TW200909177A - Method for resin encapsulation molding of optical element and device used therefor - Google Patents

Method for resin encapsulation molding of optical element and device used therefor Download PDF

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Publication number
TW200909177A
TW200909177A TW097122387A TW97122387A TW200909177A TW 200909177 A TW200909177 A TW 200909177A TW 097122387 A TW097122387 A TW 097122387A TW 97122387 A TW97122387 A TW 97122387A TW 200909177 A TW200909177 A TW 200909177A
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mold
resin
substrate
unit
units
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TW097122387A
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Chinese (zh)
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TWI367154B (en
Inventor
Hiroshi Uragami
Mamoru Nakamura
Kinya Fujino
Tetsuya Yamada
Kazuki Kawakubo
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Towa Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/568—Temporary substrate used as encapsulation process aid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B29C2043/3433—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds
    • B29C2043/3438—Feeding the material to the mould or the compression means using dispensing heads, e.g. extruders, placed over or apart from the moulds moving during dispensing over the moulds, e.g. laying up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/0022—Multi-cavity moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Led Devices (AREA)

Abstract

A resin encapsulation molding device for optical elements comprises a substrate supply unit (B), a substrate container unit (C), and one or more mold assembly units (A) disposed between those units. The substrate supply unit (B) supplies a substrate (1) on which LED chips are mounted and a liquid resin to each of the mold assembly units (A). The substrate container unit (C) receives LED molded parts (3) having encapsulated LED chips in each of the mold assembly part units (A). Each of the mold assembly units (A) perform compression molding of the LED chips with use of the liquid resin.

Description

200909177 九、發明說明： C發明所屬之技術領域3 發明領域 本發明係有關於藉由具透明性即，透光性之樹脂材料 5 填封成形例如安裝於基板或導線架之發光二極體(led : Light Emitting Diode)晶片等光元件之光元件之樹脂填封成 形方法及使用於該方法之裝置。 C先前技術3 發明背景 10 15 20 迄今’利用樹脂填封成形裝置（以下，僅稱「習知裝置」） 藉由樹脂填封成形安裝於基板之LED晶片。樹脂填封成形 裝置的其中一例係使用壓縮成形裝置。以下，說明習知利 用壓縮成形裝置之樹脂填封成形方法（以下，僅稱「習知方 法」）。 習知方法中，百先，準備具有上模具及下模具之壓縮 成形用模具組合。接著’安裝有預定數量的led晶片的基 板以LED晶片朝下的狀態固定於上模具。χ，脫模薄膜覆 蓋下模具的模穴。X，具透明性的樹脂材料例如液狀樹 脂供給至被脫模薄職蓋的模穴内材料為_BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-emitting diode mounted on a substrate or a lead frame by a resin material 5 having transparency, that is, translucency (for example). Led : Light Emitting Diode) A resin encapsulation molding method for an optical element such as a wafer or the like and an apparatus used in the method. C. Prior Art 3 Background of the Invention 10 15 20 Heretofore, a resin-sealed molding apparatus (hereinafter, simply referred to as "a conventional apparatus") is used to mold and form an LED wafer mounted on a substrate. One of the resin sealing and molding apparatuses uses a compression molding apparatus. Hereinafter, a resin encapsulation molding method (hereinafter, simply referred to as "a conventional method") using a compression molding apparatus will be described. In the conventional method, a combination of a mold for compression molding having an upper mold and a lower mold is prepared. Next, the substrate on which a predetermined number of led wafers are mounted is fixed to the upper mold with the LED chips facing downward. χ, the release film covers the cavity of the lower mold. X, a transparent resin material such as a liquid resin is supplied to the cavity material of the demolded thin cover _

材料或粉末材料時，就加熱模具組合n樹脂 變成溶化狀態。 T —接著’閉合上模具與下模具。藉此，在模穴内的空間 设定為預定真空度之狀態下，紅ED晶#輯於模 液狀樹脂或溶化後的樹脂。再者，將構成模穴底面的構件 5 200909177 往上推。結果，會對模穴内的樹脂施加所需壓力。 在經過液狀樹脂或溶化後的樹脂硬化所需的時間後， 閉合上模具與下模具。藉此，可形成多數led晶片一併藉 由樹脂填封於與模穴形狀相對應之固體的樹減形體内之 5成形。然後，切斷該成形品。藉此，可得到一個或多數 LED晶片内包於樹脂之led製品。 專利文獻1 :特開2005-305954號 【發明内容3 發明揭示 10 發明欲解決之問題 前述搭載於習知裝置之模具組合是可交換的。因此， 因應光元件的生產量，可選擇性地使用小量生產用模具組 合及大量生產用模具組合其中一種。因此，根據習知裝置， 可輕易地對應於生產量的增減。 15 然而，在使用大量生產用模具組合時，特別會有下列 問題產生。 在執行大量生產時’相較於執行小量生產時，由一個 模具組合製造多數樹脂成形品，因此，模具組合的大小及 重量會變大。因此，不僅作業員處理模具組合變得困難， 2〇利用模具組合所形成之樹脂的品質也容易下降。更具體而 言，當使用大的模具組合時，樹脂硬化的狀態在模具組合 内的各個位置容易不相同。即，一個模具組合内樹脂硬化 的狀態會依存於位置而容易不均。當樹脂硬化的狀態依存 於位置而造成不均較大時，若將包含硬化後樹脂的成形品 200909177 分割為多數完成品，則該等多數完成品之透光性會有很大 的不均。因此，在樹脂填封成形光元件時，會要求不使用 大的模具組合而使用可執行大量生產的裝置。 本發明有鑒於上述問題，其目的在於提供無論用小量 5 生產方式及大量生產方式哪一種製造光元件，皆可製造高 品質的光元件之樹脂填封成形方法及使用於該方法之裝 置。 用以欲解決問題之手段 本發明之光元件之樹脂填封成形方法中，首先，準備 10 多數分別具有第1模具及與第1模具相向之第2模具之模具 組合單元。從多數模具組合單元中選擇1或2個以上之模具 組合單元。分別使用1個模具組合單元或2個以上之模具組 合單元一體化後之模具組合單元群，藉由樹脂填封光元件。 發明效果 15 根據本發明之裝置，可在一個模具組合單元安裝其他 模具組合單元，同時，亦可從一個模具組合單元卸除其他 模具組合單元。藉此，不必如習知裝置在執行大量生產時 使用大的模具組合。因此，即使需要大量生產，亦可製造 出高品質的光元件。 20 另，包含前述一個模具組合單元及其他模具組合單元 之多數模具組合單元亦可直列地配置。此時，多數模具組 合單元亦可配置於成形前材料之供給單元與成形品之容納 單元之間。又，亦可在多數模具組合單元的其中一端配置 具有成形前材料之供給單元的功能及成形品之容納單元兩 200909177 者的IN、OUT單元。 本發明之上述及其他目的、特徵、方面及優點從與所 附圖式相關所理解之與本發明相關之下列詳細說明應可清 楚明白。 5圖式簡單說明 第1圖係概略地顯示搭載有實施形態丨之模具組合之光 元件之樹脂填封成形裝置（以下，僅稱「裝置」。）之平面圖， 且顯示構成裝置之多數單元組裝後之狀態。 第2圖係顯示第丨圖所示之裝置組裝後之狀態的平面 10 圖。 第3圖係概略性地顯示第1圖所示之裝置之模具組合單 凡之截面圖’且顯示液狀樹脂供給至被脫模薄膜覆蓋之下 模具的模穴内之狀態。 第4圖係概略性地顯示實施形態2之裝置之平面圖，且 15顯示構成裝置之多數單元組裝後之狀態。 第5圖係概略性地顯示第4圖所示之裝置之模具組合單 兀之截面圖，且顯示液狀樹脂供給至被脫模薄膜覆蓋之下 模具的模穴内前之狀態。 第6圖係概略地顯示安裝有實施形態丨及2之光元件之 20樹脂填封成形方法所使用之多數光元件之基板之截面圖。 第7圖係顯示利用第1圖所示之裝置用樹脂填封成形第 6圖所示之基板上的光元件之LED成形品之截面圖。 第8圖係顯示利用第4圖所示之裝置用樹脂填封成形第 6圖所示之基板上的光元件之LED成形品之截面圖。 200909177 L實方式3 用以實施發明之最佳形態 (實施形態1) 以下，一面參照圖式，一面說明本發明實施形態之光 5兀件之樹脂填封成形方法（以下，僅稱「方法」。）及使用於 該方法之裝置（以下，僅稱「裝置」。）。另，本實施形態之 方法及裝置為所謂壓縮成形方法及壓縮成形裝置。 (成形前基板） 首先’說明搭載有利用本實施形態之方法及裝置用樹 10脂所填封成形之多數光元件之基板。在本實施形態之成形 前基板1上如第6圖所示搭載有多數LED晶片2作為多數光 元件的其中一例。多數LED晶片2在基板1的主表面上配置 成矩陣狀。第6圖所示之基板1藉由本實施形態之方法成為 第7圖所示之LED成形品之成形完畢的基板3。 15 (光元件之樹脂填封成形裝置之構造） 如第1圖及第2圖所示，本實施形態之裝置4包含多數模 具組合單元A、供給單元（IN單元）B及容納單元（〇1；丁單 元)C。模具組合單元a係用以利用樹脂一併填封安裝於基板 1之多數LED晶片2。基板供給單元B制以將基板丨及樹脂 2〇材料分別供給至1或多數模具組合單元A。3，本實施形態 中，會使用液狀樹脂5作為樹脂材料。但，樹脂材料亦可為 口體或A末的;丨脂材料。此時，會藉由加熱來溶化固體或 粉末的樹脂材料。又，基板容納單元c係用以容納分別從} 或多數模具組合單元A送過來之成形完畢的基板3。 200909177 一又如第1圖所不，在基板供給單元B安裝有模具組合 ^凡八/在模具組合單元人安裝有基板容納單元C。以基板 單凡B、1或多數模具組合單SA及基板容納單元C這樣 的=序直立地排列。基板供給單元B、模具組合單元a及基 5板合納早疋C互相可卸除。又，各模具組合單元A亦可互相 另了攸多數模具組合單元A中選擇性地使用1或2 個以上的模具組合單元A。 又，根據本實施形態之裝置，如第2圖所示，以基板供 °單元B、4個模具組合單元A及基板容納單元c這樣的順序 1〇直立地配置。另，雖然第2圖中4個模具組合單元a直列地連 接，但，模具組合單元八的數量不限該值，只要是多數模具 組合單πΑ直列地連接，可為任何值。即，根據本實施形態 之裝置，可增減模具組合單元Α的數量。 另，本實施形態中，為連結基板供給單元B、1或多數 模具組合單元A及基板容納單元c，使用連結具6。但，本 實施形態之裝置亦可不使用連結具6而互相連結基板供給 早元B、1或多數模具組合單元a及基板容納單元c。 根據上述本實施形態之裝置，可增減多數模具組合單 元的數量。因此，即使執行大量生產，也不必如過去的裝 置使用大的模具組合。即，在執行大量生產時，可使用執 行小量生產時所使用之正常尺寸的模具組合。因此，作為 製品之LED成形品3的品質不會下降。 (模具組合單元之構造） 如第1圖〜第3圖所示，模具組合單元A在其前面乜具有 200909177 模具組合7。又，模具組合7包含位置已固定之上模具8及與 上模具8相向配置且可動之下模具9。又，上模具8及下模具 9具有可加熱至樹脂材料成形時所需的溫度之加熱機構（未 圖示）。 5 X，上模具8的模具面具有定位基板1的供給部10。安 裝有LED晶片2的基板i以·晶片2朝下的狀態定位於供 給部10。又，下模具9的模具面構成模六（一個大模穴）^。 模穴11使其開口部朝上。 又，模八11的底面lla有多數半球狀凹部12(多數小模 H)穴）。多數半球狀凹部12與多數LED晶片2馳置相對應而配 置成矩陣狀。該半球狀凹部12是為了成形光元件之透鏡部 的。因此，在閉合上模具8及下模具9時，安裝於基板！之多 數LED晶片2會分別與多數凹部12相向。 