CN105283294B - Resin molding machine and resin molding method - Google Patents
Resin molding machine and resin molding method Download PDFInfo
- Publication number
- CN105283294B CN105283294B CN201480029820.1A CN201480029820A CN105283294B CN 105283294 B CN105283294 B CN 105283294B CN 201480029820 A CN201480029820 A CN 201480029820A CN 105283294 B CN105283294 B CN 105283294B
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- resin
- mould
- die cavity
- die
- film
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- 229920005989 resin Polymers 0.000 title claims abstract description 443
- 239000011347 resin Substances 0.000 title claims abstract description 443
- 238000000465 moulding Methods 0.000 title claims description 165
- 238000000034 method Methods 0.000 title claims description 80
- 238000001179 sorption measurement Methods 0.000 claims abstract description 54
- 230000007246 mechanism Effects 0.000 claims description 82
- 230000008569 process Effects 0.000 claims description 53
- 230000002093 peripheral effect Effects 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 27
- 230000009471 action Effects 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 17
- 230000008093 supporting effect Effects 0.000 claims description 12
- 238000007667 floating Methods 0.000 claims description 9
- 238000013007 heat curing Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 description 76
- 239000000758 substrate Substances 0.000 description 45
- 238000007493 shaping process Methods 0.000 description 17
- 230000007423 decrease Effects 0.000 description 14
- 238000012545 processing Methods 0.000 description 13
- 238000007689 inspection Methods 0.000 description 12
- 238000003860 storage Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 238000012546 transfer Methods 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 230000000630 rising effect Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000006835 compression Effects 0.000 description 7
- 238000007906 compression Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 7
- 238000013515 script Methods 0.000 description 7
- 230000008602 contraction Effects 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 241000208340 Araliaceae Species 0.000 description 3
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 3
- 235000003140 Panax quinquefolius Nutrition 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000008434 ginseng Nutrition 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The present invention provides a kind of technology for the quality that can lift formed products.As solution, lower mould (32) includes：Lower mould die cavity block (34), it constitutes the bottom of die cavity recess (33)；Lower die clamp block (35), it constitutes the sidepiece of die cavity recess (33)；Film loading machine (57), it can keep conveying to be equipped with resin (R) film (F)；And adsorption section (67), it is used to adsorb the film (F) configured in the way of covering the end face of lower mould die cavity block (34) and the end face of lower die clamp block (35).Lower mould die cavity block (34) is relatively moved relative to lower die clamp block (35).Film (F) is configured and kept in the end face of lower mould die cavity block (34) and the end face of lower die clamp block (35) on the lower mould (32) of level by film loading machine (57) in the way of resin (R) is located above lower mould die cavity block (34), adsorption section (67) make film (F) follow die cavity recess (33) inner surface adsorb holding film (F), to die cavity recess (33) supply resin (R).
Description
Technical field
The present invention relates to a kind of technology for being effectively applied to resin molding machine and resin molding method.
Background technology
Such as in WLP (Wafer Level Package) it is mold formed during carry out as follows：In lower mould
Configure workpiece (such as work that multiple chip parts on substrate are electrically connected by closing line with substrate opened greatly
Part.), upper mould (turns into die cavity in clamping workpiece using die cavity recess is constituted.) molding die.But, using the molding
Mould is to supply resin on workpiece when being compressed shaping, and the resin for being placed in workpiece center flows laterally, thus, it is easy to produce
Life is the problem of the quality of the formed products caused by being involved in stomata caused by air, gate break (wire sweep) etc. is bad.
On the other hand, supplied by lower mould using the molding die for constituting die cavity recess (lower mould die cavity) to the die cavity recess
To resin, can make the chip part of the workpiece kept by upper mould, closing line be impregnated in the resin that is melted in die cavity recess so as to
Carry out resin molded.The resin molded formed products such as stomata, gate break that can reduce carried out in such lower mould die cavity
Quality is bad.It is as the molding die for constituting such lower mould die cavity, such as (special in Japanese Unexamined Patent Publication 2004-148621 publications
Sharp document 1) in have described.
A kind of such technology has been recorded in the patent document 1：Stripping film is set to compare die cavity in the outside of molding die
The shape of recess and deform, supplying resin to the briquetting (preform) (bottom) corresponding with the bottom of die cavity recess
Under state, stripping film and resin are moved into internally being configured for molding die.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2004-148621 publications
The content of the invention
Problems to be solved by the invention
Stripping film as patent document 1 is described is for example using with certain flexibility, retractility, heat resistance
Film.Such stripping film by a temperature of to a certain degree be heated, occur in the way of towards its central contraction thermal contraction,
Or in the way of as uneven fold thermal contraction situation.In addition, stripping film is for example in the shape of control die cavity recess
And can be described as having put aside the state of many strains in the case of deforming.
Therefore, stripping film for example remain as the shape of die cavity recess that sample plot deformation state be configured at it is advance
During the molding die of heating, it is impossible to which the shape of stripping film is maintained into desired shape.For example, producing pleat in the presence of in stripping film
Wrinkle or fold are overlapping and produce the situation in gap.If producing fold in stripping film like this or generation being overlapping, it can produce
It is raw to be transferred in appearance or the problem of resin is leaked from overlapping position of formed products.
It is an object of the invention to provide a kind of technology for the quality that can lift formed products.According to the note of this specification
Stating can be clearly described in the present invention and other purpose and new feature with accompanying drawing.
The solution used to solve the problem
In invention disclosed in this application, representational summary is simplyd illustrate, content is as follows.
The resin molding machine of the technical scheme of the present invention is sharp by upper mould and the lower mould mold closing for being formed with die cavity recess
Workpiece is carried out with the resin for being filled in the die cavity recess resin molded, the resin molding machine is characterised by, it is described under
Mould includes：Lower mould die cavity block, it constitutes the bottom of the die cavity recess；Lower die clamp block, it constitutes the side of the die cavity recess
Portion；Loading machine, it can keep conveying the film for being equipped with the resin；And adsorption section, its be used for adsorb with cover it is described under
The mode of the end face of the end face of mould die cavity block and the lower die clamp block, which is configured, (also referred to as to be set.) the film, the lower mould
Die cavity block is configured to relatively move relative to the lower die clamp block, and the loading machine is so that the resin is positioned at described
The film is configured at the end face of the lower mould die cavity block and the end of the lower die clamp block by the mode above lower mould die cavity block
Face keeps level (also referred to as concordant, identical height.) the lower mould, it is recessed that the adsorption section makes the film follow the die cavity
The holding film is adsorbed the inner surface in portion, and the resin is supplied to the die cavity recess.
The resin molding machine of another of the invention technical scheme is by the first mould and the second mould for being formed with die cavity recess
Has mold closing, resin molded to workpiece progress using the resin for being filled in the die cavity recess, the feature of the resin molding machine exists
In second mould includes：Die cavity block, it constitutes the bottom of the die cavity recess；Fixture block, it constitutes the die cavity recess
Sidepiece；Movable part, it is used to make the die cavity block relatively move relative to the fixture block；And adsorption section, it is used to adsorb
The film configured in the way of covering the end face of the die cavity block and the end face of the fixture block, the resin molding machine includes loading
Machine, the loading machine conveys the film in the state of the film is flat, and makes the end face and the folder of the die cavity block
The end face of block is located at identical height (also referred to as level, concordant.) while, configure while the film is remain to flat state
In the end face and the end face of the fixture block of the die cavity block.
The resin molding method of the technical scheme of the present invention is using resin molding machine is by upper mould and is formed with die cavity
The lower mould mold closing of recess, resin molded, the resin molding method is carried out using the resin for being filled in the die cavity recess to workpiece
It is characterised by, the lower mould includes：Lower mould die cavity block, it constitutes the bottom of the die cavity recess；Lower die clamp block, it is constituted
The sidepiece of the die cavity recess；Loading machine, it can keep conveying the film for being equipped with the resin；And adsorption section, it is used for
Adsorb the film configured in the way of covering the end face of the lower mould die cavity block and the end face of the lower die clamp block, the resin
Method of moulding includes following process：(a) using the loading machine so that the resin is located above the lower mould die cavity block
Mode the film is configured at described in the end face of the lower mould die cavity block and the end face holding level of the lower die clamp block
Lower mould；(b) while the film is attracted using the adsorption section, the lower mould die cavity block is made relative to the lower die clamp block
Relatively move and form the die cavity recess, so that the film adsorbs holding institute with following the inner surface of the die cavity recess
Film is stated, and the resin is intactly supplied to the die cavity recess.
Using the present invention, deform to the shape that after with flat state configuration film film can be made to follow die cavity recess,
It can for example prevent film from producing fold or prevent film overlapping.Thus, it is possible to prevent formed products formation bad order or anti-
Only resin is leaked from overlapping position, so as to lift the quality of formed products.In addition, by constituting die cavity recess, example in lower mould
Chip part (such as semiconductor chip, chip capacitor), closing line is such as set to be impregnated in the resin that die cavity recess is melted, from
And the quality that can reduce the formed products as caused by stomata, gate break etc. is bad.
In addition, the resin molding machine of the technical scheme of the present invention is preferably, the loading machine includes hand, should
Hand has：Retaining surface, it is used to keep the film；Recess, its turn into be equipped at the avoidance of the resin of the film and
It is recessed from the retaining surface；And air flow circuit, its retaining surface led to around the recess and for attracting the film.
Thereby, it is possible to the resin that keeps being equipped on film state (shape, amount) resin is supplied to die cavity recess.This
Outside, absorption holding can be carried out in the way of film is not bent because of the weight of the resin in the recess being mounted on film.
In addition, the resin molding machine of the technical scheme of the present invention is preferably, the loading machine, which possesses, to be beaten
The gate portion of the roller shutter shape of the retaining surface is closed in open and close, is supported under the closed mode in the gate portion using the gate portion
The film is conveyed, the film is configured to the lower mould under the open mode in the gate portion.
Thereby, it is possible to utilize gate in the way of film is not bent because of the weight of the resin in the recess being mounted on film
Portion flatly keeps film.In addition, can batch gate portion when film is configured at lower mould and seek to save space.
In addition, the resin molding machine of the technical scheme of the present invention is preferably, the loading machine possesses heating part
And cooling end.
Thus, the heating or cooling that auxiliary is carried out to film, the resin being mounted on the film become easy.
In addition, the resin molding machine of a technical scheme of the present invention is preferably, the lower mould die cavity block it is upper
Portion is set in the way of it can separate, and the top of the lower die clamp block is set in the way of it can separate, the lower mould die cavity gear
The top of block is connected with the top of the lower die clamp block using connecting elements, and the loading machine conveying is kept off in the lower mould die cavity
To cover the lower mould die cavity block in the state of the end face level on the top of the end face on the top of block and the lower die clamp block
The film that the mode of the end face on the top of the end face on top and the lower die clamp block is configured.
Thereby, it is possible to which film and the resin being mounted on the film are configured on molding die with stable state.
In addition, the resin molding machine of the technical scheme of the present invention is preferably, the resin molding machine possesses ring
The upper board of shape and the lower panel of ring-type, the lower panel are formed with that face in peripheral part end from the upper board side is recessed and edge
The stage portion of circumferentially extending, clips the film between the upper board and the lower panel, so that the internal diameter of the upper board
Portion's mode corresponding with the stage portion of the lower panel makes the upper board be embedded in the lower panel, so as to constitute diaphragm plate
Portion, is formed with peripheral part end from end face is recessed and stage portion circumferentially in the lower die clamp block, so that the bottom
The inside diameter of the plate mode corresponding with the stage portion of the lower die clamp block makes the diaphragm plate portion be embedded in the lower die clamp block.
Thereby, it is possible to flatly keep film using simple structure, the film can be configured in the state of holding is flat
In lower mould.
In addition, the resin molding machine of a technical scheme of the present invention is preferably, the lower mould die cavity block it is upper
Portion is set in the way of it can separate, with the end face and the lower mould on the top of the lower mould die cavity block in the state of die sinking
The top of lower mould die cavity block described in the mode floating support of the end face level of fixture block.
Thus, it need not for example utilize pressure die clamp block under delivery section and make the end face and lower die clamp block of lower mould die cavity block
End face level, can simplify the movement structure of delivery section.In addition, when lower mould is configured with film, due to lower mould die cavity block
Top is the state floated, therefore, it is possible to prevent the thermal contraction of film, prevents from being equipped on the resin overheat of film or carries out heating tune
It is whole to become easy.
In addition, the resin molding machine of a technical scheme of the present invention is preferably, the lower die clamp block be provided with
The mode that can be protruded from the end face of the lower die clamp block by multiple pins of floating support,
The multiple pin protrudes from the end face of the lower die clamp block and supports the workpiece, is clamping the state of the workpiece
Under be housed in the inside of the lower die clamp block.
Thereby, it is possible to prevent the workpiece kept before clamping by upper mould from falling.
The effect of invention
The effect obtained using in invention disclosed in this application, representational form is exactly to carry in brief
Rise the quality of formed products.
Brief description of the drawings
Fig. 1 is the overall structure figure for the resin molding machine that an embodiment of the invention is represented with plane figure.
Fig. 2 is the figure for illustrating the action for the resin supply unit for supplying corpuscular resin.
Fig. 3 be the present invention the 1st embodiment resin molded process in pressing part schematical sectional view.
Fig. 4 is the schematical sectional view of the pressing part in then Fig. 3 resin molded process.
Fig. 5 is the schematical sectional view of the pressing part in then Fig. 4 resin molded process.
Fig. 6 is the schematical sectional view of the pressing part in then Fig. 5 resin molded process.
Fig. 7 is the schematical sectional view of the pressing part in then Fig. 6 resin molded process.
Fig. 8 is the schematical sectional view of the pressing part in then Fig. 7 resin molded process.
Fig. 9 is the schematical sectional view of the pressing part in then Fig. 8 resin molded process.
The schematical sectional view of pressing part in the resin molded process of the 2nd embodiment of Figure 10 present invention.
Figure 11 is the schematical sectional view of the pressing part in then Figure 10 resin molded process.
Figure 12 is the schematical sectional view of the pressing part in then Figure 11 resin molded process.
Figure 13 is the schematical sectional view of the pressing part in then Figure 12 resin molded process.
Figure 14 is the schematical sectional view of the pressing part in then Figure 13 resin molded process.
Figure 15 be the present invention the 3rd embodiment resin molded process in pressing part schematical sectional view.
Figure 16 is the schematical sectional view of the pressing part in then Figure 15 resin molded process.
Figure 17 is the schematical sectional view of the pressing part in then Figure 16 resin molded process.
Figure 18 is the schematical sectional view of the pressing part in then Figure 17 resin molded process.
Figure 19 is the schematical sectional view of the pressing part in then Figure 18 resin molded process.
Figure 20 be the present invention the 4th embodiment resin molded process in pressing part schematical sectional view.
Figure 21 is the view sub-anatomy in the diaphragm plate portion shown in Figure 20.
Figure 22 is the schematical sectional view of the pressing part in then Figure 20 resin molded process.
Figure 23 is the schematical sectional view of the pressing part in then Figure 22 resin molded process.
Figure 24 is the schematical sectional view of the pressing part in then Figure 23 resin molded process.
