CN105283294A - Resin molding device and resin molding method - Google Patents
Resin molding device and resin molding method Download PDFInfo
- Publication number
- CN105283294A CN105283294A CN201480029820.1A CN201480029820A CN105283294A CN 105283294 A CN105283294 A CN 105283294A CN 201480029820 A CN201480029820 A CN 201480029820A CN 105283294 A CN105283294 A CN 105283294A
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- China
- Prior art keywords
- resin
- counterdie
- die cavity
- film
- fixture block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims abstract description 482
- 239000011347 resin Substances 0.000 title claims abstract description 482
- 238000000465 moulding Methods 0.000 title claims abstract description 177
- 238000000034 method Methods 0.000 title claims description 34
- 230000007246 mechanism Effects 0.000 claims description 82
- 238000001179 sorption measurement Methods 0.000 claims description 60
- 238000010438 heat treatment Methods 0.000 claims description 26
- 230000009471 action Effects 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 17
- 238000007667 floating Methods 0.000 claims description 12
- 238000012423 maintenance Methods 0.000 claims description 11
- 238000005728 strengthening Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 description 79
- 239000003570 air Substances 0.000 description 46
- 239000000758 substrate Substances 0.000 description 45
- 230000002093 peripheral effect Effects 0.000 description 30
- 230000033001 locomotion Effects 0.000 description 16
- 238000010521 absorption reaction Methods 0.000 description 15
- 230000007423 decrease Effects 0.000 description 14
- 238000002844 melting Methods 0.000 description 12
- 230000008018 melting Effects 0.000 description 12
- 238000007493 shaping process Methods 0.000 description 12
- 238000003860 storage Methods 0.000 description 12
- 238000007689 inspection Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 9
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000011148 porous material Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 230000008602 contraction Effects 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- -1 metallic plate Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The present invention addresses the problem of providing technology that is capable of improving the quality of moldings. As a solution, the lower mold (32) is provided with: a lower mold cavity piece (34) for configuring the bottom of a cavity (33); lower mold clampers (35) for configuring the sides of the cavity (33); a film loader (57) capable of holding and conveying a film (F) on which a resin (R) has been loaded; and a suction section (67) for picking up the film (F), which is disposed so as to cover the edges of the lower mold cavity piece (34) and the edges of the lower mold clampers (35). The lower mold cavity piece (34) moves relative to the lower mold clampers (35). The film loader (57) disposes the film (F) on the lower mold (32), in which the edges of the lower mold cavity piece (34) are held level with the edges of the lower mold clampers (35), so that the resin (R) is positioned above the lower mold cavity piece (34). The suction section (67) picks up and holds the film (F) so as to conform to the inner surface of the cavity (33) and supplies the resin (R) to the cavity (33).
Description
Technical field
The present invention relates to a kind of technology being effectively applied to resin molding machine and resin molding method.
Background technology
Such as carry out as follows in the process that WLP (WaferLevelPackage) etc. is mold formed: (be such as arranged on the workpiece that the multiple chip parts on substrate are electrically connected with substrate by closing line at the workpiece of large of counterdie configuration.), patrix uses formation die cavity recess (to become die cavity when holding workpiece.) molding die.But, when carrying out compression molding using this molding die to supply resin on workpiece, the resin being placed in workpiece central authorities flows laterally, therefore, be easy to produce by the bad problem of the quality being involved in the formed products that pore, gate break (wiresweep) etc. that air causes cause.
On the other hand, the molding die forming die cavity recess (counterdie die cavity) is used by counterdie, to this die cavity recess supply resin, the chip part of the workpiece kept by patrix can be made, closing line impregnated in the resin in the melting of die cavity recess thus carry out resin molded.The resin molded quality that can reduce the formed products such as pore, gate break of carrying out in such counterdie die cavity is bad.As the molding die forming such counterdie die cavity, such as, described in having in Japanese Unexamined Patent Publication 2004-148621 publication (patent document 1).
A kind of such technology is described: make stripping film contrast the shape of die cavity recess and be out of shape in the outside of molding die in this patent document 1, under the state supplying to briquetting (preform) (bottom) corresponding with the bottom of die cavity recess to give resin, stripping film and resin are moved into internally being configured of molding die.
prior art document
patent document
Patent document 1: Japanese Unexamined Patent Publication 2004-148621 publication
Summary of the invention
the problem that invention will solve
Such stripping film described in patent document 1 such as uses the film with certain flexibility, retractility, heat resistance.Such stripping film by being heated at temperature to a certain degree, occurs with the mode thermal contraction towards its central contraction or with the situation of the mode thermal contraction becoming uneven fold.In addition, can be described as the state having put aside many strains stripping film is such as out of shape in the shape contrasting die cavity recess.
Therefore, stripping film such as remain that sample plot deformation of shape as die cavity recess state be configured at the molding die be pre-heated time, cannot be by the shape maintains of stripping film expect shape.Such as, there is the situation producing gap at stripping film generation fold or fold overlap.If produce fold or overlap at stripping film like this, then can produce be transferred to formed products in appearance or the resin problem of leaking from the position of overlap.
The object of the present invention is to provide a kind of technology that can promote the quality of formed products.Described and other object of the present invention and new feature can be specified according to the description of this description and accompanying drawing.
for the scheme of dealing with problems
In invention disclosed in this application, representational summary is described simply, and content is as follows.
The resin molding machine of a technical scheme of the present invention is by patrix and the counterdie mold closing being formed with die cavity recess, the resin being filled in described die cavity recess is utilized to carry out resin molded to workpiece, the feature of this resin molding machine is, described counterdie comprises: counterdie die cavity block, and it forms the bottom of described die cavity recess; Counterdie fixture block, it forms the sidepiece of described die cavity recess; Loading machine, it can keep carrying the film being equipped with described resin; And adsorption section, it configures (also referred to as setting for the mode adsorbing to cover the end face of described counterdie die cavity block and the end face of described counterdie fixture block.) described film, described counterdie die cavity block is configured to relatively to move relative to described counterdie fixture block, and described loading machine is positioned at the end face maintenance level of the end face and described counterdie fixture block that described film is configured at described counterdie die cavity block by the mode above described counterdie die cavity block (also referred to as concordant, identical height to make described resin.) described counterdie, described adsorption section make described film adsorb with following the inner surface of described die cavity recess keep described film, supply described resin to described die cavity recess.
The resin molding machine of another technical scheme of the present invention is by the first mould and the second mould mold closing being formed with die cavity recess, the resin being filled in described die cavity recess is utilized to carry out resin molded to workpiece, the feature of this resin molding machine is, described second mould comprises: die cavity block, and it forms the bottom of described die cavity recess; Fixture block, it forms the sidepiece of described die cavity recess; Movable part, it relatively moves relative to this fixture block for making this die cavity block; And adsorption section, its film configured for the mode adsorbing to cover the end face of described die cavity block and the end face of described fixture block, this resin molding machine comprises loading machine, this loading machine carries described film under the smooth state of described film, and makes the end face of described die cavity block and the end face of described fixture block be positioned at identical height (also referred to as level, concordant.) while, described film is configured in the end face of described die cavity block and the end face of described fixture block with remain smooth state.
The resin molding method of a technical scheme of the present invention uses resin molding machine by patrix and the counterdie mold closing being formed with die cavity recess, the resin being filled in described die cavity recess is utilized to carry out resin molded to workpiece, the feature of this resin molding method is, described counterdie comprises: counterdie die cavity block, and it forms the bottom of described die cavity recess; Counterdie fixture block, it forms the sidepiece of described die cavity recess; Loading machine, it can keep carrying the film being equipped with described resin; And adsorption section, its described film configured for the mode adsorbing to cover the end face of described counterdie die cavity block and the end face of described counterdie fixture block, this resin molding method comprises following operation: (a) utilizes described loading machine with make described resin be positioned at described counterdie that described film to be configured at the end face of described counterdie die cavity block and the end face maintenance level of described counterdie fixture block by mode above described counterdie die cavity block; B () is while utilizing described adsorption section to attract described film, described counterdie die cavity block is made relatively to move relative to described counterdie fixture block and form described die cavity recess, thus make described film adsorb the described film of maintenance with following the inner surface of described die cavity recess, and described resin is intactly supplied to described die cavity recess.
Adopt the present invention, can after with smooth state configuration film, film is out of shape with following the shape of die cavity recess, such as, can prevent film from producing fold or prevent film overlapping.Thus, can prevent formed products from forming bad order or preventing resin from leaking from the position of overlap, thus promote the quality of formed products.In addition, by forming die cavity recess at counterdie, such as make chip part (such as semiconductor chip, chip capacitor), closing line impregnated in the resin of die cavity recess melting, thus the quality that can reduce the formed products caused by pore, gate break etc. is bad.
In addition, preferably, described loading machine comprises hand to the resin molding machine of a technical scheme of the present invention, and this hand has: holding surface, and it is for keeping described film; Recess, it becomes avoidance place of the described resin being equipped on described film and is recessed into from described holding surface; And air flow circuit, it leads to described holding surface around described recess and for attracting described film.
Thereby, it is possible to keep resin being supplied to die cavity recess with being equipped on the state (shape, amount) of the resin of film.In addition, absorption can be carried out in make film not because being mounted in the weight of the resin in the recess on the film mode that bends to keep.
In addition, the resin molding machine of a technical scheme of the present invention preferably, the standby gate portion that can open, close the roller shutter shape of described holding surface of described Loading machine, under the closed condition in described gate portion, utilize described gate portion to support the described film of conveying, under the open mode in described gate portion, configure described film to described counterdie.
Thereby, it is possible to make film not because being mounted in the weight of the resin in the recess on film and the mode bent utilizes gate portion flatly to keep film.In addition, gate portion can be batched when film is configured at counterdie and seek to save space.
In addition, preferably, described Loading machine is for heating part and cooling end for the resin molding machine of a technical scheme of the present invention.
Thus, auxiliary heating that film, the resin be mounted on this film are carried out or cooling transfiguration easy.
In addition, the resin molding machine of a technical scheme of the present invention preferably, the top of described counterdie die cavity block is arranged in the mode that can be separated, the top of described counterdie fixture block is arranged in the mode that can be separated, the top of described counterdie die cavity block utilizes connecting elements to be connected with the top of described counterdie fixture block, the described film that the conveying of described loading machine configures in the mode of the end face on the top of the end face and described counterdie fixture block that cover the top of described counterdie die cavity block under the state of the end face level on the end face on the top of described counterdie die cavity block and the top of described counterdie fixture block.
Thereby, it is possible to film and the resin be mounted on this film are configured on molding die with stable state.
In addition, the resin molding machine of a technical scheme of the present invention preferably, this resin molding machine possesses the upper board of ring-type and the lower panel of ring-type, described lower panel is formed and is recessed into from the face of described upper board side and stage portion circumferentially at circumference end, described film is clipped between described upper board and described lower panel, described upper board is made to be embedded in described lower panel to make the inside diameter of the described upper board mode corresponding with the stage portion of described lower panel, thus form lamina membranacea portion, be formed at described counterdie fixture block and be recessed into and stage portion circumferentially from end face at circumference end, described lamina membranacea portion is made to be embedded in described counterdie fixture block to make the inside diameter of the described lower panel mode corresponding with the stage portion of described counterdie fixture block.
Thereby, it is possible to utilize simple structure flatly to keep film, this film can kept being configured at counterdie under smooth state.
In addition, the resin molding machine of a technical scheme of the present invention preferably, the top of described counterdie die cavity block is arranged in the mode that can be separated, with the top of counterdie die cavity block described in the mode floating support of the end face on top of counterdie die cavity block described under the state of die sinking and the end face level of described counterdie fixture block.
Thus, delivery section such as need not be utilized to press down counterdie fixture block and make the end face of counterdie die cavity block and the end face level of counterdie fixture block, the movement structure of delivery section can be simplified.In addition, when counterdie is configured with film, because the top of counterdie die cavity block is floating state, therefore, it is possible to prevent the thermal contraction of film, the resin preventing from being equipped on film is overheated or to carry out heating adjustment transfiguration easy.
In addition, the resin molding machine of a technical scheme of the present invention preferably, is provided with in the mode can given prominence to from the end face of described counterdie fixture block by multiple pins of floating support at described counterdie fixture block,
Described multiple pin is given prominence to from the end face of described counterdie fixture block and supports described workpiece, is housed in the inside of described counterdie fixture block under the state of the described workpiece of clamping.
Thereby, it is possible to prevent the workpiece kept by patrix before clamping from falling.
the effect of invention
The effect utilizing in invention disclosed in this application, representational form to obtain can promote the quality of formed products in brief exactly.
Accompanying drawing explanation
Fig. 1 is the overall structure figure of the resin molding machine representing an embodiment of the invention by plane figure.
Fig. 2 is the figure of the action for illustration of the resin supply unit supplying corpuscular resin.
Fig. 3 is the schematic sectional view of the pressing part in the resin molded operation of the 1st embodiment of the present invention.
Fig. 4 is the schematic sectional view of the pressing part in the resin molded operation of then Fig. 3.
Fig. 5 is the schematic sectional view of the pressing part in the resin molded operation of then Fig. 4.
Fig. 6 is the schematic sectional view of the pressing part in the resin molded operation of then Fig. 5.
Fig. 7 is the schematic sectional view of the pressing part in the resin molded operation of then Fig. 6.
Fig. 8 is the schematic sectional view of the pressing part in the resin molded operation of then Fig. 7.
Fig. 9 is the schematic sectional view of the pressing part in the resin molded operation of then Fig. 8.
The schematic sectional view of the pressing part in the resin molded operation of Figure 10 the 2nd embodiment of the present invention.
Figure 11 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 10.
Figure 12 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 11.
Figure 13 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 12.
Figure 14 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 13.
Figure 15 is the schematic sectional view of the pressing part in the resin molded operation of the 3rd embodiment of the present invention.
Figure 16 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 15.
Figure 17 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 16.
Figure 18 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 17.
Figure 19 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 18.
Figure 20 is the schematic sectional view of the pressing part in the resin molded operation of the 4th embodiment of the present invention.
Figure 21 is the view sub-anatomy in the lamina membranacea portion shown in Figure 20.
Figure 22 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 20.
Figure 23 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 22.
Figure 24 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 23.
Figure 25 is the schematic sectional view of the pressing part in the resin molded operation of the 5th embodiment of the present invention.
Figure 26 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 25.
Figure 27 is the schematic sectional view of the pressing part in the resin molded operation of the 6th embodiment of the present invention.
Figure 28 is the schematic sectional view of the pressing part in the resin molded operation of another structure example of the present invention.
Figure 29 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 28.
Figure 30 is the schematic sectional view of the pressing part in the resin molded operation of another structure example of the present invention.
Figure 31 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 30.
Figure 32 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 31.