又，模穴11的底面Ua由底面構件13構成。底面構件13 15 :上下移動。因此’底面lla可將供給至模穴11内的液狀樹 脂5往上推。因此，液狀樹脂5在閉合上模具8與下模具9時， 會壓縮在模穴11内。 又’如第3圖所示，模具組合單元A包含可覆蓋模仙 内面之脫模薄膜14及將脫模薄膜14供給至模穴之薄膜供給 20機構15。薄膜供給機構15包含將脫模薄膜“送出之滾輪… 捲堯脫桓薄膜u之滾輪lsb。滾輪⑸與滾輪⑼將維持張 力狀態之脫模薄膜14供給至上模具8與下模具9之間。 又雖未圖不，但在模穴11的底面lla連通有吸附孔。 又’在吸附孔連接有構成真空吸引機構之真空系等。真空 11 200909177 吸引機構從模穴！〗透過⑽孔將空氣強制地排至外部 此’可使脫㈣卵分«密接合於多數凹部12、模曰 的側面及模穴丨丨的底面。 、’ 又，在上模具8周圍設有圍住上模具8外周圍之上模呈 部:體隔斷構件16。上模具8與上模具外部氣體隔斷構件 固疋於固定盤17。又，在下模具9周圍設有圍住下模且9 外周圍之下模具外部氣體隔斷構件18。下模則與下模具外 部氣體隔斷構件18固定於移動盤19。 ’ ίο齡H模具外部氣體_構件16下面設有外部氣體隔 斷用密封構細。又，在模具組合單Μ設有將前述密閉空 間，空氣強制地排至外部之真空系(未圖示）。藉由真空栗的 功能，前述密閉空間可設定為預定真空度。 岫述岔閉空間之真空度具體而言如下地設定。首先， 15 。上&quot;^具8與下核具9。此時，在將上模具外部氣體隔斷 5 ^件16下面與下模具外部氣體隔斷構件耻面推合之前， 疋在存在有脫模薄膜14之狀態下，將上模具外部氣體隔斷 構件16之岔封構件2〇推向下模具外部氣體隔斷構件18上 面。藉此，上模具8、下模具9、上模具外部氣體隔斷構件 16、下模具外部氣體隔斷構件18及密封構件20形成密閉空 2 0 間。即，包含模穴丨丨内空間之模具組合内的密閉空間成為 與外部氣體隔斷之狀態。此時，上模具8與下模具9之間有 間隙。此為所謂中間閉模狀態。然後，藉由真空泵從該密 閉空間強制地將空氣排至外部。藉此，在中間存在有脫模 溥膜14之狀態下互相推合上模具8之模具面與下模具9之模 12 200909177 -面換s之，上模具8之模具面與下模具9之模具面會夫 持^讀膜Μ及基板卜此為所謂完全閉模狀態。然後，再 將在閉空間内的空氣排至外部，藉此將密閉空間之真空度 設定為預定值。 另，在執行樹脂成形時，在各模具組合單元中，將液 狀耐月曰5供給至覆蓋有脫模薄膜14之模穴I〗内的空間，且將 成形Α之基板1定位於供給部1〇，且，將模穴丨丨内之空間設 定為預定真空度。然後，在閉合上模具8與下模具9後，藉 由底面構件13對模穴11内的液狀樹脂5施加預定壓力。在該 〇狀恶下，在經過溶化後的樹脂硬化所需的時間後，打開上 才果具8與下模具9。藉此，如第7圖所示，形成多數LED晶片 2填封於對應於模穴Π的形狀之樹脂成形體21内之LED成 形品3。 (供給單元之構造） 15 又’如第1圖及第2圖所示，基板供給單元B包含裝填部 (倉E)22、定位部23、排列部(旋轉機台）24、載上機構(供給 機構)25。裝填部22裝填成形前之基板1。從裝填部22推出 之基板1定位於定位部23。排列部24變更(旋轉)從定位部23 送過來的基板1的方向。載上機構25將基板1及液狀樹脂5供 給至模具組合單元A。 又，如第2圖所示，在4個模具組合單元A及基板供給單 元B側邊位置的裝置背面仆的位置設有載上機構25之移動 領域26。又’如第3圖所示，在載上機構25上部設有以LED 晶片2朝下之狀態載置有基板丨之載置部27及將基板1抬高 13 200909177 且定位於供給部10之抬高部28。 在執行樹脂成形時，首先，將基板1從裝填部22推出至 定位部23。接著，基板1從定位部23送至排列部24。然後， 基板1由排列部24旋轉成朝預定方向。再者，基板1載置於 5載上機構25之載置部27。在該狀態下，載上機構25沿著移 動領域26移動。結果，載上機構25分別定位於1或多數模具 組合單元A側邊。在各1或多數模具組合單元A中，抬高部 28在基板1***模具組合單元a之上模具8與下模具9之間後 將基板1抬高。藉此，成形前之基板1定位於上模具8之供給 10 部 10。 又，在載上機構25下部設有使液狀樹脂5掉落至模穴u 之树脂供給機構29。樹脂供給機構29為例如橫型分配器。 又，液狀樹脂5只要具透明性（透光性）及熱硬化性，即可為 任何樹脂，但本實施形態係使用一液型矽樹脂。又，樹脂 15供給機構29包含將液狀樹脂5供給至模穴u之橫型喷嘴3〇 及對液狀樹脂5施加預定壓力之加壓部31。 在執行本實施形態之樹脂成形時’首先，載上機構25 沿著移動領域35移動。與此同時，橫型噴嘴3〇(載上機構25) 在朝水平方向（橫向）之狀態下***上模具8與下模具9之 扣間:接著，在橫型喷嘴30從上模具8與下模具9之間取出時， 堊Ρ31會對液狀树脂5朝水平方向施力口壓力。藉此，液狀 樹月曰5會被朝水平方向推出。結果，液狀樹脂$會從橫型喷 鳴X也物線掉落至模穴1卜此時，液狀樹脂5從平面看會 均勾地供給至模穴u整體。例如，使橫型喷嘴如移動成液 14 200909177 . 狀樹脂5從平面看在模穴11底面畫s形。另，基板丨及液狀樹 • 脂5亦可分關由載上機構25_供給至上财8與下模具 9。 (容納單元之構造） 5 又，如第1圖及第2圖所示，基板容納單元C包含卸下部 32、_部嶋機台）33及容納部（倉咖。卸下仰從模 具組口單tlA取MED成形品3。排列部33將從卸下部32送 ㉟來的LED成形品3旋轉成朝敢方向。從排卿33送過來 的LED成形品3容納於容納部。 1〇 $ ’如第2圖所示，在4個模具組合單元A及基板容納單 元c側邊位置的裝置背面4b的位置設有卸下機構^之移動 領域35。在使用卸下機構32時，首先，卸下機構32***模 具組合單元A之上模具8與下模具9之間。接著，卸下機構Μ 保持LED成形品3。然後，卸下機構32從上模具8與下模具9 15之間取出LED成形品3。接著，卸下機構32一面保持咖成 开&gt;品3-面沿著移動領域35移動，且將LED成形品3載置於 排列部33。接著，排列部33將LED成形品3轉成朝預定方 向。然後，LED成形品3容納於容納部34。 (光元件之樹脂填封成形方法） 20 本實施形態之樹脂填封成形方法中，首先，如第1圖及 第2圖所示，在基板供給單元B中，從裝填部22將成形前之 基板1推至定位部23。接著，基板丨由排列部24轉成朝預定 方向。又，基板1載置於載上機構25之載置部27。接著，在 搭載有基板1之載上機構25沿著移動領域26移動後，進入模 15 200909177 具組合單SA之上模具8與下模具9之間。In the case of a material or a powder material, the mold assembly n resin is heated to a molten state. T - then 'closes the upper and lower molds. Thereby, in a state where the space in the cavity is set to a predetermined degree of vacuum, the red ED crystal is collected in the molten resin or the resin after melting. Furthermore, the member 5 200909177 which constitutes the bottom surface of the cavity is pushed up. As a result, the required pressure is applied to the resin in the cavity. After the time required for the liquid resin or the melted resin to harden, the upper mold and the lower mold are closed. Thereby, a plurality of led wafers can be formed by resin encapsulation in a tree-reducing body of a solid corresponding to the shape of the cavity. Then, the molded article is cut. Thereby, a led product in which one or a plurality of LED chips are encapsulated in a resin can be obtained. Patent Document 1: JP-A-2005-305954 [Disclosure 3] Disclosure of the Invention 10 Problem to be Solved by the Invention The above-described mold combination mounted on a conventional device is interchangeable. Therefore, in response to the production amount of the optical element, it is possible to selectively use one of a small-sized production mold combination and a mass production mold combination. Therefore, according to the conventional device, it is possible to easily correspond to the increase or decrease of the throughput. 15 However, when using a large number of production mold combinations, the following problems are particularly caused. When a large amount of production is performed, a majority of the resin molded articles are produced from one mold combination as compared with the execution of a small amount of production, and therefore, the size and weight of the mold combination become large. Therefore, it is difficult for the operator to handle the mold combination, and the quality of the resin formed by the mold combination is also likely to be lowered. More specifically, when a large mold combination is used, the state in which the resin is hardened is easily different at each position in the mold assembly. That is, the state in which the resin is hardened in one mold combination tends to be uneven depending on the position. When the state in which the resin is cured depends on the position and the unevenness is large, if the molded article 200909177 including the cured resin is divided into a plurality of finished products, the light transmittance of the plurality of finished products may be greatly uneven. Therefore, when the resin is filled and formed into an optical element, it is required to use a device which can perform mass production without using a large mold combination. The present invention has been made in view of the above problems, and an object of the invention is to provide a resin encapsulation molding method and a device for use in a method of manufacturing a high-quality optical element regardless of whether a small amount of a production method or a mass production method is used. Means for Solving the Problem In the resin encapsulation molding method of the optical element of the present invention, first, a plurality of mold combination units each having a first mold and a second mold facing the first mold are prepared. One or more mold combination units are selected from a plurality of mold combination units. Each of the mold combination units or the mold combination unit group in which two or more mold combination units are integrated is used, and the optical element is filled with a resin. EFFECT OF THE INVENTION According to the apparatus of the present invention, other mold combination units can be mounted in one mold assembly unit, and other mold combination units can be removed from one mold assembly unit. Thereby, it is not necessary to use a large mold combination as in the conventional apparatus when performing mass production. Therefore, high-quality optical components can be produced even if mass production is required. Further, a plurality of mold combination units including the aforementioned one of the mold combination unit and the other mold combination unit may