Figure 25 be the present invention the 5th embodiment resin molded process in pressing part schematical sectional view.
Figure 26 is the schematical sectional view of the pressing part in then Figure 25 resin molded process.
Figure 27 be the present invention the 6th embodiment resin molded process in pressing part schematical sectional view.
Figure 28 be the present invention another configuration example resin molded process in pressing part schematical sectional view.
Figure 29 is the schematical sectional view of the pressing part in then Figure 28 resin molded process.
Figure 30 be the present invention another configuration example resin molded process in pressing part schematical sectional view.
Figure 31 is the schematical sectional view of the pressing part in then Figure 30 resin molded process.
Figure 32 is the schematical sectional view of the pressing part in then Figure 31 resin molded process.
Figure 33 be the present invention the 7th embodiment resin molded process in pressing part schematical sectional view.
Figure 34 is the schematical sectional view of the pressing part in then Figure 33 resin molded process.
Figure 35 is the schematical sectional view of the pressing part in then Figure 34 resin molded process.
Figure 36 is the schematical sectional view of the pressing part in then Figure 35 resin molded process.
Figure 37 is the main view explanation figure of the die opening state of the resin molding machine of the 8th embodiment of the present invention.
Figure 38 is the top view of Figure 37 movable platen.
Figure 39 A and Figure 39 B are the section view explanation figures of the molding die of then Figure 37 mold closing action midway.
Figure 40 A~Figure 40 C are the section view explanation figures for an example and mold closing action for representing molding die.
Figure 41 A~Figure 41 C are the section view explanation figures for another example and mold closing action for representing molding die.
Embodiment
In following embodiments of the present invention, some etc. is divided into the case of necessary and is illustrated, but it is former
Then these upper parts are not without relation each other, and relation is some or all variations that one is another one, in detail
Thin content etc..Therefore, identical reference is marked to the component with identical function in all figures of the drawings, there is omission, its is heavy
The situation of multiple explanation.In addition, for the same effect by same structure acquisition, existing and omitting its explanation repeated
Situation.
In addition, for the number (including number, numerical value, amount, scope etc.) of inscape, except the feelings especially expressed
Condition, it is expressly defined as in principle outside certain number of situation etc., is not limited to the specific number, both can has been special
More than fixed number or below specific number.In addition, when referring to the shape of inscape etc., except especially bright
Situation about showing and be specifically identified in principle be not outside such situation etc., comprising substantially approximate with its shape etc. or
Similar shape etc..
(the 1st embodiment)
First, reference picture 1 illustrates the resin molding machine 100 of present embodiment.Fig. 1 is to represent resin mold with plane figure
The overall structure figure of device 100 processed.Resin molded structure is carried out from needless to say, the resin molding machine 100 is also contained in inspection
Looked into it is resin molded after workpiece (formed products) after the structure that makes certified products be heating and curing (solidify afterwards) and stored.
Resin molding machine 100 is supplied as the processing unit for carrying out various treatment process, including Workpiece supply portion 110, resin
To portion 120, pressing part 130, Work inspection device portion cooling end 140, solidified portion 150 (curing oven), workpiece incorporating section 160.In addition,
Resin molding machine 100 includes the control unit 170 for being used to control each processing step.Each processing unit is at least constituted by one,
The situation that resin supply unit 120, pressing part 130 are made up of 2 (multiple) respectively is represented in the present embodiment.By so by
Multiple compositions more spend the processing unit of processing time compared with other processing units, can lift the entirety of resin molding machine 100
Operation ratio.
In addition, resin molding machine 100 includes robot mechanism portion 180, the robot mechanism portion 180, which possesses, to be used for place
The transfer robot of conveying workpieces, resin between reason portion.Transfer robot is, for example, being capable of throughout rotation and straight between reason portion
Line moves, has the robot of hand in the front end of multi-joint.In resin molding machine 100, robot mechanism portion 180 is surrounded
(transfer robot) configure each processing unit.Therefore, it is possible to shorten workpiece, resin throughout between reason portion displacement (
The movement of workpiece, resin is represented by dashed line in Fig. 1.), being capable of efficiently conveying workpieces.Alternatively, it is also possible to substitute machine robot mechanism
Portion 180, and the conveying mechanism in addition to transfer robot constituted using the straight-line motion mechanism as cylinder, linear motor
To conveying workpieces, resin between processing unit.
Workpiece supply portion 110 (reference picture 1) is the processing for supplying workpiece to the resin molded pressing part 130 of progress
Portion.Workpiece supply portion 110 possesses the job library (not shown) that can store the workpiece before multiple shapings (be formed product).From the work
The workpiece that the supply of part storehouse comes temporarily is positioned in robot mechanism portion 180 by the transfer robot in robot mechanism portion 180 to be possessed
Workpiece mounting portion (not shown), the loading machine 190 (delivery section) that the portion 130 that is stamped possesses is transported to pressing part 130.
Resin supply unit 120 (reference picture 1) is the processing for supplying resin to the resin molded pressing part 130 of progress
Portion.Here, reference picture 2 illustrates resin supply unit 120.Fig. 2 is to be used to illustrate supplying corpuscular resin R (hereinafter referred to as particle
Resin.) resin supply unit 120 action figure.
As shown in Fig. 2 resin supply unit 120 includes that particulate resin R resin storage unit 121, multiple small-sized can be stored
Resin storage unit 122, multiple grooves 123 for supplying particulate resin R to resin supply area (supply object).Paired tree
Fat storage unit 122 is connected with groove 123, is configured to (not shown) mobile using XY drive mechanisms.Resin storage unit 121 is consolidated
Surely set, can mass storage particulate resin R, with being divided into aliquot to the resin storage unit more small-sized than the resin storage unit 121
122 supply particulate resin R.Moreover, sending out particle tree from resin storage unit 122 to groove 123 using electromagnetic feeder (not shown)
Fat R, resin supply area is cast with predetermined shape (such as flat condition).
What resin storage unit 122 and groove 123 were constituted multipair (is in Fig. 2 at least provided with a pair, but by setting
Three pairs), the time that particulate resin R is cast to resin supply area can be shortened.Three pairs of resin storage units 122 and groove 123 are utilized
Coupling member 124 is linked up.Using the link, even if can also not utilize one for each to all setting electromagnetic feeder
Electromagnetic feeder supplies the resin of the amount of same degree to resin supply area simultaneously in the way of as intended shape.By this
Sample sets multiple resin supply structures, can be rapidly supplied the resin of correct component.Equally, can also possess multiple supplies
Liquid resinous distributor.In this case, the liquid resin of correct component can be also rapidly supplied.
The supply object of resin supply unit 120 is stripping film F.Stripping film F is for example with fep film, PET film, fluorine-containing glass
Fiber cloth, polyvinylidene chloride, PTFE, ETFE etc. have certain flexibility, retractility, the film of heat resistance.Moreover, as tree
The stripping film F of fat supply object holds component 126 by one on supporting station 125 from the state of web-like and extracted out, as predetermined
The position of width cut-off component 127 (such as cutter) in the state of the holding of holding component 126,126 is cut to once-forming
The film of amount is wide, the state as predetermined shape (such as strip).
It is each one side of groove 123 first along first row supply area to stripping film F (resin supply area) supply resins
The mobile supply particulate resin R on one side of bearing of trend (X-direction), complete to the amount of a row rectangle supply area supply resin it
It is mobile towards the second column direction (Y-direction) afterwards.Then, bearing of trend (X side of each one side of groove 123 along secondary series supply area
To) mobile while supply particulate resin R, completes the rear mobile to the 3rd column direction (Y-direction) of the resin supply of an amount arranged.
Then, bearing of trend (X-direction) of each one side of groove 123 along the 3rd row supply area is mobile while supply particulate resin R, is completed
The resin of the amount of one row supplies and completes to supply resin to whole resin supply area.
, can be according to predetermined region (area), predetermined thickness (height) with pre- using such resin supply unit 120
The fixed time is to supply (carrying) particulate resin R on stripping film F.Moreover, the particulate resin R being supplied on stripping film F is with peeling off
Film F is together transported to after loading machine 190 by robot mechanism portion 180, is loaded the inside that machine 190 is moved to pressing part 130.
Therefore, stripping film F is also the carrier film for conveying resin R.
Pressing part 130 (reference picture 1) is the place for being used to carry out workpiece resin molded shaping molding resin portion (forming section)
Reason portion.Explained after the treatment process.Workpiece after shaping is loaded machine 190 and is temporarily positioned in robot mechanism portion
In the 180 workpiece mounting portions (not shown) possessed, then it is handed off to the transfer robot in robot mechanism portion 180.
Work inspection device portion cooling end 140 (reference picture 1) is the state for checking the workpiece (formed products) after shaping
Processing unit, and be the processing unit for heated workpiece to be cooled down.Cooling end can also be relative to Work inspection device portion in addition
Set, but by configuring the white space in Work inspection device portion, compact conformation can be made.
The inspection project in Work inspection device portion is such as the thickness measure, the visual examination of workpiece that have workpiece.These check knot
Fruit is sent to control unit 170 and handled.Formed products are for example shot in the lump or dividedly, are to check by visual inspection
It is no to be not filled by waiting cob webbing.Shaping exist it is fine or not and bad in the case of, regard bad species, shooting image as fortune
Row information is stored in the storage part of control unit 170.When detecting abnormal (beyond being not filled by for anticipation), by making device whole
Body stopping action being safeguarded, can prevent from continuously producing defective work.When having checked, using transfer robot from workpiece
The work delivery position of inspection portion cooling end 140 is to the conveying workpieces of solidified portion 150.
Solidified portion 150 (reference picture 1) is for the processing unit of (solidify afterwards) that the moulded resin portion of workpiece is heating and curing.Gu
Change portion 150 is closed using shutter door (not shown) relative to outside, is heated to predetermined temperature inside it.In conveying machine
When the workpiece that people is kept is close to curing oven 150, shutter door opening, is configured in internal in workpiece and transfer robot is kept out of the way
When, door termination is opened and closed, is heating and curing the scheduled time.Afterwards, the workpiece come is taken out of in workpiece from solidified portion 150 by transfer robot
Workpiece incorporating section 160 is transported to after being cooled down in inspection portion cooling end 140.
Workpiece incorporating section 160 (reference picture 1) is the place for storing workpiece as the final process of resin molding machine 100
Reason portion.Workpiece incorporating section 160 possesses the job library same with Workpiece supply portion 110, utilizes the conveyer in robot mechanism portion 180
Workpiece (formed products) is accommodated in the job library by device people.
Then, reference picture 3 illustrates the pressing part 130 of the resin molding machine 100 of present embodiment.Fig. 3 is this embodiment party
The schematical sectional view of the pressing part 130 of formula.The workpiece W of the state for the product of being formed is show also in the Fig. 3.Workpiece W leads to
Cross chip engagement chip part 11 (such as semiconductor chip) is arranged on substrate 10 (such as circuit board), utilize closing line
(not shown) forms substrate 10 and the electrical connection of chip part 11.
Pressing part 130 possesses molding die 30 (paired upper mould 31 and lower mould 32).In the present embodiment, by lower mould 32
Be set to moveable die, upper mould 31 be set to fixing mould illustrated but it is also possible to be by upper mould 31 be set to moveable die, will under
Mould 32 is set to fixing mould or upper mould 31 and lower mould 32 is set to the situation of moveable die.
In molding die 30, workpiece W is maintained in upper mould 31, in lower mould 32 provided with die cavity recess 33 (in clamping workpiece
When constitute die cavity C.).Molding die 30 includes the lower mould die cavity block 34 for constituting the bottom of die cavity recess 33 and surrounds the lower mould
Die cavity block 34 and the lower die clamp block 35 for constituting the sidepiece (wall portion) of die cavity recess 33.In molding die 30, pass through lower mould mould
Chamber block 34 is relatively moved relative to lower die clamp block 35, and depth (height) change of die cavity recess 33, die cavity C volume becomes
Change.
Specifically describe the structure of mould 31.Upper mould 31 includes upper die base 36, upper mould inserts 37, upper die clamp block 40.
The lower surface of upper die base 36 is fixed and is assembled with mould inserts 37, and mould inserts 37 possesses heater (not shown) on this, is configured to
Can heated partses W, moreover, upper die clamp block 40 is assembled in the way of it can move along the vertical direction.Upper die clamp block 40 is by one piece
Tabular mould is constituted, and die clamp block 40 is formed with through hole 41 on this.Insertion of through hole 41 of die clamp block 40 is configured with this
Upper mould inserts 37.That is, upper mould inserts 37 is surrounded by upper die clamp block 40.
Upper die clamp block 40 is by the elastic component 42 (such as spring) of composition movable part with what can be moved along the vertical direction
Mode is assembled, hanger bearing (floating support) is in upper die base 36.The upper mould inserts 37 fixed accordingly, with respect to upper die base 36
Relation between the upper die clamp block 40 movable relative to upper die base 36 is that upper mould inserts 37 utilizes the flexible of elastic component 42
And relatively moved relative to upper die clamp block 40.
The state that elastic component 42 as situation in die sinking is not exerted a force (is not affected by the shape from externalities
State) under, the lower surface (end face of downside) of upper mould inserts 37 is in higher than the lower surface (end face of downside) of upper die clamp block 40
Position (position of top).In other words, the lower surface of upper die clamp block 40 is in the lower surface (end of downside than upper mould inserts 37
Face) low position (position of lower section).Illustrate afterwards, by with such height poorly in mold closing by upper die clamp block
40 and lower die clamp block 35 constitute confined space (chamber), can depressurize while carrying out resin molded.In addition, by by upper mould
Inserts 37 is configured to relatively move relative to upper die clamp block 40, and the thickness of slab regardless of workpiece W can be uniform
Height and position clamping workpiece W.
In addition, upper mould 31 possesses the inner peripheral surface of the through hole 41 of the outer peripheral face for being arranged on mould inserts 37 and upper die clamp block 40
Between containment member 43 (such as O-ring seals).In order that being depressurized in the die cavity C formed in clamping workpiece, the sealing structure
Part 43 is so that the gap between the inner peripheral surface of the through hole 41 of the outer peripheral face of upper mould inserts 37 and upper die clamp block 40 turns into air stream
Road 41A mode is sealed (reference picture 7).
The inner peripheral surface being formed with upper die clamp block 40 in the way of being connected with air flow circuit 41A from through hole 41 leads to mould
Outside air flow circuit 44.The air flow circuit 44 is connected with the relief portion 45 (such as pump) of mold exterior.Illustrate, pass through afterwards
Air flow circuit 41A and air flow circuit 44 by gap, die cavity C is depressurized using relief portion 45.
In addition, being provided with the work holding portion thereof (reference picture 27) for being used for keeping workpiece W in upper mould 31.The work holding portion thereof is provided with
The air flow circuit 90 connected with the end face of upper mould inserts 37, using the relief portion 91 communicated with the air flow circuit 90 so that workpiece W
Substrate 10 the back side and the mode of the lower surface pairing of upper mould inserts 37 adsorb, keep workpiece W.Or, work holding portion thereof
Can keep workpiece W situation using the claw of the end face for being arranged on mould inserts 37, electrostatic chuck.
