 2nd embodiment of the present invention is carried out referring to the drawings
Describe in detail.
The structure ＞ of ＜ electronic control device for vehicle
First, the structure of the electronic control device for vehicle in present embodiment is described in detail referring to Fig. 4.
Fig. 4 is having splitted it and storing one of shell for the electronic control device for vehicle in the 2nd embodiment of the present invention
Equivalent to Fig. 2 on sectional view in the state of point, position.
As shown in figure 4, in electronic control device for vehicle 100 in the present embodiment, main difference is, generation
Thermal diffusion cover 50 on electronic control device for vehicle 10 in 1st embodiment is provided with thermal diffusion cover 110 and thermal expansion
Dissipate cover 120.Thus, in the present embodiment, be conceived to the difference to illustrate, for the 1st embodiment identical
Identical label is marked on structural element, and it is illustrated to carry out suitably omission or simplified.In addition, in Fig. 4, saying for convenience
It is bright, and eliminate the diagram of the resin portion 60 of the inside of thermal diffusion cover 110 and the inside of thermal diffusion cover 120.
Electronic control device for vehicle 100 in present embodiment mainly has heat generating components 20, substrate 30, stores shell
40th, resin portion 60, connector 70, thermal diffusion cover 110,120 and secure component 130.
On thermal diffusion cover 110, the box portion of the rectangular-shape of opened downward is typically made by metals such as iron and is
Part, the thermal diffusion cover 110 covers heat generating components 20 with separating predetermined distance with heat generating components 20, but is by secure component
130 and be installed on the 1st mounting surface 30a of substrate 30, this structure with the thermal diffusion cover 50 in electronic control device for vehicle 10
It is different.That is, thermal diffusion cover 110 except be formed with its top plate portion 56 for through insertion secure component 130 in thickness of slab side
Outside the through hole 111 extended upward through, remaining is identical with the structure of the thermal diffusion cover 50 in electronic control device for vehicle 10.
Thermal diffusion cover 120 and the box portion that thermal diffusion cover 110 is equally the rectangular-shape being typically made up of metals such as iron
Part, but thermal diffusion cover 120 be provided with heat generating components 20 with the 1st mounting surface 30a on the 2nd mounting surface 30b to cover
The state in the corresponding region in region, the 2nd mounting surface 30b is installed in by secure component 130.The thermal diffusion cover 120 with
Cover and the 1st mounting surface 30a region for being provided with heat generating components 20 is observed from the top to the bottom and the 2nd mounting surface is projected on
The state of 30b view field is installed on the 2nd mounting surface 30b.Here, the region covered by thermal diffusion cover 120 is not limited to and institute
The consistent situation of view field is stated, as long as shown in figure 4, comprising the view field or bigger than the view field
Region.
In more detail, thermal diffusion cover 120 is the box part of the unlimited rectangular-shape in top, and the thermal diffusion cover 120 has
Have：Recess 121；4 side of sidewall portion 122a, 122b, 122c, 122d, they are arranged at around recess 121；Multiple foots 124,
They just extend further up from 4 side of sidewall portion 122a, 122b, 122c, 122d upper end 123a, 123b, 123c, 123d
Set, and be accordingly inlaid in the multiple hole portions for the omission diagram for being formed at substrate 30；Multiple clearance portions 125, they distinguish
It is correspondingly formed between 4 side of sidewall portion 122a, 122b, 122c, 122d adjacent side wall；And base plate 126.By
4 side of sidewall portion 122a, 122b, 122c, 122d and base plate 126 mark off recess 121.In addition, pacifying in thermal diffusion cover 120
During loaded on substrate 30, thermal diffusion cover 120 upper end 123a, 123b, 123c, 123d and substrate 30 the 2nd mounting surface 30b it
Between, there are multiple clearance portions 190 to be formed respectively.Clearance portion 125 and clearance portion 190 are arranged for making resin flow into thermal diffusion cover
120 inside.Be formed with base plate 126 for through insertion secure component 130 extended upward through in thickness of slab side run through
Hole 127.