be arranged in series. At this time, a plurality of mold assembling units may be disposed between the supply unit of the material before forming and the accommodating unit of the molded article. Further, it is also possible to arrange the function of the supply unit of the pre-molding material and the accommodation unit of the molded product at one end of the majority of the mold unit, and the IN and OUT units of the 200909177. The above and other objects, features, aspects and advantages of the present invention will become apparent from the <RTIgt; BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view schematically showing a resin encapsulation molding apparatus (hereinafter simply referred to as "apparatus") in which an optical element of a mold assembly of the embodiment is mounted, and shows a plurality of unit assembly of the constituent apparatus. After the state. Fig. 2 is a plan view showing a state in which the device shown in Fig. 1 is assembled. Fig. 3 is a view schematically showing a cross-sectional view of the mold combination of the apparatus shown in Fig. 1 and showing a state in which the liquid resin is supplied into the cavity of the mold covered by the release film. Fig. 4 is a plan view schematically showing the apparatus of the second embodiment, and 15 shows a state in which a plurality of units constituting the apparatus are assembled. Fig. 5 is a cross-sectional view schematically showing a mold assembly unit of the apparatus shown in Fig. 4, and showing a state in which the liquid resin is supplied to the inside of the cavity of the mold covered by the release film. Fig. 6 is a cross-sectional view schematically showing a substrate of a plurality of optical elements used in the resin encapsulation molding method in which the optical elements of the embodiments 丨 and 2 are mounted. Fig. 7 is a cross-sectional view showing the LED molded article in which the optical element on the substrate shown in Fig. 6 is filled with a resin by the apparatus shown in Fig. 1. Fig. 8 is a cross-sectional view showing the LED molded article in which the optical element on the substrate shown in Fig. 6 is filled with a resin by means of the apparatus shown in Fig. 4. 200909177 L Real Mode 3 Best Mode for Carrying Out the Invention (Embodiment 1) Hereinafter, a resin encapsulation molding method for a light member according to an embodiment of the present invention will be described with reference to the drawings (hereinafter, simply referred to as "method" And the device used in the method (hereinafter, simply referred to as "device"). Further, the method and apparatus of the present embodiment are a so-called compression molding method and a compression molding device. (Pre-molding substrate) First, a substrate on which a plurality of optical elements which are formed by the resin of the present embodiment and sealed with a resin 10 is mounted will be described. In the pre-molding substrate 1 of the present embodiment, as shown in Fig. 6, a plurality of LED chips 2 are mounted as an example of a plurality of optical elements. Most of the LED chips 2 are arranged in a matrix on the main surface of the substrate 1. The substrate 1 shown in Fig. 6 is formed into the formed substrate 3 of the LED molded article shown in Fig. 7 by the method of the present embodiment. 15 (Structure of Resin Sealing and Forming Apparatus of Optical Element) As shown in Figs. 1 and 2, the apparatus 4 of the present embodiment includes a plurality of mold combination units A, a supply unit (IN unit) B, and a housing unit (〇1). ; D unit) C. The mold assembly unit a is for sealing a plurality of LED chips 2 mounted on the substrate 1 together with a resin. The substrate supply unit B is configured to supply the substrate 丨 and the resin 〇 material to 1 or a plurality of mold combination units A, respectively. 3. In the present embodiment, the liquid resin 5 is used as the resin material. However, the resin material may also be a mouth or a terminal; a resin material. At this time, the resin material of the solid or powder is melted by heating. Further, the substrate accommodating unit c is for accommodating the formed substrate 3 which is respectively sent from the or a plurality of mold combining units A. 200909177 Again, as shown in Fig. 1, a mold assembly is mounted on the substrate supply unit B. The substrate housing unit C is mounted on the mold assembly unit. The substrate is arranged upright in the order of the B, 1 or a plurality of mold combination sheets SA and the substrate housing unit C. The substrate supply unit B, the mold assembly unit a, and the base 5 are combined with each other to be detachable. Further, each of the mold assembling units A may be used in combination with each other, and one or two or more mold combining units A may be selectively used in the plurality of mold combining units A. Further, according to the apparatus of the present embodiment, as shown in Fig. 2, the substrate supply unit B, the four mold assembly units A, and the substrate storage unit c are arranged in an upright position. Further, although the four mold combination units a are connected in series in Fig. 2, the number of the mold combination units eight is not limited to this value, and may be any value as long as the plurality of mold combinations are connected in a single π Α line. That is, according to the apparatus of the present embodiment, the number of the mold unit Α can be increased or decreased. Further, in the present embodiment, the connecting device 6 is used to connect the substrate supply units B and 1 or the plurality of mold combination units A and the substrate storage unit c. However, the apparatus of the present embodiment can supply the early elements B, 1 or the plurality of mold combining units a and the substrate accommodating unit c to each other without using the connecting device 6. According to the apparatus of the above embodiment, the number of the plurality of mold combining units can be increased or decreased. Therefore, even if mass production is performed, it is not necessary to use a large mold combination as in the past. That is, when mass production is performed, a normal size mold combination used in performing small-volume production can be used. Therefore, the quality of the LED molded article 3 as a product does not decrease. (Configuration of Mold Combination Unit) As shown in Figs. 1 to 3, the mold assembly unit A has a 200909177 mold assembly 7 in front of it. Further, the mold assembly 7 includes a mold 8 having a fixed position and a mold 9 disposed opposite to the upper mold 8 and movable. Further, the upper mold 8 and the lower mold 9 have a heating mechanism (not shown) which can be heated to a temperature required for molding the resin material. 