Specifically describe the structure of lower mould 32.Carried out as the lower mould 32 of moveable die using known mould clamping device
Die sinking, mold closing, the mould clamping device is by the drive transmission mechanism (connecting rod such as toggle link driven using driving source (electro-motor)
Mechanism or leading screw etc.) lift lower mould movable platen.In this case, the lifting action of lower mould 32 can arbitrarily be set
Translational speed, plus-pressure etc..
Lower mould 32 includes lower die base 46, lower mould die cavity block 34, lower die clamp block 35.Consolidate in the upper surface of lower die base 46
Surely lower mould die cavity block 34 is assembled with, and is assembled with the way of it can move along the vertical direction lower die clamp block 35.Lower die clamp
Block 35 is made up of one piece of tabular mould, and through hole 47 is formed with the lower die clamp block 35.In the through hole 47 of the lower die clamp block 35
Insertion is configured with lower mould die cavity block 34.That is, lower mould die cavity block 34 is surrounded by lower die clamp block 35.In addition, lower mould die cavity gear
Block 34 is configured to heated resin R by possessing heater (not shown) as aftermentioned.
Lower die clamp block 35 is by the elastic component 50 (such as spring) of composition movable part with what can be moved along the vertical direction
Mode is assembled, floating support is in lower die base 46.The lower mould die cavity block 34 fixed accordingly, with respect to lower die base 46 and relative
Relation between the movable lower die clamp block 35 of lower die base 46 is that lower mould die cavity block 34 utilizes the flexible phase of elastic component 50
Relatively moved for lower die clamp block 35.
The state that elastic component 50 as situation in die sinking is not exerted a force (is not affected by the shape from externalities
State) under, the upper surface (end face of upside) of lower mould die cavity block 34 is in the upper surface (end face of upside) than lower die clamp block 35
Low position (position of lower section).Illustrate afterwards, by with such height poorly by lower mould die cavity block 34 with energy
Enough modes relatively moved relative to lower die clamp block 35 are set, and can change the depth (die cavity C volume) of die cavity recess 33.
In addition, lower mould 32 possesses the interior of the through hole 47 of the outer peripheral face for being arranged on lower mould die cavity block 34 and lower die clamp block 35
Containment member 51 (such as O-ring seals) between side face., should for the stripping film F of the die joint that attracts to be configured at lower mould 32
Containment member 51 is so that gap between the inner peripheral surface of the through hole 47 of the outer peripheral face of lower mould die cavity block 34 and lower die clamp block 35
Mode as air flow circuit 47A is sealed (reference picture 5).Due to the upper surface of lower mould die cavity block 34 and passing through for lower die clamp block 35
The inner peripheral surface of through hole 47 constitutes die cavity recess 33, therefore, the angle between the bottom and sidepiece of air flow circuit 47A and die cavity recess 33
Portion is connected.
The inner peripheral surface being formed with lower die clamp block 35 in the way of being connected with air flow circuit 47A from through hole 47 leads to mould
Air flow circuit 52 outside tool.The air flow circuit 52 is connected with the adsorption section 53 (such as pump) of mold exterior.Illustrate afterwards,
Via the air flow circuit 47A and air flow circuit 52 in gap, the shape of die cavity recess 33 is followed using adsorption section 53 holding is adsorbed
Stripping film F central portion.
In addition, being formed with the air flow circuit 54 for leading to mold exterior from the upper surface of lower die clamp block 35 in lower die clamp block 35.
The air flow circuit 54 is connected with the adsorption section 55 (such as pump) of mold exterior.Illustrate, via air flow circuit 54, utilize afterwards
Stripping film F peripheral part absorption is maintained at the clamping face of lower die clamp block 35 by adsorption section 55.
In addition, be adjacent to each pressing part 130 provided with loading machine 190 (reference picture 1), the loading machine 190 has can be to
The upper conveying workpieces W of mould 31 work loader 56 and the film loading machine 57 for being capable of the resin R and stripping film F of the conveying of mould 32 downwards.
In loading machine 190, work loader 56 and film loading machine 57 are configured to from robot mechanism portion 180 into pressing part 130
Portion handing-over workpiece W, stripping film F, work loader 56 and film loading machine 57 are using drive mechanism (not shown) respectively in not homology
Driven in system, can be taken out of relative to pressing part 130, move into workpiece W, stripping film F.In addition, film loading machine 57 both can be
Receive resin R and stripping film F structure from robot mechanism portion 180 in loading machine 190, robot mechanism portion can also be utilized
Resin R and stripping film F are transported to the ground of resin supply unit 120 supply resin R and stripping film F by 180.
Work loader 56 includes support plate 60, support 61, location division 62.The size example of the plane domain of support plate 60
Such as it is configured the plane domain of the through hole 41 more than upper die clamp block 40.In the upper surface of the support plate 60, in predetermined height
Provided with vertical view support 61 annular in shape.In addition, in the upper surface of support plate 60 and position than support 61 in the outer part, pre-
Fixed height (is for example sold) provided with multiple location divisions 62.
Set, try one's best and substrate 10 on the inside of the outward flange of substrate 10 of the support 61 with its plane domain along workpiece W
The mode that plane domain turns into same degree is set.It is mounted in addition, support 61 is higher than with its height on workpiece W substrate 10
The mode of height (such as height of the thickness of chip part 11, closing line) of component set.Thus, workpiece W is with support plate
60 do not contact the periphery portion supported portion of the mode in substrate 10 of (interference) with chip part 11 and closing line (not shown)
61 supportings.
Location division 62 is contacted by the inner peripheral surface with the through hole 41 of upper die clamp block 40, is configured to work loader
56 position relative to upper mould inserts 37, as an example, and the planar configuration of the location division 62 is separately positioned on die clamp block 40
The rectangular through hole 41 of vertical view corner.In addition, location division 62 is with its height before workpiece W is handed off into mould inserts 37
The mode contacted with the inner peripheral surface of through hole 41 is spent to set.Thus, workpiece W with configure upper mould inserts 37 lower surface it is predetermined
The mode in region is positioned using location division 62.
Using the work loader 56 of such structure, make the back side and the following table of upper mould inserts 37 of workpiece W substrate 10
Face is contacted, and the upward moulds 31 of workpiece W are joined.Now, using support 61 by substrate 10 press upper mould inserts 37 lower surface, profit
The substrate 10 (workpiece W) is kept with the maintaining part of mould 31.
Film loading machine 57 possesses the hand 63 for adsorbing the stripping film F for keeping being equipped with resin R.Hand 63, which has, to be used for
The recessed recess in the retaining surface 64 (adsorption plane) for keeping stripping film F, the air flow circuit 65 for leading to retaining surface 64, self-sustaining face 64
66。
The size (size of the plane domain of hand 63) of retaining surface 64 turn into can along such as strip stripping film F
Plane domain periphery absorption size.Recess 66 is arranged (in n, m with being for example configured to n rows m in the region of retaining surface 64
At least any one is more than 2) matrix mode be formed with hand 63 it is multiple.Air flow circuit 65 with not with the phase of recess 66
Intrusively lead to the outside of hand 63 from retaining surface 64 (such as the retaining surface 64 between the peripheral part of retaining surface 64, recess 66)
Mode is formed at hand 63.The air flow circuit 65 for leading to retaining surface 64 is arranged on around recess 66 (between each recess 66).This
Outside, air flow circuit 65 is connected with the adsorption section 67 (such as pump) of the outside of hand 63.Thus, taken by adsorbing with surrounding resin R
Resin R stripping film F is loaded with, all outside as needed can apply stretching while keeping stripping film F, utilize resin R
Weight, holding stripping film F can be flatly adsorbed in the non-deflecting modes of stripping film F.In addition, stripping film mentioned here
State flat F refers to that stripping film F is not bent or not crooked, the flat conveying to resin R, setting for molding die 30
Surely the state for the degree having no problem, it is complete plane to be not necessarily required to.
Using the film loading machine 57 of such structure, ensuring to avoid the resin R's for being equipped on stripping film F in recess 66
Meanwhile, attract stripping film F from the air flow circuit 65 around recess 66.Thereby, it is possible to be flatly held in stripping film F
Resin R and stripping film F are handed off to lower mould 32 under the state (state not deformed) for holding face 64.Further, since can utilize
Recess 66 ensures to avoid resin R, therefore, it is possible to the state (shape, amount) for the resin R for keeping being equipped on stripping film F.In addition,
It is not that to be divided into multiple regions in stripping film F entire surface (corresponding with multiple recesses 66 in present embodiment.)
Carry resin R.In addition, according to stripping film F intensity, resin R weight, only can also be attracted in stripping film F periphery
Keep.
Then, 3~Fig. 9 of reference picture illustrates the resin molded side of the progress of resin molding machine 100 using present embodiment
Method (method of operating of resin molding machine 100).Fig. 3~Fig. 9 is the pressing part 130 in the resin molded process of present embodiment
Schematical sectional view.
The resin molding machine 100 of present embodiment possesses stripping film F of the configuration in the die joint of lower mould 32.By using
Stripping film F, can prevent clearance leakage of the resin between lower mould die cavity block 34 and lower die clamp block 35.Furthermore it is possible to prevent
Resin between lower mould die cavity block 34 and lower die clamp block 35 blocks and ensures lower mould die cavity block 34 relative to lower die clamp block 35
Relative movement.In addition, according to stripping film F intensity, resin R weight, only can also be attracted in stripping film F periphery
Keep.
As shown in figure 3, in the state of molding die 30 has been molded, work is moved into from mold exterior using work loader 56
Part W.
In addition, in the state of the die sinking of molding die 30, resin R and stripping film F are moved into using film loading machine 57.Herein it
Before, (supply) resin R is carried on the stripping film F of web-like, stripping film F is cut to predetermined shape (such as strip) (ginseng
According to Fig. 2).Stripping film F adsorbed portions 67 attract and are adsorbed on retaining surface 64, are moved in a flattened condition.In addition, with
Arrow represents the attraction action (reference picture 3 etc.) of the grade of adsorption section 67.
Then, as shown in figure 4, rising work loader 56, workpiece W is handed off to upper mould 31.Specifically, utilizing
The rising of work loader 56 makes location division 62 be connected to after the inner peripheral surface of through hole 41 of die clamp block 40, makes substrate 10
The back side is connected to the lower surface of mould inserts 37.Then, substrate 10 (workpiece W) is maintained at using work holding portion thereof (not shown)
The lower surface of upper mould inserts 37.In such manner, it is possible to which workpiece W is joined from the upward mould 31 of work loader 56.
In addition, as shown in figure 4, declines film loading machine 57, the stripping film F for being equipped with resin R being handed off into lower mould 32, opened
Beginning melts resin R.Specifically, first, retaining surface 64 is made to be connected to across stripping film F in the decline using film loading machine 57
After the upper surface of lower die clamp block 35, elasticity of compression component 50 (makes movable part movable).That is, using being fallen under film loading machine 57
Depress die clamp block 35.Then, decline film loading machine 57, until lower mould die cavity block 34 upper surface (end face of upside) and under
Untill the upper surface (end face of upside) of die clamp block 35 turns into horizontal state.In addition, can also substitute makes film loading machine herein
57 actions declined, and utilize the action for making lower mould 32 increase that stripping film F is handed off into lower mould 32.
Now, the resin R on stripping film F by heating in lower mould die cavity block 34 by starting melting.In addition, film is loaded
Machine 57 keeps flat stripping film F in retaining surface 64.That is, using film loading machine 57 by flat stripping film F so that resin R
Mode in the lower top of mould die cavity block 34 is configured at the upper surface (end face of upside) of lower mould die cavity block 34 and lower die clamp block
35 upper surface (end face of upside) keeps the lower mould 32 of level.In addition, stripping film F is flat when configuring (supply) in lower mould 32
It is smooth.In this case, as shown in figure 4, being crushed on mould being set to the retaining surface 64 of film loading machine 57 across stripping film F
On chamber recess 33 in the case of such shape or size, only carry out being depressed into the end that film loading machine 57 is connected to die cavity block 34
Action untill face, it becomes possible to supply stripping film F to the lower mould 32 of horizontality, fold etc. can not be produced and simply supplied
Give.
Then, in the state of the upper surface level of the upper surface of lower mould die cavity block 34 and lower die clamp block 35, suction is utilized
The attached absorption of portion 53,55, holding are configured in the way of covering the upper surface of lower mould die cavity block 34 and the upper surface of lower die clamp block 35
Flat condition stripping film F.Thereby, it is possible to which resin R and stripping film F is handed off into lower mould 32 from film loading machine 57.In addition, inhaling
Attached portion 53,55 both can be different system or same system.
Then, after workpiece W is maintained as aftermentioned, as shown in figure 5, declining work loader 56.Thus, work
Part loading machine 56 leaves workpiece W.Then, workpiece W is only kept by upper mould 31.
In addition, as shown in figure 5, attracting flat stripping film F from air flow circuit 47A, 52,54 using adsorption section 53,55
While, film loading machine 57 is risen and elastic component 50 is extended and (is made movable part movable).Then, the elastic component 50 is utilized
Lower mould die cavity block 34 is relatively moved relative to lower die clamp block 35, form die cavity recess 33.Now, due to utilizing adsorption section
55 adsorption stripping film F peripheral part, utilizes the adsorption stripping film F of adsorption section 53 portion corresponding with the corner of die cavity recess 33
Position, therefore, stripping film F is deformed with following the inner surface of die cavity recess 33.Thus, stripping film F follows the interior table of die cavity recess 33
Face it is adsorbed keeping.
In addition, adsorb holding stripping film F with following the inner surface of die cavity recess 33, and resin R is intactly supplied
It is given to die cavity recess 33.Resin R is configured in the lower top of mould die cavity block 34 across stripping film F using film loading machine 57, therefore,
Even if lower mould die cavity block 34 relatively moves relative to lower die clamp block 35 and forms die cavity recess 33, resin R can also be kept
It is fed into die cavity recess 33 to the state of script.Thus, it is possible to be kept the shape with resin R shape and side that position is constant
Resin R is supplied to the bottom of die cavity recess 33 by formula.Resin R way is supplied to die cavity recess 33 so in the state of expectation
Worked for the quality that reduces the formed products as caused by stomata, gate break etc. is bad.
Then, as shown in fig. 6, making work loader 56 and film loading machine 57 keep out of the way from inside molding die 30.
Then, as shown in fig. 7, making to rise as the lower mould 32 of moveable die, by the mold closing of molding die 30 (matched moulds).Specifically
Ground is said, lower mould 32 is risen to the position for clamping stripping film F by lower die clamp block 35 and upper die clamp block 40.Thus, it is recessed comprising die cavity
It is airtight inside the molding die 30 in portion 33.Now, by driving relief portion 45 in advance, via air flow circuit 41A and air stream
Road 44 makes the inner pressure relief of molding die 30 (degassing) for including die cavity recess 33., can by making the inner pressure relief of molding die 30
The air being mixed into the resin molding process after in the resin R of melting is removed, can prevent formed products from producing stomata.