Thermal diffusion cover 120 during the 2nd mounting surface 30b for being installed on substrate 30 when thermal diffusion cover 120 is from the 2nd mounting surface
The height h2 that 30b rises, because heat generating components 20 is not installed on into the 2nd mounting surface 30b, therefore is configured to specific heat diffusion shell 110
The 110 height h1 from the 1st mounting surface 30a of thermal diffusion cover is low when being installed on the 1st mounting surface 30a of substrate 30.Thereby, it is possible to subtract
Interval between the 2nd mounting surface 30b and storage shell 40 of small substrate 30, therefore, it is possible to make electronic control device for vehicle 100 small
Type.In addition, in thermal diffusion cover 120, the electronic unit such as other heat generating components can also be installed on the 2nd installation of substrate 30
On the 30b of face.In addition, for thermal diffusion cover 120, the advantage of cost aspect etc. is formed in by identical material with thermal diffusion cover 110
It is very big, as long as but thermal conductivity ratio stores the big material of pyroconductivity of shell 40 and resin portion 60, can also use and heat
The metal material of diffusion shell 110 metal material not of the same race is formed.
The resin material with mobility for being filled in the inside for storing shell 40 flows into thermal diffusion cover 110 and thermal diffusion cover
120 inside and outside after-hardening, forms resin portion 60 therefrom.Now, it is filled in and stores the inside of shell 40 and have
The resin material of mobility is flowed into the inside of thermal diffusion cover 110 from the clearance portion 55 and clearance portion 90 of thermal diffusion cover 110, and
The inside of thermal diffusion cover 120 is flowed into from the clearance portion 125 and clearance portion 190 of thermal diffusion cover 120.Resin portion 60 will be by thermal diffusion
Cover 110 covering heat generating components 20 seal and be fixed on the inside of thermal diffusion cover 110, and by electronic unit 13a, 13b, 13c,
Substrate 30, thermal diffusion cover 110, thermal diffusion cover 120 and a part of of connector 70 seal and are fixed on the interior of storage shell 40
Portion.
On secure component 130, typically resin is made, and the secure component 130 has head 130a at one end, another
One end has fastening part 130b, wherein, head 130a has the diameter bigger than the diameter of through hole 127.On secure component
130, its by be inserted in be formed at the through hole 111 of thermal diffusion cover 110, be formed at substrate 30 omission diagram
Through hole and be formed in the through hole 127 of thermal diffusion cover 120 and head 130a and thermal diffusion cover 120 through hole
In the state of base plate 126 around 127 is abutted, by fastening part 130b by be pressed into or screw togather etc. and with thermal diffusion cover 110
Through hole 111 around top plate portion 56 tighten together, and make thermal diffusion cover 110 and thermal diffusion cover 120 relative to substrate
30 fix.In addition, the pyroconductivity of secure component 130 is configured to the pyroconductivity same degree with resin portion 60, and setting
It is small into specific heat diffusion shell 110 and the respective pyroconductivity of thermal diffusion cover 120.
The assemble method ＞ of ＜ electronic control device for vehicle
Then, the assemble method of the electronic control device for vehicle 100 in present embodiment is carried out referring to Fig. 4 detailed
Describe in detail bright.In addition, in the assemble method of electronic control device for vehicle in the present embodiment, for the 1st embodiment
In electronic control device for vehicle the identical step of assemble method, omit or simplify its explanation.
First, heat generating components 20 and electronic unit 13a, 13b are installed on to the 1st mounting surface of substrate 30 by soldering etc.
30a, and electronic unit 13c is installed on to by soldering etc. the 2nd mounting surface 30b of substrate 30, afterwards, using thermal diffusion cover
120 is covered the 1st mounting surface 30a region for being provided with heat generating components 20 is observed from the top to the bottom and be projected on the 2nd peace
In the state of dress face 30b view field, thermal diffusion cover 110 and thermal diffusion cover 120 are passed through into secure component across substrate 30
130 are installed on substrate 30.