Figure 33 is the schematic sectional view of the pressing part in the resin molded operation of the 7th embodiment of the present invention.
Figure 34 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 33.
Figure 35 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 34.
Figure 36 is the schematic sectional view of the pressing part in the resin molded operation of then Figure 35.
Figure 37 is that the master of the die opening state of the resin molding machine of the 8th embodiment of the present invention looks key diagram.
Figure 38 is the top view of the movable platen of Figure 37.
Figure 39 A and Figure 39 B be then Figure 37 mold closing action midway molding die analyse and observe key diagram.
Figure 40 A ~ Figure 40 C be represent an example of molding die and mold closing action analyse and observe key diagram.
Figure 41 A ~ Figure 41 C be represent another example of molding die and mold closing action analyse and observe key diagram.
Detailed description of the invention
In following embodiments of the present invention, be divided into multiple parts etc. to be described in the case of necessary, but in principle these parts not it doesn't matter each other, part or all the variation, detailed content etc. of relation to be one be another one.Therefore, in all figures of the drawings identical Reference numeral is marked to the component with identical function, there is the situation omitting the explanation that it repeats.In addition, for the same effect obtained by same structure, there is the situation omitting the explanation that it repeats.
In addition, for the number (comprising number, numerical value, amount, scope etc.) of inscape, except express especially situation, in principle, be defined as given number clearly situation etc. except, be not limited to this specific number, both can be more than specific number, also can be below specific number.In addition, when mentioning the shape of inscape etc., except situation about expressing especially with clearly not thought it is except such situation etc. in principle, shape etc. approximate or similar with its shape etc. is in fact comprised.
(the 1st embodiment)
First, the resin molding machine 100 of present embodiment is described with reference to Fig. 1.Fig. 1 is the overall structure figure representing resin molding machine 100 by plane figure.Carry out resin molded structure from needless to say, this resin molding machine 100 be also contained in checked resin molded after workpiece (formed products) after certified products are heating and curing (Post RDBMS) and the structure of being received.
Resin molding machine 100, as the handling part carrying out various treatment process, comprises Workpiece supply portion 110, resin supply unit 120, pressing part 130, Work inspection device portion cooling end 140, solidified portion 150 (curing oven), workpiece incorporating section 160.In addition, resin molding machine 100 comprises the control part 170 for controlling each processing step.Each handling part is at least formed by one, represents resin supply unit 120 in the present embodiment, situation that pressing part 130 is made up of 2 (multiple) respectively.By forming by multiple the handling part more spending the processing time compared with other handling parts like this, the operation ratio of resin molding machine 100 entirety can be promoted.
In addition, resin molding machine 100 comprises robot mechanism portion 180, and this robot mechanism portion 180 possesses the transfer robot for conveying workpieces, resin between handling part.Transfer robot is such as can rotate between reason portion throughout and rectilinear movement, have the robot of hand in multiarticulate front end.In resin molding machine 100, configure each handling part with surrounding robot mechanism portion 180 (transfer robot).Therefore, it is possible to shorten the workpiece, (movement of workpiece represented by dashed line, resin in FIG of the displacement of resin throughout between reason portion.), can conveying workpieces efficiently.In addition, also can substitute machine robot mechanism portion 180, and utilize the conveying mechanism except transfer robot that is made up of the straight-line motion mechanism that cylinder, linear motor are such to conveying workpieces, resin between handling part.
Workpiece supply portion 110 (with reference to Fig. 1) is for the handling part carrying out resin molded pressing part 130 and supply workpiece.Workpiece supply portion 110 possesses the job library (not shown) of the workpiece before can receiving multiple shaping (be formed product).The workpiece come from the supply of this job library by the transfer robot in robot mechanism portion 180 be temporarily positioned in robot mechanism portion 180 the workpiece mounting portion (not shown) that possesses, the loading machine 190 (delivery section) that the portion 130 that is stamped possesses is transported to pressing part 130.
Resin supply unit 120 (with reference to Fig. 1) is for the handling part carrying out resin molded pressing part 130 and supply resin.At this, with reference to Fig. 2, resin supply unit 120 is described.Fig. 2 is (hereinafter referred to as particulate resin for illustration of the corpuscular resin R of supply.) the figure of action of resin supply unit 120.
As shown in Figure 2, resin supply unit 120 comprise can the resin storage unit 121 of storage granules resin R, multiple small-sized resin storage unit 122, for supplying multiple grooves 123 of particulate resin R to resin supply area (supply object).Paired resin storage unit 122 is communicated with groove 123, is set to utilize XY driving mechanism (not shown) mobile.Resin storage unit 121 is arranged regularly, can mass storage particulate resin R, supplies particulate resin R with being divided into aliquot to the resin storage unit 122 more small-sized than this resin storage unit 121.And, utilize electromagnetic feeder (not shown) to send particulate resin R from resin storage unit 122 to groove 123, cast resin supply area with predetermined shape (such as flat condition).
Resin storage unit 122 and groove 123 form at least arranging a pair, but by arranging multipair (in Fig. 2 be three to), the time casting particulate resin R to resin supply area can be shortened.Three pairs of resin storage units 122 and groove 123 utilize coupling member 124 to link up.Utilize this link, though not for each to all arranging electromagnetic feeder, an electromagnetic feeder also can be utilized to become the mode of intended shape simultaneously to the resin of the amount of resin supply area supply same degree.By arranging multiple resin supply structure like this, the resin of correct component can be supplied rapidly.Equally, the liquid resinous distributor of multiple supply can also be possessed.In this case, the liquid resin of correct component can also be supplied rapidly.
The supply of resin supply unit 120 is to liking stripping film F.The film that stripping film F such as adopts fep film, PET film, fluorine-containing glass fabric, polyvinylidene chloride, PTFE, ETFE etc. have certain flexibility, retractility, heat resistance.And, the stripping film F becoming resin supply object is held component 126 by one from the state of web-like and extracts out on supporting station 125, wide by holding the film that cut-off component 127 (such as cutter) under state that component 126,126 holds is cut to once-forming amount in the position becoming preset width, become the state of predetermined shape (such as strip).
To stripping film F (resin supply area), first supply resin be each groove 123 while along bearing of trend (X-direction) the mobile supply on one side particulate resin R of first row supply area, moves after completing the rectangle supply area supply resin to the amount of row towards secondary series direction (Y-direction).Then, each groove 123 is mobile while supply particulate resin R along the bearing of trend (X-direction) of secondary series supply area, moves to the 3rd column direction (Y-direction) at the rear of resin supply of the amount completing row.Then, each groove 123 is mobile while supply particulate resin R along the bearing of trend (X-direction) of the 3rd row supply area, completes the resin supply of the amount of row and completes to whole resin supply area supply resin.
Adopt such resin supply unit 120, (lift-launch) particulate resin R can be supplied with predetermined time according to predetermined region (area), predetermined thickness (highly) on stripping film F.And, be supplied to after particulate resin R on stripping film F and stripping film F is together transported to loading machine 190 by robot mechanism portion 180, be loaded the inside that machine 190 is moved to pressing part 130.Therefore, stripping film F is also the carrier film for carrying resin R.
Pressing part 130 (with reference to Fig. 1) is for carrying out resin molded, to be shaped molded resin portion (forming section) handling part to workpiece.Explain after this treatment process.Workpiece after shaping is loaded machine 190 and is temporarily positioned in the workpiece mounting portion (not shown) that robot mechanism portion 180 possesses, then is handed off to the transfer robot in robot mechanism portion 180.
Work inspection device portion cooling end 140 (with reference to Fig. 1) is the handling part of the state for checking the workpiece after shaping (formed products), and is for by by the handling part of work-piece cools heated.Cooling end also can be arranged relative to Work inspection device portion in addition, but by being configured in the white space in Work inspection device portion, can make compact conformation.
The inspection item in Work inspection device portion such as has the thickness measure of workpiece, the visual examination etc. of workpiece.These check results are sent to control part 170 and process.Such as in the lump or point to cede territory to take formed products, checked whether by visual inspection cob webbings such as not filling.When the existence that is shaped is fine or not and bad, bad kind, shooting image are stored in the storage part of control part 170 as operation information.When detecting exception (exceeding not filling of anticipation), by making the overall stopping action of device safeguard, continuous seepage defective work can be prevented.When having checked, utilize transfer robot from the work delivery position of Work inspection device portion cooling end 140 to solidified portion 150 conveying workpieces.
Solidified portion 150 (with reference to Fig. 1) is the handling part for be heating and curing in the moulded resin portion of workpiece (Post RDBMS).Solidified portion 150 utilizes shutter door (not shown) to close relative to outside, and its inside is heated to predetermined temperature.When the workpiece that transfer robot keeps is close to curing oven 150, shutter door is open, and when workpiece is configured in inside, transfer robot is kept out of the way, shutter door is closed, and is heating and curing the scheduled time.Afterwards, be transferred robot and be transported to workpiece incorporating section 160 after the workpiece that solidified portion 150 takes out of cools Work inspection device portion cooling end 140.
Workpiece incorporating section 160 (with reference to Fig. 1) is for receiving the handling part of workpiece as the final operation of resin molding machine 100.Workpiece incorporating section 160 possesses the job library same with Workpiece supply portion 110, utilizes the transfer robot in robot mechanism portion 180 to be accommodated in this job library by workpiece (formed products).
Then, the pressing part 130 of the resin molding machine 100 of present embodiment is described with reference to Fig. 3.Fig. 3 is the schematic sectional view of the pressing part 130 of present embodiment.The workpiece W of the state of the product of being formed is show also in this Fig. 3.Chip part 11 (such as semiconductor chip) is arranged on substrate 10 (such as circuit board) by chip join by workpiece W, utilizes closing line (not shown) that substrate 10 and chip part 11 electrical connection are formed.
Pressing part 130 possesses molding die 30 (paired patrix 31 and counterdie 32).In the present embodiment, counterdie 32 is set to moveable die, patrix 31 is set to fixed mould is described, but also can be patrix 31 is set to moveable die, counterdie 32 is set to fixed mould or patrix 31 and counterdie 32 is set to the situation of moveable die.
In molding die 30, maintain workpiece W at patrix 31, be provided with die cavity recess 33 at counterdie 32 and (during in holding workpiece, form die cavity C.)。Molding die 30 comprises the counterdie die cavity block 34 of the bottom forming die cavity recess 33 and surrounds this counterdie die cavity block 34 and form the counterdie fixture block 35 of the sidepiece (wall portion) of die cavity recess 33.In molding die 30, relatively moved relative to counterdie fixture block 35 by counterdie die cavity block 34, the degree of depth (highly) change of die cavity recess 33, the volume change of die cavity C.
Specifically describe the structure of patrix 31.Patrix 31 comprises upper die base 36, patrix inserts 37, patrix fixture block 40.Fixedly be assembled with patrix inserts 37 at the lower surface of upper die base 36, this patrix inserts 37 possesses not shown heater, and being configured to can heated parts W, and patrix fixture block 40 is can the mode of movement along the vertical direction assemble.Patrix fixture block 40 is made up of one piece of tabular mould, is formed with through hole 41 at this patrix fixture block 40.Insert at the through hole 41 of this patrix fixture block 40 and be configured with patrix inserts 37.That is, patrix inserts 37 surround by patrix fixture block 40.
Patrix fixture block 40 by the elastic component 42 (such as spring) forming movable part with can the mode of movement be along the vertical direction assembled, hanger bearing (floating support) is in upper die base 36.Therefore, the relation between the patrix inserts 37 fixing relative to upper die base 36 and the patrix fixture block 40 movable relative to upper die base 36 is that patrix inserts 37 utilizes the flexible of elastic component 42 and relatively moves relative to patrix fixture block 40.
Under the state (not being subject to the state from externalities) that the elastic component 42 that the situation of die sinking is such is not biased, the lower surface (end face of downside) of patrix inserts 37 is in the position (position of top) higher than the lower surface (end face of downside) of patrix fixture block 40.In other words, the lower surface of patrix fixture block 40 is in the position (position of below) lower than the lower surface (end face of downside) of patrix inserts 37.Be described afterwards, by forming confined space (chamber) by patrix fixture block 40 and counterdie fixture block 35 with such difference of height when mold closing, can reducing pressure, it is resin molded to carry out.In addition, by patrix inserts 37 being set to relatively to move relative to patrix fixture block 40, regardless of the thickness of slab of workpiece W, can both at uniform height and position holding workpiece W.
In addition, patrix 31 possesses the containment member 43 (such as O-ring seals) between the inner peripheral surface of the through hole 41 of outer peripheral face and the patrix fixture block 40 being arranged on patrix inserts 37.In order to make to reduce pressure in the die cavity C that formed when holding workpiece, sealing component 43 seals (with reference to Fig. 7) in the mode making the gap between the inner peripheral surface of the through hole 41 of the outer peripheral face of patrix inserts 37 and patrix fixture block 40 and become air flow circuit 41A.
Be formed with the air flow circuit 44 leading to mold exterior from the inner peripheral surface of through hole 41 in the mode be communicated with air flow circuit 41A at patrix fixture block 40.This air flow circuit 44 is communicated with the relief portion 45 (such as pump) of mold exterior.Be described afterwards, via air flow circuit 41A and the air flow circuit 44 in gap, utilize relief portion 45 that die cavity C is reduced pressure.
In addition, the work holding portion thereof (with reference to Figure 27) for holding workpiece W is provided with at patrix 31.This work holding portion thereof is provided with the air flow circuit 90 be communicated with the end face of patrix inserts 37, utilizes the relief portion 91 communicated with this air flow circuit 90 to adsorb in the mode that the lower surface at the back side and patrix inserts 37 that make the substrate 10 of workpiece W is involutory, holding workpiece W.Or, work holding portion thereof also can be utilize be arranged on the claw of the end face of patrix inserts 37, situation that electrostatic chuck carrys out holding workpiece W.
Specifically describe the structure of counterdie 32.Counterdie 32 as moveable die utilizes known mould clamping device to carry out die sinking, mold closing, and this mould clamping device makes counterdie movable platen be elevated by the drive transmission mechanism utilizing drive source (electro-motor) to drive (linkage or the leading screw etc. such as toggle link).In this case, the lifting action of counterdie 32 at random can set translational speed, plus-pressure etc.
Counterdie 32 comprises lower die base 46, counterdie die cavity block 34, counterdie fixture block 35.Counterdie die cavity block 34 is fixedly assembled with at the upper surface of lower die base 46, and so that the mode of movement along the vertical direction counterdie fixture block 35 can be assembled with.Counterdie fixture block 35 is made up of one piece of tabular mould, is formed with through hole 47 at this counterdie fixture block 35.Insert at the through hole 47 of this counterdie fixture block 35 and be configured with counterdie die cavity block 34.That is, counterdie die cavity block 34 surround by counterdie fixture block 35.In addition, counterdie die cavity block 34 is by possessing not shown heater, and being configured to as aftermentioned can heated resin R.