5 X, the mold surface of the upper mold 8 has the supply portion 10 of the positioning substrate 1. The substrate i on which the LED chip 2 is mounted is positioned in the supply portion 10 with the wafer 2 facing downward. Further, the mold surface of the lower mold 9 constitutes a mold six (a large mold hole). The cavity 11 has its opening facing upward. Further, the bottom surface 11a of the die VIII has a plurality of hemispherical recesses 12 (most small mode H) holes. Most of the hemispherical recesses 12 are arranged in a matrix in correspondence with the majority of the LED chips 2. The hemispherical recess 12 is for molding the lens portion of the optical element. Therefore, when the upper mold 8 and the lower mold 9 are closed, they are mounted on the substrate! The majority of the LED chips 2 are opposed to the plurality of recesses 12, respectively. Further, the bottom surface Ua of the cavity 11 is constituted by the bottom surface member 13. The bottom member 13 15 : moves up and down. Therefore, the bottom surface 11a pushes up the liquid resin 5 supplied into the cavity 11. Therefore, the liquid resin 5 is compressed in the cavity 11 when the upper mold 8 and the lower mold 9 are closed. Further, as shown in Fig. 3, the mold assembly unit A includes a release film 14 which can cover the inner surface of the mold, and a film supply mechanism 15 for supplying the release film 14 to the cavity. The film supply mechanism 15 includes a roller for feeding the release film, and a roller lsb for winding the release film u. The roller (5) and the roller (9) supply the release film 14 in a state of maintaining tension between the upper die 8 and the lower die 9. Although not shown, an adsorption hole is connected to the bottom surface 11a of the cavity 11. Further, a vacuum system or the like constituting the vacuum suction mechanism is connected to the adsorption hole. Vacuum 11 200909177 The suction mechanism is forced from the cavity by the hole (10). The floor is discharged to the outside. This allows the (four) egg to be tightly joined to the majority of the recess 12, the side of the die and the bottom surface of the cavity. · Again, around the upper die 8 is surrounded by the outer periphery of the upper die 8. The upper mold portion: the body partition member 16. The upper mold 8 and the upper mold outer gas partition member are fixed to the fixed plate 17. Further, the lower mold 9 is provided around the lower mold and the outer portion of the outer periphery of the outer air is cut off. The member 18. The lower mold is fixed to the movable disk 19 with the lower mold outer gas shutoff member 18. The 外部 龄 H H mold external gas _ member 16 is provided with a sealing structure for external gas partitioning under the member. Sealing the aforementioned In the vacuum system (not shown), the air is forcibly discharged to the outside. The sealed space can be set to a predetermined degree of vacuum by the function of the vacuum pump. The degree of vacuum of the closed space is specifically set as follows. , 15 . Upper &quot;^8 and the lower fixture 9. At this time, before the outer air of the upper mold is cut off by 5 pieces 16 and the lower surface of the outer gas barrier member of the lower mold is pushed, the release film is present. In the state of 14, the dam member 2 of the upper mold outer gas shutoff member 16 is pushed onto the lower mold outer gas shutoff member 18. Thereby, the upper mold 8, the lower mold 9, the upper mold outer gas shutoff member 16, and the lower portion The mold outer gas shutoff member 18 and the seal member 20 form a sealed space 20. That is, the sealed space in the mold combination including the cavity inside the cavity is in a state of being blocked from the outside air. At this time, the upper mold 8 and the lower mold There is a gap between the two. This is a so-called intermediate mold closing state. Then, the air is forcibly discharged to the outside from the sealed space by a vacuum pump, whereby the mold release film 14 is interposed in the middle. The mold face of the die 8 and the die 12 of the lower die 9 200909177 - face change, the die face of the upper die 8 and the die face of the lower die 9 hold the film and the substrate, which is a so-called fully closed state. Then, the air in the closed space is discharged to the outside, whereby the degree of vacuum of the sealed space is set to a predetermined value. Further, when the resin molding is performed, the liquid resistant month 5 is supplied to each of the mold combination units. To cover the space in the cavity I of the release film 14, and to position the substrate 1 of the formed crucible to the supply portion 1, and set the space inside the cavity to a predetermined degree of vacuum. Then, in the closed After the upper mold 8 and the lower mold 9, the liquid resin 5 in the cavity 11 is applied with a predetermined pressure by the bottom member 13. Under the scorpion, after the time required for the molten resin to harden, it is opened. Only the fruit 8 and the lower mold 9. As a result, as shown in Fig. 7, a plurality of LED chips 2 are formed and sealed in an LED molded article 3 in a resin molded body 21 corresponding to the shape of the cavity. (Structure of Supply Unit) 15 As shown in Figs. 1 and 2, the substrate supply unit B includes a loading unit (bin E) 22, a positioning unit 23, an arranging unit (rotating machine) 24, and a loading mechanism ( Supply organization) 25. The loading portion 22 is filled with the substrate 1 before molding. The substrate 1 pushed out from the loading portion 22 is positioned at the positioning portion 23. The aligning portion 24 changes (rotates) the direction of the substrate 1 sent from the positioning portion 23. The loading mechanism 25 supplies the substrate 1 and the liquid resin 5 to the mold assembly unit A. Further, as shown in Fig. 2, the movement area 26 of the loading mechanism 25 is provided at a position on the back side of the apparatus at the side of the four mold unit A and the substrate supply unit B. Further, as shown in FIG. 3, the mounting portion 27 on which the substrate 丨 is placed with the LED chip 2 facing downward is placed on the upper portion of the mounting mechanism 25, and the substrate 1 is raised 13 200909177 and positioned at the supply portion 10. The elevated portion 28. When the resin molding is performed, first, the substrate 1 is pushed out from the loading portion 22 to the positioning portion 23. Next, the substrate 1 is sent from the positioning portion 23 to the array portion 24. Then, the substrate 1 is rotated by the aligning portion 24 in a predetermined direction. Further, the substrate 1 is placed on the mounting portion 27 of the five-load upper mechanism 25. In this state, the loading mechanism 25 moves along the moving area 26. As a result, the loading mechanism 25 is positioned at the side of one or a plurality of mold combining units A, respectively. In each of the one or more mold assembly units A, the elevated portion 28 lifts the substrate 1 after the substrate 1 is inserted between the mold 8 and the lower mold 9 above the mold assembly unit a. Thereby, the substrate 1 before molding is positioned