Specifically, the through hole 127 of thermal diffusion cover 120 is run through from the foreign side of thermal diffusion cover 120 and inserts secure component
130 fastening part 130b.
Then, the fastening part 130b of secure component 130 of the through hole of through hole 127 and substrate will have been sequentially passed through from heat
The inside of diffusion shell 110 run through be inserted into the through hole 111 of thermal diffusion cover 110 until secure component 130 head 130a with
Untill base plate 126 around the through hole 127 of thermal diffusion cover 120 is abutted.
Now, the through hole for being pressed into the fastening part 130b of secure component 130 and thermal diffusion cover 110 or screwing togather etc. is utilized
Top plate portion 56 around 111 tightens together, so that thermal diffusion cover 110 and thermal diffusion cover 120 be fixed relative to substrate 30
Ground is installed to substrate 30.
Then, connector 70 will be installed and electronic unit 13a, 13b, 13c, heat generating components 20, thermal diffusion are installed
The substrate 30 of cover 110 and thermal diffusion cover 120 is received into the inside for storing shell 40 from the opening portion 41 for storing shell 40.
Finally, harden it after the inside that resin material flows into storage shell 40 from opening portion 41 is filled, so that,
In the state of covering heat generating components 20 by thermal diffusion cover 110 and foregoing view field is covered by thermal diffusion cover 120, make electricity
Subassembly 13a, 13b, 13c, heat generating components 20, substrate 30, thermal diffusion cover 110, the one of thermal diffusion cover 120 and connector 70
Part seals and is fixed in storage shell 40.Now, it is filled in the resin material with mobility for the inside for storing shell 40
Inside and the hardening of thermal diffusion cover 110 are flowed into from the clearance portion 55 and clearance portion 90 of thermal diffusion cover 110, so that by heat generating components 20
It is sealed in the inside of thermal diffusion cover 110.In addition, in thermal diffusion cover 120, being installed on there is the electronic units such as other heat generating components
In the case of 2nd mounting surface 30b of substrate 30, similarly, also by the electronic part encapsulation in the inside of thermal diffusion cover 120.
The febrile state ＞ of ＜ heat generating components adstante febres
Then, below to the adstante febre of heat generating components 20 on the electronic control device for vehicle 100 in present embodiment
Febrile state is described in detail.
The situation of the febrile state of the adstante febre of heat generating components 20 of electronic control device for vehicle 100 in present embodiment
It is identical with the content that reference picture 3A is illustrated, and the situation of the heating of heat generating components 20 of electronic control device for vehicle 100
Under Temperature Distribution it is identical with the content that reference picture 3B is illustrated.
But, in electronic control device for vehicle 100 in the present embodiment, because in addition to thermal diffusion cover 110
Thermal diffusion cover 120 is additionally provided with, therefore the heat of the adstante febre of heat generating components 20 also is communicated to inside thermal diffusion cover 120 via substrate 30
Resin portion 60.The heat so transmitted to the resin portion 60 inside thermal diffusion cover 120 is passed towards the diffusivity of thermal diffusion cover 120
Pass, and in the case where inhibiting the form conducted heat again to the resin portion 60 inside thermal diffusion cover 120 in the portion of itself of thermal diffusion cover 120
Part internal heat transfer, and conducted heat via thermal diffusion cover 120 to the resin portion 60 between thermal diffusion cover 120 and storage shell 40, and warp
From the resin portion 60 between thermal diffusion cover 120 and storage shell 40 to conducting heat with storing the diffusivity of shell 40, then to storage shell 40
External cooling.Thus, across substrate 30 further to when the heat of the adstante febre of heat generating components 20 is diffused and conducted heat and
Equalization, can make the highest temperature of electronic control device for vehicle 100 further reduces.Here, due to the heat of secure component 130
Conductivity set is set to specific heat diffusion shell 110 and thermal diffusion cover 120 into the pyroconductivity identical degree with resin portion 60
Respective pyroconductivity is small, therefore when being diffused in the heat to the adstante febre of heat generating components 20 and making its equalization, will not bring
Unnecessary heat affecting.In addition, in thermal diffusion cover 120, substrate 30 is installed on even in electronic units such as other heat generating components
The 2nd mounting surface 30b in the case of, certainly similarly, can further to the grade adstante febre of heat generating components 20 heat expand
Dissipate and make its equalization, making the highest temperature of electronic control device for vehicle 100 further reduces.
