CN105474395A - 阵列基板、辐射检测器以及配线基板 - Google Patents
阵列基板、辐射检测器以及配线基板 Download PDFInfo
- Publication number
- CN105474395A CN105474395A CN201480045869.6A CN201480045869A CN105474395A CN 105474395 A CN105474395 A CN 105474395A CN 201480045869 A CN201480045869 A CN 201480045869A CN 105474395 A CN105474395 A CN 105474395A
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- 239000000758 substrate Substances 0.000 title claims abstract description 100
- 230000005855 radiation Effects 0.000 title claims description 17
- 239000010409 thin film Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 23
- 230000007797 corrosion Effects 0.000 claims abstract description 20
- 238000005260 corrosion Methods 0.000 claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 13
- 238000009826 distribution Methods 0.000 claims description 60
- 238000006243 chemical reaction Methods 0.000 claims description 53
- 239000011241 protective layer Substances 0.000 claims description 35
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 18
- 239000004020 conductor Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000003989 dielectric material Substances 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 239000012774 insulation material Substances 0.000 claims description 7
- 150000004767 nitrides Chemical class 0.000 claims description 7
- 239000011810 insulating material Substances 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 description 27
- 239000003990 capacitor Substances 0.000 description 25
- 238000005520 cutting process Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 239000004411 aluminium Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 229910052804 chromium Inorganic materials 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 229910052716 thallium Inorganic materials 0.000 description 2
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- MCVAAHQLXUXWLC-UHFFFAOYSA-N [O-2].[O-2].[S-2].[Gd+3].[Gd+3] Chemical compound [O-2].[O-2].[S-2].[Gd+3].[Gd+3] MCVAAHQLXUXWLC-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- MIKCAECBBIRHCH-UHFFFAOYSA-N gadolinium(3+);oxygen(2-);trisulfide Chemical compound [O-2].[O-2].[O-2].[S-2].[S-2].[S-2].[Gd+3].[Gd+3].[Gd+3].[Gd+3] MIKCAECBBIRHCH-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
- H01L27/14663—Indirect radiation imagers, e.g. using luminescent members
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Measurement Of Radiation (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Ceramic Engineering (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013179368A JP2015050236A (ja) | 2013-08-30 | 2013-08-30 | アレイ基板、放射線検出器、および配線基板 |
JP2013-179368 | 2013-08-30 | ||
PCT/JP2014/072135 WO2015029938A1 (ja) | 2013-08-30 | 2014-08-25 | アレイ基板、放射線検出器、および配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105474395A true CN105474395A (zh) | 2016-04-06 |
CN105474395B CN105474395B (zh) | 2018-06-12 |
Family
ID=52586496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480045869.6A Active CN105474395B (zh) | 2013-08-30 | 2014-08-25 | 阵列基板、辐射检测器以及配线基板 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20160148953A1 (zh) |
EP (1) | EP3041049A4 (zh) |
JP (1) | JP2015050236A (zh) |
KR (1) | KR20160032190A (zh) |
CN (1) | CN105474395B (zh) |
WO (1) | WO2015029938A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107589439A (zh) * | 2016-07-07 | 2018-01-16 | 佳能株式会社 | 放射线检测装置、***和用于放射线检测装置的制造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6523803B2 (ja) * | 2015-06-10 | 2019-06-05 | キヤノン電子管デバイス株式会社 | アレイ基板、および放射線検出器 |