at the supply portion 10 of the upper mold 8. Further, a resin supply mechanism 29 for dropping the liquid resin 5 to the cavity u is provided in the lower portion of the loading mechanism 25. The resin supply mechanism 29 is, for example, a lateral distributor. Further, the liquid resin 5 may be any resin as long as it has transparency (transparency) and thermosetting property. However, in the present embodiment, a one-liquid type resin is used. Further, the resin supply mechanism 29 includes a horizontal nozzle 3A for supplying the liquid resin 5 to the cavity u, and a pressurizing portion 31 for applying a predetermined pressure to the liquid resin 5. When the resin molding of this embodiment is performed, first, the loading mechanism 25 moves along the movement region 35. At the same time, the horizontal nozzle 3〇 (the loading mechanism 25) is inserted into the buckle between the upper mold 8 and the lower mold 9 in the horizontal direction (lateral direction): next, the horizontal nozzle 30 is from the upper mold 8 and the lower portion When the molds 9 are taken out, the crucible 31 applies a pressure to the liquid resin 5 in the horizontal direction. In this way, the liquid tree willow 5 will be pushed out horizontally. As a result, the liquid resin $ is dropped from the horizontal type X to the cavity 1 at this time, and the liquid resin 5 is supplied to the entire cavity u from the plane. For example, the horizontal nozzle is moved into a liquid 14 200909177. The resin 5 is s-shaped on the bottom surface of the cavity 11 as seen from a plane. In addition, the substrate crucible and the liquid tree grease 5 can also be supplied to the upper and lower molds 9 by the loading mechanism 25_. (Structure of Storage Unit) 5 Further, as shown in Figs. 1 and 2, the substrate storage unit C includes a detaching portion 32, a _ 嶋 machine table 33, and a housing portion. In the aligning portion 33, the LED molded article 3 sent from the detaching portion 32 is rotated in the direction of the daring. The LED molded article 3 sent from the lining 33 is housed in the accommodating portion. As shown in Fig. 2, the movement area 35 of the detaching mechanism is provided at the position of the apparatus back surface 4b at the side of the four mold unit A and the substrate accommodating unit c. When the detaching mechanism 32 is used, first, unloading The lower mechanism 32 is inserted between the mold 8 and the lower mold 9 above the mold assembly unit A. Next, the detaching mechanism 保持 holds the LED molded article 3. Then, the detaching mechanism 32 takes out the LED from between the upper mold 8 and the lower mold 915. Next, the detaching mechanism 32 moves the product 3-side along the movement area 35, and the LED molded article 3 is placed on the aligning portion 33. Next, the arranging unit 33 forms the LED molded article. 3 is rotated in a predetermined direction. Then, the LED molded article 3 is housed in the accommodating portion 34. (Resin sealing method for optical element In the resin sealing molding method of the present embodiment, first, as shown in Figs. 1 and 2, in the substrate supply unit B, the substrate 1 before molding is pushed from the loading portion 22 to the positioning portion 23. The substrate 转 is rotated in the predetermined direction by the aligning portion 24. Further, the substrate 1 is placed on the mounting portion 27 of the loading mechanism 25. Then, after the loading mechanism 25 on which the substrate 1 is mounted is moved along the moving region 26, The mold 15 is connected between the mold 8 and the lower mold 9 on the combination of the single SA.

然後，載上機構25之抬高部28將基板1抬高。藉此’基 板1疋位於上模具8之供給部10。此時，安裝於基板1之LED 5 10 曰曰片2會朝下。又，液狀樹脂5從載上機構25之樹脂供給機 構29的橫型噴嘴3()被朝水平方向推至覆蓋有賴薄膜咐 榼八11。然後’液狀樹脂5會在模穴丨丨内加熱。 接著’閉合上模具8與下模具9,而成為中間閉模狀態。 然後’將上模具8與下模具9間之密閉空間設定為預定真空 度。藉此，上模具8與下模具9成為完全閉模狀態。然後， 在密閉空間設定為預定真空度之狀態下，安裝於基板 LED晶片2會浸潰於模穴11内之液狀樹脂5。再者，底面構 件13會對模穴u内之液狀樹脂5施加預定壓力。 在經過硬化所需的預定時間後，形成LED成形品（成形 完畢基板)3。LED成形品3是將多數LED晶片2填封成形於樹 15脂成形體21内者。樹脂成形體21對應於模穴11的形狀。 接著，打開上模具8與下模具9。然後，卸下機構32進 入上模具8與下模具9之間，且保持LED成形品3。接著，卸 下機構32移動於移動領域35，且將LED成形品3送至基板容 納單元C之排列部33。排列部33變更LED成形品3的方向。 20然後’ LED成形品3容納於基板容納單元C。 (LED成形品） 又，LED成形品3如第7圖所示，具有内包安裝於基板1 之多數LED晶片2之樹脂成形體21。樹脂成形體21對應於包 含多數凹部12之模穴11的形狀。 16 200909177 基板1上之多數L E D晶片2的數量及位置分別對應於模 穴11之多數凹部12的數量及位置。因此，LED成形品3中， 構成樹脂成形體21之多數半球部36的數量及位置對應於樹 脂成形體21内之多數LED晶片2的數量及位置。又，樹脂成 5形體21包含多數半球部36及圍住該等半球部36之平板部 37。多數半球部36對應於模穴η之多數凹部12，平板部37 對應於圍住模穴11之各多數凹部丨2的平板部37。 前述LED成形品3若在切斷位置38切斷，則可得到分別 包含一個半球部36之多數LED零件39。 10 (模具組合單元之增減調整） 又’如前所述，根據本實施形態之樹脂填封成形方法 及使用於該方法之裝置，可增減設於基板供給單元B與基板 容納單元C之間的模具組合單元a(正常尺寸的模具）的數 量。因此’不必如過去使用大尺寸的模具組合，而可執行 光元件之成形品的小量生產及大量生產兩者。因此，可製 造高品質之LED成形品3。 (實施形態2) 接著，說明本發明實施形態2之樹脂填封成形方法及使 用於該方法之裝置。 20 另，本實施形態裴置之構成要素中，與實施形態1所說 之構成要素同一構成要素則賦予同一符號，且不反覆說 (光元件之樹脂填封成形裝置之構造） 如第4圖所示，實施形態2之光元件之樹脂填封成形裝 17 200909177 置（以下僅稱「裝置」）41包含内裝有基板供給機構44及基板 容納機構45兩者之IN、OUT單元E以及1或多數模具組合單 元D。基板供給機構44對應於實施形態1之基板供給單元 B。基板容納機構45對應於實施形態1之基板容納單元c。 5本實施形態中，基板供給機構44及基板容納機構45—體化 而構成一個IN、OUT單元E。模具組合單元D可安裝於in、 OUT單元E，同時也可從in、OUT單元E卸除。各模具組合 單元D亦可互相卸除。另，可從多數模具組合單元D中選擇 性地使用1或2個以上之模具組合單元〇。 10 模具組合單元D形成第8圖所示之LED成形品（成形完 畢基板)43。LED成形品43具有多數光元件。多數光元件分 別包含安裝於基板1之多數LED晶片2。多數LED晶片2分別 填封於多數樹脂成形體，即半球狀之樹脂成形體46内。 基板供給機構44將基板1及液狀樹脂5分別供給至j或 15多數椟具組合單元D。基板容納機構45容納模具組合單元D 所樹脂填封成形之第8圖所示之LED成形品43。 又，1個模具組合單元D與IN、OUT單元E可藉由連結 具6互相連結。又，各多數模具組合單元D可藉由連結具6 連結，且直列地(―列地）配置。 2〇 又’實施形態2之裝置41中，在該|置前面41a設有卸 下機構32所移動之移動領域35，且在該裝置背面41b設有载 上機構25所移動之移動領域26。 (模具組合單元之構造） 々第4圖及第5圖所示，1或多數模具組合單元D分別在 18 200909177 該杈具組合單元D之裝置前面4ia設有模具組合42。模具組 合42包含已固定的上模具47(固定盤17)與相向於上模具47 而配置且可動之下模具48(移動盤19)。上模具47及下模具补 具有加熱液狀樹脂5之加熱機構(未圖示）。Then, the elevated portion 28 of the loading mechanism 25 raises the substrate 1. Thereby, the substrate 1 is located at the supply portion 10 of the upper mold 8. At this time, the LEDs 5 10 mounted on the substrate 1 will face downward. Further, the liquid resin 5 is pushed from the horizontal nozzle 3 () of the resin supply mechanism 29 of the loading mechanism 25 in the horizontal direction to cover the film 榼8. Then the liquid resin 5 is heated in the cavity. Then, the upper mold 8 and the lower mold 9 are closed to be in an intermediate closed mold state. Then, the sealed space between the upper mold 8 and the lower mold 9 is set to a predetermined degree of vacuum. Thereby, the upper mold 8 and the lower mold 9 are in a completely closed state. Then, in a state where the sealed space is set to a predetermined degree of vacuum, the liquid crystal resin 5 which is mounted on the substrate LED wafer 2 is immersed in the cavity 11. Further, the bottom member 13 applies a predetermined pressure to the liquid resin 5 in the cavity u. After a predetermined time required for the hardening, an LED molded article (formed substrate) 3 is formed. The LED molded article 3 is obtained by filling and molding a plurality of LED chips 2 into the resin 15 of the tree 15 . The resin molded body 21 corresponds to the shape of the cavity 11. Next, the upper mold 8 and the lower mold 9 are opened. Then, the detaching mechanism 32 enters between the upper mold 8 and the lower mold 9, and holds the LED molded article 3. Next, the unloading mechanism 32 is moved to the movement area 35, and the LED molded article 3 is sent to the array portion 33 of the substrate accommodating unit C. The aligning portion 33 changes the direction of the LED molded article 3. 