In addition, in the present embodiment, not installing heat generating components in the inside of thermal diffusion cover 120, but it is also possible in thermal expansion
Dissipate the inside of cover 110 and be respectively mounted heat generating components with the inside both sides of thermal diffusion cover 120.
The structure of present embodiment more than, in addition to the effect of the 1st embodiment, is also made with metal
Thermal diffusion cover 120, the thermal diffusion cover 120 is installed on the 2nd mounting surface 30b at the back side as the 1st mounting surface 30a of substrate 30
On, and the 2nd mounting surface 30b of covering region corresponding with the 1st mounting surface 30a region for being provided with heat generating components 20, and
The thermal diffusion cover 120 is sealed in storage shell 40 by being filled in the resin portion 60 for the inside for storing shell 40, thereby, it is possible to
Produced by making to be installed on the 1st mounting surface 30a heat generating components 20 and via substrate to the 2nd mounting surface 30b transmit it is hot efficiently
Conducted heat and to external cooling, the region for producing localized hyperthermia can be reliably suppressed.
In addition, according to the structure of present embodiment, the secure component 130 being also made with resin, the secure component 130 will
Thermal diffusion cover 110 is secured to one another across substrate 30 with thermal diffusion cover 120, so as to without soldering by thermal diffusion cover
110 are installed on substrate 30 with thermal diffusion cover 120, there is no need for soldering to the research of the layout of substrate 30 or for soldering
Substrate space, can make the installation of electronic unit and the winding of circuit pattern that there is the free degree, and because do not pass through
The thermal diffusion cover 110 and thermal diffusion cover 120 for riveting and metal being made are installed on substrate, during therefore, it is possible to reduce because being riveted
The possibility of the phenomenons such as the short circuit on substrate is produced from the metal powder that thermal diffusion cover is produced.
In addition, for the present invention, species, configuration, number of part etc. are not limited to foregoing embodiment, certain energy
It is enough that its structural element is suitably replaced as realizing to structural element of equal action effect etc., in the model for the purport for not departing from invention
Can suitably it be changed in enclosing.
Industrial applicability
As described above, the present invention can provide a kind of electronic control device for vehicle, its by efficiently to from
The heat that heat generating components is produced is conducted heat and to external cooling, so as to suppress the region for producing localized hyperthermia, base of the present invention
It is expected to can be widely applied in for motor vehicle electronic-controlled installation such as motor bike in the personality of its general generality.
Claims (5)
1. a kind of electronic control device for vehicle, it has：
Heat generating components；
The heat generating components is installed on substrate, the substrate；And
Shell is stored, it stores the heat generating components and the substrate,
By be filled in it is described storage shell inside resin by the heat generating components and the base plate seals in the storage shell
It is interior,
Characterized in that,
The 1st thermal diffusion cover that the electronic control device for vehicle is also made with metal, the 1st thermal diffusion cover with the hair
The state that thermal part covers the heat generating components with separating predetermined distance is installed on the 1st mounting surface of the substrate, and is led to
Cross the resin for the inside for being filled in the storage shell and be sealed in the storage shell.
2. electronic control device for vehicle according to claim 1, it is characterised in that
The 2nd thermal diffusion cover that the electronic control device for vehicle is also made with metal, the 2nd thermal diffusion cover is installed on the base
On 2nd mounting surface of plate, the 2nd mounting surface is the back side of the 1st mounting surface, and the 2nd thermal diffusion cover covering the described 2nd is installed
Region corresponding with the region for being provided with the heat generating components of the 1st mounting surface on face, and it is described by being filled in
Store the resin of the inside of shell and be sealed in the storage shell.