KR102556234B1 (ko) * | 2015-12-31 | 2023-07-14 | 엘지디스플레이 주식회사 | 엑스레이 검출기용 어레이기판 및 이를 포함하는 엑스레이 검출기 |
JP2018059724A (ja) * | 2016-10-03 | 2018-04-12 | 東芝電子管デバイス株式会社 | 放射線検出器 |
US11145688B2 (en) * | 2017-06-28 | 2021-10-12 | Sharp Kabushiki Kaisha | Active matrix substrate and method for manufacturing same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011112688A (ja) * | 2009-11-24 | 2011-06-09 | Hitachi Displays Ltd | 表示パネル、表示パネル基板及び表示装置 |
US20120211756A1 (en) * | 2011-02-23 | 2012-08-23 | Mitsubishi Electric Corporation | Array substrate and display device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0527263A (ja) | 1991-07-22 | 1993-02-05 | Toshiba Corp | 液晶表示装置 |
US7193218B2 (en) * | 2003-10-29 | 2007-03-20 | Canon Kabushiki Kaisha | Radiation detection device, method of producing the same, and radiation image pick-up system |
JP2009130273A (ja) * | 2007-11-27 | 2009-06-11 | Konica Minolta Medical & Graphic Inc | ガラス基板および電磁波検出装置の製造方法 |
JP2009170768A (ja) | 2008-01-18 | 2009-07-30 | Mitsubishi Electric Corp | フォトセンサーアレイ基板とフォトセンサー |
JP5336102B2 (ja) * | 2008-04-03 | 2013-11-06 | 三菱電機株式会社 | Tft基板 |
JP4911169B2 (ja) * | 2008-12-25 | 2012-04-04 | 三菱電機株式会社 | アレイ基板及び表示装置 |
JP2010210713A (ja) * | 2009-03-06 | 2010-09-24 | Sharp Corp | アクティブマトリクス基板、アクティブマトリクス基板の製造方法、表示パネル及び液晶表示装置 |
JP5908212B2 (ja) | 2011-01-24 | 2016-04-26 | 株式会社東芝 | 放射線検出器及びその製造方法 |
JP2015092518A (ja) * | 2012-02-22 | 2015-05-14 | 富士フイルム株式会社 | 半導体素子、放射線検出器、及び半導体素子の製造方法 |
-
2013
- 2013-08-30 JP JP2013179368A patent/JP2015050236A/ja active Pending
-
2014
- 2014-08-25 WO PCT/JP2014/072135 patent/WO2015029938A1/ja active Application Filing
- 2014-08-25 KR KR1020167003776A patent/KR20160032190A/ko not_active Application Discontinuation
- 2014-08-25 CN CN201480045869.6A patent/CN105474395B/zh active Active
- 2014-08-25 EP EP14839426.5A patent/EP3041049A4/en not_active Withdrawn
-
2016
- 2016-01-28 US US15/009,254 patent/US20160148953A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011112688A (ja) * | 2009-11-24 | 2011-06-09 | Hitachi Displays Ltd | 表示パネル、表示パネル基板及び表示装置 |
US20120211756A1 (en) * | 2011-02-23 | 2012-08-23 | Mitsubishi Electric Corporation | Array substrate and display device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107589439A (zh) * | 2016-07-07 | 2018-01-16 | 佳能株式会社 | 放射线检测装置、***和用于放射线检测装置的制造方法 |
CN107589439B (zh) * | 2016-07-07 | 2019-10-22 | 佳能株式会社 | 放射线检测装置、***和用于放射线检测装置的制造方法 |
US10481280B2 (en) | 2016-07-07 | 2019-11-19 | Canon Kabushiki Kaisha | Radiation detecting apparatus, radiation detecting system, and manufacturing method for radiation detecting apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP3041049A1 (en) | 2016-07-06 |
KR20160032190A (ko) | 2016-03-23 |
WO2015029938A1 (ja) | 2015-03-05 |
EP3041049A4 (en) | 2017-04-05 |
US20160148953A1 (en) | 2016-05-26 |
JP2015050236A (ja) | 2015-03-16 |
CN105474395B (zh) | 2018-06-12 |
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Effective date of registration: 20160620 Address after: Tochigi County, Japan Applicant after: Toshiba Electron Tubes & Devic Address before: Tokyo, Japan Applicant before: Toshiba Corp Applicant before: Toshiba Electron Tubes & Devic |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tochigi County, Japan Patentee after: Canon Electronic Tube Devices Co., Ltd. Address before: Tochigi County, Japan Patentee before: Toshiba Electron Tubes & Devic |