Then, as shown in figure 8, making further up as the lower mould 32 of moveable die, the upper surface of lower die clamp block 35 is made
The peripheral part of substrate 10 is connected to across stripping film F.Now, because elastic component 42 is weaker than elastic component 50, therefore, under utilization
The rising of mould 32 (lower die clamp block 35), by the upper elasticity of compression component 42 of die clamp block 40.Thus, upper mould inserts 37 (upper mould is utilized
31) with lower die clamp block 35 (lower mould 32) clamping workpiece W, the lower surface of the surface of substrate 10 and upper die clamp block 40 turns into horizontal shape
State.By so making upper mould inserts 37 relatively be moved relative to upper die clamp block 40, no matter workpiece W thickness of slab how can be
Uniform height and position clamping workpiece W.
Then, as shown in figure 9, the lower mould 32 as moveable die is further up, be impregnated in chip part 11 making
After the resin R melted using mold temperature, the molten resin R being filled in die cavity C (die cavity recess 33) is set to be heating and curing,
Workpiece W is carried out resin molded.Now, because lower die clamp block 35 is connected to upper mould 31 across substrate 10 and moves and is hindered,
Therefore, the rising elasticity of compression component 50 of lower mould 32 (lower die base 46) is utilized.Pass through the rising stop position of the lower mould 32 of adjustment
(being in other words the amount of contraction of the elastic component 50), can be carried out resin molded in desired forming thickness (shaping position).By
This, formed products are substantially completed.
Afterwards, workpiece W (formed products) is being kept in upper mould 31 using work holding portion thereof, and will using adsorption section 53,55
Stripping film F is molded in the state of being maintained on lower mould 32.Now, by using stripping film F, it is stripped easily workpiece W.
Moreover, as foregoing, workpiece W is accommodated in into workpiece incorporating section 160 by inspection portion cooling end 140, solidified portion 150.
, can be after with flat state configuration stripping film F by using the resin molding machine 100 of present embodiment
Stripping film F is set to deform with following the shape of die cavity recess 33.For example, stripping film F will not generated into fold or overlapping
Molding die 30 is supplied under state.Thus, it is possible to prevent stripping film F fold etc. to be transferred to the outward appearance of formed products or prevent
Only resin is leaked from overlapping position, lifts the quality of formed products.In addition, by constituting die cavity recess 33, example in lower mould 32
Chip part 11, closing line (not shown) is such as set to be impregnated in the entire surface for being fed into die cavity recess 33 and the resin R melted,
Making resin R flowing turns into Min., bad so as to the quality that reduces the formed products such as stomata, gate break.
(the 2nd embodiment)
Relative to the 1st embodiment, in the present embodiment, (upper mould is embedding with fixture by workpiece W for work loader 56
The bottom of part 37) together configuration (setting) is in upper mould 31, and film loading machine 57 has including heating part, cooling end, gate in terms of portion
Institute is different.Hereinafter, 10~Figure 14 of reference picture is illustrated centered on the difference.Figure 10~Figure 14 is present embodiment
The schematical sectional view of pressing part 130.
As workpiece W (substrate 10) is changed into big, workpiece W largely produces flexure (warpage), therefore, as described
1st embodiment simply utilizes work loader 56 (support 61) holding workpiece W in the periphery portion of substrate 10 like that
In the case of, it is difficult the problems such as keeping or fallen in course of conveying in mould because being bent deadweight to produce substrate 10.Cause
This, in the present embodiment, flexure is prevented by fixture 37A (component) tops of tabular to the back side for the substrate 10 opened greatly,
Workpiece W is together conveyed with fixture 37A using work loader 56.Fixture 37A be, for example, and the upper identical material of mould inserts 37
Matter (stainless steel).Therefore, fixture 37A can also be considered as the bottom of upper mould inserts 37 and be set in the way of it can separate.
In addition, as the 1st embodiment in the case where film loading machine 57 sets the structure of multiple recesses 66,
Recess 66 peripheral part (provided with leading to the air flow circuit 65 of retaining surface 64.) region, it is impossible to carry resin on stripping film F
R.But, form a larger recess 66 of opening portion in hand 63 and resin R is equipped on stripping film F in wider scope
In the case of, well imagine and stripping film F excessive deflections are caused by resin R weight and be difficult flatly to keep stripping film F.Cause
This, in the present embodiment, the gate portion for the stripping film F for being equipped with resin R can be kept by being had in the opening portion of hand 63
70。
Here, specifically describing the film loading machine 57 of present embodiment.Film loading machine 57, which possesses, to be opened, close holding
The gate portion 70 of the roller shutter shape in face 64.Using drive division (not shown), the gate portion 70 (is beaten in the state of retaining surface 64 to be opened
Open state) under be taken up and self-sustaining face 64 is kept out of the way, be sent to guarantor under the state (closed mode) of retaining surface 64 to be closed
Hold face 64.Therefore, film loading machine 57 can be supported using gate portion 70 under the closed mode in gate portion 70 and convey stripping film F,
In lower mould 32 configuration stripping film F under the open mode in gate portion 70.
The material that gate portion 70 can for example be batched as relatively thin metallic plate, resin material is constituted.In addition, gate
The material in portion 70 preferably has the material relatively low relative to stripping film F frictional resistance, shape.Thus, do not make stripping film F crooked
It can just batch.In addition, core 71 as the support rod extended along the direction orthogonal with take-up direction enters gate portion 70
Mode it is more preferable in terms of stripping film F is flatly kept.
, can be with stripping film F not because the resin R's that is mounted in the recess 66 on stripping film F using the film loading machine 57
Weight and the mode that bends flatly keeps (supporting) stripping film F in gate portion 70.In addition, in the case where stripping film F is configured at
During mould 32, gate portion 70 can be batched and seek to save space.But, gate portion 70 is not necessarily required to be set to what can be batched
Structure, even if the structure that the component of tabular is set to open, close, can also keep stripping film F (i.e. resin R).
In addition, film loading machine 57 includes cooling end 72 and heating part 73.Thus, aid in stripping film F, be mounted in the stripping
The heating or cooling that resin R on film F is carried out become easy.In addition, the structure for including heating part by being set to gate portion 70,
The shape that stripping film F can be preheated and be made stripping film F more reliably imitate die cavity recess 33.In this case, for example lead to
Cross and core 71 is set to hot line, the heating part located at gate portion 70 can be made.
Then, resin molding method (the resin molded dress carried out using the resin molding machine 100 of present embodiment is illustrated
Put 100 method of operating).
As shown in Figure 10, in the state of the die sinking of molding die 30, using work loader 56 by workpiece W and fixture 37A
Together moved into from mold exterior.
In addition, in the state of the die sinking of molding die 30, resin R and stripping film F are moved into using film loading machine 57.Now,
When being intended to prevent by radiant heat heated resin R from mould, (or closed by making cooling end 72 turn into opening in advance
State), heating part 73 is turned into closed mode, can also prevent stripping film F, resin R to be heated.
In addition, using the gate portion 70 of closed mode, will in the state of the resin R for keeping being mounted on stripping film F
Resin R is moved to molding die 30.Stripping film F adsorbed portions 67 attract and are adsorbed in retaining surface 64, in flat state
Under be moved to.
Then, as shown in figure 11, work loader 56 is made to increase, together upward mould 31 joins by workpiece W and fixture 37A.
Specifically, the rising using work loader 56 make location division 62 be connected to die clamp block 40 through hole 41 inner peripheral surface
Afterwards, the fixture 37A that remain workpiece W is made to be connected to the lower surface of mould inserts 37.Then, (do not schemed using work holding portion thereof
Show) workpiece W and fixture 37A are maintained to the lower surface of upper mould inserts 37.In such manner, it is possible to by workpiece W from work loader 56 to
Upper mould 31 joins.
In addition, as shown in figure 11, declining film loading machine 57.Specifically, first, in the decline using film loading machine 57
Make retaining surface 64 after stripping film F and gate portion 70 are connected to the upper surface of lower die clamp block 35, elasticity of compression component 50 (makes
Movable part is movable).That is, pressure die clamp block 35 under the decline of film loading machine 57 is utilized.Then, decline film loading machine 57, until
The upper surface of lower mould die cavity block 34 and the upper surface of lower die clamp block 35 turn into horizontal state.In addition, in order to make cooling end
72 in the case of opening as reducing the mold temperature of molding die 30, preferably in the process shown in Figure 11
Cooling end 72 is set to turn into closed mode.
Then, as shown in figure 12, decline work loader 56.Thus, work loader 56 leaves workpiece W.Then, work
Part W is kept by upper mould 31.
In addition, as shown in figure 12, the stripping film F for being equipped with resin R is handed off into lower mould 32.Specifically, first, batch
Gate portion 70, is configured flat stripping film F using film loading machine 57 in the way of resin R is located at the lower top of mould die cavity block 34
The lower mould 32 of level is kept in the upper surface of lower mould die cavity block 34 and the upper surface of lower die clamp block 35.Then, adsorption section is utilized
53rd, 55 the stripping film F of flat condition is adsorbed, the upper surface of lower mould die cavity block 34 and the upper surface of lower die clamp block 35 is held in
The die joint of the lower mould 32 of level.Thereby, it is possible to which resin R and stripping film F is joined from the downward mould 32 of film loading machine 57.In addition,
By making heating part 73 turn into opening, in addition to from the heating of the lower side of mould 32 (lower section), resin R can also be entered from top
Row heating, can shorten the time for being melted.Thereby, it is possible to improve productivity ratio.
Then, as shown in figure 13, flat stripping film F is being attracted from air flow circuit 47A, 52,54 using adsorption section 53,55
While, film loading machine 57 is risen and elastic component 50 is extended and (is made movable part movable).Then, the elastic component 50 is utilized
Lower mould die cavity block 34 is relatively moved relative to lower die clamp block 35, form die cavity recess 33.Now, due to utilizing adsorption section
55 adsorption stripping film F peripheral part, using the position corresponding with the corner of die cavity recess 33 of the adsorption stripping film of adsorption section 53,
Therefore, stripping film F is made to deform with following the inner surface of die cavity recess 33.Thus, stripping film F can follow the interior of die cavity recess 33
Outwardly it is adsorbed keeping.
Now, by follow die cavity recess 33 inner surface adsorb holding stripping film F, resin R can be with the shape of script
Shape is fed into die cavity recess 33.In other words, due to being configured resin R in lower mould mould across stripping film F using film loading machine 57
The top of chamber block 34, therefore, even if lower mould die cavity block 34 relatively moves relative to lower die clamp block 35 and forms die cavity recess
33, resin R are fed into die cavity recess 33 with can also keeping the state of script.Thus, it is possible to not walked with resin R shape
Resin R is supplied to the bottom of die cavity recess 33 by the constant mode of sample and position.
Then, as shown in figure 14, work loader 56 and film loading machine 57 is made to keep out of the way from inside molding die 30.Afterwards,
By the process that 7~Fig. 9 of reference picture illustrates in the 1st embodiment, formed products are substantially completed.
(the 3rd embodiment)
In the 2nd embodiment, holding is adsorbed using in the mounting surface side for being equipped with resin R to film loading machine 57
Stripping film F hand 63 and the face opposite with the mounting surface that side bearing stripping film F gate portion 70 situation carry out
Explanation.In contrast, in the present embodiment, film loading machine 57 is using supporting resin R and stripping film F and is remained untouched
Ground configuration (setting) is different in fixture (component) this point of lower mould 32.Hereinafter, 15~Figure 19 of reference picture is with the difference
Centered on illustrate.Figure 15~Figure 19 is the schematical sectional view of the pressing part 130 of present embodiment.
As the 2nd embodiment, in supporting stripping film F gate portion 70, in the case where stripping film F is configured at
Need to batch (dismounting) gate portion 70 during mould 32.Now, it is possible to which resin R on stripping film F is out of shape etc. to cause its distribution production
Raw bias.Therefore, in the present embodiment, the fixture 34A of tabular is pushed up to stripping film F bottom and keeps flat stripping film
F, is together conveyed stripping film F with fixture 34A using film loading machine 57, is made using the fixture 34A for the state for being configured with stripping film F
For lower mould 32.That is, due to fixture 34A be, for example, with the lower identical material (stainless steel) of mould die cavity block 34, therefore, it is possible to regarding
Top for lower mould die cavity block 34 is set in the way of it can separate.
Here, specifically describing the film loading machine 57 and pressing part 130 of present embodiment.Film loading machine 57 includes lower mould mould
Fixture 34A that the top of chamber block 34 is set in the way of it can separate and the top of lower die clamp block 35 are can separate
The fixture 35A that mode is set.In addition, the through hole in fixture 35A is configured with fixture 34A, in order to lift supporting fixture
34A, fixture 34A outer peripheral face and fixture 35A inner peripheral surface are connected using multiple connecting elements 74.The connecting elements 74 is for example
Can be as leaf spring as can use the fixture 35A movable parts movable along the vertical direction relative to fixture 34A.
These fixtures 34A is different with the thickness of fixture 35, and fixture 34A thickness is thinner than fixture 35A thickness.Moreover,
It is not affected by the state of externalities, fixture 34A end face and fixture 35A end face is kept using connecting elements 74
Level.In addition, in pressing part 130, the state that elastic component 50 as the situation in die sinking is not exerted a force (is not affected by and come from
The state of externalities) under, the bottom upper surface of the bottom upper surface of lower mould die cavity block 34 and lower die clamp block 35 can be located
In identical height and position.In the present embodiment, will by the thickness difference (difference of height) with such fixture 34A, 35A
Fixture 34A (top of lower mould die cavity block 34) relative to fixture 35A (top of lower die clamp block 35) can relatively move
Ground is set, and can change the depth (die cavity C volume) of die cavity recess 33.
Pressed in addition, the pressing part 130 (film loading machine 57) of present embodiment possesses from upper surface (face for being equipped with resin R)
Press stripping film F press section 75,76.Press section 75 is formed profile not in order to press stripping film F around resin R
With the flange shape that combines of 2 square annular components, the end face of itself and fixture 34A peripheral part is oppositely disposed.In addition,
Press section 76 relatively press its peripheral part in order to the end face with stripping film F lower die clamp block 35 and with fixture 35A end
Face is oppositely disposed.
Using film loading machine 57, can while fixture 34A end face and fixture 35A end face are kept into level,
Convey stripping film F while stripping film F is flatly kept on the end face of these fixtures.Thereby, it is possible to which stripping film F and the stripping will be equipped on
Resin R from film F is configured at molding die 30 with stable state.
Then, resin molding method (the resin molded dress carried out using the resin molding machine 100 of present embodiment is illustrated
Put 100 method of operating).
As shown in figure 15, in the state of molding die 30 has been molded, moved into using work loader 56 from mold exterior
Workpiece W.In addition, in the state of molding die 30 has been molded, resin R and stripping film F are moved into using film loading machine 57.
In addition, before this, such as in resin supply unit 120, being protected in fixture 34A end face and fixture 35A end face
In the state of water holding is flat, the stripping film F of web-like is sent out, carrying (supply) in stripping film F has resin R.Then, by that will peel off
Film F is cut to predetermined shape (such as strip) (reference picture 2), due to fixture 34A and fixture 35A end face level, therefore,
State when stripping film F is configured at the end face of these fixtures is also flat.Stripping film F is by robot mechanism portion 180
Pressing part 130 is fed into loading machine 190.