Counterdie fixture block 35 by the elastic component 50 (such as spring) forming movable part with can the mode of movement be along the vertical direction assembled, floating support is in lower die base 46.Therefore, the relation between the counterdie die cavity block 34 fixing relative to lower die base 46 and the counterdie fixture block 35 movable relative to lower die base 46 is, counterdie die cavity block 34 utilizes the flexible of elastic component 50 relatively to move relative to counterdie fixture block 35.
Under the state (not being subject to the state from externalities) that the elastic component 50 that the situation of die sinking is such is not biased, the upper surface (end face of upside) of counterdie die cavity block 34 is in the position (position of below) lower than the upper surface (end face of upside) of counterdie fixture block 35.Be described afterwards, by with such difference of height by counterdie die cavity block 34 can arrange relative to the mode of counterdie fixture block 35 relatively movement, the degree of depth (volume of die cavity C) of die cavity recess 33 can be changed.
In addition, counterdie 32 possesses the containment member 51 (such as O-ring seals) between the inner peripheral surface being arranged on the outer peripheral face of counterdie die cavity block 34 and the through hole 47 of counterdie fixture block 35.In order to attract the stripping film F of the die joint being configured at counterdie 32, the mode that sealing component 51 becomes air flow circuit 47A with the gap between the inner peripheral surface of the through hole 47 of the outer peripheral face and counterdie fixture block 35 that make counterdie die cavity block 34 seals (with reference to Fig. 5).Because the inner peripheral surface of the upper surface of counterdie die cavity block 34 and the through hole 47 of counterdie fixture block 35 forms die cavity recess 33, therefore, the bight between the bottom of air flow circuit 47A and die cavity recess 33 and sidepiece is communicated with.
Be formed with in the mode be communicated with this air flow circuit 47A the air flow circuit 52 leading to mold exterior from the inner peripheral surface of through hole 47 at counterdie fixture block 35.This air flow circuit 52 is communicated with the adsorption section 53 (such as pump) of mold exterior.Be described afterwards, via air flow circuit 47A and the air flow circuit 52 in gap, utilize adsorption section 53 to adsorb the central portion keeping stripping film F with following the shape of die cavity recess 33.
In addition, the air flow circuit 54 leading to mold exterior from the upper surface of counterdie fixture block 35 is formed at counterdie fixture block 35.This air flow circuit 54 is communicated with the adsorption section 55 (such as pump) of mold exterior.Be described afterwards, via air flow circuit 54, utilize adsorption section 55 that the absorption of the peripheral part of stripping film F is remained on the clamping face of counterdie fixture block 35.
In addition, be adjacent to be provided with loading machine 190 (with reference to Fig. 1) with each pressing part 130, this loading machine 190 has can to the work loader 56 of patrix 31 conveying workpieces W and the film loading machine 57 can carrying resin R and stripping film F to counterdie 32.In loading machine 190, work loader 56 and film loading machine 57 are configured to can from robot mechanism portion 180 to pressing part 130 inside handing-over workpiece W, stripping film F, work loader 56 and film loading machine 57 utilize not shown driving mechanism to be driven in different system respectively, can take out of, move into workpiece W, stripping film F relative to pressing part 130.In addition, film loading machine 57 both can be the structure accepting resin R and stripping film F in loading machine 190 from robot mechanism portion 180, and robot mechanism portion 180 also can be utilized resin R and stripping film F to be transported to resin supply unit 120 ground supply resin R and stripping film F.
Work loader 56 comprises support plate 60, support 61, location division 62.The size of the plane domain of support plate 60 is such as configured the plane domain of the through hole 41 being greater than patrix fixture block 40.At the upper surface of this support plate 60, be provided with the support 61 overlooked in the form of a ring at predetermined height.In addition, support plate 60 upper surface and than support 61 position in the outer part, be provided with multiple location division 62 (such as selling) at predetermined height.
Support 61 is arranged inside the outward flange of the substrate 10 of workpiece W with its plane domain, become the mode of same degree with the plane domain of substrate 10 is as far as possible arranged.In addition, support 61 is arranged in the mode of its height higher than the height (such as the thickness of chip part 11, the height of closing line) of the component be mounted on the substrate 10 of workpiece W.Thus, the mode that workpiece W does not contact (interference) with support plate 60 with closing line (not shown) with chip part 11 supports in the periphery portion supported portion 61 of substrate 10.
Location division 62 is contacted by the inner peripheral surface of the through hole 41 with patrix fixture block 40, be configured to work loader 56 to be located relative to patrix inserts 37, as an example, the planar configuration of this location division 62 is separately positioned on the bight overlooking rectangular through hole 41 of patrix fixture block 40.In addition, the mode that location division 62 contacts with the inner peripheral surface of through hole 41 with its height before workpiece W is handed off to patrix inserts 37 is arranged.Thus, workpiece W utilizes location division 62 to locate in the mode of the presumptive area being configured in the lower surface of patrix inserts 37.
Utilize the work loader 56 of such structure, the back side of the substrate 10 of workpiece W is contacted with the lower surface of patrix inserts 37, workpiece W is joined to patrix 31.Now, utilize support 61 by substrate 10 by the lower surface at patrix inserts 37, utilize the maintaining part of patrix 31 to keep this substrate 10 (workpiece W).
Film loading machine 57 possesses for adsorbing the hand 63 keeping being equipped with the stripping film F of resin R.Hand 63 has the recessed recess 66 in the holding surface 64 (adsorption plane) for keeping stripping film F, the air flow circuit 65 leading to holding surface 64, self-sustaining face 64.
The size (size of the plane domain of hand 63) of holding surface 64 becomes the size can adsorbed along the periphery of the plane domain of the stripping film F of such as strip.Recess 66 is formed multiple in the mode being such as configured to the capable m of n arranging the matrix of (in n, m at least any one is more than 2) in the region of holding surface 64 on hand 63.Air flow circuit 65 with not and recess 66 interfere lead to the outside of hand 63 from holding surface 64 (holding surface 64 between the peripheral part of such as holding surface 64, recess 66) mode be formed at hand 63.The air flow circuit 65 leading to holding surface 64 is arranged on the surrounding of recess 66 (between each recess 66).In addition, air flow circuit 65 is communicated with the adsorption section 67 (such as pump) of the outside of hand 63.Thus, by adsorbing the stripping film F being equipped with resin R with surrounding resin R, can apply in week to stretch outside as required to keep this stripping film F, utilize the weight of resin R, flatly can adsorb in the non-deflecting mode of stripping film F and keep this stripping film F.In addition, the state that stripping film F mentioned here is smooth refers to, stripping film F does not bend or not crooked, the smooth conveying to resin R, state for the no problem degree of the setting of molding die 30, might not be plane completely.
Utilize the film loading machine 57 of such structure, while guaranteeing that avoidance is equipped on the resin R of stripping film F in recess 66, attract stripping film F from the ambient air stream 65 of recess 66.Thereby, it is possible to resin R and stripping film F is handed off to counterdie 32 under stripping film F is flatly held in the state of holding surface 64 (not having the state of being out of shape).In addition, guarantee due to recess 66 can be utilized to avoid resin R, therefore, it is possible to keep the state (shape, amount) being equipped on the resin R of stripping film F.In addition, in the present embodiment, be not at whole of stripping film F but be divided into multiple region (corresponding with multiple recess 66.) carry resin R.In addition, according to the intensity of stripping film F, the weight of resin R, also only attracting holding can be carried out in the periphery of stripping film F.
Then, with reference to Fig. 3 ~ Fig. 9, the resin molding method (method of operating of resin molding machine 100) utilizing the resin molding machine 100 of present embodiment to carry out is described.Fig. 3 ~ Fig. 9 is the schematic sectional view of the pressing part 130 in the resin molded operation of present embodiment.
The resin molding machine 100 of present embodiment possesses the stripping film F of the die joint being configured in counterdie 32.By using stripping film F, resin can be prevented from the clearance leakage between counterdie die cavity block 34 and counterdie fixture block 35.In addition, can prevent the resin between counterdie die cavity block 34 and counterdie fixture block 35 from blocking and guaranteeing the relative movement of counterdie die cavity block 34 relative to counterdie fixture block 35.In addition, according to the intensity of stripping film F, the weight of resin R, also only attracting holding can be carried out in the periphery of stripping film F.
As shown in Figure 3, under the state in molding die 30 die sinking, work loader 56 is utilized to move into workpiece W from mold exterior.
In addition, under the state of molding die 30 die sinking, film loading machine 57 is utilized to move into resin R and stripping film F.Before this, the stripping film F of web-like carries (supply) resin R, stripping film F is cut to predetermined shape (such as strip) (with reference to Fig. 2).This stripping film F adsorbed portion 67 attracts and is adsorbed on holding surface 64, is moved in a flattened condition.In addition, the attraction action (with reference to Fig. 3 etc.) of adsorption section 67 grade is represented with arrow.
Then, as shown in Figure 4, make work loader 56 increase, workpiece W is handed off to patrix 31.Specifically, make utilizing the rising of work loader 56 after location division 62 is connected to the inner peripheral surface of through hole 41 of patrix fixture block 40, to make the back side of substrate 10 be connected to the lower surface of patrix inserts 37.Then, utilize work holding portion thereof (not shown) that substrate 10 (workpiece W) is remained on the lower surface of patrix inserts 37.Like this, workpiece W can be joined from work loader 56 to patrix 31.
In addition, as shown in Figure 4, film loading machine 57 is declined, the stripping film F being equipped with resin R is handed off to counterdie 32, start to make resin R melting.Specifically, first, the decline of film loading machine 57 is being utilized to make holding surface 64 after stripping film F is connected to the upper surface of counterdie fixture block 35, elasticity of compression component 50 (make movable part movable).That is, the decline of film loading machine 57 is utilized to press down counterdie fixture block 35.Then, film loading machine 57 is declined, until the upper surface (end face of upside) of the upper surface of counterdie die cavity block 34 (end face of upside) and counterdie fixture block 35 becomes the state of level.In addition, also can substitute at this action that film loading machine 57 is declined, and utilize the action making counterdie 32 increase that stripping film F is handed off to counterdie 32.
Now, the resin R on stripping film F is by being started melting by heating in counterdie die cavity block 34.In addition, film loading machine 57 keeps smooth stripping film F in holding surface 64.That is, film loading machine 57 is utilized smooth stripping film F to be kept the counterdie 32 of level with the upper surface (end face of upside) of the upper surface (end face of upside) and counterdie fixture block 35 that make the resin R mode be positioned at above counterdie die cavity block 34 be configured at counterdie die cavity block 34.In addition, stripping film F is smooth when configuring (supply) in counterdie 32.In this case, as shown in Figure 4, when the holding surface 64 being set to film loading machine 57 is crushed on shape such on die cavity recess 33 or size across stripping film F, only carry out being depressed into film loading machine 57 and be connected to action till the end face of die cavity block 34, just can supply stripping film F to the counterdie 32 of level, fold etc. can not be produced and supply simply.
Then, under the state of the upper surface of counterdie die cavity block 34 and the upper surface level of counterdie fixture block 35, the stripping film F of the flat condition that the mode utilize adsorption section 53,55 to adsorb, keeping covering the upper surface of counterdie die cavity block 34 and the upper surface of counterdie fixture block 35 configures.Thereby, it is possible to resin R and stripping film F is handed off to counterdie 32 from film loading machine 57.In addition, adsorption section 53,55 both can be different system, also can be same system.
Then, after maintain workpiece W as aftermentioned, as shown in Figure 5, work loader 56 is declined.Thus, work loader 56 leaves workpiece W.So, workpiece W only keep by patrix 31.
In addition, as shown in Figure 5, while utilizing adsorption section 53,55 to attract smooth stripping film F from air flow circuit 47A, 52,54, make film loading machine 57 increase and make elastic component 50 extend (make movable part movable).So, utilize this elastic component 50 that counterdie die cavity block 34 is relatively moved relative to counterdie fixture block 35, form die cavity recess 33.Now, owing to utilizing the peripheral part of adsorption section 55 adsorption stripping film F, utilize the position corresponding with the bight of die cavity recess 33 of adsorption section 53 adsorption stripping film F, therefore, stripping film F is out of shape with following the inner surface of die cavity recess 33.Thus, stripping film F is kept by absorption with following the inner surface of die cavity recess 33.
In addition, adsorb with following the inner surface of die cavity recess 33 and keep stripping film F, and resin R is intactly supplied to die cavity recess 33.Film loading machine 57 is utilized to be configured in above counterdie die cavity block 34 by resin R across stripping film F, therefore, even if counterdie die cavity block 34 relatively moves relative to counterdie fixture block 35 and forms die cavity recess 33, resin R is fed into die cavity recess 33 with also can keeping state originally.Thus, can to keep the shape with the shape of resin R and resin R is supplied to the bottom of die cavity recess 33 by the mode of invariant position.The quality of the formed products that the way supplying resin R to die cavity recess 33 like this under the state expected is caused by pore, gate break etc. for reduction is bad to work.
Then, as shown in Figure 6, work loader 56 and film loading machine 57 is made to keep out of the way from molding die 30 inside.
Then, as shown in Figure 7, the counterdie 32 as moveable die is made to increase, by molding die 30 mold closing (matched moulds).Specifically, counterdie 32 is made to rise to the position being clamped stripping film F by counterdie fixture block 35 and patrix fixture block 40.Thus, molding die 30 inside comprising die cavity recess 33 is airtight.Now, by driving relief portion 45 in advance, make via air flow circuit 41A and air flow circuit 44 molding die 30 inner pressure relief (degassed) comprising die cavity recess 33.By making molding die 30 inner pressure relief, the air be mixed in resin molding process afterwards in the resin R of melting can be removed, can prevent formed products from producing pore.
Then, as shown in Figure 8, make the counterdie 32 as moveable die increase further, make the upper surface of counterdie fixture block 35 be connected to the peripheral part of substrate 10 across stripping film F.Now, because elastic component 42 is weaker than elastic component 50, therefore, the rising of counterdie 32 (counterdie fixture block 35) is utilized, by patrix fixture block 40 elasticity of compression component 42.Thus, utilize patrix inserts 37 (patrix 31) and counterdie fixture block 35 (counterdie 32) holding workpiece W, the surface of substrate 10 and the lower surface of patrix fixture block 40 become the state of level.By making patrix inserts 37 relatively move relative to patrix fixture block 40 like this, no matter how the thickness of slab of workpiece W can both at uniform height and position holding workpiece W.