3. electronic control device for vehicle according to claim 2, it is characterised in that
The secure component that the electronic control device for vehicle is also made with resin, the secure component will be described across the substrate
1st thermal diffusion cover is fastened to each other with the 2nd thermal diffusion cover.
4. the electronic control device for vehicle according to Claims 2 or 3, it is characterised in that
The resin of inside of the 1st thermal diffusion cover and the 2nd thermal diffusion cover is filled in along being installed on the substrate
Other electronic units relative to the heat generating components be offsettingly configured at it is described storage shell in.
5. electronic control device for vehicle according to claim 1, it is characterised in that
The pyroconductivity of resin is big described in the thermal conductivity ratio for storing shell.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-180064 | 2013-08-30 | ||
| JP2013180064A JP6227937B2 (en) | 2013-08-30 | 2013-08-30 | Electronic control device for vehicle |
| PCT/JP2014/068902 WO2015029629A1 (en) | 2013-08-30 | 2014-07-16 | Vehicular electronic control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105493648A CN105493648A (en) | 2016-04-13 |
| CN105493648B true CN105493648B (en) | 2017-07-11 |
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|---|---|---|---|
| CN201480047283.3A Active CN105493648B (en) | 2013-08-30 | 2014-07-16 | Electronic control device for vehicle |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6227937B2 (en) |
| CN (1) | CN105493648B (en) |
| WO (1) | WO2015029629A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016224083A1 (en) * | 2016-12-02 | 2018-06-07 | Robert Bosch Gmbh | Electrical assembly |
| JP6966259B2 (en) * | 2017-08-25 | 2021-11-10 | 日立Astemo株式会社 | Resin-sealed in-vehicle electronic control device |
| JP2020004840A (en) * | 2018-06-28 | 2020-01-09 | アルパイン株式会社 | Electronic unit and manufacturing method thereof |
| JP2021118268A (en) * | 2020-01-27 | 2021-08-10 | 日立Astemo株式会社 | Electronic control device and connector |
| WO2021152899A1 (en) * | 2020-01-27 | 2021-08-05 | 日立Astemo株式会社 | Electronic control device |
| JP7344141B2 (en) * | 2020-01-27 | 2023-09-13 | 日立Astemo株式会社 | electronic control unit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958312A (en) * | 2009-07-16 | 2011-01-26 | 株式会社电装 | Electronic control unit |
| CN102868258A (en) * | 2011-07-07 | 2013-01-09 | 日立汽车***株式会社 | Electronic control device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006313768A (en) * | 2005-05-06 | 2006-11-16 | Denso Corp | Electronic controller |
| JP4910996B2 (en) * | 2007-11-13 | 2012-04-04 | 株式会社デンソー | Electronic control device having heat dissipation structure |
| JP5374271B2 (en) * | 2009-07-31 | 2013-12-25 | 株式会社ケーヒン | Electronic control unit |
| JP2012060014A (en) * | 2010-09-10 | 2012-03-22 | Keihin Corp | Electronic control device |
-
2013
- 2013-08-30 JP JP2013180064A patent/JP6227937B2/en active Active
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2014
- 2014-07-16 CN CN201480047283.3A patent/CN105493648B/en active Active
- 2014-07-16 WO PCT/JP2014/068902 patent/WO2015029629A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958312A (en) * | 2009-07-16 | 2011-01-26 | 株式会社电装 | Electronic control unit |
| CN102868258A (en) * | 2011-07-07 | 2013-01-09 | 日立汽车***株式会社 | Electronic control device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015050274A (en) | 2015-03-16 |
| JP6227937B2 (en) | 2017-11-08 |
| CN105493648A (en) | 2016-04-13 |
| WO2015029629A1 (en) | 2015-03-05 |
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