Then, as shown in figure 16, work loader 56 is increased, the upward moulds 31 of workpiece W are joined.
In addition, as shown in figure 16, declining film loading machine 57.Specifically, fixture is made using the decline of film loading machine 57
35A is connected to the upper surface of lower die clamp block 35.Now, stripping film F is flatly configured at fixture 34A using film loading machine 57
The end face on (top of lower mould die cavity block 34) and fixture 35A (top of lower die clamp block 35) end face keep the lower mould of level
32.In addition, now, fixture 34A is not connected to the upper surface of lower mould die cavity block 34.
Then, as shown in figure 17, decline work loader 56.Thus, work loader 56 leaves workpiece W.
In addition, as shown in figure 17, stripping film F is attracted using adsorption section 53,55.Specifically, adsorbed using adsorption section 55
Stripping film F peripheral part, using the adsorption stripping film F of adsorption section 53 central portion, is made relative to fixture 35A using connecting elements 74
The fixture 34A movably set along the vertical direction declines (making movable part movable).
Lower mould die cavity block 34 is relatively moved relative to lower die clamp block 35 using the connecting elements 74, form die cavity recessed
Portion 33.Now, due to the peripheral part using the adsorption stripping film F of adsorption section 55, using the adsorption stripping film of adsorption section 53 F's and die cavity
The corresponding position in the corner of recess 33, therefore, stripping film F is deformed with following the inner surface of die cavity recess 33.Thus, stripping film
F is adsorbed keeping in which can follow the inner surface of die cavity recess 33.
In addition, adsorb holding stripping film F with following the inner surface of die cavity recess 33, and resin R is intactly supplied
It is given to die cavity recess 33.Due to being configured at resin R above fixture 34A across stripping film F using film loading machine 57, therefore, i.e.,
Make to form die cavity recess 33, resin R is fed into die cavity recess 33 with can also keeping the state of script.Thus, it is possible to set
Fat R shape keeps the shape and resin R is unchangeably supplied to the bottom of die cavity recess 33 by position.
Then, as shown in figure 18, while stripping film F is attracted from air flow circuit 52,54 using adsorption section 53,55, make
Film loading machine 57 rises, and resin R and stripping film F are handed off into lower mould 32.
Then, as shown in figure 19, work loader 56 and film loading machine 57 is made to keep out of the way from inside molding die 30.Afterwards,
By the process that 7~Fig. 9 of reference picture illustrates in the 1st embodiment, formed products are substantially completed.
(the 4th embodiment)
In the 1st embodiment, to using flatly absorption to keep stripping film F hand 63 as film loading machine 57
Situation be illustrated.In contrast, in the present embodiment, being remained untouched using using stripping film F as plate to support
Ground configuration (setting) is different as this point of film loading machine 57 in the fixture (component) of lower mould 32.Hereinafter, reference picture 20~
Figure 24 is illustrated centered on the difference.Figure 20, Figure 22~Figure 24 are the schematic of the pressing part 130 of present embodiment
Sectional view.Figure 21 is the view sub-anatomy of the film loading machine 57 (diaphragm plate portion) shown in Figure 20.
Specifically describe the pressing part 130 of present embodiment.Film loading machine 57 possesses the upper board 80 and lower panel of ring-type
81, consist of by the way that from clamping up and down stripping film F can be being kept in the state of complete cycle stretch release film F (especially
It is reference picture 21).In the example shown in Figure 21, lower panel 81 in flange shape mode to be formed with peripheral part end from top
The face of the side of plate 80 is recessed and stage portion 82 circumferentially.Stripping film F is clipped between upper board 80 and lower panel 81, so that
Mode corresponding with the stage portion 82 (small diameter part) of lower panel 81 the inside diameter 80a of upper board 80 is embedded in down upper board 80
Plate portion 81, so as to constitute diaphragm plate portion (film loading machine 57) (referring particularly to Figure 20).Moreover, stripping film F upper board 80 and under
The inner circumferential of portion's plate 81 is flatly tensioned setting.
In addition, can also for example use the upper board 80 and lower panel 81 of identical ring-type, it is fixed on using bolt etc.
Peripheral part insertion hole (avoiding stripping film F positions) and constitute diaphragm plate portion.
In addition, be formed with lower die clamp block 35 peripheral part end from end face is recessed and stage portion 83 circumferentially.
Moreover, making diaphragm plate portion in the mode for making the inside diameter 81a of lower panel 81 corresponding with the stage portion 83 of lower die clamp block 35, (film is loaded
Machine 57) it is fitted and fixed with lower die clamp block 35.In the present embodiment, stripping film F can be flatly kept using simple structure,
Stripping film F can be configured at lower mould 32 in a flattened condition.
Then, resin molding method (the resin molded dress carried out using the resin molding machine 100 of present embodiment is illustrated
Put 100 method of operating).
As shown in figure 20, in the state of the die sinking of molding die 30, work is moved into from mold exterior using work loader 56
Part W.In addition, in the state of molding die 30 has been molded, resin R and stripping film F are moved into using film loading machine 57.
In addition, before this, as shown in figure 21, stripping film F being clipped between upper board 80 and lower panel 81 and film is constituted
Plate portion, carrying (supply) has resin R on the stripping film F in the diaphragm plate portion.
Then, as shown in figure 22, work loader 56 is increased, the upward moulds 31 of workpiece W are joined.
In addition, as shown in figure 22, declining film loading machine 57, the stripping film F for being equipped with resin R being handed off into lower mould 32.
Specifically, first, in the decline using film loading machine 57 so that the lower surface of lower panel 81 is connected to the platform of lower die clamp block 35
The mode of the upper surface in rank portion 83 is secured after lower panel 81, and elasticity of compression component 50 (makes movable part movable).That is, film is utilized
Pressure die clamp block 35 under the decline of loading machine 57.Then, decline film loading machine 57, until the upper surface of lower mould die cavity block 34
Untill the upper surface (end face of upside) of (end face of upside) and lower die clamp block 35 turns into horizontal state.
Now, the tensioning of film loading machine 57 remains flat stripping film F.That is, using film loading machine 57 by flat stripping
Film F is configured at the upper surface of lower mould die cavity block 34 and lower die clamp block in the way of resin R is located at the lower top of mould die cavity block 34
35 upper surface keeps the lower mould 32 of level.
Then, in the state of the upper surface level of the upper surface of lower mould die cavity block 34 and lower die clamp block 35, suction is utilized
Attached portion 53 adsorbs, keep the upper surface to cover lower mould die cavity block 34 and the upper surface of lower die clamp block 35 in the way of configure it is flat
The stripping film F of smooth state.
Then, as shown in figure 23, decline work loader 56.Thus, work loader 56 leaves workpiece W.Then, work
Part W is only kept by upper mould 31.Then, work loader 56 is made to keep out of the way from inside molding die 30.
In addition, as shown in figure 23, attracting flat stripping film F's same from air flow circuit 47A, 52 using adsorption section 53
When, film loading machine 57 is increased, elastic component 50 is extended and (is made movable part movable).Moreover, under being made using the elastic component 50
Mould die cavity block 34 is relatively moved relative to lower die clamp block 35, forms die cavity recess 33.Now, the internal diameter of lower panel 81 is passed through
The stage portion 83 of portion 81a and lower die clamp block 35 is fitted together to, and stripping film F peripheral part is fixed, and utilizes the adsorption stripping film F of adsorption section 53
The position corresponding with the corner of die cavity recess 33, therefore, stripping film F is deformed with following the inner surface of die cavity recess 33.By
This, stripping film F is adsorbed keeping with following the inner surface of die cavity recess 33.
Now, by follow die cavity recess 33 inner surface adsorb holding stripping film F, resin R is with the shape quilt of script
It is supplied to die cavity recess 33.In other words, kept off due to being configured resin R across stripping film F using film loading machine 57 in lower mould die cavity
The top of block 34, therefore, even if lower mould die cavity block 34 relatively moves relative to lower die clamp block 35 and forms die cavity recess 33, tree
Fat R is fed into die cavity recess 33 with can also keeping the state of script.Thus, it is possible to kept the shape with resin R shape and
Resin R is supplied to the bottom of die cavity recess 33 by the constant mode in position.In this wise to die cavity recess 33 in the state of expectation
Supply resin R way works for the quality that reduces the formed products as caused by stomata, gate break etc. is bad.
Then, as shown in figure 24, make to rise as the lower mould 32 of moveable die, by the mold closing of molding die 30 (matched moulds).By
This, can clamp stripping film F, i.e. can utilize upper mould 31 and lower mould 32 clamping diaphragm plate portion (film loading machine 57).Afterwards, pass through
The process that 8~Fig. 9 of reference picture illustrates in the 1st embodiment, formed products are substantially completed.
(the 5th embodiment)
In the 1st embodiment, to making lower mould by using pressure die clamp block 35 under film loading machine 57 (hand 63)
The situation of the upper surface level of the upper surface of die cavity block 34 and lower die clamp block 35 is illustrated.In contrast, in this implementation
In mode, the fixture 34A (top of lower mould die cavity block 34) of the tabular of floating support is set in lower mould 32, makes the fixture
The aspect of the upper surface level of 34A upper surface and lower die clamp block 35 is different.Hereinafter, 25~Figure 26 of reference picture is with the difference
Illustrated centered on point.Figure 25~Figure 26 is the schematical sectional view of the pressing part 130 of present embodiment.
Specifically describe the pressing part 130 of present embodiment.Pressing part 130 possesses the top of lower mould die cavity block 34 with energy
The tabular fixture 34A that the mode enough separated is set.In addition, pressing part 130 possesses the example for supporting the fixture 34A of tabular
Such as multiple fulcrum posts 84 of corner.In addition, pressing part 130 by fulcrum post 84 with can be relative to lower die base 46 along the vertical direction
Mobile mode is assembled in the lower die base 46, possesses the elastic component 85 (such as spring) with the identical quantity of fulcrum post 84.Cause
This, with the upper table of fixture 34A (top of lower mould die cavity block 34) upper surface and lower die clamp block 35 in the state of having molded
The mode of face level, utilizes fulcrum post 84 and the floating support fixture 34A of elastic component 85 of composition movable part.In addition, tabular
Fixture 34A can also be set to what is do not utilized elastic component 85 and can be lifted using drive mechanism as cylinder, servo motor
Structure.
Then, the resin molding method (resin molding machine of the resin molding machine 100 using present embodiment is illustrated
100 method of operating).
As shown in figure 25, in the state of molding die 30 has been molded, resin R and stripping film F is moved into and downward mould 32 is handed over
Connect.Now, stripping film F is flatly configured at the upper of fixture 34A (top of lower mould die cavity block 34) using film loading machine 57
Surface and the upper surface of lower die clamp block 35 keep the lower mould 32 of level.Then, start to attract stripping film F using adsorption section 53,55.
Then, as shown in figure 26, stripping film F is attracted using adsorption section 53,55.Specifically, adsorbed using adsorption section 55
Stripping film F peripheral part, attracts the air in below stripping film F space using adsorption section 53, with relative to the lower edge of die clamp block 35
Fixture 34A elasticities of compression component 85 that the movable mode of above-below direction is set simultaneously makes its decline (making movable part movable).
Make fixture 34A (top of lower mould die cavity block 34) relative to lower die clamp block 35 relatively using the elastic component 85
It is mobile, form die cavity recess 33.Now, due to the peripheral part using the adsorption stripping film F of adsorption section 55, adsorbed using adsorption section 53
The stripping film F position corresponding with the corner of die cavity recess 33, therefore, stripping film F is with following the inner surface of die cavity recess 33
Deformation.Thus, stripping film F is adsorbed keeping with following the inner surface of die cavity recess 33.
In addition, adsorb holding stripping film F with following the inner surface of die cavity recess 33, and resin R is intactly supplied
It is given to die cavity recess 33.Due to being configured resin R above fixture 34A across stripping film F using film loading machine 57, therefore, i.e.,
Make to form die cavity recess 33, also the state of resin R holding scripts can be supplied to die cavity recess 33.Thus, it is possible to set
Resin R is supplied to the bottom of die cavity recess 33 by the mode that fat R shape keeps the shape and position is constant.Afterwards, by institute
The process that 7~Fig. 9 of reference picture illustrates in the 1st embodiment is stated, formed products are substantially completed.
Thus, the end face of lower mould die cavity block 34 need not be for example made using 57 times pressure die clamp blocks 35 of film loading machine with
The end face level of die clamp block 35, can simplifying the movement structure of film loading machine 57, (output of such as drive motor, stroke subtract
It is few).Further, since when mould 32 configures stripping film F downwards, fixture 34A (top of lower mould die cavity block 34) is the state floated,
Therefore, it is possible to prevent stripping film F thermal contraction, prevent the resin R being mounted on stripping film F from overheating or carrying out heating adjustment
Become easy.
(the 6th embodiment)
In the 1st embodiment, the molding to including die cavity recess 33 as illustrating as reference picture 7 in mold closing
The inside of mould 30 carried out it is airtight in the state of the situation of the inner pressure relief of molding die 30 (degassing) is illustrated.Now,
Substrate 10 (workpiece W) is held in the work holding portion thereof (air flow circuit 90 and adsorption section 91) using upper mould 31, by adsorbing
In the case of upper mould 31, the attraction decline for sorbing substrate is caused by the attraction for being depressurized, substrate 10 has can
It can fall.Relative to such 1st embodiment, in the present embodiment, making makes multiple pin floating supports under
Die clamp block 35 and the structure for supporting the substrate 10 in the state of forming pressure reduction space in the way of substrate 10 is pressed on into upper mould 31
This point is different.Hereinafter, reference picture 27 is illustrated centered on the difference.Figure 27 is the punching press of present embodiment
The schematical sectional view in portion 130.
Pressing part 130 possesses many of inside that lower die clamp block 35 is arranged on along around the through hole 47 of lower die clamp block 35
Individual pin 86.In addition, pin 86 is assembled in down by pressing part 130 in the way of it can along the vertical direction be moved relative to lower die clamp block 35
The inside of die clamp block 35, possesses the elastic component 87 (such as spring) with the identical quantity of pin 86.
Therefore, with the end face protrusion in the state of pressure reduction space is formed from lower die clamp block 35, across stripping film F and substrate
10 surface abuts ground supporting workpiece W mode, utilizes the floating support pin 86 of elastic component 87 for constituting movable part.Moreover,
In the state of clamping workpiece W (reference picture 8), pin 86 is housed in the inside of lower die clamp block 35.Thus, it is possible to prevent in clamping
The preceding workpiece W kept by upper mould 31 is fallen.
In addition, in figure 27, when via air flow circuit 44 using the formation pressure reduction space of relief portion 45, the attraction path is seen
Get up blocked, but because pin 86 is partly configured, therefore decompression will not be hindered.
(the 7th embodiment)
Relative to only resin molded the 1st embodiment is carried out to workpiece W (substrate 10) one side, in this embodiment party
In formula, two faces resin molded this point of progress to workpiece W is different.Hereinafter, 33~Figure 36 of reference picture is with the difference
Centered on illustrate.Figure 33~Figure 36 is the schematical of the pressing part 130 in the resin molded process of present embodiment
Sectional view.