Then, as shown in Figure 9, making to rise further as the counterdie 32 of moveable die, chip part 11 be impregnated in utilize the resin R of mold temperature melting after, the molten resin R be filled in die cavity C (die cavity recess 33) is heating and curing, carries out resin molded to workpiece W.Now, mobile to be hindered because counterdie fixture block 35 is connected to patrix 31 across substrate 10, therefore, utilized the rising elasticity of compression component 50 of counterdie 32 (lower die base 46).By adjusting the rising stop position (being in other words the amount of contraction of this elastic component 50) of counterdie 32, can carry out resin molded at the forming thickness (shaping position) expected.Thus, formed products roughly completes.
Afterwards, utilize work holding portion thereof at patrix 31 holding workpiece W (formed products), and utilize adsorption section 53,55 stripping film F to be remained on state lower open die on counterdie 32.Now, by using stripping film F, the workpiece W demoulding can easily be made.And, as aforementioned, through inspection portion cooling end 140, solidified portion 150, workpiece W is accommodated in workpiece incorporating section 160.
By using the resin molding machine 100 of present embodiment, can after with smooth state configuration stripping film F, stripping film F be out of shape with following the shape of die cavity recess 33.Such as, stripping film F can not be supplied to molding die 30 under the state creating fold or overlap.Thus, the fold etc. of stripping film F can be prevented to be transferred to the outward appearance of formed products or to prevent resin from leaking from the position of overlap, promote the quality of formed products.In addition, by forming die cavity recess 33 at counterdie 32, such as make chip part 11, closing line (not shown) impregnated in whole of being fed into die cavity recess 33 and the resin R of melting, make the flowing of resin R become Min., thus the quality that can reduce the formed products such as pore, gate break is bad.
(the 2nd embodiment)
Relative to described 1st embodiment, in the present embodiment, workpiece W and fixture (bottom of patrix inserts 37) are together configured (setting) in patrix 31 by work loader 56, film loading machine 57 comprise heating part, cooling end, gate portion aspect different.Below, be described centered by this difference with reference to Figure 10 ~ Figure 14.Figure 10 ~ Figure 14 is the schematic sectional view of the pressing part 130 of present embodiment.
Along with workpiece W (substrate 10) becomes large, workpiece W produces flexure (warpage) largely, therefore, when just utilizing work loader 56 (support 61) holding workpiece W as described 1st embodiment in the periphery portion of substrate 10, produce substrate 10 and bend because of deadweight and be difficult to keep in mould or decline inferior problem at course of conveying.Therefore, in the present embodiment, the fixture 37A (component) of tabular pushed up to the back side of the substrate 10 of large and prevent flexure, utilizing work loader 56 together to be carried by workpiece W and fixture 37A.This fixture 37A is such as the material (stainless steel) identical with patrix inserts 37.Therefore, the bottom that fixture 37A also can be considered as patrix inserts 37 is arranged in the mode that can be separated.
In addition, when arranging the structure of multiple recess 66 at film loading machine 57 as described 1st embodiment, (air flow circuit 65 leading to holding surface 64 is provided with at the peripheral part of recess 66.) region, resin R cannot be carried on stripping film F.But, when hand 63 forms a larger recess 66 of opening portion and in wider scope, resin R is equipped on stripping film F, well imagine and cause stripping film F excessive deflection by the weight of resin R and be difficult to flatly keep stripping film F.Therefore, in the present embodiment, the gate portion 70 of the stripping film F that can keep being equipped with resin R is had in the opening portion of hand 63.
At this, specifically describe the film loading machine 57 of present embodiment.Film loading machine 57 possesses the gate portion 70 of the roller shutter shape can opened, cut out holding surface 64.Utilize not shown drive division, this gate portion 70 is taken up under the state (open mode) will opening holding surface 64 and self-sustaining face 64 is kept out of the way, under the state (closed condition) will closing holding surface 64, be sent to holding surface 64.Therefore, film loading machine 57 can utilize gate portion 70 to support conveying stripping film F under the closed condition in gate portion 70, under the open mode in gate portion 70, configure stripping film F at counterdie 32.
Gate portion 70 is such as made up of the material that can batch that thinner metallic plate, resin material are such.In addition, the material in gate portion 70 preferably has material, the shape lower relative to the frictional resistance of stripping film F.Thus, do not make that stripping film F is crooked just can be batched.In addition, the mode that the such core 71 of support rod extended along the direction orthogonal with take-up direction enters into gate portion 70 flatly keep stripping film F in more desirable.
Adopt this film loading machine 57, can because being mounted in the weight of the resin R in the recess 66 on stripping film F, the mode that bends flatly keep (supporting) stripping film F in gate portion 70 with stripping film F.In addition, when stripping film F is configured at counterdie 32, gate portion 70 can be batched and seek to save space.But gate portion 70 might not be set to the structure that can batch, even if the component of tabular to be set to the structure can opened, close, stripping film F (i.e. resin R) also can be kept.
In addition, film loading machine 57 comprises cooling end 72 and heating part 73.Thus, auxiliary to stripping film F, be mounted in heating that the resin R on this stripping film F carries out or cooling transfiguration easy.In addition, comprising the structure of heating part by being set to gate portion 70, also can stripping film F be made to imitate the shape of die cavity recess 33 more reliably stripping film F preheating.In this case, such as, by core 71 is set to hot line, the heating part being located at gate portion 70 can be made.
Then, the resin molding method (method of operating of resin molding machine 100) using the resin molding machine 100 of present embodiment to carry out is described.
As shown in Figure 10, under the state of molding die 30 die sinking, work loader 56 is utilized together to be moved into from mold exterior by workpiece W and fixture 37A.
In addition, under the state of molding die 30 die sinking, film loading machine 57 is utilized to move into resin R and stripping film F.Now, when for preventing by radiant heat heated resin R from mould, by making cooling end 72 become opening (or closed condition) in advance, making heating part 73 become closed condition, also can prevent stripping film F, resin R heated.
In addition, utilize the gate portion 70 of closed condition, by under the state of the resin R be mounted on stripping film F, this resin R is moved to molding die 30 in maintenance.This stripping film F adsorbed portion 67 attracts and is adsorbed in holding surface 64, is moved in a flattened condition.
Then, as shown in figure 11, make work loader 56 increase, workpiece W and fixture 37A is together joined to patrix 31.Specifically, make utilizing the rising of work loader 56 after location division 62 is connected to the inner peripheral surface of through hole 41 of patrix fixture block 40, to make the fixture 37A that remain workpiece W be connected to the lower surface of patrix inserts 37.Then, work holding portion thereof (not shown) is utilized workpiece W and fixture 37A to be remained on the lower surface of patrix inserts 37.Like this, workpiece W can be joined from work loader 56 to patrix 31.
In addition, as shown in figure 11, film loading machine 57 is made to decline.Specifically, first, the decline of film loading machine 57 is being utilized to make holding surface 64 after stripping film F and gate portion 70 are connected to the upper surface of counterdie fixture block 35, elasticity of compression component 50 (make movable part movable).That is, the decline of film loading machine 57 is utilized to press down counterdie fixture block 35.Then, film loading machine 57 is declined, until the upper surface of counterdie die cavity block 34 and the upper surface of counterdie fixture block 35 become the state of level.In addition, in order to not make the mold temperature of molding die 30 reduce when making cooling end 72 become opening, in the operation shown in Figure 11, cooling end 72 is preferably made to become closed condition.
Then, as shown in figure 12, work loader 56 is made to decline.Thus, work loader 56 leaves workpiece W.So, workpiece W keep by patrix 31.
In addition, as shown in figure 12, the stripping film F being equipped with resin R is handed off to counterdie 32.Specifically, first, batch gate portion 70, utilize film loading machine 57 smooth stripping film F to be configured at the counterdie 32 of the upper surface of counterdie die cavity block 34 and the upper surface maintenance level of counterdie fixture block 35 in the resin R mode be positioned at above counterdie die cavity block 34.Then, utilize adsorption section 53,55 to be adsorbed by the stripping film F of flat condition, be held in the die joint of the counterdie 32 of the upper surface of counterdie die cavity block 34 and the upper surface level of counterdie fixture block 35.Thereby, it is possible to resin R and stripping film F is joined from film loading machine 57 to counterdie 32.In addition, by making heating part 73 become opening, except except the heating of counterdie 32 side (below), also can heating from top to resin R, the time for carrying out melting can being shortened.Thereby, it is possible to boost productivity.
Then, as shown in figure 13, while utilizing adsorption section 53,55 to attract smooth stripping film F from air flow circuit 47A, 52,54, make film loading machine 57 increase and make elastic component 50 extend (make movable part movable).So, utilize this elastic component 50 that counterdie die cavity block 34 is relatively moved relative to counterdie fixture block 35, form die cavity recess 33.Now, owing to utilizing the peripheral part of adsorption section 55 adsorption stripping film F, utilize the position corresponding with the bight of die cavity recess 33 of adsorption section 53 adsorption stripping film, therefore, stripping film F is out of shape with following the inner surface of die cavity recess 33.Thus, stripping film F is kept by absorption with can following the inner surface of die cavity recess 33.
Now, keep stripping film F by adsorbing with following the inner surface of die cavity recess 33, resin R can be fed into die cavity recess 33 with shape originally.In other words, owing to utilizing film loading machine 57, resin R is configured in above counterdie die cavity block 34 across stripping film F, therefore, even if counterdie die cavity block 34 relatively moves relative to counterdie fixture block 35 and forms die cavity recess 33, resin R is fed into die cavity recess 33 with also can keeping state originally.Thus, can to keep the shape with the shape of resin R and resin R is supplied to the bottom of die cavity recess 33 by the mode of invariant position.
Then, as shown in figure 14, work loader 56 and film loading machine 57 is made to keep out of the way from molding die 30 inside.Afterwards, through the operation that reference Fig. 7 ~ Fig. 9 in described 1st embodiment illustrates, formed products roughly completes.
(the 3rd embodiment)
In described 2nd embodiment, the mounting surface side absorption being equipped with resin R is used in film loading machine 57 and keeps the situation in the gate portion 70 of the hand 63 of stripping film F and that side bearing stripping film F in the face contrary with this mounting surface to be illustrated.In contrast, in the present embodiment, film loading machine 57 uses supporting resin R and stripping film F and it intactly to be configured (setting) different in fixture (component) this point of counterdie 32.Below, be described centered by this difference with reference to Figure 15 ~ Figure 19.Figure 15 ~ Figure 19 is the schematic sectional view of the pressing part 130 of present embodiment.
As described 2nd embodiment, in the gate portion 70 of supporting stripping film F, need to batch (dismounting) gate portion 70 when stripping film F being configured at counterdie 32.Now, likely its distribution is caused to produce bias by the resin R on stripping film F is out of shape etc.Therefore, in the present embodiment, the fixture 34A of tabular pushed up the bottom of stripping film F and keeps smooth stripping film F, utilizing film loading machine 57 together to be carried by stripping film F and fixture 34A, using the fixture 34A being configured with the state of stripping film F as counterdie 32.That is, due to the material (stainless steel) that this fixture 34A is such as identical with counterdie die cavity block 34, therefore, it is possible to the top being considered as counterdie die cavity block 34 is arranged in the mode that can be separated.
At this, specifically describe film loading machine 57 and the pressing part 130 of present embodiment.The fixture 35A that the top that film loading machine 57 comprises counterdie die cavity block 34 is arranged in the mode that can be separated with the top of counterdie fixture block 35 with the fixture 34A that the mode that can be separated is arranged.In addition, be configured with fixture 34A at the through hole of fixture 35A, in order to lift supporting fixture 34A, outer peripheral face and the inner peripheral surface of fixture 35A of fixture 34A utilize multiple connecting elements 74 to be connected.This connecting elements 74 such as also can use as the movable part that fixture 35A can be made movable along the vertical direction relative to fixture 34A as leaf spring.
These fixtures 34A is different with the thickness of fixture 35, and the thickness of fixture 34A is thinner than the thickness of fixture 35A.And, be not subject under the state from externalities, utilizing connecting elements 74 to make the end face of fixture 34A and the end face maintenance level of fixture 35A.In addition, in pressing part 130, under the state (not being subject to the state from externalities) that the elastic component 50 that the situation of die sinking is such is not biased, the bottom upper surface of counterdie die cavity block 34 and the bottom upper surface of counterdie fixture block 35 can be in identical height and position.In the present embodiment, by the thickness difference (difference of height) with such fixture 34A, 35A by fixture 34A (top of counterdie die cavity block 34) relatively can arrange movably relative to fixture 35A (top of counterdie fixture block 35), the degree of depth (volume of die cavity C) of die cavity recess 33 can be changed.
In addition, the pressing part 130 (film loading machine 57) of present embodiment possesses the press section 75,76 pressing stripping film F from upper surface (being equipped with the face of resin R).Press section 75 is formed different for profile 2 flange shape that square annular component combines to press stripping film F around resin R, and the end face of the peripheral part of itself and fixture 34A is relatively arranged.In addition, press section 76 is relatively arranged with the end face of fixture 35A to can relatively press its peripheral part with the end face of the counterdie fixture block 35 of stripping film F.
Utilize film loading machine 57, while the end face of the end face of fixture 34A and fixture 35A is kept level, can carry stripping film F while the end face of these fixtures flatly keeps stripping film F.Thereby, it is possible to stripping film F and the resin R being equipped on this stripping film F are configured at molding die 30 with stable state.
Then, the resin molding method (method of operating of resin molding machine 100) using the resin molding machine 100 of present embodiment to carry out is described.
As shown in figure 15, under the state in molding die 30 die sinking, work loader 56 is utilized to move into workpiece W from mold exterior.In addition, under the state in molding die 30 die sinking, film loading machine 57 is utilized to move into resin R and stripping film F.
In addition, before this, such as, in resin supply unit 120, under the state that the end face of fixture 34A and the end face of fixture 35A keep level, send the stripping film F of web-like, carrying (supply) at this stripping film F has resin R.Then, by stripping film F being cut to predetermined shape (such as strip) (with reference to Fig. 2), due to the end face level of fixture 34A and fixture 35A, therefore, state when this stripping film F is configured at the end face of these fixtures is also smooth.This stripping film F is fed into pressing part 130 by robot mechanism portion 180 and loading machine 190.
Then, as shown in figure 16, make work loader 56 increase, workpiece W is joined to patrix 31.
In addition, as shown in figure 16, film loading machine 57 is made to decline.Specifically, the decline of film loading machine 57 is utilized to make fixture 35A be connected to the upper surface of counterdie fixture block 35.Now, the end face of the end face and fixture 35A (top of counterdie fixture block 35) that utilize film loading machine 57 stripping film F to be flatly configured at fixture 34A (top of counterdie die cavity block 34) keeps the counterdie 32 of level.In addition, now, fixture 34A is not connected to the upper surface of counterdie die cavity block 34.
Then, as shown in figure 17, work loader 56 is made to decline.Thus, work loader 56 leaves workpiece W.