20 then 'LED molded article 3 is accommodated in substrate housing unit C. (LED molded article) As shown in Fig. 7, the LED molded article 3 has a resin molded body 21 in which a plurality of LED chips 2 mounted on the substrate 1 are packaged. The resin molded body 21 corresponds to the shape of the cavity 11 including the plurality of recesses 12. 16 200909177 The number and position of the plurality of L E D wafers 2 on the substrate 1 correspond to the number and position of the plurality of recesses 12 of the cavity 11, respectively. Therefore, in the LED molded article 3, the number and position of the plurality of hemispherical portions 36 constituting the resin molded body 21 correspond to the number and position of the plurality of LED chips 2 in the resin molded body 21. Further, the resin-shaped body 21 includes a plurality of hemispherical portions 36 and a flat plate portion 37 that surrounds the hemispherical portions 36. The majority of the hemispherical portions 36 correspond to the plurality of recesses 12 of the cavity n, and the flat plate portion 37 corresponds to the flat plate portion 37 that surrounds the plurality of recesses 2 of the cavity 11. When the LED molded article 3 is cut at the cutting position 38, a plurality of LED components 39 each including one hemispherical portion 36 can be obtained. 10 (Adjustment and Reduction Adjustment of Mold Combination Unit) As described above, the resin encapsulation molding method and the apparatus used in the method according to the present embodiment can be increased or decreased in the substrate supply unit B and the substrate storage unit C. The number of mold combination units a (normally sized molds). Therefore, it is not necessary to use a large-sized mold combination as in the past, and it is possible to perform both small-volume production and mass production of a molded article of an optical element. Therefore, a high-quality LED molded article 3 can be produced. (Embodiment 2) Next, a resin encapsulation molding method according to Embodiment 2 of the present invention and an apparatus used therefor will be described. In the components of the first embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the structure of the resin sealing device of the optical element is not repeated (see Fig. 4). In the resin encapsulating and molding device 17 of the optical device of the second embodiment, the present invention includes an IN, an OUT unit E and a 1 in which both the substrate supply mechanism 44 and the substrate housing mechanism 45 are housed. Or most mold combination unit D. The substrate supply mechanism 44 corresponds to the substrate supply unit B of the first embodiment. The substrate housing mechanism 45 corresponds to the substrate housing unit c of the first embodiment. In the present embodiment, the substrate supply mechanism 44 and the substrate housing mechanism 45 are integrally formed to constitute one IN and OUT unit E. The mold assembly unit D can be installed in the in and OUT units E, and can also be removed from the in and OUT units E. Each of the mold combination units D can also be removed from each other. Further, one or two or more mold combination units 〇 can be selectively used from the plurality of mold combination units D. The mold assembly unit D forms the LED molded article (formed substrate) 43 shown in Fig. 8. The LED molded article 43 has a plurality of optical elements. Most of the optical components include a plurality of LED chips 2 mounted on the substrate 1, respectively. Most of the LED chips 2 are filled in a plurality of resin molded bodies, i.e., hemispherical resin molded bodies 46. The substrate supply mechanism 44 supplies the substrate 1 and the liquid resin 5 to the j or 15 plurality of cookware combination units D, respectively. The substrate housing mechanism 45 accommodates the LED molded article 43 shown in Fig. 8 in which the mold assembly unit D is resin-sealed. Further, one of the mold unit D and the IN and OUT units E can be connected to each other by the joint 6. Further, each of the plurality of mold combining units D can be connected by the connecting means 6 and arranged in series ("column"). Further, in the apparatus 41 of the second embodiment, the movement area 35 on which the removal mechanism 32 is moved is provided on the front surface 41a, and the movement area 26 on which the loading mechanism 25 is moved is provided on the apparatus rear surface 41b. (Structure of Mold Combination Unit) As shown in Figs. 4 and 5, 1 or a plurality of mold combination units D are respectively provided with a mold assembly 42 at the front face 4ia of the apparatus of the cookware combination unit D at 18 200909177. The die assembly 42 includes a fixed upper die 47 (fixed disk 17) and a lower movable die 47 (moving disk 19) disposed opposite to the upper die 47. The upper mold 47 and the lower mold are provided with a heating mechanism (not shown) for heating the liquid resin 5.

5 又，如第5圖所示，基板1在下模具48的模具面以LED 晶片2朝下之狀態定位於供給部1〇。多數LED晶片2以矩陣 狀配置在該基板1上。多數LED晶片2分別對應於多數半球 狀之模穴49。又，多數半狀狀之模穴49分別對應於實施形 態1之多數凹部U。另，第4圖巾，多數模穴49以點虛線顯 10 示於下模具48之模具面。 又，樹脂供給機構2 9將預定量之液狀樹脂5供給至各多 數模穴49。又’模具組合42與實施形態1相同，具有將多數 模穴49分別設定成預定真空度之機構。該機構如實施形態i 所說明者，包含上模具外部氣體隔斷構件16、下模具外部 15氣體隔斷構件18、密封構件20及真空吸引機構等。 根據上述本實施形態之方法及裝置，可利用模具組合 42將安裝於基板1之多數LED晶片2分別填封於多數半球狀 樹脂成形體46内。 (樹脂填封成形方法） 20 實施形態2中，與實施形態1相同，首先，基板供給機 構44從裝填部22將成形前基板1推至定位部23。基板丨以排 列部24朝向預定方向。又，然後，基板1載置於載上機構^ 之載置部27。 接著，載上機構25—面保持基板1 ’ 一面沿著移動領域 19 200909177 26移動，然後，進入模具組合單元d之上模具π與下模具48 之間。 接著，載上機構25之抬高部28將基板1抬高。藉此，基 板1定位於供給部10。另，基板UXLED晶片2朝下之狀態定 5位於供給部10。又，載上機構25之樹脂供給機構29之加壓 部31對液狀樹脂5施加壓力。藉此，液狀樹脂5從橫型噴嘴 30分別供給至多數模穴49。 接著，閉合上模具47及下模具48。藉此，安裝於基板！ 之多數LED晶片2分別浸潰於多數模穴49之液狀樹脂5。此 10時本實施形態之方法中，與實施形態1之方法相同，多數 模穴49分別設定成預定真空度。 在經過液狀樹脂硬化所需的時間後，LED晶片2藉由半 球狀之樹脂成形體46填封於多數模穴49。結果，如第3圖及 第8圖所示，形成LED成形體43。 