The workpiece W of present embodiment includes：Substrate 10, it has a face 10a and another face opposite with face 10a
10b；And multiple spherical projection 11A, 11A (the 1st part, the 2nd part), it is separately positioned on two faces 10a, 10b, should
Workpiece W is for example configured to wafer-shaped (tabular).Projection 11A, 11A progress respective to two faces 10a, 10b is resin molded, two
Individual face 10a, 10b form resin mold section 14,15 (reference picture 36) respectively, and workpiece W is big as resin molded finished product (formed products)
Cause to complete.
The resin molded of the workpiece W of such wafer-shaped is referred to as WLP (Wafer Level Package).In addition, conduct
Part on the workpiecew is set, the projection 11A as wiring part is not limited to, both can be that chip part (is for example partly led
Body chip, MEMS chip, chip capacitor etc.), and can also be both wiring part and chip part.It is used as substrate
10, not only comprising common substrate, also the component comprising tabular or temporarily it is equipped with carrier, the semiconductor die of part
Circle.
In addition, in the present embodiment, for workpiece W, being supplied respectively to using robot mechanism portion 180 (reference picture 1)
Not by the workpiece W (reference picture 33) of part (projection 11A) exposure in resin molded and two faces and be only a face by resin mold
Make and the only workpiece W (reference picture 35) of part (projection 11A) exposure in another face.Therefore, the pressing part of present embodiment
130 include the 1st fixture 12 (reference picture 33) and the 2nd fixture 13 (reference picture 35) of tabular.
When using upper mould 31 and lower 32 clamping workpiece W of mould, fixture 12,13 is alternatively provided at mould inserts 37 respectively
Lower surface.The 1st perforate 12a that fixture 12 has the carrying region than projection 11A big (is represented multiple in fig. 33.), the projection
11A is equipped on the semiconductor chip manufactured as finished product on the 10a of face.In other words, the 1st perforate 12a is used as projection 11A to avoid
The part of setting simultaneously forms workpiece W and the mode of the coincidence of fixture 12.In addition, fixture 13 has 2nd perforate bigger than perforate 12a
13a (represents one in Figure 35.).
When using fixture 12, projection 11A (that is, ensures to avoid projection 11A to be accommodated in perforate 12a using perforate 12a.)
Mode be equipped on workpiece W face 10a (reference picture 33).In addition, when using fixture 13, resin mold section 15 is to be accommodated in out
Hole 13a (that is, ensures to avoid resin mold section 15 using perforate 13a.) mode be equipped on workpiece W face 10b (reference picture 35).
In the present embodiment, by using fixture 12,13, (avoidance) projection 11A, the ground clamping workpiece of resin mold section 15 can be avoided
W (reference picture 34, Figure 36).
Further, since fixture 12,13 can be replaced, therefore, molding die 30 can be shared in the other finished products of shaping,
Use other fixtures.In addition, fixture 12,13 can also be used even if upper mould 31 is fixed on.
In the present embodiment, loading machine 190 joins from robot mechanism portion 180 fixture 12 or fixture 13 are overlapped
They are moved to pressing part 130 after on the workpiece W come.In addition, loading machine 190 joins the resin of coming since pressing part 130
Mould and pull down fixture 12 or fixture 13 on the workpiece W finished, taken out of robot mechanism portion 180.By so loading
Prepare fixture 12 or fixture 13 on machine 190, workpiece W and fixture 12 or fixture 13 can be together handed off to inside pressing part 130.
Then, the formed products (tree carried out using the resin molding machine 100 (compression molding apparatuss) of present embodiment is illustrated
Fat molded product) manufacture method (resin molding method).Specifically, to as formed products in workpiece W two faces (face
10a, 10b) form resin mold section 14,15 respectively during the method that shapes one by one for each face it is (once-forming, secondary
The two-stage method of moulding of shaping) illustrate.
Firstly, for by robot mechanism portion 180 convey Lai workpiece W for, in loading machine 190 with projection 11A receive
It is contained in a perforate 12a face 10a carrying clamp 12 of the mode in workpiece W.In this case, due in loading machine 190
Carrying clamp 12, therefore, 180, robot mechanism portion conveying workpieces W can use that can to remove the less machine of weight man-machine
Structure portion 180, is capable of the manufacturing cost of cutting device.
Its this, in the state of molding die 30 has been molded, removed using work loader 56 (reference picture 3) from mold exterior
Enter workpiece W and fixture 12, together upward mould 31 joins (reference picture 33) with fixture 12 by workpiece W.Thus, workpiece W can be protected
Hold the die face in upper mould 31.
Specifically, in the state of mould 32, fixture 12 is made to be connected to mould inserts 37 under workpiece W face 10b
Lower surface, adsorbed and kept across fixture 12 in the die face of upper mould 31 (upper mould inserts 37) using work holding portion thereof (not shown)
Workpiece W (substrate 10).The perforate of the projection 11A for avoiding being mounted on workpiece W (substrate 10) face 10a is provided with fixture 12
12a, therefore can for example protect projection 11A.Alternatively, it is also possible to without using fixture 12, and carved in the lower surface of upper mould inserts 37
Recess is carved, projection 11A is avoided.
In addition, in the state of molding die 30 has been molded, resin R and stripping are moved into using film loading machine 57 (reference picture 3)
From film F, resin R and stripping film F is joined (reference picture 33) from the downward mould 32 of film loading machine 57.Now, stripping film F shape is made
Stripping film F is adsorbed to the lower mould 32 for being maintained at and including lower mould die cavity recess 33 from the flat deformation for following lower mould die cavity recess 33
Die face, and resin R is intactly supplied to lower mould die cavity recess 33.
In addition, by using stripping film F, can prevent gap of the resin between lower mould inserts 34 and lower die clamp block 35 from letting out
Leakage.But, can also not in the case where the influence of not such resin leakage can intactly convey resin R
Use stripping film F.
Then, as shown in figure 34, make the projection 11A located at face 10b complete rising the lower mould 32 as moveable die
Portion is impregnated in after the resin R melted under mold temperature, while using upper mould 31 and lower 32 clamping workpiece W of mould, under making
Mould inserts 34 is moved to shaping position.Then, the resin R being filled in lower mould die cavity C is made to be heating and curing, to workpiece W trees
Fat is moulded.Thereby, it is possible in workpiece W face 10b formation resin mold sections 15.
Afterwards, keeping workpiece W (formed products) in upper mould 31 using work holding portion thereof and existed using adsorption section 53,55
Lower mould 32 keeps molding in the state of stripping film F.Now, by using stripping film F, it is stripped easily workpiece W.So
Afterwards, as foregoing, workpiece W is accommodated in workpiece incorporating section 160 (ginseng by inspection portion cooling end 140, solidified portion 150
According to Fig. 1).
Then, in workpiece incorporating section 160, the workpiece W that face 10b resin mold section 15 is formed at due to possessing is contained
In job library, therefore, job library is set to be moved to Workpiece supply portion 110.Now, in order in workpiece W face 10a formation resins
Molding section 14, in advance overturns workpiece W, so as to prepare secondary forming.In addition, in order to form resin mold section 14, replacing clamp
12 and fixture 13 and carry out the same process of process with formation resin mold section 15.
Then, it is accommodated in using robot mechanism portion 180 with the resin mold section 15 for being loaded the workpiece W that machine 190 is moved into
Fixture 13 is equipped on a workpiece W face 10b by perforate 13a mode.Here, the perforate 13a of fixture 13 plane domain is big
In the plane domain of resin mold section 15, being in other words greater than constituting is used to be formed under the lower mould die cavity C of resin mold section 15
The upper surface of mould inserts 34.
Then, in the state of the die sinking of molding die 30, moved into using work loader 56 (reference picture 3) from mold exterior
Workpiece W and fixture 13, upper mould 31 (reference picture 35) is together handed off to by workpiece W and fixture 13.It is used for due to being provided with fixture 13
The perforate 13a of resin mold section 15 being mounted on workpiece W (substrate 10) face 10b is avoided, thus it is for example possible to protect resin
Molding section 15.Alternatively, it is also possible to without using fixture 13, and carve recess in the lower surface of upper mould inserts 37 and avoid resin molded
Portion 15.
In addition, in the state of molding die 30 has been molded, resin R and stripping are moved into using film loading machine 57 (reference picture 3)
From film F, resin R and stripping film F is joined (reference picture 35) from the downward mould 32 of film loading machine 57.Now, stripping film F shape is made
Stripping film F is adsorbed to the lower mould 32 for being held in and including lower mould die cavity recess 33 from the flat deformation for following lower mould die cavity recess 33
Die face, and resin R is intactly supplied to lower mould die cavity recess 33.
Resin R is used to form resin mold section 14, passes through the same amount of resin mold section 15, the homogeneity for being set to Yu being formed before
Material, projection 11A can be sealed into identical shape.But, in the present embodiment, what is represented as projection 11A
In the case that the height of the part of carrying on the substrate 10 is different, the resin R for the component being each adapted to can be also used.At this
In the case of kind, the purpose of warpage as caused by the difference of resin molded thickness, the function phase of the part carried and can be also prevented
Should the different resin R of ground character of use.
Then, as shown in figure 36, make the projection 11A located at face 10a complete rising the lower mould 32 as moveable die
Portion is impregnated in after the resin R melted under mold temperature, while using upper mould 31 and lower 32 clamping workpiece W of mould, under making
Mould inserts 34 is moved to shaping position.Then, the resin R for being filled in lower mould die cavity C is heating and curing, resin is carried out to workpiece W
Molding.Thereby, it is possible in workpiece W face 10a formation resin mold sections 14.
Afterwards, keeping workpiece W (formed products) in upper mould 31 using work holding portion thereof and existed using adsorption section 53,55
Lower mould 32 keeps molding in the state of stripping film F.Now, by using stripping film F, it is stripped easily workpiece W.So
Afterwards, as foregoing, workpiece W is accommodated in workpiece incorporating section 160 (ginseng by inspection portion cooling end 140, solidified portion 150
According to Fig. 1).
For workpiece W after, projection 11A is exposed by being ground the end face of resin mold section 14,15, and
The each region suitable with 1 chip is turned to by monolithic, 1 packaging for being formed with connection terminal face on both faces is formed
(resin molded finished product).In addition, mutually pasting and being used as in a face by the substrate 10 by projection 11A is configured with one side
In the case of workpiece W, by make substrate 10 mutually peel off after monolithic turn to the region suitable with 1 chip, can be effective
Rate it is formed in the packaging that one side is formed with connection terminal face.
Using present embodiment, the workpiece W of tabular two faces 10a, 10b can be entered respectively using compress moulding method
Row is resin molded.Furthermore it is possible to downwards mould die cavity recess 33 (lower mould die cavity C) supply resin R and carry out it is resin molded, therefore i.e.
Make to be large-scale workpiece W, also can efficiently shape.
In addition it is also possible to after workpiece W one side forms resin mold section 15, by the way that workpiece W is not accommodated in into work
The ground of part incorporating section 160 is moved to pressing part 130 and forms resin mold section 14, so that continuously shaping resin molding section 14,15.
In addition, in the above-described embodiment, can also substitute and be set to flatly keep resin R and stripping film F
Gate portion 70, and the tabular component of resin holding is being clipped in resin R and stripping film F in order to flatly keep resin R
Between in the state of conveying stripping film F.The tabular component of resin holding for example both can be metallic plate, glass plate or silicon wafer
Structure as the various sheet materials such as circle or lead frame, substrate.In this case, the tabular structure of resin holding
Part can both be peeled off after such shaping, also can be by intactly remaining in packaging and as exothermic layer, electromagnetic shielding
Layer, filter layer, lens jacket, wavelength conversion layer, permeation-proof gas-bearing formation or functional layer as wiring layer.By using such resin
The tabular component of holding, can utilize and flatly convey tree by the tabular component for being pasted on workpiece W and being capable of multifunction
Fat R and stripping film F, can simply manufacture H.D finished product.Alternatively, it is also possible to simultaneously using the tabular structure of resin holding
Part and gate portion 70.
(the 8th embodiment)
In the pressing part of the resin molding machine of the 1st embodiment, to utilizing known clamping device to molding
Mould is molded, the situation of mold closing is illustrated.In the present embodiment, special instruction is provided with reply workpiece in pressing part
The resin molding machine of the clamping device of W maximization (WLP).Using the resin molding machine of present embodiment, by dimension
Mold closing is accurately carried out while holding the depth of parallelism of the movable platen in mold closing action process and make final resin pressure into
For high pressure, it is possible to increase shaping quality.
Hereinafter, possessing for opening, closing the clamping device of molding die for the present invention is together described in detail with accompanying drawing
The preferably embodiment of resin molding machine.Resin molding machine 201 includes the molding mould with upper mould 202 and lower mould 203
Tool 204 and the clamping device 205 for opening, closing the molding die 204.
In Figure 37, clamping device 205 is located at the base portion 206 of rectangle.It is sharp between base portion 206 and stationary platen 207
With configuration in each corner (everywhere；Reference picture 38) pull bar 208 be connected.Upper mould 202 is supported on stationary platen 207, lower mould 203
It is supported on front (upper surface) side of movable platen 209.Movable platen 209 guided by the pull bar 208 that insertion couples and up and down
Motion.
Ball screw framework 210 (the 1st mould switching mechanism), the ball-screw are provided with the rear side of movable platen 209
Mechanism 210 couples with the movable platen 209, by the mold closing of molding die 204 between movable platen 209 and stationary platen 207, directly
Reach the 1st mold clamping force.
Specifically, base portion 206, than pull bar 208 in the inner part everywhere be provided with leading screw 211, everywhere provided with use
In the 1st drive motor 212 (servo motor) for driving each leading screw 211 to rotate it.1st drive motor 212 multiple motors it
Between synchronously drive, can accurately control speed using SERVO CONTROL.In addition, four of rear side in movable platen 209
Place is provided with the fixing nut 213 chimeric with the screw thread of leading screw 211.In Figure 38, pull bar 208 and leading screw 211 (can in base portion 206
Dynamic platen 209) diagonal position be mutually equally spaced apart configuration.As long as in addition, ball screw framework 210 is provided with more than three, then
Setting is several can.
Elbow-bar mechanism 214 (the 2nd mould switching mechanism) is provided with the rear side central portion of movable platen 209.Elbow-bar mechanism
214 couple with movable platen 209, carry out mold closing and further enhance the 2nd of chucking power compared with the 1st mold clamping force until reaching
Mold clamping force, maintains final resin pressure.Specifically, it is provided with leading screw 215 and for driving the silk in the central portion of base portion 206
Thick stick 215 makes the 2nd drive motor 216 (servo motor) that it rotates.Being fitted together in the screw thread of leading screw 215 has movable nut 217.Movable
Nut 217 is integrally provided with connecting rod linking part 218.In addition, each drive motor 216,212 can also match somebody with somebody by using band mechanism
Put in the side of base portion 206.