In addition, as shown in figure 17, adsorption section 53,55 is utilized to attract stripping film F.Specifically, utilize the peripheral part of adsorption section 55 adsorption stripping film F, utilize the central portion of adsorption section 53 adsorption stripping film F, the fixture 34A that utilizes connecting elements 74 to make movably to arrange along the vertical direction relative to fixture 35A declines (make movable part movable).
Utilize this connecting elements 74 that counterdie die cavity block 34 is relatively moved relative to counterdie fixture block 35, form die cavity recess 33.Now, owing to utilizing the peripheral part of adsorption section 55 adsorption stripping film F, utilize the position corresponding with the bight of die cavity recess 33 of adsorption section 53 adsorption stripping film F, therefore, stripping film F is out of shape with following the inner surface of die cavity recess 33.Thus, stripping film F is kept by absorption with can following the inner surface of die cavity recess 33.
In addition, adsorb with following the inner surface of die cavity recess 33 and keep stripping film F, and resin R is intactly supplied to die cavity recess 33.Owing to utilizing film loading machine 57 to be configured at above fixture 34A by resin R across stripping film F, therefore, even if form die cavity recess 33, resin R to be fed into die cavity recess 33 with also can keeping state originally.Thus, can keep the shape with the shape of resin R and also invariant position resin R is supplied to the bottom of die cavity recess 33.
Then, as shown in figure 18, while utilizing adsorption section 53,55 to attract stripping film F from air flow circuit 52,54, make film loading machine 57 increase, resin R and stripping film F is handed off to counterdie 32.
Then, as shown in figure 19, work loader 56 and film loading machine 57 is made to keep out of the way from molding die 30 inside.Afterwards, through the operation that reference Fig. 7 ~ Fig. 9 in described 1st embodiment illustrates, formed products roughly completes.
(the 4th embodiment)
In described 1st embodiment, the hand 63 of stripping film F is kept to be illustrated as the situation of film loading machine 57 to using flatly absorption.In contrast, in the present embodiment, use and stripping film F to be supported and intactly to configure (setting) different as film loading machine 57 this point in the fixture (component) of counterdie 32 as plate.Below, be described centered by this difference with reference to Figure 20 ~ Figure 24.Figure 20, Figure 22 ~ Figure 24 is the schematic sectional view of the pressing part 130 of present embodiment.Figure 21 is the view sub-anatomy of the film loading machine 57 (lamina membranacea portion) shown in Figure 20.
Specifically describe the pressing part 130 of present embodiment.Film loading machine 57 possesses upper board 80 and the lower panel 81 of ring-type, consists of by can keep this stripping film F (particularly with reference to Figure 21) under the state from complete cycle stretch release film F from clamping up and down.In the example shown in Figure 21, lower panel 81 to be recessed into from the face of upper board 80 side and stage portion 82 circumferentially at circumference end to be formed in flange shape mode.Stripping film F is clipped between upper board 80 and lower panel 81, to make the inside diameter 80a of upper board 80 mode corresponding with the stage portion 82 (small diameter part) of lower panel 81 make upper board 80 be embedded in lower board unit 81, thus form lamina membranacea portion (film loading machine 57) (particularly with reference to Figure 20).And stripping film F is arranged in the inner circumferential flatly tensioning of upper board 80 and lower panel 81.
In addition, such as, also can use upper board 80 and the lower panel 81 of identical ring-type, utilize bolt etc. be fixed on through hole (avoiding stripping film F position), their circumference and form lamina membranacea portion.
In addition, counterdie fixture block 35 is formed is recessed into and stage portion 83 circumferentially from end face at circumference end.And, to make the inside diameter 81a of lower panel 81 mode corresponding with the stage portion 83 of counterdie fixture block 35, lamina membranacea portion (film loading machine 57) is fitted and fixed with in counterdie fixture block 35.In the present embodiment, simple structure can be utilized flatly to keep stripping film F, in a flattened condition stripping film F can be configured at counterdie 32.
Then, the resin molding method (method of operating of resin molding machine 100) using the resin molding machine 100 of present embodiment to carry out is described.
As shown in figure 20, under the state of molding die 30 die sinking, work loader 56 is utilized to move into workpiece W from mold exterior.In addition, under the state in molding die 30 die sinking, film loading machine 57 is utilized to move into resin R and stripping film F.
In addition, before this, as shown in figure 21, clip stripping film F and form lamina membranacea portion between upper board 80 and lower panel 81, the stripping film F in this lamina membranacea portion carries (supply) resin R.
Then, as shown in figure 22, make work loader 56 increase, workpiece W is joined to patrix 31.
In addition, as shown in figure 22, film loading machine 57 is declined, the stripping film F being equipped with resin R is handed off to counterdie 32.Specifically, first, utilizing after the decline of film loading machine 57 secures lower panel 81 in the mode making the lower surface of lower panel 81 and be connected to the upper surface of the stage portion 83 of counterdie fixture block 35, elasticity of compression component 50 (make movable part movable).That is, the decline of film loading machine 57 is utilized to press down counterdie fixture block 35.Then, film loading machine 57 is declined, until the upper surface (end face of upside) of the upper surface of counterdie die cavity block 34 (end face of upside) and counterdie fixture block 35 becomes the state of level.
Now, film loading machine 57 tensioning remains smooth stripping film F.That is, film loading machine 57 is utilized smooth stripping film F to be configured at the counterdie 32 of the upper surface of counterdie die cavity block 34 and the upper surface maintenance level of counterdie fixture block 35 in the resin R mode be positioned at above counterdie die cavity block 34.
Then, under the state of the upper surface of counterdie die cavity block 34 and the upper surface level of counterdie fixture block 35, the stripping film F of the flat condition that the mode utilize adsorption section 53 to adsorb, keeping covering the upper surface of counterdie die cavity block 34 and the upper surface of counterdie fixture block 35 configures.
Then, as shown in figure 23, work loader 56 is made to decline.Thus, work loader 56 leaves workpiece W.So, workpiece W only keep by patrix 31.Then, work loader 56 is made to keep out of the way from molding die 30 inside.
In addition, as shown in figure 23, while utilizing adsorption section 53 to attract smooth stripping film F from air flow circuit 47A, 52, make film loading machine 57 increase, make elastic component 50 extend (make movable part movable).And, utilize this elastic component 50 that counterdie die cavity block 34 is relatively moved relative to counterdie fixture block 35, form die cavity recess 33.Now, be fitted together to by the inside diameter 81a of lower panel 81 and the stage portion 83 of counterdie fixture block 35, the peripheral part of stripping film F is fixed, and utilizes the position corresponding with the bight of die cavity recess 33 of adsorption section 53 adsorption stripping film F, therefore, stripping film F is out of shape with following the inner surface of die cavity recess 33.Thus, stripping film F is kept by absorption with following the inner surface of die cavity recess 33.
Now, keep stripping film F by adsorbing with following the inner surface of die cavity recess 33, resin R is fed into die cavity recess 33 with shape originally.In other words, owing to utilizing film loading machine 57, resin R is configured in above counterdie die cavity block 34 across stripping film F, therefore, even if counterdie die cavity block 34 relatively moves relative to counterdie fixture block 35 and forms die cavity recess 33, resin R is fed into die cavity recess 33 with also can keeping state originally.Thus, can to keep the shape with the shape of resin R and resin R is supplied to the bottom of die cavity recess 33 by the mode of invariant position.The quality of the formed products that the way supplying resin R to die cavity recess 33 in this wise under the state expected is caused by pore, gate break etc. for reduction is bad to work.
Then, as shown in figure 24, the counterdie 32 as moveable die is made to increase, by molding die 30 mold closing (matched moulds).Thereby, it is possible to clamping stripping film F, that is, patrix 31 and counterdie 32 can be utilized to clamp lamina membranacea portion (film loading machine 57).Afterwards, through the operation that reference Fig. 8 ~ Fig. 9 in described 1st embodiment illustrates, formed products roughly completes.
(the 5th embodiment)
In described 1st embodiment, to by utilizing film loading machine 57 (hand 63) to press down counterdie fixture block 35, the situation of the upper surface of counterdie die cavity block 34 and the upper surface level of counterdie fixture block 35 is illustrated.In contrast, in the present embodiment, the fixture 34A (top of counterdie die cavity block 34) of the tabular of floating support is set in counterdie 32, make the upper surface of this fixture 34A and the upper surface level of counterdie fixture block 35 in different.Below, be described centered by this difference with reference to Figure 25 ~ Figure 26.Figure 25 ~ Figure 26 is the schematic sectional view of the pressing part 130 of present embodiment.
Specifically describe the pressing part 130 of present embodiment.The tabular fixture 34A that the top that pressing part 130 possesses counterdie die cavity block 34 is arranged in the mode that can be separated.In addition, pressing part 130 possesses multiple fulcrum posts 84 of the such as corner of the fixture 34A for supporting tabular.In addition, fulcrum post 84 can be assembled in this lower die base 46 relative to the mode of lower die base 46 movement along the vertical direction, is possessed the elastic component 85 (such as spring) with fulcrum post 84 equal number by pressing part 130.Therefore, in the mode of the upper surface of state lower clamp 34A (top of counterdie die cavity block 34) in die sinking and the upper surface level of counterdie fixture block 35, utilize fulcrum post 84 and form the elastic component 85 floating support fixture 34A of movable part.In addition, the fixture 34A of tabular also can be set to and not utilize elastic component 85 and utilize the structure that the such driving mechanism of cylinder, servo motor can be elevated.
Then, the resin molding method (method of operating of resin molding machine 100) of the resin molding machine 100 using present embodiment is described.
As shown in figure 25, under the state in molding die 30 die sinking, move into resin R and stripping film F and join to counterdie 32.Now, the upper surface of the upper surface and counterdie fixture block 35 that utilize film loading machine 57 stripping film F to be flatly configured at fixture 34A (top of counterdie die cavity block 34) keeps the counterdie 32 of level.Then, adsorption section 53,55 is utilized to start to attract stripping film F.
Then, as shown in figure 26, adsorption section 53,55 is utilized to attract stripping film F.Specifically, utilize the peripheral part of adsorption section 55 adsorption stripping film F, utilize adsorption section 53 to attract the air in the space of below stripping film F, the fixture 34A elasticity of compression component 85 arranged in the mode movable along the vertical direction relative to counterdie fixture block 35 also makes its decline (make movable part movable).
Utilize this elastic component 85 that fixture 34A (top of counterdie die cavity block 34) is relatively moved relative to counterdie fixture block 35, form die cavity recess 33.Now, owing to utilizing the peripheral part of adsorption section 55 adsorption stripping film F, utilize the position corresponding with the bight of die cavity recess 33 of adsorption section 53 adsorption stripping film F, therefore, stripping film F is out of shape with following the inner surface of die cavity recess 33.Thus, stripping film F is kept by absorption with following the inner surface of die cavity recess 33.
In addition, adsorb with following the inner surface of die cavity recess 33 and keep stripping film F, and resin R is intactly supplied to die cavity recess 33.Owing to utilizing film loading machine 57 to be configured in above fixture 34A by resin R across stripping film F, therefore, even if form die cavity recess 33, also resin R can be supplied to die cavity recess 33 with keeping state originally.Thus, can to keep the shape with the shape of resin R and resin R is supplied to the bottom of die cavity recess 33 by the mode of invariant position.Afterwards, through the operation that reference Fig. 7 ~ Fig. 9 in described 1st embodiment illustrates, formed products roughly completes.
Thus, such as, film loading machine 57 need not be utilized to press down counterdie fixture block 35 and make the end face of counterdie die cavity block 34 and the end face level of counterdie fixture block 35, the movement structure (output of such as CD-ROM drive motor, the minimizing of stroke) of film loading machine 57 can be simplified.In addition, during owing to configuring stripping film F to counterdie 32, fixture 34A (top of counterdie die cavity block 34) is floating state, therefore, the thermal contraction of stripping film F can be prevented, prevent from being mounted in that resin R on stripping film F is overheated or to carry out heating adjustment transfiguration easy.
(the 6th embodiment)
In described 1st embodiment, under having carried out airtight state to molding die 30 inside comprising die cavity recess 33 at mold closing as illustrating with reference to Fig. 7, the situation of molding die 30 inner pressure relief (degassed) is illustrated.Now, when utilizing the work holding portion thereof of patrix 31 (air flow circuit 90 and adsorption section 91), by absorption, substrate 10 (workpiece W) being held in patrix 31, caused declining for the attraction of sorbing substrate by the attraction for carrying out reducing pressure, substrate 10 likely falls.Relative to so described 1st embodiment, in the present embodiment, make that under the state making multiple pin floating support form pressure reduction space in counterdie fixture block 35, support the structure this point of this substrate 10 in mode substrate 10 being pressed on patrix 31 different.Below, be described centered by this difference with reference to Figure 27.Figure 27 is the schematic sectional view of the pressing part 130 of present embodiment.
Pressing part 130 surrounding possessed along the through hole 47 of counterdie fixture block 35 is arranged on multiple pins 86 of the inside of counterdie fixture block 35.In addition, pin 86 can be assembled in the inside of counterdie fixture block 35 relative to the mode of counterdie fixture block 35 movement along the vertical direction, is possessed the elastic component 87 (such as spring) with pin 86 equal number by pressing part 130.
Therefore, to give prominence to, to abut with the surface of substrate 10 across stripping film F the mode of ground holding workpieces W under the state forming pressure reduction space from the end face of counterdie fixture block 35, the elastic component 87 floating support pin 86 forming movable part is utilized.And under the state of holding workpiece W (with reference to Fig. 8), pin 86 is housed in the inside of counterdie fixture block 35.Thus, can prevent the workpiece W kept by patrix 31 before clamping from falling.
In addition, in figure 27, when utilizing relief portion 45 to form pressure reduction space via air flow circuit 44, this attraction path seems blocked, but is configured partly due to pin 86, therefore can not hinder decompression.
(the 7th embodiment)
Relative to only carrying out resin molded described 1st embodiment to the one side of workpiece W (substrate 10), in the present embodiment, resin molded this point carried out to two faces of workpiece W different.Below, be described centered by this difference with reference to Figure 33 ~ Figure 36.Figure 33 ~ Figure 36 is the schematic sectional view of the pressing part 130 in the resin molded operation of present embodiment.
The workpiece W of present embodiment comprises: substrate 10, and it has a face 10a and another face 10b contrary with this face 10a; And multiple spherical projection 11A, 11A (the 1st parts, the 2nd parts), it is separately positioned on two faces 10a, 10b, and this workpiece W is such as configured to wafer-shaped (tabular).Carry out resin molded to two faces 10a, 10b projection 11A, 11A separately, form resin mold section 14,15 (with reference to Figure 36) respectively at two faces 10a, 10b, workpiece W roughly completes as resin molded finished product (formed products).