15 接著’打開•模具47及下模具48 H卸下機構32Further, as shown in Fig. 5, the substrate 1 is positioned on the mold surface of the lower mold 48 with the LED chip 2 facing downward in the supply portion 1A. A plurality of LED chips 2 are arranged in a matrix on the substrate 1. Most of the LED chips 2 correspond to a plurality of hemispherical mold cavities 49, respectively. Further, most of the semi-shaped cavity portions 49 correspond to the plurality of concave portions U of the embodiment 1. Further, in the fourth figure, most of the cavity 49 is shown by a dotted line on the mold surface of the lower mold 48. Further, the resin supply mechanism 29 supplies a predetermined amount of the liquid resin 5 to each of the plurality of cavities 49. Further, the mold assembly 42 has the same mechanism as that of the first embodiment, and has a mechanism for setting the plurality of mold cavities 49 to a predetermined degree of vacuum. This mechanism includes the upper mold outer gas shutoff member 16, the lower mold outer portion 15 gas shutoff member 18, the seal member 20, the vacuum suction mechanism, and the like as described in the embodiment i. According to the method and apparatus of the present embodiment described above, the plurality of LED chips 2 mounted on the substrate 1 can be filled in the plurality of hemispherical resin molded bodies 46 by the mold assembly 42. (Resin Sealing Method) In the second embodiment, as in the first embodiment, first, the substrate supply mechanism 44 pushes the pre-molding substrate 1 from the loading unit 22 to the positioning unit 23. The substrate 朝向 faces the alignment portion 24 in a predetermined direction. Further, the substrate 1 is then placed on the mounting portion 27 of the loading mechanism. Next, the loading mechanism 25-side holding substrate 1' is moved along the moving field 19 200909177 26, and then enters between the mold π and the lower mold 48 above the mold assembly unit d. Next, the elevated portion 28 of the loading mechanism 25 raises the substrate 1. Thereby, the substrate 1 is positioned at the supply portion 10. Further, the substrate UXLED wafer 2 is positioned downward in the state of the supply portion 10. Further, the pressurizing portion 31 of the resin supply mechanism 29 of the loading mechanism 25 applies pressure to the liquid resin 5. Thereby, the liquid resin 5 is supplied from the horizontal nozzles 30 to the plurality of cavities 49, respectively. Next, the upper mold 47 and the lower mold 48 are closed. By this, it is mounted on the substrate! Most of the LED chips 2 are immersed in the liquid resin 5 of the plurality of cavities 49, respectively. In the method of this embodiment at 10 o'clock, as in the method of the first embodiment, the plurality of cavities 49 are each set to a predetermined degree of vacuum. After the time required for the liquid resin to harden, the LED wafer 2 is filled in a plurality of cavities 49 by a hemispherical resin molded body 46. As a result, as shown in Figs. 3 and 8, an LED molded body 43 is formed. 15 then 'opens · mold 47 and lower mold 48 H removal mechanism 32

進入上換具47下模具48之間。接著，卸下機構32保持LED 成形體43。接著，卸下機構32移動於移動領域％。藉此， 基板1設置於基板容納機構45之排列部33。然後，排列部33 變更LED成形體43的方向，且將LED成形體43送至容納部 20 34。 (LED成形品） 又，LED卿體43如帛8_示，包含安裝絲幻之 夕婁文LED曰曰片2。又，多數led晶片2分別内包於多數半球 狀樹脂成形體46。另，多數半球狀樹脂成形體从分別對應 20 200909177 於多數模穴49的形狀。另，LED成形品43在切斷位置5〇切 斷，而分割為多數製品。 (模具组合單元之增減調整） 又，如前所述，在實施形態2中’與實施例1相同，可 5因應小量生產及大量生產任何一個，將安裝於IN、〇υτ單 元E之模具組合單元d的數量從一個增減至數個。因此，根 據本實施形態之方法及裝置，與實施形態1之方法及震置相 同，無須大尺寸之模具組合。結果，對小量生產及大量生 產任何一個皆可形成高品質之LED成形品。 1〇 另，各實施形態中，使用液狀樹脂5作為樹脂材料，但 亦可使用顆粒狀的樹脂材料或粉末狀的樹脂材料來取代液 狀樹脂。又，各實施形態中，使用一液型矽樹脂，但取而 代之亦可使用二液型石夕樹脂。又，各實施形態中，亦可使 用％氣樹脂作為樹脂材料。 15 又’各實施形態中’可使用導線框取代基板1。又，各 實施形態之方法中，採用使用脫模薄膜的方法及將模穴設 成預定真空度的方法。然而，該等方法是選擇性地採用的， 因此’本發明之方法亦可都不採用使用脫模薄膜的方法及 將模穴設成航真#的方法任何—個或兩者。 20 3 ’實施形態之模具組合為上模具與下模具所構成之 兩片变構造之模具組合。然而，本發明之模具組合亦可為 上模具、下模具及中間型之三片型構造之模具組合。另， 三片«造之模具組合可由下模具與中間型夹持脫模薄 膜。 21 200909177 雖詳細地說明顯示本發明，但此僅為舉例，而並非限 定’應可清楚轉發明㈣僅自賴請專利範圍來 定。 x 【圖式簡單說明】 第1圖係概略地顯示搭載有實施形態1之模具組合之光 7L件之樹脂填封成形裝置(以下，僅稱「裝置」。）之平面圖， 且顯不構成Ιϊ之多數單元組裝後之狀態。 第2圖係顯示第丨圖所示之裝置組裝後之狀態的平 圖。 第3圖係概略性地顯示第丨圖所示之裝置之模具組合單 兀之截面圖，且顯示液狀樹脂供給至被脫模薄膜覆蓋之下 模具的模穴内之狀態。 第4圖係概略性地顯示實施形態2之裝置之平面圖，且 顯示構成裝置之多數單元組裝後之狀態。 第5圖係概略性地顯示第4圖所示之裝置之模具組合單 兀之截面圖，且顯示液狀樹脂供給至被脫模薄膜覆蓋之下 模具的模穴内前之狀態。 第6圖係概略地顯示安裝有實施形態丨及2之光元件之 樹脂填封成形方法所使用之多數光元件之基板之截面圖。 第7圖係顯示利用第1圖所示之裝置用樹脂填封成形第 6圖所示之基板上的光元件之LED成形品之截面圖。 第8圖係顯示利用第4圖所示之裝置用樹脂填封成形第 圖所示之基板上的光元件之led成形品之載面圖。 22 200909177 【主要元件符號說明】 1…基板(成形前） 20…密封構件 21.. .樹脂成形體 22…裝填部(倉匡) 23.. .定位部 24.. .排列部(旋轉機台） 25.. .載上機構(供給機構) 26.. .移動領域 27.. .載置部 28.. .抬高部 29.. .樹脂供給機構 30.. .橫型噴嘴 31.. .加壓部 32…卸下部 33···排列部(旋轉機台） 34.. .容納部(倉匣） 35.. .移動領域 36.. .半球部 37.. .平板部 38.. .切斷位置 39.. 丄ED零件 41.. .裝置 41a...裝置前面 41b…裝置背面 2.. .LED 晶片 3…基板(成形完畢） 4.. .裝置 4a...裝置前面 4b...裝置背面 5.. .液狀樹脂 6.. .連結具 7.. .模具組合 8.. .上模具 9.. .下模具 10.. .供給部 11…模六 11a...模穴底面 12.. .凹部Enter the lower mold 47 between the lower molds 48. Next, the detaching mechanism 32 holds the LED molded body 43. Next, the detaching mechanism 32 moves to the mobile field %. Thereby, the substrate 1 is provided in the array portion 33 of the substrate housing mechanism 45. Then, the aligning portion 33 changes the direction of the LED molded body 43, and sends the LED molded body 43 to the accommodating portion 2034. (LED molded product) Further, the LED body 43 is shown as 帛8_, and includes an LED 曰曰 之 曰曰 曰曰 LED 曰曰 。 。 Further, a plurality of led wafers 2 are respectively wrapped in a plurality of hemispherical resin molded bodies 46. Further, most of the hemispherical resin molded bodies correspond to the shape of the majority of the cavities 49 from 20 200909177, respectively. Further, the LED molded article 43 is cut at the cutting position 5, and is divided into a plurality of products. (Adjustment and Reduction Adjustment of Mold Combination Unit) As described above, in the second embodiment, 'the same as in the first embodiment, 5 can be installed in the IN, 〇υτ unit E in accordance with the small-scale production and mass production. The number of mold combination units d is increased or decreased from one to several. Therefore, according to the method and apparatus of the present embodiment, the method and the apparatus of the first embodiment are the same, and it is not necessary to combine molds of a large size. As a result, high-quality LED molded articles can be formed for any small-volume production and mass production. In the respective embodiments, the liquid resin 5 is used as the resin material, but a granular resin material or a powdery resin material may be used instead of the liquid resin. Further, in each of the embodiments, a one-liquid type resin is used, but a two-component type of stone resin may alternatively be used. Further, in each of the embodiments, a % gas resin may be used as the resin material. 15 In the 'in the embodiments', the substrate 1 can be replaced with a lead frame. Further, in the method of each embodiment, a method of using a release film and a method of setting a cavity to a predetermined degree of vacuum are employed. However, these methods are selectively employed, and thus the method of the present invention may not employ any one or both of the method of using the release film and the method of setting the cavity to the aerospace #. The mold combination of the 20 3' embodiment is a combination of two molds of a variable structure composed of an upper mold and a lower mold. However, the mold combination of the present invention may also be a combination of an upper mold, a lower mold, and an intermediate type three-piece construction. In addition, the three-piece mold combination can be used to hold the release film from the lower mold and the intermediate mold. 21 200909177 Although the present invention has been described in detail, this is an exemplification and is not intended to limit the invention (s). [Embodiment of the drawings] Fig. 1 is