Elbow-bar mechanism 214 is so-called force-increasing mechanism, and consisting of can utilize what is be made up of following each link component
Toggle link construction makes the output from the 2nd drive motor 216 increase (amplification) and be exported to movable platen 209.Specifically, link
One end of connecting rod 219 is rotatably linked to connecting rod linking part 218.Link the other end of connecting rod 219 to turn
Dynamic mode is linked to the top corner portion of triangular coupling rod 220.One bottom corner portion of triangular coupling rod 220 is with can be relative to pedestal
The mode that portion 206 is rotated is linked to the base portion 206, and another bottom corner portion is rotatably linked to slide link
221 one end.The other end of slide link 221 is rotatably linked to the company at the back side for being located at movable platen 209
Knot 209a.Using such structure, in elbow-bar mechanism 214, the 2nd driving horse for having movable nut 217 is fitted together to using screw thread
The linking part 209a at the back side of movable platen 209 is located at up to 216 drivings.
In addition, utilizing the drive motor 212 of 222 drive control of control unit the 1st and the 2nd drive motor 216.In addition, being drawn each
Pressure sensor 223 is respectively equipped with bar 208.Control unit 222 is by being detected the folder of molding die 204 by pressure sensor 223
Pressure is held and the drive motor 212 of drive control the 1st and the 2nd drive motor 216, to control ball screw framework 210 and toggle link machine
The mould holding action of structure 214.
Specifically, control unit 222 synchronously drives the driving of the 1st drive motor the 212 and the 2nd when starting mold closing action
Motor 216, molding die is being fed into using ball screw framework 210 via movable platen 209 with the clamping of the 1st mold clamping force
After 204 workpiece, the pressurized state of the ball screw framework 210 is set to be transitioned into the pressurized state pressurizeed by elbow-bar mechanism 214,
Movable platen 209 is clamped until reaching the 2-in-1 mould power bigger than the 1st mold clamping force using the elbow-bar mechanism 214.
Reference picture 40A illustrates an example of molding die 204.The upper die base 202a of upper mould 202 is supported in solid
Platen 7.Mould inserts 202b is assembled with upper die base 202a.It is formed with and is protected for upper mould inserts 202b workpiece W to be adsorbed
Hold as the work holding portion thereof 202c concordant with clamping face.
The lower die base 203a of lower mould 203 is supported on movable platen 209.It is formed with lower die base 203a clamping face recessed
Portion, lower mould die cavity block 203b is supported with the recess, and lower die clamp block 203c is supported under this with exerting a force by helical spring 203d
Around mould die cavity block 203b.Lower die clamp block 203c from lower mould die cavity block 203b upper surface are protruded upward, are formed with
Lower mould die cavity recess 203e.Holding stripping film F is adsorbed in the way of covering the lower mould die cavity recess 203e.
Stripping film F is adsorbed to be held in mould clamping face.Stripping film F thickness is 0.5mm or so, with heat resistance, is held
Easily peeled off from die face, with flexibility, extensibility, for example, be adapted to use with PTFE, ETFE, PET, fep film, fluorine-containing glass fibers
Wei Bu, polypropylene screen, polyvinylidene chloride etc. are the individual layer or multilayer film of main component.
Then, reference picture 37, Figure 39 A and Figure 39 B, Figure 40 A~Figure 40 C illustrate on-off action and the tree of clamping device 205
One example of fat molding action.
In Figure 37, in the state of the die sinking of molding die 204, using feedway (not shown) by workpiece W to molding
Mould 204 is supplied.In addition, the lower mould die cavity recess 203e of lower mould 203 is covered and adsorbed and maintains stripping film F in advance.
As shown in fig. 40, workpiece W (such as being equipped with the substrate of semiconductor chip, semiconductor crystal wafer) is by upper mould 202
Work holding portion thereof 202c absorption is kept, and moulded resin R (liquid trees are supplied to the stripping film F lower mould die cavity recess 203e covered
Fat, particulate resins, particle resin (powdex), sheet material resin, block resin etc.).Alternatively, it is also possible to by moulded resin R
Lower mould die cavity recess 203e is together supplied to stripping film F.
When starting mold closing action, control unit 222 synchronously drives the 1st drive motor 212 and the 2nd drive motor 216.
In Figure 39 A, using the driving of the 1st drive motor 212, the leading screw 211 that ball screw framework 210 has at four rotates, with
The rotation of leading screw 211, the movable platen 209 chimeric with the screw thread of fixing nut 213 remains flat relative to stationary platen 207
Rise row degree.That is, lower mould 203 (specifically its die joint) is protected relative to upper mould 202 (specifically its die joint)
Rise with hold the depth of parallelism.
In addition, using the driving of the 2nd drive motor 216, the movable nut 217 chimeric with the screw thread of leading screw 215 is moved upwards,
Therefore, the link connecting rod 219 linked with the both sides of connecting rod linking part 218 is toppled over towards horizontal direction to both sides, triangular coupling rod
220 are rotated in the way of erecting, so that elbow-bar mechanism 214 boosts slide link 221.Now, due to being arranged on slide link 221
Gap between linking part 209a, elbow-bar mechanism 214 is not subject to transmit the load of coming via movable platen 209.
In addition, as shown in Figure 40 B, workpiece W (substrate) and upper mould inserts are connected to across stripping film F in lower die clamp block 203c
In the state of 202b, compression helical spring 203d.Thus, confined space (pressure reduction space, closing are formed in molding die 204
Space), resin R is filled with die cavity recess 203e (die cavity).In this case, remain by movable platen 209 flat
Rise, movable platen 209 is also relative to stationary platen 207 with remain the depth of parallelism close to stationary platen 207 row degree.Thus,
Also the depth of parallelism can be remain by upper mould 202 and the lower matched moulds of mould 203.In addition, as mould die cavity recess downwards as shown in figure 40
203e center supply resin R situation like that by towards spread out resin R on the outside of lower mould die cavity recess 203e and by resin R
Be filled into die cavity recess 203e (die cavity) it is interior when, also can suitably control closure pressing speed using ball screw framework 210.
Above-mentioned state is kept to continue matched moulds, the pressure sensor 223 that there are everywhere detects the 1st clamping pressure respectively
(for example add up to 36ton；Moulded resin R resin pressure) when, stop the 1st drive motor 212 of driving, continue to drive the 2nd to drive
Motor 216.Thus, elbow-bar mechanism 214 takes over the state pressurizeed using ball screw framework 210 to movable platen 209, is pressurized to
Each pressure sensor 223 detects the 2-in-1 mould power higher than the 1st clamping pressure and (for example adds up to 125ton；Final resin pressure)
Untill.Thus, in Figure 39 B, movable nut 217 is moved further up along leading screw 215, as passing through movable platen 209
Linking part the 209a slide link 221 and the triangular coupling rod 220 that link together upright state.Alternatively, it is also possible to not stop driving
Dynamic 1st drive motor 212, and movable platen 209 is pressurizeed using both ball screw framework 210 and elbow-bar mechanism 214.This
Outside, ball screw framework 210 can also be set to drive and non-pressurized state.
Now, as shown in figure 40 c, because molding die 204 is in the shape of upper mould inserts 202b and lower die clamp block 203c abuttings
The state of pressurization under to(for) movable platen 209 strengthens, and therefore, lower die clamp block 203c helical spring 203d is compressed, and molding is set
Fat R is filled into lower mould die cavity recess 203e, is maintained final resin pressure, moulded resin R is heating and curing.
By being supplied to as described above using ball screw framework 210 via movable platen 209 with the clamping of the 1st mold clamping force
To the workpiece W of molding die 204, confined space can be formed in molding die 204.Elbow-bar mechanism 214, which is taken over, utilizes the rolling
The pressurized state that screw mechanism 210 pressurizes, movable platen 209 is clamped until reaching than the 1st matched moulds using the elbow-bar mechanism 214
The big 2-in-1 mould power of power, so as to make moulded resin R be heating and curing using final resin pressure.
Thus, accurately carried out while by the depth of parallelism in the movable platen 209 in maintaining mold closing action process
Mold closing, and final resin pressure is turned into high pressure, shaping quality can be lifted.That is, it is especially important in the depth of parallelism, closure pressing speed
Moulded resin R end-of-fills before, using ball screw framework 210 accurately control drive volume while matched moulds,
After the especially important moulded resin R fillings of plus-pressure, the elbow-bar mechanism 214 for the output increase for making the 2nd drive motor 216 is utilized
Matched moulds pressurization is carried out, so as to realize each required performance before and after the mold closing of molding die 204.
In addition, by using the elbow-bar mechanism 214 for the output increase for making the 2nd drive motor 216 as opening, closing
The clamping device 205 of molding die 204, such as with only being carried out without using the mechanism for making output increase using straight-line motion mechanism
The situation of mould on-off action is compared, can use than for being driven to mechanism servo motor (the 1st drive motor 212,
2nd drive motor 216) the smaller mechanism of output, by also subtracting the diameter of filament thick stick 211, equipment miniaturization can also be reduced
Consumption electric power, can reduce manufacturing cost.Thus, it is possible to which more inexpensively big of reply workpiece W changes.
In Figure 40 A~Figure 40 C, workpiece W is kept in the upper mould 202 of molding die 204, to the mould for being formed at lower mould 203
Chamber supplies moulded resin R but it is also possible to be structure in contrast to this.
That is, in Figure 41 A, the upper die base 202a of upper mould 202 is supported in stationary platen 207.In upper die base 202a
Clamping face be formed with recess, be supported with mould die cavity block 202d in the recess, upper die clamp block 202e is by helical spring 202f
Force ground hanger bearing is on this around mould die cavity block 202d.Upper die clamp block 202e is under than upper mould die cavity block 202d
The position of surface on the lower is protruded, mould die cavity recess 202g in formation.Adsorbed by covering on this in the way of mould die cavity recess 202g
Keep stripping film F.
The lower die base 203a of lower mould 203 is supported in movable platen 209.Lower mould inserts is assembled with lower die base 203a
203f.It is formed with lower mould inserts 203f for workpiece W absorption to be remained into the work holding portion thereof 203g concordant with clamping face.
As shown in Figure 41 A, in the state of the die sinking of molding die 204, workpiece W (is for example equipped with semiconductor chip
Substrate, semiconductor crystal wafer etc.) the work holding portion thereof 203g of lower mould 203 is supplied to, supply moulded resin R (liquid resin, graininess
Resin, particle resin (powdex), sheet material resin, block resin etc.).Moulded resin R can also be fed into work in advance
Work holding portion thereof 203g is fed into after on part W.The upper mould die cavity recess 202g of upper mould 202, which is covered and adsorbed to maintain, to be shelled
From film F.
Drive ball screw framework 210 and start mold closing action when, as shown in figure 41b, upper die clamp block 202e across
Helical spring 202f is compressed in the state of stripping film F is connected to workpiece W (substrate) and lower mould inserts 203f.Thus, in molding
It is formed with mould 204 in the state of confined space (pressure reduction space, closing space), moulded resin R is filled into upper mould die cavity
In recess 202g.
Molding die 204 reaches the 1st mold clamping force, and toggle link machine is converted to from the pressurization carried out using ball screw framework 210
During the pressurization of structure 214, as shown in fig. 41c, molding die 204 is in the state of lower mould inserts 203f and upper die clamp block 202e is abutted
For the pressurization enhancing of movable platen 209, therefore, the state that the helical spring 202f as upper die clamp block 202e is compressed, mould
Resin pressure in chamber recess rises, as final clamp pressure, maintains to apply moulded resin R the shape of predetermined resin pressure
State, makes moulded resin R be heating and curing.
Using said structure, control unit 222 synchronously drives ball screw framework 210 and elbow when starting mold closing action
Linkage 214, molding mould is fed into by using ball screw framework 210 via movable platen 209 with the clamping of the 1st mold clamping force
The workpiece W of tool 204, can form the mold closing of molding die 204 confined space in the molding die 204.Elbow-bar mechanism 214
Take over using the ball screw framework 210 pressurize pressurized state, using the elbow-bar mechanism 214 clamp movable platen 209 until
The 2-in-1 mould power bigger than the 1st mold clamping force is reached, so as to make moulded resin R be heating and curing with final resin pressure.
Thus, it is same with above-mentioned mould structure, using the teaching of the invention it is possible to provide it is a kind of reply workpiece W maximization and accurately tie up
Hold small-sized in the state of the depth of parallelism of molding die 204, closure pressing speed and the resin molded of matched moulds can be carried out at low cost
Device 201.Alternatively, it is also possible to substitute elbow-bar mechanism 214, hydraulic stamping mechanism is set.In this case, also can be in dimension
Mold closing is accurately carried out while hold the depth of parallelism of the movable platen 209 in mold closing action process and makes final resin pressure
Power turns into high pressure, so as to lift shaping quality.In addition it is also possible to substitute elbow-bar mechanism 214 and set other force-increasing mechanisms.
In addition it is also possible to be set to such structure：Movable platen is driven using ball screw framework 210 as described above
209 carry out mould on-off action, clamp mould, and using above-mentioned elbow-bar mechanism 214 only to the lower mould die cavity shown in Figure 40
Block 203b is pressurizeed and driven.In this case, by setting through hole in lower die base 203a and movable platen 209, and
And be used in lower mould die cavity block 203b pressing element insertion through holes pressurizeed and be linked to linking part 209a, Neng Gouling
The lower mould die cavity block 203b of row driving.Thereby, it is possible to control lower mould die cavity block 203b respectively to resin R plus-pressure and mould
Chucking power, thus, it is also possible to suppress mold clamp force while resin pressure is arbitrarily increased, even if restraining device entirety
Output, is formed in which can not also reduce resin pressure.It is further possible to required plus-pressure accordingly with only by rolling
Driving and the driving that is carried out by ball screw framework 210 and elbow-bar mechanism 214 that screw mechanism 210 is carried out switches driving
State.Also, protruded by making lower mould die cavity block 203b individually rise from lower mould 203, can also become mold clean
Easily.
More than, the present invention is specifically understood according to embodiment, but the present invention is not limited to the embodiment, energy
Various changes are enough carried out in the range of its purport is not departed from even more self-evident.
In the 1st embodiment, to being illustrated using particulate resin as resin R situation.But do not limit
Due to this, membranaceous resin can also be used as resin R, and can also use and be laminated into film resin of different sizes
The structure of mountain shape.
Specifically, it would however also be possible to employ the shaping carried out using the workpiece W and resin R shown in Figure 28, Figure 29.Such as these figures
It is shown, as workpiece W, the part for being flip-chip mounted chip part 11 on the substrate 10 can also be used.In such case
Under, as resin R, it can also use and be formed as middle high film resin or use supply to be middle high particulate resin.
In this case, in the process for supplying and being moulded after workpiece W and resin R same with above-mentioned embodiment, in mold closing
Afterwards during further matched moulds, as shown in figure 29, when chip part 11 is impregnated in the resin R of melting, from center side
Chip part 11 starts to be impregnated in resin R in order.Now, the resin R of melting flows to outer peripheral side from the center of substrate 10.Cause
And, when the workpiece W for being flip-chip mounted chip part 11 is sealed, the underfill transfiguration between chip part 11 and substrate 10
Easily.