The resin molded of workpiece W of such wafer-shaped is referred to as WLP (WaferLevelPackage).In addition, as the parts arranged on the workpiecew, being not limited to the projection 11A as wiring part, both can be chip part (such as semiconductor chip, MEMS chip, chip capacitor etc.), and can be both wiring part and chip part.As substrate 10, not only comprising common substrate, also comprise the component of tabular, also can be the carrier, the semiconductor crystal wafer that are temporarily equipped with parts.
In addition, in the present embodiment, with regard to workpiece W, the workpiece W (with reference to Figure 33) utilizing robot mechanism portion 180 (with reference to Fig. 1) to supply respectively not exposed by resin molded and parts in two faces (projection 11A) and be only a face by resin molded and workpiece W (reference Figure 35) that is that only have the parts in another face (projection 11A) to expose.Therefore, the pressing part 130 of present embodiment comprises the 1st fixture 12 (with reference to Figure 33) and the 2nd fixture 13 (with reference to Figure 35) of tabular.
When utilizing patrix 31 and counterdie 32 holding workpiece W, fixture 12,13 is alternatively arranged on the lower surface of patrix inserts 37 respectively.Fixture 12 has the 1st perforate 12a larger than the lift-launch region of projection 11A and (represents multiple in fig. 33.), this projection 11A is equipped on the semiconductor chip manufactured as finished product on the 10a of face.In other words, the 1st perforate 12a is to avoid the parts that arrange as projection 11A and the mode making workpiece W and fixture 12 overlap is formed.In addition, fixture 13 has 2nd perforate 13a (among Figure 35 the expression one larger than perforate 12a.)。
When using fixture 12, projection 11A (that is, utilizes perforate 12a to guarantee to avoid projection 11A to be accommodated in perforate 12a.) mode be equipped on the face 10a (with reference to Figure 33) of workpiece W.In addition, when using fixture 13, resin mold section 15 (that is, utilizes perforate 13a to guarantee to avoid resin mold section 15 to be accommodated in perforate 13a.) mode be equipped on the face 10b (with reference to Figure 35) of workpiece W.In the present embodiment, by using fixture 12,13, (avoidance) projection 11A, resin mold section 15 ground holding workpiece W (with reference to Figure 34, Figure 36) can be avoided.
In addition, because fixture 12,13 can be replaced, therefore, molding die 30 can be shared when being shaped other finished product, using other fixture.In addition, also can use even if fixture 12,13 is fixed on patrix 31.
In the present embodiment, they are moved to pressing part 130 by loading machine 190 after fixture 12 or fixture 13 being overlapped on the workpiece W joined from robot mechanism portion 180.In addition, loading machine 190 pulls down fixture 12 or fixture 13 since pressing part 130 joins on the resin molded complete workpiece W come, and is taken out of robot mechanism portion 180.By preparing fixture 12 or fixture 13 like this on loading machine 190, workpiece W and fixture 12 or fixture 13 together can be handed off to pressing part 130 inner.
Then, the manufacture method (resin molding method) of the formed products (resin molded finished product) using the resin molding machine 100 (compression molding apparatus) of present embodiment to carry out is described.Specifically, the method (once-forming, secondary forming two-stage method of moulding) be shaped one by one for each face in the process forming resin mold section 14,15 as formed products in two faces (face 10a, 10b) of workpiece W is respectively described.
First, for the workpiece W transported by robot mechanism portion 180, in loading machine 190, be accommodated in the face 10a carrying clamp 12 of mode at workpiece W of perforate 12a with projection 11A.In this case, due to carrying clamp 12 in loading machine 190, therefore, 180, robot mechanism portion conveying workpieces W, can use and can remove the less robot mechanism portion 180 of weight, can the manufacturing cost of cutting device.
Its this, under the state in molding die 30 die sinking, utilize work loader 56 (with reference to Fig. 3) to move into workpiece W and fixture 12 from mold exterior, workpiece W and fixture 12 are together joined (reference Figure 33) to patrix 31.Thus, workpiece W can be maintained at the die face of patrix 31.
Specifically, by the face 10b of workpiece W towards under the state of counterdie 32, make fixture 12 be connected to the lower surface of patrix inserts 37, utilize work holding portion thereof (not shown) to adsorb holding workpiece W (substrate 10) in the die face of patrix 31 (patrix inserts 37) across fixture 12.Being provided with the perforate 12a for avoiding the projection 11A be mounted on the face 10a of workpiece W (substrate 10) at fixture 12, therefore such as can protecting projection 11A.In addition, also can not use fixture 12, and carve recess at the lower surface of patrix inserts 37, avoid projection 11A.
In addition, under the state in molding die 30 die sinking, utilize film loading machine 57 (with reference to Fig. 3) to move into resin R and stripping film F, resin R and stripping film F joined from film loading machine 57 to counterdie 32 (with reference to Figure 33).Now, the distortion making the shape of stripping film F follow counterdie die cavity recess 33 from smooth and stripping film F absorption is remained on the die face of the counterdie 32 comprising counterdie die cavity recess 33, and resin R is intactly supplied to counterdie die cavity recess 33.
In addition, by using stripping film F, resin can be prevented from the clearance leakage between counterdie inserts 34 and counterdie fixture block 35.But, when intactly can carry resin R when there is no the impact of such resin leakage, also can not use stripping film F.
Then, as shown in figure 34, make making to rise as the counterdie 32 of moveable die after the projection 11A being located at face 10b all impregnated in the resin R of melting under mold temperature, while utilizing patrix 31 and counterdie 32 holding workpiece W, to make counterdie inserts 34 move to shaping position.Then, the resin R be filled in counterdie die cavity C is heating and curing, carries out resin molded to workpiece W.Thereby, it is possible to form resin mold section 15 at the face 10b of workpiece W.
Afterwards, utilizing work holding portion thereof at patrix 31 holding workpiece W (formed products) and utilizing adsorption section 53,55 to keep the state lower open die of stripping film F at counterdie 32.Now, by using stripping film F, the workpiece W demoulding can easily be made.Then, as aforementioned, workpiece W is accommodated in (with reference to Fig. 1) in workpiece incorporating section 160 through inspection portion cooling end 140, solidified portion 150.
Then, in workpiece incorporating section 160, because the workpiece W possessing the resin mold section 15 being formed at face 10b is incorporated in job library, therefore, job library is moved to Workpiece supply portion 110.Now, in order to resin mold section 14 can be formed at the face 10a of workpiece W, make workpiece W overturn in advance, thus prepare secondary forming.In addition, in order to form resin mold section 14, replacing clamp 12 and fixture 13 and carry out the operation same with the operation forming resin mold section 15.
Then, fixture 13 is equipped on a face 10b of workpiece W by the mode utilizing robot mechanism portion 180 to be accommodated in perforate 13a with the resin mold section 15 of the workpiece W being loaded machine 190 and moving into.At this, the plane domain of the perforate 13a of fixture 13 is greater than the plane domain of resin mold section 15, is in other words the upper surface being greater than the counterdie inserts 34 being configured for the counterdie die cavity C forming resin mold section 15.
Then, under the state of molding die 30 die sinking, utilize work loader 56 (with reference to Fig. 3) to move into workpiece W and fixture 13 from mold exterior, workpiece W and fixture 13 are together handed off to patrix 31 (with reference to Figure 35).Owing to being provided with the perforate 13a for avoiding the resin mold section 15 be mounted on the face 10b of workpiece W (substrate 10) at fixture 13, therefore, such as, resin mold section 15 can be protected.In addition, also can not use fixture 13, and carve recess at the lower surface of patrix inserts 37 and avoid resin mold section 15.
In addition, under the state in molding die 30 die sinking, utilize film loading machine 57 (with reference to Fig. 3) to move into resin R and stripping film F, resin R and stripping film F joined from film loading machine 57 to counterdie 32 (with reference to Figure 35).Now, the distortion making the shape of stripping film F follow counterdie die cavity recess 33 from smooth and stripping film F absorption is held in the die face of the counterdie 32 comprising counterdie die cavity recess 33, and resin R is intactly supplied to counterdie die cavity recess 33.
This resin R for the formation of resin mold section 14, by the resin mold section 15 that is set to and formed before with measuring, the material of homogeneity, projection 11A can be sealed into identical shape.But, in the present embodiment, when the height of the lift-launch represented as projection 11A parts is on the substrate 10 different, also can use separately the resin R of component that is applicable to.In this case, also can from prevent the function of the object of the warpage caused by the difference of resin molded thickness, the parts of the lift-launch resin R that correspondingly character of use is different.
Then, as shown in figure 36, make making to rise as the counterdie 32 of moveable die after the projection 11A being located at face 10a all impregnated in the resin R of melting under mold temperature, while utilizing patrix 31 and counterdie 32 holding workpiece W, to make counterdie inserts 34 move to shaping position.Then, the resin R being filled in counterdie die cavity C is heating and curing, carries out resin molded to workpiece W.Thereby, it is possible to form resin mold section 14 at the face 10a of workpiece W.
Afterwards, utilizing work holding portion thereof at patrix 31 holding workpiece W (formed products) and utilizing adsorption section 53,55 to keep the state lower open die of stripping film F at counterdie 32.Now, by using stripping film F, the workpiece W demoulding can easily be made.Then, as aforementioned, workpiece W is accommodated in (with reference to Fig. 1) in workpiece incorporating section 160 through inspection portion cooling end 140, solidified portion 150.
For workpiece W afterwards, by the end face of grinding resin mold section 14,15, projection 11A is exposed, and turn to each region suitable with 1 chip by monolithic, form 1 packaging (resin molded finished product) being formed with splicing ear face on both faces.In addition, when a face by the substrate 10 by being configured with projection 11A at one side is mutually pasted and is used as workpiece W, turn to the region suitable with 1 chip by monolithic after making the mutual stripping of substrate 10, the packaging that one side is formed with splicing ear face can be formed in efficiently.
Adopt present embodiment, compress moulding method can be utilized to carry out resin molded to two faces 10a, 10b of the workpiece W of tabular respectively.In addition, can resin R be supplied to counterdie die cavity recess 33 (counterdie die cavity C) and carry out resin molded, even therefore large-scale workpiece W, also can be shaped efficiently.
In addition, also after the one side of workpiece W defines resin mold section 15, pressing part 130 can be moved to by workpiece W not being accommodated in ground, workpiece incorporating section 160 and forming resin mold section 14, thus shaping resin molding section 14,15 continuously.
In addition, in the above-described embodiment, also can substitute the gate portion 70 in order to flatly keep resin R and stripping film F to arrange, and carry stripping film F under the state be clipped between resin R and stripping film F at the tabular component in order to flatly keep resin R to be kept by resin.The tabular component that resin keeps can be both such as the various sheet materials such as metallic plate, glass plate or Silicon Wafer, also can be the such structure of lead frame, substrate.In this case, the tabular component that resin keeps both can be peeled off after such shaping, also can be used as the such functional layer of exothermic layer, electro-magnetic screen layer, filter course, lens jacket, wavelength conversion layer, permeation-proof gas-bearing formation or wiring layer by intactly remaining in packaging.By the tabular component using such resin to keep, can utilize by being pasted on workpiece W and the tabular component of multifunction can flatly carry resin R and stripping film F, H.D finished product can be manufactured simply.In addition, the tabular component that also can simultaneously use resin to keep and gate portion 70.
(the 8th embodiment)
In the pressing part of the resin molding machine of described 1st embodiment, to utilizing, known clamping device carries out die sinking to molding die, the situation of mold closing is illustrated.In the present embodiment, the resin molding machine being provided with the clamping device of the maximization (WLP) of reply workpiece W at pressing part is illustrated.Adopt the resin molding machine of present embodiment, by carrying out mold closing accurately and make final resin pressure become high pressure while the depth of parallelism maintaining the movable platen in mold closing course of action, shaping quality can be improved.
Below, the preferably embodiment possessing the resin molding machine of clamping device for opening, closing molding die of the present invention is together described in detail with accompanying drawing.Resin molding machine 201 comprises the molding die 204 with patrix 202 and counterdie 203 and the clamping device 205 for opening, closing this molding die 204.
In Figure 37, clamping device 205 is located at the base portion 206 of rectangle.Utilize between base portion 206 and stationary platen 207 and be configured in each bight (everywhere; With reference to Figure 38) pull bar 208 be connected.Patrix 202 is supported on stationary platen 207, and counterdie 203 is bearing in front (upper surface) side of movable platen 209.Movable platen 209 guide by the pull bar 208 of through connection and move up and down.
Ball screw framework 210 (the 1st mould switching mechanism) is provided with in the rear side of movable platen 209, this ball screw framework 210 connects with this movable platen 209, by molding die 204 mold closing between movable platen 209 and stationary platen 207, until reach the 1st mold clamping force.
Specifically, base portion 206, than pull bar 208 in the inner part be provided with leading screw 211 everywhere, be provided with the 1st CD-ROM drive motor 212 (servo motor) for driving each leading screw 211 to make it rotate everywhere.1st CD-ROM drive motor 212 synchronously drives between multiple motor, can utilize SERVO CONTROL control rate accurately.In addition, movable platen 209 rear side be provided with the hold-down nut 213 chimeric with leading screw 211 screw thread everywhere.In Figure 38, pull bar 208 and leading screw 211 equally spaced configure mutually at the diagonal position of base portion 206 (movable platen 209).In addition, as long as ball screw framework 210 is provided with more than three, then arrange several can.
Elbow-bar mechanism 214 (the 2nd mould switching mechanism) is provided with at the rear side central portion of movable platen 209.Elbow-bar mechanism 214 connects with movable platen 209, carries out mold closing until reach the 2-in-1 mould power strengthening chucking power compared with the 1st mold clamping force further, maintains final resin pressure.Specifically, leading screw 215 and the 2nd CD-ROM drive motor 216 (servo motor) for driving this leading screw 215 to make it rotate is provided with at the central portion of base portion 206.Be fitted together at leading screw 215 screw thread and have movable nut 217.Connecting rod linking part 218 is provided with integratedly at movable nut 217.In addition, each CD-ROM drive motor 216,212 also can be configured in the side of base portion 206 by utilizing band mechanism.
Elbow-bar mechanism 214 is so-called force-increasing mechanisms, consists of and the toggle link structure be made up of following each link component can be utilized to make the output from the 2nd CD-ROM drive motor 216 increase (amplification) and export to movable platen 209.Specifically, the one end linking connecting rod 219 is rotatably linked to connecting rod linking part 218.The other end linking connecting rod 219 is rotatably linked to the top corner portion of triangular coupling rod 220.A bottom corner portion of triangular coupling rod 220 is linked to this base portion 206 in the mode can rotated relative to base portion 206, and another bottom corner portion is rotatably linked to one end of slide link 221.The other end of slide link 221 is rotatably linked to the linking part 209a at the back side being located at movable platen 209.Utilize such structure, in elbow-bar mechanism 214, the 2nd CD-ROM drive motor 216 utilizing screw thread to be fitted together to movable nut 217 drives the linking part 209a being located at the back side of movable platen 209.