a plan view schematically showing a resin encapsulation molding apparatus (hereinafter simply referred to as "apparatus") in which the light 7L of the mold assembly of the first embodiment is mounted, and does not constitute a crucible. The state of most units after assembly. Fig. 2 is a plan view showing the state after assembly of the device shown in Fig. 1. Fig. 3 is a cross-sectional view schematically showing the mold assembly unit of the apparatus shown in Fig. 1, and shows the state in which the liquid resin is supplied into the cavity of the mold covered by the release film. Fig. 4 is a plan view schematically showing the apparatus of the second embodiment, and shows a state in which a plurality of units constituting the apparatus are assembled. Fig. 5 is a cross-sectional view schematically showing a mold assembly unit of the apparatus shown in Fig. 4, and showing a state in which the liquid resin is supplied to the inside of the cavity of the mold covered by the release film. Fig. 6 is a cross-sectional view schematically showing a substrate of a plurality of optical elements used in a resin sealing molding method in which the optical elements of the embodiments 丨 and 2 are mounted. Fig. 7 is a cross-sectional view showing the LED molded article in which the optical element on the substrate shown in Fig. 6 is filled with a resin by the apparatus shown in Fig. 1. Fig. 8 is a plan view showing a LED molded article in which the optical element on the substrate shown in Fig. 1 is filled with a resin by means of the apparatus shown in Fig. 4. 22 200909177 [Description of main component symbols] 1...Substrate (before molding) 20...Sealing member 21. Resin molded body 22...Loading part (Cangbin) 23.. Positioning part 24: Arrangement part (Rotary machine 25.. . Loading mechanism (supply mechanism) 26.. Mobile field 27.. Mounting part 28.. Lifting part 29.. Resin supply mechanism 30.. Horizontal nozzle 31.. Pressurizing unit 32...Removing unit 33··· Arrangement unit (rotating machine) 34.. accommodating part (Cangjie) 35.. Moving area 36.. Hemispherical part 37.. Flat section 38.. Cutting position 39.. 丄 ED part 41.. Device 41a... Device front 41b... Device back side 2.. LED wafer 3... Substrate (formed) 4.. Device 4a... Device front 4b. .. Back of the device 5.. Liquid resin 6.. . Connecting tool 7.. Mold combination 8.. Upper mold 9.. Lower mold 10.. Supply part 11... Mold 6 11... The bottom surface of the hole is 12: recess

13.. .底面構件 14.. .脫模薄膜 15.. .薄膜供給機構 15a、15b...滾輪 16.. .上模具外部氣體隔斷構件 17.. .固定盤 18.. .下模具外部氣體隔斷構件 19.. .移動盤 23 200909177 42.. .模具組合 43 ...LED成形品(成形完畢基板) 44…基板供給機構 45.. .基板容納機構 46. ··樹脂成形體 47.. .上模具 48.. .下模具 49.. .模穴 50.. .切斷位置 A...模具組合單元 B·..供給單元(IN單元） C. ..容納單元(OUT單元) D. ..模具組合單元 E. ..IN、OUT單元 2413.. bottom member 14: release film 15.. film supply mechanism 15a, 15b... roller 16.. upper mold outer gas barrier member 17.. fixed disk 18.. Gas partition member 19: moving disk 23 200909177 42.. mold assembly 43 ... LED molded product (formed substrate) 44 ... substrate supply mechanism 45. substrate receiving mechanism 46. · resin molded body 47. . Upper mold 48.. Lower mold 49.. mold cavity 50.. Cut position A... Mold assembly unit B·.. Supply unit (IN unit) C. .. Storage unit (OUT unit) D. .. mold combination unit E. .. IN, OUT unit 24

Claims (1)

200909177 十、申請專利範圍： 1. 一種光元件之樹脂填封成形方法，包括下列步驟： 準備多數分別具有第1模具及與前述第1模具相向 之第2模具之模具組合單元； 5 從前述多數模具組合單元中選擇1或2個以上之模 具組合單元；及 分別使用前述1個模具組合單元或前述2個以上之 模具組合單元一體化後之模具組合單元群，藉由樹脂填 f 封光元件。 10 2.如申請專利範圍第1項之光元件之樹脂填封成形方法， 更包括下列步驟： 在前述選擇步驟後，且在前述填封步驟前，將前述 光元件及前述樹脂分別供給至前述1或2個以上之模具 組合單元；及 15 在前述填封步驟後，分別從前述1或2個以上之模具 組合單元取出前述光元件已被前述樹脂填封之成形品。 I 3.如申請專利範圍第2項之光元件之樹脂填封成形方法， 其中在前述供給步驟前，以脫模薄膜覆蓋前述1或2個以 上之模具組合單元之各模穴， ' 20 且，在前述供給步驟中，將前述樹脂供給至已被前 述脫模薄膜覆蓋之前述模穴内的空間。 4.如申請專利範圍第1項之光元件之樹脂填封成形方法， 其中在前述填封步驟中，在包含前述1或2個以上之模具 組合單元之各模穴的密閉空間設定為預定真空度之狀 25 200909177 態下，在前述密閉空間中藉由前述樹脂填封前述光元 件。 5. —種樹脂填封成形裝置，包含多數分別具有第1模具及 與前述第1模具相向之第2模具之模具組合單元， 5 且，選自前述多數模具組合單元之1或2個以上之模 具組合單元一體化。 6. 如申請專利範圍第5項之光元件之樹脂填封成形裝置， 更包含： 供給單元，可將光元件及樹脂分別供給至前述1或2 10 個以上之模具組合單元；及 容納單元，可容納分別從前述1或2個以上之模具組 合單元取出且已被前述樹脂填封之前述光元件， 且，前述1或2個以上之模具組合單元、前述供給單 元及前述容納單元一體化。 15 7.如申請專利範圍第6項之光元件之樹脂填封成形裝置， 其中前述1或2個以上之模具組合單元配置於前述供給 單元與前述容納單元之間。 8.如申請專利範圍第6項之光元件之樹脂填封成形裝置， 其中前述供給單元與前述容納單元為一體化後之一個 20 單元。 26200909177 X. Patent Application Range: 1. A resin encapsulation molding method for an optical element, comprising the steps of: preparing a plurality of mold combination units each having a first mold and a second mold facing the first mold; 5 One or two or more mold combination units are selected from the mold combination unit; and the mold combination unit group in which the one mold assembly unit or the two or more mold assembly units are integrated is used, and the light sealing member is filled with a resin . [2] The resin encapsulation molding method of the optical element of claim 1, further comprising the steps of: supplying the optical element and the resin separately to the foregoing after the selecting step and before the filling step 1 or more mold combination units; and 15 After the sealing step, the molded article in which the optical element is filled with the resin is taken out from the one or two or more mold assembly units. The resin encapsulation molding method of the optical element according to claim 2, wherein before the supplying step, the mold holes of the one or more mold assembly units are covered with a release film, '20 In the supply step, the resin is supplied to a space in the cavity which has been covered by the release film. 4. The resin encapsulation molding method of the optical element according to claim 1, wherein in the caking step, the sealed space of each of the cavities including the one or more mold assembly units is set to a predetermined vacuum In the state of 200909177, the optical element is filled in the sealed space by the aforementioned resin. 5. A resin sealing and molding apparatus comprising a plurality of mold combining units each having a first mold and a second mold facing the first mold, 5 and selected from one or more of the plurality of mold combining units The mold combination unit is integrated. 6. The resin encapsulation molding apparatus of the optical element of claim 5, further comprising: a supply unit that supplies the optical element and the resin to the one or more than 10 mold combination units; and the accommodation unit; The optical element which is taken out from the one or two or more mold combining units and is filled with the resin may be accommodated, and the one or two or more mold combining units, the supply unit, and the storage unit may be integrated. The resin sealing and molding apparatus of the optical element of claim 6, wherein the one or more mold combining units are disposed between the supply unit and the storage unit. 8. The resin encapsulating and forming apparatus of the optical element according to claim 6, wherein the supply unit and the storage unit are integrated into one unit. 26
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