In the 1st embodiment, to utilizing multiple grooves 123 simultaneously by same degree in resin supply unit 120
Situation in the resin R supplies (carrying) to the stripping film F as resin supply area of amount is illustrated.But it is not limited to
This, can also substitute multiple grooves 123, and use the distributor with multiple nozzles, and these nozzles can supply particulate resin, liquid
The such resin with mobility of state resin.Thereby, it is possible to prevent by resin quantity delivered increase (resin supply area it is big
Type) cause the long-time of service time.In addition, for example being made by configuring each nozzle relative to the distribution of resin supply area
Resin supply can be also supplied uniformly across without uneven.
In the 1st embodiment, make elastic component 50 flexible the mould opening and closing with mould clamping device and make
Lower mould die cavity block 34 is illustrated relative to the situation that lower die clamp block 35 is relatively moved.This is not limited to, can also
Driving, lower die clamp block 35 can be changed height mechanism is additionally carried out using relative to mould clamping device.
As the changeable mechanism of die cavity height, for example it is also possible that structure：Lower mould die cavity block 34 and driving source
The lower die base 46 of molding die 30 is connected and is assembled in the way of it can move, lower die clamp block 35 is fixed and is assembled in lower mould base
Seat 46.
In addition, being used as the changeable mechanism or such structure of die cavity height：In lower mould die cavity block 34 and lower mould
The mode that the thickness of slab adjustment block (circular cone) that between pedestal 46 so that interface is formed as the conical surface (inclined plane) is overlapped sets wedge portion, plate
One of thick adjustment block can be slided using driving sources such as cylinder, motors.
In the 1st embodiment, to only self-sustaining face 64 attracts with being connected with adsorption section 67 in film loading machine 57
The situation of air is illustrated (reference picture 3).This is not limited to, as film loading machine 57a or in recess 66
The structure of air can be attracted, and can also be that the structure that air is pressurizeed can be filled into recess 66.Specifically,
The film loading machine 57a as shown in Figure 30~Figure 32 can be used.In addition, (the reference picture of mould 31 on being eliminated in Figure 30~Figure 32
3)。
Using film loading machine 57a, as shown in figure 30, when conveying is equipped with resin R stripping film F, from air stream
The air flow circuit 65b that pressurization part 67b and recess 66 will be attracted to connect of road 65a different systems is attracted or added
Pressure, air flow circuit 65a has the function same with air flow circuit 65 shown in Fig. 3.Specifically, by making to utilize resin R
Weight it is balanced to the stripping film F pressurizations carried out and adsorption section 67a attraction (negative pressure), can prevent by resin R weight
Stripping film F is caused to bend.
In addition, using film loading machine 57a, as shown in Figure 31, Figure 32, when stripping film F is configured at into die cavity recess 33,
By the way that pressurization part 67b supplies air and filling air is pressurizeed into recess 66 from attracting, it can also make stripping film F pleat
Wrinkle expansion.Thus, also it can imitate stripping film F using the attraction from the position progress corresponding with the corner of die cavity recess 33
While imitating the shape of die cavity recess 33, stripping film F fold is pushed open and flattening-out laterally in the end face of die cavity block 34, because
This, can be more reliably prevented from producing fold.In addition, heating air can be used as the sky being now filled into recess 66
Gas, prevents fold with can not reducing mold temperature.Further, since stripping film F is also heated, thus, it is also possible to make stripping
From the shape that film F more reliably imitates die cavity recess 33.
In addition, in the 1st embodiment, the stripping film F for being equipped with resin R is configured at into lower mould to film loading machine 57
32 example is illustrated, but the present invention is not limited to this, can also be configured at mould 31.In this case, resin
The molding die 30 of device for molding 100 is set to turn upside down lower mould 32 and upper mould 31 such structure, is configured to lower mould (phase
When in the first mould of the present invention) and upper mould (equivalent to the second mould of the invention) mold closing of die cavity recess is formed with, can
Workpiece W is carried out using the resin for being filled in the die cavity recess resin molded.Mould and the lower mould 32 of the 1st embodiment on this
Equally can be using such structure, i.e. including：Die cavity block, it constitutes the bottom of die cavity recess；Fixture block, it constitutes die cavity
The sidepiece of recess；Movable part, it makes die cavity block relatively be moved relative to fixture block；And adsorption section, it attracts absorption to cover
The stripping film F that the mode of the end face of cover mold chamber block and the end face of fixture block is configured.In addition, film loading machine and the 1st embodiment party
The film loading machine 57 of formula is same, conveys stripping film F in the state of stripping film F is flat, and make the end face of die cavity block and
While the end face of fixture block is located at identical height, configure in the die cavity block while stripping film F is maintain to flat state
The end face of end face and the fixture block.Using the resin molding machine 100, punching press is not moved to together with resin R even in stripping film F
In the case of portion 130, configured with can also preventing fold.
In addition, in the 1st embodiment, to supplying granular resin to stripping film F in resin supply unit 120
R situation is illustrated.This is not limited to, resin supply unit 120 can also supply the resin R of liquid.In such case
Under, it can also will be set by robot mechanism portion 180 after the resin R of liquid is supplied on workpiece W by resin supply unit 120
Fat R and workpiece W is together moved to pressing part 130.In addition, resin supply unit 120 can also supply the resin R of sheet.This
In the case of, robot mechanism portion 180 can also by by resin supply unit 120 supply Lai sheet resin R and stripping film F or work
Part W is overlapped or resin R only is moved into pressing part 130.
In addition, can also be just not carry chip part 11, projection simply by the presence of face to be protected is needed as workpiece W
Its own such tabular component of 11A wafer.The surface of the tabular component can both have concaveconvex shape or flat
Face.
Claims (8)
1. a kind of resin molding machine, it is by upper mould and the lower mould mold closing for being formed with die cavity recess, using being filled in the die cavity
The resin of recess is resin molded to workpiece progress, and the resin molding machine is characterised by,
The lower mould includes：Lower mould die cavity block, it constitutes the bottom of the die cavity recess；Lower die clamp block, it constitutes the mould
The sidepiece of chamber recess；And adsorption section, it is used to adsorb to cover the end face and the lower die clamp block of the lower mould die cavity block
End face the film that configures of mode,
The resin molding machine possesses loading machine, and the loading machine has the 1st component and the 2nd component, can be by the 1st component
It is equipped with the 2nd component clamping drawing in the state of the film of the resin and keeps conveying the film,
1st component is the upper board of ring-type,
2nd component is the lower panel of ring-type,
The lower panel is formed with that face in peripheral part end from the upper board side is recessed and stage portion circumferentially,
The film is clipped between the upper board and the lower panel, so that the inside diameter of the upper board and the lower panel
The corresponding mode of stage portion the upper board is embedded in the lower panel, so as to constitute diaphragm plate portion,
It is formed with the lower die clamp block at peripheral part end from end face is recessed and stage portion circumferentially, so that the bottom
The inside diameter of the plate mode corresponding with the stage portion of the lower die clamp block makes the diaphragm plate portion be embedded in the lower die clamp block.
2. resin molding machine according to claim 1, it is characterised in that
It is provided with the lower die clamp block in the way of it can be protruded from the end face of the lower die clamp block by multiple pins of floating support,
The end face of the multiple pin from the lower die clamp block highlightedly supports the workpiece, the quilt in the state of the workpiece is clamped
It is housed in the inside of the lower die clamp block.
3. resin molding machine according to claim 1 or 2, it is characterised in that
The gate portion for the roller shutter shape that the loading machine, which possesses, to be opened, close, is utilized under the closed mode in the gate portion
The gate portion supporting conveying film, the film is configured under the open mode in the gate portion on the lower mould.
4. resin molding machine according to claim 1 or 2, it is characterised in that
The loading machine possesses heating part and cooling end.
5. a kind of resin molding method, it is using resin molding machine by upper mould and the lower mould mold closing for being formed with die cavity recess, profit
Workpiece is carried out with the resin for being filled in the die cavity recess resin molded, the resin molding method is characterised by,
The lower mould includes：Lower mould die cavity block, it constitutes the bottom of the die cavity recess；Lower die clamp block, it constitutes the mould
The sidepiece of chamber recess；And adsorption section, it is used to adsorb to cover the end face and the lower die clamp block of the lower mould die cavity block
End face the film that configures of mode,
The resin molding method includes following process：
(a) using the loading machine with the 1st component and the 2nd component, pulled by the 1st component and the 2nd component clamping
The film is kept in the state of the film for being equipped with the resin；
(b) loading machine is utilized in the way of making to be equipped on the resin of the film above the lower mould die cavity block
The lower die clamp block is pushed untill the end face of the lower mould die cavity block and the end face holding level of the lower die clamp block, is made
The lower mould die cavity block is relatively moved relative to the lower die clamp block；And
(c) while the film is attracted using the adsorption section, the lower mould die cavity block is made relative to the lower die clamp block
Relatively move and form the die cavity recess, so that the film adsorbs holding institute with following the inner surface of the die cavity recess
Film is stated, and the resin is intactly supplied to the die cavity recess.
6. a kind of resin molding machine, it possesses the clamping device for opening, closing molding die, the resin molding machine
It is characterised by,
The clamping device possesses：
Movable platen, it is used to support at least one mould in the molding die；
Stationary platen, it is used to support another mould；
1st mould switching mechanism, it couples with the movable platen, by institute between the movable platen and the stationary platen
Molding die mold closing is stated, until reaching the 1st mold clamping force；
2nd mould switching mechanism, it couples with the movable platen, carries out mold closing until reaching compared with the 1st mold clamping force
The 2-in-1 mould power of chucking power is further enhanced, and maintains final resin pressure；And
Control unit, it is used to control the 1st mould switching mechanism, the on-off action of the 2nd mould switching mechanism；
The control unit synchronously drives the 1st mould switching mechanism, the 2nd mould switching mechanism when starting mold closing action,
The molding die is being fed into the clamping of the 1st mold clamping force via the movable platen using the 1st mould switching mechanism
Workpiece after, the 2nd mould switching mechanism take over the 1st mould switching mechanism pressurization state, via the movable table
Plate clamps the workpiece until reaching the 2-in-1 mould power bigger than the 1st mold clamping force using the molding die.
7. resin molding machine according to claim 6, it is characterised in that
Periphery edge of the 1st mould switching mechanism along the movable platen is equally spaced configured, the 2nd mould opening and closing
Mechanism configures the central portion in the movable platen.
8. a kind of resin molding method, it is opened by using clamping device, folder resin molded to carry out of closing molding die
Holding mechanism includes being used for the movable platen of one mould of supporting and the stationary platen for supporting another mould, and this is resin molded
Method is characterised by,
The resin molding method includes following process：
To the molding die supply workpiece and resin molded；
The 1st mould switching mechanism and the 2nd mould switching mechanism that couple with the movable platen is set synchronously to work, using described
1st mould switching mechanism carries out mold closing, until by the molding die untill the 1st mold clamping force clamps the workpiece；
The 2nd mould switching mechanism takes over the state of the 1st mould switching mechanism pressurization, the movable platen is worked,
The molding die is clamped until reaching the 2-in-1 mould power bigger than the 1st mold clamping force；And
While maintain with the final resin pressure of the 2-in-1 mould power clamping molding die, add the resin
Heat cure.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013113222A JP2014231185A (en) | 2013-05-29 | 2013-05-29 | Resin molding apparatus and resin molding method |
| JP2013-113222 | 2013-05-29 | ||
| JP2013115783A JP2014233882A (en) | 2013-05-31 | 2013-05-31 | Resin molding device and method |
| JP2013-115783 | 2013-05-31 | ||
| JP2013139424A JP6180206B2 (en) | 2013-07-03 | 2013-07-03 | Resin sealing method and compression molding apparatus |
| JP2013-139424 | 2013-07-03 | ||
| PCT/JP2014/061014 WO2014192456A1 (en) | 2013-05-29 | 2014-04-18 | Resin molding device and resin molding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105283294A CN105283294A (en) | 2016-01-27 |
| CN105283294B true CN105283294B (en) | 2017-08-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480029820.1A Active CN105283294B (en) | 2013-05-29 | 2014-04-18 | Resin molding machine and resin molding method |
Country Status (5)
| Country | Link |
|---|---|
| KR (1) | KR102203781B1 (en) |
| CN (1) | CN105283294B (en) |
| SG (1) | SG11201508166RA (en) |
| TW (1) | TWI606526B (en) |
| WO (1) | WO2014192456A1 (en) |
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| JP6066889B2 (en) * | 2013-11-25 | 2017-01-25 | Ｔｏｗａ株式会社 | Compression molding apparatus and compression molding method |
| WO2017010319A1 (en) * | 2015-07-15 | 2017-01-19 | アピックヤマダ株式会社 | Molding die and resin molding device |
| JP6506680B2 (en) * | 2015-11-09 | 2019-04-24 | Ｔｏｗａ株式会社 | Resin sealing apparatus and resin sealing method |
| JP6654861B2 (en) * | 2015-11-09 | 2020-02-26 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
| JP6598642B2 (en) * | 2015-11-09 | 2019-10-30 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
| JP6491120B2 (en) * | 2016-02-13 | 2019-03-27 | Ｔｏｗａ株式会社 | Resin sealing device, resin sealing method, and resin molded product manufacturing method |
| JP6640003B2 (en) * | 2016-04-05 | 2020-02-05 | Ｔｏｗａ株式会社 | Resin sealing device and resin sealing method |
| JP6723185B2 (en) * | 2017-03-29 | 2020-07-15 | Ｔｏｗａ株式会社 | Mold, resin molding apparatus, resin molding method, and resin molded article manufacturing method |
| JP6342566B1 (en) * | 2017-11-16 | 2018-06-13 | アルファーデザイン株式会社 | Component holding device and component joining system |
| JP6923423B2 (en) * | 2017-11-21 | 2021-08-18 | Ｔｏｗａ株式会社 | Manufacturing method of transport equipment, resin molding equipment and resin molded products |
| JP6876637B2 (en) * | 2018-01-22 | 2021-05-26 | Ｔｏｗａ株式会社 | Molding mold, resin molding equipment and manufacturing method of resin molded products |
| JP7102238B2 (en) * | 2018-06-08 | 2022-07-19 | Ｔｏｗａ株式会社 | Resin molding equipment and manufacturing method of resin molded products |
| JP7084247B2 (en) * | 2018-08-02 | 2022-06-14 | Ｔｏｗａ株式会社 | Manufacturing method for resin molding equipment, molding molds, and resin molded products |
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2014
- 2014-04-18 KR KR1020157036843A patent/KR102203781B1/en active IP Right Grant
- 2014-04-18 SG SG11201508166RA patent/SG11201508166RA/en unknown
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- 2014-04-18 WO PCT/JP2014/061014 patent/WO2014192456A1/en active Application Filing
- 2014-04-25 TW TW103114913A patent/TWI606526B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| SG11201508166RA (en) | 2015-12-30 |
| TW201448074A (en) | 2014-12-16 |
| KR20160013202A (en) | 2016-02-03 |
| WO2014192456A1 (en) | 2014-12-04 |
| KR102203781B1 (en) | 2021-01-15 |
| TWI606526B (en) | 2017-11-21 |
| CN105283294A (en) | 2016-01-27 |
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