In addition, control part 222 drived control the 1st CD-ROM drive motor 212 and the 2nd CD-ROM drive motor 216 is utilized.In addition, each pull bar 208 is respectively equipped with pressure sensor 223.Control part 222, by being detected the clamp pressure of molding die 204 and drived control the 1st CD-ROM drive motor 212 and the 2nd CD-ROM drive motor 216 by pressure sensor 223, controls the mould holding action of ball screw framework 210 and elbow-bar mechanism 214.
Specifically, control part 222 is when starting mold closing action, synchronously drive the 1st CD-ROM drive motor 212 and the 2nd CD-ROM drive motor 216, utilize ball screw framework 210 via movable platen 209 with the 1st mold clamping force clamping be fed into the workpiece of molding die 204 after, make the pressurized state of this ball screw framework 210 be transitioned into the pressurized state pressurizeed by elbow-bar mechanism 214, utilize this elbow-bar mechanism 214 to clamp movable platen 209 until reach the 2-in-1 mould power larger than the 1st mold clamping force.
An example of molding die 204 is described with reference to Figure 40 A.The upper die base 202a of patrix 202 is supported in solid platen 7.Patrix inserts 202b is assembled with at upper die base 202a.Be formed for the workpiece W of patrix inserts 202b absorption is remained the work holding portion thereof 202c concordant with clamping face.
The lower die base 203a of counterdie 203 is supported on movable platen 209.Be formed with recess at the clamping face of lower die base 203a, be supported with counterdie die cavity block 203b at this recess, counterdie fixture block 203c is bearing in around this counterdie die cavity block 203b by helical spring 203d with exerting a force.Counterdie fixture block 203c gives prominence to upward from the upper surface of counterdie die cavity block 203b, is formed with counterdie die cavity recess 203e.Adsorb in the mode covering this counterdie die cavity recess 203e and keep stripping film F.
Stripping film F is held in patrix clamping face by absorption.The thickness of stripping film F is about 0.5mm, there is heat resistance, easily peel off from die face, there is flexibility, extensibility, such as, be applicable to adopting be main component individual layer or the multilayer film such as PTFE, ETFE, PET, fep film, fluorine-containing glass fabric, polypropylene screen, polyvinylidene chloride.
Then, with reference to Figure 37, Figure 39 A and Figure 39 B, Figure 40 A ~ Figure 40 C, the on-off action of clamping device 205 and an example of resin molded action are described.
In Figure 37, under the state of molding die 204 die sinking, not shown feedway is utilized to be supplied to molding die 204 by workpiece W.In addition, the counterdie die cavity recess 203e of counterdie 203 covers in advance and adsorbs and maintains stripping film F.
As shown in fig. 40, workpiece W (being such as equipped with the substrate of semiconductor chip, semiconductor crystal wafer etc.) is adsorbed by the work holding portion thereof 202c of patrix 202 and keeps, and the counterdie die cavity recess 203e covered to stripping film F supplies moulded resin R (liquid resin, particulate resins, particle resin (powdex), sheet material resin, block resin etc.).In addition, also moulded resin R and stripping film F together can be supplied to counterdie die cavity recess 203e.
When starting mold closing action, control part 222 synchronously drives the 1st CD-ROM drive motor 212 and the 2nd CD-ROM drive motor 216.In Figure 39 A, utilize the driving of the 1st CD-ROM drive motor 212, the leading screw 211 that ball screw framework 210 has at four places rotates, along with the rotation of leading screw 211, the movable platen 209 chimeric with hold-down nut 213 screw thread remain relative to stationary platen 207 the depth of parallelism rise.That is, counterdie 203 (specifically its die joint) rises relative to patrix 202 (specifically its die joint) with remain the depth of parallelism.
In addition, utilize the driving of the 2nd CD-ROM drive motor 216, the movable nut 217 chimeric with leading screw 215 screw thread moves upward, therefore, the link connecting rod 219 linked with the both sides of connecting rod linking part 218 is toppled over towards horizontal direction to both sides, triangular coupling rod 220 rotates in the mode erected, thus elbow-bar mechanism 214 boosts slide link 221.Now, owing to being arranged on the gap between slide link 221 and linking part 209a, elbow-bar mechanism 214 does not bear the load come via movable platen 209 transmission.
In addition, as shown in Figure 40 B, under the state being connected to workpiece W (substrate) and patrix inserts 202b across stripping film F at counterdie fixture block 203c, compression helical spring 203d.Thus, in molding die 204, form confined space (pressure reduction space, enclosure space), in die cavity recess 203e (die cavity), be filled with resin R.In this case, risen with remain the depth of parallelism by movable platen 209, movable platen 209 also relative to stationary platen 207 with remain the depth of parallelism close to stationary platen 207.Thus, with also can remain the depth of parallelism by patrix 202 and counterdie 203 matched moulds.In addition, as as shown in figure 40 to the central supplying of counterdie die cavity recess 203e to when resin R being filled in die cavity recess 203e (die cavity) by spreading out resin R towards the outside of counterdie die cavity recess 203e the situation of resin R, ball screw framework 210 also can be utilized suitably to control closure pressing speed.
Keep above-mentioned state to continue matched moulds, the pressure sensor 223 had everywhere detects that the 1st clamping pressure (such as adds up to 36ton respectively; The resin pressure of moulded resin R) time, stop driving the 1st CD-ROM drive motor 212, continue driving the 2nd CD-ROM drive motor 216.Thus, elbow-bar mechanism 214 takes over the state utilizing ball screw framework 210 pairs of movable platen 209 to pressurize, and is pressurized to each pressure sensor 223 and detects that the 2-in-1 mould power higher than the 1st clamping pressure (such as adds up to 125ton; Final resin pressure) till.Thus, in Figure 39 B, movable nut 217 moves upward further along leading screw 215, becomes the state that the slide link 221 that linked by the linking part 209a of movable platen 209 is together upright with triangular coupling rod 220.In addition, also can not stop driving the 1st CD-ROM drive motor 212, and utilize both ball screw framework 210 and elbow-bar mechanism 214 to pressurize to movable platen 209.In addition, ball screw framework 210 also can be set to and drive and non-pressurized state.
Now, as shown in figure 40 c, because molding die 204 strengthens for the pressurization of movable platen 209 under the state of patrix inserts 202b and counterdie fixture block 203c abutting, therefore, the helical spring 203d of counterdie fixture block 203c is compressed, moulded resin R is filled in counterdie die cavity recess 203e, maintains final resin pressure, moulded resin R is heating and curing.
By utilizing ball screw framework 210 to clamp the workpiece W being fed into molding die 204 with the 1st mold clamping force via movable platen 209 as described above, confined space can be formed in molding die 204.Elbow-bar mechanism 214 takes over the pressurized state utilizing this ball screw framework 210 to pressurize, and utilizes this elbow-bar mechanism 214 to clamp movable platen 209 until reach the 2-in-1 mould power larger than the 1st mold clamping force, thus utilizes final resin pressure that moulded resin R is heating and curing.
Thus, by carrying out mold closing accurately while the depth of parallelism maintaining the movable platen 209 in mold closing course of action, and making final resin pressure become high pressure, shaping quality can be promoted.Namely, before the moulded resin R end-of-fill of the depth of parallelism, closure pressing speed particular importance, utilize ball screw framework 210 matched moulds while controlling drive volume accurately, after the moulded resin R of plus-pressure particular importance fills, utilize the elbow-bar mechanism 214 that the output of the 2nd CD-ROM drive motor 216 is increased to carry out matched moulds pressurization, thus performance required separately can be realized before and after the mold closing of molding die 204.
In addition, the elbow-bar mechanism 214 increased by making the output of the 2nd CD-ROM drive motor 216 is as the clamping device 205 for opening, closing molding die 204, such as only use straight-line motion mechanism to carry out compared with the situation of mould on-off action with the mechanism not using output to increase, the mechanism less than the output of the servo motor (the 1st CD-ROM drive motor 212, the 2nd CD-ROM drive motor 216) for driving mechanism can be used, by also subtracting the diameter of filament thick stick 211, equipment miniaturization, also can reduce power consumption, can manufacturing cost be reduced.Thus, change for large that workpiece W can be tackled more at an easy rate.
In Figure 40 A ~ Figure 40 C, at the patrix 202 holding workpiece W of molding die 204, to the die cavity supply moulded resin R being formed at counterdie 203, but it also can be structure in contrast to this.
That is, in Figure 41 A, the upper die base 202a of patrix 202 is supported in stationary platen 207.Be formed with recess at the clamping face of upper die base 202a, be supported with patrix die cavity block 202d at this recess, patrix fixture block 202e is exerted a force ground hanger bearing around this patrix die cavity block 202d by helical spring 202f.Patrix fixture block 202e, to more outstanding than the lower surface position on the lower of patrix die cavity block 202d, forms patrix die cavity recess 202g.Adsorb in the mode covering this patrix die cavity recess 202g and keep stripping film F.
The lower die base 203a of counterdie 203 is supported in movable platen 209.Counterdie inserts 203f is assembled with at lower die base 203a.Be formed for workpiece W absorption is remained the work holding portion thereof 203g concordant with clamping face at counterdie inserts 203f.
As shown in Figure 41 A, under the state of molding die 204 die sinking, workpiece W (being such as equipped with the substrate of semiconductor chip, semiconductor crystal wafer etc.) is supplied to the work holding portion thereof 203g of counterdie 203, supply moulded resin R (liquid resin, particulate resins, particle resin (powdex), sheet material resin, block resin etc.).Moulded resin R also can be fed into work holding portion thereof 203g after being fed on workpiece W in advance.The patrix die cavity recess 202g of patrix 202 covers and adsorbs to maintain and is stripped film F.
When starting mold closing action driving ball screw framework 210, as shown in figure 41b, under the state being connected to workpiece W (substrate) and counterdie inserts 203f at patrix fixture block 202e across stripping film F, helical spring 202f is compressed.Thus, under the state being formed with confined space (pressure reduction space, enclosure space) in molding die 204, moulded resin R is filled in patrix die cavity recess 202g.
Molding die 204 reaches the 1st mold clamping force, when being converted to the pressurization of elbow-bar mechanism 214 from the pressurization utilizing ball screw framework 210 to carry out, as shown in fig. 41c, molding die 204 strengthens for the pressurization of movable platen 209 under the state of counterdie inserts 203f and patrix fixture block 202e abutting, therefore, become the helical spring 202f of patrix fixture block 202e by the state compressed, resin pressure in die cavity recess rises, become final clamp pressure, maintain state moulded resin R being applied to predetermined resin pressure, moulded resin R is heating and curing.
Adopt said structure, control part 222 is when starting mold closing action, synchronously drive ball screw framework 210 and elbow-bar mechanism 214, by utilizing ball screw framework 210 to clamp the workpiece W being fed into molding die 204 with the 1st mold clamping force via movable platen 209, molding die 204 mold closing can be formed confined space in this molding die 204.Elbow-bar mechanism 214 takes over the pressurized state utilizing this ball screw framework 210 to pressurize, and utilizes this elbow-bar mechanism 214 to clamp movable platen 209 until reach the 2-in-1 mould power larger than the 1st mold clamping force, thus moulded resin R can be heating and curing with final resin pressure.
Thus, same with above-mentioned mould structure, a kind of maximization at reply workpiece W can be provided and maintain the depth of parallelism of molding die 204, closure pressing speed accurately state under small-sized and the resin molding machine 201 of matched moulds can be carried out at low cost.In addition, also can substitute elbow-bar mechanism 214 and hydraulic stamping mechanism is set.In this case, also can while the depth of parallelism of the movable platen 209 that maintain in mold closing course of action, carry out mold closing accurately and make final resin pressure become high pressure, thus promote shaping quality.In addition, also can substitute elbow-bar mechanism 214 and other force-increasing mechanism is set.
In addition, also such structure can be set to: utilize ball screw framework 210 as described above to drive movable platen 209 to carry out mould on-off action, clamping mould, and utilize above-mentioned elbow-bar mechanism 214 only pressurize to the counterdie die cavity block 203b shown in Figure 40 and drive.In this case, by arranging through hole at lower die base 203a and movable platen 209, and be used in counterdie die cavity block 203b pressurize pressing element this through hole through and be linked to linking part 209a, counterdie die cavity block 203b can be driven separately.Thus, counterdie die cavity block 203b can be controlled respectively to the plus-pressure of resin R and mold clamp force, therefore, also can suppress mold clamp force while making resin pressure increase arbitrarily, even if the output of restraining device entirety, form with also reducing resin pressure.In addition, also the driving only undertaken by ball screw framework 210 and the driving undertaken by ball screw framework 210 and elbow-bar mechanism 214 correspondingly can be utilized to switch driving condition with required plus-pressure.Further, giving prominence to from counterdie 203 by making counterdie die cavity block 203b rise individually, mold clean transfiguration also can be made easy.
Above, specifically understand the present invention according to embodiment, but the present invention is not limited to described embodiment, it is self-evident for can carrying out various change in the scope not departing from its purport.
In described 1st embodiment, the situation using particulate resin as resin R is illustrated.But be not limited thereto, membranaceous resin also can be used as resin R, and the structure film resin varied in size being laminated into mountain shape can be used.
Specifically, the shaping using the workpiece W shown in Figure 28, Figure 29 and resin R to carry out can also be adopted.As shown in these figures, as workpiece W, the parts being flip-chip mounted chip part 11 on the substrate 10 also can be used.In this case, as resin R, also can use and be formed as middle high film resin or use supplying as the high particulate resin in centre.In this case, same with above-mentioned embodiment supply workpiece W and resin R after carry out in the operation be molded, after mold closing further matched moulds process in, as shown in figure 29, when chip part 11 impregnated in the resin R of melting, from the chip part 11 of center side, impregnated in resin R in order.Now, the resin R of melting flows from the mediad outer circumferential side of substrate 10.Thus, when being sealed by the workpiece W being flip-chip mounted chip part 11, the underfill transfiguration between chip part 11 and substrate 10 is easy.
In described 1st embodiment, the resin R of the amount of same degree is supplied (lift-launch) to utilizing multiple groove 123 in resin supply unit 120 simultaneously and be illustrated to as the situation on the stripping film F of resin supply area.But be not limited thereto, also can substitute multiple groove 123, and use and have the distributor of multiple nozzle, these nozzles can supply the such resin with mobility of particulate resin, liquid resin.Thereby, it is possible to prevent long-timeization being caused service time by the increase of resin quantity delivered (maximization of resin supply area).In addition, such as, by making resin supply not have uneven relative to the resin supply area distribution each nozzle of configuration, also can supply equably.
In described 1st embodiment, make elastic component 50 flexible to the mould opening and closing along with mould clamping device and counterdie die cavity block 34 is illustrated relative to the situation of counterdie fixture block 35 relatively movement.Be not limited thereto, also can use the mechanism carrying out that drive, that counterdie fixture block 35 can be changed height relative to mould clamping device in addition.
As the changeable mechanism of die cavity height, such as, also can be such structure: counterdie die cavity block 34 is connected with drive source and the mode of movement can be assembled in the lower die base 46 of molding die 30, counterdie fixture block 35 is fixedly assembled in lower die base 46.
In addition; as the changeable mechanism of die cavity height; also can be such structure: the mode overlapped with the thickness of slab adjustment block (circular cone) making interface be formed as the conical surface (inclined plane) between counterdie die cavity block 34 and lower die base 46 arranges wedge portion, and the one in thickness of slab adjustment block utilizes the drive source such as cylinder, motor to slide.
In described 1st embodiment, in film loading machine 57, only self-sustaining face 64 and adsorption section 67 attract the situation of air to be illustrated (with reference to Fig. 3) with being connected.Being not limited thereto, as film loading machine 57a, also can be the structure that can attract air in recess 66, and can be in recess 66, to fill the structure that air carries out pressurizeing.Specifically, the film loading machine 57a as shown in Figure 30 ~ Figure 32 can be used.In addition, in Figure 30 ~ Figure 32, eliminate patrix 31 (with reference to Fig. 3).
Adopt this film loading machine 57a, as shown in figure 30, when conveying is equipped with the stripping film F of resin R, from with air flow circuit 65a different system the air flow circuit 65b attracting pressurization part 67b and recess 66 to couple together is carried out attracting or pressurizeing, this air flow circuit 65a has the function same with the air flow circuit 65 shown in Fig. 3.Specifically, pressurization stripping film F carried out by making to utilize the weight of resin R and the attraction (negative pressure) of adsorption section 67a balanced, can prevent from causing stripping film F to bend by the weight of resin R.
In addition, adopt this film loading machine 57a, as shown in Figure 31, Figure 32, when stripping film F is configured at die cavity recess 33, by from attracting pressurization part 67b air supply and fill air in recess 66 to pressurize, the fold of stripping film F also can be made to launch.Thus, also can while utilizing the attraction carried out from the position corresponding with the bight of die cavity recess 33 to make stripping film F imitate the shape of die cavity recess 33, the fold of stripping film F is pushed open and flattening-out laterally, therefore, it is possible to prevent fold more reliably at the end face of die cavity block 34.In addition, can use and add hot-air as the air be now filled in recess 66, prevent fold while mold temperature can not be reduced.In addition, because stripping film F is also heated, therefore, stripping film F also can be made to imitate the shape of die cavity recess 33 more reliably.
In addition, in described 1st embodiment, the example that the stripping film F being equipped with resin R is configured at counterdie 32 is illustrated by film loading machine 57, but the present invention is not limited thereto, also can be configured at patrix 31.In this case, the molding die 30 of resin molding machine 100 is set to such structure that counterdie 32 and patrix 31 to be turned upside down, be configured to, by counterdie (being equivalent to the first mould of the present invention) and patrix (being equivalent to the second mould of the present invention) mold closing being formed with die cavity recess, the resin being filled in this die cavity recess can be utilized to carry out resin molded to workpiece W.This patrix is same with the counterdie 32 of described 1st embodiment can adopt such structure, that is, comprising: die cavity block, and it forms the bottom of die cavity recess; Fixture block, it forms the sidepiece of die cavity recess; Movable part, it makes die cavity block relatively move relative to fixture block; And adsorption section, it attracts to adsorb the stripping film F configured in the mode of the end face of the end face and fixture block that cover die cavity block.In addition, film loading machine is same with the film loading machine 57 of described 1st embodiment, stripping film F is carried under the state that stripping film F is smooth, and while the end face of the end face and fixture block that make die cavity block is positioned at identical height, stripping film F is configured in maintain smooth state the end face of this die cavity block and the end face of this fixture block.Adopt this resin molding machine 100, even if when stripping film F is not moved to pressing part 130 together with resin R, be configured with also can preventing fold.
In addition, in described 1st embodiment, the situation supplying granular resin R to stripping film F in resin supply unit 120 is illustrated.Be not limited thereto, resin supply unit 120 also can be used for the resin R of liquid state.In this case, also after the resin R of liquid state is supplied on workpiece W by resin supply unit 120, by robot mechanism portion 180, resin R and workpiece W can be together moved to pressing part 130.In addition, resin supply unit 120 also can be used for the resin R of sheet.In this case, the resin R of the sheet supplied by resin supply unit 120 also can overlap with stripping film F or workpiece W or only this resin R is moved to pressing part 130 by robot mechanism portion 180.
In addition, as workpiece W, as long as there is the face needing protection, can be also just himself the such tabular component of wafer not carrying chip part 11, projection 11A.The surface of this tabular component both can have concaveconvex shape, also can be smooth face.
Claims (14)
1. a resin molding machine, it is by patrix and the counterdie mold closing being formed with die cavity recess, and utilize the resin being filled in described die cavity recess to carry out resin molded to workpiece, the feature of this resin molding machine is,
Described counterdie comprises: counterdie die cavity block, and it forms the bottom of described die cavity recess; Counterdie fixture block, it forms the sidepiece of described die cavity recess; Loading machine, it can keep carrying the film being equipped with described resin; And adsorption section, its described film configured for the mode adsorbing to cover the end face of described counterdie die cavity block and the end face of described counterdie fixture block,
Described counterdie die cavity block is configured to relatively to move relative to described counterdie fixture block,
Described loading machine is positioned at described resin the described counterdie that described film to be configured at the end face of described counterdie die cavity block and the end face maintenance level of described counterdie fixture block by mode above described counterdie die cavity block,
Described adsorption section makes described film adsorb the described film of maintenance with following the inner surface of described die cavity recess, supplies described resin to described die cavity recess.
2. resin molding machine according to claim 1, is characterized in that,
Described loading machine comprises hand, and this hand has: holding surface, and it is for keeping described film; Recess, it becomes avoidance place of the described resin being equipped on described film and is recessed into from described holding surface; And air flow circuit, it leads to described holding surface around described recess and for attracting described film.
3. resin molding machine according to claim 2, is characterized in that,
The standby gate portion that can open, close the roller shutter shape of described holding surface of described Loading machine, utilizes described gate portion to support the described film of conveying, under the open mode in described gate portion, configures described film on described counterdie under the closed condition in described gate portion.
4. the resin molding machine according to any one of claims 1 to 3, is characterized in that,
Described Loading machine is for heating part and cooling end.
5. resin molding machine according to claim 1, is characterized in that,
The top of described counterdie die cavity block is arranged in the mode that can be separated,
The top of described counterdie fixture block is arranged in the mode that can be separated,
The top of described counterdie die cavity block utilizes connecting elements to be connected with the top of described counterdie fixture block,
The described film that the conveying of described loading machine configures in the mode of the end face on the top of the end face and described counterdie fixture block that cover the top of described counterdie die cavity block under the state of the end face level on the end face on the top of described counterdie die cavity block and the top of described counterdie fixture block.
6. resin molding machine according to claim 1, is characterized in that,
This resin molding machine possesses the upper board of ring-type and the lower panel of ring-type,
Described lower panel is formed and is recessed into from the face of described upper board side and stage portion circumferentially at circumference end,
Between described upper board and described lower panel, clip described film, to make the inside diameter of the described upper board mode corresponding with the stage portion of described lower panel make described upper board be embedded in described lower panel, thus form lamina membranacea portion,
Be formed at described counterdie fixture block and be recessed into and stage portion circumferentially from end face at circumference end, make described lamina membranacea portion be embedded in described counterdie fixture block to make the inside diameter of the described lower panel mode corresponding with the stage portion of described counterdie fixture block.
7. resin molding machine according to claim 1, is characterized in that,
The top of described counterdie die cavity block is arranged in the mode that can be separated,
With the top of counterdie die cavity block described in the mode floating support of the end face on top of counterdie die cavity block described under the state of die sinking and the end face level of described counterdie fixture block.
8. the resin molding machine according to any one of claim 1 ~ 7, is characterized in that,
Be provided with in the mode can given prominence to from the end face of described counterdie fixture block by multiple pins of floating support at described counterdie fixture block,
Described multiple pin supports described workpiece highlightedly from the end face of described counterdie fixture block, is housed in the inside of described counterdie fixture block under the state of the described workpiece of clamping.
9. a resin molding machine, it is by the first mould and the second mould mold closing being formed with die cavity recess, and utilize the resin being filled in described die cavity recess to carry out resin molded to workpiece, the feature of this resin molding machine is,
Described second mould comprises: die cavity block, and it forms the bottom of described die cavity recess; Fixture block, it forms the sidepiece of described die cavity recess; Movable part, it relatively moves relative to this fixture block for making this die cavity block; And adsorption section, its film configured for the mode adsorbing to cover the end face of described die cavity block and the end face of described fixture block,
This resin molding machine comprises loading machine, this loading machine carries described film under the smooth state of described film, and while the end face of the end face and described fixture block that make described die cavity block is positioned at identical height, described film is configured in the end face of described die cavity block and the end face of described fixture block with remain smooth state.
10. a resin molding method, it uses resin molding machine by patrix and the counterdie mold closing being formed with die cavity recess, and utilize the resin being filled in described die cavity recess to carry out resin molded to workpiece, the feature of this resin molding method is,
Described counterdie comprises: counterdie die cavity block, and it forms the bottom of described die cavity recess; Counterdie fixture block, it forms the sidepiece of described die cavity recess; Loading machine, it can keep carrying the film being equipped with described resin; And adsorption section, its described film configured for the mode adsorbing to cover the end face of described counterdie die cavity block and the end face of described counterdie fixture block,
This resin molding method comprises following operation:
A () utilizes described loading machine with make described resin be positioned at described counterdie that described film to be configured at the end face of described counterdie die cavity block and the end face maintenance level of described counterdie fixture block by mode above described counterdie die cavity block; And
B () is while utilizing described adsorption section to attract described film, described counterdie die cavity block is made relatively to move relative to described counterdie fixture block and form described die cavity recess, thus make described film adsorb the described film of maintenance with following the inner surface of described die cavity recess, and described resin is intactly supplied to described die cavity recess.
11. 1 kinds of resin molding machines, it possesses the clamping device for opening, closing molding die, and the feature of this resin molding machine is,
Described clamping device possesses:
Movable platen, it is for supporting at least one mould in described molding die;
Stationary platen, it is for supporting another mould;
1st mould switching mechanism, it connects with described movable platen, by described molding die mold closing between described movable platen and described stationary platen, until reach the 1st mold clamping force;
2nd mould switching mechanism, it connects with described movable platen, carries out mold closing until reach the 2-in-1 mould power strengthening chucking power compared with described 1st mold clamping force further, and maintains final resin pressure; And
Control part, it is for controlling the on-off action of described 1st mould switching mechanism, the 2nd mould switching mechanism;
Described control part is when starting mold closing action, synchronously drive described 1st mould switching mechanism, the 2nd mould switching mechanism, utilize described 1st mould switching mechanism via described movable platen with the 1st mold clamping force clamping be fed into the workpiece of described molding die after, described 2nd mould switching mechanism takes over the state of the 1st mould switching mechanism pressurization, utilizes described molding die to clamp described workpiece until reach the 2-in-1 mould power larger than described 1st mold clamping force via described movable platen.
12. resin molding machines according to claim 11, is characterized in that,
Described 1st mould switching mechanism equally spaced configures along the edge, periphery of described movable platen, and described 2nd mould switching mechanism is configured in the central portion of described movable platen.
13. 1 kinds of resin molding machines, it possesses clamping device, this clamping device is configured to open relative to the stationary platen lifting of a mould of the described molding die of supporting, close this molding die by making the movable platen of another mould of supporting molding die, the feature of this resin molding machine is
Described clamping device comprises:
Elbow-bar mechanism, the central authorities of itself and described movable platen link; And
More than three ball screw frameworks, its edge, periphery along described movable platen equally spaced configures, and links respectively at this allocation position with this movable platen.
14. 1 kinds of resin molding methods, it is opened by use clamping device, close molding die carries out resin molded, this clamping device comprises the movable platen for supporting a mould and the stationary platen for supporting another mould, and the feature of this resin molding method is
This resin molding method comprises following operation:
Described molding die supply workpiece to die sinking and resin;
The 1st mould switching mechanism that connects with described movable platen and the 2nd mould switching mechanism are synchronously worked, utilizes described 1st mould switching mechanism to carry out mold closing, until clamp described workpiece by described molding die with the 1st mold clamping force;
Described 2nd mould switching mechanism takes over the state of described 1st mould switching mechanism pressurization, makes described movable platen work, clamps described molding die until reach the 2-in-1 mould power larger than described 1st mold clamping force; And
While maintain and clamping the final resin pressure of described molding die with described 2-in-1 mould power, described resin is heating and curing.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013113222A JP2014231185A (en) | 2013-05-29 | 2013-05-29 | Resin molding apparatus and resin molding method |
| JP2013-113222 | 2013-05-29 | ||
| JP2013115783A JP2014233882A (en) | 2013-05-31 | 2013-05-31 | Resin molding device and method |
| JP2013-115783 | 2013-05-31 | ||
| JP2013-139424 | 2013-07-03 | ||
| JP2013139424A JP6180206B2 (en) | 2013-07-03 | 2013-07-03 | Resin sealing method and compression molding apparatus |
| PCT/JP2014/061014 WO2014192456A1 (en) | 2013-05-29 | 2014-04-18 | Resin molding device and resin molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105283294A true CN105283294A (en) | 2016-01-27 |
| CN105283294B CN105283294B (en) | 2017-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201480029820.1A Active CN105283294B (en) | 2013-05-29 | 2014-04-18 | Resin molding machine and resin molding method |
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| Country | Link |
|---|---|
| KR (1) | KR102203781B1 (en) |
| CN (1) | CN105283294B (en) |
| SG (1) | SG11201508166RA (en) |
| TW (1) | TWI606526B (en) |
| WO (1) | WO2014192456A1 (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| SG11201508166RA (en) | 2015-12-30 |
| WO2014192456A1 (en) | 2014-12-04 |
| TW201448074A (en) | 2014-12-16 |
| KR102203781B1 (en) | 2021-01-15 |
| TWI606526B (en) | 2017-11-21 |
| CN105283294B (en) | 2017-08-25 |
| KR20160013202A (en) | 2016-02-03 |
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